Note 1: The products with Flash memory (86FH46,86FH46A,86FH46B) contain the Flash control register (FLSCR) at 0FFFH
DBR area. The products with mask ROM or OTP and the emulation chip do not have the FLSCR register. In
in the
these devices,therefore, a program that accesses the FLSCR register cannot function properly (executes differently
as in the case of a Flash product).
Note 2: The TXD and RXD pins to be used in Serial PROM mode differ between the 86FH46 and the 86FH46A,86FH46B.
Take this into consideration in your board design when you replace the product. Details of the function refer to the chapter of the 86FH46,86FH46A,86FH46B data sheet.
Note 1: The products with Flash memory (86FH47,86FH47A,86FH47B) contain the Flash control register (FLSCR) at 0FFFH
DBR area. The products with mask ROM or OTP and the emulation chip do not have the FLSCR register. In
in the
these devices,therefore, a program that accesses the FLSCR register cannot function properly (executes differently
as in the case of a Flash product).
Note 2: The TXD and RXD pins to be used in Serial PROM mode differ between the 86FH47 and the 86FH47A,86FH47B.
Take this into consideration in your board design when you replace the product. Details of the function refer to the chapter of the 86FH47,86FH47A,86FH47B data sheet.
Note 3: P21,P22 combine XTIN,XTOUT and port.
Differences in Electrical Characteristics (TMP86xx46 Series)
5.5
4.5
2.7
1.8
1 4.2 816 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
2.0
0.030
0.034
1 4.2 816 [MHz]
[V]
(a)
(b)
(Note1)
5.5
4.5
2.7
1.8
1 4.2 816 [MHz]
[V]
(a)
5.5
4.5
3.0
2.7
1.8
0.030
0.034
1 4.2 8 16
(a)
(b)
(Note2)
[MHz]
[V]
5.5
4.5
2.7
1.8
0.030
0.034
1 4.2 8 16 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
2 4 8 16 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
0.030
0.034
2 4.2 8 16 [MHz]
[V]
(a)
TMP86FH47BUG
Operating condition
(MCU
mode)
Read/
Fetch
Erase/
Program
86C846 / 86CH46 / 86CM46
86CM46A
86PM46
86PH46
86CH46A
(a) 1.8V to 5.5V (-40 to 85 °C) (a) 2.0V to 5.5V (-40 to 85 °C)
(b) 1.8V
to 2.0V (-20 to 85 °C)
---
86FH46
(a) 2.7V to 5.5V (-40 to 85 °C)
86FH46A
86FH46B
TMP86FH46A
(a) 3.0V
to 5.5V (-40 to 85 °C)
(b) 2.7V to 3.0V (-20 to 85 °C)
TMP86FH46B
(a) 2.7V to 5.5V (-40 to 85 °C)
Operating condition
(Serial PROM
mode)
Supply voltage
(Absolute Maxi-
mum
Ratings)
Operating current
Note 1: With The 86CH46A,PH46 the operating temperature (Topr) is -20 °C to 85 °C when the supply voltage VDD is less
2: With The 86FH46A, the operating temperature (Topr) is -20 °C to 85 °C when the supply voltage VDD is less than
Note
Note 3: With The 86FH46A,86FH46B when a program is executing in the Flash memory or when data is being read from the
Note 4: About the measurement condition of supply current, VIN level of TEST pin is deffrent between 86FH46B and the oth-
(a) 4.5V to 5.5V (-10 to 40 °C)
--
(a) 4.5V to 5.5V (20 to 30 °C) (a) 4.5V to 5.5V (-10 to 40 °C)
86FH46A
−0.3 ~ 6.5
(a)−0.3 ~
6.5
86FH46B
(a)−0.3 ~ 6.0
Operating current varies with each product. For details, refer to the datacheet (electrical chracteristics) of each product.(Note4)
(Note3)
than 2.0V.
3.0V.
Flash memory, the Flash memory operates in an intermittent manner causing peak currents in the Flash memory momentarily, as shown in Figure. in this case, the supply current IDD(in NORMAL1,NORMAL2 and SLOW1 mode) is defined as the sum of the average peak current and MCU current.
er 86xx46 series MCUs. The supply current is defined as follows; VIN of TEST pin: VIN ≤ 0.1V(86FH46B), VIN ≤ 0.2V(others) It is described in the section "Electrical characteristics" of TMP86FH46B in detail.
n
Program counter (PC)
n+1n+2n+3
1 machine cycle(4/fc or 4/fs)
MCU current
I
[mA]
DDP-P
Typ. current
Momentary Flash current
Max. current
Sum of average momentary
Flash current and MCU curren
t
Intermittent Operation of Flash Memory
TMP86FH47BUG
Differences in Electrical Characteristics (TMP86xx47 Series)
5.5
4.5
2.7
1.8
1 4.2 816 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
2.0
0.030
0.034
1 4.2 816 [MHz]
[V]
(a)
(b)
(Note1)
5.5
4.5
2.7
1.8
1 4.2 816 [MHz]
[V]
(a)
5.5
4.5
3.0
2.7
1.8
0.030
0.034
1 4.2 8 16
(a)
(b)
(Note2)
[MHz]
[V]
5.5
4.5
2.7
1.8
0.030
0.034
1 4.2 8 16 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
2 4 8 16 [MHz]
[V]
(a)
5.5
4.5
2.7
1.8
0.030
0.034
2 4.2 8 16 [MHz]
[V]
(a)
TMP86FH47BUG
Operating condition
(MCU
mode)
Read/
Fetch
Erase/
Program
86C847 / 86CH47 / 86CM47
86CM47A
86PM47
(a) 1.8V to 5.5V (-40 to 85 °C)
---
86PH47
86CH47A
(a) 2.0V to 5.5V (-40 to 85 °C)
(b) 1.8V
to 2.0V (-20 to 85 °C)
86FH47
(a) 2.7V to 5.5V (-40 to 85 °C)
86FH47A
86FH47B
86FH47A
(a) 3.0V
to 5.5V (-40 to 85 °C)
(b) 2.7V to 3.0V (-20 to 85 °C)
86FH47B
(a) 2.7V to 5.5V (-40 to 85 °C)
Operating condition
(Serial PROM
mode)
Supply voltage
(Absolute Maxi-
mum
Ratings)
Operating current
Note 1: With The 86CH47A, PH47 the operating temperature (Topr) is -20 °C to 85 °C when the supply voltage VDD is less
2: With The 86FH47A, the operating temperature (Topr) is -20 °C to 85 °C when the supply voltage VDD is less than
Note
Note 3: With The 86FH47A,86FH47B when a program is executing in the Flash memory or when data is being read from the
Note 4: About the measurement condition of supply current, VIN level of TEST pin is deffrent between 86FH47B and the oth-
(a) 4.5V to 5.5V (-10 to 40 °C)
--
(a) 4.5V to 5.5V (20 to 30 °C) (a) 4.5V to 5.5V (-10 to 40 °C)
86FH47A
−0.3 ~ 6.5
(a)−0.3 ~
6.5
86FH47B
(a)−0.3 ~ 6.0
Operating current varies with each product. For details, refer to the datacheet (electrical chracteristics) of each product.(Note4)
(Note3)
than 2.0V.
3.0V.
Flash memory, the Flash memory operates in an intermittent manner causing peak currents in the Flash memory momentarily, as shown in Figure. in this case, the supply current IDD(in NORMAL1,NORMAL2 and SLOW1 mode) is defined as the sum of the average peak current and MCU current.
er 86xx47 series MCUs. The supply current is defined as follows; VIN of TEST pin: VIN ≤ 0.1V(86FH47B), VIN ≤ 0.2V(others) It is described in the section "Electrical characteristics" of TMP86FH47B in detail.
n
Program counter (PC)
n+1n+2n+3
1 machine cycle(4/fc or 4/fs)
MCU current
I
[mA]
DDP-P
Typ. current
Momentary Flash current
Max. current
Sum of average momentary
Flash current and MCU curren
2.2.3Operation Mode Control Circuit ......................................................................................................................................11
2.2.3.1Single-clock mode
2.2.3.2Dual-clock mode
2.2.3.3STOP mode
2.2.4Operating Mode Control ..................................................................................................................................................16
3.4.1Interrupt acceptance processing is packaged as follows. ................................................................................................35
6.3.1Selection of Address Trap in Internal RAM (ATAS) .....................................................................................................56
6.3.2Selection of Operation at Address Trap (ATOUT) .........................................................................................................56
10.3.2Transfer bit direction.....................................................................................................................................................108
11.9.4Receive Data Buffer Full..............................................................................................................................................129
11.9.5Transmit Data Buffer Empty.........................................................................................................................................129
12.6.1Analog input pin voltage range.....................................................................................................................................139
14.2.4Product ID Entry...........................................................................................................................................................146
14.2.5Product ID Exit..............................................................................................................................................................146
14.3Toggle Bit (D6)...................................................................................................................147
14.4Access to the Flash Memory Area......................................................................................148
14.4.1Flash Memory Control in the Serial PROM Mode......................................................................................................148
14.4.1.1How to write to the flash memory by executing the control program in the RAM area (in the RAM loader mode within the
14.4.2Flash Memory Control in the MCU mode...................................................................................................................150
14.4.2.1How to write to the flash memory by executing a user write control program in the RAM area (in the MCU mode)
15.3.1Serial PROM Mode Control Pins.................................................................................................................................154
15.3.4Activating the Serial PROM Mode...............................................................................................................................156
15.10.2Handling of Password Error........................................................................................................................................177
15.10.3Password Management during Program Development..............................................................................................177
15.11Product ID Code................................................................................................................178
15.12Flash Memory Status Code...............................................................................................178
15.13Specifying the Erasure Area..............................................................................................180
15.14Port Input Control Register...............................................................................................180
is a single-chip 8-bit high-speed and high-functionality microcomputer incorporating
16384 bytes of Flash Memory. It is pin-compatible with the TMP86CH47AUG/TMP86C847UG (Mask ROM version). The TMP86FH47BUG can realize operations equivalent to those of the TMP86CH47AUG/TMP86C847UG
by programming the on-chip Flash Memory.
This product uses the Super Flash® technology under the licence of Silicon Storage Technology, Inc. Super Flash® is registered trademark of Silicon Storage
Technology, Inc.
Page 1
RA000
1.1 Features
TMP86FH47BUG
10. 10-bit successive approximation type AD converter
has MCU mode, parallel PROM mode, and serial PROM mode. Table 1-1 shows the
pin functions in MCU mode. The serial PROM mode is explained later in a separate chapter.
Table 1-1 Pin Names and Functions(1/3)
Pin Name
P07
INT4
P06
SCK
P05
SI
P04
SO
P03
TXD
P02
RXD
BOOT
P01
TC4
PDO4/PWM4/PPG4
Pin NumberInput/OutputFunctions
17
16
15
14
13
12
11
IOIPORT07
External interrupt
IOIOPORT06
Serial clock
IOIPORT05
Serial data
IOOPORT04
Serial data
IOOPORT03
UART data
IO
PORT02
I
UART data
I
Serial PROM mode control input
IO
PORT01
I
TC4 input
O
PDO4/PWM4/PPG4
input/output
input
output
output
input
4 input
output
P00
INT0
P1718IOPORT17
P1619IOPORT16
P15
INT3
P14
PPG
P13
DVO
P12
INT2
TC1
P11
INT1
P10
PDO3/PWM3
TC3
P22
XTOUT
10
20
21
22
23
24
25
7
IOIPORT00
External interrupt
IOIPORT15
External interrupt
IOOPORT14
PPG output
IOOPORT13
Divider Output
IO
PORT12
I
External interrupt
TC1 input
I
IOIPORT11
External interrupt
IO
PORT10
O
PDO3/PWM3 output
I
IO
O
input
TC3
PORT22
Resonator connecting
nal clock
0 input
3 input
2 input
1 input
pins(32.768kHz) for inputting exter-
RA000
P21
XTIN
PORT21
6
IO
Resonator connecting
I
nal clock
pins(32.768kHz) for inputting exter-
Page 5
1.4 Pin Names and Functions
Table 1-1 Pin Names and Functions(2/3)
TMP86FH47BUG
P20
STOP
INT5
P37
AIN7
STOP5
P36
AIN6
STOP4
P35
AIN5
STOP3
P34
AIN4
STOP2
P33
AIN3
P32
AIN2
P31
AIN1
Pin Name
Pin NumberInput/OutputFunctions
IO
PORT20
9
33
32
31
30
29
28
27
I
STOP mode
External interrupt 5 input
I
IO
PORT37
I
Analog Input7
I
STOP5
IO
PORT36
I
Analog Input6
I
STOP4
IO
PORT35
I
Analog Input5
I
STOP3
IO
PORT34
I
Analog Input4
I
STOP2
IOIPORT33
Analog Input3
IOIPORT32
Analog Input2
IOIPORT31
Analog Input1
release signal input
input
input
input
input
P30
AIN0
P4744IOPORT47
P4643IOPORT46
P4542IOPORT45
P4441IOPORT44
P4340IOPORT43
P4239IOPORT42
P4138IOPORT41
P4037IOPORT40
XIN2IResonator connecting pins for high-frequency clock
XOUT3OResonator connecting pins for high-frequency clock
RESET8IOReset signal
TEST4ITest pin for out-going test. Normally, be fixed to low.
VAREF34IAnalog Base Voltage Input Pin for A/D Conversion
26
IOIPORT30
Analog Input0
Table 1-1 Pin Names and Functions(3/3)
Pin NamePin NumberInput/OutputFunctions
AVDD35IAnalog Power Supply
AVSS36IAnalog Power Supply
VDD5I+5V
VSS1I0(GND)
Page 6
RA000
2.Operational Description
TMP86FH47BUG
2.1 CPU
Core Functions
The CPU core consists of a CPU, a system clock controller, and an interrupt controller.
This section provides a description of the CPU core, the program memory, the data memory, and the reset circuit.
2.1.1 Memory Address Map
The TMP86FH47BUG memory is composed Flash, RAM, DBR(Data buffer register) and SFR(Special function register). They are all mapped in 64-Kbyte address space. Figure 2-1 shows the TMP86FH47BUG memory address map.
SFR
RAM
DBR
0FFF
C000
Flash
FFC0
FFDF
FFE0
FFFF
0000
H
003F
H
0040
H
023F
H
0F80
H
H
H
H
H
H
H
64 bytes
512
bytes
128
bytes
16384
bytes
SFR:
Vector table for vector call instructions
(32 bytes)
Vector table for interrupts
(32 bytes)
Special function register includes:
I/O ports
Peripheral
Peripheral status registers
System control registers
Program status word
RAM:
Random access memory includes:
Data memory
Stack
DBR: Data buffer register includes:
Peripheral control
Peripheral status registers
Flash: Program memory
control registers
registers
Figure 2-1 Memory Address Map
2.1.2 Program
The TMP86FH47BUG has a 16384 bytes (Address C000H to FFFFH) of program memory (Flash).
Memory (Flash)
2.1.3 Data Memory (RAM)
The TMP86FH47BUG has 512bytes (Address 0040H to 023FH) of internal RAM. The first 192 bytes
(0040H to 00FFH) of the internal RAM are located in the direct area; instructions with shorten operations
are available against such an area.
Page 7
2. Operational Description
2.2 System Clock Controller
The data memory contents become unstable when the power supply is turned on; therefore, the data memory should be initialized by an initialization routine.
Example :Clears RAM to “00H”. (TMP86FH47BUG)
SRAMCLR:LD(HL), A
2.2 System Clock Controller
TMP86FH47BUG
LDHL, 0040H; Start address setup
LDA, H; Initial value (00H) setup
LDBC, 01FFH
INCHL
DECBC
JRSF, SRAMCLR
The system clock controller consists of a clock generator, a timing generator, and a standby controller.
Timing generator control register
TBTCR
0036
H
Timing
generator
System clocks
Standby controller
0038
H
0039
System control registers
XIN
XOUT
XTIN
XTOUT
Clock
generator
fc
High-frequency
clock oscillator
fs
Low-frequency
clock oscillator
Clock generator control
Figure 2-2 System Clock Control
2.2.1 Clock Generator
The clock generator generates the basic clock which provides the system clocks supplied to the CPU core
and peripheral hardware. It contains two oscillation circuits: One for the high-frequency clock and one for
the low-frequency clock. Power consumption can be reduced by switching of the standby controller to low-power operation based on the low-frequency clock.
H
SYSCR2SYSCR1
The high-frequency (fc) clock and low-frequency (fs) clock can easily be obtained by connecting a resonator between the XIN/XOUT and XTIN/XTOUT pins respectively. Clock input from an external oscillator is also possible. In this case, external clock is applied to XIN/XTIN pin with XOUT/XTOUT pin not connected.
Page 8
TMP86FH47BUG
(a) Crystal/Ceramic
resonator
Note:The function to monitor the basic clock directly at external is not provided for hardware, however,
High-frequency clock
XOUTXIN
(b) External oscillator
XOUTXIN
(Open)
XTIN
(c) Crystal(d) External oscillator
Low-frequency clock
XTOUT
XTIN
XTOUT
(Open)
Figure 2-3 Examples of Resonator Connection
with disabling all interrupts and watchdog timers, the oscillation frequency can be adjusted by monitoring the pulse which the fixed frequency is outputted to the port by the program.
The system to require the adjustment of the oscillation frequency should create the program for the adjustment in advance.
Page 9
2. Operational Description
2.2 System Clock Controller
2.2.2 Timing Generator
The timing generator generates the various system clocks supplied to the CPU core and peripheral hardware from the basic clock (fc or fs). The timing generator provides the following functions.
TMP86FH47BUG
1. Generation of main system clock
2. Generation of divider output (DVO) pulses
3. Generation of source clocks for time base timer
4. Generation of source clocks for watchdog timer
5. Generation of internal source clocks for timer/counters
6. Generation of warm-up clocks for releasing STOP mode
2.2.2.1 Configuration of timing generator
The timing generator consists of a 2-stage prescaler, a 21-stage divider, a main system clock generator,
and machine cycle counters.
An input clock to the 7th stage of the divider depends on the operating mode, SYSCR2<SYSCK> and
TBTCR<DV7CK>, that is shown in Figure 2-4. As reset and STOP mode started/canceled, the prescaler
and the divider are cleared to “0”.
SYSCK
DV7CK
High-frequency
clock fc
Low-frequency
clock fs
fc/4
12143287109121114131615
5 617 18 19 20 21
S
A
Y
B
Multi-
plexer
fc or fs
Machine cycle countersMain system clock generator
Divider
B0
B1
A0
A1
S
Y0
Y1
Multiplexer
Warm-up
controller
Watchdog
timer
Timer counter, Serial interface, Time-base-timer, divider output, etc. (Peripheral functions)
Figure 2-4 Configuration of Timing Generator
Page 10
Timing Generator Control Register
TMP86FH47BUG
TBTCR
(0036H)
Note 1: In single clock mode, do not set DV7CK to “1”.
Note 2: Do not set “1” on DV7CK while the low-frequency clock is not operated stably.
Selection of input to the 7th stage
of the divider
0: fc/28 [Hz]
1: fs
2.2.2.2 Machine cycle
Instruction execution and peripheral hardware operation are synchronized with the main system clock.
The minimum instruction execution unit is called an “machine cycle”. There are a total of 10 different
types of instructions for the TLCS-870/C Series: Ranging from 1-cycle instructions which require one machine cycle for execution to 10-cycle instructions which require 10 machine cycles for execution. A machine cycle consists of 4 states (S0 to S3), and each state consists of one main system clock.
R/W
1/fc or 1/fs [s]
Main system clock
State
Machine cycle
Figure 2-5 Machine Cycle
2.2.3 Operation Mode Control Circuit
The operation mode control circuit starts and stops the oscillation circuits for the high-frequency and low-frequency clocks, and switches the main system clock. There are three operating modes: Single clock mode, dual clock mode and STOP mode. These modes are controlled by the system control registers (SYSCR1 and
SYSCR2). Figure 2-6 shows the operating mode transition diagram.
2.2.3.1 Single-clock mode
Only the oscillation circuit for the high-frequency clock is used, and P21 (XTIN) and P22 (XTOUT)
pins are used as input/output ports. The main-system clock is obtained from the high-frequency clock. In
the single-clock mode, the machine cycle time is 4/fc [s].
S3S2S1S0S3S2S1S0
(1) NORMAL1 mode
In this mode, both the CPU core and on-chip peripherals operate using the high-frequency clock.
The TMP86FH47BUG is placed in this mode after reset.
Page 11
2. Operational Description
2.2 System Clock Controller
TMP86FH47BUG
(2) IDLE1 mode
In this mode, the internal oscillation circuit remains active. The CPU and the watchdog timer are hal-
ted; however
on-chip peripherals remain active (Operate using the high-frequency clock).
IDLE1 mode is started by SYSCR2<IDLE> = "1", and IDLE1 mode is released to NORMAL1
mode by an interrupt request from the on-chip peripherals or external interrupt inputs. When the
IMF (Interrupt master enable flag) is “1” (Interrupt enable), the execution will resume with the acceptance of the interrupt, and the operation will return to normal after the interrupt service is completed.
When the IMF is “0” (Interrupt disable), the execution will resume with the instruction which follows the IDLE1 mode start instruction.
(3) IDLE0 mode
In this mode, all the circuit, except oscillator and the timer-base-timer, stops operation.
This mode is enabled by SYSCR2<TGHALT> = "1".
When IDLE0 mode starts, the CPU stops and the timing generator stops feeding the clock to the peripheral circuits other than TBT. Then, upon detecting the falling edge of the source clock selected
with TBTCR<TBTCK>, the timing generator starts feeding the clock to all peripheral circuits.
When returned from IDLE0 mode, the CPU restarts operating, entering NORMAL1 mode back
again. IDLE0 mode is entered and returned regardless of how TBTCR<TBTEN> is set. When IMF
= “1”, EF6 (TBT interrupt individual enable flag) = “1”, and TBTCR<TBTEN> = “1”, interrupt processing is performed. When IDLE0 mode is entered while TBTCR<TBTEN> = “1”, the INTTBT interrupt latch is set after returning to NORMAL1 mode.
2.2.3.2 Dual-clock mode
Both the high-frequency and low-frequency oscillation circuits are used in this mode. P21 (XTIN) and
P22 (XTOUT) pins cannot be used as input/output ports. The main system clock is obtained from the highfrequency clock in NORMAL2 and IDLE2 modes, and is obtained from the low-frequency clock in
SLOW and SLEEP modes. The machine cycle time is 4/fc [s] in the NORMAL2 and IDLE2 modes, and
4/fs [s] (122 μs at fs = 32.768 kHz) in the SLOW and SLEEP modes.
The TLCS-870/C is placed in the single-clock mode during reset. To use the dual-clock mode, the lowfrequency oscillator should be turned on at the start of a program.
(1) NORMAL2 mode
In this mode, the CPU core operates with the high-frequency clock. On-chip peripherals operate us-
ing the high-frequency clock and/or low-frequency clock.
(2) SLOW2 mode
In this mode, the CPU core operates with the low-frequency clock, while both the high-frequency
clock and the low-frequency clock are operated. As the SYSCR2<SYSCK> becomes "1", the hardware changes into SLOW2 mode. As the SYSCR2<SYSCK> becomes “0”, the hardware changes into NORMAL2 mode. As the SYSCR2<XEN> becomes “0”, the hardware changes into SLOW1
mode. Do not clear SYSCR2<XTEN> to “0” during SLOW2 mode.
(3) SLOW1 mode
This mode can be used to reduce power-consumption by turning off oscillation of the high-frequency clock. The CPU core and on-chip peripherals operate using the low-frequency clock.
Page 12
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