Murata LB1MDIMP004 User Manual

Preliminary Specification Number : SP-ZZ1MD-J
Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
Cypress CYW43438 WLAN / BT + ST Micro STM32F412 MCU
for 802.11b/g/n & Bluetooth® 4.1
Electric Imp P/N : imp004m
MURATA P/N : LBEE5ZZ1MD-011
This Datasheet is preliminary version, and subject
to change without notice.
Preliminary Specification Number : SP-ZZ1MD-J
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
Revision history
Issued Date
Revision Code
Revision Page
Changed Items
Change Reason
Jul. 6. 2016
First Issue
Sep. 9. 2016
A
P3 P4
P6 P15 P17
2. Part Number
4.1. Dimensions
4.2. Terminal Configurations
11. Land pattern (Top View)
13. Tape and Reel Packing
Oct. 11. 2016
B
P3
P4
P6 P10 P12
2. Part Number
4.1. Dimensions (LMK) 42 Terminal Configurations
8. Power up sequence
9. RF Characteristics
Oct. 13. 2016
C
P6
P8
P9 P10
P11
P16 P17
4.2. Pin configurations
4.3. Pin mux table
5. LED drive
6. Phototransistor
7. SPI flash requirements
9. Operating condition
10. External 32kHz crystal
14. Reference circuit
15. Recommended components
Oct. 20. 2016
D
P10
6. Phototransistor
Correct imp003 reference
Oct. 21. 2016
E
P3
1. Scope
Update cloud information
Mar. 14. 2017
F
P5
4.1. Dimensions
Correct Pin 1 Marking
Apr. 13. 2017
G
P5
P12
4. Dimensions, Marking and Terminal Configurations
9. Operating Condition
Correct Top view design
Correct the range of VDD_WLAN, VDDA_MCU and VDD_IO_MCU
Apr. 20. 2017
H
P5
4.1. Dimensions
Correct the marking.
Jun. 27. 2017
I
P3
1. Scope
Wording
Jul. 29. 2017
J
P1
P15
P16
P23
P17
P24
P34
Part number
7. SPI flash requirements
8. Required wiring for Bluetooth operation
15. Reference circuit
9. Absolute Maximum Rating
16.3 Flash memory
20. Regulatory Requirements
Updated from temp to production part number
Added SPI commands
Added Bluetooth connections
Correction
Updated part number recommendations
Added FCC and IC regulations for modular certification
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
TABLE OF CONTENTS
1. Scope ............................................................................................................................... 3!
2. Part Number ..................................................................................................................... 4!
3. Block Diagram .................................................................................................................. 5!
4. Dimensions, Marking and Terminal Configurations .......................................................... 6!
4.1. Dimensions ................................................................................................................ 6!
4.2. Terminal Configurations ............................................................................................. 9!
4.3. Pin Mux table ........................................................................................................... 12!
5. LED drive ........................................................................................................................ 13!
6. Phototransistor ............................................................................................................... 14!
7. SPI flash requirements ................................................................................................... 15!
8. Required wiring for Bluetooth operation ......................................................................... 16!
9. Absolute Maximum Rating ............................................................................................. 17!
10. Operating Condition ..................................................................................................... 17!
11. External 32.768 kHz Crystal ......................................................................................... 18!
12. Power Up Sequence .................................................................................................... 19!
12.1. Without RESET_L control ...................................................................................... 19!
12.2. With RESET_L control ........................................................................................... 19!
12.3. RESET_L Circuit .................................................................................................... 20!
13. Electrical Characteristics .............................................................................................. 21!
14. Land pattern (Top View) ............................................................................................... 22!
15. Reference Circuit .......................................................................................................... 23!
16. Recommended Components ........................................................................................ 23!
16.1. Bi-color LED ........................................................................................................... 23!
16.2. Phototransistor ....................................................................................................... 24!
16.3. SPI Flash ............................................................................................................... 24!
17. Tape and Reel Packing ................................................................................................ 25!
18. NOTICE ........................................................................................................................ 28!
18.1. Storage Conditions: ............................................................................................... 28!
18.2. Handling Conditions: .............................................................................................. 28!
18.3. Standard PCB Design (Land Pattern and Dimensions): ........................................ 28!
18.4. Notice for Chip Placer: ........................................................................................... 29!
18.5. Soldering Conditions: ............................................................................................. 30!
18.6. Cleaning: ................................................................................................................ 30!
18.7. Operational Environment Conditions: .................................................................... 30!
18.8. Input Power Capacity: ............................................................................................ 31!
19. PRECONDITION TO USE OUR PRODUCTS ............................................................. 32!
20. Regulatory requirements .............................................................................................. 33!
20.1. FCC Warning Notice .............................................................................................. 33!
20.2. IC Warning Notice .................................................................................................. 34!
Please be aware that an important notice concerning availability, standard warranty and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet.
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
1. Scope
This specification is for the LBEE5ZZ1MD (imp004m) module that provides connectivity to the internet via WiFi. The fully maintained, secure OS that is part of the Electric Imp cloud service comes pre-loaded.
802.11 b/g/n 1x1 WiFi
802.11b 17dBm (typ.)
802.11g 13dBm (typ.)
802.11n 12dBm (typ.) [20MHz channels] RX Sensitivity -98dBm (typ.) [@1Mbps] On-board antenna Supports WEP, WPA, WPA2, WPS
Bluetooth 4.1 BTLE support for WiFi configuration using GATT Automatically shares antenna with WiFi Optional: requires 4 MCU pins and stack license fee to enable functionality in commercial products
32-bit Cortex M4 processor
- Robust embedded operating system with fail-safe firmware updates
- Virtual machine for customer firmware
- 256kB of application bytecode flash
- Over 190kB of free application RAM
Electric Imp OS & service
- Robust embedded operating system with fail-safe, secure OS & Application updates
- Pre-provisioned MAC address & per-device secrets
- TLS1.2-RSA-ECDHE (forward secrecy) connection to cloud
- Elliptic curve challenge-response to prevent device impersonation
- Fully featured cloud VM for every device for easy integration with RESTful APIs
- Open source integrations with AWS, Azure, etc services
LED drive for red/green status LEDs
Phototransistor input for Electric imp’s patented BlinkUpTM technology for easy
configuration from any smartphone, tablet, or web browser
18 user selectable I/Os
- GPIO, PWM, Analog input, SPI, UART, I2C
- Dedicated SPI bus for local storage
Low power 14uA (typ.) sleep mode
- Option for coin cell RTC battery backup
Compliant with the RoHS directive
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
2. Part Number
Sample Part Number
LBEE5ZZ1MD-TEMP
Production Part Number
LBEE5ZZ1MD-011
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
3. Block Diagram
Note: 32.768KHz outside of module
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Preliminary
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Murata Manufacturing Co., Ltd.
4. Dimensions, Marking and Terminal Configurations
4.1. Dimensions
< Side View
>
< Top View >
< Top View >
XXXXXXXXX
(F)
imp004m
(E)
(B)
(G)
electricimp
(C)
(A)
Model:Type1MD
R 001-P01018
FCC:VPYLB1MDIMP004 IC :772C-LB1MDIMP004
(H)
(J)
(I)
(D)
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
Mark
Dimensions
Mark
Dimensions
Mark
Dimensions
L
21.0 +/- 0.2
W
17.5 +/- 0.2
T
2.3 max.
a1
0.4 +/- 0.1
a2
0.4 +/- 0.1
b1
0.2 +/- 0.2
b2
0.2 +/- 0.2
c1
0.8 +/- 0.1
c2
0.8 +/- 0.1
e1
0.3 +/- 0.1
e2
0.3 +/- 0.1
e3
2.2 +/- 0.1
e4
1.6 +/- 0.1
e5
2.1 +/- 0.1
e6
3.1 +/- 0.1
e7
2.5 +/- 0.1
m1
0.8 +/- 0.1
m2
0.8 +/- 0.1
m3
0.7 +/- 0.1
m4
0.8 +/- 0.1
(unit : mm)
Marking
Marking
Meaning
(A)
Pin 1 Marking
(B)
Murata Logo
(C)
Electric Imp Logo
(D)
Murata Module Type
(E)
Imp Module Type
(F)
Inspection Number
(G)
2D code
(H)
Japanese Type certification No.
(I)
FCC certification ID
(J)
IC certification No.
Structure
PWB
Metal!Case
PCB!Trace Antenna
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Preliminary
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Murata Manufacturing Co., Ltd.
Mounting
The module is designed to be mounted on the edge of the board, with the antenna section hanging off in free space. The antenna is tuned for free space operation. Please see the design guide on Electric Imp dev center website at http://www.electricimp.com/docs for more information.
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Preliminary
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Murata Manufacturing Co., Ltd.
4.2. Terminal Configurations
Top view (through package)
Preliminary Specification Number : SP-ZZ1MD-J
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Preliminary
< Specification may be changed by Murata without notice >
Murata Manufacturing Co., Ltd.
No.
Name
Type
Description
1
GND
GND
2
CLK_REQ
O
Reference clock request. As the clock is internal, this pin does not need to be connected
3
BT_REG_ON
I
Enable Bluetooth power. Leave NC if Bluetooth is not used (active high)
4
NC
-
No Connect
5
pinM
I/O
GPIO, i2cNM SDA, PWM
6
pinN
I/O
GPIO, i2cNM SCL, PWM
7
pinP
I/O
GPIO, i2cQP SDA, PWM, IRQ
8
pinW
I/O
GPIO, uartBCAW CTS, ADC, IRQ & wake from deep sleep (active high)
9
GND
GND
10
pinA
I/O
GPIO, uartBCAW RTS, spiAHSR MOSI, ADC, PWM
11
pinB
I/O
GPIO, uartBCAW TX, ADC, PWM, IRQ
12
pinC
I/O
GPIO, uartBCAW RX, ADC, IRQ
13
LPO_IN
I
Sleep Clock (for both WiFi & Bluetooth). If low power WiFi operation – or Bluetooth operation – is required, this pin should be connected to pinE. Otherwise, ground this pin.
14
pinD
I/O
GPIO, ADC, PWM, IRQ
15
pinE
I/O
GPIO, IRQ
16
pinK
I/O
GPIO, spiGJKL SCLK, ADC, PWM
17
pinL
I/O
GPIO, spiGJKL NSS, ADC, IRQ
18
GND
GND
19
VDD_IO_MCU
PWR
MCU/WLAN VIO
20
GND
GND
21
pinQ
I/O
GPIO, uartQ TX, i2cQP SCL, IRQ
22
pinR
I/O
GPIO, spiAHSR NSS, IRQ
23
pinS
I/O
GPIO, spiAHSR SCLK, IRQ
24
PSU_ENABLE
O
Active high when WiFi needs 2.7v+
25
pinF
I/O
GPIO, uartFGJH TX
26
pinG
I/O
GPIO, uartFGJH RX, spiGJKL MOSI
27
pinH
I/O
GPIO, uartFGJH CTS, uartHJ TX, spiAHSR MISO, IRQ
28
pinJ
I/O
GPIO, uartFGJH RTS, uartHJ RX, spiGJKL MISO, pulse counter
29
GND
GND
30
LED_RED
O
Red LED drive
31
LED_GREEN
O
Green LED drive
32
OPTO_IN
I
Phototransistor input
33
OPTO_BIAS
O
Phototransistor supply
34
FLASH_MOSI
O
SPI flash connection
35
FLASH_SCLK
O
SPI flash connection
36
FLASH_CS_L
O
SPI flash connection
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