These edge triggered flip-flops utilize advanced silicon-gate
CMOS technology to implement D-type flip-flops. They possess high noise immunity, low power, and speeds comparable to low power Schottky TTL circuits. This device contains
8 master-slave flip-flops with a common clock and common
clear. Data on the D input having the specified setup and
hold times is transferred to the Q output on the low to high
transition of the CLOCK input. The CLEAR input when low,
sets all outputs to a low state.
Each output can drive 10 low power Schottky TTL equivalent loads. The MM54HC273/MM74HC273 is functionally
Connection Diagram
Dual-In-Line Package
as well as pin compatible to the 54LS273/74LS273. All inputs are protected from damage due to static discharge by
diodes to V
Features
Y
Typical propagation delay: 18 ns
Y
Wide operating voltage range
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 80 mA (74 Series)
Y
Output drive: 10 LS-TTL loads
and ground.
CC
MM54HC273/MM74HC273 Octal D Flip-Flops with Clear
January 1988
Top View
TL/F/5331– 1
Order Number MM54HC273 or MM74HC273
Truth Table(Each Flip-Flop)
InputsOutputs
ClearClockDQ
LXXL
H
H
HLXQ
e
H
high level (steady state)
e
low level (steady state)
L
e
don’t care
X
e
transition from low to high level
u
e
the level of Q before the indicated steady state
Q
0
input conditions were established
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
TL/F/5331
HH
u
LL
u
0
Page 2
Absolute Maximum Ratings (Notes 1 and 2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V880160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
b
40
55
eb
A
55 to 125§C
g
CC
a
85
a
125
1.0mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
e
5V, T
SymbolParameterConditionsTyp
f
MAX
t
PHL,tPLH
t
PHL
t
REM
t
s
t
H
t
W
Maximum Operating5030MHz
Frequency
Maximum Propagation1827ns
Delay, Clock to Output
Maximum Propagation1827ns
Delay, Clear to Output
Minimum Removal Time,1020ns
Clear to Clock
Minimum Setup Time1020ns
Data to Clock
Minimum Hold Time
Clock to Data
Minimum Pulse Width1016ns
Clock or Clear
e
A
b
20 ns
25§C, C
Guaranteed
e
L
Limit
15 pF, t
e
r
e
t
f
Units
6ns
AC Electrical Characteristics C
e
L
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PHL
t
REM
t
s
t
H
t
W
tr,t
t
THL,tTLH
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V16543MHz
Frequency4.5V74272118MHz
Maximum Propagation2.0V38135170205ns
Delay, Clock to Output4.5V14273441ns
Maximum Propagation2.0V42135170205ns
Delay, Clear to Output4.5V19273441ns
Minimum Removal Time2.0V0253237ns
Clear to Clock4.5V0567ns
Minimum Setup Time2.0V26100125150ns
Data to Clock4.5V7202530ns
Minimum Hold Time2.0Vb15000ns
Clock to Data4.5V
Minimum Pulse Width2.0V3480100120ns
Clock or Clear4.5V11162024ns
Maximum Input Rise and2.0V100010001000ns
f
Fall Time, Clock4.5V500500500ns
Maximum Output Rise2.0V287595110ns
and Fall Time4.5V11151922ns
Power Dissipation(per flip-flop)45pF
Capacitance (Note 5)
Maximum Input7101010pF
Capacitance
e
CC
e
t
6 ns (unless otherwise specified)
r
f
e
T
25§C
A
eb
T
A
74HC54HC
40 to 85§CT
A
eb
55 to 125§C
50 pF, t
TypGuaranteed Limits
6.0V78312420MHz
6.0V12232935ns
6.0V18232935ns
6.0V0456ns
6.0V5172125ns
b
6000ns
b
6.0V
4000ns
6.0V10141820ns
6.0V400400400ns
6.0V9131619ns
2
e
CPDV
D
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
Units
3
Page 4
Logic Diagram
TL/F/5331– 2
4
Page 5
5
Page 6
Physical Dimensions inches (millimeters)
Order Number MM54HC273J
or MM74HC273J
NS Package J20A
MM54HC273/MM74HC273 Octal D Flip-Flops with Clear
Order Number MM74HC273N
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.