Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 2
1 Publication Order Number:
MC74HC165A/D
MC74HC165A
8-Bit Serial or
Parallel-Input/
Serial-Output Shift Register
High–Performance Silicon–Gate CMOS
The MC74HC165A is identical in pinout to the LS165. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device is an 8–bit shift register with complementary outputs
from the last stage. Data may be loaded into the register either in
parallel or in serial form. When the Serial Shift/Parallel Load
input is
low, the data is loaded asynchronously in parallel. When the Serial
Shift/Parallel Load
input is high, the data is loaded serially on the
rising edge of either Clock or Clock Inhibit (see the Function Table).
The 2–input NOR clock may be used either by combining two
independent clock sources or by designating one of the clock inputs to
act as a clock inhibit.
• Output Drive Capability: 10 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2 to 6 V
• Low Input Current: 1 µA
• High Noise Immunity Characteristic of CMOS Devices
• In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 286 FETs or 71.5 Equivalent Gates
Device Package Shipping
ORDERING INFORMATION
MC74HC165AN PDIP–14 2000 / Box
MC74HC165AD SOIC–14
http://onsemi.com
55 / Rail
MC74HC165ADR2 SOIC–14 2500 / Reel
MARKING
DIAGRAMS
A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
MC74HC165ADT TSSOP–14 96 / Rail
MC74HC165ADTR2 TSSOP–14
2500 / Reel
TSSOP–14
DT SUFFIX
CASE 948G
HC
165A
ALYW
1
14
1
14
PDIP–14
N SUFFIX
CASE 646
MC74HC165AN
AWLYYWW
SOIC–14
D SUFFIX
CASE 751A
1
14
HC165A
AWLYWW
MC74HC165A
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2
LOGIC DIAGRAM
PIN 16 = V
CC
PIN 8 = GND
11
12
13
14
3
4
5
6
10
A
B
C
D
E
F
G
H
S
A
PARALLEL
DATA
INPUTS
SERIAL
DATA
INPUT
SERIAL SHIFT/
PARALLEL LOAD
1
2
15
CLOCK
CLOCK INHIBIT
9
7
Q
H
Q
H
SERIAL
DATA
OUTPUTS
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
B
C
D
CLOCK INHIBIT
V
CC
Q
H
S
A
A
F
E
CLOCK
SERIAL SHIFT/
PARALLEL LOAD
GND
Q
H
H
G
FUNCTION TABLE
Inputs Internal Stages Output
Serial Shift/
Parallel Load
Clock
Clock
Inhibit
S
A
A – H Q
A
Q
B
Q
H
Operation
L X X X a … h a b h Asynchronous Parallel Load
H
H
L
L
L
H
X
X
L
H
Q
An
Q
An
Q
Gn
Q
Gn
Serial Shift via Clock
H
H
L
L
L
H
X
X
L
H
Q
An
Q
An
Q
Gn
Q
Gn
Serial Shift via Clock Inhibit
H
H
X
H
H
X
X
X
X
X
No Change Inhibited Clock
H L L X X No Change No Clock
X = don’t care QAn – QGn = Data shifted from the preceding stage
MC74HC165A
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3
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, VCC and GND Pins
Power Dissipation in Still Air Plastic DIP†
SOIC Package†
TSSOP Package†
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP, SOIC or TSSOP Package)
_
C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: – 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time VCC = 2.0 V
(Figure 1) VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
ns
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Minimum High–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Maximum Low–Level Input
Voltage
V
out
= 0.1 V or VCC – 0.1 V
|I
out
| v 20 µA
Minimum High–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
V
out
should be constrained to the
range GND v (Vin or V
out
) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
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DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Maximum Low–Level Output
Voltage
Vin = VIH or V
IL
|I
out
| v 20 µA
Vin = VIH or VIL|I
out
| v 2.4 mA
|I
out
| v 4.0 mA
|I
out
| v 5.2 mA
Maximum Input Leakage
Current
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
I
out
= 0 µA
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book
(DL129/D).
AC ELECTRICAL CHARACTERISTICS (C
L
= 50 pF, Input tr = tf = 6 ns)
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 8)
Maximum Propagation Delay, Clock (or Clock Inhibit) to QH or Q
H
(Figures 1 and 8)
Maximum Propagation Delay, Serial Shift/Parallel Load to QH or
Q
H
(Figures 2 and 8)
Maximum Propagation Delay, Input H to QH or Q
H
(Figures 3 and 8)
Maximum Output Transition Time, Any Output
(Figures 1 and 8)
Maximum Input Capacitance
pF
NOTES:
1. For propagation delays with loads other than 50 pF , see Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
C
PD
Power Dissipation Capacitance (Per Package)*
40
pF
*Used to determine the no–load dynamic power consumption: PD = CPD V
CC
2
f + ICC VCC. For load considerations, see Chapter 2 of the
ON Semiconductor High–Speed CMOS Data Book (DL129/D).