Nokia 9300 Service Manual 06 rae6 BB
Nokia Customer Care
6 - Baseband Description
and T roubleshooting
Issue 1 12/04 COMPANY CONFIDENTIAL
Copyright © 2004 Nokia. All Rights Reserved.
RAE-6/RA-4
6 - Baseband Description and Troubleshooting Nokia Customer Care
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Issue 1 12/04 COMPANY CONFIDENTIAL 2
Copyright © 2004 Nokia. All Rights Reserved.
RAE-6/RA-4
6 - Baseband Description and Troubleshooting Nokia Customer Care
Abbreviations ......................................................................................................7
Baseband Top-Level Description ......................................................................9
Operating conditions........................................................................................ 10
Absolute maximum ratings ............................................................................ 10
DC characteristics ..........................................................................................11
Temperature conditions ................................................................................. 11
ESD immunity ................................................................................................ 11
Functional Description of CMT........................................................................ 12
Interfaces between CMT and APE................................................................... 13
XBUS .............................................................................................................13
XABUS ...........................................................................................................13
Functional Description of APE ........................................................................14
Audio................................................................................................................ 14
Audio control signals........................................................................................ 15
Audio modes.................................................................................................... 15
HP call ............................................................................................................15
IHF call ...........................................................................................................15
Accessory call ................................................................................................ 15
APE audio ...................................................................................................... 16
Internal interfaces ............................................................................................ 16
McBSP interfaces ..........................................................................................16
MCSI interfaces .............................................................................................16
UART interfaces .............................................................................................16
µWire interface ............................................................................................... 16
I2C .................................................................................................................16
ARMIO ...........................................................................................................17
GPIO ..............................................................................................................17
External interfaces........................................................................................... 17
Back cover switch .......................................................................................... 17
Lid hall switch .................................................................................................17
MMC ..............................................................................................................17
USB ................................................................................................................17
UI interfaces..................................................................................................... 17
Displays .........................................................................................................17
Keyboards ......................................................................................................18
Bluetooth ........................................................................................................18
IrDA ................................................................................................................18
Energy Management.........................................................................................19
CMT EM........................................................................................................... 20
APE EM ........................................................................................................... 20
Battery.............................................................................................................. 21
Charging .......................................................................................................... 22
Backup battery and RTC.................................................................................. 22
Issue 1 12/04 COMPANY CONFIDENTIAL 3
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Nokia Customer Care 6 - Baseband Description and Troubleshooting
Display and keypad illumination....................................................................... 22
Power up and system states............................................................................ 22
Operating modes ...........................................................................................23
Power up sequence ....................................................................................... 23
System Connector ............................................................................................ 24
Universal Serial Bus (USB).............................................................................. 25
Accessory Control Interface (ACI) ................................................................... 25
VOUT (Accessory Voltage Regulator) ...........................................................26
HookInt............................................................................................................. 26
DC-plug ..........................................................................................................26
VCHAR pins of system connector ..................................................................26
After Sales Interface ......................................................................................... 27
User Interface .................................................................................................... 28
Component placement and FPWB outline of 1BD........................................... 29
Hinge connector............................................................................................... 30
PDA display ..................................................................................................... 31
Interface .........................................................................................................31
CMT display..................................................................................................... 33
Interface .........................................................................................................33
CMT keypad..................................................................................................... 35
Description of operation .................................................................................35
Illumination and drivers ..................................................................................35
PDA keypad..................................................................................................... 36
Hall-sensor .....................................................................................................36
Baseband Troubleshooting.............................................................................. 38
Top level flowchart........................................................................................... 39
Phone is dead troubleshooting ........................................................................ 41
IR troubleshooting............................................................................................ 42
Illumination troubleshooting ............................................................................. 43
SIM troubleshooting......................................................................................... 44
UI troubleshooting............................................................................................ 45
PDA LCD troubleshooting ..............................................................................46
CBA keys troubleshooting .............................................................................. 47
QWERTY troubleshooting ..............................................................................48
Charging troubleshooting................................................................................. 49
USB troubleshooting........................................................................................ 50
Accessory troubleshooting............................................................................... 51
MMC troubleshooting....................................................................................... 52
Audio troubleshooting...................................................................................... 53
MDOC troubleshooting .................................................................................... 55
SDRAM troubleshooting .................................................................................. 56
Flash troubleshooting....................................................................................... 57
APE clock and reset troubleshooting............................................................... 58
4 COMPANY CONFIDENTIAL Issue 1 12/04
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RAE-6/RA-4
6 - Baseband Description and Troubleshooting Nokia Customer Care
CMT troubleshooting........................................................................................ 59
EM troubleshooting (APE) ............................................................................... 60
Bluetooth troubleshooting................................................................................ 61
Issue 1 12/04 COMPANY CONFIDENTIAL 5
Copyright © 2004 Nokia. All Rights Reserved.
RAE-6/RA-4
Nokia Customer Care 6 - Baseband Description and Troubleshooting
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6 COMPANY CONFIDENTIAL Issue 1 12/04
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RAE-6/RA-4
6 - Baseband Description and Troubleshooting Nokia Customer Care
Abbreviations
ACI Accessory Interface
APE Application Processor Engine
ASIC Application Specific Integrated Circuit
ASIP Application Specific Integrated Passive
BB Baseband
BT Bluetooth (Low range radio link standard)
CCS Customer Care Solution
CMT Cellular Mobile Telephone
COG Chip on Glass
CSR Cambridge Silicon Radio
DAC Digital to Analog Converter
DC/DC Switched mode power supply
DCT4.x Digital Core Technology, fourth.x generation
DSP Digital Signal Processing
EEPROM Electrically Erasable Programmable Read Only Memory
EM Energy Management
EMC Electro Magnetic Compatibility
EMIFF External Memory Interface Fast
EMIFS External Memory Interface Slow
ESD Electro Static Discharge
FBUS Serial bus
FPWB Flex Printed Wiring Board
FM Frequency Modulation
GSM G lobal System for Mobile communications
HSCSD High Speed Circuit Switched Data
HW Hardware
IC Integrated Circuit
IMEI International Mobile Equipment Identity
IO Input / Output
Issue 1 12/04 COMPANY CONFIDENTIAL 7
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Nokia Customer Care 6 - Baseband Description and Troubleshooting
LDO Low Drop Out
LoSSI Low Speed Screen Interface
MBUS Serial bus
MCU MicroController Unit
MMC Multi-Media Card
MCBSP1 Multi-channel Buffer Serial Port
NAND Flash memory cell type
OMAP Open Multimedia Architecture Platform
OSP Organic Solderable Preservative
PA Power Amplifier
PWB Printed Wiring Board (same than PCB)
RF Radio Frequency
RTC Real Time Clock
SDRAM Synchronous Dynamic Random Access Memory
SPI Serial Perpheral Interface
SPR Standard Product Requirements
SW SoftWare
UART Universal Asynchronous Receiver Transmitter
UEMEK Universal Energy Management ASIC (DCT4 EM asic)
UI User Interface
UPP Universal Phone Processor ASIC (DCT4 processor asic)
USB Universal Serial Bus
ViSSI Video Streaming Screen Interface
8 COMPANY CONFIDENTIAL Issue 1 12/04
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6 - Baseband Description and Troubleshooting Nokia Customer Care
Baseband Top-Level Description
RAE-6/RA-4 HW architecture consists of:
• Two colour displays
• QWERTY keyboard
• Cover keyboard
• Engine PWB
There are three PWBs: main engine board, QWERTY flex and UI flex. Both displays and the
cover keyboard are connected to the engine via the UI flex. The QWERTY keyboard is connected to the engine through a QWERTY controller.
RAE-6/RA-4 engine PWB architecture consists of four main building blocks:
• Application Processor Engine (APE)
• Cellular Mobile Telephone (CMT)
•CMT RF
The APE part is constructed using OMAP1510 processor with external SDRAM and NAND
based flash memory as the core. Other major parts for APE are power supplies, UI interfaces,
audio support and Bluetooth.
APE and CMT parts are connected together by serial communication buses and by a few control lines. The APE part reset and power control comes from the CMT side. Audio control is
mostly on the APE side. APE and CMT operate with no clear master-slave nomination.
The diagram below shows a high level block diagram of RAE-6/RA-4.
Issue 1 12/04 COMPANY CONFIDENTIAL 9
Copyright © 2004 Nokia. All Rights Reserved.
RAE-6/RA-4
Nokia Customer Care 6 - Baseband Description and Troubleshooting
Figure 1:Simplified RAE-6/RA-4 block diagram
CMT
RF
VBAT
Battery
UEMEK
BB
Regulators
CODEC
SIM I/F
StUF (Stacked UPP + Flash
ARM7
Lead3
Flash
64Mb
LPRFUART
DSPSIO
Bluetooth
Hands-free In
Hands-free Out
SIM
NAND
64/128MB
SDRAM
64MB
Enable
NAND/
NOR IF
Adapter
DAC
APE
REGULATORS
I2C
McBSP1
GPIO I/F
UART2
McBSP2
MCSI2
McBSP3
MCSI
1
Flash I/F
SDRAM I/F
PA
IHF
OMAP1510
ARM925T
LEAD3ph3
LCD I/F CLKM
Camera
USB
UART3 /
PWT/PWL
UART1
SD-MMC
uWire
ARMI
O
Keyboar
d
Bottom Connector
MIC
ACI
OUTL
OUTR
USB
IrDA
MMC
CBA keys
Backlights Keylights
Cover
keys &
PDA display
Lid Flex
display
CMT
PWRkey
12MHz
Back cover
Switch
ARMIO
■ Operating conditions
Absolute maximum ratings
Table 1: Absolute maximum ratings
Signal Note
Battery Vo ltage (Idle) -0.3V - 5.5V
Battery Vo ltage (Call) Max 4.8V
Charger Input Voltage -0.3V - 16V
Battery voltage maximum values are specified during active charging.
UEM control
QWERTY Flex
I2C
COP8
HALL
QWERTY
10 COMPANY CONFIDENTIAL Issue 1 12/04
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DC characteristics
Table 2: Battery voltage range
Signal Min Nom Max Note
VBAT 3.1V 3.6V 4.2V (charging high limit voltage) 3.4V SW RF cut off
Battery maximum voltage is specified when charging switch is disconnected after/between
charging pulses.
Temperature conditions
Full functionality is achieved in the ambient temperature range -15 oC to +55 oC. Reduced functionality between -25
The required storage temperature is -40
o
C to -10 oC and +55 oC to +70 oC.
o
C to +85 oC.
ESD immunity
SPR limits are 8kV for galvanic contact and 15kV for air discharge with normal and reversed
polarity.
Issue 1 12/04 COMPANY CONFIDENTIAL 11
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Nokia Customer Care 6 - Baseband Description and Troubleshooting
Functional Description of CMT
The CMT architecture of RAE-6/RA-4 is based on DCT4 Common Baseband. The main functionality of the CMT baseband is implemented into two ASICs: UPP (Universal Phone Processor) and UEMEK (Universal Energy Management).
32Mbit NOR flash is used to store the program code. For a simplified block diagram of the RAE6/RA-4 CMT baseband, see Figure 2, “Simplified CMT baseband block diagram” on page 13.
System clock for the CMT is derived from the RF circuits. For GSM it is 26 MHz. The low frequency sleep clock is generated in the UEMEK using an external 32.768 kHz crystal. The I/O
voltage of the CMT baseband is 1.8V and the analog parts are powered from 2.8V power rails.
The core voltage of UPP can be altered with SW depending on the prevailing processing power
requirements.
UEMEK is a dual voltage circuit. The digital parts are running from the baseband supply (1.8V)
and the analog parts are running from the analog supply (2.8V). Some blocks of UEMEK are
also connected directly to the battery voltage (VBAT). UEMEK includes 6 linear LDO (low dropout) regulator for the baseband and 7 regulators for the RF. It also includes 4 current sources
for biasing purposes and internal usage.
Some parts of the SIM interface have been integrated into UEMEK. The SIM interface supports
only 1.8V and 3V SIM cards. Data transmission between the UEMEK and UPP is handled via
two serial buses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM
coded audio. Digital speech processing is handled by the DSP inside UPP and the audio codec
is in UEMEK.
The analog interface between the baseband and the RF sections has been implemented into
UEMEK. UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and
transmit signal paths and supplies the analog TXC and AFC signals to RF section under the
UPP DSP control. The digital RF-BB interface, consisting of a dedicated RFIC control bus and
a group of GenIO pins, is located in the UPP.
The baseband side supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is performed in the UEMEK according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are
generated and encoded by the UPP and transmitted to UEMEK for decoding.
RAE-6/RA-4 has two galvanic serial control interfaces for CMT: FBUS and MBUS.
Communication between the APE and CMT parts is handled through 2 serial buses: XBUS and
XABUS. XBUS is the main communication channel for general use, and XABUS is intended
mainly for audio data transfer. Also the system reset (PURX) and SleepClk for APE are taken
from the CMT side. The PURX is delayed approximately 130ms to fulfil OMAP1510 reset timing
requirements. External level shifter, D4801, is used for 32 kHz SleepClk level shifting to APE.
12 COMPANY CONFIDENTIAL Issue 1 12/04
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6 - Baseband Description and Troubleshooting Nokia Customer Care
Figure 2:Simplified CMT baseband block diagram
RF-BB
IF
XBUS
RFConv
Control
Control
RFClk
RFIC
RF
Stacked UPP +
CMT - APE interface
XABUS
PUR delay
StUF
Flash
64Mb
Flash
+ lvl shift
PURX SleepClk
RFConvIF
Internal SIM IF
Audio IF
MBUS
FBUS
DBUS
CBUS
SleepClk
32kHz lvl
shift
MIC+ACI
Prod/AS
Test IF
FBUS
MBUS
UEMK
UEMEK
Zocus
XEAR
L+R
Audio
Audio
DAC
DAC
Audio
AMP
32kH
z
CHRG
current
sense
L+R
1.8V/3V
PWR on key
SIM
EAR
MIC
BATT. IF CHRG. IF
Control
from APE
System Connector
IHF
■ Interfaces between CMT and APE
XBUS
XBUS is the main communication interface between the CMT and APE parts of RAE-6/RA-4.
This 6-pin interface is implemented using UART2 of OMAP1510 (APE), LPRFUART of UPP
(CMT) and 2 general purpose I/O pins from both ASICs.
XABUS
XABUS is a synchronous serial interface which is used for uncompressed PCM audio data
transfer between the DSPs of UPP (CMT) and OMAP1510 (APE). This interface utilises the
DSPSIO of UPP and the MCSI_2 of OMAP1510. In addition to these one UPP GenIO and two
dedicated pins of OMAP1510 are needed for XABUS clock generation and control.
Issue 1 12/04 COMPANY CONFIDENTIAL 13
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Nokia Customer Care 6 - Baseband Description and Troubleshooting
Functional Description of APE
APE term includes not only the processor itself but also the peripherals around it, clocking, resetting and power management for these parts.
APE is based around OMAP1510 (Open Multimedia Application Platform) processor. Peripherals attached to OMAP1510 include:
• Audio DAC
• Bluetooth
• Cover display
•PDA display
• Memory card
•IrDA
• Cover keypad & command buttons
• QWERTY controller
• External SDRAM
• Flash memories
APE acts as a system slave compared to the CMT side. CMT holds the master reset and power
management logic. APE and CMT are connected through a serial link called XBUS.
■ Audio
Figure 3:RAE-6/RA-4 Audio architecture
DSP_SIO
XABUS
4
PCM
CSR
BT
XBUS
BT
control
UPP
UART2
UART2
MCSI2
MCSI1
UART1
1
1
Ringtones
Streaming
engine
OMAP1510
MP3 decoder
Entertainment
effects
D
D
A
McBSP1
I2CI/F
McBSP2
A
UEM
L
P
L
P
Stereo or mono
digital audi o
MIC1
MIC2
MIC3
EARP/EARN
HF/HFCM
XEAR
I2S, Digital Audio;
4
I2C
Control
2
2
Mic_In
TLV320AIC23B
R_Line_In
L_Line_In
R_HP_Out
L_HP_Out
R_Out
~10dB
Attenuator
L_Out
McBSP Contro l , S PI Mode;
3
2
IHFIn
Phone HS
1
RIn
Lin
1
LM4855
IHFOut
ROut
LOut
2
2
Tomahawk
As RAE-6/RA-4 is based on a dual-processor architecture, audios are also divided into APE
and CMT parts. Audio control is mostly on the APE side. Phone audio is routed from the CMT
side to APE in analog form. On the CMT side, audio HW is integrated into the UEMEK ASIC.
On the APE side, the most important parts are OMAP1510, audio DAC and audio power amplifier.
14 COMPANY CONFIDENTIAL Issue 1 12/04
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6 - Baseband Description and Troubleshooting Nokia Customer Care
The stereo output of this amplifier is designed for use with the ext ended Pop-portTM connector.
It also has a differential mono output for driving the handsfree speaker.
The battery voltage (VBAT) is used directly as a supply voltage for the audio amplifier.
The type of DAC used is TLV320AIC23B and the supply voltage for this is coming from V28.
■ Audio control signals
Audio DAC is controlled via I2C bus by OMAP1510. Digital audio data from OMAP1510 to DAC
is coming via MCBSP1.
The audio amplifier is controlled through a 3-wire SPI bus (MCBSP2 of OMAP1510). Audio
mode of the amplifier and gain values are controlled via SPI bus.
The HEADINT signal is needed for recognising the external device (e.g. headset) connected
to system. The recognition is based on the ACI-pin of the system connector, which is shorted
to ground inside the external device.
The button of the external device generates HOOKINT interrupt and is used to answer or end
a phone call.
■ Audio modes
HP call
The basic audio mode is the hand portable mode. This is entere d whe n no audio accessories
are connected and handsfree mode is not selected by opening the cover.
The call is created by CMT. The internal earpiece is driven by the CMT engine for voice calls.
The internal microphone is driven by the CMT for voice calls and voice recording. The internal
microphone is enabled and uses the MICB1 bias voltage from UEMEK.
IHF call
This mode can be entered by user selection (opening the cover).
The call is created by CMT. The internal microphone is driven by the CMT for voice calls and
voice recording. The internal microphone is enabled and uses the MICB1 bias voltage from
UEMEK as in HP mode.
XEAR output of UEMEK is used to drive mono output signal is connected to the APE Audio
DAC. Signal is then routed to the Phone_In_IHF input of the LM4855 audio power amplifier.
This drives the internal speaker via the SPKRout driver.
Accessory call
This mode is used when accessory is connected to the system connector.
The call is created by CMT. The uplink signal is generated by external microphone and trans-
ferred to UEMEK MIC2 input (via XMIC signals from Pop-port
TM
connector). Hence the MIC2B
bias voltage and MIC2P/N inputs are enabled on UEMEK.
As in IHF call down link audio signal is routed through the single ended XEAR output driver in
UEMEK. The mono XEAR output is connected to the DAC and then signal is routed to the L
and RIN inputs of the LM4855. Accessories are driven via Pop-portTM connector using the L
IN
OUT
driver of LM4855 audio power amplifier.
Issue 1 12/04 COMPANY CONFIDENTIAL 15
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RAE-6/RA-4
Nokia Customer Care 6 - Baseband Description and Troubleshooting
APE audio
This mode is entered when user starts the multimedia application (e.g. MP3, AAC etc.), which
is played via IHF speaker or Pop-port
Audio data from MMC is sent by OMAP1510 to the external audio DAC through the I
TM
accessories.
2
S con-
nection. The DAC performs the digital to analog audio conversion.
For playback via the internal speaker signal from DAC is routed to Phone_in_IHF input on
LM4855 audio power amplifier.
For playback via the stereo/ mono headset or other Pop-port
is routed to the L
/RIN inputs of the LM4855 audio power amplifier. In case of mono accessory
IN
TM
accessories signal from DAC
OMAP1510 will produce monophonic signal to DAC.
■ Internal interfaces
In practice, all APE internal interfaces consist of interfaces connected from OMAP1510 to peripheral devices. All UI related interfaces, memory interfaces, USB and MMC are covered in
separate sections of this document.
McBSP interfaces
OMAP1510 can support maximum of three independent Multi-channel Buffer Serial Ports
(McBSPs) interfaces. However, these ports are slightly different and particularly suitable for different purposes. McBSP1 supports I2S protocol and is connected to external audio codec.
McBSP#2 and #3 can be used as general purpose SPI interface supporting bit rates up to
5Mbits/s. McBSP2 is used to control the audio PA. McBSP3 clock output is used as audio codec master clock. Other McBSP3 signals cannot be used because they are multiplexed with
µWire signals.
MCSI interfaces
The MCSI is a serial interface with multi-channels transmission capability. MCSI1 is used to
interface with Bluetooth and MCSI2 is used as XABUS (DSP-DSP bus between CMT and APE)
UART interfaces
OMAP1510 has three UART interfaces capable of 1.5Mbit/s data rates. UART1 is used as
Bluetooth control interface, UART2 is used as XBUS (MCU-MCU bus between CMT and APE),
UART3 includes 115.2 kbit/s IrDA modulation support, and is used to communicate with external IrDA device.
µWire interface
The µWire interface is a standard serial synchronous bus protocol with two chip select lines.
Interface is used as PDA LCD control bus (CS3) and as a unidirectional data bus for the Cover
display (CS0).
I2C
The I2C is a half-duplex serial port using two lines, data and clock, for data communications
with software addressable external devices. I
controller COP8 is also connected to APE via I
2
C is used as audio codec. External keyboard
2
C.
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ARMIO
ARMIO provides 5 ARM processor controllable GPIOs by default, and 5 more are available with
different multiplexing scheme. ARMIOs also include a keyboard interface. The GPIOs consists
programmable debouncing circuit but can be accessed directly only by the ARM processor.
Both ARMIOs and keyboard interface signals can wake-up OMAP1510 from deep sleep and
big sleep states.
GPIO
14 General Purpose Input/ Output External pins are multiplexed between ARM/DSP. Multiplex
logic is programmed and controlled by ARM and supports pin-by-pin configuration.
■ External interfaces
Back cover switch
A switch is used for back cover removal detection. A rib is attached to the back cover. A sensor
gives a warning to prevent data loss or corruption when writing to the MMC card.
Lid hall switch
A hall switch is used to detect the lid position. The switch is located on QWERTY flex and is
connected to COP8 controller. The magnet is in the lid.
MMC
The MMC Interface in OMAP1510 is fully compliant with the MultiMediaCard system specification version 3.1. RAE-6/RA-4 MMC interface voltage is 3 V.
USB
The OMAP1510 USB Controller is a Full Speed Device (12 Mb/s) fully compliant with the Universal Serial Bus specification Revision 2.0. The USB Client (a mobile terminal) is connected
to the USB Host (a PC) through the system connector.
■ UI interfaces
Displays
S80 display interface
S80 display utilizes the 16-bit synchronous LCD interface of OMAP1510, and µWire for control
data.
Cover display interface
RAE-6/RA-4 has a separate small 64k colours display connected to OMAP1510 via µWire interface. There is an unidirectional level shifter between OMAP and the display, so no data can
be read from the display.
Issue 1 12/04 COMPANY CONFIDENTIAL 17
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RAE-6/RA-4
Nokia Customer Care 6 - Baseband Description and Troubleshooting
Figure 4:Display interfaces
OMAP1510
DOUT
µ
U
DIN
W
w
I
i
Cs0
r
r
e
CLK
e
RST
Cs3
RST
Vid e o
data
Level
Shifte rs
CMT Disp la y
Da ta
L
CS
Clock
Re se t
PDA Disp la y
Din
Dou t
Clk
CS
Re s e t
Vid e o
data
O
S
S
i
Keyboards
Cover keyboard and command buttons
The cover keyboard and the four command buttons are directly connected to the OMAP1510
keyboard matrix.
QWERTY
An external keyboard controller is used for the QWERTY keyboard. COP8 is connected via I2C
bus to OMAP1510 with an additional interrupt line to OMAP1510.
Power button
The power button is connected directly to UEMEK in the DCT4 engine. See Chapte r Power up
and system states for further details on the power button operation.
Bluetooth
A single chip Bluetooth solution, BC02, is used in RAE-6/RA-4. The chip contains radio and
baseband parts as well as MCU and on-chip ROM memory. Together with some external components (filter, balun etc.) and the antenna, it forms the Bluetooth system, which is attached to
the host (OMAP1510). Bluetooth components are mounted directly to the PWB.
IrDA
RAE-6/RA-4 design includes a small (height 2.2 mm) metal shielded module. The modules use
speeds up to 115.2kbps.
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Energy Management
Energy Management covers both CMT and APE sides. Battery and charging functions are integrated into CMT Universal Energy Management (UEMEK) ASIC. UEMEK includes also all
needed regulators for CMT BB and RF. APE side has its own discrete power supplies.
Figure 5:Power distribution diagram
Measurement resistor
LM3820
UEMEK
VR1..7
VSIM
VANA
VFLASH1
VAUX2
VCORE
VIO
LP3981-2.8
2.8V
LM2708-1.57
1.57V SMPS
LP2985-1.8
1.8V
V18
V28
V15
BATTERY
RF
PA
Various
7
SIM
StUF
CORE
I/O
CMT FLASH
VCC
I/O
AUDIO PA
PopPort
Vout
Vbus
LP2985-3.3
3.3V
GPIO3
OMAP1510
I/O (2.8V) USB
I/O (1.8V)
CORE
V3
3
NAND FLASH
BT
CORE
I/O
AUDIO
DAC
CORE+I/O
SDRAM
I/O
CORE
LP3985-3.0
3.0V
GPIO15
TK11851L
CallLED1
Battery line
Power line
Control signal
Measurement signal
VMMC
Switch
Dlight
QWERTY
I/O + CORE
Switch
Klight
MMC
S80
VDDI
VDD
Backlight
CMT display
keypad
VDDI
VDD
Backlight
Issue 1 12/04 COMPANY CONFIDENTIAL 19
Copyright © 2004 Nokia. All Rights Reserved.