This 4-bit high speed bidirectional shift register utilizes advanced silicon-gate CMOS technology to achieve the low
power consumption and high noise immunity of standard
CMOS integrated circuits, along with the ability to drive 10
LS-TTL loads. This device operates at speeds similar to the
equivalent low power Schottky part.
This bidirectional shift register is designed to incorporate
virtually all of the features a system designer may want in a
shift register. It features parallel inputs, parallel outputs,
right shift and left shift serial inputs, operating mode control
inputs, and a direct overriding clear line. The register has
four distinct modes of operation: PARALLEL (broadside)
LOAD; SHIFT RIGHT (in the direction Q
SHIFT LEFT; INHIBIT CLOCK (do nothing).
toward QD);
A
Synchronous parallel loading is accomplished by applying
the four bits of data and taking both mode control inputs, S0
and S1, high. The data are loaded into their respective flip
flops and appear at the outputs after the positive transition
of the CLOCK input. During loading, serial data flow is inhibited. Shift right is accomplished synchronously with the rising edge of the clock pulse when S0 is high and S1 is low.
Serial data for this mode is entered at the SHIFT RIGHT
data input. When S0 is low and S1 is high, data shifts left
synchronously and new data is entered at the SHIFT LEFT
serial input. Clocking of the flip flops is inhibited when both
mode control inputs are low. The mode control inputs
should be changed only when the CLOCK input is high.
The 54HC/74HC logic family is functionally as well as pinout compatible with the standard 54LS/74LS logic family.
All inputs are protected from damage due to static discharge by internal diode clamps to V
Features
Y
Typical operating frequency: 45 MHz
Y
Typical propagation delay: ns (clock to Q)
Y
Wide operating supply voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent supply current: 160 mA maximum
(74HC Series)
LXXX X XXXXXLLLL
HXX L X XXXXXQ
HHH
HLH
HLH
HHL
HHL
HLL X X XXXXXQ
C
1995 National Semiconductor CorporationRRD-B30M115/Printed in U. S. A.
S1 S2
Clock
Left Right A B C D
XXabcdabcd
u
XHXXXXHQAnQBnQ
u
XLXXXXLQAnQBnQ
u
HXXXXXQBnQCnQDnH
u
LXXXXXQBnQCnQDnL
u
TL/F/5323
QAQBQCQ
A0QB0QC0QD0
A0QB0QC0QD0
Order Number MM54HC194 or MM74HC194
Hehigh level (steady state)
e
L
D
Cn
Cn
low level (steady state)
e
X
irrelevant (any input, including transitions)
e
transition from low to high level
u
e
a, b, c, d
respectively.
Q
before the indicated steady-state input conditions were established.
Q
the most-recent
the level of steady-state input at inputs A, B, C, or D,
e
A0,QB0,QC0,QD0
An,QBn,QCn,QDn
the level of QA,QB,QC,orQD, respectively,
e
the level of QA,QB,QC, respectively, before
transition of the clock.
u
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
)
b
0.5 toa7.0V
b
1.5 to V
b
CC
0.5 to V
CC
b
65§Ctoa150§C
a
a
g
g
g
1.5V
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temperature (T
)
L
(Soldering 10 seconds)260§C
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
I
IN
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
I
IN
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
g
and VILoccur at V
) occur for CMOS at the higher voltage and so the 6.0V values should be used.
OZ
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
IH
e
IN
e
IN
OUT
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,ICC, and
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
40
b
55
eb
A
CC
a
85
a
125
55 to 125§C
g
1.0mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
e
5V, T
SymbolParameterConditionsTyp
f
MAX
t
PHL,tPLH
t
PHL
t
REM
t
S
t
S
t
W
t
H
Maximum Operating5035MHz
Frequency
Maximum Propagation1724ns
Delay, Clock to Q
Maximum Propagation1925ns
Delay, Reset to Q
Minimum Removal Time,5ns
Reset Inactive to Clock
Minimum Setup Time20ns
(A, B, C, D to Clock)
Minimum Setup Time20ns
Mode Controls to Clock
Minimum Pulse Width916ns
Clock or Reset
Minimum Hold Time
any Input
e
A
b
30 ns
25§C, C
Guaranteed
e
L
Limit
15 pF, t
e
r
e
t
f
Units
6ns
AC Electrical Characteristics C
e
L
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
PHL
t
THL,tTLH
t
REM
t
S
t
S
t
H
t
W
tr,t
f
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V10654
Frequency4.5V45302420MHz
Maximum Propagation2.0V70145183216ns
Delay, Clock to Q4.5V15293745ns
Maximum Propagation2.0V80150189216ns
Delay, Reset to Q4.5V15303745ns
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Minimum Removal Time2.0V555ns
Reset Inactive to Clock4.5V555ns
Minimum Set Up Time2.0V100125150ns
(A, B, C, or D to Clock)4.5V202530ns
Minimum Set Time2.0V100125150ns
Mode Controls to Clock4.5V202530ns
Minimum Hold Time2.0Vb10000ns
any Input4.5Vb3000ns
Minimum Pulse Width2.0V3080100120ns
Clock or Reset4.5V89162024ns
Maximum Input Rise and2.0V100010001000ns
Fall Time4.5V500500500ns
Power Dissipation77pF
Capacitance (Note 5)
Maximum Input5101010pF
Capacitance
e
CC
e
t
6 ns (unless otherwise specified)
r
f
e
T
25§C
A
74HC54HC
eb
T
A
40 to 85§CT
A
eb
55 to 125§C
50 pF, t
TypGuaranteed Limits
6.0V50352824MHz
6.0V12253137ns
6.0V12263137ns
6.0V7131619ns
6.0V555ns
6.0V172125ns
6.0V172125ns
b
6.0V
3000ns
6.0V8141820ns
6.0V400400400ns
2
e
CPDV
D
faICCVCC, and the no load dynamic current consumption, I
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
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