Philips MDV456/17 Service Manual
Contents
Chapter
Technical Specifications
Schematic Diagrams and CBA's
Exploded Views
Mechanical and Electrical Parts Lists
Survey of versions:
Published by FU-KC 0506 Service AV Systems Printed in The Netherlands Subject to modification
/17 NTSC
DVD Player MDV456/17
c Copyright 2005 Philips Consumer Electronics B.V. Eindhoven, The Netherlands.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval
system or transmitted, in any form or by any means, electronic, mechanical, photocopying,
or otherwise without the prior permission of Philips.
CLASS 1 LASER PRODUCT
KLASSE 1 LASER PRODUKT
KLASS 1 LASER APPARAT
CLASSE 1 PRODUIT LASER
EN 3139 785 30990
Second Generation
Service Manual
Service
Service
Service
This service manual is for MDV456/17 Second
Generation model, which are different from
previous generation MDV456/17 model.
For Second Generation models, the serial
number should begin with LN2Bxxxxxxxxxx.
Refer to the rating label illustration on the right.
Rating label
SERIAL NO.
LN2Bxxxxxxxxxx
MODEL NO. MDV456/17
MODEL NO. MDV456/17
DISTRIBUTED BY
Philips Consumer Electronics North America,
Knoxville, Tennessee 37914-1810 U.S.A
DVD PLAYER
E6170UD
MANUFACTURED:D
JANUARY, 2005
Serial number
Service Information only
TABLE OF CONTENTS
LASER BEAM SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1-1
IMPORTANT SAFETY PRECAUTIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2-1
STANDARD NOTES FOR SERVICING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3-1
OPERATING CONTROLS AND FUNCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4-1
SIGNAL NAME ABBREVIATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5-1
CABINET DISASSEMBLY INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6-1
HOW TO INITIALIZE THE DVD PLAYER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7-1
FIRMWARE RENEWAL MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8-1
BLOCK DIAGRAMS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9-1
SCHEMATIC DIAGRAMS / CBA'S AND TEST POINTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10-1
WAVEFORMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11-1
WIRING DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12-1
SYSTEM CONTROL TIMING CHARTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13-1
IC PIN FUNCTION DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14-1
LEAD IDENTIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15-1
NOT IN USE....................... . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16-1
EXPLODED VIEWS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17-1
NOT IN USE........................ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18-1
Manufactured under license from Dolby Laboratories.
“Dolby” and the double-D symbol are trademarks of Dolby Laboratories.
1-1-1 E6NLSP
LASER BEAM SAFETY PRECAUTIONS
This DVD player uses a pickup that emits a laser beam.
The laser beam is emitted from the location shown in the figure. When checking the laser diode, be sure to keep
your eyes at least 30 cm away from the pickup lens when the diode is turned on. Do not look directly at the laser
beam.
CAUTION: Use of controls and adjustments, or doing procedures other than those specified herein, may result in
hazardous radiation exposure.
Location: Top of DVD mechanism.
Do not look directly at the laser beam coming
from the pickup or allow it to strike against your
skin.
Drive Mecha Assembly
Laser Beam Radiation
Laser Pickup
Turntable
LASER RADIATION
WHEN OPEN. DO NOT
STARE INTO BEAM.
CAUTION
1-2-1 DVDN_ISP
IMPORTANT SAFETY PRECAUTIONS
Product Safety Notice
Some electrical and mechanical parts have special
safety-related characteristics which are often not
evident from visual inspection, nor can the protection
they give necessarily be obtained by replacing them
with components rated for higher voltage, wattage,
etc. Parts that have special safety characteristics are
identified by a # on schematics and in parts lists. Use
of a substitute replacement that does not have the
same safety characteristics as the recommended
replacement part might create shock, fire, and/or other
hazards. The Product’s Safety is under review
continuously and new instructions are issued
whenever appropriate. Prior to shipment from the
factory, our products are carefully inspected to confirm
with the recognized product safety and electrical
codes of the countries in which they are to be sold.
However, in order to maintain such compliance, it is
equally important to implement the following
precautions when a set is being serviced.
Precautions during Servicing
A. Parts identified by the # symbol are critical for
safety. Replace only with part number specified.
B. In addition to safety, other parts and assemblies
are specified for conformance with regulations
applying to spurious radiation. These must also be
replaced only with specified replacements.
Examples: RF converters, RF cables, noise
blocking capacitors, and noise blocking filters, etc.
C. Use specified internal wiring. Note especially:
1) Wires covered with PVC tubing
2) Double insulated wires
3) High voltage leads
D. Use specified insulating materials for hazardous
live parts. Note especially:
1) Insulation tape
2) PVC tubing
3) Spacers
4) Insulators for transistors
E. When replacing AC primary side components
(transformers, power cord, etc.), wrap ends of
wires securely about the terminals before
soldering.
F. Observe that the wires do not contact heat
producing parts (heat sinks, oxide metal film
resistors, fusible resistors, etc.).
G. Check that replaced wires do not contact sharp
edges or pointed parts.
H. When a power cord has been replaced, check that
5 - 6 kg of force in any direction will not loosen it.
I. Also check areas surrounding repaired locations.
J. Be careful that foreign objects (screws, solder
droplets, etc.) do not remain inside the set.
K. Crimp type wire connector
The power transformer uses crimp type
connectors which connect the power cord and the
primary side of the transformer. When replacing
the transformer, follow these steps carefully and
precisely to prevent shock hazards.
Replacement procedure
1) Remove the old connector by cutting the wires
at a point close to the connector.
Important: Do not re-use a connector.
(Discard it.)
2) Strip about 15 mm of the insulation from the
ends of the wires. If the wires are stranded,
twist the strands to avoid frayed conductors.
3) Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
4) Use a crimping tool to crimp the metal sleeve at
its center. Be sure to crimp fully to the complete
closure of the tool.
L. When connecting or disconnecting the internal
connectors, first, disconnect the AC plug from the
AC outlet.
1-2-2 DVDN_ISP
Safety Check after Servicing
Examine the area surrounding the repaired location for damage or deterioration. Observe that screws, parts, and
wires have been returned to their original positions. Afterwards, do the following tests and confirm the specified
values to verify compliance with safety standards.
1. Clearance Distance
When replacing primary circuit components, confirm
specified clearance distance (d) and (d’) between
soldered terminals, and between terminals and
surrounding metallic parts. (See Fig. 1)
Table 1: Ratings for selected area
Note: This table is unofficial and for reference only. Be
sure to confirm the precise values.
2. Leakage Current Test
Confirm the specified (or lower) leakage current
between B (earth ground, power cord plug prongs) and
externally exposed accessible parts (RF terminals,
antenna terminals, video and audio input and output
terminals, microphone jacks, earphone jacks, etc.) is
lower than or equal to the specified value in the table
below.
Measuring Method (Power ON):
Insert load Z between B (earth ground, power cord plug
prongs) and exposed accessible parts. Use an AC
voltmeter to measure across the terminals of load Z.
See Fig. 2 and the following table.
Table 2: Leakage current ratings for selected areas
Note: This table is unofficial and for reference only. Be sure to confirm the precise values.
AC Line Voltage Clearance Distance (d), (d’)
120 V ≥ 3.2 mm (0.126 inches)
AC Line Voltage Load Z Leakage Current (i) Earth Ground (B) to:
120 V
0.15 µF CAP. & 1.5 kΩ RES.
Connected in parallel
i ≤ 0.5 mA Peak Exposed accessible parts
Chassis or Secondary Conductor
dd'
Primary Circuit Terminals
Fig. 1
AC Voltmeter
(High Impedance)
Exposed Accessible Part
B
Earth Ground
Power Cord Plug Prongs
Z
Fig. 2
1-3-1 DVDN_PC_SN
STANDARD NOTES FOR SERVICING
Circuit Board Indications
1. The output pin of the 3 pin Regulator ICs is
indicated as shown.
2. For other ICs, pin 1 and every fifth pin are
indicated as shown.
3. The 1st pin of every male connector is indicated as
shown.
Instructions for Connectors
1. When you connect or disconnect the FFC (Flexible
Foil Connector) cable, be sure to first disconnect
the AC cord.
2. FFC (Flexible Foil Connector) cable should be
inserted parallel into the connector, not at an
angle.
Pb (Lead) Free Solder
When soldering, be sure to use the Pb free solder.
IDENTIFICATION:
Regardless of special logo (not always
indicated)
One must treat all sets from 1.1.2005
onwards, according next rules.
Important note:
In fact also products a little older can
also be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). So best to always
use SAC305 and the higher temperatures belong to
this.
Due to lead-free technology some rules have to be
respected by the workshop during a repair:
• Use only lead-free solder alloy Philips SAC305 with
order code 0622 149 00106. If lead-free solderpaste is required, please contact the manufacturer
of your solder-equipment. In general use of solderpaste within workshops should be avoided because
paste is not easy to store and to handle.
• Use only adequate solder tools applicable for lead-
free solder alloy. The solder tool must be able
• To reach at least a solder-temperature of 400°C,
• To stabilize the adjusted temperature at the solder-
tip
• To exchange solder-tips for different applications.
• Adjust your solder tool so that a temperature around
360°C
- 380°C is reached and stabilized at the
solder joint. Heating-time of the solder-joint should
not exceed ~ 4 sec. Avoid temperatures above
400°C otherwise wear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid wear-out of
tips switch off un-used equipment, or reduce heat.
• Mix of lead-free solder alloy / parts with leaded
solder alloy / parts is possible but PHILIPS
recommends strongly to avoid mixed solder alloy
types (leaded and lead-free). If one cannot avoid,
clean carefully the solder-joint from old solder alloy
and re-solder with new solder alloy (SAC305).
• Use only original spare-parts listed in the Service-
Manuals. Not listed standard-material (commodities)
has to be purchased at external companies.
• Special information for BGA-ICs:
- always use the 12nc-recognizable soldering
temperature profile of the specific BGA (for desoldering always use highest lead-free temperature
profile, in case of doubt)
- lead free BGA-ICs will be delivered in so-called
'dry-packaging' (sealed pack including a silica gel
pack) to protect the IC against moisture. After
opening, dependent of MSL-level seen on indicatorlabel in the bag, the BGA-IC possibly still has to be
baked dry. This will be communicated via AYS-
Top View
Out
In
Bottom View
Input
5
10
Pin 1
Pin 1
FFC Cable
Connector
CBA
* Be careful to avoid a short circuit.
1-3-2 DVDN_PC_SN
website.
Do not re-use BGAs at all.
• For sets produced before 1.1.2005, containing
leaded soldering-tin and components, all needed
spare-parts will be available till the end of the
service-period. For repair of such sets nothing
changes.
• On our website
www.atyourservice.ce.Philips.com
you find more
information to:
• BGA-de-/soldering (+ baking instructions)
• Heating-profiles of BGAs and other ICs used in
Philips-sets
You will find this and more technical information within
the “magazine”, chapter “workshop news”.
For additional questions please contact your local
repair-helpdesk.
How to Remove / Install Flat Pack-IC
1. Removal
With Hot-Air Flat Pack-IC Desoldering Machine:
1. Prepare the hot-air flat pack-IC desoldering
machine, then apply hot air to the Flat Pack-IC
(about 5 to 6 seconds). (Fig. S-1-1)
2. Remove the flat pack-IC with tweezers while
applying the hot air.
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
CAUTION:
1. The Flat Pack-IC shape may differ by models. Use
an appropriate hot-air flat pack-IC desoldering
machine, whose shape matches that of the Flat
Pack-IC.
2. Do not supply hot air to the chip parts around the
flat pack-IC for over 6 seconds because damage
to the chip parts may occur. Put masking tape
around the flat pack-IC to protect other parts from
damage. (Fig. S-1-2)
3. The flat pack-IC on the CBA is affixed with glue, so
be careful not to break or damage the foil of each
pin or the solder lands under the IC when
removing it.
With Soldering Iron:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Lift each lead of the flat pack-IC upward one by
one, using a sharp pin or wire to which solder will
not adhere (iron wire). When heating the pins, use
a fine tip soldering iron or a hot air desoldering
machine. (Fig. S-1-4)
3. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
4. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Fig. S-1-1
Hot-air
Flat Pack-IC
Desoldering
Machine
CBA
Flat Pack-IC
Tweezers
Masking
Tape
Fig. S-1-2
Flat Pack-IC
Desoldering Braid
Soldering Iron
Fig. S-1-3
Fine Tip
Soldering Iron
Sharp
Pin
Fig. S-1-4
1-3-3 DVDN_PC_SN
With Iron Wire:
1. Using desoldering braid, remove the solder from
all pins of the flat pack-IC. When you use solder
flux which is applied to all pins of the flat pack-IC,
you can remove it easily. (Fig. S-1-3)
2. Affix the wire to a workbench or solid mounting
point, as shown in Fig. S-1-5.
3. While heating the pins using a fine tip soldering
iron or hot air blower, pull up the wire as the solder
melts so as to lift the IC leads from the CBA
contact pads as shown in Fig. S-1-5.
4. Bottom of the flat pack-IC is fixed with glue to the
CBA; when removing entire flat pack-IC, first apply
soldering iron to center of the flat pack-IC and heat
up. Then remove (glue will be melted). (Fig. S-1-6)
5. Release the flat pack-IC from the CBA using
tweezers. (Fig. S-1-6)
Note: When using a soldering iron, care must be
taken to ensure that the flat pack-IC is not
being held by glue. When the flat pack-IC is
removed from the CBA, handle it gently
because it may be damaged if force is applied.
2. Installation
1. Using desoldering braid, remove the solder from
the foil of each pin of the flat pack-IC on the CBA
so you can install a replacement flat pack-IC more
easily.
2. The “●” mark on the flat pack-IC indicates pin 1.
(See Fig. S-1-7.) Be sure this mark matches the 1
on the PCB when positioning for installation. Then
presolder the four corners of the flat pack-IC. (See
Fig. S-1-8.)
3. Solder all pins of the flat pack-IC. Be sure that
none of the pins have solder bridges.
To Solid
Mounting Point
Soldering Iron
Iron Wire
or
Hot Air Blower
Fig. S-1-5
Fine Tip
Soldering Iron
CBA
Flat Pack-IC
Tweezers
Fig. S-1-6
Example :
Pin 1 of the Flat Pack-IC
is indicated by a " " mark.
Fig. S-1-7
Presolder
CBA
Flat Pack-IC
Fig. S-1-8
1-3-4 DVDN_PC_SN
Instructions for Handling Semiconductors
Electrostatic breakdown of the semi-conductors may
occur due to a potential difference caused by
electrostatic charge during unpacking or repair work.
1. Ground for Human Body
Be sure to wear a grounding band (1 MΩ) that is
properly grounded to remove any static electricity that
may be charged on the body.
2. Ground for Workbench
Be sure to place a conductive sheet or copper plate
with proper grounding (1 MΩ) on the workbench or
other surface, where the semi-conductors are to be
placed. Because the static electricity charge on
clothing will not escape through the body grounding
band, be careful to avoid contacting semi-conductors
with your clothing.
<Incorrect>
CBA
Grounding Band
Conductive Sheet or
Copper Plate
1MΩ
1MΩ
<Correct>
CBA
1-4-1 E6170IB
OPERATING CONTROLS AND FUNCTIONS
1-4-2 E6170IB
1-4-3 E6170IB
1-4-4 E6170IB
1-5-1 E6170SNA
SIGNAL NAME ABBREVIATIONS
Signal Name Function
-FL FIP Drive Power Supply
AUDIO(L) Audio (L) Signal
AUDIO(R) Audio (R) Signal
AUDIO(R)MUTE
Audio (R) Mute Control Signal
AUDIO+5V +5V at Audio Signal
AUDIO-GND Audio Ground Signal
EV+1.2V +1.2V Power Supply
EV+10V +10V Power Supply
EV+3.3V +3.3V Power Supply
EV+5V +5V Power Supply
F1 Filament Power Supply 1
F2 Filament Power Supply 2
FP-CLK Clock Input
FP-DIN Serial Data Input
FP-DOUT Serial Data Output
FP-STB Serial Interface Strobe
I/P-SW
Interlace/Progressive Detector
Signal
K1 Key Data 1 Input
K2 Key Data 2 Input
KEY-1 Key Souce-1
KEY-2 Key Souce-2
KEY-3 Key Souce-3
KEY-4 Key Souce-4
OSC Oscillator Input
P-ON+3.3V +3.3V at Power-On Signal
P-ON+5V +5V at Power-On Signal
P-ON+9V +9V at Power-On Signal
PWRCON Power Down
REMOTE Remote Control Signal
SPDIF
Digital Audio Interface Format
Signal
VDD Power Supply
VEE Pull Down Level
VIDEO-C
C (chrominance) Component Video
Signal
VIDEO-Cb/Pb Cb/Pb Component Video Signal
VIDEO-Cr/Pr Cr/Pr Component Video Signal
VIDEO-Y(I/P)
Y (luminance) Component Video
Signal (Interlace/Progressive)
VSS GND
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