These edge triggered flip-flops utilize advanced silicon-gate
CMOS technology to implement D-type flip-flops. They possess high noise immunity, low power, and speeds comparable to low power Schottky TTL circuits. This device contains
6 master-slave flip-flops with a common clock and common
clear. Data on the D input having the specified setup and
hold times is transferred to the Q output on the low to high
transition of the CLOCK input. The CLEAR input when low,
sets all outputs to a low state.
Each output can drive 10 low power Schottky TTL equivalent loads. The MM54HC174/MM74HC174 is functionally
as well as pin compatible to the 54LS174/74LS174. All inputs are protected from damage due to static discharge by
diodes to V
and ground.
CC
Connection and Logic Diagrams
Dual-In-Line Package
Features
Y
Typical propagation delay: 16 ns
Y
Wide operating voltage range: 2 –6V
Y
Low input current: 1 mA maximum
Y
Low quiescent current: 80 mA (74HC Series)
Y
Output drive: 10 LSTTL loads
TL/F/5318– 1
Order Number MM54HC174 or MM74HC174
Truth Table
(Each Flip-Flop)
InputsOutputs
ClearClockDQ
LXXL
H
H
HLXQ
e
H
High level (steady state)
e
Low level (steady state)
L
e
Don’t Care
X
e
Transition from low to high level
u
e
The level of Q before the indicated steady state
Q
0
input conditions were established.
C
1995 National Semiconductor CorporationRRD-B30M105/Printed in U. S. A.
HH
u
LL
u
TL/F/5318
0
TL/F/5318– 2
Page 2
Absolute Maximum Ratings (Notes1&2)
Operating Conditions
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage (V
CC
)
DC Input Voltage (VIN)
DC Output Voltage (V
OUT
)
Clamp Diode Current (IIK,IOK)
DC Output Current, per pin (I
OUT
)
DC VCCor GND Current, per pin (ICC)
Storage Temperature Range (T
STG
b
b
)
b
0.5 toa7.0V
1.5 to V
CC
0.5 to V
CC
g
g
b
g
65§Ctoa150§C
a
1.5V
a
0.5V
20 mA
25 mA
50 mA
Supply Voltage (V
)26V
CC
DC Input or Output Voltage0V
(V
IN,VOUT
)
Operating Temp. Range (TA)
MM74HC
MM54HC
Input Rise or Fall Times
e
V
2.0V(tr,tf)1000ns
CC
e
V
4.5V500ns
CC
e
V
6.0V400ns
CC
Power Dissipation (PD)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temperature (T
(Soldering 10 seconds)260
)
L
C
§
DC Electrical Characteristics (Note 4)
SymbolParameterConditionsV
CC
A
e
T
25§C
TypGuaranteed Limits
V
IH
Minimum High Level2.0V1.51.51.5V
Input Voltage4.5V3.153.153.15V
6.0V4.24.24.2V
V
IL
Maximum Low Level2.0V0.50.50.5V
Input Voltage**4.5V1.351.351.35V
6.0V1.81.81.8V
V
OH
Minimum High LevelV
Output Voltage
e
VIHor V
l
IN
I
OUT
IL
s
20 mA2.0V2.01.91.91.9V
l
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
l
IN
I
OUT
e
V
OL
Maximum Low LevelV
Output Voltage
IL
s
4.0 mA4.5V4.23.983.843.7V
l
s
5.2 mA6.0V5.75.485.345.2V
l
VIHor V
IL
s
20 mA2.0V00.10.10.1V
l
4.5V00.10.10.1V
6.0V00.10.10.1V
e
V
VIHor V
IN
I
l
OUT
I
l
OUT
I
IN
I
CC
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground.
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package:
Note 4: For a power supply of 5V
designing with this supply. Worst case V
I
**V
Maximum InputV
Current
Maximum QuiescentV
Supply CurrentI
, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
CC
limits are currently tested at 20% of VCC. The above VILspecification (30% of VCC) will be implemented no later than Q1, CY’89.
IL
e
IN
e
IN
OUT
g
10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when
and VILoccur at V
IH
IL
s
4.0 mA4.5V0.20.260.330.4V
l
s
5.2 mA6.0V0.20.260.330.4V
l
VCCor GND6.0V
g
0.1
VCCor GND6.0V8.080160mA
e
0 mA
b
12 mW/§C from 65§Cto85§C; ceramic ‘‘J’’ package:b12 mW/§C from 100§Cto125§C.
e
5.5V and 4.5V respectively. (The VIHvalue at 5.5V is 3.85V.) The worst case leakage current (IIN,
CC
74HC54HC
eb
T
40 to 85§CT
A
g
1.0
MinMaxUnits
V
§
§
Units
b
b
40
55
eb
A
55 to 125§C
g
CC
a
85
a
125
1.0mA
C
C
2
Page 3
AC Electrical Characteristics V
CC
e
5V, T
SymbolParameterConditions Typ
f
MAX
t
PHL,tPLH
t
REM
t
S
t
H
t
W
Maximum Operating5030MHz
Frequency
Maximum Propagation1630ns
Delay, Clock or Clear to Output
Minimum Removal Time,
Clear to Clock
Minimum Setup Time1020ns
Data to Clock
Minimum Hold Time05ns
Clock to Data
Minimum Pulse Width1016ns
Clock or Clear
e
A
b
25§C, C
e
L
Guaranteed
Limit
15 pF, t
r
e
t
f
Units
25 ns
e
6ns
AC Electrical Characteristics C
e
L
50 pF, t
SymbolParameterConditionsV
f
MAX
t
PHL,tPLH
t
REM
t
S
t
H
t
W
t
TLH,tTHL
tr,t
C
PD
C
IN
Note 5: CPDdetermines the no load dynamic power consumption, P
Maximum Operating2.0V543MHz
Frequency4.5V272118MHz
Maximum Propagation2.0V55165206248ns
Delay Clock or Clear to Output4.5V18334149ns
Minimum Removal Time2.0V1555ns
Clear to Clock4.5V1555ns
Minimum Setup Time2.0V42100125150ns
Data to Clock4.5V12202530ns
Minimum Hold Time2.0V1555ns
Clock to Data4.5V1555ns
Minimum Pulse Width2.0V3580106120ns
Clock or Clear4.5V10162024ns
Maximum Output Rise2.0V307595110ns
and Fall Time4.5V8151922ns
Maximum Input Rise and2.0V100010001000ns
f
Fall Time4.5V500500500ns
Power Dissipation(per package)136pF
Capacitance (Note 5)
Maximum Input5101010pF
Capacitance
e
CPDV
D
e
e
t
6 ns (unless otherwise specified)
r
f
74HC54HC
eb
T
40 to 85§CT
A
A
eb
55 to 125§C
Units
CC
e
T
25§C
A
TypGuaranteed Limits
6.0V312420MHz
6.0V16283542ns
6.0V1555ns
6.0V10172125ns
6.0V1555ns
6.0V8141820ns
6.0V7131619ns
6.0V400400400ns
2
faICCVCC, and the no load dynamic current consumption, I
CC
e
CPDVCCfaICC.
S
3
Page 4
Physical Dimensions inches (millimeters)
Order Number MM54HC174J or MM74HC174J
Dual-In Line Package (J)
See NS Package J16A
MM54HC174/MM74HC174 Hex D Flip-Flops with Clear
Dual-In Line Package (N)
Order Number MM74HC174N
See NS Package N16E
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or2. A critical component is any component of a life
systems which, (a) are intended for surgical implantsupport device or system whose failure to perform can
into the body, or (b) support or sustain life, and whosebe reasonably expected to cause the failure of the life
failure to perform, when properly used in accordancesupport device or system, or to affect its safety or
with instructions for use provided in the labeling, caneffectiveness.
be reasonably expected to result in a significant injury
to the user.
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.