Leica DM8000M, DM12000M User Manual
Leica DM8000 M & DM12000 M
See More, Detect Faster –
High-throughput Inspection Systems
The New Class of Inspection Systems
Inspection, process control and defect analysis of wafers or LCDs
and TFTs has to be fast, accurate and ergonomic. Leica Microsystems has many years of experience in developing inspection
systems for the semiconductor industry. Using this expertise, we
have developed a totally new line of products for the inspection of
8 and 12 inch wafers.
The Leica DM8000 M and Leica DM12000 M optical inspection
systems provide an innovative yet cost-effective system solution
for mastering present and future inspection challenges with confi dence.
More image information in less time
New optical features offered by the
Leica DM8000 M such as the macro mode
or the oblique UV illumination (OUV) not
only improve resolving power but also
speed up sample throughput.
2
Larger field
Top resolution
for faster inspection
The Leica DM8000 M and the Leica DM12000 M
feature an integrated macro mode, giving you four
times the fi eld of view of conventional scanning
objectives. Seeing more means faster throughput.
from every angle
The new Oblique UV (OUV) mode combines
oblique illumination with UV light, which
enables you to view a sample in top resolution
from any angle – and enhances the accuracy
of the inspection results.
Higher quality
due to ergonomic design
An ergonomic design enables users to work in
comfort, enhancing their performance and ultimately improving the quality of their work. The
Leica DM8000 M/DM12000 M is specifi cally
designed to provide comfort for long hours at the
microscope, and is intuitively operated and easy
to adapt to different users’ microscopy skill levels.
LED illumination
for a cleaner environment
The LED illumination integrated in the
Leica DM8000 M/DM12000 M optimizes
the airfl ow and creates a cleaner cleanroom.
With their long lifetimes and low power
consumption, LEDs also have a lower cost of
ownership.
3
Loading...