Microsemi Corporation CHFP6KE60A, CHFP6KE60, CHFP6KE43A, CHFP6KE43, CHFP6KE40A Datasheet

FEATURES

∙Unidirectional and Bidirectional

∙Fully glass passivated

∙600 watt (10/1000 μs)

∙Eliminates wire bonding

∙NON Inductive Insertion

∙No voltage overshoot

MECHANICAL

∙Weight: 0.01 grams (approximate)

∙Solderable standoff tabs .040X.040X.010

PACKAGING

∙Waffle package 50 pices or wafer ring 70 pieces

	8700 E. Thomas Road	FLIP-CHIP TVS DIODES
		CHFP6KE5.0
	Tel: [phone]
	Scottsdale, AZ 85251
	Fax: [phone]	thru
		CHFP6KE170CA
		Patented Flip-Chip Series

MAXIMUM RATINGS

∙Max Junction Temperature: 1500C (with conformal coating)

∙Storage Temperature: -550C to +1500C

∙Flip-Chip Peak Pulse Power: 600 Watts (10/1000 μs)

∙Maximum non-repetitive peak power 600 Watts (10/1000 μs)

∙Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C)

∙Turn-on time (theoretical) unidirectional 1X10-12

∙Turn-on time (theoretical) bidirectional 1X10-9

BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm)

FLIP-CHIP DIMENSIONS

PAD SIZE & CIRCUIT

VBR above 30 V	VBR 30V and below

MSC1596.PDF

ISO 9001 CERTIFIED

REV B 3/13/2000