ON Semiconductor NCP5602 Technical data

NCP5602
l
High Efficiency Ultra Small Thinnest White LED Driver
The NCP5602 product is a dual output LED driver dedicated to the
The built−in DC−DC converter is based on a high efficient charge pump structure with operating mode 1x and 1.5x. It provides a peak 87% efficiency together with a 0.2% LED to LED matching.
Features
2.7 to 5.5 V Input Voltage Range
87% Peak Efficiency with 1x and 1.5x Mode
ICON Function Implemented
Built−in Short Circuit Protection
Provides Two Independent LED Drives
Support I2C Protocol
Smallest Available Package on the Market
Tight 0.2% LED to LED Matching
This is a Pb−Free Device
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MARKING DIAGRAM
LLGA12 (2x2 mm)
MU SUFFIX
CASE 513AA
1
ZA = Specific Device Code M = Date Code G = Pb−Free Package
(Note: Microdot may be in either location)
ZA M G
G
T ypical Applications
Portable Back Light
Digital Cellular Phone Camera Photo Flash
LCD and Key Board Simultaneously Drive
GND
I2C−SCL
I2C−SDA
C3
1 mF/6.3 V
10 k
GND
220 nF/10 V
Vbat
12
Vbat
SCL SDA
IREF
GND
C1N
R1
11
6 5
4
1
Figure 1. Typical Multiple White LED Driver
10
C1P
U1 NCP5602
220 nF/10 V
9
C2N
8
C2P
Vout
LED1
LED/ICON
1 mF/10 V
7
D1
2
LWY87SG
D2
LWY87SG
3
C4
PIN CONNECTIONS
GND
C1N
LED1 LED2
IREF
SDA
SCL
GND
1
2 12 11 3 4 5 6
(Top View)
ORDERING INFORMATION
Device Package Shipping
NCP5602MUTBG LLGA12
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
3000 Tape & Ree
10
9 8 7
Vbat C1P
C2N C2P VOUT
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev . 1
1 Publication Order Number:
NCP5602/D
Vbat
C1
NCP5602
220 nF 220 nF
12 10C29 8
C4
GND
1 mF/6.3 V
C3
GND
1 mF/6.3 V
SCL
SDA
R1
GND 4
100 k
GND
11
6 5
Vbat
DIGITAL CONTROL
CHARGE PUMP
DC−DC CONVERTER
OVERVOLTAGE
Vbat
Q1
Q2
Vout
7
LWT67C
LWT67C
D1
D2
2
3
ANALOG CONTROL
1
OVERTEMPERATURE
CURRENT CONTROL
GND
ICON
Figure 2. Simplified Block Diagram
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NCP5602
PIN FUNCTION DESCRIPTION
Pin No. Symbol Function Description
1 GND POWER This pin is the GROUND signal for the analog and digital blocks and must be
2 LED1 INPUT, POWER This pin sinks to ground and monitors the current flowing into the first LED,
3 LED2 INPUT, POWER This pin sinks to ground and monitors the current flowing into the second
4 I
REF
INPUT, ANALOG This pin provides the reference current, based on the internal bandgap
5 SDA INPUT, DIGITAL This pin carries the data provided by the I2C protocol. The content of the
6 SCL INPUT, DIGITAL This pin carries the I2C clock to control the DC−DC converter and to set up
7 VOUT OUTPUT, POWER This pin provides the output voltage supplied by the DC−DC converter. The
8 C2P POWER One side of the external charge pump capacitor (C
9 C2N POWER One side of the external charge pump capacitor (C
10 C1P POWER One side of the external charge pump capacitor (C
11 VBAT INPUT, POWER Input Battery voltage to supply the analog and digital blocks. The pin must be
12 C1N POWER One side of the external charge pump capacitor (C
1. Using low ESR ceramic capacitor is mandatory to optimize the Charge Pump efficiency.
2. Total DC−DC output current is limited to 60 mA.
connected to the system ground. This pin is the GROUND reference for the DC−DC converter and the output current control. The pin must be connected to the system ground, a ground plane being strongly recommended.
intended to be used in backlight application. The current is limited to 30 mA maximum (see Note 2). When the ICON bit of the LED−REG register is High, the LED2 fulfills the ICON function. In this case, LED1 is deactivated.
LED, intended to be used in backlight application. The current is limited to 30 mA maximum (see Note 2). When the ICON bit of the LED−REG register is High, the LED2 fulfills the ICON function. In this case, LED1 is deactivated. The ICON current is 600 mA typical.
voltage reference, to control the output current flowing in the LED. A 1% tolerance, or better, resistor shall be used to get the highest accuracy of the LED biases. An external current source can be used to bias this pin to dim the light coming out of the LED.
In no case shall the voltage at pin 4 be forced either higher or lower than the 600 mV provided by the internal reference.
SDA byte is used to program the mode of operation and to set up the output current (see Table 2).
the output current. The SCL clock is associated with the SDA signal.
Vout pin must be bypassed by 1.0 mF ceramic capacitor located as close as possible to the pin to properly bypass the output voltage to ground. The circuit shall not operate without such bypass capacitor properly connected to the Vout pin.
The output voltage is internally clamped to 5.5 V maximum in the event of no load situation. On the other hand, the output current is limited to 40 mA (typical) in the event of a short circuit to ground.
) is connected to this
FLY
pin, associated with C2N (see Note 1).
) is connected to this
FLY
pin, associated with C2P (see Note 1).
) is connected to this
FLY
pin, associated with C1N, pin 11 (see Note 1).
decoupled to ground by a 1.0 mF ceramic capacitor.
) is connected to this
FLY
pin, associated with C1P, pin 10 (see Note 1).
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3
NCP5602
MAXIMUM RATINGS
Rating Symbol Value Unit
Power Supply V
BAT
Output Power Supply Vout 7.0 V Digital Input Voltage
SCL, SDA −0.3 < V < V
Digital Input Current Human Body Model: R = 1500 W, C = 100 pF (Note 3)
ESD 2.0
Machine Model LLGA12 Package
Power Dissipation @ TA = +85°C (Note 4) Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Air Operating Ambient Temperature Range T Operating Junction Temperature Range T Maximum Junction Temperature T Storage Temperature Range T
R
R
P
D
q
JC
q
JA A J
Jmax
stg
Latchup Current Maximum Rating per JEDEC Standard: JESD78 "100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
3. This device series contains ESD protection and exceeds the following tests: Human Body Model (HBM) "2.0 kV per JEDEC standard: JESD22−A114. Machine Model (MM) "200V per JEDEC standard: JESD22−A115.
4. The maximum package power dissipation limit must not be exceeded.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A.
−0.3 <V < 7.0 V
BAT
1.0
mA
200
200
51
200
mW
°C/W °C/W
−40 to +85 °C
−40 to +125 °C +150 °C
−65 to +150 °C
V
kV
V
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NCP5602
POWER SUPPLY SECTION (Typical values are referenced to T
= +25°C, Min & Max values are referenced −40°C to +85°C ambient
A
temperature, operating conditions 2.85 V < Vbat < 5.5 V , unless otherwise noted.)
Rating Pin Symbol Min Typ Max Unit
Power Supply 11 V Continuous DC Current in the Load @ Vf = 3.0 V , ICON = L
7 I @ 3.2 V < Vbat < 5.5 V @ 3.0 V < Vbat < 5.5 V
Output ICON Current (ICON = H) @ Tj = + 25°C, Vf = 2.8 V,
7 I
ICONTROL
bat
out
2.7 5.5 V mA
60 45
600 850 mA
Vbat = 3.6 V Continuous Output Short Circuit Current 7 Isch 45 150 mA Output Voltage Compliance (OVP) 7 Vout 4.8 5.7 V DC−DC Start Time (Cout = 1.0 mF) 3.0 V < Vbat = Nominal < 5.5 V
12 Tstart 150 ms
from Last ACK Bit to Full Load Operation Output Voltage T urn Off Time from Last ACK Bit to V out = 5% 12 Toff 300 ms Standby Current, Vbat = 3.6 V , Iout = 0 mA, ICON = L
@ SCL = SDA = L
@ SCL = SDA = H (No Port Activity) Operating Current, @ Iout = 0 mA, ICON = H, Vbat = 3.6 V 11 I Output LED to LED Current Matching, @ 3.0 V < Vbat < 4.2 V ,
I
= 10 mA, LED1 & LED2 are Identical −25°C < Ta < 85°C
LED
Output Current Tolerance @ Vbat = 3.6 V, I
= 10 mA −25°C < Ta
LED
11 I
2, 3 I
2, 3 I
stdb
op
MAT
TOL
mA
6.0 12
750 mA
1.0 "0.2 1.0 %
"3.0 %
< 85°C Charge Pump Operating Frequency −40°C < Ta < 85°C Fpwr 1.0 MHz Thermal Shutdown Protection T Thermal Shutdown Protection Hysteresis T Efficiency
− LED1 = LED2 = 10 mA, Vf = 3.2 V , Vbat = 3.2 V (Total = 20 mA)
− LED1 = LED2 = 30 mA, Vf = 3.4 V , Vbat = 3.75 V (Total = 60 mA)
E
SD
SDH
PWR
160 °C
30 °C
87 84
%
ANALOG SECTION (Typical values are referenced to T
= +25°C, Min & Max values are referenced −40°C to +85°C ambient
A
temperature, operating conditions 2.85 V < Vbat < 5.5 V , unless otherwise noted.)
Rating Pin Symbol Min Typ Max Unit
Reference Current @ Vref = 600 mV (Note 7) 4 I Reference Voltage (Note 7) 4 V Reference Current (IREF) Current Ratio (see Table 2) I
REF
REF
LEDR
1.0 60 mA
−3% 600 +3% mV
16
6. The overall output current tolerance depends upon the accuracy of the external resistor. Using 1% or better resistor is recommended.
7. The external circuit must not force the I one can force to run the normal operation.
DIGITAL PARAMETERS SECTION (Typical values are referenced to T
pin voltage either higher or lower than the 600 mV specified. The limits represent the min/max values
REF
= +25°C, Min & Max values are referenced −40°C to +85°C
A
ambient temperature, operating conditions 2.85 V < Vbat < 5.5 V , unless otherwise noted.) Note: Digital inputs undershoot < − 0.30 V to ground, Digital inputs overshoot < 0.30 V to V
BAT
.
Rating Pin Symbol Min Typ Max Unit
InputI2C Clock Frequency (Note 8) 6 F Positive Going Input High Voltage Threshold, SCL, SDA Signals 5, 6 V Negative Going Input High Voltage Threshold, SCL, SDA
5, 6 V
SCK
IH
IL
400 kHz
1.3 V
BAT
0 0.4 V
Signals
8. Parameter not tested in production, guaranteed by design.
V
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NCP5602
VBandgap
APPLICATION INFORMATION
DC−DC Operation
The converter is based on a charge pump technique to generate a DC voltage capable to supply the White LED load. The system regulates the current flowing into each LED by means of internal current mirrors associated with the white diodes. Consequently, the output voltage will be equal to the Vf of the LED, plus the drop voltage (ranging from 200 mV to 400 mV, depending upon the output current) developed across the internal NMOS mirror. Typically, assuming a standard white LED forward biased at 10 mA, the output voltage will be 3.8 V.
The built−in OVP circuit continuously monitor each output and stops the converter when the voltage is above
5.0 V. The converter resumes to normal operation when the voltage drops below 5.0 V (no latchup mechanism). Consequently, the chip can operate with no load during any test procedures.
Load Current Calculation
The load current is derived from the 600 mV reference voltage provided by the internal Bandgap associated to the external resistor connected across I Figure 3). In any case, no voltage shall be forced at I
pin and Ground (see
REF
REF
pin, either downward or upward.
The reference current is multiplied by the constant k = 250 to yield the output load current. Since the reference voltage is based on a temperature compensated Bandgap, a tight tolerance resistor will provide a very accurate load current. The resistor is calculated from the Ohm’s law (R
= Vref/I
bias
) and a more practical equation can be
REF
arranged to define the resistor value for a given output current:
R
+ (Vref * k)ńIout
bias
R
+ (0.6*250)ńIout
bias
(eq. 1)
R
+ 150ńIout
bias
(eq. 2)
Consequently, the resistor value will range between
R
= 150/30 mA = 5000 W and R
bias
= 150/0.5 mA =
bias
300 kW. Obviously, the tolerance of such a resistor must be 1% or better, with a 100 ppm thermal coefficient, to get the expected overall tolerance.
LED Return
+
600mV
I
REF
Pin 4
R1
Note: The I
GND
Figure 3. Basic Reference Current Source
biased by an external voltage.
pin must never be
REF
GND
Pin 2 & 3
Load Connection
The NCP5602 chip is capable to drive the two LED simultaneously, as depicted in Figure 1, but the load can be arranged to accommodate one or two LED if necessary in the application (see Figure 4). In this case, the two current mirrors can be connected in parallel to drive a single power full LED, thus yielding 60 mA current capability in a single LED.
7
NCP5602
2 3
7
D1
Figure 4. Typical Single and Double LED Connections
LWY8SG
C4
GND
1 mF/6.3 V
NCP5602
2 3
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6
D1
LWY8SG
D2
LWY8SG
C4
1 mF/6.3 V
GND
NCP5602
Finally, an external network can be connected across Vout and ground , but the current through such network will not be regulated by the NCP5602 chip (see Figure 5). On
GND
NCP5602
Figure 5. Extra Load Connected to Vout
C4
7
20 mA
D1
2 3
I2C Protocol
The standard I2C protocol is used to transfer the data from the MCU to the NCP5602. Leaving aside the
top of that, the total current out of the Vout pin shall be limited to 60 mA.
1 mF/6.3 V
5 mA
20 mA
LWY8SG
D2
LWY8SG
LWY8SG
D3
220RR1220R
GND
5 mA
D4
R2
LWY8SG
Acknowledge bit, the NCP5602 does not return data back to the MCU.
Figure 6. Basic I2C Timings
MSB LSB
START A7 A6 A5 A4 A3 A2 A1 R/W ACK
7 Bits Slave Address
Start condition sent by Master Sent by Slave
Figure 7. Peripheral Address Identification
B7 B6 B5 B4 B3 B2 B1 ACK STOP
B0
Sent by Slave
Sent by Master
Figure 8. Basic DATA Transfer from MCU to Peripheral
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NCP5602
The physical address of the NCP5602 is 1001 111X, the X being the Read/Write identifier as defined by the I2C specification. Since the NCP5602 does not return data, the first byte of the I2C frame shall be 1001 1110 ($9E) as depicted in Table 2.
T able 1. NCP5602 Physical I2C Address
B7 B6 B5 B4 B3 B2 B1 B0
1 0 0 1 1 1 1 0
To set up a new output current value, a full frame shall be sent by the MCU. The frame contains three consecutive bytes and shall fulfill the I2C specifications:
First byte : I2C address ³$9E Second byte : internal register address ³$01 Third byte : output current value ³$00 to $1E (0 mA to 30 mA, Assuming Rext = 10 kW)
The waveforms given in Figure 9 illustrate a typical output current update.
Figure 9. Typical NCP5602 I2C Startup Sequence
Dimming
The built−in I2C interface provides a simple way to accurately control the output current flowing in the two LED. Such dimming is active under the NORMAL mode only and the LED2 current cannot be adjusted when the ICON mode is active.
The internal register LED−REG[0..7] is set up by the content of the SDA byte sent by the external MCU as depicted in Table 2. For typical application, the 60 mA reference current forced by the external resistor is multiply by 16 to get a 1.0 mA/step in the output LED. The waveforms given Figure 10 illustrate a normal programming sequence.
Table 2. LED−REG[0..7] Internal Register Bits Assignment
B7 B6 B5 B4 B3 B2 B1 B0
RFU RFU ICON IREF*16*16 IREF*16*8 IREF*16*4 IREF*16*2 IREF*16
[B7,B6] = RFU:bits reserved for future use B5 = ICON:control the NORMAL/ICON
mode of operation:
ICON = Low ³ Normal MODE takes place, the two
LED are activated and the current can be adjusted from 0 mA to 30 mA maximum per LED.
ICON = High ³ ICON mode takes place, LED#1 is
deactivated, the current to LED#2 being setup to 450 mA. It is not possible to adjust this current.
[B4..B0] = Output LED current. The content of these bits
is latched to the current reference on the 8th SCK clock pulse.
The DC−DC converter is switched OFF and the two LED are disconnected when LED−REG=$00.
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NCP5602
VCC
G
J2
When the ICON mode is activated, the DC−DC converter is switched OFF, LED#1 is deactivated from the VOUT and 450 mA are forced into LED#2. The
Figure 10. Output Current I2C Programming Sequence
2
POWER
J1
2 4 6 8
10 9
CONTROL
PORT
ND
1
GND
GND
VCC
SCL SDA
TP1
TP2
SCL
SDA
1 3 5 7
4.7 mF/10 V VCC
R1
10 k
C3
R2
IREFBK
10 k
11
6 5 4
1
waveforms, given Figure 11, illustrate the programming sequence to activate the ICON.
220 nF/63 V
C1 C2
12
C1N
Vbat
SCL SDA
IREF
GND
U1 NCP5602
Figure 11. ICON Programming Sequence
220 nF/63 V
10
C1P
9
C2N
8
Vout
LED1
LED/ICON
C2P
C4
GND
7
Vout
D1
LED1
2
LED2
3
4.7 mF/16 V
LWY8S
D2
LWY8S
R3
10 k
GND
Z1
GND
Figure 12. Demo Board Schematic Diagram
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NCP5602
Figure 13. LED Current Matching
Figure 14. Efficiency as a Function of VF, V
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10
bat
NCP5602
Figure 15. NCP5602 Demo Board
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NCP5602
PACKAGE DIMENSIONS
LLGA12
MU SUFFIX
CASE 513AA−01
ISSUE O
12X
REFERENCE
2 X
SEATING PLANE
PIN ONE
2 X
C0.10
C0.08
11X
e/2
D
C0.10
C0.10
TOP VIEW
A
B
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.50 0.60
A1 0.00 0.05
b 0.15 0.25
D 2.00 BSC
D2 0.80 1.00
E 2.00 BSC
E2 0.55 0.65
e 0.40 BSC
K 0.25 −−−
L 0.30 0.50
L1 0.40 0.60
A
L1
2
SIDE VIEW
D2
C
SOLDERING FOOTPRINT*
9X
e
6
E2
2.06
0.66
2.30
1
0.93
12X
0.23
0.40 PITCH
0.91
A1
L
K
1
12
11
BOTTOM VIEW
7
12X
0.10 C
b
0.05 C
A BB
NOTE 3
11X
0.630.56
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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12
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