Nokia 9210 Service Manual 03_SYST

PAMS Technical Documentation

RAE-3 Series PDA

3. RF+System Module BL8

issue 1 06/01

Copyright  2001. Nokia Mobile Phones. All Rights Reserved.

RAE-3

PAMS

3. RF+System Module BL8

AMENDMENT RECORD SHEET

Amendment
Number

Date Inserted By Comments

06/01 OJuntunen

Technical Documentation

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CONTENTS –Troubleshooting

Abbreviations 3 – 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RAE-3 Structure 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RAE-3 Modules 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

List of Modules 3 – 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Summary of System Part 3 – 10. . . . . . . . . . . . . . . . . . . . .

Block Diagram 3 – 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Characteristics 3 – 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Supply 3 – 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System Connector 3 – 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Battery Connector 3 – 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Backup battery connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SIM card connector 3 – 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMC Connector 3 – 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Infrared interface 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UI Signals 3 – 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System – RF interface 3 – 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3. RF+System Module BL8

Page No

Functional Description 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Modes of Operation 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Clocking Scheme 3 – 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Control and Reset 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Distribution 3 – 26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power up 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power Off 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charging 3 – 28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Resets and Watchdogs 3 – 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

System to interface 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

CPU block 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MEMORIES block 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

XIP Memories 3 – 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SDRAM Memory 3 – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Serial Flash Memory 3 – 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MMC block 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IRDA block 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

UI block 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Phone LCD Interface 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Keyboard Interface 3 – 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Earpiece and HF Speaker lines 3 – 34. . . . . . . . . . . . . . . . . . . . . .

Battery removal signal 3 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SYSCON block 3 – 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Serial connections 3 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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External Audio Interface 3 – 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charger Interface 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

External RF 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

POWER block 3 – 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Use of CCONT ADC channels 3 – 37. . . . . . . . . . . . . . . . . . . . . . .

AUDIO_RFI block 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RFI 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Audio 3 – 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Introduction to RF of BL8 3 – 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Maximum ratings 3 – 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF frequency plan 3 – 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DC characteristics 3 – 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Regulators 3 – 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Control signals 3 – 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.7 V regulator in VCP line 3 – 42. . . . . . . . . . . . . . . . . . . . . . . . . .

Power distribution diagram 3 – 43. . . . . . . . . . . . . . . . . . . . . . . . . .

Technical Documentation

RF characteristics 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter characteristics 3 – 44. . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver characteristics 3 – 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Functional descriptions 3 – 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF block diagram 3 – 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Frequency synthesizer 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmitter 3 – 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AGC strategy 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AFC function 3 – 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Antenna switch 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SWITCH (SW_1, SW_2) 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX–FILTERS 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX–FILTERS 3 – 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Receiver blocks 3 – 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RX EGSM900/DCS1800 DUALBAND SAW FILTER 3 – 51. . . .

EGSM Pre–amplifier (LNA) 3 – 51. . . . . . . . . . . . . . . . . . . . . . . . . .

DCS1800 Pre–amplifier (LNA) 3 – 52. . . . . . . . . . . . . . . . . . . . . . .

GSM/PCN IC (Hagar), RX part 3 – 52. . . . . . . . . . . . . . . . . . . . . . .

Transmitter blocks 3 – 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IQ–modulator and TX–AGC in HAGAR IC 3 – 53. . . . . . . . . . . . .

EGSM TX saw filter 725057 3 – 53. . . . . . . . . . . . . . . . . . . . . . . . .

Diplexer 3 – 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TX–buffer and 3dB attenuator 3 – 54. . . . . . . . . . . . . . . . . . . . . . . .

Dual–band power amplifier 3 – 54. . . . . . . . . . . . . . . . . . . . . . . . . .

Directional coupler 3 – 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power detector 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Synthesizer blocks 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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VCTCXO, reference oscillator 3 – 56. . . . . . . . . . . . . . . . . . . . . . . .

SHF PLL in HAGAR 3 – 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

VCO module 3 – 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Connections 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Antenna 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

RF connector and antenna switch 3 – 58. . . . . . . . . . . . . . . . . . . . . .

RF–System interface 3 – 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Timings 3 – 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Transmit power Timing 3 – 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Synthesizer clocking 3 – 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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Abbreviations

ACCIF ACCessory InterFace block of MADLinda
A/D Analog–to–Digital
ADC Analog–to–Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
AMM ARM MegaModule
API ARM Port Interface in LMM
ARM Advanced RISC Machines
ASIC Application Specific Integrated Circuit
AVG Average
BB Baseband
BGA Ball Grid Array package
bl8 RAE-3 System/RF module
BLL–3 Litium–Ion battery back for RAE-3
CCONT Multifunction power management IC for DCT3

CCR Clock Configuration Register in MADLinda
CHAPS DCT3 Charging control ASIC – used in bl8 system HW
CMT Cellular Mobile Transceiver
COBBA DCT3 RF–interface and Audio codec IC
COBBA_GJP Serial control interface version of COBBA

CRFU3 UHF RF IC – used in bl8 RF HW
CSD Card–specific Data, register in MultiMediaCards
CSP Chip Scale Package
CTSI Clocking, Timing, Sleep & Interrupt block of MADLinda
D/A Digital–to–Analog
DAC Digital–to–Analog Converter
DCD Data Carrier Detect
DCE Data Communication Equipment
DCT3 3rd generation Digital Core Technology
DNL Differential non–linearity
DMA Direct Memory Access
DL2 RAE–3 Color UI module
DSP Digital Signal Processor
DTMF Dual Tone Multi Frequency
DTR Data Terminal Ready
EAD External Accessory Detect
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
ESD Electrostatic Discharge
FBUS Full Duplex Serial Bus in NOKIA’s phones
FFS Flash File System
GPIO General Purpose Input/Output (block in MADLinda)

Technical Documentation

– used in bl8 system HW

– used in bl8 system HW

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HAGAR Direct conversion RF ASIC – used in bl8 RF HW
HF Hands Free
HSCSD High Speed Circuits Switched Data
HW Hardware
IC Integrated Circuit
ICE In–Circuit Emulator
INL Integral non–linearity
IO Input/Output
IR Infrared
IrDA Infrared Data Association
JTAG Joint Test Action Group, commonly used as a synonym

LCD Liquid Crystal Display
LEAD Low power Enhanced Architecture DSP
LEAD2 Digital Signal Processor block of MADLinda
LMM LEAD2 MegaModule – DSP module in MADLinda
MAD MCU+ASIC+DSP chip (MCU–ASIC–DSP)
MAD2 GSM version of MAD
MAD2PR1 A pin reduction version of the MAD2
MAD2WD1 High Speed Data version of MAD2 by Wireless Data
MADLinda MAD based version of RAE-3 Communicator ASIC
MBUS 1–wire half duplex serial bus in NOKIA’s phones
MCU Micro Controller Unit
MFI Modulator and filter interface in MAD2
MMC MultiMediaCard
MMU Memory Management Unit
MPU Micro Processor Unit

NTC Negative Temperature Coefficient (resistor)
PCI Phone Control Interface
PCM Pulse Code Modulation
PCR Pin Configuration Register in MADLinda
PDA Personal Digital Assistant
PHF Personal Hands Free
PLL Phase Locked Loop
PMM Permanent Memory Management block (Plato UI)
PPM Post Programmable Memory
PUP PIO, USART and PWM block of MADLinda
PWB Printed Wiring Board
PWM Pulse Width Modulation
R&D Research and development
RAM Random Access Memory
RF Radio Frequency
RFI RF Interface
ROM Read Only Memory
RTC Real Time Clock
SCU Synthesizer Control Unit

3. RF+System Module BL8

for boundary scan (IEEE 1149.1) testing

– in text refers to MADLinda’s ARM9 processor

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3. RF+System Module BL8

SCR System Configuration Register in MADLinda
SDRAM Synchronous Dynamic RAM
SIM Subscriber Identify Module
SIMIF Subscriber Identify Module Interface
SIR Serial Infrared (speed 115.2kbit/s)
SPI Serial Peripheral Interface
Spock Second generation communicator RAE–2
SSR System Status Register in MADLinda
SUMMA VHF RF IC – used in bl8 RF HW
SW Software
TAP Test Access Port (Boundary Scan)
TI Texas Instruments
TVS Transient Voltage Suppressor
UART Universal Asynchronous Receiver Transmitter
USART Universal Synchronous/Asynchronous Receiver

Transmitter
UI User Interface
UI1 RAE-3 Black&White UI module
VCTCXO Voltage Controlled Temperature Compensated Oscillator
VCXO Voltage Controlled Oscillator
VIA Versatile Interconnection Architecture (inside MADLinda)
WD1 Wireless Data Engine 1
XIP Execute In Place (memory)
(TBC) (To be checked)
(TBD) (To be defined)

Technical Documentation

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RAE-3 Structure

This document specifies the system HW part of RAE–3 GSM900/GSM1800
Dual Band Communicator. The BL8 module contains both the system hard­ware and the RF components. The system part of the BL8 module functions as
a combined CMT baseband and PDA engine.

RAE-3 Modules

DL2 – Color UI module

3. RF+System Module BL8

UL8 QWERTY –flex module

Audio
holder

MIC

BL8
SYSTEM/RF
module

Lithium
Battery
BLL–3
(Li–Ion)

Figure 1. RAE–3 modules

Battery
removal
switch

Ear–
piece

HF
speaker

List of Modules

Table 1. List of submodules

Name of module Type code Material

code

RF&System BL8 0201278 GSM phone + PDA module, European FLASH mem
User Interface DL2 0201282 PDA + CMT displays, Colour LCD
Keyboard and Hinge flex UL8 0201667 Audio PWB and connectors
MRAE3 0261997 Mechanical assembly parts , no language dependent

parts

Notes

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Technical Summary of System Part

The RAE-3 system hardware is based on a special version of the DCT3 MAD2
ASIC called MADLinda. MADLinda carries out all the signal processing and op­eration controlling tasks of the phone as well as all PDA tasks. To be able to run
simultaneously both CMT and PDA applications, MADLinda (ROM1) has a
52MHz ARM9 core.

MADLinda’s main blocks include: ARM925 MPU Subsystem, Traffic Controller
(TC), LEAD2 DSP megamodule (LMM), GSM System Logic and PDA peripher­als. ARM925 MPU Subsystem includes ARM9TDMI core, data and instruction
caches, data and instruction memory management units (MMU) and write and
address buffers. Traffic Controller includes primary DMA controller, LCD con­troller and Flash and SDRAM memory interfaces. The System Logic of MAD2 is
able to support high speed data features (HSCSD). PDA peripherals include
interfaces for Serial Flash, MMC, IrDA, serial port, IOs and PWMs.

In addition of the MADLinda IC the system hardware includes memories, in­frared transceiver, COBBA_GJP, CCONT and CHAPS ASICs, audio amplifier
and power regulators. CSP packages are used for all ASICs. System HW also
has connectors for MultiMediaCard (MMC) and SIM card, UI connector and
pads for system connector’s spring contacts.

Technical Documentation

Three XIP Flash devices are used for program code storage. A serial Flash de­vice is used half for the Flash file system and half to save application code. A
synchronous DRAM (SDRAM) device is used as data memory. Code can also
be run from the SDRAM. This is used to run applications loaded from Serial
Flash or MultiMediaCard.

The main battery voltage range in RAE-3 is 3.0V to 4.2V. Battery charging is
controlled in SW using CCONT and CHAPS ASICs. RAE-3 can also supply 3
V(max 100mA) accessory voltage out from system connector.

The system electronics run from a 2.8V power rail. 1.8V is used as core voltage
inside MADLinda and as I/O voltage for XIP Flash memory interface.

Power supplying of the BL8 module, both system HW and RF, and also 2.8V
supplying for the UI module is carried out in system HW. A linear regulator is
used to generate 2.8V VBB voltage and a DC/DC converter is used to generate
the 1.8V Vcore voltage. Accessory voltage and MMC supply are generated with
separate 3V linear regulators. Other supplies are generated using the CCONT
power ASIC (4.7V needed in DCT4 RF is generated in RF side). CCONT gen­erates also the main reset for the system.

Both 3V and 5V Plug–in SIM–cards are supported. SIM is interfaced through
CCONT, which does signal level shifting and generates correct supply voltage
for SIM.

A real time clock function is integrated into CCONT, which utilizes the same
32kHz clock supply as the sleep clock. A rechargeable backup battery provides
backup power to run the RTC when the main battery is removed. The backup
time is about 10 days. Note also the information in section 8 chapter 2.6.

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The interface from the system part and the RF and audio sections is handled
by a specific ASIC COBBA_GJP. This ASIC provides A/D and D/A conversion
of the in–phase and quadrature receive and transmit signal paths and also A/D
and D/A conversions of received and transmitted audio signals. Data transmis­sion between the COBBA_GJP and the MADLinda is implemented using serial
connections. Digital speech processing is executed by the MADLinda ASIC.

External audio is connected to RAE-3 through system connector’s XMIC and
XEAR lines.

Serial connection channels in RAE-3 include IrDA, MBUS, and serial port.
MBUS and serial port have logic level signals which are connected through sys­tem connector. IR transceiver is next to the system connector at the bottom end
of RAE-3 device.

Block Diagram

SERIALFLASH

SDRAM

XIP MEMORIES

FLASH

3. RF+System Module BL8

MULTI

MEDIA

CARD

CONNECTOR

UI

CONNECTOR

UI SIGNALS

AUDIO

(EARP,

SPEAKER)

AUDIO

AMP

PCM

CODEC

MIC

COBBA

PDA
PERIPHERALS

_GJP

AUDIO

MADLINDA

_RFI

RFI

ARM925
MPU
SUBSYSTEM

TRAFFIC
CONTROLLER

32

CCONT

KHZ

XTAL

SYSTEM
LOGIC

ACK UP

B
BATTERY

VBB
REG.

SYSTEM SUPPLIES

LMM

(DSP)

VCORE

REG.

CHAPS

VMMC

REG.

ACCPWR

REG.

HALL

SENSOR

IRDA

SYSTEM

CONNECTOR

SERIAL
INTER­FACES

EXTERNAL
AUDIO

EXTERNAL
RF

CHARGER

POWER

BATTERY

CONNECTOR

SIM

CARD

CONNECTOR

SYS

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RF SIGNALS

Figure 2. RAE-3 SYSTEM PART BLOCK DIAGRAM

RF SUPPLIES

RF

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Electrical Characteristics

Power Supply

Table 2. Operating voltages and power consumptions

Name Parameter Min Typ Max Unit Notes

VIN Voltage 3.4 18 V Charging voltage

VBATT Voltage 3.0 3.6 4.8 V Voltage directly from main battery –to Vcore

450 mA typical for whole bl8

VB Voltage 3.0 3.6 4.8 V Filtered battery voltage

VB_CCONT Voltage 3.0 3.6 4.8 V Filtered battery voltage

VBB Voltage

Current

FLVPP Voltage

2.74 2.8 2.86 V System HW supply voltage,
45 400 mA typ. measured, max available from regulator

0 2.8 V Connected to MADLinda IO in assembled de-

req. and RF part,

– to VBB req. and to UI

– to CCONT and audio HF amplifier

vise. Functions as program enable in 2.8V .

Current

Vcore Voltage

Current

VMMC Voltage

Current

VACC Voltage

Current

VSIM Voltage 4.8 5.0 5.2 V Voltage to SIM, 5V selected

Current 3 10 30 mA 2)
Voltage

Current

VCOBBA Voltage

Current

VXO Voltage

Current

VRX Voltage

Current

VSYN_1 Voltage

Current

VSYN_2 Voltage

Current

VTX Voltage

Current

1.7 1.8 1.9 V Core voltage

2.74 3.0 3.1 V MMC supply voltage

3.03 3.3 3.4 V Accessory supply voltage output

2.8 3.0 3.2 V Voltage to SIM, 3V selected
1 6 30 mA 2)

2.7 2.8 2.85 V COBBA_GJP analog supply (CCONT VR6)

2.7 2.8 2.85 V

2.7 2.8 2.85 V

2.7 2.8 2.85 V

2.7 2.8 2.85 V

2.7 2.8 2.85 V

36 uA Takes flashing current form Vcc pin

– to MADLinda and XIP Flash IF

70 300 mA typ. measured, max available form regulator

100 mA max supported consumption level

100 mA max current out

(CCONT VSIM)

15.7 mA current during call, 4)
To RF (CCONT VR1)

63 mA

63 mA

63 mA

50 mA

63 mA

Available from CCONT, 4)
To RF (CCONT VR2)

Available from CCONT, 4)
To RF (CCONT VR4)

Available from CCONT, 4)
To RF (CCONT VR3)

Available from CCONT, 4)
To RF (CCONT VR5)

Available from CCONT, 4)

Page 3 – 12

issue 1 06/01

PAMS

CTRL

RAE-3

Technical Documentation

Table 2. Operating voltages and power consumptions (continued)

VCP Voltage

Current

VREF V oltage 1.478 1.500 1.523 V Reference voltage to COBBA_GJP and RF

Current 150 A Available from CCONT ,
Current 36 A Consumption in system HW

4.8 5.0 5.2 V
30 mA

3. RF+System Module BL8

NotesUnitMaxTypMinParameterName

To RF (CCONT V5V)
Available from CCONT, 2)

(VREF_2) (CCONT VREF)

2) VCP and VSIM together max 30mA

4) Total current from CCONT VR1–VR6 max 330mA rms

System Connector

Table 3. Electrical characteristics of the system connector (X450) signals

Pin Name Parameter Min Typ Max Unit Notes

1 L_GND 0 0 0 V Supply ground
2 VIN Voltage in

Current in

Voltage in

Current in
Voltage in

Current in

3 CHRG_

4 SGND

5 XEAR

Output LOW 0 0.5 V Charger control (PWM) low

Output HIGH 2.4 2.85 V Charger control (PWM) high

PWM Frequency 32 Hz fast charger connected

PWM duty cycle 1 99 %

Output resistance 22 kΩ

Output AC imped-

ance

Series output capaci-

tance

Resistance to phone

ground

Output AC imped-

ance

Series output capaci­tance

Load AC impedance 16 300 Ω ref. to SGND (Headset)
Load AC impedance 4.7 10 kΩ ref. to SGND (Accessory)

Max. output level 1.8 Vpp no load

Load DC resistance 10 kΩ ref. to SGND (Accessory)
Load DC resistance 16 1500 Ω ref. to SGND (Headset)

DC voltage 2.8 V 44k pull–up to VBB

Earphone signal 0 70 630 mVrms HF–HFCM from COBBA_GJP HF

6.8

8.5 10.0

7.8 8.8

350

47 Ω ref. to GND

10 µF

330 Ω

47 Ω ref. to GND

10 µF

30

1.5

850

14.0 VmAUnloaded Standard Charger (ACP–7)

VACHAPS’ absolute max. input voltage

Fusing current

VmAUnloaded Fast Charger (ACP–9,

LCH–9)
Charging current

Charging current

output

issue 1 06/01

Page 3 – 13

RAE-3

PAMS

3. RF+System Module BL8

Table 3. Electrical characteristics of the system connector (X450) signals (continued)

6 XMIC

7 MBUS Output LOW 0 0.22*VBB V Open drain output

8 DCE_TX

9 DCE_RX

10 DCE_DTR

11 GND 0 0 V Supply ground
12 RF_GND
13 RF_INTER-

NAL

14 RF_COM-

MON

15 RF_GND

Input AC impedance 2.2 kΩ

Max. input signal 1 Vpp

Output DC level 1.47 1.55 V Accessory muted (not for headset)
Output DC level 2.5 2.8 V Accessory unmuted

Bias current 100 600 µA

Output LOW current 2 mA

Pullup resistance 4.7 kΩ to VBB

Series resistance 270 Ω

Input LOW 0 0.3*VBB V

Input HIGH 0.7*VBB VBB V

Input LOW 0 0.3*VBB V To AccRxData

Input HIGH 0.7*VBB VBB V 220kΩ Pullup to VBB in bl8

Series resistance 270 Ω

Output LOW 0 0.22*VBB V From AccTxData

Output HIGH 0.8*VBB VBB V 47kΩ Pullup to VBB in bl8

Output current 4 mA

Series resistance 270 Ω

Input LOW 0 0.3*VBB V

Input HIGH 0.7*VBB VBB V

Series resistance 270 Ω

Technical Documentation

Data T erminal Ready input
Internal pullup max. 140mA

Accessory power output – refer to
VACC in NO TAG

To internal antenna – defined in RF
spec NO TAG

From RF – defined in RF spec
NO TAG

NotesUnitMaxTypMinParameterNamePin

Battery Connector

Table 4. Battery Connector (X100) Electrical Specifications

Pin Name Min Typ Max Unit Notes

1 VBATT 3.0 3.6 4.2 V Battery voltage

4.8 V Maximum voltage with charger

2 BSI

Page 3 – 14

0 2.8 V Battery size indication

System HW has 100kW 5% pull up resistor.

Battery removal detection (shorter contact)

(Threshold is 2.4V@VBB=2.8V)
221% kW Service battery pull down value
685% kW 4.2V Li–Ion battery pull down value

issue 1 06/01

PAMS

RAE-3

Technical Documentation

3. RF+System Module BL8

Table 4. Battery Connector (X100) Electrical Specifications (continued)

NotesUnitMaxTypMinNamePin

3 BTEMP

4 BGND 0 0 V Battery ground – connected directly to system HW GND

0 1.4 V Battery temperature indication

Phone has 100k 5% pull–up resistor,

Battery package has NTC pull down resistor:

@+25C 47k 5%, B=40503%

0 1 kW Fast power up (in production)

Backup battery connector

Table 5. Backup battery connector X102

Pin Name Min Typ Max Unit Notes

1 VBACK IN 2.82 3.15 3.28 V Backup battery voltage from CHAPS

2 VBACK

OUT

1.8 3.3 V Backup battery voltage to CCONT/VBACK

@ Ibackup = 100mA

(not specified in CCONT spec)

VBACKIN and VBACKOUT are connected together in back up battery’s positive
terminal.

Table 6. Microphone contacts

Pin Name Min Typ Max Unit Notes

1 MICP 0.1 Vpp Pad P200
2 MICN 0.1 Vpp Pad P201

0.2 Vpp MICP–MICN differential voltage range

2.0 2.1 V MICP, MICN biasing output level

SIM card connector

Only Plug–in SIM (small SIM) cards are supported.

Table 7. SIM Connector (X101) Electrical Specifications

Pin Signal

Name

4 GND GND GND 0 0 V Ground
3 VSIM VCC (C1) Supply V oltage

6 SIM–DATA

SIM Con-

tact

Type

I/O (C7) Vout HIGH

I/O

Parameter Min Typ Max Unit Notes

Supply Voltage

Vout HIGH

Vout LOW

Trise/Tfall

Series Resistance

4.8

2.8

4.0

2.8
0

5.0

3.0

100

5.2

3.2

VSIM
VSIM

0.4
1

V
V

V
V
V

mS

W

5V SIM Card
3V SIM Card

5V SIM Card

3V SIM Card
3V/5V SIM Card
3V/5V SIM Card

(Vin not defined in CCONT

specification )

issue 1 06/01

Page 3 – 15

RAE-3

PAMS

3. RF+System Module BL8

Table 7. SIM Connector (X101) Electrical Specifications (continued)

Signal

Pin

Name

Type

2 SIMRSTORST (C2) Vout HIGH

1 SIMCLK CLK (C3) Vout HIGH

5 VSIM VPP (C6) Supply Voltage

tact

Vout HIGH

Vout LOW

Trise/Tfall

Series Resistance

Vout HIGH

Vout LOW

Frequency

Trise/Tfall

O

Series Resistance

Supply Voltage

4.0

2.8

4.0

2.8

4.8

2.8

100

3.25

47

5.0

3.0

Technical Documentation

NotesUnitMaxTypMinParameterSIM Con-

VSIM
VSIM

0.4

100

VSIM
VSIM

0.4

25

5.2

3.2

V
V
V

ns

W

V
V
V

MHz

ns

W

V
V

5V SIM Card

3V SIM Card
3V/5V SIM Card
3V/5V SIM Card

5V SIM Card

3V SIM Card
3V/5V SIM Card

3V/5V SIM Card
3V/5V SIM Card

Programming voltage,

pin5 and pin3 tied together

MMC Connector

Table 8. MMC Connector Electrical Specifications

Pin Signal

Name

7 MMCDa

6 GND 6 / VSS2 0 0 V Ground
5 MMCClk

4 VMMC 4 / VDD powered on

3 GND 3 / VSS1 0 0 V Ground
2 MMCCmd

MMC Con-

tact

Type

7 / DAT[0] Output HIGH

I/O

5 / CLK Output HIGH

O

2 / CMD Output HIGH

I/O

Parameter Min Typ Max Unit Notes

Output LOW

Input HIGH
Input LOW

Series Resistance

Output LOW

Frequency

Series Resistance

powered off

Current

Output LOW

Input HIGH
Input LOW

Series Resistance

2.1

2.1

100

2.1

0

100

2.76 3.0 3.1

2.1

2.1

100

2.9

0.65

3.1

0.8

2.9

0.65
13

0

100

2.9

0.65

2.9

0.8

V
V
V
V

W

V
V

MHz

W

V

mA

V
V
V
V

W

There is 100kΩ Pullup to

VMMC in bl8

Supply voltage

Supply Current

Command/Response

There is 10kΩ Pullup to

VMMC in bl8

Data

Clock

Note: There is no pin 1 in connector

Page 3 – 16

(Not connected in MultiMediaCard mode; SPI mode not supported

issue 1 06/01

PAMS

(P

IO)

RAE-3

Technical Documentation

3. RF+System Module BL8

Infrared interface

– IrDA and HP–SIR compatible
– Data rates from 9600bits/s to 115kbits/s
– Transmitter wavelength: min 880nm, max 900nm

UI Signals

Table 9. UI Connector

Pin Signal Name

Type

27,

VB Main
28,
29

15 FLVPP

not UI signal

16 VPROG

not UI signal
17 VBB 2.7 2.85 2.9 V Supply voltage
1,

GND 0 0 Supply ground
8,
21,
25,
30,
34,
41,
66,
70

49 COL0 MADLinda

62 COL1

60 COL2

35,59COL3

33,54COL4

55 COL5

56 COL6

61 COL7

53 COL8

From/To Parameter Minimum Nomi-

battery

Flash Vpp pins 15 and 16 con-

MADLinda
(Prog_IO)

Output high ”1” 0.8*VBB V
Output low ”0” 0.22*VBB V
Output current 2 mA
Input high ”1” 0.7*VBB V
Input low ”0” 0.3*VBB V
Series resistance 200

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

(Refer to COL0) Keyboard column

I/O

I/O

I/O

I/O

I/O

I/O

I/O

I/O

I/O

rog_

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

3.0 4.8 V Battery voltage

Maximum Unit Function

nal

nected in UL8

pins 15 and 16 con­nected in UL8

Keyboard column

W

issue 1 06/01

Page 3 – 17

RAE-3

(P

IO)

63

(Prog_IO /

Command/Data select

(GPIO)

PAMS

3. RF+System Module BL8

Pin

Type

51 COL9

50 ROW0

69 ROW1

67 ROW2

65 ROW3

64 ROW4

ROW5LCDCD

32,

I/O

I/O

I/O

I/O

I/O

I/O

MADLinda
(Prog_IO)

MADLinda

rog_

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda

Technical Documentation

Table 9. UI Connector (continued)

MinimumParameterFrom/ToSignal Name

(Refer to COL0) Keyboard column

Output high ”1” 0.8*VBB V Keyboard row
Output low ”0” 0.22*VBB V
Output current 2 mA
Input high ”1” 0.7*VBB V
Input low ”0” 0.3*VBB V
Series resistance 200

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

Output high ”1” 0.8*VBB V

nal

W

FunctionUnitMaximumNomi-

Serial LCD driver

57 ROW6

68 ROW7

58 ROW8

52 ROW9

42 BATT_REM

I/O

I/O

I/O

I/O

I/O

I

UIF)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda
(Prog_IO)

MADLinda

Output low ”0” 0.22*VBB V
Output current 2 mA

Input high ”1” 0.7*VBB V Keyboard row
Input low ”0” 0.3*VBB V
Series resistance 200

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

(Refer to ROW0) Keyboard row

Input high ”1” 0.7*VBB V Battery removal switch
Input low ”0” 0.3*VBB V
Series resistance 200

W

W

Page 3 – 18

issue 1 06/01

PAMS

(

)

O

(),

()

(UIF)

(Ph

LCD)

(UIF)

(Ph

LCD)

(PWM)

l

(PWM)

backligh

l

(GPIO)

l

(GPIO)

RAE-3

Technical Documentation

Pin

Type

11

GenSClk

9

GenSDIO MADLinda

MADLinda

UIF),
(and to
CCONT)

O

3. RF+System Module BL8

Table 9. UI Connector (continued)

MinimumParameterFrom/ToSignal Name

Output high ”1” 0.8*VBB V

Output low ”0” 0.22*VBB V

Output current 2 mA
Frequency 0 3.25 MHz 3.25MHz during

Series resistance 200
Output high ”1” 0.8*VBB V

Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

nal

W

W

FunctionUnitMaximumNomi-

Serial LCD driver
clock (Phone LCD

Phone LCD access,

2.17MHz during
CCONT access

Serial LCD driver data

one

12

LCDEN MADLinda

10

LCDPWM MADLinda

31

BACKPWM MADLinda

6

LCD_PWR MADLinda

Output high ”1” 0.8*VBB V

O

O

O

O

Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

Output high ”1” 0.8*VBB V
Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

Frequency 0 50.7
Output high ”1” 0.8*VBB V

Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

Frequency 0 231

Output high ”1” 0.8*VBB V
Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

Serial LCD driver chip
select

W

PWM for PDA LCD
contrast contro

W

kHz

PWM for PDA LCD

W

Hz

PDA LCD power con­tro

W

one

t contro

14

issue 1 06/01

LCDRSTX MADLinda

O

Output high ”1” 0.8*VBB V Phone LCD reset
Output low ”0” 0.22*VBB V
Output current 2 mA
Series resistance 200

W

Page 3 – 19