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1. Please check all the appropriate boxes:
Complete
Disassembly
Procedures
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Exploded
Views
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Diagrams
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Details
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List
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4. We would appreciate any corrections or recommendations for improving this manual.
Please include the specific page number(s) of the diagram or procedure in question.
No part of this manual may be reproduced, transmitted, stored in a retrieval system, or translated into
any language or computer language, in any form or by any means, without the prior written
permission of Motorola Inc.
Computer Software Copyrights
The Motorola products described in this manual may include copyrighted Motorola computer
programs stored in semiconductor memories or other media. Laws in the United States and other
countries preserve for Motorola certain exclusive rights for copyrighted computer programs including,
but not limited to, the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Motorola computer programs contained in the Motorola
products described in this manual may not be copied, reproduced, modified, reverse-engineered, or
distributed in any manner without the express written permission of Motorola. Furthermore, the
purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppel,
or otherwise, any license under the copyrights, patents or patent applications of Motorola, except for
the normal non-exclusive royalty-free license to use that arises by operation of law in the sale of a
product.
i
Trademarks
MOTOROLA and the Stylized M Logo are registered in the U.S.Patent and Trademark Office. All
other product or service names are the property of their respective owners.
ii
SAFETY INFORMATION
Product Safety and RF Energy Exposure Compliance
These servicing instructions are for use by qualified personnel only. To
reduce the risk of electric shock, do not perform any servicing other than that
contained in the Operating Instructions unless you are qualified to do so.
Refer all servicing to qualified service personnel.
Before using this product, read the operating instructions for safe usage
contained in the Product Safety and RF Exposure booklet enclosed with your
radio.
ATTENTION!
This is restricted to occupational use only to satisfy ICNIRP RF energy exposure
requirements. Before using this product, read the RF energy awareness information and
operating instructions in the Product Safety and RF Exposure booklet enclosed with your
(Motorola Publication part number 68007024010) to ensure compliance with RF energy
exposure limits.
For a list of Motorola-approved antennas, and other accessories, visit the following web site
which lists approved accessories: http://www.motorola.com/radiosolutions
DOCUMENT HISTORY
The following major changes have been implemented in this manual since the previous edition:
EditionDescriptionDate
6878422A01-AInitial editionMar, 2009
iii
6878422A01-BAdded VHF and UHF1 band information (Chapter 8,
9, 10, 11, 12, 13)
August, 2009
iv
Notes
Table of Contentsv
Table of Contents
Copyright ........................................................................................................ i
Safety Information......................................................................................... ii
Document History ........................................................................................ iii
Table 6-1.Troubleshooting Table for Receiver (UHF2) .................................................................... 6-1
Table 6-2.Troubleshooting Table for Synthesizer (UHF2)................................................................ 6-2
Table 6-3.Troubleshooting Table for Transmitter (UHF2) ................................................................ 6-3
Table 6-4.Troubleshooting Table for Board and IC Signals (UHF2)................................................. 6-4
Table 9-1.Troubleshooting Table for Receiver (VHF)....................................................................... 9-1
Table 9-2.Troubleshooting Table for Synthesizer (VHF) .................................................................. 9-2
Table 9-3.Troubleshooting Table for Transmitter (VHF)................................................................... 9-3
Table 9-4.Troubleshooting Table for Board and IC Signals (VHF)................................................... 9-4
Table 12-1.Troubleshooting Table for Receiver (UHF1) .................................................................. 12-1
Table 12-2.Troubleshooting Table for Synthesizer (UHF1).............................................................. 12-2
Table 12-3.Troubleshooting Table for Transmitter (UHF1) .............................................................. 12-3
Table 12-4.Troubleshooting Table for Board and IC Signals (UHF1)............................................... 12-4
xiiNotations Used in This Manual
Notations Used in This Manual
Throughout the text in this publication, you will notice the use of the following notations. These notations are
used to emphasize that safety hazards exist, and due care must be taken and observed.
Note
An operational procedure, practice, or condition that isessential to emphasize.
CAUTION indicates a potentially hazardous situation which, if not avoided,
might result in equipment damage.
Summary of Printed Circuit Boards and Bands Availablexiii
Summary of Printed Circuit Boards and Bands Available
Table below lists all the bands available in this manual.
Frequency
Band
UHF2435 – 480 MHz1W or 4W
UHF2––
UHF2––
VHF136 – 162 MHz1W or 5W
VHF––
VHF––
UHF1403 – 447 MHz1W or 4W
UHF1––
UHF1––
BandwidthPower LevelPC Board Part NumberBoard
8431BEACON200
8421BEACON100
8422BEACON100
8431BEACON400
8421BEACON100
8422BEACON100
8431BEAUHF300
8421BEACON100
8422BEACON100
Chapter
Revision
27
17
17
410
110
110
313
113
113
xiv
Notes
Chapter 1Maintenance
1.0Introduction
This chapter of the manual describes:
•Preventive maintenance
•Safe handling of CMOS devices
•Repair procedures and techniques
NOTE
The Servicing of your Intrinsically Safe Radios.
In order to maintain compliance, radios that are FM Approved to intrinsically safe
standards MUST be repaired at FM audited service centers. See Further Assistance FromMotorola on page 1-2 for more information.
1.1Preventive Maintenance
Periodic visual inspection and cleaning is recommended.
1.2Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches
are functional. It is not recommended to inspect the interior electronic circuitry.
1.3Cleaning
The following procedures describe the recommended cleaning agents and the methods to be
used when cleaning the external and internal surfaces of the radio. External surfaces include the
front cover, housing assembly, and battery case. These surfaces should be cleaned whenever a
periodic visual inspection reveals the presence of smudges, grease, and/or grime.
NOTE
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild
dishwashing detergent in water. The only factory recommended liquid for cleaning the printed
circuit boards and their components is isopropyl alcohol (100% by volume).
Internal surfaces should be cleaned only when the radio is disassembled for servicing or
repair.
CAUTION: The effects of certain chemicals and their vapors can have harmful results on
certain plastics. Aerosol sprays, tuner cleaners, and other chemicals should be avoided.
1.Cleaning External Plastic Surfaces
The detergent-water solution should be applied sparingly with a stiff, non-metallic, shortbristled brush to work all loose dirt away from the radio. A soft, absorbent, lintless cloth or
tissue should be used to remove the solution and dry the radio. Make sure that no water
remains entrapped near the connectors, cracks, or crevices.
1-2 Introduction
2.Cleaning Internal Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to dislodge
embedded or caked materials located in hard-to-reach areas. The brush stroke should
direct the dislodged material out and away from the inside of the radio. Make sure that
controls or tunable components are not soaked with alcohol. Do not use high-pressure
air to hasten the drying process since this could cause the liquid to collect in unwanted
places. Upon completion of the cleaning process, use a soft, absorbent, lintless cloth to
dry the area. Do not brush or apply any isopropyl alcohol to the frame, front cover, or
back cover.
NOTEAlways use a fresh supply of alcohol and a clean container to prevent contamination by
dissolved material (from previous usage).
1.4Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios.
CMOS characteristics make them susceptible to damage by electrostatic or high voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later. Therefore, special
precautions must be taken to prevent device damage during disassembly, troubleshooting, and
repair.
Handling precautions are mandatory for CMOS circuits and are especially important in low
humidity conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS
CAUTION paragraph in the Disassembly and Reassembly section of the manual.
1.5General Repair Procedures and Techniques
NOTE
Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards - examples shown below) were developed and assembled using environmentally
preferred components and solder assembly techniques that meet or exceed compliance
to the European Union’s ROHS and WEEE directives (Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC and Restriction of Hazardous Subtances
(ROHS) Directive 2002/95/EC). To maintain product compliance and reliability, use only
the Motorola specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products will carry the EPP
Marking, shown below, on the printed circuit board (PCB). This marking provides
information to those performing assembly, servicing and recycling operation on this
product, adhering to the JEDEC standard #97. The EPP Marking takes the form of a
label or marking on the PCB.
Introduction1-3
Any rework or repair on Environmentally Preferred Products must be done using the appropriate
lead-free solder wire and solder paste as stated in the following tables:
Table 1-2. Lead Free Solder Paste Part Number List
Motorola
Part Number
1085674C03NC-SMQ230900-1000KCPs
Manufacturer
Part Number
ViscosityTypeComposition & Percent Metal
Brookfield (5rpm)
Type 3
(-325/+500)
(95.5%Sn-3.8%Ag-0.7%Cu)
89.3%
Liquid
Temperatur
e
217°C
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement
component is not locally available, check the parts list for the proper Motorola part number and
order the component from the nearest Motorola Communications parts center listed in the “Piece
Parts” section of this manual.
Rigid Circuit Boards
The family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are
not accessible, some special considerations are required when soldering and unsoldering
components. The through-plated holes may interconnect multiple layers of the printed circuit.
Therefore, care should be exercised to avoid pulling the plated circuit out of the hole.
When soldering near the connector pins:
•Avoid accidentally getting solder in the connector.
•Be careful not to form solder bridges between the connector pins
•Closely examine your work for shorts due to solder bridges.
Chip Components
Use the RLN4062 Hot-Air Repair Station for chip component replacement. Adjust the
temperature control to 390 °C (735 °F), and adjust the airflow to a minimum setting. Airflow can
vary due to component density.
•To remove a chip component:
1.Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm
(1/8") above the component to be removed.
2.Begin applying the hot air. Once the solder reflows, remove the component using a pair
of tweezers.
3.Using a solder wick and a soldering iron or a power desoldering station, remove the
excess solder from the pads.
1-4 Introduction
•To replace a chip component using a soldering iron:
1.Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the
solder pads.
2.Using a pair of tweezers, position the new chip component in place while heating the
fresh solder.
3.Once solder wicks onto the new component, remove the heat from the solder.
4.Heat the remaining pad with the soldering iron and apply solder until it wicks to the
component. If necessary, touch up the first side. All solder joints should be smooth and
shiny.
•To replace a chip component using hot air:
1.Use the hot-air hand piece and reflow the solder on the solder pads to smooth it.
2.Apply a drop of solder paste flux to each pad.
3.Using a pair of tweezers, position the new component in place.
4.Position the hot-air hand piece approximately 0.3 cm (1/8”) above the component and
begin applying heat.
5.Once the solder wicks to the component, remove the heat and inspect the repair. All
joints should be smooth and shiny.
Shields
Removing and replacing shields is recommended to be done with the Air Blower,
BOSCH GHG 603 or equivalent.
•To remove the shield:
1.Place the circuit board in the circuit board holder.
2.Add solder paste flux around the base of the shield.
3.Position the heat-focus head onto the shield.
4.Turn on the heater and wait until the shield lifts off the circuit board.
5.Once the shield is off, turn off the heat, and grab the part with a pair of tweezers.
6.Remove the circuit board from the circuit board holder.
•To replace the shield:
1.Add solder to the shield if necessary, using a micro-tipped soldering iron.
2.Next, rub the soldering iron tip along the edge of the shield to smooth out any excess
solder. Use solder wick and a soldering iron to remove excess solder from the solder
pads on the circuit board.
3.Place the circuit board back in the circuit board holder.
4.Place the shield on the circuit board using a pair of tweezers.
5.Position the heat-focus head over the shield.
6.Turn on the heater and wait for the solder to reflow.
7.Once complete, turn off the heat, raise the heat-focus head and wait approximately one
minute for the part to cool.
8.Remove the circuit board and inspect the repair. No cleaning should be necessary.
Chapter 2Test Equipment, Service Aids, and Service
Tools
2.1Test Equipment
Table 2-1 lists test equipment required to service the radios.
Table 2-1. Recommended Test Equipment
Motorola Part No.DescriptionCharacteristicsApplication
R2600 series or
HP 8920A
*R1074AFluke 87 digital
*R1377AAC voltmeter1 mV to 300 mV, 10 mega-
R1611ADual channel
S1339ARF millivolt meter100 μV to 3V RF, 10 kHz to
*R1013B or
*R1370A
System analyzerThis item will substitute for
items with an asterisk (*)
True RMS metering,
multi-meter
Fluke 85 RF probe500 MHz, 30 VAC maxUse with Fluke 87 digital
100 MHz
oscilloscope
(Agillent)
SINAD meter or
SINAD meter with
RMS
200 kHz frequency
counter, 32-segment bar
graph with backlit display
Without RMS audio
voltmeter or
With RMS audio voltmeter
Frequency/Deviation meter and
signal generator for wide-range
troubleshooting and alignment
Digital voltmeter is recommended
for AC/DC voltage and current
measurements
multi-meter for RF voltage
measurements.
Audio voltage measurements
Waveform measurements
RF level measurements
Receiver sensitivity
measurements
2-2Test Equipment, Service Aids, and Service Tools: Service Aids
2.2Service Aids
Table 2-2 lists the service aids recommended for working on the EP350 SeriesRadios. While all of
these items are available from Motorola, most are standard shop equipment items, and any
equivalent item capable of the same performance may be substituted for the item listed.
Table 2-2. Service Aids
Motorola Part
No.
PMDN4026_RFlat Ceramic Tuning Tools
(1.8mm)
PMDN4038_RKnob Remover/Chassis OpenerUsed to remove the front cover assembly.
PMDN4039_RCrab Eye Nut OpenerUsed to remove the crab eye nut.
1
PMDN4040_R
PMDN4041_RRF AdapterAdapts radio’s antenna port to BNC cabling of test
PMDN4044_RT-Head Ceramic Tuning ToolUsed for tuning the VCO.
PMDN4053_RFlat Ceramic Tuning Tools
PMDN4076_RRadio to Radio Cloning CableAllows a radio to be duplicated from a master radio by
PMDN4077_RProgramming CableUsed to program the radio through Customer
PMDN4079_RGND PlateInterconnects radio’s chassis to RF Adaptor.
Radio Test BoxEnables communication between the radio, test
(0.9mm)
DescriptionApplication
Used for tuning the VCO.
equipment and the computer's USB port.
equipment.
Used for tuning the VCO.
transferring programmed data from the master radio to
the other.
Programming Software and Radio Tuner.
PMDN4080_RBattery EliminatorInterconnects radio to power supply.
PMVN4161_Customer Programming
Software on CD Rom
PMVN4165_Tuner on CD RomOnly Motorola Service Centers or Authorized Motorola
Note: 1.Use PMDN4040BR or higher for tuning the EP350 Series radios as PMDN4040AR cannot be used to
perform this function.
Program customer option and channel data.
Service Dealers can perform this function.
Test Equipment, Service Aids, and Service Tools: Service Aids2-3
t
Programming/Test Cable
2.5mm stereo
USB connection
Figure 2-1. Programming/Test Cable (PMDN4077_R)
2.5mm stereo
2.5mm stereo >
12
RX / TX data GND
~
Figure 2-2. Cloning Cable (PMDN4076_R)
D-D+
VBUS
1
2
GND
TX_D
RX_D
IC : CP2102
2.5mm stereo
1
VBUS
2
D-
3
D+
GND
4, 5, 6
To Computor
USB_CONNECTOR
Figure 2-3. Wiring of the Connectors
2-4Test Equipment, Service Aids, and Service Tools: Service Aids
Notes
Chapter 3DC Power Distribution
3.1DC Regulation and Distribution
A block diagram of the DC power distribution throughout the radio is shown in Figure 3-1.
VCTCXO
Voltage
Doubler
10V
Charge
5V
Pump
3.3V
Audio filter
½ Vcc
VCO
RX B+
TXVB
MCU, EEPROM
PLL IC
Digital potent iometer
DTMF IC
LCD Driver
7.5V
Battery
Mech SW1
PA
APC
Driv er,
Pre-driver
SWB+
Vdd
Regulat or
Vdd
Regulat or
KeyPC B
Low Batt.
detect or
Audio
Amplifier
Figure 3-1. DC Power Distribution Block Diagram
Battery voltage enters at connector J602 and is routed through SW/VOL1 to become SWB+.
This voltage is routed to:
•SW/VOL1
• TX power amplifier Q403 (via R417)
• APC circuit U401
• RX audio power amplifier U601
• 5V regulator (U505)
• 3.3V regulator (U506)
• Voltage divider R153/R154, a microprocessor A/D input which measures battery voltage
•Key PCB
3-2DC Power Distribution: DC Regulation and Distribution
The following regulators are used:
Table 3-1. Voltage Regulators
Reference No.DescriptionType
U5055V regulatorTK11250
U5063.3V regulatorTK11233
U507Voltage Doubler (10V)TC12140
The 5 V source from U505 is applied to:
• RX back end circuitry
• RX/TX audio filters
• 1/2 VCC generator
• VCO power source (Q705, Q706)
• RX B+ (Q304)
• TXVB (Q407)
• VCTCXO
The 5 V source is also applied to transistor switches Q304 and Q407. Q304 is turned on by Q305
when RX_EN (from U101 Pin 71) is high, and supplies the source to mixer, IF IC and LNA. Q407 is
turned on by Q408 when TX_EN2 (from U101 Pin 85) is high, and supplies the "TXVB" source to the
first transmitter stage Q401 base, Q402 gate, APC power source (U401 Pin 8) and ANT switch
(CR401).
The 3.3 V regulated source from U506 is applied to:
• MCU IC U101
• EEProm IC U104
• DTMF IC U103
• Audio processor IC U102
• Microphone bias circuitry
• And applied to Key PCB (LCD driver power source)
The 10 V source from U507 is applied to Charge Pump.
Chapter 4Controller Theory of Operation
4.1RX Audio Circuit
The RX audio circuit consists of Audio Processor IC, Audio Amplifier, Internal (INT)/External (EXT)
speaker and Sub-Audio Tones System.
Audio Processor IC (AK2347)
Audio IN
(from IF IC)
pin24
RXA1
VR3
-4 to +3.5dB/
0.5dB
Sub audio
Programmable
RX LPFTX/RX HPF
LPF
Sub audio
-6 to +6dB/
HPF
Comparator
U105-C
0.5dB
VR5
pin18
U105-A,B
(tone detect)
Figure 4-1. RX Audio Circuit
4.1.1Audio processor IC (U102)
The RX audio from Pin 9 of U201 enters to Pin 24 of Audio processor IC.
To CPU
Scrambler/
Descrambler
U102
INT SPK.
EXT SPK.
J601
De-
emphasis
ExpanderVR4SMF
-18, -4.5 to +4.5dB/
0.25dB
Audio Amp.
OUT-
OUT+
U601
IN-
IN+
SVR
Audio Mute
pin21
Vol1
control
• RX A: An operational amplifier used for gain adjustment of the receive demodulation signal
from Pin 9 of U201. The gain is unity and it acts as a buffer amplifier.
4.1.1.1 RX Audio Processing
•VR3: This circuit controls the volume for adjusting the input level of receive demodulation
signal. Adjustment range: -4.0dB to +3.5dB in 0.5dB steps.
• RX LPF: Low-pass filter to eliminate high-frequency components higher than 3 kHz which are
included in the receive demodulation signal.
• TX/RX HPF: High-pass filter to eliminate low-frequency components lower than 250 Hz which
are included in receive audio signal. This circuit is turned on and off by control register of Audio
processor IC.
• Descrambler: This circuit inverts the spectrum distribution of receive audio signals with respect
to the carrier frequency. The carrier frequency is 3.388 kHz or 3.290 kHz.
4-2Controller Theory of Operation: RX Audio Circuit
• De-emphasis: This circuit restores the original state of signal of which high-frequency
component has been emphasized by the pre-emphasis.
• Expander: This circuit expands the signal compressed twice by the Compressor in dB scale to
restore the original signal state.
•VR4: This circuit controls the volume for adjusting the RX output level.
Adjustment range: -18.0dB, -4.5dB to +4.5dB in 0.25dB steps.
•SMF: Smoothing filter to eliminate the high-frequency and clock components generated in the
Audio processor IC.
4.1.1.2 RX Tone PL/Digital PL Decode Filtering
• Sub-audio Programmable LPF: Low-pass filter to eliminate components of the RXA1 signal.
This circuit is controlled by the internal registers and by the audio processor IC for cut-off
frequency.
•VR5: This circuit controls the volume for adjusting the output level from the sub-audio LPF
signal. Adjustment range: -6.0dB, +6.0dB in 0.5dB steps
The sub-audio tone of U102 Pin 18 output pass through switchable high-pass filter U105. This filter
(U105-A, B) has 4 different high pass cut-off frequencies which can be selected accordingly to the
sub-tone audio. This filter (U105-A, B) filters the unwanted sub-tone. The tone of U105-B output
passed through U105-C comparator, which acts as a squaring circuit. This output signal is then sent
to microprocessor Pin 3. The micro-processor then decodes CTCSS and CDCSS from this square
signal.
4.1.2Audio Amp
The de-emphasized audio signal from Pin 21 of audio processor IC passes through volume control
(SW/VOL1) and is amplified by U601BTL audio amplifier to a sufficient level to drive a loud speaker.
U601 has mute/un-mute function controlled by audio-mute control (Pin 83) of CPU. When U601
Pin 1 is low, the audio amp goes to active (un-mute) mode. When U601 Pin 1 is high, the audio amp
goes to mute mode.
4.1.3Internal and External Speaker
When no external speaker is plugged into J601, the RX audio is passed through to the internal
speaker. When an external speaker is plugged into J601, the internal speaker is cut-off from the
rest of the circuit and RX audio is passed through the external speaker.
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