INOTE : Since both D200 (UEM) and D400(UPP) are underfilled, they can not be replaced. If
either D200 or D400 is defective, the whole PWB has to be discarded.
The flash programming can only be done via the pads on the PWB (J396).
In case of Flash failure in FLALI station, problem is most likely related to SMD problems. Pos-
sible failures could be short-circuit of balls under µBGAs (UEM, UPP, FLASH). Missing or misaligned components.
In flash programming error cases the flash prommer can give some information about a fault.
The fault information messages could be:
- Phone doesn't set FBUS_TX line low
Because of the use of uBGA components it is not possible to verify if there is a short circu it in
control- and address lines of MCU (UPP) and memory (flash).
If this kind of failure is presenting itself immediately after FLALI, it is most likely caused by
ASICs missing contact with PWB.
If for some reason the MCU does not service the watchdog register within the UEM, the operations watchdog will run out after approximately 32 seconds. Unfortunately , the service routine
can not be measured.
This error can only happen at power up where several self-tests is run. If any of these test cases
fails the display will show the message: "Contact Service".
It's individual test cases so the below lineup of error hunting's has no chronological order . Use
common sense and experience to decide which test case to start error hunting at.
Figure 6:Troubleshooting when Contact Service message seen
Display shows
"Contact Service"
Yes
EarDa & MicDa
between
UPP and UEM?
MBUS interface
between
UPP and UEM?
AuxDa & UEMInt
between
UPP and UEM?
SleepX & SleepClk
between UPP & UEM?
TXI/QD & RXI/QD?
SIM interface between
UPP & UEM
No
Check :
PWB.
Else defective D200*
or D400*
Key is stucked
Flash checksum
yASIC version vs. compilation flag, PMM checksum
yPMM validity
yWarrenty Information State
ySIM-Lock
■ The phone does not register to the network, or the phone cannot make a call
If the phone doesn't register to the network, the fault can be in either BB or RF . Only few signals
can be tested since several signals is 'burried' in one or more of the inner layers of the PWB.
First of all check that SIM LOCK is not causing the error by using a Test-SIM card and connect
the phone to a tester.
All checks can be done while the phone is partially disamsembled (no need for full reasembly
inbetween debugging steps):
SIM failure (including insert SIM faults)
1. Flex B2B connector pressed in?
2. Change LCD can assembly (for new flex) works?
3. C314 (VSIM cap) short circuitting?
4. C313 (SIMIO cap) short circuitting?
5. Voltages (SIM startup sequence)? Board to Board connector pin17
6. Change main PWB (UEM)?
The hardware of the SIM interface from UEM (D200) to the SIM co nnector can be teste d wit hout a SIM card. When the power is switched on the phone first check for a 1,8V SIM card and
then a 3V SIM card. The phone will try this four times, whereafter it will display ”Insert SIM
card”.
VSIM – Board to board connector pin 17
Reset – Board to board connector pin 29
Clock – Board to board connector pin 20
Data – Board to board connector pin 19
The error ”SIM card rejected” means that the A TR message received from SIM card is corrupted, e.g. data signal levels are wrong. The first data is always ATR and it is sent from card to
phone.
For reference a picture with normal SIM power-up is shown below.
Three types of measurements are used in the following. It will be specified if the measurement
type is "RF" “RF test” or "LF".
•RF measurements should be done with a GSM tester and a suitable connector to
the general RF input/output. That connection is for tun ing a nd te sting the whole RF
in the phone.
•RF test measurements should be done with a Spectrum Analyzer and a high-frequency 500ohm passive probe, for example HP54006A. Use some sort of DC blocking device, to avoid loading the circuit or the SPA with DC. (Note that when
measuring with the 500ohm probe, the signal will be around 20 dB attenuated. The
values in the following will have these 20 dB subtracted and represent the real value
seen on the spectrum analyzer).
•LF (Low frequency) and DC measurements should be done with a 10:1 probe and
an oscilloscope. The probe used in the following is 10MΩ/8pF passive probe . If using another probe then bear in mind that the voltages displayed may be slightly different.
Always make sure the measurement set-up is calibrated when measuring RF parameters on
the antenna connector. Remember to in clude the loss in the module rep air jig and the coaxial
cable when realigning the phone.
Most RF semiconductors are static discharge sensitive. So ESD prot ection must be taken
during repair (ground straps an d ESD soldering irons). Mjoelner is mo isture sensitive so parts
must be pre-baked prior to soldering.
Apart from key-components described in this document there are a lot of discrete components
(resistors, inductors and capacitors) for which troubleshooting is done by checking if soldering
of the component is done properly or checking if the component is missing from PCB. Capacitors can be checked for short-circuit and resistors for value by means of an ohmmeter, but be
aware in-circuit measurements should be evaluated carefully.
In the following both the name “low band” will be used to describe both GSM850 - EGSM and
GSM900, while “high band” will be used for both PCN and GSM1800.
In the following general desriptions different colours are used in the block diagram. The Lowband signal route is shown in red, the Highband route in green and the common signal lines
are shown in blue.
■ Receiver signal path
The signal from the antenna pad is routed to the Front End Module (FEM - N700). The FEM
contains a diplexer and a switch system controlling the direction of the signals, either routing
the TX signal from the Power Amplifier (P A) to the anten na or routing the received signal from
the antenna to either the Lowband (850/900 MHz) or the Highband (1800/1900 MHz) input on
the RF IC (N600).
Figure 14:Receiver signal path
Rx
Ant
Diplexer
RX/TX switch
PA and detector
GSM RX
PCS RX
supply
F
X
R
D
D
V
LNABias
INMH
INPL
INML
INPM
INMM
INPH
ASIC
LNA
LNA
LNA
Pre-gain
Pre-gain
SAW
RX850/
900
SAW
RX1800/
1900
filter
222
2
1/21/4
Mjølner
BBAMP
BBAMP
B
B
X
R
D
D
V
BIQUAD
DCN1
LPF1
DCN1
LPF1
AGC
AGC
LPF2
BIQUAD
LPF2
DCN2
DCN2
VRX
RXIP
RXIM
RXQP
RXQM
VR6
1/4
1/2
The Lowband signal from the FEM is routed to the SAW filter (Z602). The purpose of the SA W
filter is to provide out-of band blocking imummity and to provide the LNA in Mjoelner (N600)
with a balanced signal. The front end of Mjoelner is divided into a LNA and Pre-Gain amplifier
before the mixers.
The output from the mixer is fed to Baseband part of Mjoelner where the signals amplified in
the BBAMP aand low pass filteret in LPF1 before the DC compensation circuits in DCN1. The
DCN1 output is followed by a controlled attenuator and a se cond lowp ass filter LPF2. The ou tput from LPF2 is DC centeret in DCN2 before being feed to the BB for demodulation.
The Highband signal chain is similar to the lowband.
■ Transmitter signal path
The I/Q signal from the BB is routed two the modulators for both Lowband and Highband. The
output of the modulators is either terminated in a SA W filte r (Z603) for the Lowb and or a balun
for the Highband. The signals from the SAW and Balun are then amplified in the Power Amplifier (PA) located in the Front End Module (FEM - N700) where the gain control t akes place. In
order to control the TX level a sample of the signal is taken in the FEM and used in the power
loop amplfier in Mjoelner to establish the right output power. The selection of which amplifier
chain in the FEM to be active is controlled through the 4 controllines VC1, VC2, BS and Vtx.
Figure 15:Transmitter signal path
Ant
Diplexer
RX/TX switch
PA and detector
Vapc
Vsense
VC1 (TX/RX GSM)
VC2 (TX/RX DCS)
VTX
Band sel
PCN/PCS
GSM
PCN/PCS
Balun
VTX
SAW
PW-loop
filter
VPCTRL_G
VANTL
VANTM
VANTH
VB_DET
VTXLOL
VTXLOH
VTXBH
VTXBL
OUTHP
OUTHM
OUTLP
OUTLM
DET
PLFB1
PLFB2
ASIC
RF Controls
RF Controls
Open collector
Open collector
VDDDIG
VDDRXBB
PWC
TXP
Mjølner
1/2
1/2
2
TXC
VDDTX
Supply
filter
1/4
1/4
2
2
2
2
2
VTX
TXQP/TXQM
VBATTRF
VR2
TXC
TXP
TXIP/TXIM
■ PLL
The PLL supplies Local Oscillator (LO) signals for the RX and TX-mixers. In order to be able
to generate LO-frequencies for the required EGSM and PCN channels a regular synthesizercircuit is used. All blocks for the PLL except for the VCO, reference X-tal and loopfilter is lo cated
in the Mjoelner IC, N600.
The reference frequency is generated by a 26MHz V olt age Controlled X-tal Oscillator (VCXO)
located in the Mjoelner IC. Only the X-tal is external. 26MHz is supplied to BB where a divideby-2 circuit (located in the UPP IC) generates the BB-clock at 13MHz. The reference frequency
is supplied to the reference divider (RDIV) where the frequency is divided by 65. The output of
RDIV (400kHz) is used as reference clock for the Phase Detector (ϕ).
The PLL synthesizer is a feedback control system controlling the phase and frequency of the
LO-signal. Building blocks for the PLL are: Phase detector, Charge Pump, Voltage Controlled
Oscillator (VCO), N-Divider and loopfilter. As mentioned earlier only the VCO and loopfilter is
external to the Mjoelner IC.
The VCO (G600) is the component that actually generates the LO-frequency. Based on the
control voltage input the VCO generates a signal, which is made differential through a balun.
This signal is fed to the Prescaler and N-divider in Mjoelner, these 2 block together divide the
frequency by a ratio based on the selected channel. The divider output is supplied to the phase
detector which compares the frequency and phase to the 400kHz reference clock. Based on
this comparison the phase detector controls the charge pump to either charge or discharge the
capacitors in the loopfilter . By charging/discharging the loop filter the control voltage to the VCO
changes and the LO-frequency will change. Therefore the PLL will make the LO-frequency stay
locked to the 26MHz VCXO frequency.
The loopfilter consists of the following components: C639-C641 and R618-R619.
The PLL is operating at twice the channel center frequency when transmitting or receiving in
the PCN band. For the EGSM band the PLL is operating at 4-times the channel frequency.
Therefore divide-by-2 and divide-by-4 circuits are inserted between the PLL output and LO-inputs to the PCN and EGSM mixers.
According to the figures above the PLL must be able to cover the f requency range 3420.4MHz
to 3839.2MHz for the GSM900/1800 and 3296.8 to 3979.6MHz for the GSM850/1900.
The power supply and the synthesiser is common for RH53/54, except for the synthesiser ranges.
Power Supply Configuration
All power supplies for the RF Unit are generated in the UEM IC (D200). All power outputs from
this IC have a decoupling capacitor at which the supply voltage can be checked.
The power supply configuration used in the phone is shown in the block diagram below:
See the picture below for measuring points at the UEM (D200).
Figure 19: UEM measuring points
VR2=VTX (C223)
VR6=VRX (C225) VR1A=VCP (C221)
VR7=VVCO (C224)
VR3=VXO (C227)
VR5=VPLL (C226)
VrefRF01=VREF1 (C231)
VIO=VBB (C218)
There is only one PLL synthesizer generating Local Oscillator frequencies for both RX and TX
in both bands (Lowband and Highband). The VCO frequency is divided by 2 for Highband operation or by 4 for Lowband operation inside the Mjoelner IC.
■ General instructions for Synthesizer troubleshooting
Start the Phoenix-Service-Software and
Select:ProductRH53/54 or scan
Select:Testing
RF Controls
Band XX, se table below
Active UnitRX
Operation ModeContinuous
RX/TX ChannelYY se table below
The signal from the VCO is measured at R640 using a spectrum analysator and a 500ohm p assive probe. The frequency should be as found in the table below and the power should be
around –20dBm.
The 26 MHz oscillator is located in the Mjoelner IC (N600). The coarse frequency for this oscillator is set by an external crystal (B600). The reference oscillator is used as a reference frequency for the PLL synthesizer and as the system clock for BaseBand. The 26MHz signal is
divided by 2 to achieve 13MHz inside the UPP IC (D400). The 26 MHz signal from the VCXO
can be measured by probing R420 at the end towards the UPP, see “Measurement points for
the Synthesizer”. The level at this point is approx. 700mVpp. Frequency of this oscillator is adjusted by changing the AFC-register inside the Mjoelner IC. This is done via the Mjoelner serial
interface.
The VCO is generating frequencies in the range of 3420.4MHz – 3839.2 MHz for the RH-53
and in the range 3296.8 to 3979.6 MHz for RH-54 when the PLL is running. The output frequency from the VCO is led to the Local oscillator input of the Mjoelner IC (N600), where the frequency is divided either by 2 or 4 in order to generate all channels in EGSM and PCN
respectively . Frequency of the VCO is controlled by a DC-volt age (Vctrl) coming from the loopfilter. The loopfilter consists of the component s R618, R619 and C639-C641. Range of the Vctrl
when the PLL is running (locked) is 0.4V – 4.3V. Even if the PLL is not in locked state (Vctrl
out of range) there is some frequency at the output of the VCO (G600), which is between 3 and
4 GHz. This is true if the VCO is working and if the VCO power supply is at present (2.7V).
If the phone stops working a short time after the power is turned ON, a possible reason for this
might be the 26MHz system clock signal is not getting to the UPP clock-inpu t in BaseBand. In
this case check the following:
Turn on the phone and check
VCXO Power supply (C620) = 2.7V
VCXO output (R420 – end not connected to C420) is 26MHz and approx. 700mVpp
If this is not the case check the reference crystal (B600) and Mjolner (N600) as well as R420,
Depending on the vendor of the Front End Module (FEM), dif ferent timing of the control signals
are present. The SW suppoerts both FEMs. R629 tells the SW which FEM control should be
active. Renesas FEM control is used when R629 is 18K and RFMD FEM control is used when
R629 is 82K.
If the FEM is exchanged with an other type, the R629 must be changed, too.
Renesa FEM logic
Table 5: Renesa FEM logic
ModeVtxBSVC1VC2
VTX_B_PVTX_B_PVant1Vant2
Low Band RX0000
Low Band TX1010
High Band RX0100
High Band TX1101
RFMD FEM logic
ModeVTX_B_PVTX_B_PVant1Vant2
Idle0000
Low Band RX0010
Low Band TX1010
High Band RX0110
High Band TX1110
The troubleshooting of the transmitter for the different phones is similar, meaning that the low
band, 850/900 MHz, has similar values and the high band, 1800/1900 MHz, has simila r values.
The only differences are which selection of product done in Phoenix.
Apply an RF-cable to the RF-connector to allow the transmitted signal act as normal. RF-cable
should be connected to measurement equipment or to at least a 10-dB attenuator, otherwise
the PA may be damaged.
Measure the output power of the phone; it should be around 32.5 dBm for low band and 29.5
dBm for highband. Remember the loss in the jig; around 0 dB for the low band and 0.1 dB for
the high band.
Troubleshooting chart for GSM900 transmitter
For the spectrum analyzer measurements in the following chart use the 500ohm passive probe
giving an approximately 20 dB lower reading than indicate in the following figures. Since the
signal measured is bursted it is advised to set the analyzer to maxhold.
Figure 44:Troubleshooting chart for GSM900 transmitter
Names in () is for high band
All the red signals are pulsed with the burst
The Green "DC" signals are pulsed with the burst
In local mode random burst RF signals can be demodulated by a GSM
tester
Vpc R712
Max PW: 1.2 Vdc
Min PW: 0.65 Vdc
Logic signals for the Front End Module
Attenuator
R714
(R711)
TXC (R620) Max PW 1.6V
Min PW 0.6 V
TXP (C646) 2.7V
Opamp (C644) Max PW 1.2 V
Min PW 0.65
R610
R611
Z603
(T600)
Mjoelner
N600
Depending on the vendor of the Front End Module (FEM), dif ferent timing of the control signals
are at present:the SW supports both FEMS. R629 tells the SW which FEM control should be
active. Renesas FEM control is used when R629 is 18K and RFMD FEM control is used when
R629 is 82K.
If the FEM is exchanged with an other type, the R629 has to be changed, too.
Renesa FEM logic
Table 13: Renesa FEM logic
ModeVtxBSVC1VC2
VTX_B_PVTX_B_PVant1Vant2
Low Band RX0000
Low Band TX1010
High Band RX0100
High Band TX1101
ModeVTX_B_PVTX_B_PVant1Vant2
Idle0000
Low Band RX0010
Low Band TX1010
High Band RX0110
High Band TX1110
Analog Power control signals (TXC, VPC, VDET)
RH-53/54
The pictures in the following page show the typical shapes of the control signals low ba nd, right
side it for highest power – left side for lowest power . In all the pictures TXP is used a the trigger
point and is seen in the top of each picture. The difference between the high band and the low
band is that he high band signals looks the same with only small changes in level. The activating of high band Vdet starts 5us earlier than for low band.
The alignment/calibration is the same in both GSM900/850 and GSM1800/1900 except for the
channels and frequencies. Only the the procedures for GSM900/GSM1800 are shown.
In Phoenix select connection Fbus scan product. If you power up the board before selecting
Fbus, it works without any error messages. Use Jig or other device for RF and bus connection.
Attenuation in the probe alone is 0dB for 900 and 0.1dB for 1800. Use CMD55,CMU200 or other suitable device. Default channels are 37 for GSM900 and 700 for GSM1800 (Ch 190 and
661 for GSM850/1900). The alignments and calibrations mu st be performed in the order shown
to give reliable results.
The way to save data to the phone and to load data from the phone is made different in the
various tunings. Always look what is shown in the windows regarding these issues and act accordingly . In some windows the saving is done without any warning or secon d approval as soon
as you stop or end.
To vary a selected parameter you can use + and – key or in some cases directly type the new
value. + and – steps the value for every press. Repeat function seems not to work. In I/Q you
can use the side arrows.
■ RX calibration
Select Tuning, RX Calibration
Select band GSM900
Press start
Note! You have to follow the shown procedure. It is not possible to tune the high band alone.
You need to make a tuning of the low band first to come to the high band. You can stop at any
time by switching off the menu. If the values are outside internal specs, you can not save them
and have to leave the tuning without saving.
■ RX Band Filter Response
Normally not needed in repair.
■ Tx Power tuning
Select Tuning, Tx Power Level Tuning
Figure 52:TX tuning
RH-53/54
Press start and follow the instructions in the pop-up window
Set the spectrum analyser or GSM tester for the required settings and press “OK” If a GSM
tester is used, set the TX data type to random so that the tester can trig on the signal.
Figure 54:TX tuning
Tune the highlighted values to the wanted power (Use average burst power)
Tune the base level to –25dBm
When done press Save&Continue and Phoenix will automatically shif t from lowband t o
highband. At the same time the intermidiate values are calculated, but that is firs t seen
next time you start a tuning.
Set the spectrum analyser or GSM tester for the required settings and press “OK” . If a GSM
tester is used, set the TX data type to random so that the tester can trig on the signal.
Figure 56:TX tuning
Tune the highlighted values to the wanted power (Use average burst power).
Tune the base level to –25dBm.
When done press Save&Continue. The intermediate results are then calculated.
The procedure has to be followed. First low band tuning and then high band tuning. You do not
need to change anything.
■ I/Q tuning
Select Tuning, Tx IQ tuning, TX Data Type “random” for a GSM tester like CMU200 or 1/0 for
SPA measuring.
CMD55 shows the same as a spectrum analyzer when I/Q tuning is selected. CMU200 shows
the carrier and sideband supression directly as figures in the modulation mode.
Set the spectrum analyser or GSM tester for the required settings and press “OK”
Figure 59:I/Q tuning
RH-53/54
Begin tuning with data from selected place.
Tune DC offset values to lowest carrier. Use Side arrows or +, - .
Tune Amplitude and phase to lowest sideband.
When satisfied with the result, press Next. (The sidebands should hardly be visible).Or for
CMU200 the supression should be better than -40dBc.
Set the spectrum analyser or GSM tester for the required settings and press “OK”
Figure 61:I/Q tuning
Press Start to begin tuning with data from selected place.
Tune DC offset values to lowest carrier. Use Side arrows or +, - .
Tune Amplitude and phase to lowest sideband.
When satisfied with the result, press Finish. (The sidebands should hardly be visible).
■ RF control
The purpoase is to check the receiver or transmitter without going in call. It works very much
like a call, but you have control via the PC and not via the tester . If you want to tune or calibrat e
at other channels or levels than the default for that function, you can activate RF control at the
same time and change the wanted parameters.
Edit the file RH_53_tunings.ini and save it in the product folder under Phoenix with the right
name. It defines the target values for the tu nings which need targets or can be a general one
that only needs small updates for the values that might change (e.g. the base target).
Edit the file autotune_RH-53.ini and save it in the product folder under Phoenix with the right
name.
Change the Baselevel init values so that the expected base coefficient is among them. It is not
absolutely needed but it speeds up the tuning. Larger steps can be used but with lower accuracy.
Eventually, change also the Coeff init values if the tuning deviates too much from the target.
The lowest coefficient must be very close to 0. Check how the power tuning goes an d try with
some changes.
In case of edge capability, copy from RH-12 and make some changes. RH-12 is for Gemini engine, RH-53 is for Mjoelner engine.
For autotuning, please see also TB “Autotuning function in Phoenix”.
■ Phoenix setup
In Phoenix tools-options-gpib card select the type of card used.
Press start to check if the equipment can be found.
With a PKD-1NS dongle the loss in cables and jigs has to be set, and the jig type must be defined to the product. When that is done the PKD-1 donkle can be used, and the losses can not
be changed with that dongle.