LG 47LE5300, 47LE5300-ZA, 47LE530N, 47LE530N-ZA Service Manual

INPUT
MENU
P
OK
/I
LED LCD TV
CAUTION
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LD01D
MODEL : 47LE5300 47LE5300-ZA
MODEL : 47LE530N
47LE530N-ZA
North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in KoreaP/NO : MFL62863031 (1002-REV00)
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
BLOCK DIAGRAM...................................................................................15
EXPLODED VIEW .................................................................................. 17
SVC. SHEET ...............................................................................................
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's exposed METALLIC PARTS
Good Earth Ground such as WATER PIPE, CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15 uF
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 4 -
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10 % (by volume) Acetone and 90 % (by volume) isopropyl alcohol (90 % - 99 % strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500
°
F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire­bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.
(500
°F to 600 °F)
b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature
(500
°F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.
2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and solder it.
3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.
Power Output, Transistor Device Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit board.
3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow stake.
2. Securely crimp the leads of replacement component around notch at stake top.
3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).
1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.
1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement
.
4. Module General Specification
1. Application range
This specification is applied to the LED LCD TV used LD01D chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
1) Temperature : 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage : Standard input voltage (100 V - 240 V @ 50/60 Hz) * Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specification by part number in accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC:CE, IEC
No. Item Specification Remark
1 Display Screen Device 119 cm(47 inch) Wide color display module LED LCD
2 Aspect Ratio 16:9
3 LCD Module 119 cm(47 inch) TFT LCD Slim Edge LED FHD (100 Hz) LGD
4 Storage Environment Temp. : (-20 ~ 60) deg
Humidity : 10 % ~ 90 %
5 Input Voltage AC 100 V - 240 V~, 50/60 Hz
6 Power Consumption Power on (Blue)
LGD Typ : 111.6 W LCD (Module) + Backlight(Lamp)
8 Pixel Pitch 0.5415 mm x 0.5415 mm
9 Back Light Edge LED
10 Display Colors 1.06 Billion(FHD LGD), 16.7 M (others)
11 Coating 3H, AG
5. Module optical specification
1) Standard Test Condition (The unit has been ‘ON’)
2) Stable for approximately 30 minutes in a dark environment at 25 ºC ± 2 ºC.
3) The values specified are at approximate distance 50 Cm from the LCD surface
4) Ta=25 ºC ± 2 °C, VLCD=12.0 V, fv=120 Hz, Dclk=74.25 MHz, EXTV
BR-B=100 % IF165 mA(Typ)
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LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No. Item Specification Min. Typ. Max. Remark
1. Viewing Angle (CR>10) Right/Left(Up/Down) 178 Degree
2. Luminance Luminance (cd/m
2
) 450
Variation - 1.3 MAX / MIN
3. Contrast Ratio CR 1000 1400
4. CIE Color Coordinates RED Rx
Ry
Green Gx
Gy Typ. Typ.
Blue Bx -0.03 +0.03
By
White Wx 0.279
Wy 0.292
6. Component Video Input (Y, C
B
/PB, CR/PR)
No.
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz)
1. 720x480 15.73 60.00 SDTV,DVD 480i
2. 720x480 15.63 59.94 SDTV,DVD 480i
3. 720x480 31.47 59.94 480p
4. 720x480 31.50 60.00 480p
5. 720x576 15.625 50.00 SDTV,DVD 625 Line
6. 720x576 31.25 50.00 HDTV 576p
7. 1280x720 45.00 50.00 HDTV 720p
8. 1280x720 44.96 59.94 HDTV 720p
9. 1280x720 45.00 60.00 HDTV 720p
10. 1920x1080 31.25 50.00 HDTV 1080i
11. 1920x1080 33.75 60.00 HDTV 1080i
12. 1920x1080 33.72 59.94 HDTV 1080i
13. 1920x1080 56.250 50 HDTV 1080p
14. 1920x1080 67.5 60 HDTV 1080p
No.
Specification
Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1. 720*400 31.468 70.08 28.321 For only DOS mode
2. 640*480 31.469 59.94 25.17 VESA
Input 848*480
60 Hz, 852*480 60 Hz
-> 640*480 60 Hz Display
3. 800*600 37.879 60.31 40.00 VESA
4. 1024*768 48.363 60.00 65.00 VESA(XGA)
5. 1280*768 47.78 59.87 79.5 WXGA
6. 1360*768 47.72 59.8 84.75 WXGA FHD Model
7. 1366*768 47.56 59.6 84.75 WXGA WXGA Model
8. 1280*1024 63.595 60.0 108.875 SXGA FHD model
9. 1280*720 45 60 74.25 720p DTV Standard
10. 1920*1080 66.587 59.93 138.625 WUXGA FHD model
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LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
7. RGB (PC)
8. HDMI Input
(1) DTV Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*400 31.468 70.08 28.321 HDCP
2. 640*480 31.469 59.94 25.17 VESA HDCP
3. 800*600 37.879 60.31 40.00 VESA HDCP
4. 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
5. 1280*768 47.78 59.87 79.5 WXGA HDCP
6. 1360*768 47.72 59.8 84.75 WXGA HDCP
7. 1440*1050 55.5 59.90 88.750 WSXGA Not used(Monitor Panel)
8. 1400*1050 64.744 59.948 101.00 WSXGA Not used(Monitor Panel)
9. 1680*1050 65.16 59.94 147.00 WSXGA Not used(Monitor Panel)
10. 1280*1024 63.595 60.0 108.875 SXGA HDCP/FHD model
11. 1920*1080 67.5 60.00 138.625 WUXGA HDCP/FHD model
(2) PC Mode
No. Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1. 720*480 31.469 /31.5 59.94 /60 27.00/27.03 SDTV 480P
2. 720*576 31.25 50 54 SDTV 576P
3. 1280*720 37.500 50 74.25 HDTV 720P
4. 1280*720 44.96 /45 59.94 /60 74.17/74.25 HDTV 720P
5. 1920*1080 33.72 /33.75 59.94 /60 74.17/74.25 HDTV 1080I
6. 1920*1080 28.125 50.00 74.25 HDTV 1080I
7. 1920*1080 26.97 /27 23.97 /24 74.17/74.25 HDTV 1080P
8. 1920*1080 33.716 /33.75 29.976 /30.00 74.25 HDTV 1080P
9. 1920*1080 56.250 50 148.5 HDTV 1080P
10. 1920*1080 67.43 /67.5 59.94 /60 148.35/148.50 HDTV 1080P
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Only for training and service purposes
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ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LED LCD TV with LD01D chassis.
2. Designation
1) The adjustment is according to the order which is
designated and which must be followed, according to the plan which can be changed only on agreeing.
2) Power Adjustment: Free Voltage
3) Magnetic Field Condition: Nil.
4) Input signal Unit: Product Specification Standard
5) Reserve after operation: Above 5 Minutes (Heat Run) Temperature : at 25 ºC ± 5 ºC Relative humidity : 65 % ± 10 % Input voltage : 220 V, 60 Hz
6) Adjustment equipments: Color Analyzer(CA-210 or CA-
110), DDC Adjustment Jig equipment, SVC remote control.
7) Push The “IN STOP” KEY - For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between computer, jig, and set.
3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
4) Click “Connect” tab. If “Can’t” is displayed, check
connection between computer, jig, and set.
5) Click “Auto” tab and set as below
6) Click “Run”.
7) After downloading, check “OK” message.
* USB DOWNLOAD
1) Put the USB Stick to the USB socket
2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low, it didn’t work. But your downloaded version is High, USB data is automatically detecting
3) Show the message “Copying files from memory”
filexxx.bin
(4)
(7) ……….OK
(5)
(6)
(1)
fil exxx.bi n
(2)
(3)
Please Check the Speed : To use speed between from 200KHz to 400KHz
Case1 : Software version up
1. After downloading S/W by USB, TV set will reboot automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “In-stop” key at first.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover channel information by itself.
3. After function inspection, Push “In-stop” key.
4) Updating is staring.
5) Uploading completed, The TV will restart automatically.
6) If your TV is turned on, check your updated version and Tool option.(explain the Tool option, next stage)
* If downloading version is more high than your TV have,
TV can lost all channel data. In this case, you have to channel recover. if all channel data is cleared, you didn’t have a DTV/ATV test on production line.
* After downloading, have to adjust Tool Option again.
1) Push "IN-START" key in service remote controller
2) Select “Tool Option 1” and Push “OK” button.
3) Punch in the number. (Each model hax their number)
4) Completed selecting Tool option.
3.1. ADC Process
(1) ADC
- Enter Service Mode by pushing “ADJ” key,
- Enter Internal ADC mode by pushing “
G
” key at “5. ADC
Calibration”
<Caution> Using ‘power on’ button of the Adjustment R/C,
power on TV.
* ADC Calibration Protocol (RS232)
Adjust Sequence
• aa 00 00 [Enter Adjust Mode]
• xb 00 40 [Component1 Input (480i)]
• ad 00 10 [Adjust 480i Comp1]
• xb 00 60 [RGB Input (1024*768)]
• ad 00 10 [Adjust 1024*768 RGB]
• aa 00 90 End Adjust mode * Required equipment : Adjustment R/C.
3.2. Function Check
* Check display and sound
- Check Input and Signal items. (cf. work instructions)
1) TV
2) AV (SCART1/SCART2/ CVBS)
3) COMPONENT (480i)
4) RGB (PC : 1024 x 768 @ 60hz)
5) HDMI
6) PC Audio In * Display and Sound check is executed by Remote control.
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LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Module Tool option1 Tool option2 Tool option3 Tool option4 Tool option5
LGD 32993 27448 57388 26893 8
Item CMD1 CMD2 Data0
Adjust ‘Mode In’ A A 0 0 When transfer the ‘Mode In’,
Carry the command.
ADC Adjust A D 1 0 Automatically adjustment
(The use of a internal pattern)
4. Total Assembly line process
4.1. Adjustment Preparation
· W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
· Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
* Connecting picture of the measuring instrument
(On Automatic control) Inside PATTERN is used when W/B is controlled. Connect to auto controller or push Adjustment R/C POWER ON -> Enter the mode of White-Balance, the pattern will come out.
* Auto-control interface and directions
1) Adjust in the place where the influx of light like floodlight around is blocked. (illumination is less than 10 lux).
2) Adhere closely the Color Analyzer (CA210) to the module less than 10 cm distance, keep it with the surface of the Module and Color Analyzer’s prove vertically.(80° ~ 100°).
3) Aging time
- After aging start, keep the power on (no suspension of power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others, check the back light on.
• Auto adjustment Map(RS-232C) RS-232C COMMAND [CMD ID DATA]
Wb 00 00 White Balance Start Wb 00 ff White Balance End
** Caution **
Color Temperature : COOL, Medium, Warm. One of R Gain/G Gain/ B Gain should be kept on 0xC0, and adjust other two lower than C0. (when R/G/B Gain are all C0, it is the FULL Dynamic Range of Module)
* Manual W/B process using adjusts Remote control.
• After enter Service Mode by pushing “ADJ” key,
• Enter White Balance by pushing “
G
” key at “6. White
Balance”.
* After done all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it is correctly same then unplug the AC cable. If it is not same, then correct it same with BOM and unplug AC cable. For correct it to the model’s module from factory JIG model.
* Push the “IN STOP” key after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
4.2. DDC EDID Write (RGB 128Byte )
• Connect D-sub Signal Cable to D-sub Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.3. DDC EDID Write (HDMI 256Byte)
• Connect HDMI Signal Cable to HDMI Jack.
• Write EDID Data to EEPROM(24C02) by using DDC2B protocol.
• Check whether written EDID data is correct or not.
* For SVC main Assembly, EDID have to be downloaded to
Insert Process in advance.
4.4. EDID DATA
1) All Data : HEXA Value
2) Changeable Data :
*: Serial No : Controlled / Data:01 **: Month : Controlled / Data:00 ***:Year : Controlled ****:Check sum
- 11 -
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
Cool 13,000 K X=0.269(±0.002)
Y=0.273(±0.002) <Test Signal>
Medium 9,300 K X=0.285(±0.002) Inner pattern
Y=0.293(±0.002) (216gray,85IRE)
Warm 6,500 K X=0.313(±0.002)
Y=0.329(±0.002)
Full White Pattern
COLOR ANALYZER TYPE: CA-210
RS-232C Communication
CA-210
RS-232C COMMAND MIN CENTER MAX
[CMD ID DATA] (DEFAULT)
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128
- Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.
* Edid data and Model option download (RS232)
- Manual Download
* Caution
1) Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
2) Never connect HDMI & D-sub Cable at the same time.
3) Use the proper cables below for EDID Writing
4) Download HDMI1, HDMI2, separately because HDMI1 is different from HDMI2
1) FHD RGB EDID data
2) FHD HDMI EDID data
* Detail EDID Options are below
Product ID
Serial No: Controlled on production line.Month, Year: Controlled on production line:
ex) Monthly : ‘02’ -> ‘02’
Year : ‘2009’ -> ‘13’
Model Name(Hex):
Checksum: Changeable by total EDID data.Vendor Specific(HDMI)
Model Name HEX EDID Table DDC Function
FHD Model 0001 01 00 Analog/Digital
LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
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MODEL MODEL NAME(HEX)
all 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
Item CMD1 CMD2 Data0
Download A A 0 0 When transfer the ‘Mode In’,
‘Mode In’ Carry the command.
Download A E 00 10 Automatically Download
(The use of a internal pattern)
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital : 3
Data(Hex)
1E6D
01
03
D-sub to D-sub DVI-D to HDMI or HDMI to HDMI
For HDMI EDID
For Analog EDID
INPUT MODEL NAME(HEX)
HDMI1 67030C001000B82D
HDMI2 67030C002000B82D
HDMI3 67030C003000B82D
HDMI4 67030C004000B82D
012 3 4 5 67 8 9 ABCD EF
00 00 FF FF FF FF FF FF 00 1E 6D ⓐⓑ 10 01 03 68 73 41 78 0A CF 74 A3 57 4C B0 23
20 09 48 4C A1 08 00 81 80 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 70 00
80 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
90 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
A0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
B0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
C0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
D0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
E0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
F0 FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF FF
012 3 4 5 67 8 9 ABCD EF
00 00 FF FF FF FF FF FF 00 1E 6D ⓐⓑ 10 01 03 80 73 41 78 0A CF 74 A3 57 4C B0 23
20 09 48 4C A1 08 00 81 80 61 40 45 40 31 40 01 01
30 01 01 01 01 01 01 02 3A 80 18 71 38 2D 40 58 2C
40 45 00 7E 8A 42 00 00 1E 01 1D 00 72 51 D0 1E 20
50 6E 28 55 00 7E 8A 42 00 00 1E 00 00 00 FD 00 3A 60 3E 1E 53 10 00 0A 20 20 20 20 20 20 70 01
80 02 03 26 F1 4E 10 1F 84 13 05 14 03 02 12 20 21 90 22 15 01 26 15 07 50 09 57 07 A0 E3 05 03 01 01 1D 80 18 71 1C 16 20 58 2C
B0 25 00 7E 8A 42 00 00 9E 01 1D 00 80 51 D0 0C 20
C0 40 80 35 00 7E 8A 42 00 00 1E 02 3A 80 18 71 38
D0 2D 40 58 2C 45 00 7E 8A 42 00 00 1E 66 21 50 B0
E0 51 00 1B 30 40 70 36 00 7E 8A 42 00 00 1E 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 F9
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LGE Internal Use OnlyCopyright ©2010 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4.5. V-COM Adjust(Only LGD(M+S) Module)
- Why need Vcom adjustment?
A The Vcom (Common Voltage) is a Reference Voltage of
Liquid Crystal Driving.
-> Liquid Crystal need for Polarity Change with every frame.
- Adjust sequence
· Press the PIP key of th ADJ remote control.(This PIP key is
hot key to enter the VCOM adjusting mode)
(Or After enter Service Mode by pushing “ADJ” key, then Enter V-Com Adjust mode by pushing “
G” key at “10. V-
Com”
· As pushing the right or the left key on the remote control,
and find the V-COM value which is no or minimized the Flicker. (If there is no flicker at default value, Press the exit key and finish the VCOM adjustment.)
· Push the “OK” key to store value. Then the message
“Saving OK” is pop.
· Press the exit key to finish VCOM adjustment.
(Visual Adjust and control the Voltage level)
4.6. Outgoing condition Configuration
- When pressing IN-STOP key by SVC remocon, Red LED are blinked alternatively. And then Automatically turn off.
(Must not AC power OFF during blinking)
4.7. Internal pressure
Confirm whether is normal or not when between power board’s ac block and GND is impacted on 1.5 kV(dc) or 2.2 kV(dc) for one second.
5. Model name & Serial number D/L
• Press “Power on” key of service remocon. (Baud rate : 115200 bps)
• Connect RS232 Signal Cable to RS-232 Jack.
• Write Serial number by use RS-232.
• Must check the serial number at the Diagnostics of SET UP menu. (Refer to below).
5.1. Signal TABLE
CMD : A0h LENGTH : 85~94h (1~16 bytes) ADH : EEPROM Sub Address high (00~1F) ADL : EEPROM Sub Address low (00~FF) Data : Write data CS : CMD + LENGTH + ADH + ADL + Data_1 +…+ Data_n Delay : 20ms
5.2. Command Set
* Description
FOS Default write : <7mode data> write Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart, 0, Phase Data write : Model Name and Serial Number write in
EEPROM.
5.3. Method & notice
A. Serial number D/L is using of scan equipment. B. Setting of scan equipment operated by Manufacturing
Technology Group.
C. Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory by D-book 4.0.
CMD LENGTH ADH ADL DATA_1 . . . Data_n CS DELAY
No. Adjust mode CMD(hex) LENGTH(hex
)
Description
1
EEPROM WRITE
A0h
84h+n
n-bytes Write (n = 1~16)
Row Li ne
Column Li ne
CLC
CST
Pane l
S
Y
S
T
E
M
Gat e Driv e IC
So urce D r iv e I C
Circuit Block
Tim i ng Cont r o ll er
Po w er Blo c k
V
COM
Gamma Ref er ence V oltage
Gamm a Re ference Volta ge
Data (R,G ,B) & C on tro l signal
Cont rol si gnal
Data (R,G,B ) & Cont rol si gnal
In t er fa ce
TFT
Po w er I np u t
Power Input
Da ta I n pu t
Da ta I n pu t
V
COM
Liquid Crys tal
V
COM
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