AV2 (Scart connecter)21 Pin terminal (Audio/Video in, Audio/Video out, S-Video in, Q-Link)
AV3 (Scart connecter)21 Pin terminal (Audio/Video in, Audio/Video out, RGB in, S-Video in, Q-Link)
COMPONENT
IDEO
AUDIO L - RRCA PIN Type × 20.5 Vrms
Output
AUDIO L - RRCA PIN Type × 20.5 Vrms (high impedance)
Dimensions ( W × H × D )968 mm × 641 mm × 96.5 mm (37-inch)
Weight28.5 kg Net (37-inch)
PAL I
UHF E21-68.
PAL 525/60
Playback of NTSC tape from some PAL Video recorders (VCR) orNTSC disc playback from DVD
player and recorder.
DVB
Digital terrestrial services via UHF aerial input.
M.NTSC
Playback from M.NTSC Video recorders (VCR).
NTSC (AV inputonly)
Playback from NTSC Video recorders (VCR).
UHF / VHF (PA50E)
UHF (PE50B)
Humidity: 20 % - 80 % RH (non-condensing)
PB, PR±0.35 Vp-p
1,068 mm × 701 mm × 96.5 mm (42-inch)
33 kg Net (42-inch)
1.0 Vp-p (including synchronization)
Notes:
·
Design and Specifi cations are subject to change without notice. Weight and Dimensions shown are approximate.
·
This equipment complies with the EMC standards listed below.
EN55013, EN61000-3-2, EN61000-3-3, EN55020
CONTENTS
Page Page
1 Applicable signals 5
2 Safety Precautions
6
2.1. General Guidelines
2.2. Touch-Current Check
2
6
6
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
4 About lead free solder (PbF)
5 Service Hint
6 Plasma panel replacement method
6.1. Remove the Back cover.
6.2. Remove the P-Board.
6.3. Remove the PB-Board
6.4. Remove the D-Board
6.5. Remove the rear terminal cover
6.6. Remove the metal frame
6.7. Remove the XV-Board (PE50B only)
6.8. Remove the DG-Board
6.9. Remove the H-Board and TA-Board
6.10. Remove the PA-Board
6.11. Remove the Z-Board
6.12. Remove the SU-Board
6.13. Remove the SD-Board
6.14. Remove the SC-Board
6.15. Remove the SS-Board
6.16. Remove the C1-Board
6.17. Remove the C2-Board
6.18. Remove the K-Board
6.19. Remove the S-Board
6.20. Remove the Speaker L, R
6.21. Remove the Plasma panel section from the Front frame
(glass)
6.22. Replace the plasma panel (finished).
7 Location of Lead Wiring
7.1. Lead of Wiring (1)
7.2. Lead of Wiring (2)
7.3. Lead of Wiring (3)
8 Self Check
8.1. Power LED Blinking timing chart
8.2. No Power
8.3. No Picture
8.4. Local screen failure
9 Service Mode Function
9.1. How to enter SERVICE 1
9.2. How to enter SERVICE 2
9.3. Option Description
10 Adjustment Procedure
10.1. Driver Set-up
10.2. Initialization Pulse Adjust
10.3. P.C.B. (Printed Circuit Board) exchange
10.4. Adjustment Volume Location
10.5. Test Point Location
11 Adjustment
11.1. PAL panel white balance adjustment
11.2. 1080i white balance adjustment
11.3. Sub bright adjustment
11.4. ABL adjustment
12 Hotel mode
13 Conductor View
13.1. P-Board
7
8
9
10
10
10
10
10
11
11
11
11
12
12
12
12
13
13
14
14
14
14
15
15
13.2. PA-Board
13.3. PB-Board
13.4. H-Board
13.5. DG-Board
13.6. TA-Board
13.7. XV-Board (PE50B)
13.8. Z-Board
13.9. D-Board
13.10. C1-Bo ard (37 inch)
13.11. C1-Bo ard (42 inch)
13.12. C2-Bo ard (37 inch)
13.13. C2-Bo ard (42 inch)
13.14. SC-Bo ard
13.15. SU-Bo ard (37 inch)
13.16. SU-Bo ard (42 inch)
13.17. SD-Bo ard (37 inch)
13.18. SD-Bo ard (42 inch)
13.19. SS-Bo ard
13.20. K and S-Board
14 Block and Schematic Diagram
14.1. Schematic Diagram Notes
14.2. Main Block Diagram
14.3. P-Board Block Diagram
14.4. P-Board (1 of 6) Schematic Diagram
14.5. P-Board (2 of 6) Schematic Diagram
15
16
17
17
18
19
20
21
21
22
23
24
24
24
26
28
28
29
30
30
31
32
32
33
33
34
35
37
14.6. P-Board (3 of 6) Schematic Diagram
14.7. P-Board (4 of 6) Schematic Diagram
14.8. P-Board (5 of 6) Schematic Diagram
14.9. P-Board (6 of 6) Schematic Diagram
14.10. PA and PB-Board Block Diagram
14.11. PA-Bo ard Schematic Diagram
14.12. PB-Bo ard Schematic Diagram
14.13. H and TA-Board Block Diagram
14.14. K, S and Z-Boa rd Block Diagram
14.15. H Board (1 of 2) Schematic Diagram
14.16. H-Boa rd (2 of 2) Schematic Diagram
14.17. K, S and TA-Bo ard Schematic Diagram
14.18. Z-Boa rd Schematic Diagram
14.19. XV-Bo ard Block Diagram (PE50 B)
14.20. XV-Bo ard (1 of 5) Schematic Diagram (PE50B)
14.21. XV-Bo ard (2 of 5) Schematic Diagram (PE50B)
14.22. XV-Bo ard (3 of 5) Schematic Diagram (PE50B)
14.23. XV-Bo ard (4 of 5) Schematic Diagram (PE50B)
14.24. XV-Bo ard (5 of 5) Schematic Diagram (PE50B)
14.25. DG-B oard (1 of 2) Block Diagram
14.26. DG-B oard (2 of 2) Block Diagram
14.27. DG-B oard (1 of 11) Schematic Diagram
14.28. DG-B oard (2 of 11) Schematic Diagram
14.29. DG-B oard (3 of 11) Schematic Diagram
14.30. DG-B oard (4 of 11) Schematic Diagram
14.31. DG-B oard (5 of 11) Schematic Diagram
14.32. DG-B oard (6 of 11) Schematic Diagram
14.33. DG-B oard (7 of 11) Schematic Diagram
37
40
41
42
44
46
47
49
50
53
54
55
56
57
60
61
62
63
64
66
67
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
3
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
14.34. DG-B oard (8 of 11) Schematic Diagram 100
14.35. DG-B oard (9 of 11) Schematic Diagram
14.36. DG-B oard (10 of 11) Schematic Diagram
14.37. DG-B oard (11 of 11) Schematic Diagram
14.38. D-Boa rd Block Diagram
14.39. D-Boa rd (1 of 6) Schematic Diagram
14.40. D-Boa rd (2 of 6) Schematic Diagram
14.41. D-Boa rd (3 of 6) Schematic Diagram
14.42. D-Boa rd (4 of 6) Schematic Diagram
14.43. D-Boa rd (5 of 6) Schematic Diagram
14.44. D-Boa rd (6 of 6) Schematic Diagram
14.45. C1 and C2-Board Block Diagra m
14.46. C1-Bo ard (1 of 2) Schematic Diagram (37 inch)
14.47. C1-Bo ard (2 of 2) Schematic Diagram (37 inch)
14.48. C1-Bo ard (1 of 2) Schematic Diagram (42 inch)
14.49. C1-Bo ard (2 of 2) Schematic Diagram (42 inch)
14.50. C2-Bo ard (1 of 2) Schematic Diagram (37 inch)
14.51. C2-Bo ard (2 of 2) Schematic Diagram (37 inch)
14.52. C2-Bo ard (1 of 2) Schematic Diagram (42 inch)
14.53. C2-Bo ard (2 of 2) Schematic Diagram (42 inch)
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
14.54. SC-Bo ard Block Diagram
14.55. SC-Bo ard (1 of 2) Schematic Diagram
14.56. SC-Bo ard (2 of 2) Schematic Diagram
14.57. SU-Bo ard Block Diagram
14.58. SU-Bo ard Schematic Diagram (37 inch)
14.59. SU-Bo ard Schematic Diagram (42 inch)
14.60. SD-Bo ard Block Diagram
14.61. SD-Bo ard Schematic Diagram (37 inch)
14.62. SD-Bo ard Schematic Diagram (42 inch)
14.63. SS-Bo ard Block Diagram
14.64. SS-Bo ard Schematic Diagram
15 Parts Location & Mechanical Replacement Parts List
15.1. Parts Location
15.2. Packing Exploded Views (1)
15.3. Packing Exploded Views (2)
15.4. Packing Exploded Views (3)
15.5. Mechanical Replacement Parts List
16 Electrical Replacement Parts List
16.1. Replacement Parts List Notes
16.2. Electrical Replacement Parts List
120
121
122
123
124
125
126
127
128
129
130
131
131
132
133
134
135
137
137
138
4
1 Applicable signals
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
5
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
2 Safety Precautions
2.1. General Guidelines
1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2. After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3. After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
2.2. Touch-Current Check
1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.
2. Connect a measuring network for touch currents between each exposed metallic part on the set and a good earth ground such
as a water pipe, as shown in Figure 1.
3. Use Leakage Current Tester (Simpson 228 or equivalent) to measure the potential across the measuring network.
4. Check each exposed metallic part, and measure the voltage at each point.
5. Reserve the AC plug in the AC outlet and repeat each of the above measure.
6. The potential at any point (TOUGH CURRENT) expressed as voltage U
For a. c.: U
For d. c.: U
= 35 V (peak) and U2= 0.35 V (peak);
1
= 1.0 V,
1
Note:
The limit value of U
= 0.35 V (peak) for a. c. and U1= 1.0 V for d. c. correspond to the values 0.7 mA (peak) a. c. and 2.0
2
mA d. c.
The limit value U
= 35 V (peak) for a. c. correspond to the value 70 mA (peak) a. c. for frequencies greater than 100 kHz.
1
7. In case a measurement is out of the limits specified, there is a possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the customer.
and U2, does not exceed the following values:
1
Figure 1
6
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
3 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alminum
foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to
damage an ES device).
7
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
4 About lead free solder (PbF)
Note: Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it’s manufacture due to environmental conservation issues. For service and repair work, we’d
suggest the use of Pb free solder as well, although Pb solder may be used.
PCBs manufactured using lead free solder will have the PbF within a leaf Symbol
Caution
·
Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
·
Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
·
After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
stamped on the back of PCB.
8
5 Service Hint
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
8.1. Power LED Blinking timing chart
1. Subject
Information of LED Flashing timing chart.
2. Contents
When an abnormality has occurred the unit, the protection circuit operates and reset to the stand by mode. At this time, the
defective block can be identified by the number of blinkes of the Power LED on the front panel of the unit.
8.2. No Power
First check point
There are following 3 states of No Power indication by power LED.
1. No lit
2. Green is lit then turns red blinking a few seconds later.
3. Only red is lit.
1. No lit
21
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
8.3. No Picture
22
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
8.4. Local screen failure
Plasma display may have local area failure on the screen. Fig - 1 is the possible defect P.C.B. for each local area.
Fig - 1
23
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
9 Service Mode Function
MPU controls the functions switching for each IICs through IIC bus in this chassis. The following setting and adjustment can be
adjusted by remote control in Service Mode.
9.1. How to enter SERVICE 1
1. In sound menu, set BASS to MAXIMUM, and set TREBLE to MINIMUM.
2. Simultaneously press INDEX button on remote control and DOWN button [
9.2. How to enter SERVICE 2
1. Set the channel to CH99.
2. Select the SPL Gain.
3. Press HOLD button on remote control.
Note:
To exit to Service mode, press N or Power button on remote control.
] on the TV set.
24
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
25
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
9.3. Option Description
26
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
27
TH-42PA50E / TH-42PE50B / TH-37PA50E / TH-37PE50 B
10 Adjustment Procedure
10.1. Driver Set-up
10.1.1. Item / Preparation
1. Input an APL 100 % white signal.
2. Set the picture controls: -
Picture mode: Normal
White balance: Cool
Aspect: 16:9
10.1.2. Adjustments
Adjust driver section voltages referring the panel data on the
panel data label.
VscnTPVSCN (SC)Vad + 120 ± 3VFixed
SS BoardVeTPVE (SS)156V ± 1VVR6074 (SS)*
D, DG BoardWhite blance, Pedestal and Sub brightness for NTSC, PAL, HD, PC and 625i signals
*See the Panel label.
10.4. Adjustment Volume Location
30
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