As we continue to make engineering enhancements to our products, the information in our
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Fax to: 6-04-6124944
The Technical Publications Coordinator,
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R&D Department,
Motorola Penang.
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Manual No.: 6878422A01
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Page 4
Service Manual Feedback Form
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your cooperation.
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1. Please check all the appropriate boxes:
Complete
Disassembly
Procedures
Alignment
Procedures
Exploded
Views
Schematic
Diagrams
Circuit Board
Details
Electrical Parts
List
Exploded View
Parts List
Incomplete
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in this Manual
2. How do you rate this particular Service Manual?
excellent very good good fair poor
3. Did this Service manual provide you with the information necessary to service and
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very much so generally yes to some extent no
4. We would appreciate any corrections or recommendations for improving this manual.
Please include the specific page number(s) of the diagram or procedure in question.
No part of this manual may be reproduced, transmitted, stored in a retrieval system, or translated into
any language or computer language, in any form or by any means, without the prior written
permission of Motorola Inc.
Computer Software Copyrights
The Motorola products described in this manual may include copyrighted Motorola computer
programs stored in semiconductor memories or other media. Laws in the United States and other
countries preserve for Motorola certain exclusive rights for copyrighted computer programs including,
but not limited to, the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Motorola computer programs contained in the Motorola
products described in this manual may not be copied, reproduced, modified, reverse-engineered, or
distributed in any manner without the express written permission of Motorola. Furthermore, the
purchase of Motorola products shall not be deemed to grant either directly or by implication, estoppel,
or otherwise, any license under the copyrights, patents or patent applications of Motorola, except for
the normal non-exclusive royalty-free license to use that arises by operation of law in the sale of a
product.
i
Trademarks
MOTOROLA and the Stylized M Logo are registered in the U.S.Patent and Trademark Office. All
other product or service names are the property of their respective owners.
Page 6
ii
SAFETY INFORMATION
Product Safety and RF Energy Exposure Compliance
These servicing instructions are for use by qualified personnel only. To
reduce the risk of electric shock, do not perform any servicing other than that
contained in the Operating Instructions unless you are qualified to do so.
Refer all servicing to qualified service personnel.
Before using this product, read the operating instructions for safe usage
contained in the Product Safety and RF Exposure booklet enclosed with your
radio.
ATTENTION!
This is restricted to occupational use only to satisfy ICNIRP RF energy exposure
requirements. Before using this product, read the RF energy awareness information and
operating instructions in the Product Safety and RF Exposure booklet enclosed with your
(Motorola Publication part number 68007024010) to ensure compliance with RF energy
exposure limits.
For a list of Motorola-approved antennas, and other accessories, visit the following web site
which lists approved accessories: http://www.motorola.com/radiosolutions
Page 7
DOCUMENT HISTORY
The following major changes have been implemented in this manual since the previous edition:
EditionDescriptionDate
6878422A01-AInitial editionMar, 2009
iii
6878422A01-BAdded VHF and UHF1 band information (Chapter 8,
9, 10, 11, 12, 13)
August, 2009
Page 8
iv
Notes
Page 9
Table of Contentsv
Table of Contents
Copyright ........................................................................................................ i
Safety Information......................................................................................... ii
Document History ........................................................................................ iii
Table 6-1.Troubleshooting Table for Receiver (UHF2) .................................................................... 6-1
Table 6-2.Troubleshooting Table for Synthesizer (UHF2)................................................................ 6-2
Table 6-3.Troubleshooting Table for Transmitter (UHF2) ................................................................ 6-3
Table 6-4.Troubleshooting Table for Board and IC Signals (UHF2)................................................. 6-4
Table 9-1.Troubleshooting Table for Receiver (VHF)....................................................................... 9-1
Table 9-2.Troubleshooting Table for Synthesizer (VHF) .................................................................. 9-2
Table 9-3.Troubleshooting Table for Transmitter (VHF)................................................................... 9-3
Table 9-4.Troubleshooting Table for Board and IC Signals (VHF)................................................... 9-4
Table 12-1.Troubleshooting Table for Receiver (UHF1) .................................................................. 12-1
Table 12-2.Troubleshooting Table for Synthesizer (UHF1).............................................................. 12-2
Table 12-3.Troubleshooting Table for Transmitter (UHF1) .............................................................. 12-3
Table 12-4.Troubleshooting Table for Board and IC Signals (UHF1)............................................... 12-4
Page 16
xiiNotations Used in This Manual
Notations Used in This Manual
Throughout the text in this publication, you will notice the use of the following notations. These notations are
used to emphasize that safety hazards exist, and due care must be taken and observed.
Note
An operational procedure, practice, or condition that isessential to emphasize.
CAUTION indicates a potentially hazardous situation which, if not avoided,
might result in equipment damage.
Page 17
Summary of Printed Circuit Boards and Bands Availablexiii
Summary of Printed Circuit Boards and Bands Available
Table below lists all the bands available in this manual.
Frequency
Band
UHF2435 – 480 MHz1W or 4W
UHF2––
UHF2––
VHF136 – 162 MHz1W or 5W
VHF––
VHF––
UHF1403 – 447 MHz1W or 4W
UHF1––
UHF1––
BandwidthPower LevelPC Board Part NumberBoard
8431BEACON200
8421BEACON100
8422BEACON100
8431BEACON400
8421BEACON100
8422BEACON100
8431BEAUHF300
8421BEACON100
8422BEACON100
Chapter
Revision
27
17
17
410
110
110
313
113
113
Page 18
xiv
Notes
Page 19
Chapter 1Maintenance
1.0Introduction
This chapter of the manual describes:
•Preventive maintenance
•Safe handling of CMOS devices
•Repair procedures and techniques
NOTE
The Servicing of your Intrinsically Safe Radios.
In order to maintain compliance, radios that are FM Approved to intrinsically safe
standards MUST be repaired at FM audited service centers. See Further Assistance FromMotorola on page 1-2 for more information.
1.1Preventive Maintenance
Periodic visual inspection and cleaning is recommended.
1.2Inspection
Check that the external surfaces of the radio are clean, and that all external controls and switches
are functional. It is not recommended to inspect the interior electronic circuitry.
1.3Cleaning
The following procedures describe the recommended cleaning agents and the methods to be
used when cleaning the external and internal surfaces of the radio. External surfaces include the
front cover, housing assembly, and battery case. These surfaces should be cleaned whenever a
periodic visual inspection reveals the presence of smudges, grease, and/or grime.
NOTE
The only recommended agent for cleaning the external radio surfaces is a 0.5% solution of a mild
dishwashing detergent in water. The only factory recommended liquid for cleaning the printed
circuit boards and their components is isopropyl alcohol (100% by volume).
Internal surfaces should be cleaned only when the radio is disassembled for servicing or
repair.
CAUTION: The effects of certain chemicals and their vapors can have harmful results on
certain plastics. Aerosol sprays, tuner cleaners, and other chemicals should be avoided.
1.Cleaning External Plastic Surfaces
The detergent-water solution should be applied sparingly with a stiff, non-metallic, shortbristled brush to work all loose dirt away from the radio. A soft, absorbent, lintless cloth or
tissue should be used to remove the solution and dry the radio. Make sure that no water
remains entrapped near the connectors, cracks, or crevices.
Page 20
1-2 Introduction
2.Cleaning Internal Circuit Boards and Components
Isopropyl alcohol may be applied with a stiff, non-metallic, short-bristled brush to dislodge
embedded or caked materials located in hard-to-reach areas. The brush stroke should
direct the dislodged material out and away from the inside of the radio. Make sure that
controls or tunable components are not soaked with alcohol. Do not use high-pressure
air to hasten the drying process since this could cause the liquid to collect in unwanted
places. Upon completion of the cleaning process, use a soft, absorbent, lintless cloth to
dry the area. Do not brush or apply any isopropyl alcohol to the frame, front cover, or
back cover.
NOTEAlways use a fresh supply of alcohol and a clean container to prevent contamination by
dissolved material (from previous usage).
1.4Safe Handling of CMOS and LDMOS
Complementary metal-oxide semiconductor (CMOS) devices are used in this family of radios.
CMOS characteristics make them susceptible to damage by electrostatic or high voltage charges.
Damage can be latent, resulting in failures occurring weeks or months later. Therefore, special
precautions must be taken to prevent device damage during disassembly, troubleshooting, and
repair.
Handling precautions are mandatory for CMOS circuits and are especially important in low
humidity conditions. DO NOT attempt to disassemble the radio without first referring to the CMOS
CAUTION paragraph in the Disassembly and Reassembly section of the manual.
1.5General Repair Procedures and Techniques
NOTE
Environmentally Preferred Products (EPP) (refer to the marking on the printed circuit
boards - examples shown below) were developed and assembled using environmentally
preferred components and solder assembly techniques that meet or exceed compliance
to the European Union’s ROHS and WEEE directives (Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC and Restriction of Hazardous Subtances
(ROHS) Directive 2002/95/EC). To maintain product compliance and reliability, use only
the Motorola specified parts in this manual.
For the identification of lead (Pb) free assemblies, all EPP products will carry the EPP
Marking, shown below, on the printed circuit board (PCB). This marking provides
information to those performing assembly, servicing and recycling operation on this
product, adhering to the JEDEC standard #97. The EPP Marking takes the form of a
label or marking on the PCB.
Page 21
Introduction1-3
Any rework or repair on Environmentally Preferred Products must be done using the appropriate
lead-free solder wire and solder paste as stated in the following tables:
Table 1-2. Lead Free Solder Paste Part Number List
Motorola
Part Number
1085674C03NC-SMQ230900-1000KCPs
Manufacturer
Part Number
ViscosityTypeComposition & Percent Metal
Brookfield (5rpm)
Type 3
(-325/+500)
(95.5%Sn-3.8%Ag-0.7%Cu)
89.3%
Liquid
Temperatur
e
217°C
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical replacement
component is not locally available, check the parts list for the proper Motorola part number and
order the component from the nearest Motorola Communications parts center listed in the “Piece
Parts” section of this manual.
Rigid Circuit Boards
The family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are
not accessible, some special considerations are required when soldering and unsoldering
components. The through-plated holes may interconnect multiple layers of the printed circuit.
Therefore, care should be exercised to avoid pulling the plated circuit out of the hole.
When soldering near the connector pins:
•Avoid accidentally getting solder in the connector.
•Be careful not to form solder bridges between the connector pins
•Closely examine your work for shorts due to solder bridges.
Chip Components
Use the RLN4062 Hot-Air Repair Station for chip component replacement. Adjust the
temperature control to 390 °C (735 °F), and adjust the airflow to a minimum setting. Airflow can
vary due to component density.
•To remove a chip component:
1.Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm
(1/8") above the component to be removed.
2.Begin applying the hot air. Once the solder reflows, remove the component using a pair
of tweezers.
3.Using a solder wick and a soldering iron or a power desoldering station, remove the
excess solder from the pads.
Page 22
1-4 Introduction
•To replace a chip component using a soldering iron:
1.Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the
solder pads.
2.Using a pair of tweezers, position the new chip component in place while heating the
fresh solder.
3.Once solder wicks onto the new component, remove the heat from the solder.
4.Heat the remaining pad with the soldering iron and apply solder until it wicks to the
component. If necessary, touch up the first side. All solder joints should be smooth and
shiny.
•To replace a chip component using hot air:
1.Use the hot-air hand piece and reflow the solder on the solder pads to smooth it.
2.Apply a drop of solder paste flux to each pad.
3.Using a pair of tweezers, position the new component in place.
4.Position the hot-air hand piece approximately 0.3 cm (1/8”) above the component and
begin applying heat.
5.Once the solder wicks to the component, remove the heat and inspect the repair. All
joints should be smooth and shiny.
Shields
Removing and replacing shields is recommended to be done with the Air Blower,
BOSCH GHG 603 or equivalent.
•To remove the shield:
1.Place the circuit board in the circuit board holder.
2.Add solder paste flux around the base of the shield.
3.Position the heat-focus head onto the shield.
4.Turn on the heater and wait until the shield lifts off the circuit board.
5.Once the shield is off, turn off the heat, and grab the part with a pair of tweezers.
6.Remove the circuit board from the circuit board holder.
•To replace the shield:
1.Add solder to the shield if necessary, using a micro-tipped soldering iron.
2.Next, rub the soldering iron tip along the edge of the shield to smooth out any excess
solder. Use solder wick and a soldering iron to remove excess solder from the solder
pads on the circuit board.
3.Place the circuit board back in the circuit board holder.
4.Place the shield on the circuit board using a pair of tweezers.
5.Position the heat-focus head over the shield.
6.Turn on the heater and wait for the solder to reflow.
7.Once complete, turn off the heat, raise the heat-focus head and wait approximately one
minute for the part to cool.
8.Remove the circuit board and inspect the repair. No cleaning should be necessary.
Page 23
Chapter 2Test Equipment, Service Aids, and Service
Tools
2.1Test Equipment
Table 2-1 lists test equipment required to service the radios.
Table 2-1. Recommended Test Equipment
Motorola Part No.DescriptionCharacteristicsApplication
R2600 series or
HP 8920A
*R1074AFluke 87 digital
*R1377AAC voltmeter1 mV to 300 mV, 10 mega-
R1611ADual channel
S1339ARF millivolt meter100 μV to 3V RF, 10 kHz to
*R1013B or
*R1370A
System analyzerThis item will substitute for
items with an asterisk (*)
True RMS metering,
multi-meter
Fluke 85 RF probe500 MHz, 30 VAC maxUse with Fluke 87 digital
100 MHz
oscilloscope
(Agillent)
SINAD meter or
SINAD meter with
RMS
200 kHz frequency
counter, 32-segment bar
graph with backlit display
Without RMS audio
voltmeter or
With RMS audio voltmeter
Frequency/Deviation meter and
signal generator for wide-range
troubleshooting and alignment
Digital voltmeter is recommended
for AC/DC voltage and current
measurements
multi-meter for RF voltage
measurements.
Audio voltage measurements
Waveform measurements
RF level measurements
Receiver sensitivity
measurements
Page 24
2-2Test Equipment, Service Aids, and Service Tools: Service Aids
2.2Service Aids
Table 2-2 lists the service aids recommended for working on the EP350 SeriesRadios. While all of
these items are available from Motorola, most are standard shop equipment items, and any
equivalent item capable of the same performance may be substituted for the item listed.
Table 2-2. Service Aids
Motorola Part
No.
PMDN4026_RFlat Ceramic Tuning Tools
(1.8mm)
PMDN4038_RKnob Remover/Chassis OpenerUsed to remove the front cover assembly.
PMDN4039_RCrab Eye Nut OpenerUsed to remove the crab eye nut.
1
PMDN4040_R
PMDN4041_RRF AdapterAdapts radio’s antenna port to BNC cabling of test
PMDN4044_RT-Head Ceramic Tuning ToolUsed for tuning the VCO.
PMDN4053_RFlat Ceramic Tuning Tools
PMDN4076_RRadio to Radio Cloning CableAllows a radio to be duplicated from a master radio by
PMDN4077_RProgramming CableUsed to program the radio through Customer
PMDN4079_RGND PlateInterconnects radio’s chassis to RF Adaptor.
Radio Test BoxEnables communication between the radio, test
(0.9mm)
DescriptionApplication
Used for tuning the VCO.
equipment and the computer's USB port.
equipment.
Used for tuning the VCO.
transferring programmed data from the master radio to
the other.
Programming Software and Radio Tuner.
PMDN4080_RBattery EliminatorInterconnects radio to power supply.
PMVN4161_Customer Programming
Software on CD Rom
PMVN4165_Tuner on CD RomOnly Motorola Service Centers or Authorized Motorola
Note: 1.Use PMDN4040BR or higher for tuning the EP350 Series radios as PMDN4040AR cannot be used to
perform this function.
Program customer option and channel data.
Service Dealers can perform this function.
Page 25
Test Equipment, Service Aids, and Service Tools: Service Aids2-3
t
Programming/Test Cable
2.5mm stereo
USB connection
Figure 2-1. Programming/Test Cable (PMDN4077_R)
2.5mm stereo
2.5mm stereo >
12
RX / TX data GND
~
Figure 2-2. Cloning Cable (PMDN4076_R)
D-D+
VBUS
1
2
GND
TX_D
RX_D
IC : CP2102
2.5mm stereo
1
VBUS
2
D-
3
D+
GND
4, 5, 6
To Computor
USB_CONNECTOR
Figure 2-3. Wiring of the Connectors
Page 26
2-4Test Equipment, Service Aids, and Service Tools: Service Aids
Notes
Page 27
Chapter 3DC Power Distribution
3.1DC Regulation and Distribution
A block diagram of the DC power distribution throughout the radio is shown in Figure 3-1.
VCTCXO
Voltage
Doubler
10V
Charge
5V
Pump
3.3V
Audio filter
½ Vcc
VCO
RX B+
TXVB
MCU, EEPROM
PLL IC
Digital potent iometer
DTMF IC
LCD Driver
7.5V
Battery
Mech SW1
PA
APC
Driv er,
Pre-driver
SWB+
Vdd
Regulat or
Vdd
Regulat or
KeyPC B
Low Batt.
detect or
Audio
Amplifier
Figure 3-1. DC Power Distribution Block Diagram
Battery voltage enters at connector J602 and is routed through SW/VOL1 to become SWB+.
This voltage is routed to:
•SW/VOL1
• TX power amplifier Q403 (via R417)
• APC circuit U401
• RX audio power amplifier U601
• 5V regulator (U505)
• 3.3V regulator (U506)
• Voltage divider R153/R154, a microprocessor A/D input which measures battery voltage
•Key PCB
Page 28
3-2DC Power Distribution: DC Regulation and Distribution
The following regulators are used:
Table 3-1. Voltage Regulators
Reference No.DescriptionType
U5055V regulatorTK11250
U5063.3V regulatorTK11233
U507Voltage Doubler (10V)TC12140
The 5 V source from U505 is applied to:
• RX back end circuitry
• RX/TX audio filters
• 1/2 VCC generator
• VCO power source (Q705, Q706)
• RX B+ (Q304)
• TXVB (Q407)
• VCTCXO
The 5 V source is also applied to transistor switches Q304 and Q407. Q304 is turned on by Q305
when RX_EN (from U101 Pin 71) is high, and supplies the source to mixer, IF IC and LNA. Q407 is
turned on by Q408 when TX_EN2 (from U101 Pin 85) is high, and supplies the "TXVB" source to the
first transmitter stage Q401 base, Q402 gate, APC power source (U401 Pin 8) and ANT switch
(CR401).
The 3.3 V regulated source from U506 is applied to:
• MCU IC U101
• EEProm IC U104
• DTMF IC U103
• Audio processor IC U102
• Microphone bias circuitry
• And applied to Key PCB (LCD driver power source)
The 10 V source from U507 is applied to Charge Pump.
Page 29
Chapter 4Controller Theory of Operation
4.1RX Audio Circuit
The RX audio circuit consists of Audio Processor IC, Audio Amplifier, Internal (INT)/External (EXT)
speaker and Sub-Audio Tones System.
Audio Processor IC (AK2347)
Audio IN
(from IF IC)
pin24
RXA1
VR3
-4 to +3.5dB/
0.5dB
Sub audio
Programmable
RX LPFTX/RX HPF
LPF
Sub audio
-6 to +6dB/
HPF
Comparator
U105-C
0.5dB
VR5
pin18
U105-A,B
(tone detect)
Figure 4-1. RX Audio Circuit
4.1.1Audio processor IC (U102)
The RX audio from Pin 9 of U201 enters to Pin 24 of Audio processor IC.
To CPU
Scrambler/
Descrambler
U102
INT SPK.
EXT SPK.
J601
De-
emphasis
ExpanderVR4SMF
-18, -4.5 to +4.5dB/
0.25dB
Audio Amp.
OUT-
OUT+
U601
IN-
IN+
SVR
Audio Mute
pin21
Vol1
control
• RX A: An operational amplifier used for gain adjustment of the receive demodulation signal
from Pin 9 of U201. The gain is unity and it acts as a buffer amplifier.
4.1.1.1 RX Audio Processing
•VR3: This circuit controls the volume for adjusting the input level of receive demodulation
signal. Adjustment range: -4.0dB to +3.5dB in 0.5dB steps.
• RX LPF: Low-pass filter to eliminate high-frequency components higher than 3 kHz which are
included in the receive demodulation signal.
• TX/RX HPF: High-pass filter to eliminate low-frequency components lower than 250 Hz which
are included in receive audio signal. This circuit is turned on and off by control register of Audio
processor IC.
• Descrambler: This circuit inverts the spectrum distribution of receive audio signals with respect
to the carrier frequency. The carrier frequency is 3.388 kHz or 3.290 kHz.
Page 30
4-2Controller Theory of Operation: RX Audio Circuit
• De-emphasis: This circuit restores the original state of signal of which high-frequency
component has been emphasized by the pre-emphasis.
• Expander: This circuit expands the signal compressed twice by the Compressor in dB scale to
restore the original signal state.
•VR4: This circuit controls the volume for adjusting the RX output level.
Adjustment range: -18.0dB, -4.5dB to +4.5dB in 0.25dB steps.
•SMF: Smoothing filter to eliminate the high-frequency and clock components generated in the
Audio processor IC.
4.1.1.2 RX Tone PL/Digital PL Decode Filtering
• Sub-audio Programmable LPF: Low-pass filter to eliminate components of the RXA1 signal.
This circuit is controlled by the internal registers and by the audio processor IC for cut-off
frequency.
•VR5: This circuit controls the volume for adjusting the output level from the sub-audio LPF
signal. Adjustment range: -6.0dB, +6.0dB in 0.5dB steps
The sub-audio tone of U102 Pin 18 output pass through switchable high-pass filter U105. This filter
(U105-A, B) has 4 different high pass cut-off frequencies which can be selected accordingly to the
sub-tone audio. This filter (U105-A, B) filters the unwanted sub-tone. The tone of U105-B output
passed through U105-C comparator, which acts as a squaring circuit. This output signal is then sent
to microprocessor Pin 3. The micro-processor then decodes CTCSS and CDCSS from this square
signal.
4.1.2Audio Amp
The de-emphasized audio signal from Pin 21 of audio processor IC passes through volume control
(SW/VOL1) and is amplified by U601BTL audio amplifier to a sufficient level to drive a loud speaker.
U601 has mute/un-mute function controlled by audio-mute control (Pin 83) of CPU. When U601
Pin 1 is low, the audio amp goes to active (un-mute) mode. When U601 Pin 1 is high, the audio amp
goes to mute mode.
4.1.3Internal and External Speaker
When no external speaker is plugged into J601, the RX audio is passed through to the internal
speaker. When an external speaker is plugged into J601, the internal speaker is cut-off from the
rest of the circuit and RX audio is passed through the external speaker.
Page 31
Controller Theory of Operation: TX Audio Circuit4-3
4.2TX Audio Circuit
The TX audio circuit consists of MIC/External MIC, LPF, Audio processor IC, and TX Sub-tone
system. For UHF1 and UHF2, refer to Figure 4-2. For VHF, refer to Figure 4-3.
4 Order LPF
(Fc=4KHz)
Mic
(Audio IN)
U501-C,D
Audio Processor IC (AK2347)
pin4
TXA1
-6 to +4.5dB/
Tone IN
(from CPU)
4 Order LPF
(Fc=4KHz)
U501-C,D
VR1
(HPF)
1.5dB
Com-
pressor
pin19
Mic
(Audio IN)
TX/RX HPF
Pre-
Emphasis
Scrambler/
Descrambler
Limiter
Fc=300Hz
U102
DTA1
Sub audio
Programmable
LPF
-6 to +6dB/
0.5dB
2 Order LPF
(Fc=300Hz)
VR5
pin17
U502-A
To VCO &
VCTC XO
Figure 4-2. TX Audio Circuit (UHF1 and UHF2)
Audio Processor IC (AK2347)
-9.6 to +3dB/
6 Order LPF
(Fc=3KHz)
U501-A,B
VR2
0.2dB
SplatterSMF
Fc=2.55KHz/
3KHz
Mod.Adj,
U508
pin8
TX AF Amp.
U502-C
pin4
TXA1
-6 to +4.5dB/
(from CPU)
VR1
(HPF)
1.5dB
Tone IN
Com-
pressor
pin19
DTA1
TX/RX HPF
pin17
Scrambler/
Descrambler
U102
2 Order LPF
(Fc=300Hz)
U502-A
Pre-
Emphasis
Sub audio
Programmable
LPF
Fc=300Hz
-6 to +6dB/
0.5dB
VR5
Figure 4-3. TX Audio Circuit (VHF)
Limiter
To VCO &
VCTC XO
-9.6 to +3dB/
6 Order LPF
(Fc=3KHz)
U501-A,B
VR2
0.2dB
SplatterSMF
Fc=2.55KHz/
3KHz
U502-C
pin8
TX AF Amp.
Mod.Adj,
U508
Page 32
4-4Controller Theory of Operation: TX Audio Circuit
4.2.1MIC and External MIC
The TX audio enters the radio via the internal MIC or the external MIC jack. When using
the internal MIC, the audio passes through the external jack then rest of the circuits. When using the
external jack, the audio from the internal MIC is cut-off from the rest of the circuits and the external
MIC audio is passed to the rest of the circuits.
4.2.24-order 4 kHz Low-Pass Filter (U501-C, D)
4-order 4 kHz Low-pass filter to prevent aliasing noise of the ASIC switching cut-off frequency.
4.2.3Audio processor IC (U102)
4.2.3.1 TX Audio Processing
Tx Audio from Pin 14 of U501-D enters the ASIC at Pin 3, 4 (Internal TX AMP).
• TX A1: Operational amplifier for gain adjustment of TX audio signal. R102, R103, C102, C103
are used to set the gain.
• VR1 (HPF): This circuit controls the volume for adjusting the input level of TX audio signal.
Adjustment range: -6.0dB, +4.5dB in 1.5dB steps
• Compressor: This circuit compresses the amplitude of transmit audio signal by 1/2 in dB scale.
• Pre-emphasis: This circuit emphasizes the high-pass frequency component of TX audio signal
to improve the S/N ratio of the modulation signal.
• TX/RX HPF: High-pass filter to eliminate low-frequency components lower than 250 Hz which
are included in transmitter audio signal. This circuit is turned on and off by control register of
Audio Processor IC.
• Scrambler: This circuit inverts the spectrum distribution of transmitter audio signals with
respect to the carrier frequency. The carrier frequency is 3.388 kHz or 3.290 kHz.
• Limiter: Amplitude limiting circuit to suppress frequency deviation in the modulation signal. The
limit level can be adjusted by applying a DC voltage the LIMLV Pin 7. When the pin is left open,
the level predetermined within the device is output.
• VR2: This circuit controls the volume for adjusting the output level on the MOD Pin 8.
Adjustment range: -9.6dB to +3.0dB in 0.2dB steps.
• Splatter: Low-pass filter to eliminate high-frequency components higher than 3 kHz which are
included in the limiter output signal. The cut-off frequency is 3 kHz.
• SMF: Smoothing filter to eliminate the high-frequency and clock components generated in the
ASIC.
4.2.3.2 Tx Tone PL/Digital PL Encode Filtering
The encode circuit of CTCSS and CDCSS mixes signals from 4 ports of microprocessor. This mixed
signal passes through ASIC Pin 19, 20 (U102).
• DTA1: Amplifier for gain adjustment of sub-audio signal which generated from CPU. Use
external resistor and capacitor to set the gain.
• Sub-audio Programmable LPF: Low-pass Filter to eliminate components of DAT1 signal in the
transmitter. This circuit is controlled cut-off frequency by the internal ASIC registers.
• VR5: This circuit controls the volume for adjusting the output level from the Sub-Audio LPF
signal. Adjustment range: -6.0dB to +6.0dB in 0.5 steps.
Page 33
Controller Theory of Operation: Microprocessor Circuitry4-5
4.2.4TX audio amplifier and 6 order 3 kHz Low-Pass filter
The TX audio signal from ASIC Pin 8 (UHF1, UHF2) or U508 Pin 4 (VHF) is linked by TX audio amp
(U502-C) to increase limiting range. The limited audio signal is adjusted to a proper level by U508
and passes through 6 order 3 kHz low pass filter (U501-A,B) before being modulated.
4.2.5TX modulation Adjustment
TX audio signal from Pin 8 of U502-C (UHF1, UHF2) or Pin 8 of ASIC (VHF) is linked TX modulation
adjustment IC (U508). The TX modulation is tuned in the factory. If any of the TX part is replaced, the
TX modulation must be tuned using Tuner.
4.3Microprocessor Circuitry
The microprocessor circuitry includes microprocessor (U101) and associated EEPROM.
Table 4-1. Radio Memory Requirements
Reference No.DescriptionSize
U101MicroprocessorFlash ROM128 Kbyte * 8
RAM5 Kbyte * 8
U104Serial EEPROM8 Kbit * 8
4.3.1Memory Usage
Radio operation is controlled by software that is stored in internal Flash ROM memory. Radio
parameters and customer specific information is stored in External EEPROM (U104). The operating
status of the radio is maintained in RAM located within the microprocessor. When the radio is turned
off, the operating status of the radio is written to EEPROM before operating voltage is removed from
the microprocessor.
4.3.2Control and Indicator Interface
Ports Pin 35 and 36 are outputs which control the Sub-PCB mounted LED indicator. When Pin 35 is
high, the indicator is green. When Pin 36 is high, the indicator is red. When both are high, the
indicator is amber. When both are low, the indicator id is off.
Pressing the side-mounted PTT button (PB501) provides a low to port Pin 44, which indicates PTT is
asserted. Side-mounted function buttons 1 & 2 (PB502 and PB503) are connected to port Pin 21 and
Pin 32, respectively.
4.3.3Interface to USB programming
The radio can be programmed, or the programmed information can be read, using a computer with
CPS (Customer Programming Software) connected to the radio via a USB Programming cable
(PMDN4077A). Connection to the radio is made via the microphone connector (part of accessory
connector J601). The line connects the programming connect (J601 Pin 6) to port PRG/CLONE_RX
(data into uP, Pin 34) and PRG/CLONE_TX(data out of uP, Pin 33).
4.3.4Storage of Customer-Specific Information
Information that has been programmed using CPS, such as channel frequencies or selective
signaling codes, etc, are stored in the external EEPROM, where it is retained permanently (unless
reprogrammed) without needing DC power applied to the microprocessor.
Page 34
4-6Controller Theory of Operation: Microprocessor Circuitry
4.3.5Sensing of VOX operating
Port PTT2 (Pin 68) is used to detect the presence of VOX operating when externally connected
accessories with VOX enabled. When port PTT2 is low, the VOX will start to operate.
4.3.6Microprocessor Power-on reset Routine
On power-up, the microprocessor is held in reset until the digital 3.3V regulator (U506 Pin 4)
provides a stable supply voltage. Once the digital supply reaches steady state and releases the reset
line (U107 Pin 2), the microprocessor begins to start up. After reset release by all circuit, the software
within the microprocessor begins executing port assignment, RAM checking, and initialization.
4.3.7Microprocessor 7.3728 MHz Clock
The 7.3728 MHz clock signal (Pin 13, X-in) is provided from the FL101.
4.3.8Battery indicator
Various battery types are available having different capacities. The radio can select different battery
type by FPP (Front Panel Programming) or CPS. A voltage divided by R153 and R154. And
EEPROM have a data for each battery types.
Page 35
Chapter 5435 – 480 MHz UHF2 Theory Of Operation
A
5.1Introduction
This chapter provides a detailed theory of operation for the radio components. Schematic diagrams
for the circuits described in the following paragraphs are located in Chapter 7 of this manual.
5.2UHF2 Receiver
The UHF2 receiver design covers the frequency range of 435 – 480 MHz and it is a double
conversion super heterodyne with 1st IF 45.1 MHz and 2nd IF 455 kHz. The receiver is divided into
two major blocks, Front End and Back End as shown in Figure 5-1.
Preselector
Filter
RF
Amp
Postselector
Filter
1st Mixer
Crystal
Filter
IF
Amp
RX from
ntennaSwitch
Inj Filter
First LO
fromSynthesizer
N/S_SW
Ceramic
Descriminator
455C24
Recovered Audio
LPF
Quadrature
Detector
Filter
IF
Amp
455FW
455HW
RSSI
Figure 5-1. UHF2 Receiver Block Diagram
Crystal
44.645MHz
Page 36
5-2435 – 480 MHz UHF2 Theory Of Operation: UHF2 Receiver
5.2.1Receiver Front End
Incoming RF signals from antenna are first routed through the harmonic filter (L409, L410, L411,
C426, C427, C428, C429, C445, C446) and antenna switch (CR301), part of the transmitter circuitry,
before being applied to the receiver front end. The receiver front end consists of preselector filter,
RF amplifier, post-selector filter and a single-balanced mixer.
The preselector filter is a varactor-tuned 2-pole design using discrete elements (L320, L324, C351,
C352, C353, C354, C355, C356, C357, C358, C359, C360, C361) in a series/shunt resonator
configuration. It is a band-shift filter and the frequency shift is controlled by varactor diodes CR314
and CR307, which are connected to the microprocessor. It is configured to provide steeper
attenuation above the passband for improved spurious rejection when low-side local injection is used.
The frequency is separated into 8 steps and controlled by CPU (435 – 480 MHz).
The output of this filter is matched to the base of RF amplifier Q301 which provides 13dB of gain.
The output of the RF amplifier is applied to the post-selector filter. The post-selector filter designed
using discrete elements (L322, L323, L328, C379, C354, C355) in a series/shunt resonator
configuration. It is a band-shift filter and the frequency shift is controlled by varactor diodes CR313,
CR304 and CR305, which are connected to the microprocessor. It is configured to provide steeper
attenuation above the passband for improved spurious rejection when low-side local injection is used.
The frequency is separated into 8 steps and controlled by CPU (435 – 480 MHz).
The output of the post selector is connected to the single-balanced mixer consisting of components
L329, L333, Q306 and Q307. 1st local signal generated from VCO is filtered by injection filter (L310,
L331, C325, C326, C327) to remove second harmonics. The converted 1st IF frequency at mixer
passes through L331 and matches the 45.1 MHz IF signal to pair crystal filter (FL301).
5.2.2Receiver Back End
The 1st IF signal is amplified about 15 dB by IF amp Q303. The output of the IF amp is connected to
IF IC (U201). 1st IF frequency (45.1 MHz) and 2nd LO frequency (44.645 MHz) are mixed in U201.
The second mixer converts the 45.1 MHz high IF frequency to 2nd IF frequency (455 kHz).
Additional IF selectivity is provided by two ceramic filters (CF1, CF2). The wider filter 455 FW is used
for 25 kHz channel spacing, and the narrower filter 455 HW is used for 12.5 kHz channel spacing.
These two ceramic filters may eliminate undesired signal and demodulated by demodulator in U201.
N/S_SW which connected to microprocessor is used to select the wide and narrow band.
The mute (squelch) circuit switches off the audio amplifier when no audio is present. The squelch
circuit consists of U201 and U202 and their associated components. The noise signal from Pin 9 of
U201 is used to control the squelch circuit sensitivity of U202. The noise passes through filter, and is
amplified by internal amp of U201. The amplified noise act as a DC voltage to control the mute
system. So if the noise level is under the threshold voltage, the microprocessor (U101) un-mutes the
radio. If the noise level is over the threshold voltage, the microprocessor mutes the radio.
The squelch level is tuned in the factory. When a component or a part in the RX system is replaced,
the squelch must be re-tuned using the Tuner.
Page 37
435 – 480 MHz UHF2 Theory Of Operation: UHF2 Transmitter5-3
5.3UHF2 Transmitter
The UHF2 transmitter covers the range of 435 – 480 MHz. Depending on model, the output power of
the transmitter is switchable on a per-channel basis between high power (4 Watts) and low
power (1 Watt). The transmitter is divided into four major blocks as shown in Figure 5-2.
• Power Amplifier
• Harmonic Filter
• Antenna Matching Network
• Power Control.
From VCO
Attenuator
Circuit
5.3.1Power Amplifier
The transmitter power amplifier has three stages of amplification – Pre Driver (Q401), Driver
Amp (Q402) and Final Amp (Q403). Signal from TX VCO is applied to the pre driver via an attenuator
circuit. The attenuator is pie style resistor attenuator, and is used as isolation between VCO and the
power amps. The -4dBm TX RF signal from attenuator is then amplified by pre driver and driver amp
to around +25dBm and is applied to the final amp. The final amp (Q403) is an enhancement-mode
N-channel MOSFET device providing a gain of 12dB. The device drain current is drawn directly from
the DC battery supply voltage input via L413. A matching network consisting of C416 to C420 and a
strip line, transforms the impedance to approximately 50 Ohm.
SWB+
Power Control
Pre Driver
Amp
Driver
Amp
BAT+
Current Detect
Strip Line
Final
Amp
To Receiver
Figure 5-2. UHF2 Transmitter Block Diagram
CR401
Antenna
Switch
Antenna
Harmonic
Filter
5.3.2Antenna Switch
An antenna switch works mainly as a switching device between transmit and receive paths. In
transmit mode (PTT), Q407 is turned on and both PIN diodes (CR401, CR301) are forward biased
into conduction. This enables the RF signal to pass to the harmonic filter and then to the antenna. In
the receiver mode, both diodes are off. Signals applied to the antenna jack are routed via the LPF
(harmonic filter), through network L409 to L411, to the receiver input.
5.3.3Harmonic Filter
The harmonic filter consists of components L409, L410, L411, C426, C427, C428, C429, C430, C445
and C446. The harmonic filter is a seven-pole Chebychev filter.
Page 38
5-4435 – 480 MHz UHF2 Theory Of Operation: UHF2 Frequency Generation Circuitry
5.3.4Auto Power Control
The APC keeps the current supply constant to the final amp (Q403). The drain current of Q403 (final
amp) is sensed across resistor R417. The voltage difference across R417 is amplified through U401
by the ratio of R423 to R417. The differential signal at the output of U401 (Pin 7) is passed to Q404
and Q405 that produces a constant power output to the antenna. If the current is changed due to
change of battery voltage or load, APC controls gate voltage of Q403 and collector voltage of Q401
and drain voltage of Q402 to keep TX power stable. This circuit stabilizes TX power at a
pre-determined level adjusted by U402. This bias voltage is tuned in the factory. If the transistor
(Q403) is replaced, the RF Output Power must be tuned. By tuning the RF output power, the bias
voltage will be tuned through U402. Extra care has to be taken during the tuning process. Do not
exceed the maximum allowed bias voltage.
5.4UHF2 Frequency Generation Circuitry
The PLL synthesizer subsystem consists of the reference oscillator (VCTCXO), VCO, PLL IC, Charge
Pump and Loop Filter.
Modulating
Signal
FL701
12.8MHz
Ref.OSC.
Synthesizer
U701
PLL Data
from μP
Charge
Pump
Voltage
Doubler
Figure 5-3. UHF2 Frequency Generation Unit Block Diagram
5.4.1Reference Oscillator (12.8 MHz VCTCXO)
The reference oscillator is powered by regulated 5V provided by U505. The reference frequency
12.8 MHz VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) is applied to
the PLL IC (U701) via Pin 1. Main frequency can be adjusted by chip trimmer of VCTCXO. This
frequency provides reference to the PLL IC and has a frequency stability of +/-2.5PPM (max) at the
temperature ranging from -30 to +60 Degree Celsius.
Loop
Filter
TX VCO
Circuit
TX Out
RX VCO
Circuit
RX Out
To PA Driver
To Mixer
Page 39
435 – 480 MHz UHF2 Theory Of Operation: UHF2 Frequency Generation Circuitry5-5
5.4.2PLL IC Prescaler and Comparator
The reference frequency from VCTCXO is divided to 6.25 kHz or 5 kHz by reference counter, R. The
RF signal input from the VCO is divided to by prescaler (1/64), divided by N and A counters in PLL IC
to determine frequency steps and then supplied to the comparator. The comparison frequency is
6.25/5 kHz. The internal phase comparator compares the phase difference between the reference
and VCO signal. When the phase of the reference frequency is leading, Pin15 (R) is the output.
When VCO frequency is leading, Pin 16 (P) is the output. When P=R, small pulses are the output of
the phase detector.
5.4.3Voltage Doubler and Charge Pump
The voltage doubler (U507) converts 5V to 10V and is applied to the charge pump circuitry. The
charge pump is used for charging output signals P, R supplied by PLL IC from 0-3.3V to 0-10V. This
voltage is used to drive the VCO.
5.4.4Loop Filter
The loop filter contains C751, C752, C753, C754, R726, R727, R728. It reduces the residual sideband noise to get the best signal-to-noise ratio. The output signal from loop filter is applied to VCO.
5.4.5Dual VCO
The dual VCO module contains a RX VCO and a TX VCO. They are configured as colpitts oscillators
and connected to power up through transistor switches. Only one VCO is selected at a time. A
steering line voltage between 0.35V and 9.7V at varactor CR701 tunes the full RX frequency range
from 389.9MHz to 434.9MHz, and varactor CR702 tunes the full TX frequency range from 435MHz
to 480MHz.
In Receiver mode, high signal of RX_EN from Pin 71, U101 activates Q305. When Q305 is activated,
current flows through the base of Q304 and thus activates the Q705. The varactor CR701 sets the
resonance frequency. When there is a change in voltage supplied by loop filter, there is a change in
the resonance frequency. L703 is the resonating coil, which forms the tank circuit together with
variable cap C710.
In Transmit mode, high signal of TX_EN1 from Pin 84, U101 enables current flows through collector
of Q503 and thus activates Q706. The varactor CR702 sets the resonance frequency. When there is
a change in voltage supplied by loop filter, there is a change in the resonance frequency. L706 is the
resonating tuning coil, which forms the tank circuit together with variable cap C722.
Page 40
5-6435 – 480 MHz UHF2 Theory Of Operation: Keypad
5.5Keypad
Left, Right and P1 to P3 keys are directly connected to microprocessor via 22 pin connector. When
any of these keys is pressed, the voltage goes "low" and microprocessor detects it.
For full keypad models, the number keys are in matrix type which consisted of 3 rows and 4 columns.
When any of these keys is pressed, the voltage goes "low" and microprocessor interprets the voltage
for each key press.
KEYPAD
Left
Right
P1 P2P3
NUMBERS
Key
detect
Keyrow
Keypad board
Key
22pin connector
column
Figure 5-4. Keypad Block Diagram
MCP
Main board
22pin connector
Page 41
Chapter 6UHF2 Troubleshooting Tables
6.1Troubleshooting Table for Receiver (UHF2)
Table 6-1. Troubleshooting Table for Receiver (UHF2)
SymptomPossible CausesProcedureCorrective Action
Radio Dead (no
turn–on beep, no
LED indication)
No RX Audio (with
LED indication)
1. Battery dead or
defective
2. Defective battery
contacts
3. Microprocessor not
starting up
4. Regulator faultVerify U506 Pin 4 is 3.3V
5. Flexible Cable faultCheck connection of the 12 pin
1. Speaker dead or
defective
2. Audio Processor IC
not starting up
3. Audio Amp IC not
starting up
Substitute good battery or battery
eliminator
Inspect battery contacts for
corrosion or bent terminals
Verify clock input to U101 Pin 13 is
7.3728 MHz using high impedance
probe.
Verify U101 Pin10(reset) is high.
Verify U505 Pin 4 is 5.0V
flexible cable between J104 & J105
Substitute a good housing (with
speaker)
Verify J603 connection
Verify clock input U102 Pin 14 is
3.5795 MHz using high impedance
probe.
Verify U601 Pin 6 is battery voltage.
Change or replace battery.
Clean/Repair/Replace J602
Troubleshoot/Replace FL101.
If reset is Low, troubleshoot
regulator U506 or U107.
Check for shorts on outputs
Troubleshoot/Repair as
needed, replace faulty regulator
Re–assemble or replace flexible
cable
Change the housing (with
accessory)
Change the housing (with
accessory)
Troubleshoot/Replace FL102
Troubleshoot/Replace U601
If battery voltage is being supplied to
Pin 6, then verify audio output at
Pin 5 & 8.
No Receive (with
no LED indication)
No RX1. RX–B+ Verify Q304’s collector voltage is
1. IF IC dead or faultVerify clock input to U201 Pin 1 & 2
is 44.645Mhz using high impedance
probe.
4.8V when RX–EN is high.
Troubleshoot/Replace FL201
Check/Replace Q304
Page 42
6-2UHF2 Troubleshooting Tables: Troubleshooting Table for Synthesizer (UHF2)
6.2Troubleshooting Table for Synthesizer (UHF2)
Table 6-2. Troubleshooting Table for Synthesizer (UHF2)
UHF2 Troubleshooting Tables: Troubleshooting Table for Board and IC Signals (UHF2)6-5
Table 6-4. Troubleshooting Table for Board and IC Signals (UHF2) (Continued)
IC DesignatorPinPin FunctionDC Voltage (V)Comments (Condition)
(DTMF decoder)2IN-1.6
3GS1.6
4Vref1.6
8OSC11.63.579545 MHz input
10VSS0
11TOE3.3
17STDHighAt DTMF detecting
18EST3.3
19ST/GT3.3
20VDD3.3
FL701(VCTCXO)1VCON1.9
2GND0
3OSC outoscGenerate the 12.8 MHz
4VCC5
Q206(N/S SW)EGND0
BN/S SW12.5 kHz: Low
CCollector12.5 kHz: High
25 kHz: Low
Q304E+5V5At RX Mode
BTo Q305 collectorLow
CRX_B+4.7
Q305EGND0At RX Mode
BRX_ENHigh
CTo Q304 baseLow
Q503EGND0At TX Mode
BTX_EN1High
CTo Q706 baseLow
Q407E+5V5At TX Mode
BTo Q408 collectorLow
CTXVB4.7
Q408EGND0At TX Mode
BTX_EN2High
CTo Q 40 7Low
Page 46
6-6UHF2 Troubleshooting Tables: Troubleshooting Table for Board and IC Signals (UHF2)
Table 6-4. Troubleshooting Table for Board and IC Signals (UHF2) (Continued)
IC DesignatorPinPin FunctionDC Voltage (V)Comments (Condition)
Q601EGND0
BAudio_MUTE_CONMute: Low
None Mute: High
CModeMute: High
None Mute: Low
1. All voltages are measured with a high-impedance digital voltmeter and expressed in volts DC relative to ground (0V).
2. Voltages are measured with a DC input voltage of 7.50 + .02 volts DC applied to the battery connector (J602).
3. All voltages are measured in the squelched receive mode, unless otherwise indicated.
4. Voltages are identical for VHF and UHF models unless otherwise indicated.
Page 47
Chapter 7UHF2 Schematic Diagrams, Overlays, and
Parts Lists
7.1Introduction
This section provides schematic diagrams, overlays, and parts lists for the radio circuit boards and
interface connections.
7.1.1Notes For All Schematics and Circuit Boards
* Component is frequency sensitive. Refer to the Electrical Parts List for value and usage.
1. Unless otherwise stated, resistance values are in Ohms (K = 1000), capacitance values are in
nanofarads (nF), picofarads (pF) or microfarads (µF), and inductance values are in
nanohenries (nH) or microhenries (µH).
2. DC voltages are measured from point indicated to chassis ground using a Motorola DC
multimeter or equivalent. If the board has been removed from the chassis, the transmitter
module mounting screws may be used for ground connection. (Note: The antenna nut bracket is connected to ground.) Operating mode dependent voltages are followed by (RX)
for receive mode, (TX) for transmit mode, (UNSQ) for unsquelched mode, etc.
3. RF voltages on VHF models are measured with a Fluke model 85 RF probe. The indicated
voltages expressed in mV (RF) are DC level readings which correspond approximately 1:1 to
the RF voltage level in mV rms. RF voltages in the Receiver Front End and Receiver Back
End circuits are measured with an on-channel 1mV (-47dBm) RF signal applied to the
antenna jack ANT1/ANT.
4. RF voltages on UHF models are measured both with a high–impedance RF voltmeter having
a bandwidth in excess of 500 MHz (levels are expressed in dBm) and with a Fluke model 85
RF probe [levels are expressed in mV (RF)]. These indicated voltages are DC level readings
which correspond approximately 1:1 to the RF voltage level in mV rms, and are only
approximate for UHF frequency measurements. RF voltages in the Receiver Front End and
Receiver Back End circuits are measured with an on-channel 1mV (-47dBm) RF signal
applied to the antenna jack ANT1/ANT.
5. Audio voltages are measured with a high-impedance AC rms voltmeter. The indicated
voltages are expressed in mV rms. Receive mode voltages are followed by (RX) and are
measured with an on-channel signal with 1 kHz modulation at 60% deviation (3 kHz for 25
kHz channels, or 1.5 kHz for 12.5 kHz channels). Transmit mode voltages are followed by
(TX) and are measured with a 1 kHz, 10 mV rms signal present at the external microphone
input (accessory connector J601).
Page 48
7-2UHF2 Schematic Diagrams, Overlays, and Parts Lists: Introduction
6. Reference Designators are assigned in the following manner:
Ref. No. SeriesCircuit Block
101 – 199
Microprocessor & audio control
circuits
1001 – 1099Microprocessor & audio control
circuits
201 – 299IF IC circuit
301 – 399Front-end and 1st Mixer
401– 499Transmit RF stage & Auto power
control
501 – 599Base band & generating circuit
601– 699Audio amplifier
701– 799VCO & PLL Synthesizer
7. Circuit Block Interconnection Legend:
NameDescription
+5V5 Volts (Regulated)
+3.3V3.3 Volts (Regulated)
SWB+Switched Battery Voltage
BAT+Unswitched Battery voltage
+10VDigital 10V(Regulated)
RESETLow-line reset signal fromU107 to U101 Pin 10
TX_EN1Transmit enable signal from U101 Pin 84
TX_EN2Transmit enable signal from U101 Pin 85
TXVBTX operating voltage
TX_AF3TX audio signal from audio processor IC to TX Audio
filter
TX_SUB_TONETX sub tone signal from audio processor IC to TX
modulation.
RX_B+RX operating voltage
RSSIRX signal strength indication from IF IC to U101
BusyRX detect signal from IF IC to U101
FTVRX frequency shift voltage
RX_AF1RX audio signal from IF IC to Audio processor IC
PLL_LDPLL lock detect signal from PLL IC to U101
N/S SWChannel space selectable Switch (12.5 kHz/25 kHz)
1/2VCC1.9 volts (divided by U502-D)
Page 49
UHF2 Schematic Diagrams, Overlays, and Parts Lists: Speaker and Microphone Schematic7-3
7.1.2Four Layer Circuit Board
Plating (Au)
PSR ink
Copper Plate
Copper
PrePreg.
Copper
CCL (core)
Copper
PrePreg.
Copper
Copper Plate
PSR ink
Figure 7-1. Four–Layer Circuit Board: Copper Steps in Layer Sequence
7.2Speaker and Microphone Schematic
MIC1
1
2
SPK1
Figure 7-2. Speaker and Microphone Schematic
7.2.1Speaker and Microphone Parts List
Reference
Designator
MIC1PMDN4139_RMicrophone
SPK1
Motorola Part No.Description
PMDN4067BR
MATES WITH J103 ON
RADIO BOARD
1
MATES WITH J603 ONRADIO BOARD
2
Speaker & Cable
Page 50
7-4Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
7.3Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
7-16Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
7.3.1Parts List
Circuit
Ref.
C100TDK–Chip Cap, 1608 Z 1μF
C101TDK–Chip Cap, 1005 K 1μF
C102TDK–Chip Cap, 1005 K 2200PF
C103TDK–Chip Cap, 1005 J 33PF
C104TDK–Chip Cap, 1005 J 150PF
C105TDK–Chip Cap, 1005 K 153PF
C106TDK–Chip Cap, 1005 K 473PF
C107TDK–Chip Cap, 1005 K 0.1μF
C109TDK–Chip Cap, 1005 K 223PF
C110TDK–Chip Cap, 1005 K 223PF
C111TDK–Chip Cap, 1005 K 1μF
C112HITACH–Chip Tantal, 10uF–M/
C113TDK–Chip Cap, 1005 K 560PF
C114TDK–Chip Cap, 1005 J 220PF
C115TDK–Chip Cap, 1005 J 27PF
C116TDK–Chip Cap, 1005 J 27PF
C117TDK–Chip Cap, 1005 K 122PF
C118HITACH–Chip Tantal, 10uF–M/
C119TDK–Chip Cap, 1005 K 10nF
C120TDK–Chip Cap, 1005 J 15PF
C121TDK–Chip Cap, 1005 K 333PF
C123TDK–Chip Cap, 1005 Z 0.1μF
C124TDK–Chip Cap, 1005 K 1000PF
C125TDK–Chip Cap, 1005 K 473PF
C126TDK–Chip Cap, 1005 K 333PF
C127TDK–Chip Cap, 1005 K 473PF
C128TDK–Chip Cap, 1005 K 473PF
C129TDK–Chip Cap, 1005 K 473PF
SupplierSupplier Part No.Description
16V(A)
16V(A)
Circuit
Ref.
C130TDK–Chip Cap,1005 K 333PF
C134TDK–Chip Cap, 1005 K 0.22μF
C135TDK–Chip Cap, 1005 J 47PF
C136TDK–Chip Cap, 1005 Z 0.1μF
C137TDK–Chip Cap, 1005 K 0.1μF
C138TDK–Chip Cap, 1608 K 0.22μF
C139KAMAYA–Chip Res, 1005 J 10KΩ
C140TDK–Chip Cap, 1005 K 473PF
C142TDK–Chip Cap, 1005 K 470PF
C143TDK–Chip Cap, 1005 Z 0.1μF
C144TDK–Chip Cap, 1005 K 0.1μF
C145TDK–Chip Cap, 1005 J 15PF
C146TDK–Chip Cap, 1005 J 15PF
C147TDK–Chip Cap, 1005 K 0.1μF
C153TDK–Chip Cap, 1005 K 1μF
C154TDK–Chip Cap, 1005 K 1μF
C156TDK–Chip Cap, 1005 K 0.22μF
C157TDK–Chip Cap, 1005 K 0.22μF
C158TDK–Chip Cap, 1005 K 0.22μF
C161TDK–Chip Cap, 1005 J 220PF
C162TDK–Chip Cap, 1005 J 220PF
C163TDK–Chip Cap, 1005 J 220PF
C164TDK–Chip Cap, 1005 J 220PF
C165TDK–Chip Cap, 1005 J 220PF
C166TDK–Chip Cap, 1005 J 220PF
C167TDK–Chip Cap, 1005 J 220PF
C168TDK–Chip Cap, 1005 J 220PF
C169TDK–Chip Cap, 1005 J 220PF
C170TDK–Chip Cap, 1005 J 220PF
C171TDK–Chip Cap, 1005 J 220PF
SupplierSupplier Part No.Description
Circuit
Ref.
C172TDK–Chip Cap, 1005 J 220PF
C173TDK–Chip Cap, 1005 J 220PF
C174TDK– Chip Cap, 1005 J 220PF
C175TDK– Chip Cap, 1005 Z 0.1μF
C176TDK– Chip Cap, 1005 J 220PF
C177TDK–Chip Cap, 1005 J 220PF
C178TDK–Chip Cap, 1005 J 220PF
C179TDK–Chip Cap, 1005 J 220PF
C187TDK– Chip Cap, 1005 Z 0.1μF
C188TDK–Chip Cap, 1005 J 220PF
C189TDK–Chip Cap, 1005 J 220PF
C191TDK–Chip Cap, 1005 J 220PF
C194HITACH–Chip Tantal, 10uF–M/
C195TDK–Chip Cap, 1005 J 220PF
C201TDK–Chip Cap, 1005 J 47PF
C203TDK–Chip Cap, 1005 J 120PF
C204TDK–Chip Cap, 1005 Z 0.1μF
C206TDK–Chip Cap, 1005 K 0.1μF
C207TDK–Chip Cap, 1005 K 0.1μF
C208TDK–Chip Cap, 1005 Z 0.1μF
C209TDK–Chip Cap, 1005 J 330PF
C210TDK–Chip Cap, 1005 J 330PF
C211TDK–Chip Cap, 1005 K 0.1μF
C213TDK–Chip Cap, 1005 K 0.1μF
C214TDK–Chip Cap, 1005 Z 0.1μF
C301TDK–Chip Cap, 1005 C 5PF
C303TDK–Chip Cap, 1005 C 3PF
C304KAMAYA–Chip Res, 1005 J 0Ω
C307TDK–Chip Cap, 1005 J 18PF
C309TDK–Chip Cap, 1005 C 3PF
SupplierSupplier Part No.Description
16V(A)
Page 63
Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)7-17
Circuit
Ref.
SupplierSupplier Part No.Description
C310TDK–Chip Cap, 1005 Z 0.1μF
C312TDK–Chip Cap, 1005 J 15PF
C318TDK–Chip Cap, 1005 J 15PF
C319TDK–Chip Cap, 1005 K 10nF
C320HITACH–Chip Tantal, 10uF–M/
16V(A)
C325TDK–Chip Cap, 1005 J 33PF
C326TDK–Chip Cap, 1005 C 3PF
C327TDK–Chip Cap, 1005 J 12PF
C328TDK–Chip Cap, 1005 C 2PF
C329TDK–Chip Cap, 1005 K 10nF
C330TDK–Chip Cap, 1005 J 39PF
C331TDK–Chip Cap, 1005 D 9PF
C332TDK–Chip Cap, 1005 D 10PF
C334TDK–Chip Cap, 1005 K 1000PF
C337TDK–Chip Cap, 1005 K 10nF
C338TDK–Chip Cap, 1005 K 473PF
C339TDK–Chip Cap, 1005 K 0.1μF
C340TDK–Chip Cap, 1005 K 0.1μF
Circuit
Ref.
SupplierSupplier Part No.Description
C362TDK–Chip Cap, 1005 D 10PF
C364TDK–Chip Cap, 1005 J 33PF
C365TDK–Chip Cap, 1005 J 27PF
C367TDK–Chip Cap, 1005 J 220PF
C368TDK–Chip Cap, 1005 K 10nF
C372TDK–Chip Cap, 1005 J 33PF
C373TDK–Chip Cap, 1005 J 20PF
C374TDK–Chip Cap, 1005 D 10PF
C376TDK–Chip Cap, 1005 Z 0.1μF
C378HITACH–Chip Tantal, 10uF–M/
16V(A)
C379TDK–Chip Cap, 1005 J 20PF
C380TDK–Chip Cap, 1005 J 47PF
C382TDK–Chip Cap, 1005 Z 0.1μF
C401TDK–Chip Cap, 1005 C 3PF
C402TDK–Chip Cap, 1005 K 10nF
C403TDK–Chip Cap, 1005 K 470PF
C404TDK–Chip Cap, 1005 J 56PF
C405TDK–Chip Cap, 1005 J 56PF
Circuit
Ref.
SupplierSupplier Part No.Description
C429TDK–Chip Cap, 1608 C 5PF
C431TDK–Chip Cap, 1608 K 1000PF
C432TDK–Chip Cap, 1005 K 1000PF
C434TDK–Chip Cap, 1005 K 470PF
C435TDK–Chip Cap, 1005 K 473PF
C436TDK–Chip Cap, 1005 Z 0.1μF
C437TDK–Chip Cap, 1005 Z 0.1μF
C439TDK–Chip Cap, 1005 K 1000PF
C440TDK–Chip Cap, 1005 K 470PF
C445TDK–Chip Cap, 1608 C 3PF
C446TDK–Chip Cap, 1608 C 4PF
C447TDK–Chip Cap, 1005 C 3PF
C448TDK–Chip Cap, 1005 K 10nF
C449TDK–Chip Cap, 1005 C 3PF
C451TDK–Chip Cap, 1608 C 3PF
C452TDK–Chip Cap, 1608 J 33PF
C453TDK–Chip Cap, 1005 K 470PF
C454HITACH–Chip Tantal, 22uF–M/
16V(B)
C341TDK–Chip Cap, 1005 J 56PF
C342TDK–Chip Cap, 1005 K 0.1μF
C343TDK–Chip Cap, 1005 Z 0.1μF
C344TDK–Chip Cap, 1005 K 470PF
C347TDK–Chip Cap, 1005 Z 0.1μF
C351TDK–Chip Cap, 1005 D 10PF
C354TDK–Chip Cap, 1005 D 10PF
C355TDK–Chip Cap, 1005 J 15PF
C357TDK–Chip Cap, 1005 J 56PF
C358TDK–Chip Cap, 1005 J 15PF
C360TDK–Chip Cap, 1005 C 4PF
C361TDK–Chip Cap, 1005 J 22PF
C406TDK–Chip Cap, 1005 Z 0.1μF
C408TDK–Chip Cap, 1005 K 10nF
C410TDK–Chip Cap, 1608 J 27PF
C413TDK–Chip Cap, 1608 J 27PF
C416TDK–Chip Cap, 1608 D 7PF
C417TDK–Chip Cap, 1608 J 12PF
C418TDK–Chip Cap, 1608 J 15PF
C420TDK–Chip Cap, 1608 D 10PF
C422TDK–Chip Cap, 1608 J 12PF
C426TDK–Chip Cap, 1608 C 6PF
C427TDK–Chip Cap, 1608 C 4PF
C428TDK–Chip Cap, 1608 C 6PF
C460TDK–Chip Cap, 1005 J 47PF
C461TDK–Chip Cap, 1005 J 220PF
C462TDK–Chip Cap, 1005 J 33PF
C463TDK–Chip Cap, 1005 K 470PF
C464TDK–Chip Cap, 1005 J 47PF
C465TDK–Chip Cap, 1005 K 470PF
C466TDK–Chip Cap, 1005 K 470PF
C467TDK–Chip Cap, 1005 K 470PF
C468TDK–Chip Cap, 1005 C 0.5PF
C469TDK–Chip Cap, 1005 Z 0.1μF
C470TDK–Chip Cap, 1005 J 47PF
C471TDK–Chip Cap, 1005 Z 0.1μF
Page 64
7-18Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
Circuit
Ref.
SupplierSupplier Part No.Description
C472TDK–Chip Cap, 1005 K 470PF
C473TDK–Chip Cap, 1005 J 47PF
C501TDK–Chip Cap, 1005 K 470PF
C502HITACH–Chip Tantal, 22uF–M/
16V(B)
C503TDK–Chip Cap, 1005 Z 0.1μF
C506TDK–Chip Cap, 1005 K 470PF
C507HITACH–Chip Tantal, 22uF–M/
16V(B)
C508HITACH–Chip Tantal, 10uF–M/
16V(A)
C509TDK–Chip Cap, 1005 K 470PF
C510TDK–Chip Cap, 2012 Z 475PF
C511HITACH–Chip Tantal, 22uF–M/
16V(B)
C512TDK–Chip Cap, 1005 K 470PF
C515TDK–Chip Cap, 1005 Z 0.1μF
C516HITACH–Chip Tantal, 10uF–M/
16V(A)
C517TDK–Chip Cap, 1005 K 153PF
C518TDK–Chip Cap, 1005 K 562PF
C519TDK–Chip Cap, 1005 K 122PF
C520TDK–Chip Cap, 1005 K 682PF
C521TDK–Chip Cap, 1005 K 122PF
C522TDK–Chip Cap, 1005 K 153PF
C523TDK–Chip Cap, 1005 K 470PF
C524TDK–Chip Cap, 1005 K 473PF
C525TDK–Chip Cap, 1005 K 2200PF
C527TDK–Chip Cap, 1005 K 183PF
C528TDK–Chip Cap, 1005 K 183PF
C529TDK–Chip Cap, 1005 Z 0.1μF
C530TDK–Chip Cap, 1005 K 10nF
Circuit
Ref.
SupplierSupplier Part No.Description
C531TDK–Chip Cap, 1005 Z 0.1μF
C533TDK–Chip Cap, 1005 Z 0.1μF
C536TDK–Chip Cap, 1005 K 153PF
C537TDK–Chip Cap, 1005 K 2200PF
C538TDK–Chip Cap, 1005 K 10nF
C539HITACH–Chip Tantal, 10uF–M/
16V(A)
C540TDK–Chip Cap, 1608 J 220PF
C541TDK–Chip Cap, 1005 Z 0.1μF
C542TDK–Chip Cap, 1005 K 10nF
C543TDK–Chip Cap, 1005 K 2200PF
C545HITACH–Chip Tantal, 22uF–M/
10V(A)
C546TDK–Chip Cap, 1005 K 0.1μF
C547TDK–Chip Cap, 1005 K 2200PF
C549TDK–Chip Cap, 1005 K 560PF
C550TDK–Chip Cap, 1005 K 560PF
C551HITACH–Chip Tantal, 10uF–M/
10V(A)
C560TDK–Chip Cap, 1005 J 47PF
C561TDK–Chip Cap, 1005 J 47PF
C562TDK–Chip Cap, 1005 J 47PF
C563TDK–Chip Cap, 1005 J 47PF
C564TDK–Chip Cap, 1005 J 47PF
C565TDK–Chip Cap, 1005 J 47PF
C566TDK–Chip Cap, 1005 J 47PF
C570TDK–Chip Cap, 1005 J 47PF
C571TDK–Chip Cap, 1005 K 153PF
C572TDK–Chip Cap, 1005 Z 0.1μF
C573TDK–Chip Cap, 1005 J 47PF
C574TDK–Chip Cap, 1005 J 47PF
Circuit
Ref.
SupplierSupplier Part No.Description
C575TDK–Chip Cap, 1005 J 47PF
C576TDK–Chip Cap, 1608 J 47PF
C577TDK–Chip Cap, 1005 J 47PF
C578TDK–Chip Cap, 1005 J 47PF
C579TDK–Chip Cap, 1005 J 47PF
C580TDK–Chip Cap, 1005 J 47PF
C581TDK–Chip Cap, 1005 J 47PF
C582TDK–Chip Cap, 1005 J 47PF
C583TDK–Chip Cap, 1005 J 47PF
C601TDK–Chip Cap, 1005 Z 0.1μF
C602TDK–Chip Cap, 1005 K 0.22μF
C605TDK–Chip Cap, 2012 Z 475PF
C606TDK–Chip Cap, 1005 Z 0.1μF
C609TDK–Chip Cap, 1005 K 0.1μF
C615TDK–Chip Cap, 1608 K 0.22μF
C616TDK–Chip Cap, 1005 K 0.1μF
C617TDK–Chip Cap, 1005 K 0.1μF
C618HITACH–Chip Tantal, 4.7uF–M/
16V(A)
C619TDK–Chip Cap, 1005 J 33PF
C620TDK–Chip Cap, 1005 J 330PF
C621TDK–Chip Cap, 1005 J 330PF
C622TDK–Chip Cap, 1005 J 47PF
C623TDK–Chip Cap, 1005 J 47PF
C624TDK–Chip Cap, 1005 J 47PF
C625TDK–Chip Cap, 1608 J 47PF
C701HITACH–Chip Tantal, 22uF–M/
10V(A)
C702TDK–Chip Cap, 1005 K 1000PF
C704TDK–Chip Cap, 1005 K 1000PF
C705TDK–Chip Cap, 1005 C 2PF
Page 65
Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)7-19
Circuit
Ref.
SupplierSupplier Part No.Description
C706TDK–Chip Cap, 1005 C 3PF
C707TDK–Chip Cap, 1005 D 9PF
C709TDK–Chip Cap, 1005 C 4PF
C710MURATA–Chip Trimmer Cap, 2PIE
6PF
C711MURATA–Chip Cap, 1005 J 13PF
10V
C712TDK–Chip Cap, 1005 K 470PF
C714TDK–Chip Cap, 1005 K 1000PF
C715HITACH–Chip Tantal, 22uF–M/
10V(A)
C716TDK–Chip Cap, 1005 K 470PF
C717TDK–Chip Cap, 1005 C 3PF
C718TDK–Chip Cap, 1005 C 4PF
C719TDK–Chip Cap, 1005 D 7PF
C721TDK–Chip Cap, 1005 C 3PF
C722MURATA–Chip Trimmer Cap, 2PIE
6PF
C723TDK–Chip Cap, 1005 C 0.5PF
C724MURATA–Chip Cap, 1005 J 11PF
10V
C725TDK–Chip Cap, 1005 K 470PF
C726TDK–Chip Cap, 1005 C 0.5PF
C727TDK–Chip Cap, 1005 C 2PF
C728TDK–Chip Cap, 1005 C 4PF
C729TDK–Chip Cap, 1005 D 6PF
C730TDK–Chip Cap, 1005 C 2PF
C731TDK–Chip Cap, 1005 C 2PF
C738TDK–Chip Cap, 1005 D 7PF
C739TDK–Chip Cap, 1005 K 1000PF
C740TDK–Chip Cap, 1005 Z 0.1μF
C741TDK–Chip Cap, 1005 Z 0.1μF
Circuit
Ref.
SupplierSupplier Part No.Description
C746TDK–Chip Cap, 1005 D 10PF
C747TDK–Chip Cap, 1005 D 10PF
C748TDK–Chip Cap, 1005 Z 0.1μF
C749TDK–Chip Cap, 1608 Z 1μF
C750TDK–Chip Cap, 1005 Z 0.1μF
C751HITACH–Chip Tantal, 1uF–M/
35V(A)
C752TDK–Chip Cap, 1005 K 0.1μF
C753PANASINIC–Film Chip Cap, 3216 J
473PF
C754PANASINIC–Film Chip Cap, 3216 J
473PF
C755TDK–Chip Cap, 1005 K 0.1μF
C756TDK–Chip Cap, 1005 K 1000PF
C1001TDK– Chip Cap, 1005 J 47PF
C1002TDK– Chip Cap, 1005 J 47PF
C1003TDK– Chip Cap, 1005 J 47PF
C1004TDK– Chip Cap, 1005 J 47PF
C1005TDK– Chip Cap, 1005 J 47PF
C1006TDK– Chip Cap, 1005 J 47PF
C1007TDK– Chip Cap, 1005 J 47PF
C1008TDK– Chip Cap, 1005 J 47PF
C1009TDK– Chip Cap, 1005 J 47PF
C1010TDK– Chip Cap, 1005 J 47PF
C1011TDK– Chip Cap, 1005 J 47PF
C1012TDK– Chip Cap, 1005 J 47PF
C1013TDK– Chip Cap, 1005 J 47PF
C1014TDK– Chip Cap, 1005 J 47PF
C1015TDK– Chip Cap, 1005 J 47PF
C1016TDK–Chip Cap, 1005 Z 0.1μF
C1017TDK–Chip Cap, 1005 K 470PF
Circuit
Ref.
SupplierSupplier Part No.Description
C1018TDK– Chip Cap, 1005 J 220PF
C1019TDK–Chip Cap, 1005 J 47PF
C1020TDK–Chip Cap, 1005 J 47PF
C1021TDK–Chip Cap, 1005 J 47PF
C1022TDK–Chip Cap, 1005 J 47PF
C1023TDK–Chip Cap, 1005 J 47PF
C1024TDK–Chip Cap, 1005 J 47PF
C1025TDK–Chip Cap, 1005 J 47PF
C1026TDK–Chip Cap, 1005 J 47PF
C1027TDK–Chip Cap, 1005 J 47PF
C1028TDK–Chip Cap, 1005 J 47PF
C1029TDK–Chip Cap, 1005 J 47PF
C1030TDK–Chip Cap, 1005 J 47PF
C1031TDK–Chip Cap, 1005 J 47PF
C1032TDK–Chip Cap, 1005 J 47PF
C1033TDK–Chip Cap, 1005 J 47PF
C1034TDK–Chip Cap, 1005 J 47PF
C1035TDK–Chip Cap, 1005 J 47PF
C1036TDK–Chip Cap, 1005 J 47PF
C1037TDK–Chip Cap, 1005 J 47PF
C1038TDK–Chip Cap, 1005 J 47PF
C1039TDK–Chip Cap, 1005 J 47PF
CF1BGTech8286045500120TOKO, Ceramic Filter,
ELFY455F
CF2BGTech8286045500220TOKO, Ceramic Filter,
ELFY455H
CR110BRIGHT LED–LED DIODE, BL-HG036D-
TR
CR111BRIGHT LED–LED DIODE, BL-HG036D-
TR
CR112
2
BRIGHT LED–LED DIODE, BL-HG036D-
TR
Page 66
7-20Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
Circuit
Ref.
CR113
2
SupplierSupplier Part No.Description
BRIGHT LED–LED DIODE, BL-HG036D-
TR
CR114
2
BRIGHT LED–LED DIODE, BL-HG036D-
TR
CR115
2
BRIGHT LED–LED DIODE, BL-HG036D-
TR
CR116KEC–SWITCH DIODE, KDS–
160E (ESM)
CR117KEC–SWITCH DIODE, KDS–
160E (ESM)
CR201KEC–SWITCH DIODE, KDS
181
CR202KEC–SWITCH DIODE, KDS
181
CR301KEC–SWITCH DIODE, KDS–
114
CR304KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR305KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR306KEC–SWITCH DIODE, KDS–
160E (ESM)
CR307KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR309KEC–SWITCH DIODE, KDS–
114E (ESM)
CR310KEC–SWITCH DIODE, KDS–
114E (ESM)
CR312KEC–SWITCH DIODE, KDS–
160E (ESM)
CR313KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR314KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR315KEC–SWITCH DIODE, KDS–
160E (ESM)
CR401M/A COM–PIN DIODE, MA4P7001F–
1072T
Circuit
Ref.
SupplierSupplier Part No.Description
CR501BRIGHT LED–LED DIODE, BL-
HEIG033B-TR
CR701KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR702KEC–VARIABLE DIODE, KDV–
154E (ESM)
CR703KEC–VARIABLE DIODE, KDV–
154E (ESM)
DEC1BGTech8287455C24010CQ, Descriminator,
JTBC455C24 (LCP)
FL101BGTech82827R3728M00SHINSUNG, Crystal,
7.3728MHz (H: 2.8mm)
FL102BGTech82823R5795M00SHINSUNG, Crystal,
3.5795MHz (H: 2.8mm)
FL201BGTech828244R645M00SHINSUNG, Crystal,
44.645MHz (SMD)
FL301BGTech828645R100220SHINSUNG, Crystal Filter,
MCF 45.15S12.B (8.5
kHz)
FL701BGTech8289012R80010SHINSUNG, VCTCXO,
12.8 MHZ
F–
CABLE
1
F–
CABLE
2
BGTech8560228005000SNAGGWA, BEACON
FLAT CABLE, FF12–
22N080XXA
BGTech8560124005000SNAGGWA, , BEACON
FLAT CABLE, FF12–
12N040XXA
J101BGTech851607C01S110YUNHO, FPC
CONNECTOR, 05004HR07C01S(G)
J102BGTech851622A01S110YUNHO, FPC
CONNECTOR, 05004HR–
22A01S
J103BGTech8516220005020KYOCERA, FPC
CONNECTOR, 04-6292022-000-800+
J104BGTech851612151A110OMIRON, FPC
CONNECTOR, XF2M1215-1A
Circuit
Ref.
SupplierSupplier Part No.Description
J105BGTech851612A01S110YUNHO, FPC
CONNECTOR, 05004HR–
12B01S(G)
J601BGTech8500031009800CHI CHENG, SPK MIC
JACK, 0980683Z01–D
J602BGTech85100G500PL00SUYIN, BATTERY
CONNECTOR,
060031MA005G500PL
J603BGTech8510530470210MOLEX, CONNECTOR,
53047–0210
L301DEARIM–Coil Air, 0.45–1.4–5TL
L304TAIYOYUDEN–Chip Ind, 1005 J 39N
L306DELTA–Chip Ind, 2012 820NH
(Tolerance: 5%)
L310DELTA–Chip Ind, 2012 18NH
L320DELTA–Chip Ind, 2012 22nH
L322DELTA–Chip Ind, 2012 18NH
L323DELTA–Chip Ind, 2012 18NH
L324DELTA–Chip Ind, 2012 22nH
L325TAIYOYUDEN–Chip Ind, 1608 220nH J
L327TAIYOYUDEN–Chip Ind, 1608 K 820NH
L328DELTA–Chip Ind, 2012 18NH
L329BGTech8920PT1667020TOKO, #617PT–1667
L330TAIYOYUDEN–Chip Ind, 1005 J 33nH
L331KAMAYA–Chip Res, 1005 J 0Ω
L332TAIYOYUDEN–Chip Ind, 1608 K 820NH
L333BGTech8920PT1664020TOKO, #617PT–1664
L334TAIYOYUDEN–Chip Ind, 1005 J 8.2nH
L340TAIYOYUDEN–Chip Ind, 1608 K 820NH
L401TAIYOYUDEN–Chip Ind, 1608 J 27nH
L402TAIYOYUDEN–Chip Ind, 1608 J 22nH
L403TAIYOYUDEN–Chip Ind, 1608 33NJ
L405TAIYOYUDEN–Chip Ind, 1608 J 6.8nH
Page 67
Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)7-21
Circuit
Ref.
SupplierSupplier Part No.Description
L406TAIYOYUDEN–Chip Ind, 1608 220nH J
L407TAIYOYUDEN–Chip Ind, 1005 J 33nH
L409DEARIM–Coil Air, 0.45–1.4–3TL
L410DEARIM–Coil Air, 0.45–1.4–3TL
L411DEARIM–Coil Air, 0.45–1.4–3TL
L412TAIYOYUDEN–Chip Ind, 1608 220nH J
L413DEARIM–Coil Air, 0.35–1.6–7TL
L601TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
L602TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
L603TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
L604TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
L701TAIYOYUDEN–Chip Ind, 1005 J 27N
L702TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
L703DAERIM–Coil Air, 0.3–1.1–3TL
L704TAIYOYUDEN–Chip Ind, 1608 220nH J
L705TAIYOYUDEN–Chip Ind, 1608 K 2.2uH
Circuit
Ref.
SupplierSupplier Part No.Description
Q102KEC–KRC 413 BJT NPN
Transistor
Q103KEC–KRC 413 BJT NPN
Transistor
Q104KEC–KRC 413 BJT NPN
Transistor
Q110NEC–2SC4226 BJT NPN
Transistor
Q111KEC–KTA 2014 BJT PNP
Transistor
Q112KEC–KTA 2014 BJT PNP
Transistor
Q113KEC–KRC 404 BJT NPN
Transistor
Q114KEC–KRC 404 BJT NPN
Transistor
Q120KEC–KRC 404 BJT NPN
Transistor
Q121KEC–KRC 404 BJT NPN
Transistor
Circuit
Ref.
SupplierSupplier Part No.Description
Q307BGTech81492SK7110202SK711 TOSHIBA FET N–
Channel Transistor
Q401BGTech8142000951120PBR 951LT1 PHILIPS BJT
NPN Transistor
Q402BGTech81490030780212SK3078 TOSHIBA FET
N–Channel Transistor
Q403BGTech81490034760212SK3476 TOSHIBA FET
N–Channel Transistor
Q404BGTech8145001188021STB 1188 AUK BJT NPN
Transistor
Q405KEC–KTC 4075 BJT NPN
Transistor
Q406KEC–KRC 404 BJT NPN
Transistor
Q407KEC–KRA 305 BJT PNP
Transistor
Q408KEC–KRC 404 BJT NPN
Transistor
Q409NEC–2SC4226 BJT NPN
Transistor
L706DAERIM–Coil Air, 0.3–1.0–3TL
L707TAIYOYUDEN–Chip Ind, 1608 220nH J
L708TAIYOYUDEN–Chip Ind, 1005 J 27N
L709TAIYOYUDEN–Chip Ind, 1005 J 22N
LCD101BGTech86343208A2020EVERRVIEW,VBS3208A2
–7FWLYA,REV4.0
MIC1BGTech8420063215000BSE, C-MIC, 6.0*2.7/
2.2KΩ,2V,-44±3dB, Pin
type
PB501BGTech8466PUD02K020PANASONIC, Tack
Switch, EVQPUD02K
PB502BGTech8466PUD02K020PANASONIC, Tack
Switch, EVQPUD02K
PB503BGTech8466PUD02K020PANASONIC, Tack
Switch, EVQPUD02K
Q101KEC–KRC 413 BJT NPN
Transistor
Q122KEC–KRC 404 BJT NPN
Transistor
Q201KEC–KRC 404 BJT NPN
Transistor
Q206KEC–KRC 404 BJT NPN
Transistor
Q207KEC–KRC 404 BJT NPN
Transistor
Q301KEC–2SC4226 BJT NPN
Transistor
Q303NEC–2SC4226 BJT NPN
Transistor
Q304KEC–KRA 305 BJT PNP
Transistor
Q305KEC–KRC 404 BJT NPN
Transistor
Q306BGTech81492SK7110202SK711 TOSHIBA FET N–
Channel Transistor
Q501KEC–KRC 404 BJT NPN
Transistor
Q502KEC–KRC 404 BJT NPN
Transistor
Q503KEC–KRC 404 BJT NPN
Transistor
Q504KEC–KRC 404 BJT NPN
Transistor
Q505KEC–KRA 305 BJT PNP
Transistor
Q601KEC–KRC 404 BJT NPN
Transistor
Q602KEC–KRC 404 BJT NPN
Transistor
Q701NEC–2SC4226 BJT NPN
Transistor
Q702NEC–2SC4226 BJT NPN
Transistor
Page 68
7-22Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
Circuit
Ref.
SupplierSupplier Part No.Description
Q703NEC–2SC4226 BJT NPN
Transistor
Q704NEC–2SC4226 BJT NPN
Transistor
Q705KEC–KRA 305 BJT PNP
Transistor
Q706KEC–KRA 305 BJT PNP
Transistor
Q707KEC–KTC 4075 BJT NPN
Transistor
Q708KEC–KTA 2014 BJT PNP
Transistor
Q709KEC–KTA 2014 BJT PNP
Transistor
Q710KEC–KTC 4075 BJT NPN
Transistor
Q711KEC–KRA 304 BJT PNP
Transistor
R101KAMAYA–Chip Res, 1005 J 10KΩ
R102KAMAYA–Chip Res, 1005 J 47KΩ
R103KAMAYA–Chip Res, 1005 J 150KΩ
R104KAMAYA–Chip Res, 1005 J 47KΩ
R105KAMAYA–Chip Res, 1005 J 47KΩ
R106KAMAYA–Chip Res, 1005 J 47KΩ
R107KAMAYA–Chip Res, 1005 J 3.9KΩ
2
R108
R109
KAMAYA– Chip Res, 1005 J 4.7KΩ
2
KAMAYA– Chip Res, 1005 J 4.7KΩ
R110KAMAYA–Chip Res, 1005 J 270KΩ
2
R112
KAMAYA– Chip Res, 1005 J 4.7KΩ
R113KAMAYA–Chip Res, 1005 J 47KΩ
R114KAMAYA–Chip Res, 1005 J 10KΩ
R115KAMAYA–Chip Res, 1005 J 10KΩ
R116KAMAYA–Chip Res, 1005 J 1.2KΩ
R117KAMAYA–Chip Res, 1005 J 8.2KΩ
Circuit
Ref.
SupplierSupplier Part No.Description
R118KAMAYA–Chip Res, 1005 J 47KΩ
2
R119
KAMAYA– Chip Res, 1005 J 4.7KΩ
R120KAMAYA–Chip Res, 1005 J 47KΩ
R121KAMAYA–Chip Res, 1005 J 330KΩ
R122KAMAYA–Chip Res, 1005 J 330KΩ
R126KAMAYA–Chip Res, 1005 J 15KΩ
R127KAMAYA–Chip Res, 1005 J 33KΩ
R128KAMAYA–Chip Res, 1005 J 3.9KΩ
R129KAMAYA–Chip Res, 1005 J 150KΩ
R131KAMAYA–Chip Res, 1005 J 10Ω
R132KAMAYA–Chip Res, 1005 J 1KΩ
R133KAMAYA–Chip Res, 1005 J 680KΩ
R134KAMAYA–Chip Res, 1005 J 3.9MΩ
R135TDK–Chip Cap,1005 K 0.1μF
R136KAMAYA–Chip Res, 1005 J 100KΩ
R137KAMAYA–Chip Res, 1005 J 4.7MΩ
R138KAMAYA–Chip Res, 1005 J 220KΩ
R139KAMAYA–Chip Res, 1005 J 10KΩ
R140KAMAYA–Chip Res, 1005 J 68KΩ
R141KAMAYA–Chip Res, 1005 J 100KΩ
R142KAMAYA–Chip Res, 1005 J 330KΩ
R143KAMAYA–Chip Res, 1005 J 100KΩ
R144KAMAYA–Chip Res, 1005 J 100KΩ
R145KAMAYA–Chip Res, 1005 J 1MΩ
R146KAMAYA–Chip Res, 1005 J 0Ω
R147KAMAYA– Chip Res, 1005 J 47KΩ
R148KAMAYA–Chip Res, 1005 J 1MΩ
R149KAMAYA–Chip Res, 1005 J 470KΩ
R150KAMAYA–Chip Res, 1005 F 10KΩ
R151KAMAYA–Chip Res, 1005 F 12KΩ
Circuit
Ref.
SupplierSupplier Part No.Description
R152KAMAYA–Chip Res, 1005 J 680Ω
R153KAMAYA–Chip Res, 1005 F 68KΩ
R154KAMAYA–Chip Res, 1005 F 47KΩ
R155KAMAYA– Chip Res, 1005 J 470Ω
R156KAMAYA– Chip Res, 1005 J 1KΩ
2
R157
R158
KAMAYA– Chip Res, 1005 J 1KW
2
KAMAYA– Chip Res, 1005 J 1KΩ
R159KAMAYA– Chip Res, 1005 J 47KΩ
R160KAMAYA– Chip Res, 1005 J 47KΩ
R161KAMAYA– Chip Res, 1005 J 47KΩ
R162KAMAYA–Chip Res, 1005 J 820Ω
R163KAMAYA–Chip Res, 1005 J 100KΩ
R164KAMAYA–Chip Res, 1005 J 100KΩ
R165KAMAYA–Chip Res, 1005 J 3KΩ
R167KAMAYA–Chip Res, 1005 J 100KΩ
R168KAMAYA–Chip Res, 1005 J 100KΩ
R169KAMAYA–Chip Res, 1005 J 1.2KΩ
R171KAMAYA–Chip Res, 1005 J 10KΩ
R172KAMAYA–Chip Res, 1005 J 10KΩ
R173KAMAYA–Chip Res, 1005 J 10KΩ
R174KAMAYA–Chip Res, 1005 J 100KΩ
R175KAMAYA–Chip Res, 1005 J 51KΩ
R176KAMAYA–Chip Res, 1005 J 24KΩ
R177KAMAYA–Chip Res, 1005 J 20KΩ
R178KAMAYA–Chip Res, 1005 J 100KΩ
R179KAMAYA–Chip Res, 1005 J 51KΩ
R180KAMAYA–Chip Res, 1005 J 100KΩ
R182KAMAYA–Chip Res, 1005 J 200KΩ
R184KAMAYA–Chip Res, 1005 J 15KΩ
R185KAMAYA–Chip Res, 1005 J 0Ω
Page 69
Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)7-23
Circuit
Ref.
SupplierSupplier Part No.Description
R190KAMAYA–Chip Res, 1005 J 15KΩ
R193KAMAYA–Chip Res, 1005 J 10KΩ
R194KAMAYA–Chip Res, 1005 J 10KΩ
R195KAMAYA–Chip Res, 1005 J 100Ω
R196KAMAYA– Chip Res, 1005 J 47KΩ
R197KAMAYA– Chip Res, 1005 J 47KΩ
R198KAMAYA– Chip Res, 1005 J 47KΩ
R199KAMAYA– Chip Res, 1005 J 47KΩ
R203KAMAYA–Chip Res, 1005 J 22KΩ
R204KAMAYA–Chip Res, 1005 J 22KΩ
R206KAMAYA–Chip Res, 1005 J 10KΩ
R207KAMAYA–Chip Res, 1005 J 22KΩ
R208KAMAYA–Chip Res, 1005 J 12KΩ
Circuit
Ref.
SupplierSupplier Part No.Description
R317KAMAYA–Chip Res, 1005 J 180KΩ
R318KAMAYA–Chip Res, 1005 J 3.3KΩ
R319KAMAYA–Chip Res, 1005 J 3.3KΩ
R320KAMAYA–Chip Res, 1005 J 100Ω
R323KAMAYA–Chip Res, 1005 J 100KΩ
R330KAMAYA–Chip Res, 1005 J 100KΩ
R332KAMAYA–Chip Res, 1005 J 100KΩ
R333KAMAYA–Chip Res, 1005 J 100KΩ
R334KAMAYA–Chip Res, 1005 J 100KΩ
R335KAMAYA–Chip Res, 1005 J 2.2KΩ
R336KAMAYA–Chip Res, 1005 J 1KΩ
R337KAMAYA–Chip Res, 1005 J 100Ω
R338KAMAYA–Chip Res, 1005 J 100Ω
Circuit
Ref.
SupplierSupplier Part No.Description
R418KAMAYA–Chip Res, 1608 D 220KΩ
R419KAMAYA–Chip Res, 1608 D 220KΩ
R420KAMAYA–Chip Res, 1005 J 4.7MΩ
R421KAMAYA–Chip Res, 1608 D 68KΩ
R422KAMAYA–Chip Res, 1608 D 68KΩ
R423KAMAYA–Chip Res, 1005 J 3.9MΩ
R424KAMAYA–Chip Res, 1005 J 12KΩ
R425KAMAYA–Chip Res, 1005 J 3.9KΩ
R426KAMAYA–Chip Res, 1005 J 4.7KΩ
R427KAMAYA–Chip Res, 1005 J 220KΩ
R428KAMAYA–Chip Res, 1005 J 100Ω
R429KAMAYA–Chip Res, 1005 J 3.6KΩ
R430KAMAYA–Chip Res, 1005 J 100Ω
R210KAMAYA–Chip Res, 1005 J 120KΩ
R211KAMAYA–Chip Res, 1005 J 15KΩ
R212KAMAYA–Chip Res, 1005 J 33KΩ
R213KAMAYA–Chip Res, 1005 J 3.3KΩ
R216KAMAYA–Chip Res, 1005 J 10KΩ
R217KAMAYA–Chip Res, 1005 J 10KΩ
R220KAMAYA–Chip Res, 1005 J 5.6KΩ
R250KAMAYA–Chip Res, 1005 J 10KΩ
R258KAMAYA–Chip Res, 1005 J 1.5KΩ
R302KAMAYA–Chip Res, 1005 J 56KΩ
R309KAMAYA–Chip Res, 1005 J 100Ω
R310KAMAYA–Chip Res, 1005 J 4.7KΩ
R311KAMAYA–Chip Res, 1005 J 330Ω
R312KAMAYA–Chip Res, 1005 J 150KΩ
R314KAMAYA–Chip Res, 1005 J 100Ω
R315KAMAYA–Chip Res, 1005 J 100Ω
R316KAMAYA–Chip Res, 1005 J 100KΩ
R401KAMAYA–Chip Res, 1005 J 180Ω
R402KAMAYA–Chip Res, 1005 J 39Ω
R403KAMAYA–Chip Res, 1005 J 180Ω
R404KAMAYA–Chip Res, 1005 J 8.2KΩ
R405KAMAYA–Chip Res, 1005 J 1.5KΩ
R406KAMAYA–Chip Res, 1005 J 22Ω
R407KAMAYA–Chip Res, 1005 J 4.7KΩ
R408KAMAYA–Chip Res, 1005 J 2.2KΩ
R409KAMAYA–Chip Res, 1005 J 10Ω
R410KAMAYA–Chip Res, 1005 J 10Ω
R411KAMAYA–Chip Res, 1005 J 560Ω
R412KAMAYA–Chip Res, 1005 J 1KΩ
R413KAMAYA–Chip Res, 1005 J 8.2KΩ
R414KAMAYA–Chip Res, 1005 J 1KΩ
R415KAMAYA–Chip Res, 2012 J 220Ω
R416KAMAYA–Chip Res, 1608 J 47KΩ
R417ROHM–Chip Res, 1W J 2512 0.1Ω
R431KAMAYA–Chip Res, 1005 J 10KΩ
R432KAMAYA–Chip Res, 1005 J 27KΩ
R433KAMAYA–Chip Res, 1005 J 0Ω
R434KAMAYA–Chip Res, 1005 J 33KΩ
R435KAMAYA–Chip Res, 1005 J 150Ω
R436KAMAYA–Chip Res, 1005 J 100Ω
R440KAMAYA–Chip Res, 1005 J 15KΩ
R441KAMAYA–Chip Res, 1005 J 0Ω
R501KAMAYA–Chip Res, 1005 J 220Ω
R502KAMAYA–Chip Res, 1005 J 220Ω
R503KAMAYA–Chip Res, 1005 J 56KΩ
R504NOBLE–Chip Semi V.R, 3PIE 47
KΩ
R505KAMAYA–Chip Res, 1005 J 12KΩ
R506KAMAYA–Chip Res, 1005 J 10KΩ
R507KAMAYA–Chip Res, 1005 J 10KΩ
R508KAMAYA–Chip Res, 1005 J 3.6KΩ
R509KAMAYA–Chip Res, 1005 J 2.2KΩ
Page 70
7-24Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)
Circuit
Ref.
SupplierSupplier Part No.Description
R510KAMAYA–Chip Res, 1005 J 15KΩ
R511KAMAYA–Chip Res, 1005 J 8.2KΩ
R512KAMAYA–Chip Res, 1005 J 20KΩ
R513KAMAYA–Chip Res, 1005 J 10KΩ
R514KAMAYA–Chip Res, 1005 J 15KΩ
R515KAMAYA–Chip Res, 1005 J 20KΩ
R516KAMAYA–Chip Res, 1005 J 2.2KΩ
R517KAMAYA–Chip Res, 1005 J 15KΩ
R518KAMAYA–Chip Res, 1005 J 4.7KΩ
R519KAMAYA–Chip Res, 1005 J 4.7MΩ
R520KAMAYA–Chip Res, 1005 J 1MΩ
R521KAMAYA–Chip Res, 1005 J 330KΩ
R523KAMAYA–Chip Res, 1005 F 30KΩ
Circuit
Ref.
SupplierSupplier Part No.Description
R609KAMAYA–Chip Res, 1005 J 1KΩ
R610KAMAYA–Chip Res, 1005 J 2.2Ω
R613KAMAYA–Chip Res, 1005 J 15KΩ
R614KAMAYA–Chip Res, 1005 J 390KΩ
R615KAMAYA–Chip Res, 1005 J 2.2Ω
R616KAMAYA–Chip Res, 1005 J 0Ω
R619KAMAYA–Chip Res, 1005 J 10KΩ
R620KAMAYA–Chip Res, 1005 J 33KΩ
R621KAMAYA–Chip Res, 1005 J 39KΩ
R622KAMAYA–Chip Res, 1005 J 0Ω
R623KAMAYA–Chip Res, 1005 J 560Ω
R701KAMAYA–Chip Res, 1005 J 56Ω
R702KAMAYA–Chip Res, 1005 J 1.5KΩ
Circuit
Ref.
SupplierSupplier Part No.Description
R720KAMAYA–Chip Res, 1005 J 150Ω
R721KAMAYA–Chip Res, 1005 J 150Ω
R722KAMAYA–Chip Res, 1005 J 10KΩ
R723KAMAYA–Chip Res, 1005 J 1KΩ
R724KAMAYA–Chip Res, 1005 J 390Ω
R725KAMAYA–Chip Res, 1005 J 100Ω
R726KAMAYA–Chip Res, 1005 J 3KΩ
R727KAMAYA–Chip Res, 1005 J 2.7KΩ
R728KAMAYA–Chip Res, 1005 J 2.7KΩ
R729KAMAYA–Chip Res, 1005 J 100KΩ
R730KAMAYA–Chip Res, 1005 J 33KΩ
R731KAMAYA–Chip Res, 1005 J 10Ω
R732KAMAYA–Chip Res, 1005 J 10KΩ
R524KAMAYA–Chip Res, 1005 F 47KΩ
R526NOBLE–Chip Semi V.R, 2PIE 47
KΩ
R527KAMAYA–Chip Res, 1005 J 82KΩ
R528KAMAYA–Chip Res, 1005 J 82KΩ
R529KAMAYA–Chip Res, 1005 J 47KΩ
R530KAMAYA–Chip Res, 1005 J 47KΩ
R531KAMAYA–Chip Res, 1005 J 47KΩ
R532KAMAYA–Chip Res, 1005 J 10KΩ
R533KAMAYA–Chip Res, 1005 J 10KΩ
R534KAMAYA–Chip Res, 1005 J 10KΩ
R535KAMAYA–Chip Res, 1005 J 10KΩ
R536KAMAYA–Chip Res, 1005 J 330KΩ
R537KAMAYA–Chip Res, 1005 J 1KΩ
R538KAMAYA–Chip Res, 1005 J 10KΩ
R539KAMAYA–Chip Res, 1005 J 330KΩ
R540KAMAYA–Chip Res, 1005 J 47KΩ
R541KAMAYA–Chip Res, 1005 J 330KΩ
R703KAMAYA–Chip Res, 1005 F 4.7KΩ
R704KAMAYA–Chip Res, 1005 F 4.7KΩ
R705KAMAYA–Chip Res, 1005 J 220Ω
R706KAMAYA–Chip Res, 1005 J 100Ω
R707KAMAYA–Chip Res, 1005 J 1.5KΩ
R708KAMAYA–Chip Res, 1005 F 4.7KΩ
R709KAMAYA–Chip Res, 1005 F 6.8KΩ
R710KAMAYA–Chip Res, 1005 J 220Ω
R711KAMAYA–Chip Res, 1005 J 100KΩ
R712KAMAYA–Chip Res, 1005 J 100KΩ
R713KAMAYA–Chip Res, 1005 J 30KΩ
R714KAMAYA–Chip Res, 1005 J 56Ω
R715KAMAYA–Chip Res, 1005 J 56Ω
R716KAMAYA–Chip Res, 1005 J 300Ω
R717KAMAYA–Chip Res, 1005 J 10Ω
R718KAMAYA–Chip Res, 1005 J 7.5KΩ
R719KAMAYA–Chip Res, 1005 J 1KΩ
R733KAMAYA–Chip Res, 1005 J 0Ω
R734KAMAYA–Chip Res, 1005 J 10Ω
R735KAMAYA–Chip Res, 1005 J 1KΩ
R736KAMAYA–Chip Res, 1005 J 1KΩ
R737KAMAYA–Chip Res, 1005 J 1KΩ
R740KAMAYA–Chip Res, 1005 J 1.5KΩ
R1001KAMAYA–Chip Res, 1005 J 10KΩ
R1002KAMAYA–Chip Res, 1005 J 9.1KΩ
R1003KAMAYA–Chip Res, 1005 J 10KΩ
R1004KAMAYA–Chip Res, 1005 J 10KΩ
R1005TDK–Chip Cap, 1005 K 10nF
RT201TAIYOYUDEN–Thermistor, 103K
RT501TAIYOYUDEN–Thermistor, 103K
SH101
SH102
SH103
SH105MOTOROLAPMDN4149ARFinger Strip TX
BGTech
BGTech
BGTech
8860BEACA1010Shield CAN, VCO
8860BEAC93010Shield CAN, PLL
8660BEACA4010Shield CAN, PA
Page 71
Circuit Board/Schematic Diagram and Parts List (UHF2: 435–480 MHz)7-25
Circuit
Ref.
SH201MOTOROLAPMDN4151ARFinger Strip–Pair
SPK1BGTech8400362424100SHINMYUNG, Speaker,
SW/
VOL1
U101BGTech81100303RF020RENESAS, CPU IC,
U102BGTech8116AK2347020ASAHI KASEL, AUDIO
U103BGTech8192088L70020ZERLINK, DTMF
U104BGTech811324LC64020MIRCO CHIP, EEPROM
U105JRC–OP AMP, NJM324
U106BGTech8135TC7S66020TOSHIBA, Analog SW IC,
SupplierSupplier Part No.Description
24Ω 1.0W 36θ(Connector
type)
BGTech84766N992N151TOKOS, Switch Volume,
RY-8418 Rev1
M3030RFCPGP
LSI, AK2347
RECEIVER, MT88L70
IC, 24LC64
TC7S66FU
Circuit
Ref.
U508BGTech8191401150320MIRCO CHIP,DIGITAL
U601BGTech811608541T020PHILIPS, AUDIO
U701BGTech810415E03S020FUJISU, PLL IC,
PCB1BGTech8431BEACON200CAFSYSTEM, Main PCB,
KEY
PCB1
SupplierSupplier Part No.Description
POTENTIOMETER,
MCP4011(503)
AMP,TDA8541
MB15E03SLPFV1–G–
BND–EF–6
FR4 4 Layer PCB Rev.#P4
BGTech8422BEACON100CAFSYSTEM, Key PCB,
1.2T 2Layer
Note:
2: Not for PMUE3144AAL
U107BGTech81287027AT020VOLTAGE DETECTOR,
KIA7027AT
U201BGTech8125311360020TOSHIBA, FM IC,
TA31136
U202BGTech8191401150220MIRCOCHIP, DIGITAL
POTENTIOMETER,
MCP4011(502)
U401KEC–OP AMP (DUAL), KIA358
U402BGTech8191401150220MIRCOCHIP, DIGITAL
POTENTIOMETER,
MCP4011(502)
U501JRC–JRC, OP AMP, NJM324
U502JRC–JRC, OP AMP, NJM324
U505BGTech8123011250021TOKO, REGULATOR IC,
TK11250AMTL
U506BGTech8123112330020TOKO, REGULATOR IC,
TK11233AMTL
U507BGTech8128TC1240020MICRO CHIP, VOLTAGE
DOUBLER, TC1240
Page 72
7-26
Notes
Page 73
Chapter 8136 – 174 MHz VHF Theory Of Operation
A
8.1Introduction
This chapter provides a detailed theory of operation for the radio components. Schematic diagrams
for the circuits described in the following paragraphs are located in Chapter 10 of this manual.
8.2VHF Receiver
The VHF receiver design covers the frequency range of 136 – 174 MHz and it is a double
conversion super heterodyne with 1st IF 45.1 MHz and 2nd IF 455 kHz. The receiver is divided into
two major blocks, Front End and Back End as shown in Figure 8-1.
Preselector
Filter
RF
Amp
Postselector
Filter
1st Mixer
Crystal
Filter
IF
Amp
RX from
ntennaSwitch
Inj Filter
First LO
fromSynthesizer
N/S_SW
Ceramic
Descriminator
455C24
Recovered Audio
LPF
Quadrature
Detector
Filter
IF
Amp
455FW
455HW
RSSI
Figure 8-1. VHF Receiver Block Diagram
Crystal
44.645MHz
Page 74
8-2136 – 174 MHz VHF Theory Of Operation: VHF Receiver
8.2.1Receiver Front End
Incoming RF signals from antenna are first routed through the harmonic filter (L409, L410, L411,
C426, C427, C428, C429, C445, C446) and antenna switch (CR301), part of the transmitter circuitry,
before being applied to the receiver front end. The receiver front end consists of preselector filter, RF
amplifier, post-selector filter and a single-balanced mixer.
The preselector filter is a varactor-tuned 2-pole design using discrete elements (L301, L302, L303,
L304, C301, C304, C305, C307) in a shunt or series resonator configuration. It is a band-shift filter
and the frequency shift is controlled by varactor diodes CR302 and CR303, which are connected to
the microprocessor. It is configured to provide steeper attenuation above the passband for improved
spurious rejection when high-side local injection is used. The frequency is separated into 6 steps and
controlled by CPU (136 – 174 MHz).
The output of this filter is matched to the base of RF amplifier Q301 which provides 15dB of gain.
The output of the RF amplifier is applied to the post-selector filter. The post-selector filter designed
using discrete elements (L307, L308, L309, L311, C315 and C354) in a series/shunt resonator
configuration. It is a band-shift filter and the frequency shift is controlled by varactor diodes CR305
and CR307, which are connected to the microprocessor. It is configured to provide steeper
attenuation above the passband for improved spurious rejection when low-side local injection is used.
The frequency is separated into 6 steps and controlled by CPU (136 – 174 MHz).
The output of the post selector is connected to the single-balanced mixer consisting of components
L329, L333, Q306 and Q307. 1st local signal generated from VCO is filtered by injection
filter (L310, L331, C325, C326, C327, C333 and C365) to remove second harmonics. The converted
1st IF frequency at mixer passes through L331 and matches the 45.1 MHz IF signal to pair crystal
filter (FL301).
8.2.2Receiver Back End
The 1st IF signal is amplified about 15 dB by IF amp Q303. The output of the IF amp is connected to
IF IC (U201). 1st IF frequency (45.1 MHz) and 2nd LO frequency (44.645 MHz) are mixed in U201.
The second mixer converts the 45.1 MHz high IF frequency to 2nd IF frequency (455 kHz).
Additional IF selectivity is provided by two ceramic filters (CF1, CF2). The wider filter 455 FW is used
for 25 kHz channel spacing, and the narrower filter 455 HW is used for 12.5 kHz channel spacing.
These two ceramic filters may eliminate undesired signal and demodulated by demodulator in U201.
N/S_SW which connected to microprocessor is used to select the wide and narrow band.
The mute (squelch) circuit switches off the audio amplifier when no audio is present. The squelch
circuit consists of U201 and U202 and their associated components. The noise signal from pin 9 of
U201 is used to control the squelch circuit sensitivity of U202. The noise passes through filter, and is
amplified by internal amp of U201. The amplified noise act as a DC voltage to control the mute
system. So if the noise level is under the threshold voltage, the microprocessor (U101) un-mutes the
radio. If the noise level is over the threshold voltage, the microprocessor mutes the radio. The
squelch level is tuned in the factory. When a component or a part in the RX system is replaced, the
squelch must be re-tuned using the Tuner.
Page 75
136 – 174 MHz VHF Theory Of Operation: VHF Transmitter8-3
8.3VHF Transmitter
The VHF transmitter covers the range of 136 – 174 MHz. Depending on model, the output power of
the transmitter is switchable on a per-channel basis between high power (5 Watts) and low
power (1 Watt). The transmitter is divided into four major blocks as shown in Figure 8-2.
• Power Amplifier
• Harmonic Filter
• Power Control
From VCO
Attenuator
Circuit
8.3.1Power Amplifier
The transmitter power amplifier has three stages of amplification – Pre Driver (Q401), Driver Amp
(Q402) and Final Amp (Q403). Signal from TX VCO is applied to the pre driver via an attenuator
circuit. The attenuator is pie style resistor attenuator, and is used as isolation between VCO and the
power amps. The -3dBm TX RF signal from attenuator is then amplified by pre driver and driver amp
to around +28dBm and is applied to the final amp. The final amp (Q403) is an enhancement-mode
N-channel MOSFET device providing a gain of 12dB. The device drain current is drawn directly from
the DC battery supply voltage input via L413. A matching network consisting of C417, C418, C419,
C420, C455 and a strip line, transforms the impedance to approximately 50 Ohm.
SWB+
Power Control
Pre Driver
Amp
Driver
Amp
BAT+
Current Detect
Strip Line
Final
Amp
To Receiver
Figure 8-2. VHF Transmitter Block Diagram
CR401
Antenna
Switch
Antenna
Harmonic
Filter
8.3.2Antenna Switch
An antenna switch works mainly as a switching device between transmit and receive paths. In
transmit mode (PTT), Q407 is turned on and both PIN diodes (CR401, CR301) are forward biased
into conduction. This enables the RF signal to pass to the harmonic filter and then to the antenna. In
the receiver mode, both diodes are off. Signals applied to the antenna jack are routed via the LPF
(harmonic filter), through a TX Low Pass Filter (L409, L410, L411, C426, C427, C428, C429, C430,
C445 and C446), to the receiver input.
8.3.3Harmonic Filter
The harmonic filter consists of components L409, L410, L411, C426, C427, C428, C429, C430, C445
and C446. The harmonic filter is a seven-pole Chebychev filter.
Page 76
8-4136 – 174 MHz VHF Theory Of Operation: VHF Frequency Generation Circuitry
8.3.4Auto Power Control
The APC keeps the current supply constant to the final amp (Q403). The drain current of Q403 (final
amp) is sensed across resistor R417. The voltage difference across R417. The differential signal at
the output of U401 (pin 7) is passed to Q404 and Q405 that produces a constant power output to the
antenna. If the current is changed due to change of battery voltage or load, APC controls gate voltage
of Q403 and collector voltage of Q401 and drain voltage of Q402 to keep TX power stable. This circuit
stabilizes TX power at a pre-determined level adjusted by U402. This bias voltage is tuned in the
factory. If the transistor (Q403) is replaced, the RF Output Power must be tuned. By tuning the RF
output power, the bias voltage will be tuned through U402. Extra care has to be taken during the
tuning process. Do not exceed the maximum allowed bias voltage.
8.4VHF Frequency Generation Circuitry
The PLL synthesizer subsystem consists of the reference oscillator (VCTCXO), VCO, PLL IC, Charge
Pump and Loop Filter.
Modulating
Signal
FL701
12.8MHz
Ref.OSC.
Synthesizer
U701
PLL Data
from μP
Charge
Pump
Voltage
Doubler
Figure 8-3. VHF Frequency Generation Unit Block Diagram
8.4.1Reference Oscillator (12.8 MHz VCTCXO)
The reference oscillator is powered by regulated 5V provided by U505. The reference frequency
12.8 MHz VCTCXO (Voltage Controlled Temperature Compensated Crystal Oscillator) is applied to
the PLL IC (U701) via pin 1. Main frequency can be adjusted by chip trimmer of VCTCXO. This
frequency provides reference to the PLL IC and has a frequency stability of +/-2.5PPM (max) at the
temperature ranging from -30 to +60 Degree Celsius.
Loop
Filter
TX VCO
Circuit
TX Out
RX VCO
Circuit
RX Out
To PA Driver
To Mixer
Page 77
136 – 174 MHz VHF Theory Of Operation: VHF Frequency Generation Circuitry8-5
8.4.2PLL IC Prescaler and Comparator
The reference frequency from VCTCXO is divided to 6.25 kHz or 5 kHz by reference counter, R. The
RF signal input from the VCO is divided to by prescaler (1/64), divided by N and A counters in PLL IC
to determine frequency steps and then supplied to the comparator. The comparison frequency is
6.25/5 kHz. The internal phase comparator compares the phase difference between the reference
and VCO signal. When the phase of the reference frequency is leading, Pin15 (R) is the output.
When VCO frequency is leading, Pin16 (P) is the output. When P=R, small pulses are the output of
the phase detector.
8.4.3Voltage Doubler and Charge Pump
The voltage doubler (U507) converts 5V to 10V and is applied to the charge pump circuitry. The
charge pump is used for charging output signals P, R supplied by PLL IC from 0-3.3V to 0-10V. This
voltage is used to drive the VCO.
8.4.4Loop Filter
The loop filter contains C751, C752, C753, C754, R726, R727, R728. It reduces the residual sideband noise to get the best signal-to-noise ratio. The output signal from loop filter is applied to VCO.
8.4.5Dual VCO
The dual VCO module contains a RX VCO and a TX VCO. They are configured as colpitts oscillators
and connected to power up through transistor switches. Only one VCO is selected at a time. A
steering line voltage between 0.35V and 9.7V at varactor CR701 tunes the full RX frequency range
from 181.1 MHz to 219.1 MHz, and varactor CR703 tunes the full TX frequency range from 136 MHz
to 174 MHz.
In Receiver mode, high signal of RX_EN from pin 71, U101 activates Q305. When Q305 is activated,
current flows through the base of Q304 and thus activates the Q705. The varactor CR701 sets the
resonance frequency. When there is a change in voltage supplied by loop filter, there is a change in
the resonance frequency. L703 is the resonating coil, which forms the tank circuit together with
variable cap C710.
In Transmit mode, high signal of TX_EN1 from pin 84, U101 enables current flows through collector
of Q503 and thus activates Q706. The varactor CR703 sets the resonance frequency. When there is
a change in voltage supplied by loop filter, there is a change in the resonance frequency. L706 is the
resonating tuning coil, which forms the tank circuit together with variable cap C722.
Page 78
8-6136 – 174 MHz VHF Theory Of Operation: Keypad
8.5Keypad
Left, Right and P1 to P3 keys are directly connected to microprocessor via 22 pin connector. When
any of these keys is pressed, the voltage goes "low" and microprocessor detects it.
For full keypad models, the number keys are in matrix type which consisted of 3 rows and 4 columns.
When any of these keys is pressed, the voltage goes "low" and microprocessor interprets the voltage
for each key press.
KEYPAD
Left
Right
P1 P2P3
NUMBERS
Key
detect
Keyrow
Keypad board
Key
22pin connector
column
Figure 8-4. Keypad Block Diagram
MCP
Main board
22pin connector
Page 79
Chapter 9VHF Troubleshooting Tables
9.1Troubleshooting Table for Receiver (VHF)
Table 9-1. Troubleshooting Table for Receiver (VHF)
SymptomPossible CausesProcedureCorrective Action
Radio Dead (no
turn–on beep, no
LED indication)
No RX Audio (with
LED indication)
1. Battery dead or
defective
2. Defective battery
contacts
3. Microprocessor not
starting up
4. Regulator faultVerify U506 pin 4 is 3.3V
5. Flexible Cable faultCheck connection of the 12 pin
1. Speaker dead or
defective
2. Audio Processor IC
not starting up
3. Audio Amp IC not
starting up right
Substitute good battery or battery
eliminator
Inspect battery contacts for
corrosion or bent terminals
Verify clock input to U101 pin 13 is
7.3728 MHz using high impedance
probe.
Verify U101 pin10(reset) is high.
Verify U505 pin 4 is 5.0V
flexible cable between J104 & J105
Substitute a good housing (with
speaker)
Verify J603 connection
Verify clock input U102 pin 14 is
3.5795 MHz using high impedance
probe.
Verify U601 pin 6 is battery voltage.
Change or replace battery.
Clean/Repair/Replace J602
Troubleshoot/Replace FL101.
If reset is Low, troubleshoot
regulator U506 or U107.
Check for shorts on outputs
Troubleshoot/Repair as
needed, replace faulty regulator
Re–assemble or replace flexible
cable
Change the housing (with
accessory)
Change the housing (with
accessory)
Troubleshoot/Replace FL102
Troubleshoot/Replace U601
If battery voltage is being supplied to
pin 6, then verify audio output at
pin5&8.
No Receive (with
no LED indication)
No RX1. RX–B+ Verify Q304’s collector voltage is
1. IF IC dead or faultVerify clock input to U201 pin 1&2 is
44.645 Mhz using high impedance
probe.
4.8V when RX–EN is high.
Troubleshoot/Replace FL201
Check/Replace Q304
Page 80
9-2VHF Troubleshooting Tables: Troubleshooting Table for Synthesizer (VHF)
9.2Troubleshooting Table for Synthesizer (VHF)
Table 9-2. Troubleshooting Table for Synthesizer (VHF)
VHF Troubleshooting Tables: Troubleshooting Table for Board and IC Signals (VHF)9-5
Table 9-4. Troubleshooting Table for Board and IC Signals (VHF) (Continued)
IC DesignatorPinPin FunctionDC Voltage (V)Comments (Condition)
(DTMF decoder)2IN-1.6
3GS1.6
4Vref1.6
8OSC11.63.579545 MHz input
10VSS0
11TOE3.3
17STDHighAt DTMF detecting
18EST3.3
19ST/GT3.3
20VDD3.3
FL701(VCTCXO)1VCON1.9
2GND0
3OSC outoscGenerate the 12.8 MHz
4VCC5
Q206(N/S SW)EGND0
BN/S SW12.5 kHz: Low
CCollector12.5 kHz: High
25 kHz: Low
Q304E+5V5At RX Mode
BTo Q305 collectorLow
CRX_B+4.7
Q305EGND0At RX Mode
BRX_ENHigh
CTo Q304 baseLow
Q503EGND0At TX Mode
BTX_EN1High
CTo Q706 baseLow
Q407E+5V5At TX Mode
BTo Q408 collectorLow
CTXVB4.7
Q408EGND0At TX Mode
BTX_EN2High
CTo Q 40 7Low
Page 84
9-6VHF Troubleshooting Tables: Troubleshooting Table for Board and IC Signals (VHF)
Table 9-4. Troubleshooting Table for Board and IC Signals (VHF) (Continued)
IC DesignatorPinPin FunctionDC Voltage (V)Comments (Condition)
Q601EGND0
BAudio_MUTE_CONMute: Low
None Mute: High
CModeMute: High
None Mute: Low
1. All voltages are measured with a high-impedance digital voltmeter and expressed in volts DC relative to ground (0V).
2. Voltages are measured with a DC input voltage of 7.50 + .02 volts DC applied to the battery connector (J602).
3. All voltages are measured in the squelched receive mode, unless otherwise indicated.
4. Voltages are identical for VHF and UHF models unless otherwise indicated.
Page 85
Chapter 10 VHF Schematic Diagrams, Overlays, and
Parts Lists
10.1Introduction
This section provides schematic diagrams, overlays, and parts lists for the radio circuit boards and
interface connections.
10.1.1 Notes For All Schematics and Circuit Boards
* Component is frequency sensitive. Refer to the Electrical Parts List for value and usage.
1. Unless otherwise stated, resistance values are in Ohms (K = 1000), capacitance values are in
nanofarads (nF), picofarads (pF) or microfarads (µF), and inductance values are in
nanohenries (nH) or microhenries (µH).
2. DC voltages are measured from point indicated to chassis ground using a Motorola DC
multimeter or equivalent. If the board has been removed from the chassis, the transmitter
module mounting screws may be used for ground connection. (Note: The antenna nut bracket is connected to ground.) Operating mode dependent voltages are followed by (RX)
for receive mode, (TX) for transmit mode, (UNSQ) for unsquelched mode, etc.
3. RF voltages on VHF models are measured with a Fluke model 85 RF probe. The indicated
voltages expressed in mV (RF) are DC level readings which correspond approximately 1:1 to
the RF voltage level in mV rms. RF voltages in the Receiver Front End and Receiver Back
End circuits are measured with an on-channel 1mV (-47dBm) RF signal applied to the
antenna jack ANT1/ANT.
4. RF voltages on UHF models are measured both with a high–impedance RF voltmeter having
a bandwidth in excess of 500 MHz (levels are expressed in dBm) and with a Fluke model 85
RF probe [levels are expressed in mV (RF)]. These indicated voltages are DC level readings
which correspond approximately 1:1 to the RF voltage level in mV rms, and are only
approximate for UHF frequency measurements. RF voltages in the Receiver Front End and
Receiver Back End circuits are measured with an on-channel 1mV (-47dBm) RF signal
applied to the antenna jack ANT1/ANT.
5. Audio voltages are measured with a high-impedance AC rms voltmeter. The indicated
voltages are expressed in mV rms. Receive mode voltages are followed by (RX) and are
measured with an on-channel signal with 1 kHz modulation at 60% deviation (3 kHz for 25
kHz channels, or 1.5 kHz for 12.5 kHz channels). Transmit mode voltages are followed by
(TX) and are measured with a 1 kHz, 10 mV rms signal present at the external microphone
input (accessory connector J601).
Page 86
10-2VHF Schematic Diagrams, Overlays, and Parts Lists: Introduction
6. Reference Designators are assigned in the following manner:
Ref. No. SeriesCircuit Block
101 – 199
Microprocessor & audio control
circuits
1001 – 1099Microprocessor & audio control
circuits
201 – 299IF IC circuit
301 – 399Front-end and 1st Mixer
401– 499Transmit RF stage & Auto power
control
501 – 599Base band & generating circuit
601– 699Audio amplifier
701– 799VCO & PLL Synthesizer
7. Circuit Block Interconnection Legend:
NameDescription
+5V5 Volts (Regulated)
+3.3V3.3 Volts (Regulated)
SWB+Switched Battery Voltage
BAT+Unswitched Battery voltage
+10VDigital 10V(Regulated)
RESETLow-line reset signal fromU107 to U101 Pin 10
TX_EN1Transmit enable signal from U101 Pin 84
TX_EN2Transmit enable signal from U101 Pin 85
TXVBTX operating voltage
TX_AF3TX audio signal from audio processor IC to TX Audio
filter
TX_SUB_TONETX sub tone signal from audio processor IC to TX
modulation.
RX_B+RX operating voltage
RSSIRX signal strength indication from IF IC to U101
BusyRX detect signal from IF IC to U101
FTVRX frequency shift voltage
RX_AF1RX audio signal from IF IC to Audio processor IC
PLL_LDPLL lock detect signal from PLL IC to U101
N/S SWChannel space selectable Switch (12.5 kHz/25 kHz)
1/2VCC1.9 volts (divided by U502-D)
Page 87
VHF Schematic Diagrams, Overlays, and Parts Lists: Speaker and Microphone Schematic10-3
10.1.2 Four Layer Circuit Board
Plating (Au)
PSR ink
Copper Plate
Copper
PrePreg.
Copper
CCL (core)
Copper
PrePreg.
Copper
Copper Plate
PSR ink
Figure 10-1. Four–Layer Circuit Board: Copper Steps in Layer Sequence
10.2Speaker and Microphone Schematic
MIC1
1
2
SPK1
Figure 10-2. Speaker and Microphone Schematic
10.2.1 Speaker and Microphone Parts List
Reference
Designator
MIC1PMDN4139_RMicrophone
SPK1
Motorola Part No.Description
PMDN4067BR
MATES WITH J103 ON
RADIO BOARD
1
MATES WITH J603 ONRADIO BOARD
2
Speaker & Cable
Page 88
10-1Circuit Board/Schematic Diagram and Parts List (VHF: 136–174 MHz)
10.3 Circuit Board/Schematic Diagram and Parts List (VHF: 136–174 MHz)