NXP 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW Schematic [ru]

74HC1G08; 74HCT1G08

2-input AND gate

Rev. 04 — 17 July 2007 Product data sheet

1. General description

74HC1G08 and 74HCT1G08 are high-speed, Si-gate CMOS devices. They provide a
2-input AND function.

The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
The standard output currents are half those of the 74HC08 and 74HCT08.

2. Features

n Symmetrical output impedance
n High noise immunity
n Low power dissipation
n Balanced propagation delays
n SOT353-1 and SOT753 package options

3. Ordering information

Table 1. Ordering information

Type number Package

Temperature range Name Description Version

74HC1G08GW −40 °C to +125 °C TSSOP5 plastic thin shrink small outline package; 5 leads;
74HCT1G08GW
74HC1G08GV −40 °C to +125 °C SC-74A plastic surface-mounted package; 5 leads SOT753
74HCT1G08GV

body width 1.25 mm

SOT353-1

4. Marking

Table 2. Marking codes

Type number Marking

74HC1G08GW HE
74HCT1G08GW TE
74HC1G08GV H08
74HCT1G08GV T08

NXP Semiconductors

5. Functional diagram

74HC1G08; 74HCT1G08

2-input AND gate

1

B

2

A

mna113

4

Y

1
2

Fig 1. Logic symbol Fig 2. IEC logic symbol

B

Y

A

mna115

Fig 3. Logic diagram

6. Pinning information

6.1 Pinning

74HC1G08

74HCT1G08

1

BV

5

CC

&

mna114

4

2

A

3

GND Y

001aaf102

Fig 4. Pin configuration

6.2 Pin description

Table 3. Pin description

Symbol Pin Description

B 1 data input
A 2 data input
GND 3 ground (0 V)
Y 4 data output
V

CC

5 supply voltage

4

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 2 of 11

NXP Semiconductors

74HC1G08; 74HCT1G08

2-input AND gate

7. Functional description

Table 4. Function table

H = HIGH voltage level; L= LOW voltage level

Input Output
A B Y

LLL
LHL
HLL
HHH

8. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions Min Max Unit

V

CC

I

IK

I

OK

I

O

I

CC

I

GND

T

stg

P

tot

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Above 55 °C the value of P

supply voltage −0.5 +7.0 V
input clamping current VI < −0.5 V or VI>VCC+ 0.5 V - ±20 mA
output clamping current VO< −0.5 V or VO>VCC+ 0.5 V - ±20 mA
output current −0.5 V < VO <VCC+ 0.5 V - ±12.5 mA
supply current - 25 mA
ground current −25 - mA
storage temperature −65 +150 °C
total power dissipation T

derates linearly with 2.5 mW/K.

tot

= −40 °C to +125 °C

amb

[2]

- 200 mW

9. Recommended operating conditions

Table 6. Recommended operating conditions

Voltages are referenced to GND (ground = 0 V).

Symbol Parameter Conditions 74HC1G08 74HCT1G08 Unit

Min Typ Max Min Typ Max

V

CC

V

I

V

O

T

amb

∆t/∆V input transition rise

supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 V
input voltage 0 - V
output voltage 0 - V

CC
CC

0-VCCV
0-VCCV

ambient temperature −40 +25 +125 −40 +25 +125 °C

= 2.0 V - - 625 - - - ns/V

V

and fall rate

CC

= 4.5 V - - 139 - - 139 ns/V

V

CC

= 6.0 V - - 83 - - - ns/V

V

CC

[1]

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 3 of 11

NXP Semiconductors

74HC1G08; 74HCT1G08

2-input AND gate

10. Static characteristics

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T

Symbol Parameter Conditions −40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max Min Max

For type 74HC1G08

V

IH

HIGH-level input
voltage

V

IL

LOW-level input
voltage

V

OH

HIGH-level output
voltage

V

OL

LOW-level output
voltage

I

I

I

CC

C

I

input leakage current VI=VCCor GND; VCC= 6.0 V - - 1.0 - 1.0 µA
supply current VI=VCCor GND; IO=0A;

input capacitance - 1.5 - - - pF

VCC= 2.0 V 1.5 1.2 - 1.5 - V

= 4.5 V 3.15 2.4 - 3.15 - V

V

CC

= 6.0 V 4.2 3.2 - 4.2 - V

V

CC

VCC= 2.0 V - 0.8 0.5 - 0.5 V

= 4.5 V - 2.1 1.35 - 1.35 V

V

CC

= 6.0 V - 2.8 1.8 - 1.8 V

V

CC

VI= VIH or V

IL

IO= −20 µA; VCC= 2.0 V 1.9 2.0 - 1.9 - V

= −20 µA; VCC= 4.5 V 4.4 4.5 - 4.4 - V

I

O

= −20 µA; VCC= 6.0 V 5.9 6.0 - 5.9 - V

I

O

= −2.0 mA; VCC= 4.5 V 4.13 4.32 - 3.7 - V

I

O

= −2.6 mA; VCC= 6.0 V 5.63 5.81 - 5.2 - V

I

O

VI= VIH or V

IL

IO= 20 µA; VCC= 2.0 V - 0 0.1 - 0.1 V

= 20 µA; VCC= 4.5 V - 0 0.1 - 0.1 V

I

O

= 20 µA; VCC= 6.0 V - 0 0.1 - 0.1 V

I

O

= 2.0 mA; VCC= 4.5 V - 0.15 0.33 - 0.4 V

I

O

= 2.6 mA; VCC= 6.0 V - 0.16 0.33 - 0.4 V

I

O

- - 10 - 20 µA

V

= 6.0 V

CC

For type 74HCT1G08

V

IH

HIGH-level input

VCC= 4.5 V to 5.5 V 2.0 1.6 - 2.0 - V

voltage

V

IL

LOW-level input

VCC= 4.5 V to 5.5 V - 1.2 0.8 - 0.8 V

voltage

V

OH

HIGH-level output
voltage

V

OL

LOW-level output
voltage

I

I

input leakage current VI=VCCor GND; VCC= 5.5 V - - 1.0 - 1.0 µA

VI= VIH or V

IL

IO= −20 µA; VCC= 4.5 V 4.4 4.5 - 4.4 - V

= −2.0 mA; VCC= 4.5 V 4.13 4.32 - 3.7 - V

I

O

VI= VIH or V

IL

IO= 20 µA; VCC= 4.5 V - 0 0.1 - 0.1 V

= 2.0 mA; VCC= 4.5 V - 0.15 0.33 - 0.4 V

I

O

amb

=25°C.

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 4 of 11

NXP Semiconductors

74HC1G08; 74HCT1G08

2-input AND gate

Table 7. Static characteristics

Voltages are referenced to GND (ground = 0 V). All typical values are measured at T

…continued

amb

=25°C.

Symbol Parameter Conditions −40 °C to +85 °C −40 °C to +125 °C Unit

Min Typ Max Min Max

I

∆I

C

CC

CC

I

supply current VI=VCCor GND; IO=0A;

V

= 5.5 V

CC

additional supply
current

per input; VCC= 4.5 V to 5.5 V;
V

I=VCC

− 2.1 V; IO=0A

- - 10 - 20 µA

- - 500 - 850 µA

input capacitance - 1.5 - - - pF

11. Dynamic characteristics

Table 8. Dynamic characteristics

GND = 0 V; tr = t

Symbol Parameter Conditions −40 °C to +85 °C −40 °C to +125 °C Unit

For type 74HC1G08

t

pd

C

PD

For type 74HCT1G08

t

pd

C

PD

≤

6.0 ns; All typical values are measured at T

f

propagation delay A and B to Y; see Figure 5

VCC = 2.0 V; CL= 50 pF - 25 115 - 135 ns

= 4.5 V; CL=50pF - 9 23 - 27 ns

V

CC

= 5.0 V; CL=15pF - 7 - - - ns

V

CC

= 6.0 V; CL=50pF - 8 20 - 23 ns

V

CC

power dissipation

VI= GND to V

CC

capacitance

propagation delay A and B to Y; see Figure 5

VCC = 4.5 V; CL= 50 pF - 11 23 - 27 ns

= 5.0 V; CL=15pF - 11 - - - ns

V

CC

power dissipation

VI= GND to VCC− 1.5 V

capacitance

=25°C. For test circuit see Figure 6

amb

Min Typ Max Min Max

[1]

[2]

-19- - -pF

[1]

[2]

-21- - -pF

[1] tpd is the same as t
[2] CPDis used to determine the dynamic power dissipation PD(µW).

PD=CPD× V
fi= input frequency in MHz
fo= output frequency in MHz
CL= output load capacitance in pF
VCC= supply voltage in Volts
∑ (CL× V

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 5 of 11

CC

2

× fo) = sum of outputs

CC

and t

PLH

2

× fi+ ∑ (CL× V

PHL

.

2

CC

× fo) where:

NXP Semiconductors

12. Waveforms

74HC1G08; 74HCT1G08

2-input AND gate

A, B input

Y output

For 74HC1G08: VM = 0.5 × VCC; VI = GND to V

V

M

t

PHL

V

M

t

PLH

mna116

CC

For 74HCT1G08: VM = 1.3 V; VI = GND to 3.0 V

Fig 5. The input (A and B) to output (Y) propagation

delays

V

CC

PULSE

GENERATOR

V

I

R

T

DUT

V

O

Test data is given in Table 8. Definitions for test
circuit:

CL = Load capacitance including jig and probe
capacitance

RT = Termination resistance should be equal to the
output impedance Zo of the pulse generator

Fig 6. Load circuitry for switching times

C

L

mna101

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 6 of 11

NXP Semiconductors

13. Package outline

74HC1G08; 74HCT1G08

2-input AND gate

TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm

D

y

Z

5

4

13

e

e

1

w M

b

p

c

A

2

E

H

E

A

1

L

p

L

detail X

SOT353-1

A

X

v M

A

(A3)

A

θ

1.5 3 mm0

scale

DIMENSIONS (mm are the original dimensions)

A

A

UNIT

max.

mm

1.1

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

OUTLINE
VERSION

SOT353-1 MO-203 SC-88A

1

0.101.0

0.8

A2A3b

0.15

IEC JEDEC JEITA

p

0.30

0.15

ceD

0.25

0.08

REFERENCES

(1)E(1)

2.25

1.85

1.35

1.15

0.65

e

1.3

LH

1

E

2.25

2.0

L

p

0.46

0.21

PROJECTION

EUROPEAN

wyv

0.1 0.10.30.425

(1)

Z

0.60

0.15

ISSUE DATE

00-09-01
03-02-19

θ

7°
0°

Fig 7. Package outline SOT353-1 (TSSOP5)

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 7 of 11

NXP Semiconductors

74HC1G08; 74HCT1G08

2-input AND gate

Plastic surface-mounted package; 5 leads SOT753

D

y

E

H

E

AB

X

v M

A

45

Q

A

A

1

c

132

e

detail X

b

p

wBM

L

p

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

UNIT

A

1.1

mm

0.9

OUTLINE

VERSION

SOT753 SC-74A

0.100

0.013

b

cD

p

1

0.40

0.26

0.25

0.10

IEC JEDEC JEITA

3.1

2.7

E

1.7

1.3

REFERENCES

e

0.95

H

3.0

2.5

L

Qywv

p

E

0.6

0.2

0.33

0.23

0.2 0.10.2

EUROPEAN

PROJECTION

ISSUE DATE

02-04-16
06-03-16

Fig 8. Package outline SOT753 (SC-74A)

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 8 of 11

NXP Semiconductors

74HC1G08; 74HCT1G08

2-input AND gate

14. Abbreviations

Table 9. Abbreviations

Acronym Description

DUT Device Under Test
TTL Transistor-Transistor Logic

15. Revision history

Table 10. Revision history

Document ID Release date Data sheet status Change notice Supersedes

74HC_HCT1G08_4 20070717 Product data sheet - 74HC_HCT1G08_3
Modifications:

74HC_HCT1G08_3 20020517 Product specification - 74HC_HCT1G08_2
74HC_HCT1G08_2 20010302 Product specification - 74HC_HCT1G08_1
74HC_HCT1G08_1 19981110 Preliminary specification - -

• The format of this data sheet has been redesigned to comply with the new identity

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Package SOT353 changed to SOT353-1 in Table 1 and Figure 7.

• Quick Reference Data and Soldering sections removed.

• Section 2 “Features” updated.

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 9 of 11

NXP Semiconductors

16. Legal information

16.1 Data sheet status

74HC1G08; 74HCT1G08

2-input AND gate

Document status

Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] Theproduct status of device(s) described in this document may have changed sincethis document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL

[1][2]

Product status

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shallhave no liability forthe consequences of
use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet
with the same product typenumber(s) and title.A short data sheet is intended
for quick reference only and should not be relied upon to containdetailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.

Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces allinformation supplied prior
to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or

[3]

http://www.nxp.com.

Definition

malfunction of a NXP Semiconductors product canreasonably be expectedto
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.

Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum RatingsSystem of IEC 60134) may cause permanent
damage to the device.Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at

http://www.nxp.com/profile/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyanceor implication of any license under any copyrights,patents
or other industrial or intellectual property rights.

16.4 Trademarks

Notice: All referenced brands, product names, service names andtrademarks
are the property of their respective owners.

17. Contact information

For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: [e-mail]

74HC_HCT1G08_4 © NXP B.V. 2007. All rights reserved.

Product data sheet Rev. 04 — 17 July 2007 10 of 11

NXP Semiconductors

18. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1

2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1

4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

7 Functional description . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

9 Recommended operating conditions. . . . . . . . 3

10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4

11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5

12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

17 Contact information. . . . . . . . . . . . . . . . . . . . . 10

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

74HC1G08; 74HCT1G08

2-input AND gate

Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.

© NXP B.V. 2007. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]

Date of release: 17 July 2007

Document identifier: 74HC_HCT1G08_4