Nokia 9300 Service Manual 06 rae6 BB

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Page 1

Nokia Customer Care

6 - Baseband Description

and T roubleshooting

Issue 1 12/04 COMPANY CONFIDENTIAL

Page 2

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

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Issue 1 12/04 COMPANY CONFIDENTIAL 2

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

Abbreviations ......................................................................................................7

Baseband Top-Level Description ......................................................................9

Operating conditions........................................................................................ 10

Absolute maximum ratings ............................................................................ 10

DC characteristics ..........................................................................................11

Temperature conditions ................................................................................. 11

ESD immunity ................................................................................................ 11

Functional Description of CMT........................................................................ 12

Interfaces between CMT and APE................................................................... 13

XBUS .............................................................................................................13

XABUS ...........................................................................................................13

Functional Description of APE ........................................................................14

Audio................................................................................................................ 14

Audio control signals........................................................................................ 15

Audio modes.................................................................................................... 15

HP call ............................................................................................................15

IHF call ...........................................................................................................15

Accessory call ................................................................................................ 15

APE audio ...................................................................................................... 16

Internal interfaces ............................................................................................ 16

McBSP interfaces ..........................................................................................16

MCSI interfaces .............................................................................................16

UART interfaces .............................................................................................16

µWire interface ............................................................................................... 16

I2C .................................................................................................................16

ARMIO ...........................................................................................................17

GPIO ..............................................................................................................17

External interfaces........................................................................................... 17

Back cover switch .......................................................................................... 17

Lid hall switch .................................................................................................17

MMC ..............................................................................................................17

USB ................................................................................................................17

UI interfaces..................................................................................................... 17

Displays .........................................................................................................17

Keyboards ......................................................................................................18

Bluetooth ........................................................................................................18

IrDA ................................................................................................................18

Energy Management.........................................................................................19

CMT EM........................................................................................................... 20

APE EM ........................................................................................................... 20

Battery.............................................................................................................. 21

Charging .......................................................................................................... 22

Backup battery and RTC.................................................................................. 22

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Display and keypad illumination....................................................................... 22

Power up and system states............................................................................ 22

Operating modes ...........................................................................................23

Power up sequence ....................................................................................... 23

System Connector ............................................................................................ 24

Universal Serial Bus (USB).............................................................................. 25

Accessory Control Interface (ACI) ................................................................... 25

VOUT (Accessory Voltage Regulator) ...........................................................26

HookInt............................................................................................................. 26

DC-plug ..........................................................................................................26

VCHAR pins of system connector ..................................................................26

After Sales Interface ......................................................................................... 27

User Interface .................................................................................................... 28

Component placement and FPWB outline of 1BD........................................... 29

Hinge connector............................................................................................... 30

PDA display ..................................................................................................... 31

Interface .........................................................................................................31

CMT display..................................................................................................... 33

Interface .........................................................................................................33

CMT keypad..................................................................................................... 35

Description of operation .................................................................................35

Illumination and drivers ..................................................................................35

PDA keypad..................................................................................................... 36

Hall-sensor .....................................................................................................36

Baseband Troubleshooting.............................................................................. 38

Top level flowchart........................................................................................... 39

Phone is dead troubleshooting ........................................................................ 41

IR troubleshooting............................................................................................ 42

Illumination troubleshooting ............................................................................. 43

SIM troubleshooting......................................................................................... 44

UI troubleshooting............................................................................................ 45

PDA LCD troubleshooting ..............................................................................46

CBA keys troubleshooting .............................................................................. 47

QWERTY troubleshooting ..............................................................................48

Charging troubleshooting................................................................................. 49

USB troubleshooting........................................................................................ 50

Accessory troubleshooting............................................................................... 51

MMC troubleshooting....................................................................................... 52

Audio troubleshooting...................................................................................... 53

MDOC troubleshooting .................................................................................... 55

SDRAM troubleshooting .................................................................................. 56

Flash troubleshooting....................................................................................... 57

APE clock and reset troubleshooting............................................................... 58

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

CMT troubleshooting........................................................................................ 59

EM troubleshooting (APE) ............................................................................... 60

Bluetooth troubleshooting................................................................................ 61

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

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Abbreviations

ACI Accessory Interface APE Application Processor Engine ASIC Application Specific Integrated Circuit ASIP Application Specific Integrated Passive BB Baseband BT Bluetooth (Low range radio link standard) CCS Customer Care Solution CMT Cellular Mobile Telephone COG Chip on Glass CSR Cambridge Silicon Radio DAC Digital to Analog Converter DC/DC Switched mode power supply DCT4.x Digital Core Technology, fourth.x generation DSP Digital Signal Processing EEPROM Electrically Erasable Programmable Read Only Memory EM Energy Management EMC Electro Magnetic Compatibility EMIFF External Memory Interface Fast EMIFS External Memory Interface Slow ESD Electro Static Discharge FBUS Serial bus FPWB Flex Printed Wiring Board FM Frequency Modulation GSM G lobal System for Mobile communications HSCSD High Speed Circuit Switched Data HW Hardware IC Integrated Circuit IMEI International Mobile Equipment Identity IO Input / Output

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LDO Low Drop Out LoSSI Low Speed Screen Interface MBUS Serial bus MCU MicroController Unit MMC Multi-Media Card MCBSP1 Multi-channel Buffer Serial Port NAND Flash memory cell type OMAP Open Multimedia Architecture Platform OSP Organic Solderable Preservative PA Power Amplifier PWB Printed Wiring Board (same than PCB) RF Radio Frequency RTC Real Time Clock SDRAM Synchronous Dynamic Random Access Memory SPI Serial Perpheral Interface SPR Standard Product Requirements SW SoftWare UART Universal Asynchronous Receiver Transmitter UEMEK Universal Energy Management ASIC (DCT4 EM asic) UI User Interface UPP Universal Phone Processor ASIC (DCT4 processor asic) USB Universal Serial Bus ViSSI Video Streaming Screen Interface

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Baseband Top-Level Description

RAE-6/RA-4 HW architecture consists of:

• Two colour displays

• QWERTY keyboard

• Cover keyboard

• Engine PWB

There are three PWBs: main engine board, QWERTY flex and UI flex. Both displays and the cover keyboard are connected to the engine via the UI flex. The QWERTY keyboard is connected to the engine through a QWERTY controller.

RAE-6/RA-4 engine PWB architecture consists of four main building blocks:

• Application Processor Engine (APE)

• Cellular Mobile Telephone (CMT)

•CMT RF

The APE part is constructed using OMAP1510 processor with external SDRAM and NAND based flash memory as the core. Other major parts for APE are power supplies, UI interfaces, audio support and Bluetooth.

APE and CMT parts are connected together by serial communication buses and by a few control lines. The APE part reset and power control comes from the CMT side. Audio control is mostly on the APE side. APE and CMT operate with no clear master-slave nomination.

The diagram below shows a high level block diagram of RAE-6/RA-4.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Figure 1:Simplified RAE-6/RA-4 block diagram

CMT

VBAT

Battery

UEMEK

Regulators

CODEC

SIM I/F

StUF (Stacked UPP + Flash

ARM7

Lead3

Flash 64Mb

LPRFUART

DSPSIO

Bluetooth

Hands-free In

Hands-free Out

SIM

NAND

64/128MB

SDRAM

64MB

Enable

NAND/ NOR IF

Adapter

DAC

APE

REGULATORS

I2C

McBSP1

GPIO I/F

UART2

McBSP2

MCSI2

McBSP3

MCSI

Flash I/F

SDRAM I/F

IHF

OMAP1510

ARM925T

LEAD3ph3

LCD I/F CLKM

Camera

USB

UART3 /

PWT/PWL

UART1

SD-MMC

uWire

ARMI

Keyboar

Bottom Connector

MIC ACI

OUTL

OUTR USB

IrDA

MMC

CBA keys

Backlights Keylights

Cover

keys &

PDA display

Lid Flex

display

CMT

PWRkey

12MHz

Back cover

Switch

ARMIO

■ Operating conditions

Absolute maximum ratings

Table 1: Absolute maximum ratings

Signal Note

Battery Vo ltage (Idle) -0.3V - 5.5V Battery Vo ltage (Call) Max 4.8V Charger Input Voltage -0.3V - 16V

Battery voltage maximum values are specified during active charging.

UEM control

QWERTY Flex

I2C

COP8

HALL

QWERTY

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DC characteristics

Table 2: Battery voltage range

Signal Min Nom Max Note

VBAT 3.1V 3.6V 4.2V (charging high limit voltage) 3.4V SW RF cut off

Battery maximum voltage is specified when charging switch is disconnected after/between charging pulses.

Temperature conditions

Full functionality is achieved in the ambient temperature range -15 oC to +55 oC. Reduced functionality between -25

The required storage temperature is -40

C to -10 oC and +55 oC to +70 oC.

C to +85 oC.

ESD immunity

SPR limits are 8kV for galvanic contact and 15kV for air discharge with normal and reversed polarity.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Functional Description of CMT

The CMT architecture of RAE-6/RA-4 is based on DCT4 Common Baseband. The main functionality of the CMT baseband is implemented into two ASICs: UPP (Universal Phone Processor) and UEMEK (Universal Energy Management).

32Mbit NOR flash is used to store the program code. For a simplified block diagram of the RAE6/RA-4 CMT baseband, see Figure 2, “Simplified CMT baseband block diagram” on page 13.

System clock for the CMT is derived from the RF circuits. For GSM it is 26 MHz. The low frequency sleep clock is generated in the UEMEK using an external 32.768 kHz crystal. The I/O voltage of the CMT baseband is 1.8V and the analog parts are powered from 2.8V power rails. The core voltage of UPP can be altered with SW depending on the prevailing processing power requirements.

UEMEK is a dual voltage circuit. The digital parts are running from the baseband supply (1.8V) and the analog parts are running from the analog supply (2.8V). Some blocks of UEMEK are also connected directly to the battery voltage (VBAT). UEMEK includes 6 linear LDO (low dropout) regulator for the baseband and 7 regulators for the RF. It also includes 4 current sources for biasing purposes and internal usage.

Some parts of the SIM interface have been integrated into UEMEK. The SIM interface supports only 1.8V and 3V SIM cards. Data transmission between the UEMEK and UPP is handled via two serial buses: DBUS for DSP and CBUS for MCU. There are also separate signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP and the audio codec is in UEMEK.

The analog interface between the baseband and the RF sections has been implemented into UEMEK. UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and transmit signal paths and supplies the analog TXC and AFC signals to RF section under the UPP DSP control. The digital RF-BB interface, consisting of a dedicated RFIC control bus and a group of GenIO pins, is located in the UPP.

The baseband side supports both internal and external microphone inputs and speaker outputs. Input and output signal source selection and gain control is performed in the UEMEK according to control messages from the UPP. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP and transmitted to UEMEK for decoding.

RAE-6/RA-4 has two galvanic serial control interfaces for CMT: FBUS and MBUS. Communication between the APE and CMT parts is handled through 2 serial buses: XBUS and

XABUS. XBUS is the main communication channel for general use, and XABUS is intended mainly for audio data transfer. Also the system reset (PURX) and SleepClk for APE are taken from the CMT side. The PURX is delayed approximately 130ms to fulfil OMAP1510 reset timing requirements. External level shifter, D4801, is used for 32 kHz SleepClk level shifting to APE.

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Figure 2:Simplified CMT baseband block diagram

RF-BB

XBUS

RFConv

Control

RFClk

RFIC

Stacked UPP +

CMT - APE interface

XABUS

PUR delay

StUF

Flash

64Mb Flash

+ lvl shift

PURX SleepClk

RFConvIF

Internal SIM IF

Audio IF

MBUS

FBUS

DBUS

CBUS

SleepClk 32kHz lvl

shift

MIC+ACI

Prod/AS

Test IF

FBUS

MBUS

UEMK

UEMEK

Zocus

XEAR

L+R

Audio

DAC

Audio

AMP

32kH

CHRG current sense

L+R

1.8V/3V

PWR on key

SIM

EAR

MIC

BATT. IF CHRG. IF

Control

from APE

System Connector

IHF

■ Interfaces between CMT and APE

XBUS

XBUS is the main communication interface between the CMT and APE parts of RAE-6/RA-4. This 6-pin interface is implemented using UART2 of OMAP1510 (APE), LPRFUART of UPP (CMT) and 2 general purpose I/O pins from both ASICs.

XABUS

XABUS is a synchronous serial interface which is used for uncompressed PCM audio data transfer between the DSPs of UPP (CMT) and OMAP1510 (APE). This interface utilises the DSPSIO of UPP and the MCSI_2 of OMAP1510. In addition to these one UPP GenIO and two dedicated pins of OMAP1510 are needed for XABUS clock generation and control.

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Functional Description of APE

APE term includes not only the processor itself but also the peripherals around it, clocking, resetting and power management for these parts.

APE is based around OMAP1510 (Open Multimedia Application Platform) processor. Peripherals attached to OMAP1510 include:

• Audio DAC

• Bluetooth

• Cover display

•PDA display

• Memory card

•IrDA

• Cover keypad & command buttons

• QWERTY controller

• External SDRAM

• Flash memories

APE acts as a system slave compared to the CMT side. CMT holds the master reset and power management logic. APE and CMT are connected through a serial link called XBUS.

■ Audio

Figure 3:RAE-6/RA-4 Audio architecture

DSP_SIO

XABUS

PCM

CSR

XBUS

control

UPP

UART2

MCSI2

MCSI1

UART1

Ringtones

Streaming

engine

OMAP1510

MP3 decoder

Entertainment

effects

McBSP1

I2CI/F

McBSP2

UEM

L P

Stereo or mono

digital audi o

MIC1 MIC2 MIC3

EARP/EARN

HF/HFCM

XEAR

I2S, Digital Audio;

I2C

Control

Mic_In

TLV320AIC23B

R_Line_In

L_Line_In

R_HP_Out

L_HP_Out

R_Out

~10dB

Attenuator

L_Out

McBSP Contro l , S PI Mode;

IHFIn

Phone HS

RIn

Lin

LM4855

IHFOut

ROut

LOut

Tomahawk

As RAE-6/RA-4 is based on a dual-processor architecture, audios are also divided into APE and CMT parts. Audio control is mostly on the APE side. Phone audio is routed from the CMT side to APE in analog form. On the CMT side, audio HW is integrated into the UEMEK ASIC. On the APE side, the most important parts are OMAP1510, audio DAC and audio power amplifier.

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The stereo output of this amplifier is designed for use with the ext ended Pop-portTM connector. It also has a differential mono output for driving the handsfree speaker.

The battery voltage (VBAT) is used directly as a supply voltage for the audio amplifier. The type of DAC used is TLV320AIC23B and the supply voltage for this is coming from V28.

■ Audio control signals

Audio DAC is controlled via I2C bus by OMAP1510. Digital audio data from OMAP1510 to DAC is coming via MCBSP1.

The audio amplifier is controlled through a 3-wire SPI bus (MCBSP2 of OMAP1510). Audio mode of the amplifier and gain values are controlled via SPI bus.

The HEADINT signal is needed for recognising the external device (e.g. headset) connected to system. The recognition is based on the ACI-pin of the system connector, which is shorted to ground inside the external device.

The button of the external device generates HOOKINT interrupt and is used to answer or end a phone call.

■ Audio modes

HP call

The basic audio mode is the hand portable mode. This is entere d whe n no audio accessories are connected and handsfree mode is not selected by opening the cover.

The call is created by CMT. The internal earpiece is driven by the CMT engine for voice calls. The internal microphone is driven by the CMT for voice calls and voice recording. The internal microphone is enabled and uses the MICB1 bias voltage from UEMEK.

IHF call

This mode can be entered by user selection (opening the cover). The call is created by CMT. The internal microphone is driven by the CMT for voice calls and

voice recording. The internal microphone is enabled and uses the MICB1 bias voltage from UEMEK as in HP mode.

XEAR output of UEMEK is used to drive mono output signal is connected to the APE Audio DAC. Signal is then routed to the Phone_In_IHF input of the LM4855 audio power amplifier. This drives the internal speaker via the SPKRout driver.

Accessory call

This mode is used when accessory is connected to the system connector. The call is created by CMT. The uplink signal is generated by external microphone and trans-

ferred to UEMEK MIC2 input (via XMIC signals from Pop-port

connector). Hence the MIC2B

bias voltage and MIC2P/N inputs are enabled on UEMEK. As in IHF call down link audio signal is routed through the single ended XEAR output driver in

UEMEK. The mono XEAR output is connected to the DAC and then signal is routed to the L and RIN inputs of the LM4855. Accessories are driven via Pop-portTM connector using the L

OUT

driver of LM4855 audio power amplifier.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

APE audio

This mode is entered when user starts the multimedia application (e.g. MP3, AAC etc.), which is played via IHF speaker or Pop-port

Audio data from MMC is sent by OMAP1510 to the external audio DAC through the I

accessories.

S con-

nection. The DAC performs the digital to analog audio conversion. For playback via the internal speaker signal from DAC is routed to Phone_in_IHF input on

LM4855 audio power amplifier. For playback via the stereo/ mono headset or other Pop-port

is routed to the L

/RIN inputs of the LM4855 audio power amplifier. In case of mono accessory

accessories signal from DAC

OMAP1510 will produce monophonic signal to DAC.

■ Internal interfaces

In practice, all APE internal interfaces consist of interfaces connected from OMAP1510 to peripheral devices. All UI related interfaces, memory interfaces, USB and MMC are covered in separate sections of this document.

McBSP interfaces

OMAP1510 can support maximum of three independent Multi-channel Buffer Serial Ports (McBSPs) interfaces. However, these ports are slightly different and particularly suitable for different purposes. McBSP1 supports I2S protocol and is connected to external audio codec. McBSP#2 and #3 can be used as general purpose SPI interface supporting bit rates up to 5Mbits/s. McBSP2 is used to control the audio PA. McBSP3 clock output is used as audio codec master clock. Other McBSP3 signals cannot be used because they are multiplexed with µWire signals.

MCSI interfaces

The MCSI is a serial interface with multi-channels transmission capability. MCSI1 is used to interface with Bluetooth and MCSI2 is used as XABUS (DSP-DSP bus between CMT and APE)

UART interfaces

OMAP1510 has three UART interfaces capable of 1.5Mbit/s data rates. UART1 is used as Bluetooth control interface, UART2 is used as XBUS (MCU-MCU bus between CMT and APE), UART3 includes 115.2 kbit/s IrDA modulation support, and is used to communicate with external IrDA device.

µWire interface

The µWire interface is a standard serial synchronous bus protocol with two chip select lines. Interface is used as PDA LCD control bus (CS3) and as a unidirectional data bus for the Cover display (CS0).

I2C

The I2C is a half-duplex serial port using two lines, data and clock, for data communications with software addressable external devices. I controller COP8 is also connected to APE via I

C is used as audio codec. External keyboard

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ARMIO

ARMIO provides 5 ARM processor controllable GPIOs by default, and 5 more are available with different multiplexing scheme. ARMIOs also include a keyboard interface. The GPIOs consists programmable debouncing circuit but can be accessed directly only by the ARM processor. Both ARMIOs and keyboard interface signals can wake-up OMAP1510 from deep sleep and big sleep states.

GPIO

14 General Purpose Input/ Output External pins are multiplexed between ARM/DSP. Multiplex logic is programmed and controlled by ARM and supports pin-by-pin configuration.

■ External interfaces

Back cover switch

A switch is used for back cover removal detection. A rib is attached to the back cover. A sensor gives a warning to prevent data loss or corruption when writing to the MMC card.

Lid hall switch

A hall switch is used to detect the lid position. The switch is located on QWERTY flex and is connected to COP8 controller. The magnet is in the lid.

MMC

The MMC Interface in OMAP1510 is fully compliant with the MultiMediaCard system specification version 3.1. RAE-6/RA-4 MMC interface voltage is 3 V.

USB

The OMAP1510 USB Controller is a Full Speed Device (12 Mb/s) fully compliant with the Universal Serial Bus specification Revision 2.0. The USB Client (a mobile terminal) is connected to the USB Host (a PC) through the system connector.

■ UI interfaces

Displays

S80 display interface

S80 display utilizes the 16-bit synchronous LCD interface of OMAP1510, and µWire for control data.

Cover display interface

RAE-6/RA-4 has a separate small 64k colours display connected to OMAP1510 via µWire interface. There is an unidirectional level shifter between OMAP and the display, so no data can be read from the display.

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Figure 4:Display interfaces

OMAP1510

DOUT

DIN

Cs0

CLK

RST

Cs3

RST

Vid e o data

Level

Shifte rs

CMT Disp la y

Da ta

CS Clock Re se t

PDA Disp la y

Din

Dou t Clk CS

Re s e t

Vid e o

data

S S

Keyboards

Cover keyboard and command buttons

The cover keyboard and the four command buttons are directly connected to the OMAP1510 keyboard matrix.

QWERTY

An external keyboard controller is used for the QWERTY keyboard. COP8 is connected via I2C bus to OMAP1510 with an additional interrupt line to OMAP1510.

Power button

The power button is connected directly to UEMEK in the DCT4 engine. See Chapte r Power up and system states for further details on the power button operation.

Bluetooth

A single chip Bluetooth solution, BC02, is used in RAE-6/RA-4. The chip contains radio and baseband parts as well as MCU and on-chip ROM memory. Together with some external components (filter, balun etc.) and the antenna, it forms the Bluetooth system, which is attached to the host (OMAP1510). Bluetooth components are mounted directly to the PWB.

IrDA

RAE-6/RA-4 design includes a small (height 2.2 mm) metal shielded module. The modules use speeds up to 115.2kbps.

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Energy Management

Energy Management covers both CMT and APE sides. Battery and charging functions are integrated into CMT Universal Energy Management (UEMEK) ASIC. UEMEK includes also all needed regulators for CMT BB and RF. APE side has its own discrete power supplies.

Figure 5:Power distribution diagram

Measurement resistor

LM3820

UEMEK

VR1..7

VSIM

VANA

VFLASH1

VAUX2

VCORE

VIO

LP3981-2.8

2.8V

LM2708-1.57

1.57V SMPS

LP2985-1.8

1.8V

V18

V28

V15

BATTERY

PA Various

SIM

StUF

CORE I/O

CMT FLASH

VCC I/O

AUDIO PA

PopPort

Vout

Vbus

LP2985-3.3

3.3V

GPIO3

OMAP1510

I/O (2.8V) USB I/O (1.8V) CORE

NAND FLASH

CORE I/O

AUDIO

DAC

CORE+I/O

SDRAM

I/O CORE

LP3985-3.0

3.0V

GPIO15

TK11851L

CallLED1

Battery line Power line Control signal

Measurement signal

VMMC

Switch

Dlight

QWERTY

I/O + CORE

Switch

Klight

MMC

S80

VDDI VDD Backlight

CMT display

keypad

VDDI VDD Backlight

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■ CMT EM

UEMEK includes following blocks:

• Baseband regulators (8 different LDOs)

• RF regulators (6 different 2.78V LDOs, 4.75V LDO and two current regulators)

• Power up/down logic (state machine).

• Charger switch and control

LM3820

(=Zocus-C) is the current measurement chip used for phone and charging current measurement. It can be used to estimate the battery charge level presented as battery bars on the display. Results are read with CBUS interface to the StUF.

VBAT

Charger

UEM

UEMEK

Cbus

PWB track

sense resistor

LM3819

LM3820

To StUF

To UPP

Battery

GND

■ APE EM

APE side EM HW consists of several discrete regulators (listed shortly below):

• One DC/DC converters for generating 1.57V to OMAP1510.

• One linear regulator for 2.8V APE side logic, NAND, etc.

• One 3.0V linear regulator for powering of MMC card.

• One 3.3V linear regulator for powering the USB block of OMAP1510.

• One 1.8V linear regulator for powering the SDRAM.

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■ Battery

970 mAh Li-Po battery pack BP-6M is used in RAE-6/RA-4.

Table 3: BP-6M characteristics

Description Value

Nominal discharge cut-off voltage 3.1V Nominal battery voltage 3.6V Nominal charging voltage 4.2V

Table 4: Pin numbering of battery pack

Signal

name

VBAT 1 Positive battery terminal BSI 2 Battery capacity measurement (fixed resistor inside the

GND 3 Negative/common battery terminal

Temperature and capacity information is needed for charge control. The BSI fixed resistor value indicates type and default capacity of a battery. NTC-resistor that measures the battery temperature is located inside the phone on th e engine

PWB. This resistor is connected to the UEMEK BTEMP –line.

number

Function

battery pack)

Figure 6:Battery pack contacts

BSI resistor is connected to the battery connector pin. Phone has 100 kOhm pull-up resistor for the line so that it can be read by A/D input in the phone.

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Table 5: BSI Resistor Values

Parameter Min Typ Max Unit Notes

Battery size indicator resistor BSI

NTC thermistor BTEMP (inside phone)

82 kOhm Battery size indicator for 970 mAh

battery (BP-6M), Tolerance +/- 1%

47 kOhm Battery temperature indicator

(NTC pulldown) 47kOhm +/- 5% @ 25C

4000 Ohm Beta value (B).

Tolerance ”5%, 25C / 85C

■ Charging

RAE-6/RA-4 supports all DCT4 chargers. 3-wire chargers are supported, but 3-wire charging is not. In practice, this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers. 1Hz PWM signal is used to control UEMEK's charge switch.

■ Backup battery and RTC

Rechargeable backup battery is used for keeping real time clo ck running in case the main battery is either removed or the power level is below the cutoff limit.

Real Time Clock (RTC), crystal oscillator and backup battery circuitry are inside UEMEK. Two regulators are used to provide needed voltages for external backup supply and backup ba ttery charging: VRTC for internal clock circuitry and VBU for backup battery charging. The backup battery has voltage range VBACK = 2.0V charged down to 2.0V).

min

– 3.2V

– 3.3V

typ

(charged to 3.2V and dis-

max

■ Display and keypad illumination

One DC-DC converter generates the voltage for displays and keypad illumination. The conve rter is able to supply cover display and keypad OR PDA display, but both cannot be active at the same time. UEMEK controls the DC-DC converter and selection of cover/PDA display under APE control. The brightness of both cover and PDA display can be adjusted with UEMEK PWM output. For further details, see RAE-6/RA-4 flex section.

■ Power up and system states

System starts automatically after the battery is inserted. The power button is connected to UEMEK PWRONX pin on the CMT side. This power button is only used for selecting operating mode and switching the RF part of the device ON and OFF when needed. APE is started when UEMEK releases a PURX-signal, which controls OMAP1510 processor reset input.

Power off happens in the lowest SW cutoff limit when UEMEK watchdog is not updated anymore by SW and after that PURX goes to reset and system power supplies are switched OFF. However also in this power OFF mode (BACK_UP mode in UEMEK) part of UEMEK is powered ON but for user the device is dead. Only way to wake up from this mode is to plug in the charger or replace empty battery with the charged one.

22 COMPANY CONFIDENTIAL Issue 1 12/04

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Operating modes

• NO_SUPPLY mode means that the main battery is not present or its voltage is too low (below UEMEK master reset threshold limit) and back-up battery voltage is too low.

• In BACK_UP mode the main battery is disconnected or empty but back-up battery has sufficient charge in it

• IN POWER_OFF mode the main battery is present and its voltage is over UEMEK master threshold limit. All regulators are disabled. Device can enter in Power Off – mode e.g. due to thermal shutdown or watchdog elapsing or VBAT falling below VCOFF-.

• RESET mode is a synonym for start-up sequence and contains in fact several modes. In this mode certain regulators and system oscillators are enabled and after they have stabilized, the system reset (PURX) is released and PWR ON mode entered.

• In POWER_ON mode SW is running and controlling the system

• SLEEP mode is entered only from PWR ON mode when system activity is low. CMT and APE sides can be in sleep mode independently from each other.

Power up sequence

RESET mode can be entered in three ways: by inserting the battery or charger, or by RTC alarm.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

System Connector

RAE-6/RA-4 supports usage of Pop-PortTM bottom connector. This means support for Pop-

Port Pop-Port consists of a charging plug socket and system connector. The Pop-Port is a feature-

based interface. The accessory contains information about its features (ACI ASIC) and it is detected with a fully digital detection procedure.

FBUS accessories are not supported. Pop-Port

voltages are: 2.43V(min.) and 2.86V(max.). In RAE-6/RA-4 2.8V VAUX2 regulator from UEMEK is used to supply accessories. Regulator output current capability is 70mA.

Four new functions are introduced with the system connector interface:

stereo and mono headsets with and without ACI, USB cable.

connector includes VOUT pin, which is 2.78V/70mA output to accessories. VOUT

• Accessory control interface (ACI)

• Power out

• Stereo audio output

• Universal serial bus (USB)

Function Note

Charging Pads for 2-wire charging in cradles Audio 4-wire fully differential stereo audio output Power supply for accessories 2.78V/70mA output to accessories ACI (Accessory Control Interface) Accessory detection/removal & controlling FBUS Standard FBUS, Fast FBUS

Note! RAE-6/RA-4 does not support accessories using FBUS serial interface.

USB (default) USB v.2.0 device mode (full speed 12M)

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Figure 7:Pop-PortTM connections

PWB

Charge

ACI

Vout

USB D-

USB D+

Shielding GND

Charge GND

USB VBUS

DATA GND

XMIC N

XMIC

HSEAR N

HSEAR

HSEAR R N

HSEAR R P

Shielding GND

Pin # Signal Note

1VCHAR 2 GND Charge ground 3 ACI Insertion & removal detection /Serial data bi-directiona l 1 kbit/s 4 Vout 200mW 5 USB VBUS 6 USB D+/FBUS RX 7 USB D-/FBUS TX 8 USB data GND Data ground 9 XMIC N Negative audio in signal 10 XMIC P Positive audio in signal 11 HSEAR N Negative audio out signal.

Max bandwidth from the phone

12 HSEAR P Positive audio out signal.

Max bandwidth from the phone 13 HSEAR R N Not connected or grounded in mono. 14 HSEAR R P Not connected or grounded in mono.

■ Universal Serial Bus (USB)

The USB interface of OMAP1510 supports the implementation of a full speed device, fully compliant to USB2.0 standard. RAE-6/RA-4 uses an integrated USB transceiver.

■ Accessory Control Interface (ACI)

ACI (Accessory Control Interface) is a point-to-point, bi-directional serial bus. ACI has two main features: 1) detecting the insertion and/or removal of an accessory device 2) acting as a data

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

bus. A third function provided by ACI is to identify and authenticate a specific accessory which is connected to the system connector interface.

All accessories cause headint interrupt when connected to or disconnected from the system connector. The insertion of an accessory generates a Headint interrupt by pulling the ACI line

down. When no accessory is present, the UEMEK’s internal Headint pull-up resistor keeps the

line high All accessories have common detection start sequence, when phone gets headint interrupt

from high to low transition in ACI pin.

VOUT (Accessory Voltage Regulator)

UEMEK internal regulator is needed for accessory power supply purposes. All ACI-accessories require this power supply.

■ HookInt

The hook signal is generated by creating a short circuit between the headset microphone signals. In this case, an LP-filter is needed on the HookInt input to filter the audio signal. When no accessory is present, the HookInt signal is pulled up by the UEM resistor . Whe n the accessory is inserted and the microphone path is biased the HookInt signal decreases to 1.8V due to the microphone bias current flowing through the resistor. When the button is pressed the microphone signals are connected together , and the HookInt input get s half of micbias DC value 1.1 V. This change in DC level will cause the HookInt comparator output to change state, in this case from 0 to 1. The button can be used for answering incoming calls but not to initiate outg oing calls.

DC-plug

RAE-6/RA-4 uses a 3.5mm DC-plug. 3-wire chargers are supported, but 3-wire charging is not. In practice this means that the 3-wire chargers are internally connected (charger control wire connected to GND) as 2-wire chargers. 1Hz PWM signal is used to control UEMEK's charge switch.

VCHAR pins of system connector

The VCHAR and ChargeGND pin are directly connected to the normal charger lines of the DCplug.

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After Sales Interface

Test pads are placed on engine PWB on battery side for service flashing and testing purposes.

Figure 8: Pin assignment in test pattern

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

User Interface

1BD is the UI flex module of RAE-6 & RA-4 (US variant) communicators locating on the upper lid and connecting the following functional blocks to phone engine:

•PDA display

•CMT display

• CMT keypad

• Power key

• Illumination

• Earpiece

In addition to the actual components to provide the needed functionality, there are some components to filter out possible EMI/ESD disturbance. Figure 9, “Block Diagram of UI HW” shows a block diagram of the UI HW of RAE-6/RA-4.

The HW UI is based on APE chip (OMAP1510).

Figure 9:Block Diagram of UI HW

LCD IF uWire Reset

uWire Reset

OMAP1510

COP8

DAC & PA

Level

shifter

Keyboard IF

PDA display

CMT display

Keypad

Hall Sensor

QWERTY

IHF

UI HW

Upper Lid

Power key

Illumination

Earpiece

Lower Lid

UPP

Klight

UEMEK

PWRONX

Dlight

28 COMPANY CONFIDENTIAL Issue 1 12/04

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X100

Power key

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Component placement and FPWB outline of 1BD

1BD FPWB board size is 150x70mm. It has a double-layer structure. Hinge part is single layer. All the components are placed on one side of the 1BD FPWB. Figure 10, “Main components of 1BD” shows the main components and all the test points of the 1BD module.

Figure 10:Main components of 1BD

Earpiece

CMT display

connector

LED driver

circuit

PDA display

connector

CMT keypad

CBA

buttons

(4pcs)

J100

(GND)

Level shifters

(2 dual buffers)

J102

(VLED-)

Figure 11:Test points of 1BD module

J101

(VLED+ for PDA display)

Keypad

LEDs

Hinge

connector

8 1

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■ Hinge connector

Hinge connector is a 61-pin board-to-board type connector with 0,5mm pitch, which connects flex module to the engine module. Table 8 shows all the signals thro ugh hinge area of the flex.

Table 6: Signal description of the hinge flex connector X100

Pin Signal Pin Signal

1 GND (Ground) 32 VBAT (supply voltage) 2 GND (Ground) 33 APE_GPIO(13) RESET for PDA display 3 V18 (Supply voltage 1.8V) 34 V28 (Supply voltage 2.8V) 4 V28 (Supply voltage 2.8V) 35 LCD(10) (Green5) 5 APE_GPIO(12) (RESX for CMT display) 36 LCD(0) (Blue0 RGB data for PDA display) 6 EARN (Audio signal for earpiece) 37 LCD(1) (Blue1 RGB data for PDA display) 7 EARP (Audio signal for earpiece) 38 LCD(2) (Blue2 RGB data for PDA display) 8 PWRONX (Power-on-signal) 39 LCD(3) (Blue3 RGB data for PDA display) 9 ROW0 (Row-line of keyboard matrix) 40 LCD(19) (DE for PDA display) 10 UWIRE(4) (CS for PDA display) 41 GND (Ground) 11 UWIRE(3) (CSX for CMT display) 42 GND (Ground) 12 ROW2 43 GND (Ground) 13 ROW1 44 GND (Ground) 14 UWIRE(2) (SCL for CMT and PDA display) 45 LCD(18) (VSYNCH for PDA display) 15 UWIRE(1) (SDA for CMT and SDIN for

PDA display) 16 UWIRE(0) (DOUT for PDA display) 47 LCD(4) (Blue4 RGB data for PDA display) 17 ROW3 48 LCD(9) (Green4 RGB data for PDA dis-

18 ROW4 49 LCD(8) (Green3 RGB data for PDA dis-

46 LCD(17) (HSYNCH for PDA display)

play)

play) 19 GND (Ground) 50 LCD(11) (Red0 RGB data for PDA display) 20 GND (Ground) 51 LCD(16) (PCLK for PDA display) 21 GND (Ground) 52 LCD(7) (Green2 RGB data for PDA dis-

play) 22 GND (Ground) 53 LCD(6) (Green1 RGB data for PDA dis-

play) 23 COL5 (Column-line of keyboard matrix) 54 LCD(12) (Red1 RGB data for PDA display)

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

24 COL4 55 LCD(13) (Red2 RGB data for PDA display) 25 COL3 56 LCD(14) Red3 RGB data for PDA display) 26 COL2 57 LCD(15) (Red4 RGB data for PDA display) 27 COL1 58 LCD(5) (Green0 RGB data for PDA dis-

play) 28 KLIGHT (control signal for CMT LEDs) 59 GND (Ground) 29 DRVEN (LED driver enable) 60 GND (Ground) 30 DLIGHT (control signal for PDA display

LEDs)

31 VBAT (supply voltage)

61 GND (Ground)

■ PDA display

PDA display is an S80L display module, 640(H) x RGB(H) x 200(V) transflective active matrix colour LCD. It is capable of showing 65536 colours (5xR, 6xG, 5xB). It incorporates a backlight system with 2x3 white LEDs connected in series.

The display has the following on-chip features: contrast control, DC/DC converter, temperature compensation and N-line inversion for low cross talk CMOS compatible inputs/outputs.

The complete display module includes LCD glass, flex cable (FPWB), driver IC and illumination system.

Interface

The PDA display has two interfaces: 16 data lines parallel video RGB interface ViSSI and optional 3-wire 9-bit serial interface LoSSI. Video interface is used for image data transfer (video and still) and serial interface is used for sending commands. GPIO13 is reset signal for PDA display.

The display is connected to the LCD interface of the OMAP1510 chip. The interconnection between the LCD module and engine is implemented with a 40-pin board-

to-board connector. All the signals go through the hinge flex and are filtered by EMI filters.

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Table 7: Interface signals of PDA display.

Signal

Pin #

1 GND GND 0V - Ground 2 VLED+ Vovp (LED Driver) Variable

3 VLED1- Vfb1 (LED Driver) 12 / 1V - Return line for LEDs 1 4 VLED2- Vfb2 (LED Driver) 12 / 1V - Return line for LEDs 2 5 GND GND 0V - Ground 6 VDDI V28 2.8V I,

7 GND GND 0V - Ground 8 GND GND 0V - Ground 9 VDD V28 2.8V I,

10 !RES GPIO13 0 – 2.8V I Reset signal

name

(LCD)

Signal name

(Engine)

Voltage

level

~12V

I/O/Z Description

- Voltage for LEDs

Logic power supply voltage

PSU

Analog power supply volt-

PSU

age

11 !CS WIRE_nSCS3 0 – 2.8V I Chip select signal 12 GND GND 0V - Ground 13 SCLK WIRE_SCLK 0 – 2.8V I Serial clock 14 DIN WIRE_SDO 0 – 2.8V I Serial data input 15 DOUT WIRE_SDIN 0 – 2.8V O Serial data output 16 GND GND 0V - Ground 17 Vsync LCD_VSYNC 0 – 2.8V I Vertical synchronization

signal

18 Hsync LCD_HSYNC 0 – 2.8V I Horizontal synchronization

signal 19 DE LCD_AC 0 – 2.8V I Data enable 20 GND GND 0V - Ground 21 PCLK LCD_PCLK 0 – 2.8V I Pixel clock signal 22 GND GND 0V - Ground 23 R0 LCD_PXL11 0 – 2.8V I Image data input red, LSB 24 R1 LCD_PXL 12 0 – 2.8V I Image data input red 25 R2 LCD_PXL 13 0 – 2.8V I Image data input red

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Signal

Pin #

26 R3 LCD_PXL 14 0 – 2.8V I Image data input red 27 R4 LCD_PXL 15 0 – 2.8V I Image data input red, MSB 28 GND GND 0V - Ground 29 G0 LCD_PXL 5 0 – 2.8V I Image data input green,

30 G1 LCD_PXL 6 0 – 2.8V I Image data input green 31 G2 LCD_PXL 7 0 – 2.8V I Image data input green 32 G3 LCD_PXL 8 0 – 2.8V I Image data input green 33 G4 LCD_PXL 9 0 – 2.8V I Image data input green 34 G5 LCD_PXL 10 0 – 2.8V I Image data input green,

35 GND GND 0V - Ground 36 B0 LCD_PXL 0 0 – 2.8V I Image data input blue, LSB

name (LCD)

Signal name

(Engine)

Voltage

level

I/O/Z Description

LSB

MSB

37 B1 LCD_PXL 1 0 – 2.8V I Image data input blue 38 B2 LCD_PXL 2 0 – 2.8V I Image data input blue 39 B3 LCD_PXL 3 0 – 2.8V I Image data input blue 40 B4 LCD_PXL 4 0 – 2.8V I Image data input blue, MSB

■ CMT display

This section outlines the 128 x 128 transflective active matrix LCD with 65536 colours. The display module includes:

• FPWB foil including connector and required passive components

• Display panel (glass) with COG drivers including display controller and 132 x132 x16 bit RAM

• Illumination system: light guide, optical sheets and LEDs

Interface

The display module is equipped with a DCT4 compatible LCD controller (Driver) with bi-directional 9-bit serial interface. The CMT LCD is connected to the µWire interface of the OMAP1510 chip. The maximum clock frequency of the OMAP1510 µWire is 3.0 MHz. GPIO12 is the reset signal for the CMT display.

Because of different logic levels of OMAP (2,8 V) and display (1,8 V), level shifters are used in the following signal lines: SDA, CSX, RESX and SCL.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

The interconnection between the LCD module and engine is implemented with a 12-pin boardto-board connector.

All the signals go through the hinge flex and are filtered by EMI filters.

Table 8: interface signals of CMT display.

Signal

Pin #

name

(LCD)

1 VLED- Vfb (LED

Signal name

(Engine)

Voltage level I/O/Z Description

12 / 0.4V - LED power supply (cathode)

Driver)

2 VDDI V18 1.8V I,

Supply voltage for digital circuits

PSU 3 GND GND 0V - Ground 4 SDA WIRE_SDO 0 – 1.8V (LCD) I/O Bi-directional serial interface

data but only used as unidirectional.1)

0 – 2.8V (OMAP1510)

5 CSX WIRE_nSCS0 0 – 1.8V (LCD) I Chip select (active low)

0 – 2.8V

(OMAP1510) 6 GND GND 0V - Ground 7 TE - 0 – 1.8V O Tearing Effect signal 8 RESX GPIO12 0 – 1.8V (LCD) I Reset signal (active low)

0 – 2.8V

(OMAP1510) 9 SCL WIRE_SCLK 0 – 1.8V (LCD) I Serial interface clock

0 – 2.8V

(OMAP1510) 10 GND GND 0V - Ground 11 VDD V28 2.8V I,

PSU

12 VLED+ Vovp (LED

Variable ~12V - LED power supply (anode)

Power supply for analogue circuits

Driver)

Note! Level shifter used.

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ CMT keypad

The amount of keys in RAE-6/RA-4 on the lid side is 27. The keys are connected to the OMAP1510 keyboard interface, except the power key, which is connected to PWRONX pin of UEMEK. Keyboard interface in OMAP1510 has a 6x5 matrix. The total amount of the keypad signals through hinge flex is 12. Keyboard matrix can be seen in Table 9, “Keypad placement matrix.” Keys are divided into CMT keys and CBA Soft Command keys that are also called PDA keys. CMT keys are on the topside of the lid and PDA keys are on the bottom side, next to the PDA display. All the signals go through EMI filters.

Table 9: Keypad placement matrix.

Col 0 Col 1 Col 2 Col 3 Col 4 Col 5 Row 0 Row 1 Row 2 Row 3 Row 4

From Signal Pin(s) To Signal Pin(s) Levels Description

OMAP1510 APE_KEYB(10:0) Keyboard

Keyboard Matrix

Row (4:0) OMAP1510 APE_KEYB(10:0) 0-2.8V Keyboard control:

Special key

UP CMT 1 CMT 2 CBA 1 CBA 2 PUSH SEND END CBA 3 CBA 4 DOWN 1 2 3 * LEFT 4 5 6 0 RIGHT 7 8 9 #

Table 10: OMAP1510 keypad interface

Column(5:0) 0-2.8V Keyboard control:

Matrix

Column

Row with external pullup

Description of operation

A keyboard Interface in OMAP1510 consists of specific I/O pins, dedicated for the 6 columns X 5 rows keyboard connection.

The keyboard interface is composed of six column lines (output), KBC (5:0); and five row lines (input), KBR (4:0) with the capability to detect multiple key pressing.

When no key is pressed, KBD_INT remains high because of external pull up, once key(s) is (are) pressed, the corresponding row(s) and column(s) are shorted together, since KBC is set to low initially, therefore, KBD_INT is changed to low state and interrupt is generated that CPU will perform a scanning process to tell which key(s) are pressed.

In case of a determined key press SW must ensure is the key pressed or not by multi-read operation.

Illumination and drivers

The illumination includes:

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RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

•PDA display

•CMT display

• CMT keypad illumination

■ PDA keypad

The keyboard matrix is a full QWERTY-keyboard, and consists of 66 keys + 9-way joystick. Space bar is built of 2 domes, so there are altogether 67 key domes in the matrix. Keyboard matrix is organized to 8 columns and 12 rows. Joystick is a 9-way joystick and consists eight directions (cardinal points & half-cardinal points) and push center direction to select.

The matrix is connected to a keyboard controller COP8, which wakes up whenever there is a key pressed in the keyboard. The COP8 controller is located in the engine board 1BC. Controller starts to scan the matrix to detect, which keys are pressed, and the scanning is continued until each key is released. If there are no more key events happening inside a certain time p eriod, the controller will return to sleep. During the scanning, the controller will send an interrupt to the main processor to notify that a key is pressed. When the main processor receives the notification, it will read the pressed keys from the controller via I2C-bus. Controller will just send the codes of the pressed keys as Hex-code; the meaning of each key code is determined in the main processor, depending on the language version and the used application.

Hall-sensor

Hall-sensor is used to detect the PDA-lid position: there is a magnet in the coverlid just above the Hall-sensor when the lid is closed; when the lid is opened, the Hall is released, thus waking up the keyboard controller. The Hall-sensor has one dedicated input in the controller, and as soon as the wake-up is detected, controller sends the lid-opened -message to the main processor.

Block diagram

Figure 12: Block diagram of illumination.

DRVEN

Dlight

Diodes on Engine PWB

TK11851L

PDA display

2x3 LEDs in series, 2x13mA

CMT displ ay

3 LEDs in series, 13mA

Klight

CMT Keyp ad

2 LEDs in series, 10mA

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• S80L backlight

• Keypad backlight

• TK11851L: white LED driver for backlight

• UEMEK PWM signals Dlight and Klight are to turn on/off white LED circuits

Description of operation

There are 6 white LEDs for illumination built in S80L module. There are two LED chains connected in parallel. Each of these chains consists of three LEDs in series. Common TK11851L driver is used for S80L display and for CMT display + keypad.

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Nokia Customer Care 6 - Baseband Description and Troubleshooting

Baseband Troubleshooting

This section is intended to be a guide for localizing and repairing electrical faults in RAE-6/RA4 baseband.

Before any service operation you must be familiar with the RAE-6/RA-4 product and module level architecture. You have to be also familiar with the RAE-6/RA-4 specific service tools such as the Phoenix service software, flashing tools and software.

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■ Top level flowchart

Start

Go to Phone is

dead

troubleshooting

Phone is

dead

Display is

distorted/colors

look strange

IR doesn't

work

Bluetooth is not working

Illumination

doesn't

work

Yes

Does pc

recognize it when

connected with

USB?

Yes

Go to UI

troubleshooting

Go to UI

troubleshooting

Go to IR

troubleshooting

Go to Bluetooth troubleshooting

Go to Illumination

troubleshooting

Go to EM

troubleshooting

Go to CMT

troubleshooting

Go to APE Clock

and reset

troubleshooting

USB doesn't

work

Keyboard

doesn't work

SIM does't work

Yes

Next page please

Go to USB

troubleshooting

Go to UI

troubleshooting

Go to SIM

troubleshooting

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RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Continued from page

Audios doesn't

work

MMC doesn't

work

Phone does not

recognize Accessory

Yes

Go to audio

trobleshooting

Go to MMC

troubleshooting

Go to accessory

troubleshooting

Charging

doesn't work

Flashing

doesn't work

Yes

Go to Charging s

troubleshooting

Go to Flashing

troubleshooting

40 COMPANY CONFIDENTIAL Issue 1 12/04

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RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Phone is dead troubleshooting

Phone is in flash jig,

powered from

laboratory power

Does it

boot now?

Phone

takes more

than 600mA

current when

powered?

Does it take

any current at

all?

Yes

Try to flash

Yes

Check

Battery

Short circuit somewhere,

disassemble

phone. Continue

testing in module

jig with engine

PWB only.

Is battery

connector ok?

Yes

Go to CMT

troubleshooting

Does phone still

take too much

current?

Connect UI

module, does

current

consumption

increase more

than 200mA?

Connect full

keyboard

module, is the

current

consumption

about the same

as in the first

measurement?

circuit, change the

Yes

component and test

Yes

Find the short

again.

Try another UI

module, does

situation

change?

Yes

Short circuit/

component fail

in UI module.

Check UI

module

connector and

surrounding components

Change full

keyboard

module

Unsuccessful

Did not help

Check that

both displays

are ok?

Yes

Fault is in non-

reworkable

component. Refer to

current BER

handling guidance.

troubleshooting

display(s). Retest

Go to flash

programming

Repair broken

after that.

Short circuit

comes from

mechanics

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■ IR troubleshooting

Phone is in

flash jig, or

powered from

battery

Try IR connection

to pc

Try again in module jig Yes

IR module N4490

seems to be properly

soldered?

Yes

Yes ok

Try to send a

contact with

phones IR

Change IR

window

Look with a camera phone viewfinder to

phones IR window

I can see blinking light

Reflash the

phone

Inspect R4490,

C4490 and

C4492

One is pulsing, another is not

Change IR

module

All ok

Check if pulses can be

seen during transmission

at pins 3 and 4

Yes

Reflash the

phone, OK

now?

42 COMPANY CONFIDENTIAL Issue 1 12/04

OMAP FAULT?

Fault is in non-

reworkable

component. Refer

to current BER

handling guidance.

Page 43

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Illumination troubleshooting

Power on

When lid open,

are all LEDs illumanated in PDA display?

YES

module’s LED flex.

Fail in display

Change display.

Are all LEDs

dead?

Only half of the

LEDs are

illuminated?

Yes, phone works

otherwise ok.

Check R103, R104

and X102 pins 3

and 4.

Try again with

known good PDA

display. OK?

Change flex.

Measure LED

driver output from

between 10-12V?

Measure DLIGHT

signal from N103 oscilloscope. Is it

high or is there a

Measure voltage

Voltage between

YES

N101 pin 4.

Is voltage

YES

pin 2 with

PWM signal?

YES

from J101

(or N103 pin 3).

10-12V?

component. Refer

handling guidance.

N103 failure.

component (or

Change flex.NO

UEME FAULT?

Fault is in non-

reworkable

to current BER

YES NO

Check connector

X100 pin 30. OK?

YES

Change

flex).

Measure voltage in N101 pin 8. Is it high (>1.5V) or

is there PWM

signal?

YES

Measure voltage in N101 pin 1. Is

there ~VBAT

voltage?

YES

N101 failure.

Change

component (or

flex).

Possible problem with connector or

flex trace. Change

Fault is in non-reworkable

component. Refer to

current BER handl i n g

Check X102

connector pins

2,3 and 4. OK?

YES

Try again with

known good PDA

display. OK?

flex. OK?

UEME FAULT?

guidance.

Change flex.

Put a magnet next to

the hall sensor and press some key on

cover, is CMT side

illuminated as it should?

YES

END

Is the PDA side still

Change flex. NO

illuminated?

YES

Possible Hall

reader fault. Visit

QWERTY

troubleshoot.

UEME FAULT?

Fault is in non-

reworkable

component. Refer to

current BER

handling guidance.

YES

Change N102.

OK?

YES

Keypad and cover

display are dark?

YES

Measure voltage

from N102 pin 2. Is

it high? (>2V)

Check connector

X100 pin 28. OK?

CMT display is

NO NO

illuminated and the

keypad is not?

YES

One of the LEDs is

broken. Change

the fault LED. OK?

Change flex.NO

illuminated and the

Check connector

X101 pins 1 and

Change the CMT

The keypad is display is not?

YES

12. OK?

YES

display.

Issue 1 12/04 COMPANY CONFIDENTIAL 43

Page 44

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ SIM troubleshooting

Check

SIM connector

SIM fault No

X2700 solderings and SIM contacts.

Problem

fixed?

Yes

Measure VSIM

with oscilloscope from

X2700 pin 3. 1.8V and then

3.0V pulses lasting about

30ms should be seen right

after power up

without SIM.

Yes

Change

SIM asip R2700.

Problem

fixed?

Fault is in non-

reworkable

component. Refer to

current BER handling

guidance. (StUF D2800 / UEMEK

D2200 problem).

capacitors C2700

and C2221 in VSIM

Check

line . OK?

Yes

Change

defect

capacitor(s).

Problem

fixed?

End

Yes

44 COMPANY CONFIDENTIAL Issue 1 12/04

Page 45

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ UI troubleshooting

CMT

display

check

Yes

Change UI

flex.

Display physically

broken?

Check

connectors

X100/X101.

OK?

Yes

Try with known

good display.

Working?

X100:

Are

VDD (pin4)

and

VDDI (pin 3)

voltage levels

~2.8 and ~1.8V?

Are

CSX (D100, pin 6),

SCL (D101, pin 6)

and SDA (D100, pin 4)

lines working

properly?

Change LCD.

Yes

LCD working?

Yes

Change LCD

Fix connector.

Check level shifters

D100/D101.

Change UI module

if needed.

Check

flex connector

X4402

on engine PWB.

OK?

Yes

CSX (D100, pin 1),

SCLK (D101, pin 1)

and SDA (D100, pin 3)

lines working properly

Are

before level

shifter?

Yes

End

Go to EM trouble

shooting

Change adequate

EMI filter(s)

Z4400...4401.

Signals OK?

Yes

OMAP FAULT. Fault is in non-

reworkable component.

Refer to current BER

handling guidance.

Display working now?

Yes

RESX (D101, pin 4)

signal reasonable?

Yes

LCD working?

Yes

End

Check (change

level shifter D101.

Yes

RESX (D101, pin 3)

signal reasonable

before level shifter?

Issue 1 12/04 COMPANY CONFIDENTIAL 45

Page 46

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

PDA LCD troubleshooting

PDA

display

check

Display physically

broken?

connectors

X102/X100.

Change UI

module.

Yes

Blank display?

Check

OK?

Yes

Change LCD.

LCD working?

Are

VDDI/VDD

(X100 pin 34 ~2.8V)

and GND

voltage levels ok?

Yes

X100:

Are

!CS

(pin10),

SCL (pin10),

DIN (pin15),

DOUT (pin16)

lines working

properly?

Yes

Is !RES

(X100 pin33)

signal

reasonable?

Fix connector. No

Fix connector.

on engine PWB.

Check

flex connector

X4402

OK?

Yes

Check

flex connector

X4402

OK?

Check

flex connector

X4402

OK?

Yes

Go to EM trouble

shooting

Change adequate EMI

filter(s)

Z4400...4403.

Signals OK?

Yes

reworkable component.

Refer to current BER

handling guidance.

End

Yes

OMAP FAULT.

Fault is in non-

LCD working?

Yes

Picture

disturbed?

Strange colors or

other effects?

End

Yes

X100:

Are VS (pin45),

Yes No

Yes

HS (pin46) DE (pin40)

PCLK (pin51)

lines working

properly?

Yes

X100:

Are

data lines

R0...4,

G0...5 and

B0...4

working

properly?

Fix connector.

Check

flex connector

X4402

on engine PWB.

OK?

Check

flex connector

X4402

on engine PWB.

OK?

Yes

46 COMPANY CONFIDENTIAL Issue 1 12/04

Page 47

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

CBA keys troubleshooting

Cover keys/

CBA keys are

not working

They seem to

mechanically

ok?

Yes

Keys work

with another

UI module?

connector

X4402

ok?

Yes

Change

Z4400

and

Z4401

No change

See that

R4424, 4425,

R4427 are ok.

Yes

Replace

flex

Still dead

OMAP FAULT?

Fault is in non-

reworkable

component. Refer

to current BER

handling guidance.

Issue 1 12/04 COMPANY CONFIDENTIAL 47

Page 48

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

QWERTY troubleshooting

Full keyboard is

not working

Check connector

X4401. OK?

Yes

Try

another full

keyboard module.

Keyboard

working?

Put original full

keyboard module back.

Yes

Measure

voltage levels from I2C_sda

(J4416), I2C_clk (J4415) and

KB_irq (J4417) lines when keys

are pressed. Voh ~ 2.8V

and Vol ~ 0V.

Voltages OK?

Fix connector.No

Check

R4800.

Resistance

~ 2k2 ohms?

Yes

Is keyboard working?

R4800. Remeasure

lines I2C_sda, I2C_clk

and KB_irq. OK?

Yes

Change

Yes

full keyboard

working?

Fault is in non-

reworkable

component. Refer to

current BER handling

guidance. (OMAP

D4800 problem).

Try another

full

keyboard

module.

Yes

Change D4400.

Remeasure lines

I2C_sda, I2C_clk and

KB_irq. OK?

Yes

End

48 COMPANY CONFIDENTIAL Issue 1 12/04

Page 49

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Charging troubleshooting

Charging fault

Change defect part

and retest.

Battery bars are

scrolling?

Re-calibrate ADC,

charge current and

voltage with Phoenix

Energy Management

tuning. Calibration OK?

Connect charger

and measure

voltage from both

ends of C2026. Is it

> 3.0V?

Yes

Check R2200. Is it

OK?

Read BTEMP value with

Yes

Phoenix. Is it close to

ambient temperature

Yes Retest

Check X2021,

X2022, F2020,

C2026 and V2020,

All components ok?

Change defect part,

re-calibrate charge

current and voltage.

Change defect part,

re-calibrate charge

current. Retest.

(~25C)?

Retest

Re-calibrate ADC

with Phoenix Energy

Management tuning.

Yes

Retest OK?

R2350, R2354 and

components OK?

Check R2021,

C2351. All

Yes

Fault is in non-

reworkable

component. Refer to

current BER

handling guidance.

(UEMEK D2200

problem).

Issue 1 12/04 COMPANY CONFIDENTIAL 49

Page 50

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ USB troubleshooting

No USB

connection

Inspect Pop-port,

L2002, R2003,

R2004, C2005-

2007, and N2001

visually

At least 5V

Check voltage

from R2004

(USB enable)

2,8V

Check voltage

from C2005

(USB operatin g

voltage)

Undamaged

Measure voltage

VBUS at C2006

when connected

to pc with USB

Not 2,8V

3.3V±7%

Damaged

cable

Replace/re-solder

broken connections/ components

Incorrect

voltage

Visit EM

section

Replace MDOC D5000, if this does not

component. Refer to current BER

handling guidance. (OMAP D4800

No help

help, Fault is in non-reworkable

Change L2002

Visit APE

clock section

No help

problem).

Incorrect

voltage

Change USB regulator

N2001

50 COMPANY CONFIDENTIAL Issue 1 12/04

Page 51

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Accessory troubleshooting

Accessory

detection doesn't

work

Insert the known

working accessoryt to

the system connector .

Does phone detect

headset?

YES

END

Does HEADINT

(R2001) toggle (high

-> low) when accessory is

connected?

YES

Vout

(system connector

X2021, pin#4)

~2.8V, after an ACI

accessory has been

connected?

NO Fix defect and retest.

Check L2000, R2002,

R2001 and C2003 and

system connector X2021

YES

Check

X2021 and L2001.

Check also that Vout is

not shorted to GND.

No fault found.

retest.

Fault found.

Fault is in non-reworkable

component. Refer to current

BER handling guidance.

Issue 1 12/04 COMPANY CONFIDENTIAL 51

Page 52

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ MMC troubleshooting

Start

Save picture to

known good MMC

card

Save and read

succeed?

Is the rib in the battery

cover in

place?

Yes

Connector, R5201,

R5200, C5200, C5201, N5200,

R5202, C5203, and

C5202 seem to be in

order

No MMC IF failure.

Yes

All measurements provide that the MMC is initializing or some operation is being

tried to perform, since

MMC power is cut after 5

seconds idle time.

MMC card

corrupted or

damaged

Replace battery cover and retest

Yes

Push the switch

S4400. Does

voltage on

R4421 change?

Yes

Measure voltage VMMC at C5200

or C5202.

3V±5%

Measure

MMC_CLK and

MMC_CMD

from connector

Something

else

signals

Replace S4400 and

retest

replace

R5200

Initialize MMC,

check voltage from

R5202.

2,8V

Change MMC

regulator N5200

MMC initialization is done at

boot, after ~5sec voltage

drops to zero, use

oscilloscope

Not 2,8V

Signals present

If reflash does not help, fault is in

non-reworkable component

(OMAP D4800). Refer to current

BER handling guidance.

Still no signals

at connector

52 COMPANY CONFIDENTIAL Issue 1 12/04

Page 53

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Audio troubleshooting

Earpiece doesn't work

Change original upper lid

Change upper lid

module. Working?

YES

Check earpiece (B100),

springs and PWB contacts from original upper lid. Check also

earpiece gasket. Check

flex. Change faulty part (earpiece, flex, UI-

shield). Retest.

Working?

Set Phoenix Audio

Routing from a known

working MIC input MIC1

(HP, Int) or MIC2 (Ext.

XMIC) to HP OUT.

Ensure the correct MIC

module back.

bias is on.

Measure DC voltage

between earpiece

(B100) pads

and GND. Is it

~1.4V?

YES

Are audio signals

from UEME to

earpiece pads OK?

Check audio path from

UEME to earpiece pads.

Check L2100 and dual

resistors R2100 and

R2101. Change

components if needed.

Retest.

DC bias OK

Check audio path from

UEME to earpiece pads.

Check L2100 and dual

resistors R2100 and

NO No audio signal

R2101. Change

components if needed.

Retest.

No DC voltage seen.

UEME D2200 FAULT?

Fault is in non-

reworkable component.

Refer to current BER

handling guidance.

YES

Does audio work

during a call?

YES

END

Audio signals OK

StUF D2800 Fault. Fault is in

non-reworkable component.

Refer to current BER handling

guidance.

Issue 1 12/04 COMPANY CONFIDENTIAL 53

Page 54

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

Microphone doesn't work

Check MIC module

(B2100) and PWB

contacts.

Are they OK?

YES

Set Phoenix Audio Routing from MIC1

(Hand portable) to known

working audio output

(EARP/ HP or Ext,

XEAR) Ensure MIC Bias

(MICB1) is set on.

Is MIC Bias 2.1V

present at R2102?

YES

MIC Bias OK

Clean contacts/ replace

MIC module

(B2100).

Retest.

Check R2102, R2103,

C2104 and C2105.

Change components if

needed.

Retest.

No MIC Bias.

Are audio signals

from MIC to UEME

OK?

YES

Does the audio work

in a call?

YES

END

Audio signals OK

Check audio path trough dual

and dual capacitor C2102.

Check also R2103 and

dual ferrite L2101.

Change needed components.

resistor R2102

Retest.

No audio signal

UEME D2200 FAULT?

Fault is in non-reworkable

component. Refer to

current BER handling

guidance.

Working

54 COMPANY CONFIDENTIAL Issue 1 12/04

Page 55

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ MDOC troubleshooting

All signals in this

troubleshooting are in

range 0 - 2.8V

Busy# signal rises

at latest after

1055us after

RSTIN# rises.

However, the Busy#

can be high before

RSTIN# rises, but this

is not taken into account.

Check resistors

R5000 and

R5001,

both ~10k

Measure

MDOC Busy#

at R4801 and

RSTIN# at

RSTIN# stays low

Measure

MPU_nReset

at R4802, low

transition?

Stays low

Go APE clocks and

reset troubleshooting

Replace damaged

resistor(s)

Start

J4803

to high

Backup user data before

MDOC troubleshooti n g, if

Boot phone. Use oscilloscope.

Busy#

stays low

Yes

possible

Check resistor

R4801

~10k

Yes

Check MDOC

core voltage at

C5000, should

be ~2.8V

Correct

voltages

Check MDOC

I/O voltage at

C5001, is it

~2.8V?

Correct

voltages

Voltage

level

invalid

Replace resistor

R4801 and rerun

first test

Voltage levels

invalid

Go to EM

troubleshooting

Yes

Measure

CS0# at J4805

and OE#

J4802,

toggling?

Yes

Memory corrupted,

replace MDOC

D5000

OMAP FAULT? Fault is

in non-reworkable

component. Refer to

current BER handling

guidance.

Check resistors

R5000 and

R5001,

both ~10k

Yes

MDOC damaged,

replace D5000

Replace damaged

resistor(s)

Issue 1 12/04 COMPANY CONFIDENTIAL 55

Page 56

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ SDRAM troubleshooting

All signals in this

Start

troubleshooting are in

range 0 - V18

Run

ST_APE_RAM

_TEST, with

Phoenix.

Result?

Fail

Measure

SDRAM

voltage V18 at

C5083

Correct

Measure

SDCLK

frequency at

R4808

>70MHz?, level

0 - ~V18

Pass

Incorrect

Yes

Still problem

occurs?

Go to MDOC

troubleshooting

Check and replace

if needed C5083-

C5089, resistance

>>1Mohm

Correct

Phone might have

been dropped, solder

balls cracked, replace

D5080

Phone might been

Yes

dropped, solder balls

cracked, replace D5080

voltages V18 at

Measure SDRAM

C5083

Incorrect

Correct

Visit APE Power

troubleshooting

Measure

SDRAM

voltages V18 at

C5083

Incorrect

Change SDRAM

D5080

Inspect R4808

value, approx

22ohm

Yes

Problem occurs

while booting?

Yes

Go to MDOC

troubleshooting

Replace

R4808 and

measure

SDCLK

frequency

>>70Mhz

Yes

No Pass

StUF FAULT?

Fault is in non-

reworkable

component. Refer

to current BER

handling guidance.

Repeat

ST_APE_RAM

_TEST with

Phoenix

Fail

Change SDRAM

D5080

End

56 COMPANY CONFIDENTIAL Issue 1 12/04

Page 57

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Flash troubleshooting

Flash

programming

fault

Double check that

you have correct

SW. Does reflashing

succeed?

Check that flash

adapter's pins are not

Measure if BSI goes

damaged and phone is

low after flashing is

properly attached to the

started?

adapter. Does reflashing

succeed?

Does reflashing

even start?

Yes

OKYes

Phone fails to flash

Check for

EM troubles

Does the pc

recognize phone as

an usb device?

No help

Check APE

clocks and

reset section

No help

Go to USB

section

No help

SDRAM part

Wrong manufacturer

ID and device ID

Is the FBUS TX-line

high after startup?

This can be

measured from

module jig

Yes

Is PURX (J2800)

pulsed low?

Yes

Fault is in non-reworkable

Yes

component. Refer to current

BER handling guidance. (StUF

D2800 problem)

Measure if BSI

Fault is in non-reworkable component.

(battery connector

middle pin)goes low

after flashing is

started?

Yes

Refer to current BER handling

guidance. (StUF D2800 / UEMEK

D2200 problem).

Fault is in non-reworkable

component. Refer to current

BER handling guidance.

(UEMEK D2200 problem)

Yes

Try to flash again,

after a couple of

failed attempts go

to MDoc section

Go to CMT

troubleshooting

section

Is the internal FBUS

TX (J2809) set LOW

after PURX has

gone HIGH?

Yes

End (retest)

Fault is in non-reworkable

component. Refer to current

BER handling guidance. (StUF

D2800 problem)

Issue 1 12/04 COMPANY CONFIDENTIAL 57

Page 58

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ APE clock and reset troubleshooting

APE clocks

and reset check

Clk32k (R4810):

Voh ~ 2.8V &

f ~ 32.768kHz

square wave ?

Yes

12Mhz clock

(C4800,

OSC1_IN):

12MHz signal

present ?

Yes

SleepClk (J2802):

Voh ~ 1.8V &

f ~ 32.768kHz

square wave ?

Solder joints of

C4800, C4801,

C4802 and B4800

OK ?

Yes

Measure

resistance over

C4801.

R >>1M ?

Yes

Change V6031 and

C6038 if no faults are

Check R4810.

Replace D4801 if it

seems to be properly

soldered

Fault is in non-

reworkable

component. Refer to

current BER handling

guidance. (UEMEK

D2200 problem).

Check R6041, R6042, C6038, R6040, R6039, R6043, R6044, V6030, V6031.

found.

Fault is in non-

reworkable

component. Refer to

current BER handling

guidance. (OMAP

D4800 problem).

Measure

MPU_nRESET

from R4802.

Is it ~ 2.8V?

Yes

Check completed

Change B4800. If

this doesn't help,

change C4800,

C4801 and C4802.

Measure PURX

from J2800. Is it ~ 1.8V?

Yes

Still not working

Check R4802.

Replace N4800 if it

seems to be

properly soldered

58 COMPANY CONFIDENTIAL Issue 1 12/04

Page 59

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ CMT troubleshooting

CMT Check

Check that both

ends of L2330-

L2335 have VBAT

voltage

Yes

Chech BSI-line

including X2020,

C2015 and C2350.

Are they OK?

Yes

Measure voltages from

following components:

VANA C2216 2.78V

VIO C2885 1.8V

VCORE C2880 1.35V / 1.57V

VR3 L7500 2.78V

VFLASH1 C2220 2.78V

Voltages OK?

Yes

Measure ~32.7kHz

SleepClk J2802. Is it

OK?

C2002 and C2330-

Replace defect

Check L2330-

L2335. C2000-

C2335 Are they

OK?

Yes

components

Check if the voltage

lines have short

circuits to GND?

Check VBAT lines

connectorX2020 to

Yes

Replace defect

components

from battery

L2330-L2335

Find and replace

short circuited

component

Fault is in non-reworkable

component. Refer to current BER

handling guidance. (UEMEK D2200

problem).

Yes

Measure 26MHz

RFClk from R2902.

Is it OK?

Yes

Measure PURX

signal from R4802.

Is it ~2.8V?

Yes

Fault is in non-

reworkable

component. Refer

to current BER

handling guidance.

(StUF D2800 /

UEMEK D2200

problem).

Measure 26MHz

RFClk from

VCTCXO G7501 pin

3. Is it OK?

Measure PURX

signal from J2800.

Is it ~1.8V?

Check R4802.

Replace N4800 if it

seems to be

properly soldered

Yes

Replace VCTCXO

Check R2902 and

C2902. If OK,

change Honi N7500

G7501

Issue 1 12/04 COMPANY CONFIDENTIAL 59

Page 60

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

■ EM troubleshooting (APE)

Phone is in

module jig

Check SYNC/

MODE from R4202(both

sides), High?

YES

Check V15(1.57V), OK? C4203

YES

Check

V18(1.8V),

OK? C4211

YES

Faulty V4200, R4202, or

N4201. If all these are

connected, replace first

V4200 and R4202, next

enable(VFLASH1),

Check

enable(VIO),

high C4819

N4201.

Check

high C2220 1/2

If still doesn't help

YES

Check caps C4206-4209

YES

& C4211-4212. If OK,

change N4202 and

Check voltage at

L4201(both

sides), 0 V?

Change coil and

retest V15

retest, OK?

Fault is in non-reworkable

component. Refer to current

BER handling guidance. (OMAP D4800 proble m )

YES

Change SMPS

chip(N4201) and

retest, OK?

Shortcut in V15

line

Shortcut in

Check

V28(2.8V),

OK? C4202

YES

END

Check enable(VIO), high? C4819

YES

V18 line

If capacitors C4200-

C4202 seem to be ok

change V28

regulator(N4200) and

retest, OK?

Shortcut in V28

line

Fault is in non-reworkable

component. Refer to current

BER handling guidance.

(UEMEK D2200 problem)

60 COMPANY CONFIDENTIAL Issue 1 12/04

Page 61

RAE-6/RA-4 6 - Baseband Description and Troubleshooting Nokia Customer Care

■ Bluetooth troubleshooting

BT Check

Check RF

Connection to

JBT9. OK?

BER <= 0.1%Yes No

components (L6032,

L6031, C6046 and

C6049.

repeat BER test.

OK?

Check Vreg (2.8V)

from capacitor

C6036. Is it OK?

Yes

Check VDD_ANA

(1.8V) from

capacitor C6031.

Is it OK?

Yes

Check BC02 Xtal_in from

R6043.

Frequency 12Mhz, swing 400-

900mV.

OK?

Check regulator

N4200 (EM

troubleshooting)

Change BT ASIC

N6030

Yes

BT OK

Yes

Repeat BER

test. OK?

Yes

Check balun

T6030 and filter

Z6030.

Repeat BER test.

OK?

Yes

Check BT clock path from

APE clock and reset

trobleshooting

Issue 1 12/04 COMPANY CONFIDENTIAL 61

Page 62

RAE-6/RA-4

Nokia Customer Care 6 - Baseband Description and Troubleshooting

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62 COMPANY CONFIDENTIAL Issue 1 12/04