MM54HC283/MM74HC283
4-Bit Binary Adder with Fast Carry
MM54HC283/MM74HC283 4-Bit Binary Adder with Fast Carry
January 1988
General Description
This full adder performs the addition of two 4-bit binary numbers utilizing advanced silicon-gate CMOS technology. The
sum (R) outputs are provided for each bit and the resultant
carry (C4) is obtained from the fourth bit. These adders feature full internal look ahead across all four bits. This provides the system designer with partial look-ahead performance at the economy and reduced package count of a ripple-carry implementation.
The adder logic, including the carry, is implemented in its
true form meaning that the end-around carry can be accomplished without the need for logic or level inversion. All inputs are protected from damage due to static discharge by
internal diode clamps to V
and ground.
CC
Connection Diagram
Dual-In-Line Package
Features
Y
Full-carry look-ahead across the four bits
Y
Systems achieve partial look-ahead performance
with the economy of ripple carry
Y
Wide supply range: 2V to 6V
Y
Low quiescent power consumption: 8 mAat25§C
Y
Low input current: 1 mA maximum
Top View
Order Number MM54HC283 or MM74HC283
C
1995 National Semiconductor Corporation RRD-B30M105/Printed in U. S. A.
TL/F/5332
TL/F/5332– 1
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
1.5V
20 mA
25 mA
50 mA
Power Dissipation (PD)
(Note 3) 600 mW
Supply Voltage (V
)26V
CC
DC Input or Output Voltage 0 V
(V
IN,VOUT
)
Operating Temp. Range (T
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf) 1000 ns
CC
e
V
4.5V 500 ns
CC
e
V
6.0V 400 ns
CC
S.O. Package only 500 mW
Lead Temperature (T
)
L
(Soldering 10 seconds) 260§C
DC Electrical Characteristics (Note 4)
Symbol Parameter Conditions V
CC
A
e
T
25§C
Typ Guaranteed Limits
V
IH
Minimum High Level 2.0V 1.5 1.5 1.5 V
Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
V
IL
Maximum Low Level 2.0V 0.5 0.5 0.5 V
Input Voltage** 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
V
OH
Minimum High Level V
Output Voltage
e
VIHor V
IN
I
l
OUT
IL
s
20 mA 2.0V 2.0 1.9 1.9 1.9 V
l
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
V
OL
Maximum Low Level V
Output Voltage
e
IN
I
l
OUT
IL
s
4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
l
s
5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
l
VIHor V
IL
s
20 mA 2.0V 0 0.1 0.1 0.1 V
l
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum Input V
Current
Maximum Quiescent V
Supply Current I
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
l
s
5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
l
VCCor GND 6.0V
g
0.1
VCCor GND 6.0V 8.0 80 160 mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC 54HC
eb
T
40 to 85§CT
A
g
1.0
Min Max Units
)
A
b
b
40
55
eb
A
55 to 125§C
g
a
a
1.0 mA
CC
85
125
V
C
§
C
§
Units
2