MOTOROLA MC10EP31D, MC10EP31DR2 Datasheet

MC10EP31

D Flip Flop with Set and
Reset

The MC10EP31 is a D flip flop with set and reset. The device is pin
and functionally equivalent to the EL31 and LVEL31 devices. With
AC performance much faster than the EL31 and LVEL31 devices, the
EP31 is ideal for applications requiring the fastest AC performance
available. Both set and reset inputs are asynchronous, level triggered
signals. Data enters the master portion of the flip–flop when CLK is
low and is transferred to the slave, and thus the outputs, upon a
positive transition of the CLK.

• 275ps T ypical Propagation Delay

• High Bandwidth to 3 Ghz T ypical

• PECL mode: 3.0V to 5.5V V

• ECL mode: 0V V

• 75k

W

Internal Input Pulldown Resistors

with VEE = –3.0V to –5.5V

CC

• Q Output will default LOW with inputs open or at V

• ESD Protection: >4KV HBM, >200V MM

• Moisture Sensitivity Level 1, Indefinite Time Out of Drypack.

For Additional Information, See Application Note AND8003/D

• Flammability Rating: UL–94 code V–0 @ 1/8”,

Oxygen Index 28 to 34

• Transistor Count = 75 devices

SET

1

2

D

with VEE = 0V

CC

S

D

Flip Flop

EE

78Q

V

CC

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SO–8
D SUFFIX
CASE 751

MARKING DIAGRAM

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HEP31

ALYW

1
*For additional information, see Application Note
AND8002/D

PIN DESCRIPTION

PIN

CLK

Reset ECL Asynchronous Reset

Set

D ECL Data Input
Q, Q ECL Data Outputs
VCC Positive Supply
VEE Negative, 0 Supply

A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week

FUNCTION

ECL Clock Inputs

ECL Asynchronous Set

3

R

RESET

Figure 1. 8–Lead Pinout (Top View) and Logic Diagram

 Semiconductor Components Industries, LLC, 1999

January , 2000 – Rev. 3

45

6

QCLK

D

V

EE

1 Publication Order Number:

L
H
X
X
X

Z = LOW to HIGH Transition

Device Package Shipping

MC10EP31D SOIC 98 Units/Rail

MC10EP31DR2 SOIC 2500 Tape & Reel

TRUTH TABLE

SET

ORDERING INFORMATION

RESET

L
L

H

L

H

L
L

L
H
H

CLK

Z
Z
X
X
X

MC10EP31/D

Q

L
H
H

L

UNDEF

MC10EP31

MAXIMUM RATINGS*

Symbol Parameter Value Unit

V

EE

V

CC

V

I

V

I

I

out

T

A

T

stg

θ

JA

θ

JC

T

sol

* Maximum Ratings are those values beyond which damage to the device may occur.

DC CHARACTERISTICS, ECL/LVECL (VCC = 0V; VEE = –5.5V to –3.0V) (Note 3.)

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

1. VCC = 0V, VEE = V

2. All loading with 50 ohms to VCC–2.0 volts.

3. Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 1.)

Output HIGH Voltage
(Note 2.)

Output LOW Voltage
(Note 2.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Input HIGH Current 150 150 150 µA
Input LOW Current 0.5 0.5 0.5 µA

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

Power Supply (VCC = 0V) –6.0 to 0 VDC
Power Supply (VEE = 0V) 6.0 to 0 VDC
Input Voltage (VCC = 0V, VI not more negative than VEE) –6.0 to 0 VDC
Input Voltage (VEE = 0V, VI not more positive than VCC) 6.0 to 0 VDC
Output Current Continuous

Operating Temperature Range –40 to +85 °C
Storage Temperature –65 to +150 °C
Thermal Resistance (Junction–to–Ambient) Still Air

Thermal Resistance (Junction–to–Case) 41 to 44 ± 5% °C/W
Solder Temperature (<2 to 3 Seconds: 245°C desired) 265 °C

–40°C 25°C 85°C

26 34 44 26 35 45 28 37 47 mA

–1135 –1060 –885 –1070 –945 –820 –1010 –885 –760 mV

–1935 –1810 –1685 –1870 –1745 –1620 –1810 –1685 –1560 mV

–1210 –885 –1145 –820 –1085 –760 mV

–1935 –1610 –1870 –1545 –1810 –1485 mV

EEmin

to V

, all other pins floating.

EEmax

Surge

500lfpm

50

100

190
130

mA

°C/W

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MC10EP31

DC CHARACTERISTICS, LVPECL (VCC = 3.3V ± 0.3V, VEE = 0V) (Note 6.)

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

4. VCC = 3.3V, VEE = 0V, all other pins floating.

5. All loading with 50 ohms to VCC–2.0 volts.

6. Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 4.)

Output HIGH Voltage
(Note 5.)

Output LOW Voltage
(Note 5.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Input HIGH Current 150 150 150 µA
Input LOW Current 0.5 0.5 0.5 µA

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

DC CHARACTERISTICS, PECL (VCC = 5.0V ± 0.5V, VEE = 0V) (Note 9.)

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

IEE

V

OH

V

OL

V

IH

V

IL

I

IH

I

IL

NOTE: 10EP circuits are designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. The

7. VCC = 5.0V, VEE = 0V, all other pins floating.

8. All loading with 50 ohms to VCC–2.0 volts.

9. Input and output parameters vary 1:1 with VCC.

Power Supply Current
(Note 7.)

Output HIGH Voltage
(Note 8.)

Output LOW Voltage
(Note 8.)

Input HIGH Voltage
Single Ended

Input LOW Voltage
Single Ended

Input HIGH Current 150 150 150 µA
Input LOW Current 0.5 0.5 0.5 µA

circuit is in a test socket or mounted on a printed circuit board and transverse airflow greater than 500lfpm is maintained.

26 34 44 26 35 45 28 37 47 mA

2165 2240 2415 2230 2355 2480 2290 2415 2540 mV

1365 1490 1615 1430 1555 1680 1490 1615 1740 mV

2090 2415 2155 2480 2215 2540 mV

1365 1690 1430 1755 1490 1815 mV

–40°C 25°C 85°C

26 34 44 26 35 45 28 37 47 mA

3865 3940 4115 3930 4055 4180 3990 4115 4240 mV

3065 3190 3315 3130 3255 3380 3190 3315 3440 mV

3790 4115 3855 4180 3915 4240 mV

3065 3390 3130 3455 3190 3515 mV

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MC10EP31

AC CHARACTERISTICS (VCC = 0V; VEE = –3.0V to –5.5V) or (VCC = 3.0V to 5.5V; VEE =

–40°C 25°C 85°C

Symbol Characteristic Min Typ Max Min Typ Max Min Typ Max Unit

f

max

t

PLH

t

PHL

t

RR

t

S

t

H

t

SKEW

t

PW

t

JITTER

t

r

t

f

10.F

11.Skew is measured between outputs under identical transitions. Duty cycle skew is defined only for differential operation when the delays
are measured from the cross point of the inputs to the cross point of the outputs.

Maximum Toggle
Frequency (Note 10.)

,

Propagation Delay to
Output Differential

Set/Reset Recovery 225 150 200 140 185 130 ps
Setup Time

Hold Time
Duty Cycle Skew (Note 11.)

Skew Part–to–Part
Minimum Pulse Width

Cycle–to–Cycle Jitter TBD TBD TBD ps
Output Rise/Fall Times

(20% – 80%) Q, Q

guaranteed for functionality only. VOL and VOH levels are guaranteed at DC only.

max

CLK–>Q, Q
S, R–>Q, Q

CLK, SET, RESET

175
200

150
150

550 450 550 450 550 450

50 120 180 60 130 200 70 150 220

3.0 3.0 3.0 GHz

250
280

50
50

TBD
TBD

325
360

200
250

150
150

275
330

50
50

TBD
TBD

350
420

0V)

250
325

150
150

320
400

50
50

TBD
TBD

ps

400
475

ps

ps

ps

ps

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MC10EP31

P ACKAGE DIMENSIONS

SO–8

D SUFFIX

PLASTIC SOIC PACKAGE

CASE 751–06

ISSUE T

A

C

E

B

A1

D

58

0.25MB

1

H

4

e

M

h

X 45

_

q

C

A

SEATING
PLANE

0.10

L

B

SS

A0.25MCB

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETER.

3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.

MILLIMETERS

DIM MIN MAX

A 1.35 1.75

A1 0.10 0.25

B 0.35 0.49
C 0.19 0.25
D 4.80 5.00
E

3.80 4.00

1.27 BSCe

H 5.80 6.20
h

0.25 0.50

L 0.40 1.25

0 7

q

__

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Notes

MC10EP31

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Notes

MC10EP31

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MC10EP31

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MC10EP31/D

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