Reverse CurrentI
Terminal CapacitanceCtV = 0 V, f = 1 MHz, TA = 25 °C30pF
Detector Low Level Output VoltageV
High Level Output CurrentI
High Level Supply CurrentI
Low Level Supply CurrentI
Coupled
Threshold Input Current
(H → L)
Current Transfer Ratio (IC/IF)CTRIF = 10 mA, VO = 0.6 V44110%
Isolation ResistanceR
Isolation CapacitanceC
Propagation Delay Time
*2
(H → L)
Propagation Delay Time
*2
(L → H)
Maximum Propagation
PLH
t
Delays
Pulse Width Distorti on
*2
(PWD)
Instantaneous Common
Mode Rejection Voltage
(Output: High)
*3
Instantaneous Common
Mode Rejection Voltage
(Output: Low)
*3
PHL
|t
CM
CM
FIF
= 10 mA1.31.652.1V
R
VR = 3 V200
OLIF
= 10 mA, VCC = 5 V, IO = 2.4 mA0.130.6V
OH
VCC = 30 V, VF = 0.8 V1.050
CCH
VCC = 30 V, VF = 0.8 V, VO = open0.61.3mA
CCL
VCC = 30 V, IF = 10 mA, VO = open0.61.3mA
FHL
I
VO = 0.8 V, IO = 0.75 mA1.55.0mA
I-O
V
I-O
I-O
PHL
t
PLH
t
−
t
−
t
= 1 kVDC, RH = 40 to 60 %,
A
T
= 25 °C
V = 0 V, f = 1 MHz, TA = 25 °C0.6pF
IF = 10mA, RL = 20 kΩ, CL = 100 pF,
THHL
V
= 1.5 V, V
PHL
PLH
|270650
TA = 25 °C, IF = 0 mA, VO > 3.0 V,
H
CM
V
= 1.5 kV, RL = 20 kΩ,
L
C
= 100 pF
TA = 25 °C, IF = 10 mA, VO < 1.0 V,
L
CM
V
= 1.5 kV, RL = 20 kΩ,
L
C
= 100 pF
THLH
= 2.0 V
11
10
250500ns
520750
−
200270650
15kV/
15kV/
µ
A
µ
A
Ω
µ
s
µ
s
4
Data Sheet P13982EJ2V0DS00
A
Typical values at T
*1
Test circuit for propagation delay time
*2
= 25 °C.
PS9713
Pulse input (IF = 10 mA)
(PW = 10 s,
µ
0.1 F
Duty cycle = 1/10)
Input
(Monitor)
47 Ω
CL is approximately which includes probe and stray wiring capacitance.
Test circuit for common mode transient immunity
*3
GL SW I
F
0.1 F
µ
BA
V
CM
CL is approximately which includes probe and stray wiring capacitance.
µ
L
= 20 kΩ
R
C
L
= 100 pF
RL = 20 kΩ
CL = 100 pF
CC
= 15 V
V
O
(Monitor)
V
V
CC
= 15 V
O
(Monitor)
V
THHL
= 1.5 V
V
V
CM
V
O
(Switch A: IF = 0 mA)
V
O
(Switch B: IF = 10 mA)
Input
Output
t
PHL
90 %
10 %
IF (ON)
50 % I
F
(ON)
15 V
V
THLH
= 2.0 V
V
t
PLH
OL
1.5 kV
0 V
t
r
t
f
15 V
3.0 V
1.0 V
V
OL
USAGE CAUTION
By-pass capacitor of more than 0.1 µF is used between VCC and GND near device. Also, ensure that the distance
between the leads of the photocoupler and capacitor is no more than 10 mm.
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. LOAD RESISTANCE
IF = 10 mA,
VCC = 15 V,
CL = 100 pF
0
010203040
Load Resistance RL (kΩ)
The graphs indicate nominal characteristics.
tPLH
tPLH – tPHL
t
PHL
50
PROPAGATION DELAY TIME,
MAXIMUM PROPAGATION DELAYS
vs. LOAD RESISTANCE
500
I
F = 10 mA,
450
VCC = 5 V,
CL = 15 pF
400
PLH – tPHL (ns)
350
300
250
200
150
100
50
0
05101520
Maximum Propagation Delays t
Propagation Delay Time tPHL, tPLH (ns),
Load Resistance RL (kΩ)
tPLH
tPLH – tPHL
tPHL
25
8
Data Sheet P13982EJ2V0DS00
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
1.75±0.1
PS9713
2.4±0.1
1.55±0.1
8.0±0.1
Tape Direction
PS9713-F3
Outline and Dimensions (Reel)
4.6±0.1
1
2
0
5.5±0.1
˚
12.0±0.2
PS9713-F4
7.4±0.1
0.3
1.5
2.0±0.5
1.5±0.5
6
0
˚
Packing: 3 500 pcs/reel
Data Sheet P13982EJ2V0DS00
21.0±0.8
φ
6.0±1
330
φ
80±5.0
13.0±0.5
φ
φ
12.4
+2.0
–0.0
9
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature235 °C or below (package surface temperature)
• Time of temperature higher than 210 °C30 seconds or less
• Number of reflowsThree
• FluxRosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
PS9713
60 to 120 s
(preheating)
Package Surface Temperature T (˚C)
Time (s)
(2) Dip soldering
• Temperature260 °C or below (molten solder temperature)
• Time10 seconds or less
• Number of timesOne (Allowed to be dipped in solder including plastic mold portion.)
• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
10
Data Sheet P13982EJ2V0DS00
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
PS9713
Data Sheet P13982EJ2V0DS00
11
PS9713
NEPOC is a trademark of NEC Corporation.
•
The information in this document is current as of May, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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