This manual covers all models of the XPR series Portable Radios, unless otherwise specified. It includes all the
information necessary to maintain peak product performance and maximum working time, using levels 1 and 2
maintenance procedures. This level of service goes down to the board replacement level and is typical of some local
service centers, Motorola Authorized Dealers, self-maintained customers, and distributors.
Product Safety and RF Exposure Compliance
Before using this product, read the operating instructions
for safe usage contained in the Product Safety and RF
!
C a u t i o n
This radio is restricted to occupational use only to satisfy FCC RF energy exposure requirements.
Before using this product, read the RF energy awarene ss information a nd operating ins tructions in the
Product Safety and RF Exposure booklet enclosed with your radio (Motorola Publication part number
6881095C98) to ensure compliance with RF energy exposure limits.
For a list of Motorola-approved antennas, bat ter ies, and othe r acces sor ie s, visit the f ollo wing web site
which lists approved accessories: http://www.motorolasolutions.com/governmentandenterprise
Computer Software Copyrights
The Motorola products described in this manual may include copyrighted Motorola computer programs stored in
semiconductor memories or other media. Laws in the United States and other countries preserve for Motorola certain
exclusive rights for copyrighted computer programs, including, but not limited to, the exclusive right to copy or reproduce in
any form the copyrighted computer program. Accordingly, any copyrighted Motorola computer programs contained in the
Motorola products described in this manual may not be copied, reproduced, modified, reverse-engineered, or distributed in
any manner without the express written permission of Motorola. Furthermore, the purchase of Motorola products shall not
be deemed to grant either directly or by implication, estoppel, or otherwise, any license under the copyrights, patents or
patent applications of Motorola, except for the normal non-exclusive license to use that arises by operation of law in the
sale of a product.
Exposure booklet enclosed with your radio.
ATTENTION!
Document Copyrights
No duplication or distribution of this document or any portion thereof shall take place without the express written permission
of Motorola. No part of this manual may be reproduced, distributed, or transmitted in any form or by any means, electronic
or mechanical, for any purpose without the express written permission of Motorola.
Disclaimer
The information in this document is carefully examined, and is believed to be entirely reliable. However, no responsibility is
assumed for inaccuracies. Furthermore, Motorola reserves the right to make changes to any products herein to improve
readability, function, or design. Motorola does not assume any liability arising out of the applications or use of any product
or circuit described herein; nor does it cover any license under its patent rights nor the rights of others.
Trademarks
MOTOROLA, MOTO, MOTOROLA SOLUTIONS and the Stylized M logo are trademarks or registered trademarks of
Motorola Trademark Holdings, LLC and are used under license. All other trademarks are the property of their respective
owners.
XPR 6100 User Guide is only available via download and not part of the HKL N4282 CD kit.
Page 14
xivRelated Publications
Page 15
Commercial Warrantyxiv
Commercial Warranty
Limited Warranty
MOTOROLA COMMUNICATION PRODUCTS
I. What This Warranty Covers And For How Long
MOTOROLA INC. (“MOTOROLA”) warrants the MOTOROLA manufactured Communication
Products listed below (“Product”) against defect s in material and workmanship under normal use and
service for a period of time from the date of purchase as scheduled below:
XPR Series Digital Portable RadiosTwo (2) Years
Product Accessories (Excluding Batteries and Chargers)One (1) Year
The portables additionally ship with a standard 1-year Repair Service Advantage (RSA) (for U.S.
customers) or 1-year Extended W arranty (for Canada customer s). However, at the time of order, yo u
may choose to omit these warranties. For more RSA or Extended Warranty information, please refer
to the portable price pages or Motorola Online (https://businessonline.motorola.com) > Resource
Center > Services > Service Product Offerings > Repair Service Advantage or Extended Warranty.
Motorola, at its option, will at no charge either repair the Product (with new or reconditioned parts),
replace it (with a new or reconditioned Product), or refund the purchase price of the Product during
the warranty period provided it is returned in accordance with the terms of this warranty. Replaced
parts or boards are warranted for the b alance o f the or igina l ap plicable war ra nty per iod. All repla ce d
parts of Product shall become the property of MOTOROLA.
This express limited warranty is extended by MOTOROLA to the original end user purchaser only
and is not assignable or transferable to any other p arty. This is the complete warranty for the Product
manufactured by MOTOROLA. MOTOROLA assumes no obligations or liability for additions or
modifications to this warranty unless made in writing and signed by an officer of MOTOROLA.
Unless made in a separate agreement between MOTO ROLA and the original end user purchaser,
MOTOROLA does not warrant the installation, maintenance or service of the Product.
MOTOROLA cannot be responsible in any way for any ancillary equipment not furnished by
MOTOROLA which is attached to or used in connection with the Product, or for operation of the
Product with any ancillary equipment, and all such equipment is expressly excluded from this
warranty. Because each system which may use the Product is unique, MOTOROLA disclaims
liability for range, coverage, or operation of the system as a whole under this warranty.
Page 16
xvCommercial Warranty
II. General Provisions
This warranty sets forth the full extent of MOTOROLA'S responsibilities regarding the Product.
Repair, replacement or refund of the purchase price, at MOTOROLA's option, is the exclusive
remedy . THIS W ARRANTY IS GIVEN IN LIEU OF ALL OTHER EXPRESS WARRANTIES. IMPLIED
WARRANTIES, INCLUDING WITHOUT LIMITATION, IMPLIED WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE LIMITED TO THE
DURATION OF THIS LIMITED WARRANTY. IN NO EVENT SHALL MOTOROLA BE LIABLE FOR
DAMAGES IN EXCESS OF THE PURCHASE PRICE OF THE PRODUCT, FOR ANY LOSS OF
USE, LOSS OF TIME, INCONVENIENCE, COMMERCIAL LOSS, LOST PROFITS OR SAVINGS
OR OTHER INCIDENTAL, SPECIAL OR CONSEQUENTIAL DAMAGES ARISING OUT OF THE
USE OR INABILITY TO USE SUCH PRODUCT, TO THE FULL EXTENT SUCH MAY BE
DISCLAIMED BY LAW.
III. State Law Rights
SOME STATES DO NOT ALLOW THE EXCLUSION OR LIMITATION OF INCIDENTAL OR
CONSEQUENTIAL DAMAGES OR LIMITATION ON HOW LONG AN IMPLIED WARRANTY
LASTS, SO THE ABOVE LIMITATION OR EXCLUSIONS MAY NOT APPLY.
This warranty gives specific legal rights, and there may be other rights which may vary from state to
state.
IV. How To Get Warranty Service
You must provide proof of purchase (bearing the date of purchase and Product item serial number)
in order to receive warranty service and, also, deliver or send the Product item, transportation and
insurance prepaid, to an authorized warranty service location. Warranty service will be provided by
Motorola through one of its authorized warranty se rvice locations. If you first contact the company
which sold you the Product, it can facilitate your obtaining warranty service. You can also call
Motorola at 1-800-927-2744 US/Canada.
V. What This Warranty Does Not Cover
A. Defects or damage resulting from use of the Product in other than its normal and customary
manner.
B. Defects or damage from misuse, accident, water, or neglect.
C. Defects or damage from improper testing, operation, maintenance, installa tion, alteration,
modification, or adjustment.
D. Breakage or damag e to antennas u nless caused dir ectly by de fe cts in material workmanship.
E. A Product subjected to unauthorized Product modifica tions, disassemblies or repairs (includ-
ing, without limitation, the addition to the Product of non-Motorola supplied equipment) which
adversely affect performance of the Product or interfere with Motorola's normal warranty
inspection and testing of the Product to verify any warranty claim.
F.Product which has had the serial number removed or made illegible.
G. Rechargeable batteries if:
- any of the seals on the battery enclosure of cells are broken or show evidence of tampering.
- the damage or defect is caused by charging or using the battery in equipment or service
other than the Product for which it is specified.
H. Freight costs to the repair depot.
Page 17
Commercial Warrantyxvi
I.A Product which, due to illegal or unauthorized alteration of the software/firmware in the Prod-
uct, does not function in accordance with MOTOROLA’s published specifications or the FCC
type acceptance labeling in effect for the Product at the time the Product was initially distributed from MOTOROLA.
J.Scratches or other cosmetic damage to Product su rfaces that does not af fect th e operation of
the Product.
K. Normal and customary wear and tear.
VI. Patent And Software Provisions
MOTOROLA will defend, at its own expense, any suit brought against the end user purchaser to the
extent that it is based on a claim that the Product or part s infringe a United States patent, and
MOTOROLA will pay those costs and damages finally awarded against the end user purchaser in
any such suit which are attributable to any such claim, but such defense and payments are
conditioned on the following:
A. that MOTOROLA will be notified promptly in writing by such purchaser of any notice of such
claim;
B. that MOTOROLA will have sole control of the defense of such suit and all negotiations for its
settlement or compromise; and
C. should the Product or parts become, or in MOTOROLA's opinion be likely to become, the
subject of a claim of infringement of a United States patent, that such purchaser will permit
MOTOROLA, at its option and expense, either to procure for such purchaser the right to continue using the Product or parts or to replace or modify the same so that it becomes noninfringing or to grant such purchaser a credit for the Product o r part s as depreciated an d accept
its return. The depreciation will be an equal amount per year over the lifetime of the Product
or parts as established by MOTOROLA.
MOTOROLA will have no liability with respect to any claim of patent infringement which is based
upon the combination of the Product or parts furnished hereunder with software, apparatus or
devices not furnished by MOTOROLA, nor will MOTOROLA have any liability for the use of ancillary
equipment or software not furnished by MOTOROLA which is at t ached to or used in con nection with
the Product. The foregoing states the entire liability of MOTOROLA with respect to infringement of
patents by the Product or any parts thereof.
Laws in the United States and other countries preserve for MOTOROLA certain exclusive rights for
copyrighted MOTOROLA software such as the exclusive rights to repro duce in copies and di stribute
copies of such Motorola software. MOTOROLA software may be used in only the Product in which
the software was originally embodied and such software in such Product may not be replaced,
copied, distributed, modified in any way, or used to produce any derivative thereof. No other use
including, without limitation, alteration, modification, reproduction, distribution, or reverse
engineering of such MOTOROLA software or exercise of rights in such MOTOROLA software is
permitted. No license is granted by implication, estoppel or otherwise under MOTOROLA patent
rights or copyrights.
VII. Governing Law
This Warranty is governed by the laws of the State of Illinois, USA.
Page 18
xviiBattery and Charger Warranty
Battery and Charger Warranty
Workmanship Warranty
The workmanship warranty guarantees against defects in workmanship under normal use and
service.
All MOTOTRBO BatteriesTwo (2) Years
IMPRES Chargers (Single-Unit and Multi-Unit, Non-Display)Two (2) Years
IMPRES Chargers (Multi-Unit with Display)One (1) Year
Capacity Warranty
The capacity warranty guarantees 80% of the rated capacity for the warranty duration.
Nickel Metal-Hydride (NiMH) or Lithium-Ion (Li-lon) Batteries12 Months
IMPRES Batteries, When Used Exclusively with IMPRES
Chargers
18 Months
Page 19
Section 1
INTRODUCTION
1.0Notations Used in This Manual
Throughout the text in this publication, you will notice the use of note and caution notations. These
notations are used to emphasize that safety hazards exist, and due care must be taken and
observed.
NOTE: An operational procedure, practice, or condition that is essential to emphasize.
!
C a u t i o n
CAUTION indicates a potentially hazardous situation which, if
not avoided, might
2.0Radio Description
The XPR seriesportable radios are available in the following frequency ranges and power levels.
Table 1-1. Radio Frequency Ranges and Power Levels
Frequency BandBandwidthPower Level
UHF R1 403–470 MHz 1 or 3.5, 4 Watt
UHF R2 450–512 MHz 1 or 4 Watt
VHF136–174 MHz1 or 3.5, 5 Watt
These radios are among the most sophisticated two-wa y radios available. They have a r obust design
for radio users who need high performance, quality , and reliability in their daily communications. This
architecture provides the capability of supporting a multitude of legacy and advanced features
resulting in a more cost-effective two-way radio communications solution.
result in equipment damage.
Page 20
1-2 Radio Description
Notes
Page 21
Section 2
MAINTENANCE
1.0Introduction
This chapter provides details about the following
•Preventive maintenance (inspection and cleaning).
•Safe handling of CMOS and LDMOS devices.
•Repair procedures and techniques
2.0Preventive Maintenance
Periodic visual inspection and cleaning is recommended.
2.1Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches
are functional. It is not recommended to inspect the interior electronic circuitry.
2.2Cleaning Procedures
The following procedures describe the recommended cleaning agents and the methods to be used
when cleaning the external and internal surfaces of the radio. External surfaces include the front
cover, housing assembly and battery case. These surfaces should be cleaned whenever a periodic
visual inspection reveals the presence of smudges, grease, and/or grime.
NOTE
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild
dishwashing detergent in water . The only factory recommended liquid for cle aning the printed circ uit
boards and their components is isopropyl alcohol (100% by volume ).
Cleaning External Plastic Surfaces
Apply the 0.5% detergent-water solution sparingly with a stiff, non-metallic, short-bristled brush to
work all loose dirt away from the radio. Use a soft, absorbent, lintless cloth or tissue to remove the
Internal surfaces should be cleaned only when the radio is disassembled for service or
repair.
The effects of cert a in chemicals an d their vap ors can ha ve harmfu l resu lt s on
!
C a u t i o n
certain plastics. Avoid using aerosol sprays, tuner cleaners and other
chemicals.
Page 22
2-2Preventive Maintenance
solution and dry the radio. Make sure that no water remains entrapped near the connectors, cra cks,
or crevices.
Cleaning Internal Circuit Boards and Components
Isopropyl alcohol (100%) may be applied with a stiff, non-metallic, short-bristled brush to dislodge
embedded or caked materials located in hard-to-reach areas. The brush str oke should direct the
dislodged material out and away from the inside of the radio. Make sure that controls or tunable
components are not soaked with alco hol. Do no t use h igh -p ressure a ir to h asten the d rying pr ocess
since this could cause the liquid to collect in unwanted places. After completing of the cleaning
process, use a soft, absorbent, lintless cloth to dry the area. Do not brush or apply any isopropyl
alcohol to the frame, front cover or back cover.
NOTE
Always use a fresh supply of alcohol and a clean container to preve nt contamination by
dissolved material (from previous usage).
2.3Safe Handling of CMOS and LDMOS Devices
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios, and
are susceptible to damage by electrostatic or high voltage charges. Damage can be latent, resulting
in failures occurring weeks or months later. Ther efore, special precautions must be taken to prevent
device damage during disassembly, troubleshooting, and repair.
Handling precautions are mandatory for CMOS circuits a nd are e specially impor tant in low humidity
conditions.
Page 23
Preventive Maintenance2-3
DO NOT attempt to disassemble the radio without first referring to the following CAUTION
statement.
This radio contains static-sensitive devices. Do not open the radio unless you are
properly grounded. Take the following precautions when working on this unit:
!
C a u t i o n
• Store and transport all CMOS devices in conductive material so that
all exposed leads are shorted together . Do no t insert CMOS devices
into conventional plastic “snow” trays used for storage and transportation of other semiconductor devices.
• Ground the working surface of the service bench to protec t the
CMOS device. We recommend using a wrist strap, two ground
cords, a table mat, and a floor mat.
• Wear a conductive wrist strap in series with a 100k resistor to
ground. (Replacement wrist straps that connect to the bench top
covering are Motorola part number 4280385A59).
• Do not wear nylon clothing while handling CMOS devices.
• Do not insert or remove CMOS devices with power applied. Check
all power supplies used for testing CMOS devices to be certain that
there are no voltage transients present.
• When straightening CMOS pins, provide grou nd straps for the apparatus used.
• When soldering, use a grounded soldering iron.
• If at all possible, handle CMOS devices by the package and not by
the leads. Prior to touching the unit, touch an elec tric al gr ou nd to
remove any static charge that you may have accumulated. The
package and substrate may be electrically common. If so, the reaction of a discharge to the case would cause the same damage as
touching the leads.
Page 24
2-4Repair Procedures and Techniques — General
3.0Repair Procedures and Techniques — General
NOTE
Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards — examples shown below) were developed and assembled using environmentally preferred components and solder assembly techniques to comply with the European Union’s Restriction of Hazardous Substances (ROHS) Directive 2002/95/EC
and Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC. To
maintain product compliance and reliability, use only the Motorola specified parts in this
manual.
Any rework or repair on Environmentally Preferred Products must be done using the appropriate
lead-free solder wire and lead-free solder paste as stated in the following table:
Table 2-3. Lead Free Solder Paste Part Number List
Motorola Part
Number
1085674C03NC-SMQ230900-1000KCPs
Manufacturer Part
Number
ViscosityTypeComposition & Percent Metal
Brookfield (5rpm)
Type 3
(-325/+500)
(95.5%Sn-3.8%Ag-0.7%Cu)
89.3%
Liquid
Temperature
217°C
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement part
is not locally available, check the parts list for the proper Motorola part number and order the part
from the nearest Motorola Radio Product s and Solutions Organization (RPSO) listed in Appendix A
of this manual.
Rigid Circuit Boards
The family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not
accessible, some special considerations are required when soldering and unsoldering componen t s.
The printed through holes may interconnect multiple layers of the printed circuit. Therefore, exercise
care to avoid pulling the plated circuit out of the hole.
When soldering near connector:
•A void accidentally getting solder in the connector.
•Be careful not to form solder bridges between the connector pins.
•Examine your work closely for shorts due to solder bridges.
Page 25
Repair Procedures and Techniques — General2-5
Chip Components
Use the RLN4062 Hot-Air Repair Station for chip component replacement. Adjust the temperature
control to 370°C (700°F), and adjust the airflow to a minimum setting. Airflow can vary due to
component density.
•To remove a chip component:
1.Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm
(1/8") above the component to be removed.
2.Begin applying the hot air. Once the solder reflows, remove the component using a pair of
tweezers.
3.Using a solder wick and a soldering iron or a power de so lde ring station, rem ov e th e exc es s
solder from the pads.
•To replace a chip component using a soldering iron:
1.Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the solder
pads.
2.Using a pair of tweezers, position the new chip component in place while heating the fresh
solder.
3.Once solder wicks onto the new component, remove the heat from the solder.
4.Heat the remaining pad with the soldering iron and apply solder until it wicks to the compo-
nent. If necessary, touch up the first side. All solder joints should be smooth and shiny.
•To replace a chip component using hot air :
1.Use the hot-air hand piece and reflow the solder on the solder pads to smooth it.
2.Apply a drop of solder paste flux to each pad.
3.Using a pair of tweezers, position the new component in place.
4.Position the hot-air hand piece approximately 0.3 cm (1/8”) above the component and begin
applying heat.
5.Once the solder wicks to the component, remove the heat and inspect the repair. All joints
should be smooth and shiny.
Page 26
2-6Notes For All Schematics and Circuit Boards
Solder mask
L1
copper foil + plated
Prepreg 1080x1
L2
copper foil + plated
Prepreg 1080x1
L3
copper foil + plated
Prepreg 1080x1
L4
0.5 oz
CORE 4mil(2116*1)
L5
0.5 oz
Prepreg 1080x1
L6
0.5 oz
CORE 4mil(2116*1)
L7
0.5 oz
Prepreg 1080x1
L8
0.5 oz
CORE 4mil(2116*1)
L9
0.5 oz
Prepreg 1080x1
L10
copper foil + plated
Prepreg 1080x1
L11
copper foil + plated
Prepreg 1080x1
L12
copper foil + plated
Solder mask
4.0Notes For All Schematics and Circuit Boards
* Component is frequency sensitive. Refer to the Electrical Parts List for value and usage.
1. Unless otherwise stated, resistances are in Ohms ( k = 1000), and ca pa ci t ances are in picofar ads
(pF) or microfarads (µF).
2. DC voltages are measured from point indicated to chassis ground using a Motorola DC multimeter or equivalent. Transmitter measurements should be made with a 1.2 µH choke in series with
the voltage probe to prevent circuit loading.
3. Reference Designators are assigned in the following manner:
700/900 Series= Transmitter
000/200 Series= Frequency Generation
400/600 Series =Receiver
1000/2000/3000 Series=Controller
6000 Series= Keypad Board
8000 Series= GPS
9000 Series= Switches and User Interfaces
4. Interconnect Tie Point Legend:
UNSWB+=Unswitch Battery Voltage (7.5V)
SWB+=Switch Battery Voltage (7.5V)
R5=Receiver Five Volts
CLK=Clock
Vdda=Regulated 3.3 Volts (for analog)
Vddd=Regulated 3.3 Volts (for digital)
SYN=Synthesizer
DACRX=Digital to Analog Voltage (For Receiver Front End Filter)
VSF=Voltage Super Filtered (5 volts)
VR=Voltage Regulator
The list of equipment contained in Table 3-1 includes most of the standard test equipment required
for servicing Motorola portable radios.
Table 3-1. Recommended Test Equipment
EquipmentCharacteristicsExampleApplication
Service
Monitor
Digital RMS
Multimeter *
RF Signal
Generator *
Oscilloscope *2 Channel
Power Meter
and Sensor *
RF Millivolt
Meter
Power Supply0 V to 32 V
Can be used as a substitute for items marked with
an asterisk (*)
100 µV to 300 V
5 Hz to 1 MHz
10 Mega Ohm Impedance
100 MHz to 1 GHz
-130 dBm to +10 dBm
FM Modulation 0 kHz to
10 kHz
Audio Frequency 100 Hz
to 10 kHz
50 MHz Bandwidth
5 mV/div to 20 V/div
5% Accuracy
100 MHz to 500 MHz
50 Watts
100 mV to 3 V RF
10 kHz to 1 GHz
0 A to 20 A
Aeroflex 2975
(www.aeroflex.com),
Motorola R2670, or equivalent
Fluke 179 or equivalent
(www.fluke.com)
Agilent N5181A
(www.agilent.com),
Ramsey RSG1000B
(www.ramseyelectronics.com), or
equivalent
Leader LS8050
(www.leaderusa.com),
Tektronix TDS1001b
(www.tektronix.com),
or equivalent
Bird 43 Thruline Watt Meter
(www.bird-electronic.com) or
equivalent
Boonton 92EA
(www.boonton.com) or equivalent
B&K Precision 1790
(www.bkprecision.com)
or equivalent
Frequency/deviation meter and
signal generator for wide-range
troubleshooting and alignment
AC/DC voltage and
current measurements. Audio
voltage measurements
Receiver measurements
Waveform measurements
Transmitter power output
measurements
RF level measurements
Voltage supply
Page 28
3-2Service Aids
2.0Service Aids
Table 3-2 lists the service aids recommended for working on the radio. While all of these items are
available from Motorola, most are standard workshop equipment items, and any equivalent item
capable of the same performance may be substituted for the item listed.
Table 3-2. Service Aids
Motorola
Part No.
RLN4460_Portable Test SetEnables connection to the audio/access or y jack .
Service AidsCustomer Programming
Software on CD-ROM
PMKN4012_Portable Programming CableThis cable connects the radio to a USB port for radio
PMKN4013_Portable Programming, T esting &
Alignment Cable
PMNN4076_7.5V Universal Battery EliminatorConnects to radio via battery eliminator cable.
5880348B33DMR SMA to BNC RF AdaptorAdapts radio’s antenna port to BNC cabling of test
PMHN4085_Bench Test Housing EliminatorInterconnects radio to power supply. Provides for
NLN9839_Vacuum Pump KitAllows servicer to test for leakages.
NTN4265_Pressure Pump KitAllows servicer to locate leakages.
DescriptionApplication
Allows switching for radio testing.
Allows servicer to program radio parameters, tune
and troubleshoot radios.
programming and data applications.
This cable connects the radio to a USB port for r adio
programming, testing and alignment.
equipment.
troubleshooting of the radio when the housing is
removed.
5871134M01Connector FittingThis connector allows the vacuum hose to be con-
nected to the radio chassis.
3271133M01Fitting SealThis seal secures the connector fitting to the radio
chassis.
Page 29
Programming, Testing and Alignment Cable3-3
3.0Programming, Testing and Alignment Cable
#25
#14
P1
#13
#1
P2
#1
#4
#11
#1
P3
#2
#12
Figure 3-1. Programming, Testing and Alignment Cable
Page 30
3-4Programming, Testing and Alignment Cable
Table 3-3. Pin Configuration of Side Connector
CONNECTION
P1P2P3
PinPinPinFunction
13VCC (5V)
34DATA +
25DATA -
16
17
16
20
6GROUND
7
1
41
8SPEAKER 10EXTERNAL MIC +
11EXTERNAL MIC -
9EXTERNAL PTT
7SPEAKER +
GROUND
(Coax
Connector)
Page 31
Section 4
POWER UP SELF-TEST
1.0Power-Up Error Codes (Display Model only)
Upon powering up, the radio performs certain test s to determine if it s basic electronics and sof tware
are in working order . An y error detected ha s an associ ated error cod e that is presen ted o n the r adio
display. These error codes are intended to be used by a service technician when the radio
generates the Self Test Fail Tone. If these tests are successfully completed, the radio will generate
the Self Test Tone.
There are two classes of detectable errors, fatal and non-fatal. If it is considered as a fatal error, then
the normal radio operation will be inhibited. Fatal err ors include hardware errors detected by the
microprocessor and certain memory errors. These memor y errors include incorre ct ROM checksum,
incorrect RAM checksum, and incorrect checksums of codeplug (Persistent Storage) blocks that
contain operating parameters. If the codeplug block operating parameters are corrupted, operation
of the unit on the proper frequency, system, and group are in question. Attempts to use this
information could provide the user with a false sense of security that others are receiving his
messages. Corrupted codeplug blocks of call IDs, or their associated aliases are considered nonfatal errors. While the user may be inconvenienced, normal communication is still possible.
Table 4-4. Power-Up Error Codes
Error CodeDescriptionError TypeCorrective Action
ERROR 01/02 Call ID or associated
aliases codeplug block
checksum is wrong.
ERROR 01/22 Tuning Codeplug block
checksum is wrong.
FAIL 01/82External Codeplug block
checksum is wrong.
FAIL 01/92Secure Codeplug check-
sum error
FAIL 01/A2Tuning Codeplug block
checksum is wrong.
FAIL 01/81ROM Checksum is
wrong.
FAIL 01/88Radio RAM Test Failure.FatalRetest radio by turning it off and turning it on
FAIL 01/90
or
FAIL 02/90
General hardware test
failure.
Non-FatalNormal communication is still possible, but the
user may be inconvenienced.
Reprogram codeplug.
Non-FatalNormal communication is still possible.
FatalReprogram codeplug.
FatalReprogram codeplug.
FatalReprogram codeplug.
FatalReprogram FLASH Memory, then retest. If
message reoccurs, replace main board or
send radio to nearest Motorola Depot.
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
FatalRetest radio by turning it off and turning it on
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
Page 32
4-2Operational Error Codes
Table 4-4. Power-Up Error Codes (Continued)
Error CodeDescriptionError TypeCorrective Action
FAIL 02/81DSP ROM Checksum is
wrong.
FatalReprogram FLASH Memory, then retest. If
message reoccurs, replace main board or
send radio to nearest Motorola Depot.
FAIL 02/82DSP RAM1 test failure.FatalRetest radio by turning it off and turning it on
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
FAIL 02/84DSP RAM2 test failure.FatalRetest radio by turning it off and turning it on
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
FAIL 02/88DSP RAM test failure.FatalRetest radio by turning it off and turning it on
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
FAIL 02/C0DSP ROM Checksum is
wrong.
FatalRetest radio by turning it off and turning it on
again. If message reoccurs, replace main
board or send radio to nearest Motorola
Depot.
No DisplayDisplay module is not
connected properly.
Display module is dam-
FatalCheck connection between main board and
display module.
Replace with new display module.
aged.
NOTE
A non-display radio emits only the Self Test Fail Tone if it fails the self-test.
2.0Operational Error Codes
During radio operation, the radio performs dy namic tests to determine if the radio is working properly.
Problems detected during these tests are presented as error codes on the radio’s displa y. The
presence of an error code should prompt a user that a problem exists and that a Motorola Au thorized
MOTOTRBO dealer should be contacted. Use Table 4-5. to aid in understanding particular
operational error codes.
Table 4-5. Operational Error Codes
Error CodeDescriptionError TypeCorrective Action
FAIL 001Synthesizer Out-of-LockNON-FATAL1. Reprogram the codeplug.
FAIL 002Personality checksum or
system block error
2. Refer to Detailed Service
Manual.
NON-FATALReprogram the codeplug.
Page 33
Section 5
CONTROLLER INFORMATION
1.0General Controller Block
The controller board is the central interface between the various subsystems of the radio. The
controller section consists of 4 main ICs. These are the OMAP1710 Host/DSP Processor, Flash,
SDRAM memories and the MAKO Audio/Power Management chip.
Figure 5-1 shows how the controller interfaces with the RF Section and the supporting controls,
switches and display. The Controller, RF sections, volume port, frequency selection switch and the
universal connector are placed on a single “Transceiver” board. LCD Display is mounted directly to
the Transceiver board and keypad is designed on the flex. The Option Board is a sep arate board that
hosts the line/connections to the flex keypad. The physical interface between the Transceiver board
and keypad board is via flex through board to board connector on the option bo ard.
RF SECTION
SPI MCBSP2
MPUIO
MCBSP1
CONTROLLER
OPTION BOARD
MCBSP1
SPI
SSI
OMAP1710
& ME MOR Y
DEVICES
KEYPAD
Numeric K eys
Navigation Keys
PTT & SIDE BUTTON S
B+ = 7.5V
VDD
RF
PLL
LC
REF
CLK
D
LOGIC
LAYER 1
TIMER
CLOCK
CTRL
USER BUTTONS & KNOBS
ON_OFF VOLUME
LCD DISPLAY
SUPPLY
LIN
G
RE
CODEC
MCBSP1
ADC
DATA
FREQ KNOB
EMERGENCY
TUNE
DAC
MA KO
SW
RE
ON
Logic
G
ACCESSORY
INTER FAC E
DATA
OPT. SEL
EXT_MIC
EXT_SPK
TRANSDUCER S
AUD
AMP
MIC
AMP
OPT
SEL
USB
TXCVR
INT_SPK
INT_MIC
Figure 5-1: Controller Block Diagram
1.1OMAP1710 Processor (U1000)
The OMAP processor (U1000) has a dual-core architecture which incorporates a TMS320C55x DSP
core and a high-performance ARM926EJS core. The OMAP is supplied with two voltages: 1.4V for
Core and 1.8V for Peripheral and I/O Interfaces.
Page 34
5-2Controller Board
The OMAP processor controls the operation of the transmitter, receiver, synthesizer and MAKO IC. It
also uses Flash and SDRAM, both located externally.
1.2Flash Memory (U2000)
The Flash memory IC is a 64Mbit CMOS device. It is supplied with 1.8V. The Flash memory has its 23
address lines and 16 data lines connected to the External Interface Module (EIM) of the OMAP IC
through the EMIFS_ADDR(23:1) and EMIFS_DATA(15:0) busses. The Flash memory contains host
firmware, DSP firmware, codeplug data, and tuning values.
1.3SDRAM (U2001)
The Synchronous DRAM (SDRAM) is 128Mb high-speed CMOS device. It is designed to operate in
1.8V, low-power memory system. The SDRAM has 13 address lines and 16 data lines connected to
the EIM of OMAP IC through SDRAM_ADDR(12:0) and SDRAM_DATA(15:0) busses.
1.4MAKO IC (U3000)
The MAKO IC handles DC power distribution and audio processing (i.e. audio amplification and
analog-to-digital/ digital-to-analog co nversions). It conta ins Switching and Linear regulators, 1W audio
amplifiers, 16-bit Voice CODEC, 11-channel 10-bit A/D Converter, 10 bit D/A Converter, support
2xUSB “OTG” transceivers, One-Wire Option Detect, and GCAI ports.
LCD, 32kHz SQUARER CKTs, L EVEL
TRANSLATOR (GPS), T OMAHAWK DIG
CKTs
MAKO A/D REFERENCE VOLTAGE, VOL,
HW_ID, LEVEL TRANS LATOR (1-WIRE)
TOMAHAWK ANALOG CKT, LNA, MIXER
ANALOG CKTs, ABACUS CORE & DIG
CKTs
SIDE CONNECTOR PULL-UPs, RED & GRN
LEDs, VBUS SUPPLY ENABLED
SIDE ACCESSORY VBUS
LEVEL TRANSLATOR (1-WIRE), TX
PRE_DRIVER
CHARGE PUMP OF ABACUS &
TOMAHAWK, POWER CONTROL,
REGULATOR FOR TX_VCO, TX_BUFFER,
RX_VCO, RX_BUFFER
Figure 5-2: DC Power Distribution Block Diagram
Figure 5-2 illustrates the DC distribution to various ICs and devices in the radio. The power
management architecture is centered on the MAKO IC (U3000). A battery supply is routed via a 3A
fuse (F9000) which goes directly to the electronic ON/OFF control (PMOS power FET Q3003) as
Page 35
Controller Board5-3
RAWB+. When the radio is turned ON, MECH_SW (ON/OFF/volume control) will trigger the MAKO
FET_ENX to low thus turning ON the PMOSFET device, and SWB+ is then distributed as shown in
Figure 5-2. SWB+ will continue to support the whole board until the radio is turned OFF.
2.1.1 Voltage Regulation
• Switcher U3020
Switcher (U3020) in conjunction with the MAKO power management IC (U3000) is a highly efficient
dc-dc buck converter. External components L3020 and C3202 are needed to filter out the dc -d c
converter output. In this application, it is configured as a Pulse Skipping Mode (PSM) with maximum
output current of 600mA. It generates an accurate 3.6V output, which supplies directly to the MAKO
internal VSW2 switcher circuit as well as other MAKO internal LDOs.
• Switcher U3021
Switcher (U3021) is a highly efficient dc-dc buck converter and same as switcher U3020. It is used
solely for OMAP processor core.
• Low Drop Out (LDO) Regulator U3008
LDO regulator (U3008) is an adjustable output voltage regulator which can supply 200mA load
current. It has an excellent Ripple Rejection Ratio and Short Circuit Protection. In this application,
LDO U3008 output is 2.3V which is set by the resistor divider R3028 and R3029. It supplies directly to
MAKO internal LDOs.
• Low Drop Out (LDO) Regulator U3002
LDO regulator (U3002) is an adjust able ou tput voltage regulator which can supply 1A load current. In
this application, LDO U3002 generates an accurate 5.6V output which is set by the resistor divider
R3017 and R3018. It supplies directly to both VBUS1 and VBUS2 supplies. Q3005 and Q3006
prevent internal voltage leakage onto VBUS_SUPPLY (U3002 pin 5).
• MAKO LDO VBUS1
VBUS1 is a voltage regulation module that can be used to provide 5V with either 50mA or 500mA
load current suited for accessory and USB supply. Q3001 and Q3002 are used to control the low
current limit (50mA) or high current limit (500mA) of Vbus1.
When USB_CONNECT is toggled LOW, the PMOSFET (Q3001) is disabled and this will limit the max
load supply to 50mA. If a high current limit is desired, i.e. USB HOST mode, USB_CONNECT is
toggled HIGH turning ON thePMOSFET (Q3001) through Q3002 inverter, and this will limit the max
load supply to 500mA.
• MAKO LDO VBUS2
VBUS2 is a voltage regulation module that can be used to provide 5V and with only 500mA load
current. This supply is used for PA Pre-driver.
• MAKO LDOs
The MAKO power management IC (U3000) provides eight more LDOs. Some LDOs are
programmable to meet the requirement of various ASIC devices. V2, V3, and V9 are programmable
via SPI while V4, V5, V6, V8, and V10 are fixed. See Figure 5-2 for details.
Page 36
5-4Controller Board
K
2.1.2 Power ON/OFF
The radio can be switched ON in only one condition:
1. MECH_SW turned ON
Turning the rotary switch (S9001) ON will cause MAKO (U3000) to turn ON SWB+. After application
of power to SWB+, MAKO regulators are sequenced to turn ON power to all MAKO internal blocks
and external system including OMAP processor (U1000), FLASH (U2000), SDRAM (U2001), and
radio RF section.
Radio can be turned OFF in one of the three conditions:
1. MECH_SW turned OFF
If the radio is manually turned OFF, MAKO (U3000) will start a 125ms watchdog timer. The OMAP
processor (U1000) may tickle the watchdog timer as needed to keep DC power ON as it shuts down
the radio. Once the watchdog timer expires, MAKO turns OFF the DC regulators and SWB+.
2. Low Battery
While the radio is ON, if battery voltage drops to low level threshold, OMAP processor (U1000) will
initiate a shutdown process. It will store the radio personality data to the FLASH (U2000) before
turning OFF.
3. Thermal Shutdown
Hard and Soft limits for thermal shutdown are implemented into MAKO IC (U3000). When MAKO die
temperature reaches Soft Thermal Limit (135
shutdown procedures. If Hard Thermal Limit (155
can finish shutdown tasks, the radio will turn OFF immediately.
°C), microprocessor will be interrupted to begin
°C) is reached before OMAP processor (U1000)
2.2Clocks
Figure 5-3 illustrates the controller clocks used throughout the radio.
TOMAHAWK
U001
XOSC BASE
0.5 ppm (GPS & CPHER)
+
1.5 ppm (NONGPS)
+
MAKO
XOUTXINXTAL32_OUTXTAL32_IN
24.576MHZ32.768KHZ
16.8 MHZ
TCXO
U3000
ARX DAC
CLK2 OUT
Y3000Y3001
20 ppm+30 ppm
+
32.768 KHz
U1006
U3003
U3004
12MHZ
Y1000
20 ppm
+
ABACUS III
U600
FREF
SiRF GPS
U8000
REF_CLK
LOW_REF_CLK
EXT_CLK (N18)
CLK32K_IN (P13)
OSC_IN (Y2)
OSC_OUT (W3)
RTC_XO
RTC_XI
General Pupose
TIMER
DPLL1
OMAP 3.3 Core
32.768KHZ
Y8000
+20 ppm
OMAP1710
U1000
1.4V
10
OSC32K_IN (V13)
OSC32K_OUT (AA13)
VSS_11 (Y13)
SYS_CLK_IN (Y4)
xN
MPU CLK
DSP CLKxN
TC CLKxN
Figure 5-3: Clock Connections
Page 37
Controller Board5-5
The OMAP processor (U1000), which consists of an ARM and DSP core, needs three clocks for
operation: a 32.768kHz square-wave, a 12MHz sine-wave, and a 16.8MHz square-wave clock.
The 16.8MHz clock source is provided from the Tomahawk TCXO routes to a squarer-circuit (U1006)
and feed to EXT_CLK (U1000 pin N18).
The 32.768kHz clock is generated by the MAKO crystal (Y3000) oscillator, converted to a gated clock
by U3003 and U3004 circuitry. It is then directly fed to OMAP CLK32_IN (U1000 pin P13). The OMAP
processor needs the 32.768kHz to determine the input reference clock app lied to OSC_IN (U1000 pin
Y2). Without this 32kHz clock, the OMAP will potentially program all the wrong dividers for USB and
UART booting. External pull-up on OSC32K_IN (U1000 pin V13) and grounding both OSC32K_OUT
(pin AA13) and VSS_11 (pin Y13) indicates that an external 32kHz clock is used.
The 12MHz sine-wave is the main system reference clock for the OMAP which all the internal clocks
are derived from.
The 24.576MHz crystal (Y3001) oscillator is the reference clock for MAKO CODEC and SSI clock. `
2.3Serial Peripheral Interface (SPI)
Figure 5-4 illustrates the controller SPI used throughout the radio.
1.8V
OMAP1710
U100 0
1.8V
TOMAHA WK
U001
1.8V
ABACUS III
U600
1.8V
MAKO
U3000
SPI_CLK
SPI_DW
SPI_DR
CEX
PC
PD
DOUTB
PE
SPI_CLK
SPI_DO
SPI_DI
SPI_CS
R3023
47K
SPI_CLK
SPI_MOSI
SPI_MISO
ABACUS3_CE
MAKO_CE
THK_CE
HPD SPI
SPIF.SCK (U19)
SPIF.DOUT (W21)
SPIF.DIN (U18)
GPIO_44 (P15)
GPIO_9 (Y8)
GPIO_58 (R11)
MMC1 SPI
SPI.CLK (M14)
MMC.CMD (P11)
SPI.CS2 (P20)
SPI.CS1 (P19)
SPI.RDY (R18)
SPI.CS3 (P18)
Figure 5-4: SPI Connections
The OMAP processor (U1000) has two SPI busses that it uses to communicate with the various
peripheral IC’s. The first is the High Performance Data (HPD) SPI bus and the second is the multimedia card (MMC) SPI.
Page 38
5-6Controller Board
The HPD SPI is a synchronous serial bus made up of four lines, SPI_CLK, SPI_MOSI, SPI_MISO,
and chip select. The SPI_CLK line is used to control the speed of the data to/from the peripheral IC’s
and the OMAP processor. This clock can be adjusted to different speed based on the IC’s
specification.
HPD SPI module is used to interface to Tomahawk (U001), Abacus III (U600), and the MAKO
(U3000). This interface operates at 1.875V logic level. SPI_MOSI, or commonly known as
TRANSMIT Data, is a data string from OMAP while SPI_MISO or RECEIVE Data is data string to the
OMAP.
The MMC SPI is not used in portable radio.
2.4Serial Synchronous Interface (SSI)
Figure 5-5 illustrates the controller SSI used in the radio controller design.
1.8V
TOMAHAWK
U001
ABACUS III
U600
MAKO
U3000
OPTION
BOARD I/F
J9001
1.8V
1.8V
CLKOUT
1.8V
VC_DCLK
VC_FSYNC
DMCS
TXCLK
SDTX
SFTX
DOUTA
SYNCB
VC_RX
VC_TX
CLK
FSYNC
VC_RX
VC_TX
OMAP1710
U1000
GPIO_2 (D15)
McBSP2.CLKX (Y6)
McBSP2.DX (AA5)
McBSP2.FSX (W7)
McBSP2
McBSP2.CLKR (V7)
McBSP2.DR (P10)
FS
McBSP2.FSR (W6)
GPIO_40 (W15)
McBSP1
McBSP1.CLKX (G21)
McBSP1.FSX (H15)
McBSP1.DX (H18)
McBSP1.DR (H20)
R3010
10K
McBSP3
McBSP3.CLKX (N14)
McBSP3.FSX (AA17)
McBSP3.DX (P14)
McBSP3.DR (T19)
Figure 5-5: SSI Connections
The OMAP processor (U1000) has a total of three SSI or multi-channel buffer serial ports (McBSP)
modules that are used to directly interface to the CODECs in the Tomahawk, Abacus, and MAKO, as
well as command/ data connections to the Option Board, and between Tx and Rx radios within a
Repeater.
As shown in Figure 5-5, McBSP1 is a 4-wire bus and interface to the MAKO CODEC as well as the
Option Board. McBSP2 is 6-wire bus; 3-wire dedicated to the Tomahawk Tx audio and the other 3-
Page 39
Controller Board5-7
wire to Abacus Rx audio. McBSP3 is a 4-wire bus, and used primarily to interface between Tx and Rx
radios within a Repeater.
2.5ACC_ID Interface
Smart accessories use the Accessory ID (ACC_ID) Interface to help the radio determine which smart
accessory, if any, are attached to the radio. Figure 5-6 illustrate the ACC_ID connections used within
the radio.
OMAP1710
U1000
HDQ (N20)ACC_ID_UP (L7)
2.6USB Interface
The OMAP processor (U1000) supports two USB ports. The radio makes use of one USB port to
communicate with smart accessories, and connection to a host compu ter for radio programming via
CPS and tuning via Tuner Tool.
Note:The USB ports are designed to support Motorola accessories only and will not support third
party “Plug-n-Play” USB devices.
Figure 5-7 shows the details of the HSSI connections within the radio.
OMAP 1710
USB1_ TXEN (W16)
USB1_ DAT (W14)
USB1_ SE0 (R13)
R3024
1.875V
V
2.9
2.9V
Vref1Vref2
SCL1
SDA1
2-BitTranslator
U3009
MAKO
U3000
R3041
ACC_ID (P9)
Figure 5-6: ACC_ID Interface Connections
Mako
USB1_OE (B08)
USB1_ DAT_TXD (C08)
USB1_SE0 (D08)
3/6 Wire
IF and
SPI
Registers
Vbus1
Monitor
USB1
Transceiver
5V
R3040
SCL2
SDA2
VBus1_ Sens (E12)
VBus1_ Cmd (C14)
VBus1 (H10)
DP (N6)
DM (P7)
5V
VBUS SUPPLY
R3103 + R3102
Q3000
VBus
D+
D-
USB_INT (L15)USB_INTX (C10)
Figure 5-7: USB Interface Connections
The OMAP processor USB host controller communicates with accessories at either 1.5 Mbps or 12
Mbps data rates depending on the accessory. The USB port can be used as a host or a device.
Page 40
5-8Controller Board
In the portable radio, only one of the two MAKO USB transceivers is used to provide the physical
layer signaling for the USB port. The transceiver generates and receives the DP and DM differential
signals of the port. The MAKO transceiver interfaces to the OMAP processor through a three-wire
interface consisting of two bi-directional signals (SE0 and DAT), and one uni-directional signal
(TXEN). The MAKO also includes a Vbus monitor that senses the connection or removal of a device
and determines whether or not to supply current to that device via Q3000 up to a high current limit of
500mA.
The USB host/device mode assignment is determined when a user attaches a USB d evice to the port.
The accessory contains information about what the USB mode assignment should be, this
information is sent to the radio via the ACC_ID. See section 2.5 on page 5-7 for more details on the
ACC_ID implementation. When configured as a host, VBUS is turned ON by MAKO and set to high
current limit, when configured as a device, VBUS will be shut OFF and the external host supplies the
VBUS power.
2.7Universal Connector (Side Connector)
The universal connector is located on the side of the radio. It is the external port of interface used for
programming and interfacing to external accessories. The universal connector is connected to the
main board via a flex through option board. This radio UC is a newly defined Motorola accessory port
that contains audio, digital I/O, serial interfaces, and accessory supply lines; and is similar in function
to Motorola’s legacy microphone connectors. The multiplexing of these functions is handled by
circuitry internal to the MAKO (U3000).
The UC includes 2 serial interfaces: an USB port and an ACC_ID interface. The USB port can be
used as either a device (radio is device) or as a host (radio is host). When configured as a device, th e
radio can be programmed using the MOTOTRBO CPS or tuned using the Tuner software. When
configured as a host, various smart accessories can be used with the radio. See section 2.6 on page
5-7 for more information on the USB interface.
The ACC_ID interface is used by accessories to provide the radio with information needed to
configure the interface for that accesso ry. See section 2.5 on page 5-7 for more information on the
ACC_ID interface.
Note:The USB port is designed to support Motorola accessories only and will not support third
part “Plug-n-Play” USB devices.
2.8Keypad Module
The keypad module is connected to the main board through option board. This unit is not considered
field-repairable. The keyp ad interface is a st andard pulsed 4 r ow by 4 column configuration controlle d
directly by the OMAP processor (U1000). Each of the 4 column output lines is toggled high in
sequence and the 4 row input lines are monito red to detect if a button has been pressed. The OMAP
processor then decodes which button was pressed using the appropriate column and row stimulus
and response information.
2.9Display Module
This display is Film-compensated Super Twisted Nematic (FSTN), 132x34 pixel dot matrix with
transflective mode and yellow-green LEDs backlighting Liquid Crystal Display (LCD) module custom
to Motorola.
This display module is constructed of glass by sandwiched with polarizers, TAB (Tape Automated
Bonding) IC driver, LED backlighting, display control circuitry flex with 16-lines receptacle connector
connected to the main board display connector (P9000). The LED and backlights are controlled via
serial connection with OMAP processor (U1000). The serial interface consists of clock, dat a, and chip
select lines that are connected directly from the OMAP pr ocessor.
Page 41
Controller Board5-9
2.10Audio
The audio circuitry consists of both analog and digital audio paths. Figure 5-8 shows the basic block
diagram of the audio interconnections.
V02_O(1.875V) for OMAP
Rf
15nF
Rf
270 Ohm
LSPKext
1.0uF
Cf
INT_MIC_P
INT_MIC_M
1.0uF
0.1uF
0.1uF
C2
EXT_SPKR_P
MIC BIAS
PA_IN_P
PA_IN_M
MIC BIAS
INT_MIC_P
INT_MIC_M
EXT_MIC_P
EXT_MIC_M
VCM1
VC_OUT_P
VC_OUT_M
V06(2.9V) for Patriot
MAKO
ADC
LESCIM
DAC
PA
VC_TX3V
VC_TX
VC_DCLK
VC_FSYNC
VC_RX
UCM_SS
DDV_CIGOL
10k
TX
DIN
Base-Band
CLK
Processor
SYNC
DOUT
RX
EXT_SPKR_M
INT_SPKR_P
LSPKint
INT_SPKR_M
2.10.1 Receive Audio
The receive audio data comes from the ABACUS III IC (U600) to the OMAP McBSP2 pin. The DSP
decodes the data and sends it out through SSI lines to MAKO SSI pin. The SSI bus is comprised of
four lines: clock, frame sync, Rx data, and Tx data. These four lines provide data to the MAKO
(U3000) using a packet frame structure consisting of four slot s. The actual audio dat a is transferred to
the MAKO in the first slot of each frame using 16-bit pulse-code modulated PCM audio. The MAKO
codec filters and converts the digital data into an analog audio signal, and this signal is sent to a
programmable gain amplifier. The analog audio circuitry routes the audio to the internal or external
port.
PA
Figure 5-8: Audio Block Diagram
Page 42
5-10Controller Board
2.10.2 Transmit Audio
Transmit audio can be sourced from either internal or external microphone p ath. Both the internal and
external microphone carries a 5V bias through a resistor to MAKO MIC_BIAS pin. The MAKO,
through SPI, selects the appropriate microphone path to route to the necessary gain stages and
converter that will send 16-bit PCM audio to the OMAP for signal processing via the SSI bus.
The transmit gain stages in the MAKO is calibrated based on an 8mV input under standard test
conditions. The microphone sensitivity is progra m ma b le th ro ug h th e us e of CPS.
Page 43
2.1 1Troubleshooting Charts
MCU
5-11
Power Up
Alert Tone
OK?
NO
Volume
knob
function?
YES
YES
NO
Read Radio
OK?
YES
Reprogram
correct data
Check volume
knob circuitry
NO
Check USB
circuitry and
setup
Speaker
OK?
YES
NO
Replace
Speaker
Int & Ext
Spkr short to
Gnd?
NO
YES
Check Speaker
circuitry, if no problem,
replace MAKO
Termination
short
together?
YES
NO
Spkr contact
voltage
=3V?
NO
YES
Troubleshooting Flow Chart for Controller
(Sheet 1 of 2)
Page 44
5-12
NO
regulator o/p
programmed?
YES
MAKO
YES
1.4V at
R1020?
NO
Check regulator
U3201
YES
16.8MHz at
C1032?
NO
Check TOMAHAWK
16.8MHz circuitry
YES
NO
C1018
=12MHz?
YES
R1048=
32.768MHz?
NO
C3001
=32.768KHz?
YES
Replace
U3003
YES
NO
C1019=
12MHz?
YES
C3000
=32.768KHz?
YES
Replace
Y3000
NO
NO
Replace
OMAP
Replace
Y1000
Replace
MAKO
Troubleshooting Flow Chart for Controller
(Sheet 2 of 2)
Controls and Switches Schematic Diagram (for 8486716Z04)
C9031VR9007
4.7pF
5.6V
MECH_SW_SW MECH_SW
C9025
100pF
BOARD SPACER
M9000
BRD_SPACER
M9001
BRD_SPACER
M9002
BRD_SPACER
Page 79
Controller Schematics5-47
RED & GREEN LEDS
RED_LED
RED_LED_SW
EMERGENCY BUTTON
EMERG_PB
1.875V_DIG_V2
R9050
10K
S9000
SWITCH
IN1OUT
GND1
GND24GND3
3
5
2
R9008
47K
3.3V_DIG_V10
1
VR9005
5.6V
R9009
10K
3
Q9000
MMBT3904
2
1.875V_DIG_V2
IMXFT110
R9014
10K
EMERG_PB_SW
C9023
100pF
SWB+
Q9001-1
1
5
6
110
13
24
EMERG_PB
4
3
Q9001-2
R9013R9012
33
2
IMXFT110
D9000
BRPY1204W
Q9003
MMBT3904
3.3V_DIG_V10
R9010
10K
3
2
FREQUENCY SWITCH
F9000
SW1_SW
SW2_SW
C9039
100pF
1.875V_DIG_V2
R9015
10K
C9026
100pF
VR9009
13V
3A
24V
R9016
10K
C9027
100pF
TP_RAWB+
1
VR9010
13V
S9002
SWITCH
GND18GND2
4K36
K2
PIN3
K4
3
_8
C2
_4
VR9008
5.6V
TP_GND
4
6
2
1
1
_1
3
C1
5
_2
7
1K13
A15A2
2
CONTACTM9007
1
PIN1
2
PIN2
1.875V_DIG_V2
R9051
10K
R9011
GREEN_LED_SW
47K
1
GREEN_LED
SW1
SW2
BATTERY CONTACT
RAWB+
BATT_DATA
RAWB_P_SW
BATT_DATA_SW
C9038
100pF
C9032
4.7pF
1.875V_DIG_V2
R9017R9018
10K
100pF
10K
C9029C9028
100pF
SW8_SW
SW4_SW
SW8
SW4
VOLUMN SWITCH
2.9V_DIG_V6
VOL_SW
VOL
C9024
100pF
VR9006
5.6V
C9030
4.7pF
BOARD SPACER
M9000
BRD_SPACER
S9001
SWITCH
HIGH
LOW
2
TAB1
TAB2
C9031
6
7
4.7pF
3
4
51
VR9007
5.6V
MECH_SW_SW MECH_SW
C9025
100pF
M9001
BRD_SPACER
M9002
BRD_SPACER
Controls and Switches Schematic Diagram (for 8486716Z07/8486716Z13, 8486716Z08 & 8475130M01) *Emergency Button not applicable for XPR 6100*
Page 80
5-48ControllerSchematics
RED & GREEN LEDS
RED_LED
RED_LED_SW
EMERGENCY BUTTON
EMERG_PB
1.875V_DIG_V2
S9000
SWITCH
IN2OUT
1
GND14GND25GND3
3
R9050
10K
R9008
47K
3.3V_DIG_V10
1
VR9005
5.6V
R9009
10K
3
Q9000
MMBT3904
2
1.875V_DIG_V2
Q9001-1
5
IMXFT110
R9014
10K
EMERG_PB_SW
C9023
330pF
SWB+
4
3
EMERG_PB
Q9001-2
R9013
33
2
IMXFT110
D9000
BRPY1204W
1
6
R9012
110
13
24
Q9003
MMBT3904
3.3V_DIG_V10
R9010
10K
3
2
R9011
47K
1
BATTERY CONTACT
RAWB+
BATT_DATA
1.875V_DIG_V2
R9051
10K
GREEN_LED_SW
RAWB_P_SW
BATT_DATA_SW
GREEN_LED
C9038
330pF
FREQUENCY SWITCH
1.875V_DIG_V2
R9015
10K
SW1
SW2
C9032
3.9pF
C9039
330pF330pF
VR9009
13V
SW1_SW
SW2_SW
VR9010
13V
F9000
C9027
C9026
330pF
330pF
TP_RAWB+
1
12
24V
5A
C9070
R9016
10K
M9007 CONTACT
1
PIN1
2
PIN2
PIN3
1.875V_DIG_V2
C9028
330pF
R9018
10K
C9029
330pF
SW8_SW
SW4_SW
SW8
SW4
R9017
S9002
SWITCH
1
_1
3
C1
5
_2
7
1
K1
A12A2
TP_GND
3
GND1
8
3K34K46
K2
5
1
GND2
_8
C2
_4
VR9008
5.6V
4
6
2
10K
VOLUMN SWITCH
S9001
SWITCH
HIGH
LOW
TAB16TAB2
7
2
1
C9031VR9007
3.9pF
5.6V
MECH_SW_SW MECH_SW
C9025
330pF
VOL
2.9V_DIG_V6
VOL_SW
C9024
330pF
VR9006
5.6V
C9030
3.9pF
3
4
5
Controls and Switches Schematic Diagram (for 8415113H03 & 8415113H05)
BOARD SPACER
M9000
BRD_SPACER
M9001
BRD_SPACER
M9002
BRD_SPACER
Page 81
Controller Schematics5-49
RED & GREEN LEDS
RED_LED
RED_LED_SW
EMERGENCY BUTTON
EMERG_PB
1.875V_DIG_V2
R9050
10K
S9000
SWITCH
IN1OUT
GND1
GND24GND3
3
5
R9008
47K
2
3.3V_DIG_V10
1
VR9005
5.6V
R9009
10K
3
Q9000
MMBT3904
2
1.875V_DIG_V2
IMXFT110
R9014
10K
EMERG_PB_SW
C9023
100pF
SWB+
Q9001-1
1
5
6
110
13
24
EMERG_PB
4
3
Q9001-2
R9013R9012
33
2
IMXFT110
D9000
BRPY1204W
Q9003
MMBT3904
3.3V_DIG_V10
R9010
10K
3
2
FREQUENCY SWITCH
F9000
SW1_SW
SW2_SW
C9039
100pF
1.875V_DIG_V2
R9015
10K
C9026
100pF
VR9009
13V
3A
24V
R9016
10K
C9027
100pF
TP_RAWB+
1
VR9010
13V
S9002
SWITCH
GND18GND2
4K36
K2
5
PIN3
4
_8
6
C2
2
_4
K4
VR9008
5.6V
A2
TP_GND
1
3
1
_1
3
C1
5
_2
7
NC
1K13
A1
2
CONTACTM9007
1
PIN1
2
PIN2
1.875V_DIG_V2
R9051
10K
R9011
GREEN_LED_SW
47K
1
GREEN_LED
SW1
SW2
BATTERY CONTACT
RAWB+
BATT_DATA
RAWB_P_SW
BATT_DATA_SW
C9038
100pF
C9032
4.7pF
NC
R9021
0
1.875V_DIG_V2
R9017R9018
10K
100pF
10K
C9029C9028
100pF
SW8_SW
SW4_SW
SW8
SW4
VOLUMN SWITCH
2.9V_DIG_V6
VOL_SW
VOL
C9024
100pF
VR9006
5.6V
C9030
4.7pF
S9001
SWITCH
HIGH
LOW
2
TAB1
TAB2
C9031
6
NC
4.7pF
7
R9022
0
3
4
51
VR9007
5.6V
MECH_SW_SW MECH_SW
C9025
100pF
BOARD SPACER
M9000
BRD_SPACER
M9001
BRD_SPACER
M9002
BRD_SPACER
Controls and Switches Schematic Diagram (for 8486716Z16) *Emergency Button not applicable fo r X PR 61 00*
Page 82
5-50ControllerSchematics
RED & GREEN LEDS
RED_LED
RED_LED_SW
EMERGENCY BUTTON
EMERG_PB
1.875V_DIG_V2
S9000
SWITCH
IN2OUT
1
GND14GND25GND3
3
R9050
10K
R9008
47K
3.3V_DIG_V10
1
VR9005
5.6V
R9009
10K
3
Q9000
MMBT3904
2
1.875V_DIG_V2
Q9001-1
5
IMXFT110
R9014
10K
EMERG_PB_SW
C9023
330pF
SWB+
4
3
EMERG_PB
Q9001-2
R9013
33
2
IMXFT110
D9000
BRPY1204W
1
6
R9012
110
13
24
Q9003
MMBT3904
3.3V_DIG_V10
R9010
10K
3
2
R9011
47K
1
BATTERY CONTACT
RAWB+
BATT_DATA
1.875V_DIG_V2
R9051
10K
GREEN_LED_SW
RAWB_P_SW
BATT_DATA_SW
GREEN_LED
C9038
330pF
FREQUENCY SWITCH
1.875V_DIG_V2
R9015
10K
SW1
SW2
C9032
3.9pF
C9039
330pF330pF
VR9009
13V
SW1_SW
SW2_SW
VR9010
13V
F9000
C9027
C9026
330pF
330pF
TP_RAWB+
1
12
24V
5A
C9070
R9016
10K
M9007 CONTACT
1
PIN1
2
PIN2
PIN3
1.875V_DIG_V2
C9028
330pF
R9018
10K
C9029
330pF
SW8_SW
SW4_SW
SW8
SW4
R9017
S9002
SWITCH
1
_1
3
C1
5
_2
NC
1
K1
A12A2
TP_GND
3
GND17GND2
8
3K34K46
K2
5
1
_8
C2
_4
VR9008
5.6V
4
6
2
10K
NC
R9021
0
BOARD SPACER
VOLUMN SWITCH
S9001
SWITCH
HIGH
LOW
TAB16TAB2
NC
7
2
1
R9022
0
0613952R66
C9031VR9007
3.9pF
5.6V
MECH_SW_SW MECH_SW
C9025
330pF
2.9V_DIG_V6
VOL_SW
VOL
C9024
330pF
VR9006
5.6V
C9030
3.9pF
3
4
5
Controls and Switches Schematic Diagram (for 8415113H13) *Emergency Button not applicable for XPR 6100
M9000
BRD_SPACER
M9001
BRD_SPACER
M9002
BRD_SPACER
Page 83
Controller Schematics5-51
RED & GREEN LEDS
RED_LED
RED_LED_SW
EMERGENCY BUTTON
EMERG_PB
1.875V_DIG_V2
S9000
SWITCH
IN
1
GND14GND25GND3
3
OUT
R9050
10K
2
R9008
47K
3.3V_DIG_V10
1
VR9005
5.6V
R9009
10K
3
Q9000
MMBT3904
2
1.875V_DIG_V2
IMXFT110
R9014
10K
EMERG_PB_SW
C9023
100pF
SWB+
Q9001-1
1
5
6
R9012
110
13
24
EMERG_PB
4
3
Q9001-2
IMXFT110
R9013
33
2
D9000
BRPY1204W
Q9003
MMBT3904
3.3V_DIG_V10
3
2
R9010
10K
FREQUENCY SWITCH
1.875V_DIG_V2
C9028
100pF
R9018
10K
C9029
100pF
SW8_SW
SW4_SW
SW8
SW4
R9017
10K
NC
R9021
0
SW1_SW
SW2_SW
100pF
1.875V_DIG_V2
R9015
10K
C9026
100pF
F9000
VR9009
13V
3A
24V
R9016
10K
C9027
100pF
TP_RAWB+
1
S9002
SWITCH
1
_1
36
C1C2
52
_2_4
7
NC
1K23
K1
A12A2
M9007
CONTACT
1
PIN1
2
PIN2
VR9010C9039
13V
GND1
5
PIN3
4
_8
GND2
8
4
6
VR9008
5.6V
K4
K3
TP_GND
1
3
1.875V_DIG_V2
R9051
10K
R9011
47K
1
GREEN_LED_SW
GREEN_LED
SW1
SW2
BATTERY CONTACT
RAWB+
BATT_DATA
RAWB_P_SW
BATT_DATA_SW
C9038
100pF
C9032
4.7pF
VOLUMN SWITCH
2.9V_DIG_V6
VOL_SW
VOL
C9024
100pF
VR9006
5.6V
C9030
4.7pF
3
4
5
S9001
SWITCH
HIGH
LOW
TAB16TAB2
NC
BOARD SPACER
M9000
BRD_SPACER
M9001
2
MECH_SW
VR9007
5.6V
MECH_SW_SW
C9025
100pF
1
C9031
4.7pF
7
R9022
0
BRD_SPACER
M9002
BRD_SPACER
Controls and Switches Schematic Diagram (for 8486716Z23, 8486716Z24, 8415113H19, 8415113H20)
Page 84
5-52Controller Schematics
Notes
Page 85
Section 6
Driver
r
A
A
UHF1 (403–470 MHZ) INFORMATION
1.0Transmitter
Power
Control
ntenna
Jack
F
rom VCO
1.1General
1.1.1 Power Amplifier
The UHF transmitter contains five basic circuits:
1. Power Amplifier
2. Antenna Switch
3. Harmonic Filter
4. Antenna Matching Network
5. Power Control
The power amplifier is a 3-stage discrete design consisting of:
1. Pre-driver, ADA4743 (U700)
2. Driver, RD01MUS1 (Q703)
3. Final PA, RD07MVS1 (Q704)
The pre-driver is a 50 Ohm gain block with a supply voltage of 5V. The supply is ramped to eliminate
feed-through power due to the fixed gain of the devic e. The pre-driver is biased in Class A region with
a typical current drain of 60mA and power gain of 16.5dB.
The driver is a 1W, LDMOS in a SOT -89 p ackage. this st age typically drains 150mA of current at rated
output power, 4W. The driver is biased in Class AB region and has a power gain of 14dB.
The final PA is a 7W, LDMOS device. The gate threshold of this device is very close to the driver.
Hence, the traditional PA bias tuning is eliminated. The current drain would typically be 1400mA. The
final PA is biased in Class AB region and has a power gain of 10dB.
Pre
PA
-
Vcontrol
Figure 6-1: UHF Transmitter Block diagram
PA
Drive
PA
F
inal
Vcontrol
nten na Switch/
Harmonic Filter/
Matching Network
Page 86
6-2Transmitter
1.1.2 Antenna Switch
The antenna switch comprises of 2 ports: standard port and remote port.
NOTE
The antenna switch consist of:
1. Four PIN diodes:
2. Six current limiting resistors:
3. Two pi networks:
In the transmit mode of standard port operation, ANT_EN signal (from MAKO) turns on Q702 (bias
Power Amplifier) and Q900(antenna switch circuit). RAWB+ bias is applied to the standard port
antenna switch circuit to bias CR902 and CR903 “ON”. Hence, the following occurs:
1. Shunt diode (CR903) shorts out the receiver port, and the pi network(C915, L908, C916), which
2. Both CR900 and CR901 is biased “OFF”, and the pi network(C911, L906, C912), which operates
In the transmit mode of remote port operation, ANT_EN signal (from MAKO) turns on Q702(bias
Power Amplifier) and Q900(antenna switch circuit) and GP02 signal (from TOMAHAWK) turns on
Q901. RAWB+ bias is applied to the standard and remote port antenna switch circuit to bias CR900,
CR901, CR902 and CR903 “ON”. Hence, the following occurs:
Remote port is not supported in XPR 6100 and the related components ar e not loaded.
a.CR902 and CR903 biased during standard and remote port operation.
b.CR900 and CR901 biased during remote port operation.
a.R904, R905 and R9053 for standard and remote port operation.
b.R902, R903 and R9054 for remote port operation.
a.C915, L908, C916 to determine TX or RX mode.
b.C911, L906, C912 to determine standard port or remote port operation.
operates as a quarter wave transmission line, transforms low impedance of the shunt diode to a
high impedance at the input of the harmonic filter. In the receive mode, the diodes are “OFF” and
hence, there exists a low attenuation path between the antenna and the receiver ports.
as a quarter wave transmission line, transfers the 50ohm impedance of the harmonic filter to
CR902 and hence, forces PA_OUT to take the standard port circuit path.
1. Shunt diode(CR903) shorts out the receiver po rt, and the pi network(C915, L908, C916), which
operates as a quarter wave transmission line, transforms low impedance of the shunt diode to a
high impedance at the input of the harmonic filter. In the receive mode, the diodes are off and
hence, there exists a low attenuation path between the antenna and the receiver ports.
2. Shunt diode(CR901) shorts out the standard port, and the pi network(C911, L906, C912), which
operates as a quarter wave transmission line, transforms the low imp edance of the shunt dio de to
a high impedance at the input of the standard port circuit and hence, forces PA_OUT to take the
remote port circuit path.
1.1.3 Harmonic Filter
The harmonic filter consists of C906, C907, C908, L904 and L905. The design of the harmonic filter
for UHF is a five pole Chebyshev design using lumped LC elements in order to realize gre ater
attenuation in the stop band for a given ripple level. The harmonic filter insertion loss is typically less
than 1.3dB.
Page 87
Transmitter6-3
1.1.4 Antenna Matching Network
A matching network which is made up of L911 is used to match the antenna's impedance to the
harmonic filter. This will optimize the performance of the transmitter and receiver into an antenna.
1.1.5 Power Control
The transmitter power control uses discrete integrator approach, the current is sensing both PA
stages namely, Driver Power Amplifier (Q703) and Final Power Amplifier (Q704).
The basic block diagram of the power control is shown in Figure 6-2. A single sensing resistor (R700)
is tied to sense both PA stages current. The power control consists of 2 comparators, U701-1 and
U701-2. U701 is a dual-package op-amp in SOT-8 package. The first stage is an I-V converter
converts current drained by Power Amplifier Driver (Q703) and Power Amplifier Final (Q704) across
R700 into a voltage drop and the second stage is an integrator used to shape the output Vcontrol to
bias both PAs. The slope of the Vcontrol is controlled by the RC time constant of the integrator and
also the ramping slope of reference signal, TX_DAC generated by MAKO IC. The final TX_DAC value
determines the transmit power level and is a factory tuned parameter which is stored inside the
codeplug.
SW 5V
SW 5V
SW 5V
SW 5V
PA
MAKO
MAKO
MAKO
MAKO
Ramp
Ramp
Ramp
Ramp
DAC
DAC
DAC
DAC
10bit
10bit
10bit
10bit
DAC 3
DAC 3
DAC 3
DAC 3
PA
Pre-
TX_DAC
driver
PA
PA
Driver
Driver
B+
B+
B+
B+
Sensing
Sensing
Sensing
Sensing
resistor
resistor
resistor
resistor
Vcontrol
Vcontrol
Integrator
Integrator
Integrator
Integrator
PA Final
PA Final
SW B+
SW B+
SW B+
SW B+
Current to
Current to
Current to
Current to
Voltage
Voltage
Voltage
Voltage
Shaped input
Shaped input
Shaped input
Shaped input
Figure 6-2: Power Control Scheme Basic Block Diagram
Page 88
6-4Receiver
p
2.0Receiver
Antenna
RF Jack
Pin Diode
Antenna
Switch
Varactor
Tuned
Filter
LNA
Varactor
Tuned
Filter
Mixer
Crystal
Filter
IF Am
SSI TO OMAP
16.8MHz
Reference Clock
2.1Receiver Front-End
The RF signal is received by the antenna and applied to a low-pass filter. For UHF, the filter consists
of C906, C907, C908, L904 and L905. The filtered RF signal is passed through the antenna switch
and then applied to a varactor tuned bandpass filter. The bandpass filter comprises of C400, C401,
C402, C403, C404, C405, L400, L401, R400, R499, D400 and D401. C400 and C405 are 50ohm
points. The bandpa ss filter is tuned by applying a control voltage to the varactor diodes D400 and
D401.
The bandpass filter is electronically tuned by the MAKO DAC. Depending on the carrier frequ ency , th e
MAKO DAC will supply the tuned voltage to the varactor diodes in the filter. Wideband operation of
the filter is achieved by shifting the bandpass filter across the band.
The output of the bandpass filter is passed through a RF step attenuator (D402) to limit the amount
RF power fed into the LNA (U400). After being amplified, the RF signal is further filtered by a second
varactor tuned bandpass filter. This bandpass filter is electronically tuned by the MAKO DAC and
comprises of C419, C420, C421, C422, C423, C424, L408, L409, R405, R4 06, D403 and D404. C419
and C423 are 50 Ohm points.
The output of the second bandp ass filter is passed to a mixer. The mixe r is a passive double balanced
quad diode mixer (D405) comprising of 2 transformers (T400 and T401). The 50 Ohm matching for
Control voltage
from MAKO
ABACUS IC
AGC
SIGNAL
PROCESSING
IF
First LO from
Synthesizer
Second LO VCO
Figure 6-3: UHF Receiver Block Diagram
FGU
Page 89
Frequency Generation Circuitry6-5
the mixer is provided by C426 and L410. After mixing with the first LO signal from the voltage control
oscillator (VCO) using low side injection, the RF signal is down converted to the 73.35 MHz IF signal.
The IF signal coming out of the mixer is applied to the cryst al filte r (FL40 0) through a resistor p ad an d
a diplexer (L411 and C427). Matching to the input of the crystal filter is provided by L412 and C428.
The crystal filter provides the necessary adja cent channel selectivity and inter-modulation protection.
The output of the crystal filter (FL400) is matched to the input of the IF amplifier transisto r by C432,
C433, L415 and L416. Voltage supply to the IF amplifier is 5V_RX, taken from RX VCO. The IF
amplifier provides a gain of 25 dB. The IF amplifier output is directly matched at the IF amplifier output
to ABACUS (U600) pin 47 via C601.
2.2Receiver Back-End
ABACUS (U600) is tuned via software at radio start-up. The IF signal applied to pin 47 of U600 is
down-converted to a second IF of 2.25 MHz. The second IF of 2.25 MHz will then be fed into an ADC,
generating the Is and Qs data. This data is in the form of SSI (Serial Synchrono us Interface) at pin 29
of U600, which will then be sent to the DSP (OMAP1710) for further processing.
The second VCO is a Colpitts oscillator built around transistor Q602. The VCO has a varactor diode,
D600 to adjust the VCO frequency. The second LO frequency could either be 71.1 MHz or 75.6 MHz,
depending on the system requirement. The control signal is derived from a loop filter consisting of
C617, C618, C619, R605 and R606. The RSSI circuitry is achieved via software programming.
3.0Frequency Generation Circuitry
RX LO
RX LO
TX LO
TX LO
RX
RX
VCO
VCO
TX
TX
VCO
VCO
TX VCO EN
TX VCO EN
RX VCO EN
RX VCO EN
LF
LF
SW
SW
TX VCO EN
TX VCO EN
GPO1
GPO3
GPO1
GPO3
SF
SF
HP
HP
mod
mod
CP
CP
out
out
Tomahawk
Tomahawk
Prescalerin
Prescaler in
Adapt
Adapt
CLK 2 out
CLK 2 out
TEST1
TEST1
AUX
AUX
DAC
DAC
DAC
DAC
TxSSI
Tx SSI
DMCS
DMCS
To Abacus
To Abacus
16.8 MHz
16.8 MHz
Buffer
Buffer
To Squarer IC
To Squarer IC
Lock Det
Lock Det
16.8 MHz
16.8 MHz
TCXO
TCXO
3 lines
3 lines
3 lines
3 lines
Adapt
Adapt
SW
SW
control
control
To GPS
To GPS
Figure 6-4: Frequency Generating Unit Block Diagram
The Frequency Generating Unit is centered on one main IC, Tomahawk (U001). The main synthesizer
on the Tomahawk functions as a modulation interface to the DSP area via the 3 TX SSI lines. The
Page 90
6-6Frequency Generation Circuitry
block diagram illustrates the interconnect and support circuitry used in the Frequency Generating
Unit. Refer to the relevant schematics for the reference designators.
The synthesizer is powered by 2.8V ANA, 2.8V DIG, 1.875V DIG and 5V ANA supplied from the
U3000-1. The synthesizer in turns generates a superfiltered 2.5V which powers up the TX VCO & RX
VCO.
In addition to the VCO, the synthesizer interfaces with the microcontroller. Programming of the
synthesizer is accomplished through the 4 lines; SPI_MISO, THK_CE, SPI_MOSI and SPI_CLK via
pin D10, D8, D9 and D11 respectively. A 1.875 dc signal from the synthesizer lock detect line
indicates to the microprocessor that the synthesizer is locked.
U001 has dual port modulation capability. The microprocessor supplies low port and high port words
to pin F11 of U001. For high port modulation, the audio runs through an internal attenuator for
modulation balancing purpose before it goes ou t to the VCO and loop filter via pin K8. For the low por t
modulation, the audio is fed into the main synthesizer, where it is summed with the main_num
channel frequency word, then supplied to the accumulator of the Fractional-N synthe sizer before
going out to the VCO.
3.1Synthesizer
U001 uses a 16.8 MHz crystal (Y001) to provide a reference for the system. The synthesizer further
divides this to 8.4MHz for nominal frequencies and 5.6 MHz for alternate frequencies. Together with
R006, R007, R008, C013, C014, C015 and C016, they build up the reference oscillator which is
capable of 1.5ppm (non-GPS) / 0.5ppm (GPS) stability over temperature of -30ºC to 85 ºC. It also
provides 16.8MHz at pin J11 of U001 to be used by ABACUS.
The loop filter which consists of R013, R014, R016, C024, C025, C026 and C027 provides the
necessary dc steering voltage for the VCO and determines the amount of noise and spur passing
through.
In achieving fast locking for the synthesizer, an internal adapt charge pump provides higher current
(~10mA) at pin H1 and an additional 2mA from a current mirror (Q002, R010, R011 and R012). The
required frequency is then locked by normal mode charge pump at pin G3. An external adapt switch
(U002) is used to control the ON/OFF of the adapt mode. Both the normal and adapt charge pumps
get their supply from the 5V ANA supplied by U3000-1.
3.2VCO - V oltage Controlled Oscillator
The VCO in conjunction with the synthesizer generates RF in both the receive and transmit modes of
operation.
The RX VCO comprises of a Colpitts oscillator built around Q200 , a cascaded buffer, built up of a
buffer IC, U200 cascaded with a discrete buffer built around Q208 and a 3dB resistive pad (R220,
R221 and R222). Vcontrol is supplied to two pairs of back-to- back vara ctors (D20 0, D201, D20 2 and
D203). The LC tank comprises of C203 and L202. The oscillator is supplied with a 2.5V superfiltered
supply from the synthesizer, U001. The cascaded buffer is supplied with a 5V ANA supply from
MAKO, U3000-1. The buffer IC in conjunction with the resistive pad provides sufficient isolation from
the mixer whilst the discrete buffer provides sufficient gain for the first LO signal. The output of the
cascaded buffer is match to the mixer by C216, C217, C241 and L207. The output po wer level of
ST
RX_1
The TX VCO comprises of a Colpitts oscillator built around Q204 and a discrete buffer built around
Q205. Vcontrol is supplied to two pairs of back-to-back varactors (D204, D205, D206 and D207). The
LC tank comprises of C222 and L210. The oscillator is supplied with a 2.5V superfiltered supply from
the synthesizer, U001. The discrete buffer is supplied with a 5V ANA supply from MAKO, U3000-1.
The output of the discrete buffer is match to the mixer by C236, C237 and L215. The output power
level of TX_BUFF is 3dB.
_LO_INJ is 6dB.
Page 91
Global Positioning System (GPS) Receiver6-7
4.0Global Positioning System (GPS) Receiver
The GPS device is an embedded receiver that provides the location of the subscriber in terms of
latitude, longitude, velocity, direction and altitude.
16.8MHz
VCTCXO
3.6V
TPS79228 TPS7 9101 L P3990
2.8V
RF
Section
SiRFStarIII, GSC3FLP
2.8V
Section
OMAP
Digital
1.5V
32.768kHz
XTAL
Dual band antenna
LNA_Supply
LNA_EN
HPF Pr e-SAW LNA Post-S AW
HF
2dB resistive pad
LTC1877
Optional
FGU
Figure 6-5: GPS Receiver Block Diagram
The RF signal is received by the antenna and applied to a high-p ass filter. The filter consists of C924,
C925, C926, L912 and L913. The filtered RF signal is then applied to a SAW filter, FL8001.
The output of the SAW filter is fed into the LNA (U8001). The LNA biasing is controlled by
SIRF_LNA_EN (pin A4 of the GPS IC, U8000). The LNA input match comprises of C8 013, C8014 and
L8001. The LNA output match comprises of L800 3 and C8017. After being amplified, the RF signal is
further filtered by a second SAW filter, FL8002.
The output of the second SAW filter is passed to pin P6 of the GPS IC. The input match for pin P6
comprises of C8018, C8019 and L8004. The control and data lines for the GPS IC are GPS_nRESET ,
GPS_ON_OFF, GPS_TX, GPS_RX and GPS_BOOT. GPS_nWAKEUP line is fed into the
microcontroller to indicate the state (full power or hibernate state) of the GPS IC so that the
microcontroller will never trigger a GPS_ON_OFF when the GPS IC is in full power state.
A dedicated 32.768kHz quartz crystal oscillator (Y8000) is used to provide RTC clock to the RTC
circuit inside the GPS IC. The second input frequency is a 16.8MHz reference, used by the StarIII to
synthesize the internal LO. This reference will be supplied by a VCTCXO (Y001) located in the
synthesizer block, which will be shared by the TOMAHAWK and ABACUS ICs.
The GPS IC is powered by 2.8V_DIG_GPS, 2.8V_RF_GPS and 1.5V_GPS_RTC supplied from 3
discrete external regulators (U3701, U3700 & U3006). The in put of these regulator s is sourced from a
switching regulator (U3020) which regulates the SWB+ to 3.6V.
Page 92
6-8Allocation of Schematics and Circuit Boards
5.0Allocation of Schematics and Circuit Boards
5.1Controller Circuits
The UHF circuits are contained on the Printed Circuit Board (PCB) which also contains the
Controller circuits. This Chapter shows the schematics for the UHF circuits only , refer to the
Controller section for details of the related Controller circuits. The PCB compon ent layouts in this
Chapter show both the Controller and UHF circuit components. The UHF schematics and the
related PCB and parts list are shown in the tables below.
Table 6-1. UHF1 Diagrams and Parts List
PCB:
8486716Z04 Main Board Top Side
8486716Z04 Main Board Bottom Side
8486716Z07 Main Board Top Side
8486716Z07 Main Board Bottom Side
8486716Z08 Main Board Top Side
8486716Z08 Main Board Bottom Side
8486716Z16 Main Board Top Side
8486716Z16 Main Board Bottom Side
SCHEMATICS
Complete Radio
Complete UHF1 RF
Complete UHF1 Transmitter
UHF1 Transmitter
UHF1 Harmonic Filter and Antenna Switch
Complete UHF1 Receiver
UHF1 Receiver Front End
UHF1 Receiver Back End
Complete UHF1 Frequency Generating Unit
UHF1 Synthesizer
UHF1 Voltage Con trolled Oscillator
UHF1 GPS Block
Parts List
8486716Z04
8486716Z07
8486716Z08
8486716Z16