This decoder utilizes advanced silicon-gate CMOS technology, and is well suited to memory address decoding or data
routing applications. The circuit features high noise immunity and low power consumption usually associated with
CMOS circuitry, yet has speeds comparable to low power
Schottky TTL logic.
The MM54HC138/MM74HC138 has 3 binary select inputs
(A, B, and C). If the device is enabled these inputs determine which one of the eight normally high outputs will go
low. Two active low and one active high enables (G1, G2A
and G2B) are provided to ease the cascading of decoders.
Connection and Logic Diagrams
Dual-In-Line Package
January 1988
The decoder’s outputs can drive 10 low power Schottky TTL
equivalent loads, and are functionally and pin equivalent to
the 54LS138/74LS138. All inputs are protected from damage due to static discharge by diodes to V
and ground.
CC
Features
Y
Typical propagation delay: 20 ns
Y
Wide power supply range: 2V –6V
Y
Low quiescent current: 80 mA maximum (74HC Series)
Y
Low input current: 1 mA maximum
Y
Fanout of 10 LS-TTL loads
MM54HC138/MM74HC138 3-to-8 Line Decoder
TL/F/5120– 1
Order Number MM54HC138
or MM74HC138
TL/F/5120– 2
Truth Table
Inputs
EnableSelect
G1 G2* CBAY0Y1Y2Y3Y4Y5Y6Y7
X HXXXHHHHHHHH
L XXXXHHHHHHHH
H L LLLL HHHHHHH
H L LLHHL HHHHHH
H L LHLHHL HHHHH
H L LHHHHHLHHHH
H L HLLHHHH LHHH
H L HLHHHHHH LHH
H L HHLHHHHHHLH
H L HHHHHHHHHH L
*G2eG2AaG2B
e
H
high level, Lelow level, Xedon’t care
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5120
Outputs
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
)
b
0.5 toa7.0V
b
1.5 to V
b
CC
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
b
40
55
eb
A
55 to 125§C
g
CC
a
85
a
125
1.0mA
C
C
2
Page 3
e
AC Electrical Characteristics V
CC
5V, T
e
A
25§C, C
SymbolParameterConditionsTyp
t
PLH
t
PHL
t
PHL,tPLH
t
PHL
Maximum Propagation1825ns
Delay, Binary Select to any Output
Maximum Propagation2835ns
Delay, Binary Select to any Output
Maximum Propagation1825ns
Delay, G1 to any Output
Maximum Propagation2330ns
Delay G2A
or G2B to
Output
t
PLH
Maximum Propagation1825ns
Delay G2A
or G2B to
Output
e
15 pF, t
L
Guaranteed
r
Limit
e
e
t
6ns
f
Units
AC Electrical Characteristics C
e
L
SymbolParameterConditionsV
t
PLH
Maximum Propagation2.0V75150189224ns
Delay Binary Select to4.5V15303845ns
any Output Low to High6.0V13263238ns
t
PHL
Maximum Propagation2.0V100200252298ns
Delay Binary Select to any4.5V20405060ns
Output High to Low6.0V17344351ns
t
PHL,tPLH
Maximum Propagation2.0V75150189224ns
Delay G1 to any4.5V15303845ns
Output6.0V13263238ns
t
PHL
Maximum Propagation2.0V82175221261ns
Delay G2A or G2B to4.5V28354452ns
Output6.0V22303744ns
t
PLH
Maximum Propagation2.0V75150189224ns
Delay G2A or G2B to4.5V15303845ns
Output6.0V13263238ns
t
TLH,tTHL
C
IN
C
PD
Note 5: CPDdetermines the no load dynamic power consumption, P
Output Rise and2.0V307595110ns
Fall Time4.5V8151922ns
Maximum Input3101010pF
Capacitance
Power Dissipation(Note 5)75pF
Capacitance
D
e
CC
e
t
6 ns (unless otherwise specified)
r
f
e
T
25§C
A
eb
T
A
74HC54HC
40 to 85§CT
eb
A
55 to 125§C
50 pF, t
TypGuaranteed Limits
6.0V7131619ns
2
e
CPDV
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Page 4
Physical Dimensions inches (millimeters)
Order Number MM54HC138J or MM74HC138J
NS Package Number J16A
MM54HC138/MM74HC138 3-to-8 Line Decoder
Order Number MM74HC138N
NS Package Number N16E
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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