Philips TDA1517, TDA1517P Technical data

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INTEGRATED CIRCUITS

DATA SH EET

TDA1517; TDA1517P

2 × 6 W stereo power amplifier

Product specification
Supersedes data of 1998 Apr 28
File under Integrated Circuits, IC01

2002 Jan 17

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

FEATURES

• Requires very few external components

• High output power

• Fixed gain

• Good ripple rejection

GENERAL DESCRIPTION

The TDA1517 is an integrated class-B dual output
amplifier in aplastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.

• Mute/standby switch

• AC and DC short-circuit safe to ground and V

P

• Thermally protected

• Reverse polarity safe

• Capability to handle high energy on outputs (VP=0V)

• No switch-on/switch-off plop

• Electrostatic discharge protection.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

ORM

I

q(tot)

I

sb

I

sw

|Z

| input impedance 50 −−kΩ

I

P

o

SVRR supply voltage ripple rejection f

α

cs

G

v

V

no(rms)

T

c

supply voltage 6.0 14.4 18.0 V
repetitive peak output current −−2.5 A
total quiescent current − 40 80 mA
standby current − 0.1 100 µA
switch-on current −−40 µA

output power RL=4Ω; THD = 0.5% − 5 − W

R

=4Ω; THD = 10% − 6 − W

L

= 100 Hz to 10 kHz 48 −−dB

i

channel separation 40 −−dB
closed loop voltage gain 19 20 21 dB
noise output voltage (RMS value) − 50 −µV
crystal temperature −−150 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA1517 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
TDA1517P HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1

2002 Jan 17 2

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

BLOCK DIAGRAM

handbook, full pagewidth

non-inverting

supply voltage
ripple rejection

input 1

output

1

60
kΩ

2

kΩ

stand-by

switch

x 1

3

VA

15 kΩ

15 kΩ

mute switch

VA

18 kΩ

V

P

18 kΩ

C

mute
reference
voltage

m

4

output 1

power stage

8

mute/stand-by

switch input

stand-by
reference
voltage

mute
switch

TDA1517

2

kΩ

non-inverting

input 2

9

input

reference

voltage

60
kΩ

SGND

VA

mute switch

signal

ground
275

Fig.1 Block diagram.

2002 Jan 17 3

6

output 2

C

m

power stage

power
ground
(substrate)

MLC351

V

PGND

P

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PINNING

SYMBOL PIN DESCRIPTION

−INV1 1 non-inverting input 1
SGND 2 signal ground
SVRR 3 supply voltage ripple rejection output
OUT1 4 output 1
PGND 5 power ground
OUT2 6 output 2
V

P

M/SS 8 mute/standby switch input

−INV2 9 non-inverting input 2

7 supply voltage

dbook, halfpage

INV1

SGND

SVRR

OUT1

PGND

OUT2

V

M/SS

INV2

1
2
3
4
5

TDA1517
6
7

P

8
9

MLC352

Fig.2 Pin configuration for SOT110-1.

FUNCTIONAL DESCRIPTION

The TDA1517 contains two identical amplifiers with
differential input stages. The gainof each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:

• Low standby current (<100 µA)

• Low mute/standby switching current

(low cost supply switch)

• Mute condition.

dbook, halfpage

Pins 10 to 18 should be connected to GND or floating.

INV1

SGND

SVRR

OUT1

PGND

OUT2

V

M/SS

INV2

1
2
3
4
5

TDA1517P
6
7

P

8
9

18
17
16
15
14
13
12
11
10

MLC353

Fig.3 Pin configuration for SOT398-1.

2002 Jan 17 4

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

P(sc)

V

P(r)

ERG

O

I

OSM

I

ORM

P

tot

T

stg

T

amb

T

c

supply voltage operating − 18 V

no signal − 20 V
AC and DC short-circuit safe voltage − 18 V
reverse polarity − 6V
energy handling capability at outputs VP=0V − 200 mJ
non-repetitive peak output current − 4A
repetitive peak output current − 2.5 A
total power dissipation see Fig.4 − 15 W
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
crystal temperature − 150 °C

THERMAL RESISTANCE

SYMBOL TYPE NUMBER PARAMETER VALUE UNIT

R

th j-c

R

th j-p

R

th j-a

18

handbook, halfpage

P

(W)

12

6

0

25 0 50 150

TDA1517 thermal resistance from junction to case 8 K/W
TDA1517P thermal resistance from junction to pins 15 K/W
TDA1517; TDA1517P thermal resistance from junction to ambient 50 K/W

MLC354

(1)

(2)

100

o

T ( C)

amb

(1) R
(2) R

th j-c
th j-p

= 8 K/W.
= 15 K/W.

Fig.4 Power derating curve.

2002 Jan 17 5

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DC CHARACTERISTICS

VP= 14.4 V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q(tot)

V

O

Mute/standby switch

V

8

Mute condition

V

O

Standby condition

I

sb

V

sw

=25°C; measured in Fig.6; unless otherwise specified.

amb

supply voltage note 1 6.0 14.4 18.0 V
total quiescent current − 40 80 mA
DC output voltage − 6.95 − V

switch-on voltage level see Fig.5 8.5 −−V

output signal in mute position V

=1V; fi=20Hzto15kHz −−2mV

I(max)

DC current in standby condition −−100 µA
switch-on current − 12 40 µA

Note

1. The circuit is DC adjusted at V

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

P

2002 Jan 17 6

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

AC CHARACTERISTICS

VP= 14.4 V; RL=4Ω; f = 1 kHz; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

output power THD = 0.5%; note 1 4 5 − W

THD total harmonic distortion P
f

lr

f

hr

G

v

low frequency roll-off at −3 dB; note 2 − 45 − Hz
high frequency roll-off at −1dB 20 −−kHz
closed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB
mute 48 −−dB
standby 80 −−dB

|Z

| input impedance 50 60 75 kΩ

i

V

no

noise output voltage

on R
on R
mute note 5 − 50 −µV

α

cs

|∆G

| channel unbalance − 0.1 1 dB

v

channel separation Rs=10Ω 40 −−dB

=25°C; measured in Fig.6; unless otherwise specified.

amb

THD = 10%; note 1 5.5 6.0 − W

=1W − 0.1 − %

o

=0Ω; note 4 − 50 −µV

s

=10Ω; note 4 − 70 100 µV

s

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency response externally fixed.

3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.

4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage independent of R

(VI= 0 V).

s

2002 Jan 17 7

Philips Semiconductors Product specification

,

,

2 × 6 W stereo power amplifier TDA1517; TDA1517P

handbook, halfpage

18

V

11

(V)

,,,,,

ON (I = 40 mA)

P

,,,,,

8.5

6.4
mute (I = 40 mA)

P

3.3

2

standby (I 100 µA)

0

Fig.5 Standby, mute and on conditions.

APPLICATION INFORMATION

MLC355

P

handbook, full pagewidth

input 1

220 nF

standby switch

100

input

reference

voltage

internal

1/2 V

µF

3

87

P

100 nF

TDA1517

1 9

20 dB 20 dB

6

signal

ground

2 5

power

ground

4

1000 µF 1000 µF

60 kΩ60 kΩ

MLC356

Fig.6 Application circuit diagram.

220 nF

2200
µF

input 2

V

P

2002 Jan 17 8

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PACKAGE OUTLINES

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

D

D

1

q

P

P

1

A

2

SOT110-1

pin 1 index

seating plane

19

Z

b

e

2

DIMENSIONS (mm are the original dimensions)

A

A

18.5

17.8

max.

3.7

2

A

8.7

8.0

A

3

4

15.8

15.4

b

bcD

1

1.40

0.67

1.14

0.50

UNIT

mm

b

1.40

1.14

A

q

2

q

1

3

A

A

4

E

L

b

w M

b

1

c

Q

0 5 10 mm

scale

(1)

w

0.25

Z

max.

1.0

0.48

0.38

(1)

21.8

21.4

2

D

21.4

20.7

(1)

E

1

eLPP

6.48

6.20

2.54

3.9

3.4

2.75

2.50

3.4

3.2

1

Q

1.75

1.55

q

15.1

14.9

q1q

2

5.9

4.4

5.7

4.2

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT110-1

2002 Jan 17 9

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-25

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

HDIP18: plastic heat-dissipating dual in-line package; 18 leads

D

seating plane

L

Z

18

pin 1 index

e

b

SOT398-1

M

E

A

2

A

A

1

b

w M

1

b

2

10

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

mm

inches

max.

12

min.

max.

b

1.40

1.14

0.06

0.04

b

1

0.67

0.50

0.03

0.02

b

1.05

0.75

0.04

0.03

cD E e M

2

0.47

21.85

0.38

21.35

0.02

0.87

0.01

0.84

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT398-1

2002 Jan 17 10

9

(1) (1)

6.5

6.2

0.26

0.24

L

3.9

3.1

0.15

0.12

M

8.32

8.02

0.33

0.32

E

8.7

7.7

0.34

0.30

e

1

EUROPEAN

PROJECTION

H

0.252.54 7.62

0.010.10 0.30

ISSUE DATE

w

max.

1.04.7 0.51 3.7

0.040.19 0.02 0.15

(1)

Z

94-04-13
95-01-25

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

SOLDERING
Introduction to soldering through-hole mount

packages

This text gives a brief insight to wave, dip and manual
soldering.A more in-depth account ofsolderingICscan be
found in our

Packages”

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

DBS, DIP, HDIP, SDIP, SIL suitable suitable

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

“Data Handbook IC26; Integrated Circuit

(document order number 9398 652 90011).

PACKAGE

Thetotalcontacttime of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 °C, contact may be up to 5 seconds.

SOLDERING METHOD

DIPPING WAVE

(1)

stg(max)

). If the

2002 Jan 17 11

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DATA SHEET STATUS

PRODUCT

DATA SHEET STATUS

Objective data Development This data sheet contains data from the objective specification for product

Preliminary data Qualification This data sheet contains data from the preliminary specification.

Product data Production This data sheet contains data from the product specification. Philips

(1)

STATUS

(2)

DEFINITIONS

development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values givenare in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditionsabovethosegiven in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorsellingthese products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofany of these products, conveys no licenceortitle
under any patent, copyright, or mask work right to these
products,and makes no representations orwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

2002 Jan 17 12

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

2002 Jan 17 13

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

2002 Jan 17 14

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

NOTES

2002 Jan 17 15

Philips Semiconductors – a w orldwide compan y

Contact information

For additional information please visit http://www.semiconductors.philips.com. Fax: [phone]
For sales offices addresses send e-mail to: [e-mail].

© Koninklijke Philips Electronics N.V. 2002
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 753503/04/pp16 Date of release: 2002 Jan 17 Document order number: 9397 750 08925

SCA74