Samsung D820 Service Manual

GSM TELEPHONE

SGH-D820

JVP WHOHSKRQH

FRQWHQWV

1. Specification

2. Circuit Description

3. Exploded Views and Parts List

4. Electrical Parts List

5. Block Diagrams

6. PCB Diagrams

7. Flow Chart of Troubleshooting

This Service Manual is a property of Samsung Electronics Co.,Ltd. Any unauthorized use of Manual can be punished under applicable International and/or domestic law.

ⓒ

Samsung Electronics Co.,Ltd. March. 2006 Printed in Korea.

Code No.: GH68-09648A BASIC.

1. Specification

1-1. GSM General Specification

GSM850

Freq.

Band[MHz]

Uplink/Downlink

ARFCN range 128~251 1~124

Tx/Rx spacing 45MHz 45MHz 45MHz 95MHz 80MHz

Mod. Bit rate

/BitPeriod

Time Slot

Period

/ Frame Period

Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK

MS Power 33dBm~5dBm 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm

824~849 869~864

270.833kbps

3.692us

576.9us

4.615ms

GSM900

Phase 1

890~915 935~960

270.833kbps

3.692us

576.9us

4.615ms

EGSM 900

Phase 2

880~915 925~960

0~124 &

975~1023

270.833kbps

3.692us

576.9us

4.615ms

DCS1800

Phase 1

1710~1785 1805~1880

512~885 512~810

270.833kbps

3.692us

576.9us

4.615ms

PCS1900

1850~1910 1930~1990

270.833kbps

3.692us

576.9us

4.615ms

Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl

Sensitivity -102dBm -102dBm -102dBm -100dBm -100dBm

TDMA Mux 8 8 8 8 8

Cell Radius 35Km 35Km 35Km 2Km 2Km

1-1

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Specification

1-2. GSM TX power class

TX Power

control

level

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

GSM850

TX Power

control

level

5 33±3 dBm

6 31±3 dBm

7 29±3 dBm

8 27±3 dBm

9 25±3 dBm

10 23±3 dBm

11 21±3 dBm

GSM900

TX Power

control

level

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

DCS1800

TX Power

control

level

0 30±3 dBm

1 28±3 dBm

2 26±3 dBm

3 24±3 dBm

4 22±3 dBm

5 20±3 dBm

6 18±3 dBm

PCS1900

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

12 19±3 dBm

13 17±3 dBm

14 15±3 dBm

15 13±3 dBm

16 11±5 dBm

17 9±5 dBm

18 7±5 dBm

19 5±5 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

7 16±3 dBm

8 14±3 dBm

9 12±4 dBm

10 10±4 dBm

11 8±4dBm

12 6±4 dBm

13 4±4 dBm

14 2±5 dBm

15 0±5 dBm

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15 0±5 dBm

2. Circuit Description

2-1. SGH-D820 RF Circuit Description

2-1-1. RX PART

- FRONT END MODULE(ANTENNA SWITCH MODULE + RX SAW FILTER) (F101)

It performs to switch Tx & Rx paths for GSM850, GSM900, DCS1800 and PCS1900 with logic controls below.

- FEM Control Logic Table

FESW1 FESW2 FESW2

Tx Mode (GSM850/900) H L

Tx Mode (DCS1800/1900) L H

Rx Mode (GSM900/850) L L

Rx Mode (DCS1800) L L

Rx Mode (PCS1900) L L H

- VC-TCXO (TCX100)

This module generates the 26MHz reference clock to drive the logic and RF systems.

It is turned on when the supply voltage (+VCC_SYN) is applied.

After buffering, the 26MHz reference clock is supplied to the other parts of the system through the transceiver pin

CLKOUT.

- Transceiver (U102)

This chip is fully integrated GSM & GPRS quad-band transceiver with RF VCO, loop filters and most of the

passive components required in it.

It also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply

regulator. Semi i ntegrated reference oscillator with integrated supply regulator.

RF Receiver front-end amplifies the E-GSM900(GSM850), DCS1800 and PCS1900 aerial signal, convert the chosen

channel down to a low IF of 100kHz.

In IF section, further amplifies the wanted channel, performs gain control to tune the output level to the desired value and

rejects DC.

2-1-2. TX PART

The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band

power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power

mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.

Output matching/balun components drive a standard 50 ohms single ended load.

2-1

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Circuit Description

2-2. Baseband Circuit description of SGH-D820

2-2-1. PCF50603 (U400)

- Power Management

Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal

system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,

while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,

such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system

complexity.

I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor

full control of the PCF50603 and enables system designers to maximize both standby and talk times.

Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable

system design. These functions work together to ensure proper system behavior during start-up or in the event of a

fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).

- Pulse-Width Modulator

The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) to modulate the

intensity of a series of LED's or to control a DC/DC converter that drives LCD backlight.

This phone is using PWM control to modulate the LCD backlight brightness.

- Clock Generator

The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator

provides an accurate low clock frequency for the PCF50603 and other circuitry.

2-2-2. LCD

D820 has just one 2.12" TFT LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. There are

couple of control signals such as RS, LCD_MAIN_CS, L_WRB, etc. RS stands for "Register Select pin." When RS = 0,

data can be written to the index register or status can be read, and when RS = 1, an instruction can be issued or data

can be written to or read from RAM. Read or write operation is selected according to L_WRB signals. The data is

received when the R/W bit is 0, and is transmitted when the R/W bit is 1.

At the falling edge of LCD_MAIN_CS

input, serial data transfer is initiated. On the other hand, at the rising edge of LCD_MAIN_CS input, the data

transfer is ceased.

2-2-3. Key

Key recognition part is consisted of 8 ports from PCF5213EL1. KEY_ROW(0:4) & KEY_COL(0:4)

These signals performs with the matrix. Any input from the matrix informs the key status to key interface in the

PCF5213EL1. Power on/off key is independent of the matrix. Therefore, 'power on/off' signal is directly connected with

PCF50603 to turn PCF50603 on.

Two 3.3V LDOs(U716, U823) enable Main and Sub Key LED on. Main and Sub Key LED are controlled by

KEYLED_ON and SLIDER_KEY_ON signal respectively.

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Circuit Description

2-2-4. EMI ESD Filter (F500)

This system uses the EMI ESD filter (F500) to protect the device from noises from IF CONNECTOR part.

2-2-5. IF connetor (IFC500)

It has 20-pin. They are designed to allocate not only 'power and data lines'(VBAT, V_EXT_CHARGE, USB_D+, +VBUS,

USB_D-, TXD1, RXD1, AUX_ON, EXT1, EXT2 and GND) but also Earphone lines(EAMMIC_P/N, EARSPK_R/L,

EAR_SWITCH, EARSPK_COM and EAR_ADC). They connected to power supply IC, microprocessor, signal processor IC

and Earphone.

2-2-6. Battery Charge Management

D820 has a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries inside.

If Travel Adapter is connected, "V_EXT_CHARGE" begins to provide the charger IC (to battery) with power (current).

When the charging operation is done, "END_OF_CHG" informs it to PCF5213EL1 to stop the operation. "CHG_ON"

signal enables the charger IC to operate in adequate circumstances.

2-2-7. Audio - Part

D820 has several audio-outputs such as stereo speaker, receiver, earphone, etc. HFR P/N signals from CPU are connected

to the receiver. MIC_CP/N are connected to the main MIC and MIC_CP2/N2 as well.

SAPA1D2 is a Class-D amplifier for outputting sounds that are used by mobile phones including MP3 playback, melodies,

voice output on speaker phone mode and so on..

STG3699(U515) is an analog switch to connect SAPA1D2 input port to main DSP or CODEC Chip.

2-2-8. Memory (UME307)

D820 has KBH10PD00M-D414 as a memory module.

The KBH10PD00M-D414 is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR

Flash Memory and 1Gbit OneNAND Flash and 256Mbit Synchronous Burst UtRAM.

It has 16 bit data line, HD[0~15] which is connected to PCF5213 and CL8522S5(Multi-media chip), also has 24 bit

address lines, HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS1n_RAM, and CS4n_NAND.

In the writing process, WEn is fallen to low and it enables writing process to operate. During reading process,

OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose

different types of memory.

2-2-9. PCF5213EL1 (UCP200)

The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn

DSP core with embedded RAM and ROM, and a set of peripherals. It has 24k×16 bits PRAM, 104k×16 bits,

32k×16 XYRAM and 63k×16 XYROM in the DSP.

The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,

tightly-coupled ITCM (Instruction Tightly Coupled Memory) and DTCM (Data Tightly Coupled Memory) memories, a

memory protection unit, and an AMBA (Advanced Microcontroller Bus Architecture) AHB (Advanced High-performance

Bus) bus interface with a write buffer. HD(0:15), data lines and HA(0:23), address lines are connected to

KBH10PD00M-D414(memory) and CL8522S5(Multi-media chip)

. It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap loader in the ARM core.

2-3

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Circuit Description

HD(0:15), data lines and HA(0:23), address lines are connected to memory and CL8522S5 to communicate.

ARM core and DSP core. OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input

status. It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM

and DSP core. ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.

2-2-10. TCO-5871U (TCX100, 26MHz)

This system has the 26MHz TCXO, TCO-5871U from Toyocom. AFC controlling signal form PCF5213EL1 controls

frequency from 26MHz X-tal. It generates the clock frequency. This clock is connected to PCF5213EL1 and UAA3587.

2-2-11. CL8522S5 (U303)

CL8522S5 provides rich video functions up to 30-frame display with minimized tasks in the handset main processor

as well as hardware based real-time JPEG compression and decompression. CL8522S5 directly transmits and previews

the RGB data to the LCD graphic memory by processing the sensor output data according to the handset's command.

It can save the raw RGB data up to VGA resoultion into its image buffer and allows the host processor to download

with scalable sized compressed data. It also provides I2S data bus to playback MP3 formatted data.

It utilizes 16 bit data bus for communication with the main processor, including bus interface types.

2-4

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3. Exploded View and its Parts list

3-1. Exploded View

QFL01

QMW02

QFU01

QHI01

QKP02

QLC01

QMI01

QME01

QCH04

QCH10

QCW01

QCA01

QMP01

QVK01

QVO02

QVO09

QCR06

QAN06

QAN02

QSP01

QCR09

QSP02

QMO01

QKP01

QVK06

QSH01

QCR06

QSC11

QSC12

QCR12

QCR17

QPC01

QIF01

QCR26

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QCH05

QRE01

QRF01

QBA01

QBA00

Exploded view and its Part list

3-2. Parts List

Location NO. Description SEC CODE

QAN06 QAR01 QBA00 QBA01 QCA01 QCH04 QCH10 QCR06 QCR09 QCR12 QCR17 QCR26

QCW01

QFL01 QFU01 QHI01 QKP01 QKP02 QLC01

QME01

QMI01

QMP01

QMW02

QPC01

QRF01 QSC11 QSC12 QSH01 QVK01 QVK06 QVO02 QVO09

QSP01

QRE01

QAN02 INTENNA-SGHD820 GH42-00767A QSP02 UNIT-MODULE SPEAKER GH59-02851A

QMO01 MOTOR DC-SGHT809 GH31-00196A

QCH05 PMO-T FLASH COVER V3 GH72-26991A

QIF01 PMO-IF COVER V4 GH72-26995A

MEC-TAPE ANTENNA RUBBER GH75-08483A

AUDIO-RECEIVER 3009-001178

MEC-BATTERY COVER GH75-08553A

INNER BATTERY PACK-800MAH,BLAC GH43-02098A

UNIT-CAMERA GH59-02787B

MEC-CAMERA UPPER GH75-08984A

MEC-CAMERA LOWER GH75-08107A

SCREW-MACHINE 6001-001155 SCREW-MACHINE 6001-001670 SCREW-MACHINE 6001-001530 SCREW-MACHINE 6001-001460 SCREW-MACHINE 6001-001850

PCT-CAMERA WINDOW GH72-25223A

MEC-FRONT SLIDER LOWER GH75-08922A

MEC-SLIDER UPPER GH75-09284A

MEC-HINGE(CAMERA) GH75-06936A

MEC-KEYPAD MAIN(EU/IKA) GH75-08928A

MEC-KEYPAD SUB GH75-08927A

ELA ETC-SGHD820 SUB LCD ASSY GH96-02105A

UNIT-METAL DOME(SUB) GH59-02384A

MICROPHONE-ASSY GH30-00220A

PBA MAIN-SGHD820 GH92-02534A

PCT-MAIN WINDOW GH72-25222A

MEA-SLIDER FPCB KIT GH97-05501A

PMO-RF COVER GH72-25131A PMO-S/LOWER SCREW CAP R GH72-26494A PMO-S/LOWER SCREW CAP L GH72-26493A

MEC-SHIELD CAN GH75-09439A

UNIT-VOLUME KEY GH59-02935A

UNIT-KEYPAD FPCB(MAIN) GH59-02379A

PMO-KEY VOLUME GH72-24204A

NDC-VOLUME KEY COVER GH71-05436A

UNIT-SPK MOT INTENNA MODULE GH59-02915A

MEC-REAR COVER GH75-08929A

3-2

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Exploded view and its Part list

Description SEC CODE

BAG PE 6902-000297 BAG PE 6902-000378

CBF INTERFACE-AV CABLE GH39-00442A

CBF INTERFACE-DATA LINK CABLE GH39-00444A

ADAPTOR-SGHD800 TA(EU) GH44-01060A

S/W CD-SAMSUNG PC STUDIO GH46-00191A

UNIT-EARPHONE GH59-02499A

LABEL(P)-IMEI GH68-01335D

LABEL(P)-WATER SOAK GH68-02026A

MANUAL-USER GH68-08207A

LABEL(R)-SGHD820(EU) GH68-08973A

BOX(P)-UNIT MAIN GH69-03456A

BOX(P)-SLIP CASE(EU) GH69-03553A

MPR-BOHO VINYL LCD CONN GH74-15350A

MPR-TAPE MAIN WINDOW GH74-17833A MPR-TAPE SUB INSULATION GH74-17843A MPR-TAPE SUB INSULATION GH74-17843A

MPR-TAPE MAIN CONNECTOR GH74-17844A

MPR-TAPE RF COVER GH74-17845A

MPR-TAPE EL FIXED GH74-18873A

MPR-TAPE HOT BAR FIXED GH74-18878A MPR-BOHO VINYL INPUT BEF GH74-18886A MPR-BOHO VINYL INPUT AFT GH74-18887A

MPR-TAPE VOLKEY SOLDER GH74-18904A

MPR-BOHO VINYL KEYPAD GH74-19130A MPR-BOHO VINYL M/KEYPAD GH74-19246A MPR-TAPE SUB MIC SOLDER GH74-19264A

MPR-TAPE LCD FPVB SUB 2 GH74-21187A

MPR-TAPE LCD FPCB MAIN 1 GH74-21189A

MPR-VINYL BOHO MAIN WIN FINAL GH74-21556A

MPR-TAPE LCD ESD 1 GH74-21557A MPR-TAPE LCD ESD 2 GH74-21558A

MPR-TAPE SUB CONNECTOR 2 GH74-21559A

MPR-TAPE LCD HOT BAR 2 GH74-21560A

MPR-GASKET MAIN CONN 2 GH74-22079A

MPR-VINYL BOHO WIN DUST GH74-22082A

MPR-TAPE EMI 1 GH74-22084A

3-3

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Exploded view and its Part list

3-3.Disassembling Procedure

Remove the 3 screws on rear case & Volume

Key

Open the rear case with

your finger

Do not disassemble the phone by compulsion

Put the disassembly tool

on lower end of rear

case

Remove the 4 screws on Antenna & Audio

Parts

When you remove the FPCB, you must pull up

the actuator

Slide up then remove the green tape

Remove the Antenna & Audio part by

tweezer

When remove the Antenna part, make

ensure the Vibrator part carefully

Remove the Main PCB and Key pad then

remove the 2 screws

3-4

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Exploded view and its Part list

Make a Slide up, then remove the 4 screws Disassemble the Slide Part

Remove the green tape then remove the FPCB

Before disassemble the Camera part, remove the

green tape

Before disassemble the slider PCB, remove

the Receiver part

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When you remove the FPCB, first pull up the

actuator then removethe FPCB

When you remove the audio part, using a

removal hole by tweezer

3-5

Exploded view and its Part list

When you disassemble the slide part, push

the slide part to the upper end

3-6

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3-4. Assembling Procedure

Exploded view and its Part list

Check the guide holes for

dome sheet

Soldering

The lower part of dome sheet should

be attached on the rear side of P CB

Point

Solder the sub_microphone guided by

it's soldering point

Check the guide hole on right

position

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Adhere the non-conductive tape on

the soldering point of SUB_MIC

Check the Hot Bar, Backlight FPCB,

Heat seal and Guide poles

3-7

Exploded view and its Part list

Check the guide hole on right

position

Adjust between each corners of LCD

module and Guiding edges on PCB

GUIDE MARK

Solder the backlight FPCB

11 12

Guide hole

Receiver's FPCB should be parallel to

Solder the Receiver on PCB

3-8

Be careful of two guide marks on

soldering process

the PCB

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Exploded view and its Part list

Adhere the non-conductive tape on

left side of PCB

Adhere the non-conductive tape on

the charger pump

Adhere the non-conductive tape on

Hot-bar

Solder and bond the vibrator's wire

and bend it on picture's direction

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Adhere the non-conductive tape on

backlight FPCB

1817

Paste the Bluetooth Ant. on the right

side Speaker

3-9

Exploded view and its Part list

Solder the side key FPCB. Adjust the

PCB outline and be careful of

electrical shortage.

Push lightly

Lower side

Insert the rubber for intenna contact

Higher side

Rubber should be place on aligned

position on the red line

Bend the SPK FPCB The bending point of SPK FPCB

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Adhere the non-conductive tape on

the solder point of side key

Bending point of FPCB (the form of 'U')

This point should not be bended

3-10

Exploded view and its Part list

Remove the protection cover

Check the white

Push & Paste

silk line

Check the alignment between FPCB

and white silk line

Adhere the non-conductive tape on

FPCB connector of Sub PCB

Put the Sub Key Pad on the slide

upper case

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Check the alignment between FPCB

and white silk line

2827

Remove the protection tape on LCD

window

3-11

Exploded view and its Part list

Insert the receiver and Sub MIC into each holder on the slide upper case

from '2' to '1'

direction

Put the sub PBA assy. on the slide

upper case

Wind the FPCB twice

Wind the camera's FPCB on the its

hinge

Adhere the non-conductive tape on

the cameras FPCB

Insert the camera module on the

fron case

(put on the camera's hinge first)

Pull out the Main FPCB through the

slider case's hole(red circle)

3-12

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Exploded view and its Part list

Push the slide lower to the slide

upper's direction

SCREW

HOLE

If there is no problems until now,

the current state will be like this

SCREW

HOLE

Screw down the upper's 4 points Screw down the lower's 2 points

Insert the screw cap Be careful of each direction

3-13

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Exploded view and its Part list

MAIN KEY PAD's GUIDE HOLE

Putthemainkeypadonthefront

case

shield can's

guide line

Place the shield can over the main

key pad

Confirm the bending state of Main

FPCB

Push the whole parts

of FPCB equaly

Insertion guide Insertion guide II ;

Confirm the

alignment

Push the main FPCB into the Main

connector

4544

Push the middle of actuator

first and the both sides later

3-14

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Exploded view and its Part list

Adhere the non-conductive tape on

the Main connector of Main PCB

Adhere the gold gasket over the non-

conductive tape

Bending line should be aligned with

the red line

Bend and push the side key FPCB

into the front case

If the other point is bent, the critical

display error will be occurred

②

③

①

5150

③

②

Put the Main PCB on the shield can

in the order described above

3-15

①

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Exploded view and its Part list

Insert the shield can's connector Insert the Speaker's connector

Reference position of the vibrator's

wire

The picture of side key FPCB on

normal condition

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Bend as the form of 'U' and push the

SPK's FPCB into the inner space

5756

SCREW

Screw down the side key's holder

3-16

Exploded view and its Part list

Screw down on each 4 points of

intenna module

Two red circles' point should be

inserted first at the rear case

assembly procedure

SCREW

Push each 5 points sufficiently Screwdownonthelast2points

3-17

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Exploded view and its Part list

3-5. Slide FPCB KIT Assembling Procedure

- Sub PCB Part

2 3

Check the white

Push & Paste

silk line

1. Check the condition of FPCB and remove the protection cover of Sub PCB

2. Check the alignment between FPCB and white silk line

3. Push and Paste evenly by pushing tool

4. Adhere the non-conductive tape on FPCB connector of Sub PCB

5. Check the condition of attachment

6. Bend the FPCB upward and check the alignment between FPCB and white silk line

3-18

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+ 60 hidden pages