The MM54HC195/MM74HC195 is a high speed 4-bit SHIFT
REGISTER utilizes advanced silicon-gate CMOS technology to achieve the low power consumption and high noise
immunity of standard CMOS integrated circuits, along with
the ability to drive 10 LS-TTL loads at LS type speeds.
This shift register features parallel inputs, parallel outputs, JK
serial inputs, SHIFT/LOAD control input, and a direct
overriding CLEAR. This shift register can operate in two
modes: PARALLEL LOAD; SHIFT from Q
Parallel loading is accomplished by applying the four bits of
data, and taking the SHIFT/LOAD control input low. The
data is loaded into the associated flip flops and appears at
the outputs after the positive transition of the clock input.
During parallel loading, serial data flow is inhibited. Serial
shifting occurs synchronously when the SHIFT/LOAD con-
Connection Diagram
towards QD.
A
Dual-In-Line Package
November 1995
trol input is high. Serial data for this mode is entered at the
J-K
inputs. These inputs allow the first stage to perform as a
J-K
or TOGGLE flip flop as shown in the truth table.
The 54HC/74HC logic family is functionally as well as pinout compatible with the standard 54LS/74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to V
and ground.
CC
Features
Y
Typical operating frequency: 45 MHz
Y
Typical propagation delay: 16 ns (clock to Q)
Y
Wide operating supply voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 80 mA maximum (74HC Series)
Y
Fanout of 10 LS-TTL loads
MM54HC195/MM74HC195 4-Bit Parallel Shift Register
Top View
TL/F/5324– 1
Order Number MM54HC195 or MM74HC195
Function Table
InputsOutputs
Clear Shift/ Clock
LoadJK ABCD
LXXXXXXXXLLLLH
HL
HH LXXXXXXQA0QB0QC0QD0Q
HH
HH
HH
HH
C
1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. A.
SerialParallel
XXabcda b c d d
u
LHXXXXQA0QA0QBnQCnQ
u
LLXXXXLQAnQBnQCnQ
u
HHXXXXHQAnQBnQCnQ
u
HLXXXXQAnQAnQBnQCnQ
u
TL/F/5324
QAQBQCQDQ
Hehigh level (steady state)
e
low level (steady state)
L
e
irrelevant (any input, including transitions)
X
D
e
transition from low to high level
u
e
the level of steady-state input at inputs A, B, C,
a, b, c, d
or D, respectively.
Q
A0,QB0,QC0,QD0
respectively, before the indicated steady-state input condi-
D0
tions were established.
Cn
Q
An,QBn,QCn
Cn
before the most-recent transition of the clock.
Cn
Cn
e
the level of QA,QB,QC,orQD,
e
the level of QA,QB,QC, respectively,
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temp. (T
) (Soldering 10 seconds)260§C
L
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
designing with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
CC
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
e
IN
e
IN
OUT
g
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
and VILoccur at V
IH
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
CC
b
b
40
55
eb
A
55 to 125§C
g
a
85
a
125
§
§
Units
1.0mA
V
C
C
2
Page 3
AC Electrical Characteristics V
CC
5V, T
e
A
25§C, C
e
L
15 pF, t
e
e
t
6ns
r
f
e
SymbolParameterConditionsTypGuaranteed LimitUnits
f
MAX
t
PHL,tPLH
t
PHL
t
REM
t
REM
t
S
t
S
t
W
t
H
Maximum Operating Frequency4530MHz
Maximum Propagation Delay, Clock to Q1424ns
Maximum Propagation Delay, Reset to Q1625ns
Minimum Removal Time, Shift/Load to Clock0ns
Minimum Removal Time, Reset Inactive to Clock5ns
Minimum Setup Time, (A, B, C, D, J, K to Clock)20ns
Minimum Setup Time, Shift/Load to Clock20ns
Minimum Pulse Width Clock or Reset16ns
Minimum Hold Time, any Input except Shift/Load0ns
AC Electrical Characteristics C
e
L
50 pF, t
SymbolParameterConditions V
f
MAX
t
PHL
t
PHL,tPLH
t
THL,tTLH
t
REM
t
REM
t
S
t
S
t
H
t
W
tr,t
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V10654MHz
Frequency4.5V45302420MHz
Maximum Propagation2.0V70150189224ns
Delay, Reset to Q or Q4.5V15303845ns
Maximum Propagation2.0V70145183216ns
Delay, Clock to Q or Q
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Minimum Removal Time,2.0Vb2000ns
Shift Load to Clock4.5V
Minimum Removal Time,2.0V555ns
Reset Inactive to Clock4.5V555ns
Minimum Setup Time,2.0V100125150ns
(A, B, C, D, J, K
Minimum Setup Time,2.0V100125150ns
Shift/Load to Clock4.5V202530ns
Minimum Hold Time2.0Vb10000ns
any Input except Shift/Load4.5V
Minimum Pulse Width,2.0V3080100120ns
Clock or Reset4.5V10162024ns
Maximum Input Rise2.0V100010001000ns
f
and Fall Time4.5V500500500ns
Power Dissipation100pF
Capacitance (Note 5)
to Clock)4.5V202530ns
Maximum Input Capacitance5101010pF
D
e
e
t
6 ns (unless otherwise specified)
r
f
CC
e
T
25§C
A
74HC54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
Units
TypGuaranteed Limits
6.0V50352824MHz
6.0V12263238ns
4.5V15293743ns
6.0V12253137ns
6.0V7131619ns
b
6.0Vb2000ns
2000ns
6.0V555ns
6.0V172125ns
6.0V172125ns
b
2000ns
b
6.0V
2000ns
6.0V9141820ns
6.0V400400400ns
2
e
CPDV
faICCVCC, and the no load dynamic current consumption, I
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SEMICONDUCTOR CORPORATION. As used herein:
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systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
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with instructions for use provided in the labeling, caneffectiveness.
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