MITEL 1A353 Datasheet

PRODUCT INFORMATION
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12604.11 1995-10-26
1320nm
High-Performance Duplex
Half-Duplex Communication
0.6
14
Ø1.5
Ø4.7
3.7
5.4
2.5
0.4
CASE
ANODE
CATHODE
BOTTOM VIEW
The diode chip is isolated from the case.
TO-46 Package With Lens
All dimensions in mm
This single-chip device operates as both an Emitter and Detector, and transmits data over a single fiber in half-duplex mode—thus reducing both fiber and component costs when compared with traditional approaches.
RECEIVING MODE
Thermal Characteristics
Absolute Maximum Ratings
Fiber:
62.5/125
mm
Graded
Index
NA=0.275
Fiber:
62.5/125mm
Graded
Index
NA=0.275
Optical and Electrical Characteristics
(25°C Case Temperature)
EMITTING MODE
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Thermal Resistance- Infinite Heat Sink R
thjc
200 8C/W
Thermal Resistance- No Heat Sink R
thja
500 8C/W
Temperature Coefficient- Optical Power dP/dT
j
-0.8 %/8C
Temperature Coefficient-Wavelength dl/dT
j
0.55 nm/8C
T emperature Coefficient-Responsivity dR/dT
j 0.2
%/8C
T emperature Coefficient-Dark Current dLd/dT
j5
%/8C
Note 1: Measured at the exit of 100 meters of fiber.
PARAMETER SYMBOL MIN. TYP. MAX. UNIT TEST CONDITION
Fiber-Coupled Power P
fiber
50 55 mW IF=80 mA
(Fig.1,2,&3) (Table1) (Note 1)
Rise and Fall Time tr,t
f
4nsI
F
=80 mA
(10-90%)
(no bias)
Bandwidth f
c
50 MHz IF=80 mA
(3dBel)
Peak Wavelength l
p
1280 1320 1350 nm IF=80 mA
Spectral Width(FWHM) Dl 140 nm IF=80 mA Forward Voltage (Fig.5) V
F
1.7 1.9 V IF=80 mA
Responsivity R 0.25 0.3 A/W VR=1V
(Fig.1,2) (Table2) l=1320nm
Rise and Fall Time tr,t
f
4nsV
R
=1V
(10-90%)
RL=50V
(no bias)
Bandwidth f
c
50 MHz VR=1V
RL=50V
Capacitance C 300 pF VR=1V, f=1MHz Dark Current I
d
20 100 nA VR=1V
PARAMETER SYMBOL LIMIT
Storage Temperature T
stg
-55 to +1258C
Operating Temperature (derating: Fig.4) T
op
-55 to +1258C
Electrical Power Dissipation(derating: Fig.4) P
tot
160 mW
Continuous Forward Current (f<10 kHz) I
F
110 mA
Peak Forward Current (duty cycle<50%, f>1 MHz) I
FRM
150 mA
Reverse Voltage V
R
2.0 V
Soldering Temperature (2mm from the case for 10 sec) T
sld
2608C
High-Performance Duplex
0
20
40
60
80
100
%
0
20 40
60
80
100
µm
RELATIVE FIBER-COUPLED POWER
r - RADIAL DISPLACEMENT OF FIBER
RELATIVE FIBER-COUPLED POWER
r
z = opt.
Øc =
62.5 µm
z
FIGURE 2
0
20
40
60
80
100
%
0
40 80
120
160
200
mA
RELATIVE FIBER-COUPLED POWER
FORWARD CURRENT
50% DUTY CYCLE
DC
HEAT SINKED
FIGURE 3
mW
300
200
100
0
0 50 100
150
¡C
NO HEAT SINK
OPERATING TEMPERATURE
MAX. ELECTRICAL POWER DISSIPATION
FIGURE 4
INFINITE HEAT SINK
0
20
40
60
80
100
%
0.5
1.0 1.5
2.0
2.5
3.0
mm
z - AXIAL DISPLACEMENT OF FIBER
RELATIVE FIBER-COUPLED POWER
r
r = opt.
Øc = 62.5ʵm
z
FIGURE 1
FORWARD VOLTAGE
FORWARD CURRENT
mA
200
100
0
0
1 2
3
V
FIGURE 5
Core Diameter/Cladding Diameter
Numerical Aperture
50/125m m 62.5/125m m
0.20 0.275
Table 2
Typical Responsivity
0.3 A/W 0.3A/W
Core Diameter/Cladding Diameter
Numerical Aperture
50/125mm 62.5/125mm
0.20 0.275
Table 1
Typical Fiber-Coupled Power
15mW 55mW
1320nm
5.6000
3.3000
Clip for SC-2A
R 1.00
80,000
0.5000
20.8200
10,2500
10.3000
4.9500
0.5000
4.5000
5.0800
3.6450
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