V = 0 V, f = 1 MHz, TA = 25 °C0.6pF
VCC = 5 V, IF = 7.5 mA, RL = 350 Ω,
L
C
= 15 pF, TA = 25 °C
TA = 25 °C0.52.55.0Coupled
Ω
11
10
7
3675ns
6075
20
10
µ
µ
mA
Ω
A
A
Pulse Input
(PW = 1 s
µ
Duty Cycle = 1/10)
IF Monitor
51 Ω
Remark
C
I
F
6
0.1
µ
F
5
3
is approximately 15 pF, which includes probe and stray wiring capacitance.
L
4
R
L
C
L
V
= 350 Ω
V
CC
O
= 5 V1
Input
0
5 V
Output
t
PHL
350 mV
(I
F
= 7.5 mA)
175 mV
F
= 3.75 mA)
(I
1.5 V
OL
V
t
PLH
4
Data Sheet P11437EJ4V0DS00
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
PS9701
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
50
(mA)
40
F
30
20
10
Maximum Forward Current I
0
20
406080100
Ambient Temperature TA (˚C)
FORWARD CURRENT vs.
FORWARD VOLTAGE
100
10
(mA)
F
1.0
0.1
Forward Current I
0.01
1.2
1.0
1.6
1.4
Forward Voltage VF (V)
TA = 100 ˚C
1.82.02.22.4
50 ˚C
25 ˚C
0 ˚C
–25 ˚C
POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
80
(mW)
C
60
40
20
Power Dissipation P
0
20406080100
Ambient Temperature TA (˚C)
NORMALIZED THRESHOLD INPUT CURRENT
vs. AMBIENT TEMPERATURE
1.6
FHL
Normalized to 1.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
Normalized Threshold Input Current I
0.0
A
= 25 ˚C, VCC = 5 V,
at T
V
O
= 0.8 V, RL = 350 Ω
–50
–25
–25
Ambient Temperature TA (˚C)
255075
0
100
OUTPUT VOLTAGE vs.
FORWARD CURRENT
7
6
5
(V)
O
4
3
2
Output Voltage V
1
0
24681012
RL = 100 Ω
350 Ω
1 kΩ
Forward Current IF (mA)
5 V
R
V
L
O
1.50
(V)
1.25
OL
1.00
0.75
0.50
0.25
Low Level Output Voltage V
0.00
Data Sheet P11437EJ4V0DS00
LOW LEVEL OUTPUT VOLTAGE vs.
AMBIENT TEMPERATURE
IF = 7.5 mA,
V
CC
= 5.5 V
I
OL
= 13 mA
5 mA
–50
–25
0
Ambient Temperature T
25
50
A
(˚C)
75
100
5
PS9701
PROPAGATION DELAY TIME vs.
FORWARD CURRENT
80
(ns)
PLH
, t
60
PHL
40
20
Propagation Delay Time t
0
5
10
Forward Current IF (mA)
PROPAGATION DELAY TIME vs.SWITCHING TIME vs.
AMBIENT TEMPERATURE
120
(ns)
100
PLH
, t
PHL
80
60
40
20
15
2025
PLH
t
t
PHL
PLH
t
t
PHL
VCC = 5 V,
RL = 350 Ω
IF = 7.5 mA,
VCC = 5 V,
R
L
= 350 Ω
PROPAGATION DELAY TIME vs.
LOAD RESISTANCE
1 000
(ns)
500
PLH
, t
PHL
100
50
Propagation Delay Time t
10
100
1 k5 k 10 k
500
Load Resistance RL (Ω)
AMBIENT TEMPERATURE
25
20
(ns)
f
, t
r
15
10
Switching Time t
5
IF = 7.5 mA,
VCC = 5 V,
µ
PW = 1 s,
duty 1/10
t
PLH
t
PHL
50 k
F
= 7.5 mA,
I
VCC = 5 V,
RL = 350 Ω
t
r
t
f
Propagation Delay Time t
0
–50
–25
0
Ambient Temperature TA (˚C)
Remark
The graphs indicate nominal characteristics.
5075100
25
0
–50–25 0
Ambient Temperature TA (˚C)
25
5075100
6
Data Sheet P11437EJ4V0DS00
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
1.75±0.1
PS9701
2.4±0.1
1.55±0.1
8.0±0.1
Tape Direction
PS9701-E3PS9701-E4
Outline and Dimensions (Tape)
4.6±0.1
5.5±0.1
12.0±0.2
7.4±0.1
0.3
2.0
13.0±0.5
Packing: 900 pcs/reel
Data Sheet P11437EJ4V0DS00
2.0±0.5
21.0±0.8
15˚
15˚
180
60
13.0±0.5
13.0±1.0
7
Outline and Dimensions (Tape)
2.0±0.1
4.0±0.1
1.55±0.1
1.75±0.1
PS9701
2.4±0.1
1.55±0.1
8.0±0.1
Tape Direction
PS9701-F3
Outline and Dimensions (Reel)
4.6±0.1
1
2
0
5.5±0.1
˚
12.0±0.2
PS9701-F4
7.4±0.1
0.3
1.5
21.0±0.8
φ
2.0±0.5
1.5±0.5
6
0
˚
6.0±1
330
φ
80±5.0
13.0±0.5
φ
φ
12.4
+2.0
–0.0
Packing: 3 500 pcs/reel
8
Data Sheet P11437EJ4V0DS00
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature235 °C (package surface temperature)
• Time of temperature higher than 210 °C30 seconds or less
• Number of reflowsThree
• FluxRosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
120 to 160 ˚C
PS9701
60 to 90 s
(preheating)
Package Surface Temperature T (˚C)
Time (s)
(2) Dip soldering
• Temperature260 °C or below (molten solder temperature)
• Time10 seconds or less
• Number of timesOne
• FluxRosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
•Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
Data Sheet P11437EJ4V0DS00
9
PS9701
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
ParameterSymbolSpeckUnit
Application class i fication (DIN VDE 0109)
for rated line voltages ≤ 300 Vr.m.s.IV
for rated line voltages ≤ 600 Vr.m.s.III
Climatic test c l ass (DIN IEC 68 Teil 1/09.80)40/085/21
Dielectric strength m aximum operating isolation v ol tage.
Test voltage (partial dis charge test procedure a for type test and random test)U
Upr = 1.2 × U
IORM
, Pd < 5 pCU
Test voltage (partial dis charge test procedure b for random test)
pr
U
= 1.6 × U
IORM
, Pd < 5 pC
Highest permissible ov ervoltageU
IORM
U
710V
pr
pr
TR
850V
1 140V
4 000V
Degree of pollution (DIN VDE 0109)2
Clearance distance> 5mm
Creepage distance> 5mm
Comparative tracking index (DIN IEC 112/VDE 0303 part 1)CTI175
Material group (DIN VDE 0109)III a
Storage temperature rangeT
Operating temperature rangeT
stg
A
–55 to +125
–40 to +85
Isolation resistance, minimum value
VIO = 500 V dc at TA = 25 °CRis MIN.10
VIO = 500 V dc at TA MAX. at least 100 °CRis MIN.10
12
11
Safety maximum ratings
(maximum permissibl e i n case of fault, see thermal derating curve)
Package temperatureTsi150
Current (input current IF, Psi = 0)Isi200mA
Power (output or total power diss i pat i on)Psi300mW
Isolation resistance
VIO = 500 V dc at TA = 175 °C (Tsi)Ris MIN.10
9
°
°
°
peak
peak
peak
peak
C
C
Ω
Ω
C
Ω
10
Data Sheet P11437EJ4V0DS00
[MEMO]
PS9701
Data Sheet P11437EJ4V0DS00
11
PS9701
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
NEPOC is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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