ON Semiconductor NCP5602 Technical data

NCP5602

High Efficiency Ultra Small Thinnest White LED Driver

The NCP5602 product is a dual output LED driver dedicated to the

LCD display backlighting.

The built−in DC−DC converter is based on a high efficient charge pump structure with operating mode 1x and 1.5x. It provides a peak 87% efficiency together with a 0.2% LED to LED matching.

Features

• 2.7 to 5.5 V Input Voltage Range

• 87% Peak Efficiency with 1x and 1.5x Mode

• ICON Function Implemented

• Built−in Short Circuit Protection

• Provides Two Independent LED Drives

• Support I2C Protocol

• Smallest Available Package on the Market

• Tight 0.2% LED to LED Matching

• This is a Pb−Free Device

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MARKING DIAGRAM

LLGA12 (2x2 mm)

MU SUFFIX

CASE 513AA

ZA = Specific Device Code M = Date Code G = Pb−Free Package

(Note: Microdot may be in either location)

ZA M G

T ypical Applications

• Portable Back Light

• Digital Cellular Phone Camera Photo Flash

• LCD and Key Board Simultaneously Drive

GND

I2C−SCL

I2C−SDA

1 mF/6.3 V

10 k

GND

220 nF/10 V

Vbat

SCL SDA

IREF

GND

C1N

6 5

Figure 1. Typical Multiple White LED Driver

C1P

U1 NCP5602

220 nF/10 V

C2N

C2P

Vout

LED1

LED/ICON

1 mF/10 V

LWY87SG

PIN CONNECTIONS

GND

C1N

LED1 LED2

IREF

SDA

SCL

GND

2 12 11 3 4 5 6

(Top View)

ORDERING INFORMATION

Device Package Shipping†

NCP5602MUTBG LLGA12

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

3000 Tape & Ree

9 8 7

Vbat C1P

C2N C2P VOUT

July, 2006 − Rev . 1

1 Publication Order Number:

NCP5602/D

Vbat

NCP5602

220 nF 220 nF

12 10C29 8

GND

1 mF/6.3 V

GND

1 mF/6.3 V

SCL

SDA

GND 4

100 k

GND

6 5

Vbat

DIGITAL CONTROL

CHARGE PUMP

DC−DC CONVERTER

OVERVOLTAGE

Vbat

Vout

LWT67C

ANALOG CONTROL

OVERTEMPERATURE

CURRENT CONTROL

GND

ICON

Figure 2. Simplified Block Diagram

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NCP5602

PIN FUNCTION DESCRIPTION

Pin No. Symbol Function Description

1 GND POWER This pin is the GROUND signal for the analog and digital blocks and must be

2 LED1 INPUT, POWER This pin sinks to ground and monitors the current flowing into the first LED,

3 LED2 INPUT, POWER This pin sinks to ground and monitors the current flowing into the second

4 I

REF

INPUT, ANALOG This pin provides the reference current, based on the internal bandgap

5 SDA INPUT, DIGITAL This pin carries the data provided by the I2C protocol. The content of the

6 SCL INPUT, DIGITAL This pin carries the I2C clock to control the DC−DC converter and to set up

7 VOUT OUTPUT, POWER This pin provides the output voltage supplied by the DC−DC converter. The

8 C2P POWER One side of the external charge pump capacitor (C

9 C2N POWER One side of the external charge pump capacitor (C

10 C1P POWER One side of the external charge pump capacitor (C

11 VBAT INPUT, POWER Input Battery voltage to supply the analog and digital blocks. The pin must be

12 C1N POWER One side of the external charge pump capacitor (C

1. Using low ESR ceramic capacitor is mandatory to optimize the Charge Pump efficiency.

2. Total DC−DC output current is limited to 60 mA.

connected to the system ground. This pin is the GROUND reference for the DC−DC converter and the output current control. The pin must be connected to the system ground, a ground plane being strongly recommended.

intended to be used in backlight application. The current is limited to 30 mA maximum (see Note 2). When the ICON bit of the LED−REG register is High, the LED2 fulfills the ICON function. In this case, LED1 is deactivated.

LED, intended to be used in backlight application. The current is limited to 30 mA maximum (see Note 2). When the ICON bit of the LED−REG register is High, the LED2 fulfills the ICON function. In this case, LED1 is deactivated. The ICON current is 600 mA typical.

voltage reference, to control the output current flowing in the LED. A 1% tolerance, or better, resistor shall be used to get the highest accuracy of the LED biases. An external current source can be used to bias this pin to dim the light coming out of the LED.

In no case shall the voltage at pin 4 be forced either higher or lower than the 600 mV provided by the internal reference.

SDA byte is used to program the mode of operation and to set up the output current (see Table 2).

the output current. The SCL clock is associated with the SDA signal.

Vout pin must be bypassed by 1.0 mF ceramic capacitor located as close as possible to the pin to properly bypass the output voltage to ground. The circuit shall not operate without such bypass capacitor properly connected to the Vout pin.

The output voltage is internally clamped to 5.5 V maximum in the event of no load situation. On the other hand, the output current is limited to 40 mA (typical) in the event of a short circuit to ground.

) is connected to this

FLY

pin, associated with C2N (see Note 1).

) is connected to this

FLY

pin, associated with C2P (see Note 1).

) is connected to this

FLY

pin, associated with C1N, pin 11 (see Note 1).

decoupled to ground by a 1.0 mF ceramic capacitor.

) is connected to this

FLY

pin, associated with C1P, pin 10 (see Note 1).

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NCP5602

MAXIMUM RATINGS

Rating Symbol Value Unit

Power Supply V

BAT

Output Power Supply Vout 7.0 V Digital Input Voltage

SCL, SDA −0.3 < V < V

Digital Input Current Human Body Model: R = 1500 W, C = 100 pF (Note 3)

ESD 2.0

Machine Model LLGA12 Package

Power Dissipation @ TA = +85°C (Note 4) Thermal Resistance, Junction−to−Case

Thermal Resistance, Junction−to−Air Operating Ambient Temperature Range T Operating Junction Temperature Range T Maximum Junction Temperature T Storage Temperature Range T

JA A J

Jmax

stg

Latchup Current Maximum Rating per JEDEC Standard: JESD78 − "100 mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

3. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) "200V per JEDEC standard: JESD22−A115.

4. The maximum package power dissipation limit must not be exceeded.

5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.

−0.3 <V < 7.0 V

BAT

1.0

200

°C/W °C/W

−40 to +85 °C

−40 to +125 °C +150 °C

−65 to +150 °C

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