Motorola XR900 User Manual

XR900 Series

Mass Storage Subsystem

User’s Manual

MCPIOSA/UM2

Notice

While reasonable efforts have been made to assure the accuracy of this document,
Motorola, Inc. assumes no liability resulting from any omissions in this document,
or from the use of the information obtained therein. Motorola r eserves the right to
revise this document and to make changes from time to time in the content hereof
without obligation of Motorola to notify any person of such revision or changes.

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Motorola products (machines and programs), programming, or services that are
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construed to mean that Motorola intends to announce such Motorola products,
programming, or services in your country.

Restricted Rights Legend

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Government, the following notice shall apply unless otherwise agreed to in
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Use, duplication, or disclosure by the Government is subject to restrictions as set
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Software clause at DFARS 252.227-7013.

Motorola, Inc.

Computer Group

2900 South Diablo Way

T empe, Arizona 85282

Preface

This manual provides general information, hardware preparation, installation
instructions and support information for the XR900 Series mass storage
subsystem, an SCSI peripheral expansion enclosure designed for use with
Modular VME System chassis. The Modular VME System is a family of system
enclosures that are configurable with a variety of card cage, storage drive, and
power supply options.

This manual is intended for anyone who wants to design OEM systems, supply
additional capability to an existing system, or use the equipment in a lab
environment for experimental purposes.

A basic knowledge of computers and digital logic is assumed.
Technical knowledge of energy and voltage hazards present in line-connected

electronic equipment is assumed.
T o use this manual, you may need to be familiar with the publications listed in the

Related Documentation section in Chapter 1 of this manual.

If any modifications are made to an XR900 Series chassis, the modifier assumes
responsibility for radio frequency interference issues. If any payload installed in a
Modular System (including the XR900 enclosure) is not totally supported by
Motorola, the integrator assumes responsibility for radio frequency interference.

Motorola

®

and the Motorola symbol are registered trademarks of Motorola, Inc.

All other products mentioned in this document are trademarks or registered
trademarks of their respective holders.

© Copyright Motorola, Inc. 1995

All Rights Reserved

Printed in the United States of America

May 1997

Safety Summary

Safety Depends On You

The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere in
this manual violates safety standards of design, manufacture, and intended use of the equipment.
Motorola, Inc. assumes no liability for the customer's failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Motorola is aware. Y ou,
as the user of the product, should follow these warnings and all other safety precautions necessary for the
safe operation of the equipment in your operating environment.

Ground the Instrument.

T o minimize shock hazard, the equipment chassis and enclosure must be connected to an electrical gr ound.
The equipment is supplied with a three-conductor ac power cable. The power cable must either be plugged
into an approved three-contact electrical outlet or used with a three-contact to two-contact adapter, with
the grounding wire (green) firmly connected to an electrical ground (safety ground) at the power outlet.
The power jack and mating plug of the power cable meet International Electrotechnical Commission (IEC)
safety standards.

Do Not Operate in an Explosive Atmosphere.

Do not operate the equipment in the presence of flammable gases or fumes. Operation of any electrical
equipment in such an environment constitutes a definite safety hazard.

Keep Away From Live Circuits.

Operating personnel must not remove equipment covers. Only Factory Authorized Service Personnel or
other qualified maintenance personnel may remove equipment covers for internal subassembly or
component replacement or any internal adjustment. Do not replace components with power cable
connected. Under certain conditions, dangerous voltages may exist even with the power cable removed. T o
avoid injuries, always disconnect power and discharge circuits before touching them.

Do Not Service or Adjust Alone.

Do not attempt internal service or adjustment unless another person capable of rendering first aid and
resuscitation is present.

Use Caution When Exposing or Handling the CRT.

Breakage of the Cathode-Ray Tube (CRT) causes a high-velocity scattering of glass fragments (implosion).
T o pr event CR T implosion, avoid rough handling or jarring of the equipment. Handling of the CR T should
be done only by qualified maintenance personnel using approved safety mask and gloves.

Do Not Substitute Parts or Modify Equipment.

Because of the danger of introducing additional hazards, do not install substitute parts or perform any
unauthorized modification of the equipment. Contact your local Motorola representative for service and
repair to ensure that safety features are maintained.

Dangerous Procedure Warnings.

Warnings, such as the example below, precede potentially danger ous procedures throughout this manual.
Instructions contained in the warnings must be followed. You should also employ all other safety
precautions which you deem necessary for the operation of the equipment in your operating environment.

Dangerous voltages, capable of causing death, are

!

WARNING

present in this equipment. Use extreme caution when
handling, testing, and adjusting.

!

WARNING

This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference when the equipment is operated in a
commercial environment. This equipment generates,
uses, and can radiate radio frequency energy, and if not
installed and used in accordance with the instruction
manual, may cause harmful interference to radio
communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in
which case the user will be required to correct the
interference at his own expense.

This digital apparatus does not exceed the Class A limits
for radio noise emissions from digital apparatus as set
out in the radio interference regulations of the Canadian
Department of Communications.

Le présent appareil numérique n’émet pas de bruits
radioélectriques dépassant les limites applicables aux
appareils numériques de Classe “A” prescrites dans le
règlement sur le brouillage radioélectrique édicté par le
Ministère des Communications du Canada.

CHAPTER 1 General Information

Contents

Introduction
General Description

Modular Chassis
XR900 Enclosure

Safety and Regulatory Compliance
Related Documentation
Manual Terminology

.....................................................................................................................1-1

.......................................................................................................1-1

......................................................................................................1-1

......................................................................................................1-2

Expansion Chassis
Power Supply
SCSI Backplane

...........................................................................................1-3

....................................................................................................1-3

.................................................................................................1-4

...................................................................1-7

........................................................................................1-8

..............................................................................................1-8

CHAPTER 2 Hardware Preparation and Installation

Introduction
Mounting Options
Hardware Preparation
Rack/Mast Mounting
Pedestal Mounting
Cabling

Data/Control Cables
Power Cables (AC Chassis)
Power Cables (DC Chassis)

Power Supply Limit Considerations
Chassis Cooling Considerations

CHAPTER 3 Operating Instructions

Controls and Indicators
Overtemperature Indicator
Test Switch
Environmental Monitor

Temperature Monitoring Function

.....................................................................................................................2-1

..........................................................................................................2-1

..................................................................................................2-1

...................................................................................................2-2

.........................................................................................................2-4

..............................................................................................................................2-8

..............................................................................................2-8

................................................................................ 2-11

................................................................................ 2-11

......................................................................2-13

..............................................................................2-14

................................................................................................3-1

.........................................................................................3-1

........................................................................................................................3-1

................................................................................................3-2

....................................................................3-2

vii

Power Supplies
Other Subassemblies

Assemblies Monitored
Voltage Monitoring Function
Recovery

.....................................................................................................................3-5

Operating Procedures

Recommended Power-On Procedure

XR900 Power Control

Remote interface

CHAPTER 4 Removal/Replacement Procedures

Recommended Power-Off Procedure
Emergency Power Removal

Introduction
Front Bezel

Removal
Replacement

......................................................................................................................4-1

........................................................................................................................4-2

......................................................................................................................4-2

..............................................................................................................4-2

Side Panel/Pedestal Cover

Side Panel Removal
Side Panel Replacement
Pedestal Cover Removal/Replacement

Power Supply

Removal
Replacement

Cooling Fan

Removal
Replacement

..................................................................................................................4-6

......................................................................................................................4-6

..............................................................................................................4-7

......................................................................................................................4-8

......................................................................................................................4-8

..............................................................................................................4-8

3 1/2- or 5 1/4-Inch Drive Modules

Removal
Replacement

......................................................................................................................4-9

............................................................................................................4-11

.................................................................................................3-3

.......................................................................................3-4

....................................................................................3-4

..............................................................................3-4

...................................................................................................3-5

...............................................................3-5

.....................................................................................3-7

...............................................................................................3-8

...............................................................3-9

.................................................................................3-9

..........................................................................................4-4

................................................................................................4-4

........................................................................................4-4

...........................................................4-5

.........................................................................4-9

CHAPTER 5 Support Information

Introduction

......................................................................................................................5-1

Parts List and Ordering Information

viii

........................................................................5-1

List of Figures

Figure 2-1. Flange Installation on the XR900 Chassis................................................2-3

Figure 2-2. Pedestal Cover Removal............................................................................2-5

Figure 2-3. Side Panel Removal.................................................................................... 2-6

Figure 2-4. Installing XR900 Chassis............................................................................ 2-7

Figure 2-5. SCSI and Environmental Monitor Connections................................... 2-10

Figure 2-6. DC Terminal Block....................................................................................2-12

Figure 4-1. Bezel Removal............................................................................................ 4-3

Figure 4-2. Side Panel Removal.................................................................................... 4-5

Figure 4-3. Power Supply Removal ............................................................................. 4-7

Figure 4-4. Drive Module Release Latches................................................................4-10

Figure 5-1. XR900 Series Chassis.................................................................................. 5-3

ix

x

List of Tables

Table 1-1. XR900 Enclosure Specifications.................................................................... 1-4

Table 1-2. XR900 Power Supply Specifications ............................................................ 1-5

Table 1-3. SCSI Backplane Specifications ...................................................................... 1-6

Table 2-1. Hardware Preparation Items ........................................................................ 2-2

Table 3-1. Environmental Monitor Connector Signals................................................ 3-8

Table 5-1. XR900 Chassis Parts List................................................................................ 5-2

xi

xii

1General Information

1

Introduction

This manual provides general information, hardware preparation
and installation instructions, removal/replacement procedures,
operating instructions, and support information for the XR900
series SCSI standalone peripheral expansion enclosure.
Throughout the rest of this manual, this enclosure may be referred
to as the XR900, or simply as the enclosure.

General Description

The XR900 is a member of the Modular VME System, a family of
standard chassis building blocks that can readily be adapted and
recombined to meet the needs of standard system customers,
component-level chassis customers, and buyers of special system
configurations for technical, industrial, and telecommunications
applications. Although the XR900 can be operated with any SCSI­compatible host, it is used most effectively with other Modular
VME System units.

Modular Chassis

The Modular Chassis ‘‘building block’’ approach supports a variety
of options in enclosure layout, payload composition, power
requirements, and system installation. 20-, 12-, and dual 9-slot card
cages are available with such features as:

❏

Support for a variety of VMEmodules and storage drives

❏

AC or DC power supplies

❏

Convenient front access to VMEmodules, fans, mass storage
drives, power supplies, and control boards

❏

Adaptability to floor, rack, or mast installation

1-1

1

General Information

XR900 Enclosure

For base chassis that have no built-in drive bays (e.g., the 20- and
dual 9-slot versions) or for applications that require additional
storage capacity in a mix of

1

5

/

4

-inch and 3

1

/

2

-inch drives, integral
and standalone SCSI peripheral expansion enclosures are available.
The integral enclosure is described in the

Chassis User’s Manual

. The standalone unit (the XR900 enclosure) is

Modular VME System

presented here.
There are two versions of the XR900 enclosure: the Single Ended

XR900 and the Differential XR900. The Single Ended version
accommodates 3

1

/

2

-inch and 5

1

/

4

-inch SCSI storage devices, such as
hard disk drives, floppy disk drives, streaming tape drives, or CD­ROM devices, as follows:

❏

Two bays for 3

❏

Two bays for 5

The Differential version accomodates 3

1

/

2

-inch hard disk drives

1

/

4

-inch or 3

1

/

2

-inch removable-media devices

1

/

2

-inch and 5

1

/

4

-inch

differential SCSI hard disk drives as follows:

❏

❏

Two 3
Two 5

1

/

2

-inch drive bays for differential hard disk drives

1

/

4

-inch drive bays for differential hard disk drives

Note The differential enclosure only supports differential

hard drives.

The XR900 is adaptable to both rack/mast and pedestal
installations. It is equipped with its own power supply, available in
versions for –48Vdc as well as for 115/230Vac inputs. For proper
airflow and regulatory compliance, a front bezel is supplied as
standard equipment for the enclosure.

The XR900 chassis is linked to its controller or host computer (the
associated Modular Chassis system) by an SCSI cable and (if the
environmental monitor function is to be used) an RJ45 cable. All

1-2

data transfers and control processes, including the switching of the
XR900 power supply on and off, occur under the control of the host
computer.

Note In applications involving a dual 9-slot system (Modular

The mass storage drives and power supplies are described in detail
in separate publications. Refer to the Related Documentation section
of this chapter for their titles and publication numbers.

The following sections present an overview of the XR900
enclosure’s major assemblies.

Expansion Chassis

The expansion chassis houses the drive enclosure. A backplane
located in the rear distributes DC power and interfaces SCSI signals
to the drives. Power is furnished by a 100W AC or DC power
supply located beside the drive enclosure.

General Description

1

Chassis model MC1209), the XR900 chassis serves one
side or the other, but not both at once.

Power Supply

Note Temperature and humidity limits are determined

primarily by tape and disk drives. Broader temperature
and humidity limits may be possible, depending on the
characteristics of the specific drives installed in the
enclosure.

DC power to the XR900 drives and fan assembly comes from a
UL/CSA/VDE-approved 100W autoranging power supply
module. Power supply modules are available in both –48Vdc- and
115/230Vac-compatible versions, each providing +5Vdc and

1-3

1

General Information

Table 1-1. XR900 Enclosure Specifications

Characteristics Specifications

Physical characteristics

Height
Width

Depth
Weight (fully loaded)

Temperature

Operating
Storage and transit

Relative humidity

Operating
Storage and transit

Altitude

Operating
Storage and transit

+12Vdc to the enclosure. The power supply module is installed next
to the drive enclosure and is cooled by the air drawn through the
expansion chassis.

5.25 in. (133 mm)

19.0 in. (483 mm) w/o flange extensions

23.0 in. (584 mm) with flange extensions

13.5 in. (343 mm) with bezel
25 lb. (11.4 kg)

0˚ to 50˚ C (32˚ to 122˚ F)

−40˚C to 70˚C (−40˚ to 158˚ F)

20% to 80% noncondensing
10% to 95% noncondensing

0 to 10,000 feet (3048 m)
0 to 30,000 feet (9144 m)

The AC or DC input to the power supply is through a power cord
or terminal block connection at the rear of the chassis. The power
supply plugs into the SCSI backplane for power distribution to the
mass storage drives.

The power supply modules are not adjustable when they are
installed in the XR900 enclosure. If you suspect that a power supply
may be out of adjustment, replace it with a known good power
supply.

SCSI Backplane

The XR900 mass storage drives and power supply plug into an SCSI
backplane mounted behind the drive enclosure. The backplane
provides:

1-4

General Description

Table 1-2. XR900 Power Supply Specifications

Characteristics Specifications

Physical characteristics

Height
Width
Length

Temperature

Operating

Storage and transit
Relative humidity 0% to 90% noncondensing
Altitude

Operating

Storage and transit
Power ratings

Input voltage (DC)

Input voltage (AC)

4.0 in. (102 mm)

2.4 in. (61 mm)

9.0 in. (229 mm)

0˚ to 50˚ C (32˚ to 122˚ F)

−55˚ to 85˚ C (−67˚ to 185˚F)

0 to 10,000 feet (3048 m)
0 to 30,000 feet (9144 m)

−36Vdc to −76Vdc
90-132Vac, 190-260Vac, 47-63Hz

1

Output voltages

+5Vdc @ 5A
+12Vdc @ 8A (10A peak)

Output power

100W maximum (total from all
outputs)

❏ Support for four SCSI mass storage drives (the two left-hand

bays accommodate 3
hand bays accommodate 5

1

/2-inch hard disk drives; the two right-

1

/4-inch or 3

1

/2-inch removable-

media drives)

Note The differential enclosure only supports four

differential hard drives.

❏ All drive power connections and SCSI signal lines for the

above devices

1-5

1

General Information

Table 1-3. SCSI Backplane Specifications

Characteristics Specifications

Physical characteristics

Height
Width
Thickness

Temperature

Operating

Storage and transit
Relative humidity 0% to 90% noncondensing
Power consumption

(without drive modules)
SCSI sockets DIN 64CSB, 96-pin. Socket

4.1 inches (104mm)

11.6 inches (295mm)

0.062 inches (1.58mm) typical

0˚C to 55˚C (32˚F to 131˚F)

−55˚C to +85˚C (−67˚F to 185˚F)

0.5W-1W (0.1A-0.2A at +5V)

spacing (center to center) 0.1 inch.

1-6

Safety and Regulatory Compliance

All systems integrated by Motorola meet the standards claimed for
those systems with regard to electromagnetic interference (EMI)
and radio frequency interference (RFI). It is possible, however, to
install drives in the XR900 enclosure that produce a Modular
Chassis system not in compliance with the applicable emission
limits. It is the integrator’s responsibility to design a payload that
does meet the desired standards.

When Motorola integrates a payload into a Modular Chassis
system (including the XR900 enclosure), it is often necessary to
modify the payload in order for the system to pass RFI standards.
The following is a list of conditions that in general must be met for
the XR900 to achieve FCC compliance as a component of a Modular
Chassis system:

❏ At a minimum, the chassis should be connected to earth

ground through the safety ground wire in the power cord.
Where feasible, the chassis ground connection on the back of
the card cage (
provide a path for connecting shields to earth ground.

1

/4 x 20 thread) should be used as well. These

General Description

1

❏ All external I/O cables should be high-quality shielded types

with metal shell connectors.

For minimum RF emissions, it is essential that the foregoing
conditions be implemented. Failure to do so could compromise the
FCC compliance of all payloads.

This product, as configured and shipped by Motorola, has been
designed and tested for compliance with the following RFI
standards and product safety regulations:

❏ Emissions: FCC class A; Vfg 243/1991, Vfg 46/1992, class B
❏ Safety: UL 1950; CSA C22.2/950; VDE EN 60 950; IEC 950

1-7

1

General Information

Related Documentation

The Motorola publications listed below are referenced in this
document. If not shipped with this product, they may be purchased
by contacting your local Motorola sales office. Non-Motorola
documents may be obtained from the sources listed.

Document Title

Disk/Tape Drive Reference Sheets MDRIVE
Power Supply Reference Sheets MPWRSUP

Publication

Number

Note Although not shown in the above list, each Motorola

Group manual publication number is suffixed with
characters which represent the revision level of the
document, such as “/D2” (the second revision of a
manual). A supplement to a manual bears the same
number as the manual but has a suffix such as
“/D2A1” (the first supplement to the second edition of
the manual).

The following publication is available from the source indicated:

ANSI Small Computer System Interface-2 (SCSI-2), Draft Document
X3.131-198X, Revision 10c; Global Engineering Documents, P.O.

Box 19539, Irvine, CA 92714.

Manual T erminology

An asterisk (∗) following the name of a level-significant signal
indicates that the signal is true or valid when the signal is low.

An asterisk (∗) following the name of an edge-significant signal
indicates that the actions initiated by that signal occur on a high-to­low transition.

1-8

2Hardware Preparation and

Introduction

This chapter includes hardware preparation and installation
directions for the XR900 enclosure. Directions for installing or
replacing the various subassemblies are in the
Removal/Replacement procedures in Chapter 5.

Mounting Options

A Modular VME System can be rack-mounted, mast-mounted (as
in a telecommunications environment) or set up in a floor-standing
pedestal configuration. The system may include multiple chassis
components, which interconnect vertically with a latching
mechanism.

As a member of the Modular VME System, the XR900 is adaptable
to both rack/mast and pedestal installations. For proper airflow
and regulatory compliance, a front bezel is supplied as standard
equipment for the enclosure.

Installation

2

Hardware Preparation

There are a number of items to check or tasks to perform before you
apply power to the enclosure. These items include, but are not
limited to, the items summarized in Table 2-1.

Dangerous voltages, capable of causing death, are

!

Warning

present in this equipment. Use extreme caution when
handling, testing, and adjusting.

2-1

Hardware Preparation and Installation

2

!

Caution

Unless otherwise instructed, perform all hardware
preparation and/or installation with power
disconnected. Installing or removing hardware items
(drive modules, cables, etc.) while power is applied may
damage the equipment.

Table 2-1. Hardware Preparation Items

Item Location of Instructions

Setting jumper options on drive modules
used in this chassis (as required)

Installing drive modules User’s manual for the respective module(s)
Installing external cables (as required) Installation instructions in this manual, also other

Mounting chassis in rack, on mast, or on
pedestal

User’s manual for the respective drive module(s)

user’s manual(s) as applicable
Installation instructions in this chapter

Rack/Mast Mounting

2-2

The XR900 chassis, like other Modular Chassis system enclosures,
can be installed without modification in a standard 19-inch RETMA
(or equivalent) equipment rack. With minor modifications, it can
also be installed on a 19-inch mast (as in telecommunications
installations), or in a 23-inch rack or mast. The procedure is the
same in all cases. To rack- or mast-mount the chassis, proceed as
follows:

1. Remove the blank bezel from the desired rack mounting
location, if a bezel is installed.

2. Remove the bezel from the XR900 chassis, if a bezel is
installed.

Rack/Mast Mounting

3. Determine the width of the rack or mast and, if necessary,
attach a pair of mounting flanges to the sides of the chassis in
the appropriate locations. Flanges for the right and left sides
are identical.

– For 19-inch rack mounting, use the existing flanges formed

in the sheet metal at the forward corners of the chassis.

– For a 19-inch mast installation, mount a set of flanges at

the center (see Figure 2-1), narrow side out.

– For a 23-inch rack or mast installation, mount the flanges

wide side out (at the forward corners for a rack, at the
center for a mast).

FOR 19-INCH INSTALLATIONS

OPTIONAL CENTER LOCATION
FOR MOUNTING FLANGES

2

FOR 23-INCH INSTALLATIONS

11276.00 9503

Figure 2-1. Flange Installation on the XR900 Chassis

2-3

Hardware Preparation and Installation

2

4. Remove the side and back panels of the rack as necessary to
gain access to the interior for chassis installation.

!

Caution

The next two steps are a two-person operation.

5. Position the chassis in the selected rack bay or mast location
and align the slots in the chassis flanges with the
corresponding holes in the frame rails of the rack or mast.

6. Install screws at those locations to secure the chassis in
position.

7. Reinstall the front bezel on the XR900 chassis.

Pedestal Mounting

The XR900 chassis, like the integrated SCSI peripheral expansion
chassis described in the Modular VME System Chassis User’s Manual,
can be mounted directly atop the Modular Chassis in a pedestal
configuration. It can also be installed on top of an existing
integrated peripheral expansion chassis in a pedestal configuration.
Although the XR900 uses no guide pins and (unlike the integrated
chassis) receives power through an external cord rather than from
the VME card cage, the pedestal installation procedure is similar.
To pedestal-mount the XR900 chassis, proceed as follows:

1. Switch all Modular Chassis power to

2-4

ST ANDBY and disconnect

the power cord(s) from the AC or DC power source:
– If the power supply is an AC unit, unplug the power cord

from the AC outlet.

– If the power supply is a DC unit, turn off the –48Vdc

power source and disconnect the DC leads from the power
supply input.

Pedestal Mounting

2. Remove the Modular Chassis pedestal cover by removing the
two screws at the back edge of the cover and sliding it off the
chassis.

111058.00 9410 (2-2)

3. Remove the bezel from the XR900 chassis, if a bezel is
installed.

2

Figure 2-2. Pedestal Cover Removal

4. Remove the bezel and side panels from the supporting
pedestal unit.

– If the XR900 is to be mounted on an existing integral SCSI

peripheral expansion chassis, remove the bezel and side
panels from that enclosure. The bezel and panels on the
Modular Chassis underneath can be left in place.

2-5

Hardware Preparation and Installation

2

Chassis enclosure, remove the bezel and side panels from
that enclosure.

– If the XR900 is to be mounted directly on a Modular

2-6

11064.00 9503

Figure 2-3. Side Panel Removal

5. Remove the stacking brackets from the top section of the
supporting pedestal unit.

6. Place the XR900 chassis on top of the pedestal unit. Fasten the
XR900 to the pedestal unit with the stacking brackets
removed in the preceding step.

7. Install a second set of stacking brackets (supplied with the
chassis) on the upper section of the XR900.

8. Reinstall the bezel and side panels removed from the
supporting pedestal unit in step 4.

EXPANSION CHASSIS

CARD CAGE

11050.00 9503

Pedestal Mounting

2

9. Install the bezel and side panels supplied with the XR900
chassis on the XR900.

10. Install the pedestal cover removed in step 2 on the XR900.

Figure 2-4. Installing XR900 Chassis

2-7

Hardware Preparation and Installation

2

Cabling

After you have completed the rack or pedestal installation of the
XR900 chassis and associated equipment, proceed as follows to
cable the hardware together.

Note All rack cabling should be contained within the rack

bay. Cabling to external peripheral equipment should
be routed through the rear panel of the rack.

Data/Control Cables

1. Attach one end of an SCSI cable to the lower of the two 68-pin
connectors labeled
(Figure 2-5).

Note For the differential enclosure, make sure the cabling is

connected to a differential controller.

2. Locate the upper SCSI connector on the back of the existing
integral SCSI peripheral expansion chassis (if one is present)
or the appropriate SCSI connector on the back of the Modular
Chassis. Remove the terminator block and plug the other end
of the SCSI cable into that connector.

SCSI on the back of the XR900 chassis

3. Move the terminator block to the unused upper SCSI

Note On the differential enclosure, you must use a

4. To connect the environmental monitor circuitry, attach an

2-8

connector on the XR900 chassis.

differential terminator.

RJ45 cable to the lower of the two RJ45 connectors (identified

Cabling

with a ‘‘no telephone’’ graphic) on the back of the XR900
chassis.

5. Plug the other end of the cable into the upper RJ45 connector
on the back of the existing integral SCSI peripheral expansion
chassis (if one is present) or into the appropriate RJ45 control
board connector on the back of the Modular Chassis.

6. Cable all other associated equipment (terminals, printers,
etc.) to the system as described in the installation guides for
those peripherals.

2

2-9

Hardware Preparation and Installation

2

SCSI TERMINATOR

SCSI CABLE

ENVIRONMENTAL
MONITOR CABLE

Figure 2-5. SCSI and Environmental Monitor Connections

2-10

11063.00 9409

Cabling

Power Cables (AC Chassis)

1. Plug the socket end of the XR900 power cord into the AC
power inlet located on the upper back panel.

2. Plug the socket end of the Modular Chassis power cord into
the AC power inlet located on the lower back panel.

3. Plug the socket end of the console terminal’s power cord into
the AC power inlet on the back of the terminal.

4. Attach power cords to all other associated equipment.

5. Plug the power cords into appropriate electrical outlets (if
any of the equipment is rack-mounted, the rack may be
equipped with power distribution modules).

Power Cables (DC Chassis)

1. Power down the –48Vdc supply.

Use a –48Vdc supply source that is electrically isolated

!

Caution

from the main DC source. The –48Vdc source is to be
reliably connected to earth.

2

!

Caution

2. Guide the free end of a DC power cable, with about
insulation stripped from the wires, to the terminal block
supplied with the XR900 DC chassis. Clamp the DC leads
(positive, negative, and ground) to the terminal block as
illustrated in Figure 2-6.

The connection to DC power consists of three #10 AWG
wire leads. To avoid grounds or shorts, exercise care
when securing the wires to the terminal block.

1

/2 inch of

2-11

Hardware Preparation and Installation

2

Note For additional protection if the conditions of the site

call for it, you may wish to also use the chassis ground
point on the rear wall of the unit (the GND connection
with a
set of SCSI and RJ45 connectors). This ground point is
to be connected to the equipment rack or other reliable
path to earth ground.

1

/4 x 20 thread located to the right of the upper

2-12

+48VDC

−48VDC

GROUND

11302.00 9503

Figure 2-6. DC Terminal Block

Power Supply Limit Considerations

3. Assemble the clam-shell connector housing around the
terminal block as shown in Figure 2-6. Secure a length of
Tyrap around the housing to reinforce the assembly.

4. Plug the assembled connector into the DC power inlet located
on the upper back panel of the XR900.

5. If there is other equipment requiring DC power, cable those
devices to the DC source as described in the associated
installation guides.

6. For AC equipment such as the system console, plug the
socket end of the unit's power cord into the AC power inlet
on the back of the unit.

7. Plug the power cord of the console terminal (and any other
AC equipment) into an electrical outlet.

8. Turn the DC power back on.

Power Supply Limit Considerations

The XR900 chassis, like the Modular Chassis, can be equipped with
a power supply module accepting either –48Vdc or 115/230Vac
inputs. The +5Vdc output is rated at 5A. The +12Vdc output is rated
at 8A.

2

The system integrator must ensure that the installed

!

Caution

peripheral devices do not exceed the power supply
rating.

The current rating for the individual outputs must not be exceeded,
and the total power supply output power must not exceed 100
watts.

2-13

Hardware Preparation and Installation

2

Chassis Cooling Considerations

It is essential that all modules used in the system be properly
cooled. The following information is supplied to help determine
whether the cooling is adequate.

Modular Chassis equipment, including the XR900 chassis, is
designed for an input air temperature below 50° C (122° F). The
XR900’s DC-powered fan provides forced-air cooling for the power
supply module and mass storage drives. Cooling air is drawn in the
front of the module and vented out through the lower back panel of
the chassis.

Note that for tape storage media, a maximum safe temperature of
50° C (122° F) is specified. Since the operating temperatures within
the chassis will always be greater than the air inlet temperature,
avoid using tapes if the inlet temperature exceeds 40° C (104° F).

To provide adequate cooling:

❏ The air space behind the chassis must not be blocked, and the

fan inlet screen must be clean.

❏ The air inlet temperature must not exceed 50° C/122° F (or

40° C/104° F if storage tapes are used). When the XR900 is
installed in a rack with other chassis, be sure that each chassis
in the rack is provided with its own supply of cooling air. Do
not use air heated by one chassis to “cool” another chassis.

❏ In rack installations, the side and back panels of the rack must

The system is designed for use in a relatively clean (office or lab)
environment. To assure reliable operation in an industrial
environment, you may need to provide protection against airborne
particles and other contaminants, especially for the disk or tape
drives and their associated media.

2-14

be in place. All unoccupied rack mount locations must be
covered with blank bezels.

3Operating Instructions

Controls and Indicators

This chapter describes the controls, indicators, and operating
procedures for the XR900 chassis. Only those controls that are part
of the base chassis configuration are described here; many of the
mass storage modules used in the chassis are equipped with
controls and/or indicators of their own. For a description of the
controls and indicators on a specific module, refer to the user’s
manual for that module.

Overtemperature Indicator

The Overtemperature LED (located next to the SCSI connectors on
the back panel of the XR900 chassis) turns on when the temperature
sensor in the enclosure is not adequately cooled. At that point,
Motorola-supported SCSI devices in the XR900 (and most other
SCSI devices) are approaching their upper temperature limits but
are not in danger of immediate damage. The sensor temperature is
typically about 20˚ F above ambient temperature.

3

Test Switch

Near the SCSI connectors on the lower back panel of the XR900
chassis is a test switch, used for calibration purposes at the factory.
The switch needs to be in the
supply to operate; flipping the switch disables the unit.

TEST position for the XR900 power

3-1

Operating Instructions

Environmental Monitor

An environmental monitoring function to track enclosure

3

Temperature Monitoring Function

temperatures and operating voltages is incorporated into the
Modular Chassis system design. The extent of coverage can be
specified when the equipment is ordered.

In the Modular Chassis, power supply outputs and temperatures
are always monitored. A backplane temperature sensor is available
as an option; with the sensor installed, card cage temperatures are
monitored as well.

The XR900 chassis has no power supply monitoring, but is
equipped with a backplane temperature sensor. As long as the RJ45
cable is installed, XR900 temperatures are monitored along with
Modular Chassis power supply voltages/temperatures and
(optionally) card cage temperatures.

3-2

The Overtemperature LED on the front panel of the Modular
Chassis indicates the presence of excessive operating temperatures
within one or more of the following subassemblies:

❏ The Modular Chassis power supply
❏ The Modular Chassis card cage (if an optional backplane

thermal sensor is installed)

❏ The integral and/or standalone SCSI peripheral expansion

enclosures (if installed)

In addition, the XR900 enclosure has an Overtemperature LED of its
own on the back panel.

Power Supplies

Two temperature thresholds exist in Modular Chassis system
power supplies. In the event of a heat buildup beyond the lower
threshold within a monitored power supply, thermal protection
circuitry illuminates the Overtemperature LED on the front panel
of the Modular Chassis.

Note If the XR900 is the location of the overtemperature

If temperatures climb further, beyond the higher threshold of
maximum safe ratings, an
and the affected power supply is shut down automatically.

At the lower threshold, Motorola-supported SCSI devices in the
XR900 enclosure and most other SCSI devices are approaching their
upper temperature limits but are not in danger of immediate
damage. Several conditions can trigger the alarm:

Environmental Monitor

3

condition, its Overtemperature LED also illuminates.

ACFAIL signal is placed on the VMEbus

❏ A failed fan in a warm environment
❏ Blocked airflow in or out of the enclosure
❏ An ambient temperature near the specified limits of the

enclosure (50˚ C/122˚ F)

The Overtemperature LED turns off when the cooling problem is
corrected if the correction is made before the power supply sensor
warms another 5˚ F to system shutdown. Powering down to correct
a problem may not be necessary, because many failures are caused
by nothing more than inadvertent blockages of the airflow. Prompt
removal of a blockage allows recovery without a shutdown of
system power. In general, power should not be removed from the
system until a normal system shutdown is completed.

3-3

Operating Instructions

Other Subassemblies

In other parts of the system, temperature sensors provide only the
lower threshold warning. As with power supplies, a heat buildup

3

beyond the first threshold within a monitored subassembly
illuminates the warning LED on the front of the Modular Chassis.
If temperatures climb further, however, no power shutdown
occurs.

Assemblies Monitored

In all cases, the temperature monitoring function covers:

❏ The Modular Chassis power supply
❏ The integral and/or standalone SCSI peripheral expansion

enclosures (provided that the cables are installed)

If an optional backplane thermal sensor is installed, the
temperature monitoring function also covers the Modular Chassis
card cage.

Voltage Monitoring Function

Similarly, overvoltage protection circuitry monitors the power
supply inputs and outputs. If the –48Vdc or 115/230Vac inputs of a
monitored power supply go out of range, or if the +5Vdc output
strays out of tolerance and remains so, the defective power supply
is shut down automatically.

This function is confined to the Modular Chassis itself; voltage
monitoring does not extend to the SCSI peripheral expansion
enclosures.

3-4

Recovery

The surest way to reset the power distribution system after a
shutdown triggered by the environmental monitor is to cycle the
primary power (remove and reconnect the –48Vdc or 115/230Vac
input power).

In systems with a redundant power supply, setting the key switch
on the Modular Chassis to
or undervoltage failure does restart the power supply, but requires
that the operating system first be shut down.

Operating Procedures

System operation with a Modular Chassis and XR900 is entirely
dependent on your choice of modules and software. Only the basic
power on/power off procedure and remote interface are discussed
here. For additional operational information, refer to the user’s
manual(s) for the modules used in the chassis.

Operating Procedures

3

STANDBY and back to RUN after a thermal

Recommended Power-On Procedure

The XR900 has no power switch. The power supply cycles on and
off under the control of the host computer (i.e., through application
of the SCSI
and if that fuse blows, it is advisable to replace the power supply.

1. Verify that all chassis, modules, and associated data/control

2. On the Modular Chassis, verify that the power switch is set to

TERMPWR signal). The only fuse is in the power supply

cabling are properly configured and installed. If the system is
rack-mounted, also check that all required external cabling
(to non-rack-mounted equipment) is correctly installed.

STANDBY (off).

3-5

Operating Instructions

Note If the power switch is in the RUN position when the line

cord is connected to a power source, the outputs of the
Modular Chassis power supply cycle on immediately.

3

3. Verify that the Modular Chassis and the XR900 have been
connected to a –48Vdc or 115/230Vac input power source (as
appropriate to the installation and system configuration).

The voltage on the rating label adjacent to the power

!

Caution

receptacle must agree with the type of line cord and the
applied voltage.

4. Insert the key and turn the Modular Chassis power switch to

RUN (on).

5. If the system incorporates a dual 9-slot chassis, repeat steps 3
and 4 for System B.

The fans run while power is on. The indicator LED on the
front panel of each Modular Chassis power supply
illuminates as long as the power supply remains connected to
a –48Vdc or 115/230Vac input power source and is free of
defects.

!

Caution

3-6

To ensure adequate cooling, all fans in the system must
be running. If any of the fans do not run, shut the system
down and correct the problem before continuing.

6. When the system is operating correctly, remove the key to
prevent tampering with the power switch.

Note Locking the system is not required, but is

recommended to prevent accidental resetting or
powering off.

XR900 Power Control

When the AC or DC power cord is attached at the upper left rear
corner of the chassis and connected to an appropriate power source,
DC power within the enclosure is controlled during normal
operation through SCSI terminator power. When the host (the
Modular Chassis) is powered up, the XR900 detects the presence of
the

TERMPWR signal and powers itself up in response. When

terminator power is removed by the host, the XR900 powers down.
A loss-of-cooling shutdown triggered by the environmental

monitor can be reset by cycling any power-controlling input off and
back on. If the cooling sensor has cooled sufficiently, the shutdown
condition then resets.

If the power supply fuse blows, the power supply should be
considered as failed and should be replaced. Damage to the drives
in the enclosure can occur if the fuse opened as a consequence of
component failure in the power supply. Overloading or shorting
the outputs of the power supply does not cause the fuse to blow.

Operating Procedures

3

3-7

Operating Instructions

Remote interface

The remote interface is designed to interconnect with an
environmental monitor I/O port on the host computer. Each pin

3

connection, signal mnemonic, and signal characteristic for the
connector is listed in the following table.

Table 3-1. Environmental Monitor Connector Signals

Pin

Number

1, 8 SVCCFAIL∗ Active-low output from SCSI backplane indicating a DC

2, 7 DISKOT∗ Active-low output that illuminates the Overtemperature

3, 6 GND Signal return path.
4, 5 DCEN∗ Open-collector active-low input from host. When low,

Signal

Mnemonic

Signal Name and Description

power problem. SVCCFAIL∗ activates if the +5Vdc
power supply output falls below 0.5 volts.

In installations with multiple peripheral expansion
enclosures, any enclosure on the environmental monitor
bus can pull SVCCFAIL∗ down to its active low state.
Check the power-on LEDs on the drives to identify the
faulty unit.

LED to indicate a cooling problem. Activates at a slightly
lower sensor temperature than cooling failure shutdown,
so that system operation can continue if the problem is
corrected promptly.

remotely enables the XR900 power supply (i.e., the
power supply turns on if the SCSI TERMPWR signal is
present). When high, disables the XR900 power supply.
When open, passes control of the power supply to the
SCSI TERMPWR signal.

3-8

Recommended Power-Off Procedure

As described in the previous section, the XR900 has no power
switch. The power supply cycles on and off under the control of the
host computer. Powering down the Modular Chassis also powers
down the XR900 chassis.

Note Ensure that proper software shutdown procedures

have been followed before you continue.

1. Insert the key and turn the Modular Chassis power switch to

STANDBY (off). The power supply cycles down, but the power

status LED on the power supply remains on, indicating that
primary power is still present.

2. If the system incorporates a dual 9-slot chassis, repeat step 1
for System B.

3. If the chassis is to be powered down for a long time or will be
left unattended, remove the key to prevent tampering with
the power switch.

Operating Procedures

3

Emergency Power Removal

In the event of an emergency, pull the AC or DC power cable from
the rear of the enclosure. There are no user-accessible circuit
breakers on the chassis.

3-9

Operating Instructions

3

3-10

4Removal/Replacement

Introduction

This chapter describes recommended procedures for the removal
and replacement of major assemblies and/or components of the
XR900 chassis. For identification and location of the assemblies and
parts mentioned in these procedures, refer to the drawings and
parts lists in Chapter 6.

The removal/replacement procedures are organized and presented
in the following order:

❏ Front bezel
❏ Side panels and pedestal cover
❏ Power supply
❏ Cooling fan
❏ 3

Procedures

1

/2- or 5 1/4-inch drive modules

4

!

Warning

!

Caution

Dangerous voltages, capable of causing death, are
present in this equipment. Use extreme caution when
handling, testing, and adjusting the equipment.

Do not remove power from an operating system
without taking the necessary steps to prevent damage to
the software, the peripherals, or their contents.

4-1

Removal/Replacement Procedures

4

Front Bezel

The XR900 front bezel (as well as the bezels for the Modular Chassis
card cage, fan trays, and power supplies) can be used in both
pedestal and rack/mast chassis configurations. The bezel is a
requirement for complete RFI shielding in either configuration. The
9U bezels used on the larger enclosures of a Modular Chassis
system are mounted on ball studs at the bottom and latched at the
top; the 3U bezel used on the XR900 enclosure is simply latched.
Screwdriver-operated locks at the upper corners prevent the
latches from being arbitrarily disengaged.

The suggested procedure for removal and replacement of the
XR900 front bezel is as follows:

Removal

1. Unlock the bezel latches (Figure 5-1) by rotating the locks a
quarter-turn inward from the ‘‘locked’’ icon to the
‘‘unlocked’’ icon with a Phillips screwdriver (clockwise on
the left side, counterclockwise on the right).

Replacement

4-2

2. Unlatch the bezel from the enclosure by pressing the latch
buttons at either side of the bezel and pulling straight out.

1. Press the sides of the bezel against the enclosure until the
latches at the sides snap into place.

2. Lock the bezel latches by rotating the locks a quarter-turn
outward from the ‘‘unlocked’’ icon to the ‘‘locked’’ icon with
a Phillips screwdriver.

4

BEZEL LOCKS
(1 EACH SIDE)

LATCH BUTTONS
(1 EACH SIDE)

Front Bezel

11051.00 9408

Figure 4-1. Bezel Removal

4-3

Removal/Replacement Procedures

4

Side Panel/Pedestal Cover

The Modular Chassis pedestal configuration incorporates side
panels for the various system enclosures (including the XR900
chassis) and a pedestal cover. The inner surfaces of the panels and
cover are molded with slots that engage slide hooks mounted on
the corresponding enclosure. In addition, the side panels are fitted
with latching mechanisms.

The suggested procedure for removal and replacement of XR900
side panel assemblies is as follows:

Side Panel Removal

1. Remove the front bezel.

2. Unlock the side panel assembly (Figure 5-2) by squeezing the
inner latch levers at the forward edge with one hand and
simultaneously slide the assembly backward approximately
an inch until it clears the slide hooks on the chassis.

Hand clearance in the latch area is limited. Work

!

Caution

carefully to avoid injury to fingers.

3. Lift the assembly off the chassis.

4. Repeat steps 2 and 3 at the opposite side of the chassis.

Side Panel Replacement

1. Engage the slots of the panel assembly with the slide hooks
on the enclosure and slide the panel assembly forward until
the latch snaps into place.

2. Repeat step 1 at the opposite side of the chassis.

3. Reinstall the front bezel.

4-4

Side Panel/Pedestal Cover

4

Figure 4-2. Side Panel Removal

Pedestal Cover Removal/Replacement

The pedestal cover is mounted with the same type of hardware as
the side panels, but no latch is used. Instead, two screws on the back
edge near the corners hold the cover in place. The removal
procedure consists of simply removing the screws, then sliding the
cover backward and disengaging it from the slide hooks.
Replacement is the reverse.

11064.00 9503

4-5

Removal/Replacement Procedures

4

Power Supply

The power supply module (Figure 5-3) is installed at the right side
of the drive bays in the XR900 chassis. The power supply receives
–48Vdc or 115/230Vac input power directly through its back panel.
The power supply outputs are cabled to the cooling fan and to a
backplane connector, which applies operating voltages from the
power supply to the mass storage modules.

Removal of a power supply module involves exposure

!

Caution

to high voltages. Avoid touching the connectors. Allow
one minute for the capacitors in the power supply to
discharge.

The suggested procedure for removal and replacement of the
XR900 power supply module is as follows:

Removal

4-6

1. Switch the power supply of the host system to STANDBY.

2. Disconnect the input power source from the XR900 chassis:
– If the power supply is an AC unit, unplug the power cord

from the AC outlet (the other end of the cord disconnects
automatically when you remove the module from the
chassis).

– If the power supply is a DC unit, turn off the –48Vdc

power source and unplug the DC connector from the
power supply input.

3. Remove the XR900 bezel, if installed.

4. At the upper right corner of the power supply module, loosen
the captive screw that holds the module in the chassis.

5. Slide the module out.

Power Supply

4

11276.00 9503 (1-2)

Replacement

Figure 4-3. Power Supply Removal

1. Slide the power supply module carefully into the chassis. Use
firm steady pressure to seat the connector properly.

2. Tighten the captive screw that holds the module in the
chassis.

3. Reinstall the XR900 bezel, if the installation includes one.

4. Reconnect the module to the AC or DC power source:
– If the power supply is an AC unit, plug the power cord

back into the module and the AC outlet.

– If the power supply is a DC unit, plug the DC connector

into the power supply input and turn the –48Vdc power
source back on.

4-7

Removal/Replacement Procedures

4

Cooling Fan

The DC-powered fan mounted on the power supply module
provides forced-air cooling for the power supply and the mass
storage drives.

The suggested procedure for removal and replacement of the
cooling fan is as follows:

Removal

1. Remove the power supply module as described in the
previous section.

2. Using a flat-tipped screwdriver, remove the three screws that
secure the fan and finger guard to the power supply
assembly.

3. While still keeping the power supply assembly and fan
together, move the fan aside far enough to reach in and
unplug the fan connector from its mating connector on the
side of the power supply assembly.

Replacement

4-8

4. Remove the fan.

1. Plug the fan wire connector into its mating connector on the
side of the power supply assembly.

2. Attach the new fan and finger guard to the power supply
assembly with the hardware removed in step 2 above.

3. Reinstall the power supply module as described in the
previous section.

3 1/2- or 5 1/4-Inch Drive Modules

4

1

3

/2- or 5

Removal

1

/4-Inch Drive Modules

The SCSI peripheral expansion enclosure contains up to four half­height storage devices. Two bays accommodate 3
only. The other two bays accommodate either 3

1

/2-inch devices

1

/2-inch or 5 1/4-inch

devices.
The suggested procedure for removal and replacement of 3

1

5

/4-inch drive modules is as follows:

1

/2- or

1. Switch the power supply of the host system to STANDBY.

2. Disconnect the input power source from the XR900 chassis:
– If the power supply is an AC unit, unplug the power cord

from the AC outlet.

– If the power supply is a DC unit, turn off the –48Vdc

power source and unplug the DC connector from the
power supply input.

3. Remove the XR900 bezel, if installed.

4. While pressing the latch at the side of the drive carrier (Figure
5-4), move the module back and forth slightly to loosen the
backplane connection. Then carefully remove the module
from the chassis by pulling straight out.

4-9

Removal/Replacement Procedures

4

Figure 4-4. Drive Module Release Latches

4-10

11060.00 9409

4

Replacement

3 1/2- or 5 1/4-Inch Drive Modules

1. Ensure that power to the host system is set to ST ANDBY and the
XR900 power cord is disconnected from the AC or DC power
source.

2. Note the device address setting on the drive you are
replacing, and set the address switch on the new drive to the
same device number.

3. Slide the replacement drive module gently into the drive bay
until it contacts the backplane connector.

4. Use firm steady pressure to seat the drive connector in the
backplane.

5. Reinstall the XR900 bezel, if the installation includes one.

6. Reconnect theXR900 chassis to the AC or DC power source:
– If the power supply is an AC unit, plug the power cord

back into the module and the AC outlet.

– If the power supply is a DC unit, plug the DC connector

into the power supply input and turn the –48Vdc power
source back on.

4-11

5Support Information

Introduction

This chapter supplies parts lists and diagrams of the XR900 chassis.
For parts lists and drawings of the mass storage drives and power
supply used in this chassis, refer to their respective reference sheets
or contact the vendor (manufacturer) of these units.

Parts List and Ordering Information

The following sections of this chapter provide a parts list and
location diagram for the XR900 chassis and its subassemblies.
Should you need to order replacement parts, order them from the
Customer Support Operations (CSO) Service Center. The order
should include the part number (when applicable) and description
of the part that appears in this chapter. The serial number of the
chassis should also be included with the ordering information.

5

Parts lists reflect the latest issue of hardware at the time of printing.

5-1

Support Information

Table 5-1. XR900 Chassis Parts List

Find

Number

-- 01-W2518D01A Blank bezel assembly 2

-- 01-W2649D01A Front bezel 1
1 01-W2651D01A Fan assembly, 119mm 1
2 01-W2654D01A Expansion chassis 1
3 01-W2722D01A 100W power supply (AC) 1
3 01-W2722D02A 100W power supply (DC) 1

5

-- 01-W3948B01A SCSI backplane 1

-- 03SW990F606 Sem, Phillips pan head, 6-32 x 3/8” w/cone washer 3

-- 03SW990F805 Sem, Phillips pan head, 8-32 x 5/16” w/cone washer 1

-- 03SW996E104 Sem, slotted hex head, self-tapping, 10-16 x 1/2” 3

-- 07-W4353C01A Bracket, RFI shield 2

-- 30-W2740D01A Cable assembly, power/fan 1

-- 30-W2787D01A Cable assembly, adapter 1

-- 33-W4658C01A Label, rating, AC component, peripheral expansion 1

-- 33-W4659C01A Label, rating, AC system, peripheral expansion 1

-- 33-W4660C01A Label, rating, DC component, peripheral expansion 1

-- 33-W4661C01A Label, rating, DC system, peripheral expansion 1

-- 35-W4408C01A Air filter 1
4 35NW9303A12 Screen, fan, finger guard 1

-- 42NW9401B28 Tyrap, nylon, L3-7/8, B3/4 4

-- 67-W2592D02A Kit assembly, DC connector (DC chassis) 1

-- 67NW9415A42 Kit, screw lock, female 2

Motorola Part

Number

Description/Quantity

5-2

Parts List and Ordering Information

11271.00 9503

1

3

2

4

5

Figure 5-1. XR900 Series Chassis

5-3

Support Information

5

5-4

Index

When using this index, keep in mind that a page number indicates only where
referenced material begins. It may extend to the page or pages following the page
referenced.

A

airflow

bezel and
blockages 3-3

applying power 3-7

2-1, 2-14

B

backplane 4-6
base configuration 3-1

C

cabling procedure 2-8
chassis configurations 2-1
chassis grounding 1-7, 2-12
cooling 2-14, 3-3
cooling fan 4-8

D

DC connections 2-11
DC connector assembly 2-11
Differential XR900 1-2
drive modules 4-9
drives supported 1-2

E

electromagnetic interference (EMI) 1-7
emergency power removal 3-9
environmental monitor

modes of operation
signals 3-8

expansion chassis 1-3

3-2

F

fan 4-8
FCC compliance 1-7
flanges, mounting 2-3

G

grounding 1-7, 2-12

I

installation options 1-2

K

key switch 3-6

L

location diagram 5-1

M

major assemblies 1-3
modular VME system 1-1, 2-1
monitoring

temperature
voltage 3-4

3-2

O

operating temperature 2-14, 3-1
overvoltage protection 3-4

P

parts list 5-1
parts location diagram 5-1
pedestal configuration 2-1

IN-1

Index

N
D
E
X

pedestal installation 2-4
power cables 2-11
power distribution system, resetting

3-5

power supply limits 2-13
power supply module 4-6

R

rack mounting 2-1, 2-2
radio-frequency interference (RFI) 1-7,

4-2

rating label, voltage 3-6
removal/replacement

cooling fan
drive modules 4-9
front bezel 4-2
pedestal cover 4-5
power supply 4-6
side panels 4-4

resetting the power supply 3-5

4-8

T

temperature

monitoring
operating 2-14, 3-1
sensors 3-1, 3-4

thresholds 3-3
termination, SCSI 2-8
terminator power 3-7
test switch 3-1

3-2

V

voltage monitoring 3-4

X

XR900 power control 3-7

S

safety considerations 1-7
SCSI

backplane
peripheral expansion chassis 2-4,

termination 2-8
terminator power 3-7

SCSI-compatible hosts, operation with

1-1

Single Ended XR900 1-2
specifications

I

backplane
enclosure 1-3
power supply 1-4

system operation 3-5

4-6

2-8

1-4

IN-2