Siemens BTS307 Datasheet

Smart Highside Power Switch
)
)
)
PROFET® BTS 307
Features
Overload protection
Current limitation
Short circuit protection
Thermal shutdown
Overvoltage protection
Fast demagnetization of inductive loads
Reverse battery protection
Open drain diagnostic output
Open load detection in OFF-state
CMOS compatible input
Loss of ground and loss of
Electrostatic discharge (ESD) protection
1
)
V
protection
bb
Product Summary
Overvoltage protection Operating voltage
On-state resistance Load current (ISO)
TO-220AB/5
5
Standard
V
bb(AZ
V
bb(on
R
ON
I
L(ISO
Straight leads
1
65 V
5.8 ... 58 V 250
1.7 A
5
1
SMD
Application
µC compatible power switch with diagnostic feedback for 12 V and 24 V DC grounded loads
Most suitable for inductive loads
Replaces electromechanical relays, fuses and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input and diagnostic feedback, monolithically integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
m
5
+ V
bb
Voltage
source
V
Logic
Voltage
sensor
IN
2
ESD
4
ST
Logic
Overvoltage
protection
Charge pump
Level shifter
Rectifier
GND
Current
limit
unclamped
Open load
detection
Short circuit
Gate
protection
Limit for
ind. loads
detection
OUT
Temperature
sensor
PROFET
3
5
Load
1
Signal GND
Load GND
)
1
With external current limit (e.g. resistor R
=150 Ω) in GND connection, resistor in series with ST
GND
connection, reverse load current limited by connected load.
Semiconductor Group 1 08.96
BTS 307
)
Pin Symbol Function
1 GND - Logic ground 2 IN I Input, activates the power switch in case of logical high signal 3Vbb+ Positive power supply voltage,
the tab is shorted to this pin 4 ST S Diagnostic feedback 5 OUT
O Output to the load
(Load, L)
at
T
= 25 °C unless otherwise specified
Maximum Ratings
j
Parameter Symbol Values Unit
Supply voltage (overvoltage protection see page 3)
)
Supply voltage for full short circuit protection
T
=-40 ...+150°C
j Start
2
Load current (Short circuit current, see page 4) Operating temperature range Storage temperature range Power dissipation (DC), TC 25 °C Electrostatic discharge capability (ESD
IN, ST:
(Human Body Model) all other pins: Input voltage (DC) Current through input pin (DC) Current through status pin (DC)
see internal circuit diagrams page 6
V V
I T T P V
V I I
bb bb
L
j stg
tot
ESD
IN IN ST
65 V 40 V
self-limited A
-40 ...+150
°C
-55 ...+150 50 W
1.0
kV
tbd (>1.0)
-0.5 ... +36 V
±2.0
mA
±5.0
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
min typ max
Thermal resistance chip - case:
junction - ambient (free air):
2)
Status fault signal in case of short to GND. Internal thermal shutdown after several milliseconds. External shutdown in response to the status fault signal in less than about 1 ms necessary, if the device is used with higher V
bb
.
R
R
thJC
thJA
--
--
--
--
2.5 75
K/W
Semiconductor Group 2
BTS 307
)
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
T
at
= 25 °C,
j
Load Switching Capabilities and Characteristics
On-state resistance (pin 3 to 5)
I
= 2 A,
L
Nominal load current, ISO Norm (pin 3 to 5
V
= 0.5 V,
ON
Output current (pin 5) while GND disconnected or
GND pulled up,
page 7 Turn-on time to 90% Turn-off time to 10%
R
= 12 ,
L
Slew rate on, 10 to 30%
R
= 12 ,
L
Slew rate off, 10 to 30%
R
= 12 ,
L
V
= 12 V unless otherwise specified
bb
V
= 24 V
bb
T
= 85 °C
C
V
bb
V
= 20V,
bb
V
= 20V,
bb
V
=32 V,
bb
V V
= 20V,
T
T
V
= 0, see diagram
IN
:
OUT
:
OUT
T
=-40...+150°C
j
V
,
OUT
=-40...+150°C
j
V
,
OUT
=-40...+150°C
j
T
=25 °C:
j
T
=150 °C:
j
R
ON
I
L(ISO)
I
L(GNDhigh)
t
on
t
off
dV /dt
on
-dV/dt
off
min typ max
-- 220 390
250 500
1.4 1.7
-- A
-- -- 1.1 mA
15 20
--
--
80 70
-- -- 6 V/µs
-- -- 7 V/µs
m
µs
Operating Parameters
)
Operating voltage
3
Undervoltage shutdown Undervoltage restart
T
=-40...+150°C:
j
T
=-40...+150°C:
j
T
=-40...+150°C:
j
Undervoltage restart of charge pump see diagram page 11
T
=-40...+150°C:
j
Undervoltage hysteresis
V
bb(under)
Overvoltage protection
I
=40 mA
bb
Standby current (pin 3)
V
=0
IN
Operating current (Pin 1)5),
=
V
bb(u rst)
-
V
bb(under)
)
4
,
V
IN
T
=-40...+150°C:
j
T
=5 V
=-40...+150°C:
j
V
bb(on)
V
bb(under)
V
bb(u rst)
V
bb(ucp)
V
bb(under)
V
bb(AZ)
I
bb(off)
I
GND
5.8 -- 58 V
2.7 -- 4.7 V
-- -- 4.9 V
-- 5.6 7.5 V
-- 0.4 -- V
65 70 -- V
µA
-- 10 50
-- 2.2 -- mA
)
3
At supply voltage increase up to
4)
)
5
See also Add
V
I
, if
ST
in table of protection functions and circuit diagram page 7.
ON(CL)
I
> 0, add
ST
I
IN
, if
V
= 5.6 V typ without charge pump,
bb
V
>5.5 V
IN
Semiconductor Group 3
V
OUT
V
- 2 V
bb
BTS 307
j
j
)
Parameter and Conditions Symbol Values Unit
at
T
= 25 °C,
j
Protection Functions
Initial peak short circuit current limit (pin 3 to 5)
Output clamp (inductive load switch off) at
V
OUT
Thermal overload trip temperature Thermal hysteresis Reverse battery (pin 3 to 1)
Diagnostic Characteristics
Open load detection current
(included in standby current
Open load detection voltage Short circuit detection voltage
(pin 3 to 5)
=
V
= 12 V unless otherwise specified
bb
V
-
bb
V
ON(CL)
I
L
I
bb(off
= 1 A,
)
6
)
=-40°C:
T
=25°C:
T
=+150°C:
j
T
T
=-40..+150°C:
j
=-40..150°C:
T
j
I
L(SCp)
V
ON(CL)
T
jt
T
jt
-
V
bb
I
L(off)
V
OUT(OL)
V
ON(SC)
min typ max
--
--
4.0
10
--
19
A
--
--
--
59 -- 75 V
150 -- -- °C
-- 10 -- K
-- -- 32 V
-- 6 --
A
µ
2.4 3 4 V V
-- 2.5 --
)
6
Requires 150 resistor in GND connection. The reverse load current through the intrinsic drain-source diode has to be limited by the connected load. Note that the power dissipation is higher compared to normal operating conditions due to the voltage drop across the intrinsic drain-source diode. The temperature protection is not active during reverse current operation! Input and Status currents have to be limited (see max. ratings page 2 and circuit page 7).
Semiconductor Group 4
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