NXP 74HC244BQ, 74HC244D, 74HC244DB, 74HC244N, 74HC244PW Schematics

...

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Rev. 4 — 24 September 2012 Product data sheet

1. General description

The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device can be used as two 4-bit buffers or one 8-bit buffer. The device features two output enables (1OE causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes that enable the use of current limiting resistors to interface inputs to voltages in excess of V

2. Features and benefits

 Input levels:

 For 74HC244: CMOS level

 For 74HCT244: TTL level  Octal bus interface  Non-inverting 3-state outputs  Complies with JEDEC standard no. 7 A  ESD protection:

 HBM JESD22-A114F exceeds 2000 V

 MM JESD22-A115-A exceeds 200 V  Multiple package options  Specifie d from 40 Cto +85C and 40 Cto +125C

and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE

3. Ordering information

Table 1. Ordering information

Type number Package

74HC244N 40 Cto+125C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1 74HCT244N 74HC244D 40 Cto+125C SO20 plastic small outline package; 20 leads; 74HCT244D 74HC244DB 40 Cto+125C SSOP20 plastic shrink small outline package; 20 leads; 74HCT244DB 74HC244PW 40 Cto+125C TSSOP20 plastic thin shrink small outline package; 20 leads; 74HCT244PW 74HC244BQ 40 C to +125 C DHVQFN20 plastic dual-in-line compatible thermal enhanced 74HCT244BQ

Temperature range Name Description Version

SOT163-1

body width 7.5 mm

SOT339-1

body width 5.3 mm

SOT360-1

body width 4.4 mm

SOT764-1 very thin quad flat package; no leads; 20 terminals; body 2.5  4.5  0.85 mm

NXP Semiconductors

mna875

1A3

1A2

1A1

1A0

1Y0

1Y1

1Y2

1Y3

1OE

2A3

2A2

2A1

2A0

2Y0

2Y1

2Y2

2Y3

2OE

mna874

1A0

1A1

1A2

1A3

1OE

1Y0

1Y1

1Y2

1Y3

2A0

2A1

2A2

2A3

2OE

2Y0

2Y1

2Y2

2Y3

2 4

6 8

18 16

mna873

11 13

15 17

9 7

4. Functional diagram

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 1. Functional diagram

Fig 2. Logic symbol Fig 3. IEC logic symbol

Product data sheet Rev. 4 — 24 September 2012 2 of 18

NXP Semiconductors

74HC244

74HCT244

1OE V

1A0 2OE 2Y0 1Y0 1A1 2A0 2Y1 1Y1 1A2 2A1 2Y2 1Y2 1A3 2A2 2Y3 1Y3

GND 2A3

001aae011

1 2 3 4 5 6 7 8 9

12 11

14 13

16 15

18 17

20 19

001aae012

74HC244

74HCT244

Transparent top view

1Y3

1A3 2Y3

2A2

2Y2 1Y2

1A2 2A1

2Y1 1Y1

1A1 2A0

2Y0 1Y0

1A0 2OE

GND

2A3

1OE

8 13

7 14

6 15

5 16

4 17

3 18

2 19

terminal 1

index area

GND

(1)

5. Pinning information

5.1 Pinning

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 4. Pin configuration DIP20, SO20, (T)SSOP20 Fig 5. Pin configuration DHVQFN20

5.2 Pin description

Table 2. Pin description

Symbol Pin Description

, 2OE 1, 19 output enable input (active LOW)

1OE 1A0, 1A1, 1A2, 1A3 2, 4, 6, 8 data input 2Y0, 2Y1, 2Y2, 2Y3 3, 5, 7, 9 bus output GND 10 ground (0 V) 2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 data input 1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14, 12 bus output V

Product data sheet Rev. 4 — 24 September 2012 3 of 18

(1) This is not a supply pin. The substrate is attached to this

pad using conductive die attach material. There is no electrical or mechanical requirement to solder this pad. However, if it is soldered, the solder land should remain floating or be connected to GND.

20 supply voltage

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

6. Functional description

Table 3. Function table

[1]

Input Output nOE nAn nYn

LLL LHH HXZ

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

7. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

V I

GND

T P

stg

tot

supply voltage 0.5 +7 V input clamping current VI < 0.5 V or VI>VCC+0.5 V - 20 mA output clamping current VO< 0.5 V or VO>VCC+0.5V - 20 mA output current 0.5 V < VO < VCC+0.5V - 35 mA supply current - 70 mA ground current 70 - mA storage temperature 65 +150 C total power dissipation DIP20 package

SO20, SSOP20, TSSOP20 and

[1]

- 750 mW

[2]

- 500 mW

DHVQFN20 packages

[1] For DIP20 package: P [2] For SO20 packages: P

For SSOP20 and TSSOP20 packages: P For DHVQFN20 packages: above 60 C, P

derates linearly with 12 mW/K above 70 C.

tot

derates linearly with 8 mW/K above 70 C.

tot

derates linearly with 5.5 mW/K above 60 C.

tot

derates linearly with 4.5 mW/K.

tot

8. Recommended operating conditions

Table 5. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

74HC244

supply voltage 2.0 5.0 6.0 V input voltage 0 - V output voltage 0 - V

t/V input transition rise and fall rate V

amb

ambient temperature 40 - +125 C

CC CC

= 2.0 V - - 625 ns/V

= 4.5 V - 1.67 139 ns/V

= 6.0 V - - 83 ns/V

V V

Product data sheet Rev. 4 — 24 September 2012 4 of 18

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Table 5. Recommended operating conditions

…continued

Symbol Parameter Conditions Min Typ Max Unit

74HCT244

t/V input transition rise and fall rate V T

amb

supply voltage 4.5 5.0 5.5 V input voltage 0 - V output voltage 0 - V

= 4.5 V - 1.67 139 ns/V

CC CC

V V

ambient temperature 40 - +125 C

9. Static characteristics

Table 6. Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

74HC244

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

LOW-level output voltage

input leakage current

OFF-state output current

supply current VI=VCCor GND; IO=0A;

input capacitance

Min Typ Max Min Max Min Max

VCC= 2.0 V 1.5 1.2 - 1.5 - 1.5 - V

= 4.5 V 3.15 2.4 - 3.15 - 3.15 - V

= 6.0 V 4.2 3.2 - 4.2 - 4.2 - V

VCC= 2.0 V - 0.8 0.5 - 0.5 - 0.5 V

= 4.5 V - 2.1 1.35 - 1.35 - 1.35 V

= 6.0 V - 2.8 1.8 - 1.8 - 1.8 V

VI=VIHor V

IO= 20 A; VCC= 2.0 V 1.9 2.0 - 1.9 - 1.9 - V

= 20 A; VCC= 4.5 V 4.4 4.5 - 4.4 - 4.4 - V

= 20 A; VCC= 6.0 V 5.9 6.0 - 5.9 - 5.9 - V

= 6.0 mA; VCC= 4.5 V 3.98 4.32 - 3.84 - 3.7 - V

= 7.8 mA; VCC= 6.0 V 5.48 5.81 - 5.34 - 5.2 - V

VI=VIHor V

IO=20A; VCC= 2.0 V - 0 0.1 - 0.1 - 0.1 V

=20A; VCC= 4.5 V - 0 0.1 - 0.1 - 0.1 V

=20A; VCC= 6.0 V - 0 0.1 - 0.1 - 0.1 V

=6.0mA; VCC= 4.5 V - 0.15 0.26 - 0.33 - 0.4 V

=7.8mA; VCC= 6.0 V - 0.16 0.26 - 0.33 - 0.4 V

VI=VCCor GND;

--0.1 - 1.0 - 1.0 A

VCC=6.0V per input pin; VI=VIHor VIL;

O=VCC

or GND;

--0.5 - 5.0 - 10 A

other inputs at VCC or GND;

=6.0V; IO=0A

- - 8.0 - 80 - 160 A

=6.0V

-3.5- - - - - pF

Product data sheet Rev. 4 — 24 September 2012 5 of 18

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Table 6. Static characteristics …continued

At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 25 C 40 C to +85 C 40 C to +125 C Unit

Min Typ Max Min Max Min Max

74HCT244

I

HIGH-level input voltage

LOW-level input voltage

HIGH-level output voltage

LOW-level output voltage

input leakage current

OFF-state output current

supply current VI=VCCor GND;

additional supply current

input capacitance

VCC= 4 .5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V

VCC= 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V

VI=VIHor VIL; VCC=4.5V

= 20 A 4.4 4.5 - 4.4 - 4.4 - V

= 6 mA 3.98 4.32 - 3.84 - 3.7 - V

VI=VIHor VIL; VCC=4.5V

=20A - 0 0.1 - 0.1 - 0.1 V

= 6.0 mA - 0.16 0.26 - 0.33 - 0.4 V

VI=VCCor GND;

=5.5V

per input pin; VI=VIHor VIL;

--0.1 - 1.0 - 1.0 A

--0.5 - 5.0 - 10 A VO=VCC or GND; other inputs at VCC or GND;

=5.5V; IO=0A

- - 8.0 - 80 - 160 A VCC=5.5V; IO=0A

per input pin; V

I=VCC

 2.1 V;

- 70 252 - 315 - 343 A other inputs at VCCor GND;

VCC= 4.5 V to 5.5 V;

=0A

-3.5- - - - - pF

10. Dynamic characteristics

Table 7. Dynamic characteristics

GND = 0 V; for load circuit see Figure 8

Symbol Parameter Conditions 25 C 40 C to +125 C Unit

74HC244

Product data sheet Rev. 4 — 24 September 2012 6 of 18

propagation delay nAn to nYn;

Min Typ Max Max

(85 C)

[1]

Max

(125 C)

see Figure 6

VCC = 2.0 V - 30 110 145 165 ns

= 4.5 V - 11 22 28 33 ns

= 5.0 V; CL=15pF - 9 - - - ns

= 6.0 V - 9 19 24 28 ns

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Table 7. Dynamic characteristics

…continued

GND = 0 V; for load circuit see Figure 8.

Symbol Parameter Conditions 25 C 40 C to +125 C Unit

Min Typ Max Max

(85 C)

enable time nOE to nYn; see Figure 7

[2]

Max

(125 C)

VCC = 2.0 V - 36 150 190 225 ns

= 4.5 V - 13 30 38 45 ns

= 6.0 V - 10 26 33 38 ns

dis

disable time nOE to nYn or see Figure 7

[3]

VCC = 2.0 V - 39 150 190 225 ns

= 4.5 V - 14 30 38 45 ns

= 6.0 V - 11 26 33 38 ns

transition time see Figure 6

[4]

VCC = 2.0 V - 14 60 75 90 ns

= 4.5 V - 5 12 15 18 ns

= 6.0 V - 4 10 13 15 ns

power dissipation

per buffer; VI=GNDtoV

[5]

-35- - -pF

capacitance

74HCT244

propagation delay nAn to nYn;

[1]

see Figure 6

VCC = 4.5 V - 13 22 28 33 ns

= 5.0 V; CL=15pF - 11 - - - ns

enable time nOE to nYn; VCC= 4.5 V; see

[2]

-153038 45ns

Figure 7

dis

disable time nOE to nYn; VCC= 4.5 V; see

[3]

-152531 38ns

Figure 7

transition time VCC = 4.5 V; see Figure 6 power dissipation

capacitance

per buffer;

=GNDtoVCC 1.5 V

[4]

- 5 12 15 18 ns

[5]

-35- - -pF

[1] tpd is the same as t

is the same as t

[2] t

[3] t

is the same as t

dis

is the same as t

[4] t

[5] C

is used to determine the dynamic power dissipation (PD in W):

P f

C V

 V

D=CPD

= input frequency in MHz; = output frequency in MHz;

= output load capacitance in pF;

= supply voltage in V;

and t

PHL PZH

PHZ

THL

 fi N+ (CL V

and t

TLH

PLH PZL

PLZ

. . .

 fo) where:

N = number of inputs switching;

 V

 (C

 fo) = sum of outputs.

Product data sheet Rev. 4 — 24 September 2012 7 of 18

NXP Semiconductors

001aae013

PLH

PHL

nYn output

nAn input

GND

TLH

THL

90 %

10 %

001aae014

PLZ

PHZ

outputs

disabled

outputs enabled

outputs

enabled

nYn output LOW-to-OFF OFF-to-LOW

nYn output

HIGH-to-OFF OFF-to-HIGH

nOE input

GND

PZL

PZH

74HC244; 74HCT244

11. Waveforms

Measurement points are given in Table 8. V

and VOH are typical voltage output levels that occur with the output load.

Fig 6. Input (nAn) to output (nYn) propagation delays and output transition times

Octal buffer/line driver; 3-state

Measurement points are given in Table 8. V

and VOH are typical voltage output levels that occur with the output load.

Fig 7. 3-state enable an d disable times

Table 8. Measurement points

Type Input Output

74HC244 0.5  V 74HCT244 1.3 V 1.3 V 0.1  V

Product data sheet Rev. 4 — 24 September 2012 8 of 18

0.5  V

0.1  V

CC CC

0.9  V

CC CC

NXP Semiconductors

10 %

90 %

0 V

negative

pulse

positive

pulse

0 V

90 %

10 %

001aad983

DUT

RLS1

open

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 8. Test circuit for measuring switching times

Table 9. Test data

Type Input Load S1 position

74HC244 V 74HCT244 3 V 6 ns 15 pF, 50 pF 1 k open GND V

Test data is given in Table 9. Definitions test circuit:

= Termination resistance should be equal to output impedance Zo of the pulse generator.

= Load capacitance including jig and probe capacitance.

= Load resistance.

S1 = Test selection switch.

tr, t

6ns 15pF, 50 pF 1k open GND V

PHL

, t

PLH

PZH

, t

PHZ

PZL

CC CC

, t

PLZ

Product data sheet Rev. 4 — 24 September 2012 9 of 18

NXP Semiconductors

UNIT

max.

1 2

cD E e M

REFERENCES

OUTLINE VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

inches

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT146-1

99-12-27 03-02-13

min.

max.

1.73

1.30

0.53

0.38

0.36

0.23

26.92

26.54

6.40

6.22

3.60

3.05

0.2542.54 7.62

8.25

7.80

10.0

8.3

24.2 0.51 3.2

0.068

0.051

0.021

0.015

0.014

0.009

1.060

1.045

0.25

0.24

0.14

0.12

0.010.1 0.3

0.32

0.31

0.39

0.33

0.0780.17 0.02 0.13

SC-603MS-001

(e )

seating plane

w M

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

(1)

(1) (1)

DIP20: plastic dual in-line package; 20 leads (300 mil)

SOT146-1

12. Package outline

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 9. Package outline SOT146-1 (DIP20)

Product data sheet Rev. 4 — 24 September 2012 10 of 18

NXP Semiconductors

UNIT

max.

A1A2A3b

(1)E(1) (1)

eHELLpQ

ywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8 0

o o

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT163-1

w M

detail X

0.25

075E04 MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0 5 10 mm

scale

v M

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

99-12-27 03-02-19

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 10. Package outline SOT163-1 (SO20)

Product data sheet Rev. 4 — 24 September 2012 11 of 18

NXP Semiconductors

UNIT A1A2A3b

(1)E(1)

eHELLpQ

(1)

Zywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

0.21

0.05

1.80

1.65

0.38

0.25

0.20

0.09

7.4

7.0

5.4

5.2

0.65

7.9

7.6

0.9

0.7

0.9

0.5

8 0

o o

0.131.25 0.2 0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

1.03

0.63

SOT339-1 MO-150

99-12-27 03-02-19

w M

detail X

v M

(A )

110

20 11

0.25

pin 1 index

0 2.5 5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

max.

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 11. Package outline SOT339-1 (SSOP20)

Product data sheet Rev. 4 — 24 September 2012 12 of 18

NXP Semiconductors

UNIT A1A2A3b

(1)E(2) (1)

eHELLpQZywv θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

6.6

6.4

4.5

4.3

0.65

6.6

6.2

0.4

0.3

0.5

0.2

8 0

o o

0.13 0.10.21

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75

0.50

SOT360-1 MO-153

99-12-27 03-02-19

w M

0.25

110

pin 1 index

detail X

(A )

v M

0 2.5 5 mm

scale

TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

max.

1.1

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 12. Package outline SOT360-1 (TSSOP20)

Product data sheet Rev. 4 — 24 September 2012 13 of 18

NXP Semiconductors

terminal 1 index area

0.51

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC JEITA

4.6

4.4

3.15

2.85

2.6

2.4

1.15

0.85

3.5

0.30

0.18

0.05

0.00

0.05 0.1

DIMENSIONS (mm are the original dimensions)

SOT764-1 MO-241 - - -- - -

0.5

0.3

0.1v0.05

0 2.5 5 mm

scale

SOT764-1

DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm

(1)

max.

detail X

terminal 1 index area

ACCB

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

(1)

02-10-17 03-01-27

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Fig 13. Package outline SOT764-1 (DHVQFN20)

Product data sheet Rev. 4 — 24 September 2012 14 of 18

NXP Semiconductors

13. Abbreviations

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Table 10. Abbreviations

Acronym Description

CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic

14. Revision history

Table 11. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74HC_HCT244 v.4 20120924 Product data sheet - 74HC_HCT244 v.3 Modifications:

74HC_HCT244 v.3 20051222 Product data sheet - 74HC_HCT244_CNV v.2 74HC_HCT244_CNV v.2 19901201 Product specification - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

Product data sheet Rev. 4 — 24 September 2012 15 of 18

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

15. Legal information

15.1 Data sheet status

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) d escribed i n this docu ment may have changed si nce this d ocument was p ublished and may dif fer in case of multiple devices. The latest product statu s

information is available on the Internet at URL http://www.nxp.com.

[1][2]

Product status

[3]

Definition

15.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to co nt ain det ailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

15.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semi conductors’ aggregat e and cumulative liabil ity towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the cust omer’s own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default , damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third part y customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell product s that is open for accept ance or the gr ant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

, unless otherwise

Product data sheet Rev. 4 — 24 September 2012 16 of 18

NXP Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It i s neit her qua lif ied nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, custome r (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, da mages or failed produ ct claims result ing from custome r design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (t ranslated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

15.4 Trademarks

Notice: All referenced brands, prod uct names, service names and trademarks are the property of their respective owners.

16. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 4 — 24 September 2012 17 of 18

NXP Semiconductors

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Functional description . . . . . . . . . . . . . . . . . . . 4

7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Recommended operating conditions. . . . . . . . 4

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5

10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6

11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17

16 Contact information. . . . . . . . . . . . . . . . . . . . . 17

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 24 September 2012

Document identifier: 74HC_HCT244

NXP 74HC244BQ, 74HC244D, 74HC244DB, 74HC244N, 74HC244PW Schematics

Specifications and Main Features

Frequently Asked Questions

User Manual

1. General description

2. Features and benefits

3. Ordering information

4. Functional diagram

5. Pinning information

5.1 Pinning

5.2 Pin description

6. Functional description

7. Limiting values

8. Recommended operating conditions

9. Static characteristics

10. Dynamic characteristics

11. Waveforms

12. Package outline

13. Abbreviations

14. Revision history

15. Legal information

15.1 Data sheet status

15.2 Definitions

15.3 Disclaimers

15.4 Trademarks

16. Contact information

17. Contents