Panasonic TH-L32C8K Schematic
Specifications
ORDER NO. MTV0901850CE
LCD TV
Model No. TH-L32C8K
Chassis: KM05
Destination: MALAYSIA
Power Source AC AUTO 110 - 240 V, 50/60 Hz
Power Consumption
Average use 99 W
Standby condition 0.8 W
Display panel
Aspect Ratio 16:9
Visible screen size 80 cm (diagonal)
698 mm (W) × 392 mm (H)
Number of pixels 1,049,088 (1,366 (W) × 768 (H))
Sound
Speaker Full range × 2 pcs, 8 Ω
Audio Output 20 W (10 W + 10 W), 10% THD
PC Signals VGA, SVGA, XGA, WVGA, WXGA
Receiving Systems / Band name 17 SYSTEMS FUNCTIONS
Vertical scanning frequency 60 Hz
1 PAL B, G, H
2 PAL I
3 PAL D, K
4 SECAM B, G
5 SECAM D, K
6 SECAM K1
7 NTSC M (NTSC 3.58 / 4.5MHZ)
8 NTSC 4.43 / 5.5 MHz
9 NTSC 4.43 / 6.0 MHz
10 NTSC 4.43 / 6.5 MHz
11 NTSC 3.58 / 5.5 MHz
12 NTSC 3.58 / 6.0 MHz
13 NTSC 3.58 / 6.5 MHz
14 SECAM I
Reception of broadcast transmission and
playback from video cassette tape recorders.
Playback from special VCR’s or DVD.
© Panasonic Corporation 2009. Unauthorized
copying and distribution is a violation of law
TH-L32C8K
15 PAL 60 Hz / 5.5 MHz Playback from Special Disc Players and
16 PAL 60 Hz / 6.0 MHz
17 PAL 60 Hz / 6.5 MHz
Receiving Channels (Analogue TV)
VHF BAND 2 - 12 (PAL / SECAM B, K1)
0 - 12 (PAL B AUST.)
1 - 9 (PAL B N.Z.)
1 - 12 (PAL / SECAM D)
1 - 12 (NTSC M JAPAN)
2 - 13 (NTSC M USA)
UHF BAND 21 - 69 (PAL G, H, I / SECAM G, K, K1)
28 - 69 (PAL B AUST.)
13 - 57 (PAL D, K)
13 - 62 (NTSC M JAPAN)
14 - 69 (NTSC M USA)
CATV S1 - S20 (OSCAR)
1 - 125 (USA CATV)
C13 - C49 (JAPAN)
S21 - S41 (HYPER)
Z1 - Z37 (CHINA)
5A, 9A (AUST.)
Aerial - Rear VHF / UHF
Operating Conditions Temperature : 0°C - 40°C
Humidity : 20 % - 80 % RH (non-condensing)
Connection Terminals
AV1 Input AUDIO L-R RCA PIN Type × 2 0.5 V [rms]
VIDEO RCA PIN Type × 1 1.0 V [p-p] (75 Ω)
AV2 Input AUDIO L-R RCA PIN Type × 2 0.5 V [rms]
VIDEO RCA PIN Type × 1 1.0 V [p-p] (75 Ω)
COMPONENT Y 1.0 V [p-p] (including synchronization)
, PR/C
P
B/CB
PC Input HIGH-DENSITY D-SUB 15 PIN R, G, B / 0.7 V [p-p] (75 Ω)
Dimensions (W x H x D) 798 mm × 551 mm × 217 mm (With Pedestal)
798 mm × 511 mm × 93 mm (TV only)
Mass 12.3 kg Net (With Pedestal)
11.4 kg Net (TV only)
Design and specifications are subject to change without notice. Weight and dimensions shown are approximate.
R
± 0.35 V [p-p]
HD, VD / TTL LEVEL 2.0-5.0 V [p-p] (high impedance)
Special VCR’s or DVD.
TABLE OF CONTENTS
1 Safety Precautions -----------------------------------------------4
1.1. General Guidelines ----------------------------------------4
1.2. Touch-Current Check--------------------------------------4
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices ------------------5
3 About Lead Free Solder (PbF)--------------------------------6
4 Power LED Blinking Timing -----------------------------------7
5 Location of Controls and Components--------------------8
5.1. Wire Dressing-----------------------------------------------8
6 Disassembly and Assembly Instructions-----------------9
PAGE PAGE
6.1. AC Cord Dressing -----------------------------------------9
6.2. AC Cord Installation------------------------------------- 10
6.3. LED Panel Installation And Fitting--------------------11
6.4. VESA Metal Assembly --------------------------------- 12
6.5. LCD Mounting Fixing ----------------------------------- 13
6.6. Chassis Frame Installation---------------------------- 14
6.7. Control Panel Assembly ------------------------------- 15
6.8. Chassis Installation-------------------------------------- 17
6.9. Sponge Speaker Sticking and VESA Fixing------- 18
6.10. Speaker Installation------------------------------------- 19
2
6.11. Back Cover Screw----------------------------------------20
7 Service Mode Adjustment ------------------------------------21
7.1. Self Check Mode ----------------------------------------- 21
7.2. Hotel Mode Adjustment---------------------------------21
7.3. Hotel Mode-------------------------------------------------21
8 Measurements and Adjustments---------------------------22
8.1. A-PCB Electrical Check---------------------------------22
8.2. P-PCB Electrical Check---------------------------------22
9 Printed Circuit Board-------------------------------------------23
9.1. A-Board -----------------------------------------------------23
9.2. A-Board -----------------------------------------------------23
10 Schematic Diagram---------------------------------------------24
10.1. Schematic Diagram Notes -----------------------------24
10.2. A Board -----------------------------------------------------25
10.2.1. A Board (1 / 7)----------------------------------------25
10.2.2. A Board (2 / 7)----------------------------------------26
10.2.3. A Board (3 / 7)----------------------------------------27
10.2.4. A Board (4 / 7)----------------------------------------28
10.2.5. A Board (5 / 7)----------------------------------------29
10.2.6. A Board (6 / 7)----------------------------------------30
10.2.7. A Board (7 / 7)----------------------------------------31
10.3. H Board -----------------------------------------------------32
10.3.1. H Board (1 / 3)----------------------------------------32
10.3.2. H Board (2 / 3)----------------------------------------33
10.3.3. H Board (3 / 3)----------------------------------------34
10.4. K Board -----------------------------------------------------35
10.4.1. K Board (1 / 2)----------------------------------------35
10.4.2. K Board (2 / 2)----------------------------------------36
10.5. P Board -----------------------------------------------------37
10.5.1. P Board (1 / 4)----------------------------------------37
10.5.2. P Board (2 / 4)----------------------------------------38
10.5.3. P Board (3 / 4)----------------------------------------39
10.5.4. P Board (4 / 4)----------------------------------------40
10.6. V Board -----------------------------------------------------41
10.6.1. V Board (1 / 3)----------------------------------------41
10.6.2. V Board (2 / 3)----------------------------------------42
10.6.3. V Board (3 / 3)----------------------------------------43
11 Exploded View and Replacement Parts List -----------44
11.1. Exploded View and Mechanical Replacement
Parts List----------------------------------------------------44
1 1 .2. Electrical Replacement Parts List --------------------44
1 1.2.1. Replacement Parts List Notes--------------------44
1 1 .2.2. Electrical Replacement Parts List ---------------45
TH-L32C8K
3
TH-L32C8K
1 Safety Precautions
1.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, repla ce all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch cu rrents between each exposed metallic part on the set and a good earth ground
such as a water pipe as shown in Figure 1.
3. Use the Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part and measure the voltage at each point.
5. The potential at any point (touch current) expressed as voltage U
For AC: U1 = 35 V (peak) and U2 = 0.35 V (peak);
For DC: U
NOTE :
The limit value of U
DC.
The limit value U
= 1.0 V,
1
= 0.35 V (peak) for AC and U1 = 1.0 V for DC correspond to the values 0.7 mA (peak) AC and 2.0 mA
2
= 35 V (peak) for AC correspond to the value 70 mA (peak) AC for frequencies greater than 100 kHz.
1
and U2, do not exceed the following values:
1
6. Should a measurement be out of the limits specified, there is a possibility of a sh ock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
4
TH-L32C8K
2 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easi ly by static electricity. Such components commonly are
called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits a nd some fieldeffect transistors and semiconductor “chip” components. The following techniques should be used to help redu ce the
incidence of component damage caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminium foil to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it (most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or
comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices (otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen erate static electricity (ESD)
sufficient to damage an ES device).
5
TH-L32C8K
3 About Lead Free Solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead Solder and PbF will refer to Lead Free Solder.
The Lead Free Solder (PbF) used in our manufacturing proce ss and discussed below is (Sn+Ag+Cu).
Those are Tin (Sn), Silver (Ag) and Copper (Cu), although other types are available.
This model uses PbF in its manufacture due to environmental conservation issues. For service and repair work, we would suggest
the use of PbF as well, although Pb may be used.
PCBs manufactured using lead-free will have the “PbF within a leaf Symbol” stamped on their back.
Caution
• PbF has a higher melting point than that of standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20°F (370 ± 10°C).
• PbF will tend to splash when heated too high (about 1100°F or 600°C).
If you must use Pb solder, please completely remove all of the PbF on the pins or solder area before applyi ng Pb. If this is not
practical, be sure to heat the PbF until it melts, before applying Pb.
• After applying PbF to double layered boards, please check the component side for excess solder which may flow onto the
opposite side (see Figure 2).
Figure 2
Suggested PbF
There are several kinds of PbF available for purchase. This product uses Sn+Ag+C u (tin, silver, copper) solder. However, Sn+ Cu
(tin, copper) and Sn+Zn+Bi (tin, zinc, bismuth) solders can also be used.
Figure 3
6
4 Power LED Blinking Timing
1. Subject
Information of LED Flashing timing.
2. Contents
When an abnormality occurs, the protection circuit will operate and reset the unit to stand by mode. During this time, the
defective block can be identified by the number of blinking times of the Power LED on the front panel of the unit as follow:
Blinking times Contents Check Point
2 INVERTER - SOS FPGA 6pin
5 24 down VCTP 106pin
6 SUB 8V down VCTP 1pin
7 Voltage down_3.3V VCTP 160pin
8 FPGA down VCTP 105pin
TH-L32C8K
7
TH-L32C8K
5 Location of Controls and Components
5.1. Wire Dressing
1. Wiring No.1 ~ No.14
2. Remove dust of terminal of LVDS and PB connector. (by ion blow)
Wire
No.1 CN 1 ~ P2
No.2 CN 1 ~ A6
No.3 A12 ~ SP(R)
No.4 A12 ~ SP(L)
No.5 A9 ~ V10
No.6 A01 ~ K01
SLOT AT CHASSIS FRAME CLAMPER
1234567891011121314
8
SLOT AT CHASSIS
FRAME
CLAMPER
6 Disassembly and Assembly Instructions
6.1. AC Cord Dressing
1. Clamp plug with clamper.
2. Insert beads 3pcs. And slide down to lower hole.
TH-L32C8K
9
TH-L32C8K
6.2. AC Cord Installation
1. Put on the AC CORD BRACKET on the CABINET.
2. Fix the AC CORD BRACKET with SCREW.
3. AC CORD BARRIER setting.
4. Insert AC CORD connector into P-PCB connector.
5. Clamp the AC CORD.
6. Insert AC CORD bushing into the AC CORD BRACKET.
10
6.3. LED Panel Installation And Fitting
1. Fix LED PANEL on CABINET.
2. Wire connecting. (V10)
3. Put V-PCB on CABINET.
4. Fix them with SCREW.
5. Insert the CLAMPER.
TH-L32C8K
11
TH-L32C8K
6.4. VESA Metal Assembly
Assemble LCD TOP MTG(L,R) , VESA METAL(upper) and fix them with screw. Please use jig for vesa metal assembly
preparation.
12
6.5. LCD Mounting Fixing
STEP 1
1. Fixing LCD SIDE MTG L and R on the CABINET.
2. LCD BTM MTG on the CABINET.
3. Fix them with SCREW.
TH-L32C8K
STEP 2
1. Fixing VESA METAL ASSY on the LCD PANEL.
2. Fix the VESA METAL ASSY with SCREW.
13
TH-L32C8K
6.6. Chassis Frame Installation
PART 1
1. A-PB-MTG METAL
2. Fix it with screw
PART 2
1. PI-PCB FRAME
2. Fix it with screw
14
6.7. Control Panel Assembly
1. Wire connecting. (K01)
2. Assemble POWER BUTTON to the K-PRINT.
3. Assemble K-PRINT, CONTROL BUTTON, CONTROL PANEL BRACKET.
4. Fix them with SCREWS.
5. Stick the FELT.
TH-L32C8K
15
TH-L32C8K
1. Put control panel Assy on the cabinet.
2. Fix the control panel with screws.
16
6.8. Chassis Installation
1. Stick Felt at Side AV Bracket.
2. Install Chassis at Chassis Frame.
3. Fix Side AV Bracket.
4. Fix Chassis with Screw.
TH-L32C8K
17
Loading...