Lanner LEC-2136 User Manual

Embedded &
Industrial Computing

Hardware Platforms for Embedded and Industrial Computing

LEC-2136
V1.1

>>

User's Manual

Publication date:2014-03-11

About

About

Overview

Icon Descriptions

The icons are used in the manual to serve as an indication
of interest topics or important messages. Below is a
description of these icons:

NOTE: This check mark indicates that

there is a note of interest and is something
that you should pay special attention to
while using the product.

Online Resources

The listed websites are links to the on-line product
information and technical support.

Resource Website

Lanner http://www.lannerinc.com

Product Resources

RMA http://eRMA.lannerinc.com

WARNING: This exclamation point

indicates that there is a caution or
warning and it is something that could
damage your property or product.

http://www.lannerinc.com/
download-center/

Acknowledgement

Intel, Pentium and Celeron are registered trademarks of
Intel Corp.

Microsoft Windows and MS-DOS are registered trademarks
of Microsoft Corp.

All other product names or trademarks are properties of
their respective owners.

Compliances and Certification

CE Certication

This product has passed the CE test for environmental
specifications. Test conditions for passing included the
equipment being operated within an industrial enclosure.
In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly
recommend the use of CE-compliant industrial enclosure
products.

FCC Class A Certication

This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required
to correct the interference at his own expense.

Revision History

Copyright and Trademarks

This document is copyrighted, © 2014 All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.

No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original
manufacturer assumes no responsibility for its use, nor for
any infringements upon the rights of third parties that
may result from such use.

Embedded and Industrial Computing

Version Changes

1.1 Change the super I/O chip to
W83627DHG-P

2

TTaTTable of Contentsbeable of Contents

Chapter 1: Introduction 4

System Specication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Package Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Chapter 2: System Components 6

System Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Front Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Rear Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chapter 3: Board Layout 10

External Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Internal Connectors and Jumpers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Connectors and Jumpers List. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

Jumper Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Chapter 4: Hardware Setup 16

Preparing the Hardware Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

System Memory Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Hard Disk Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

CompactFlash Card Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

3G SIM Card Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

3G Wireless Module Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Wall Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Appendix A: Programming Watchdog Timer 19

3

Chapter 1

Introduction

Chapter 1:
Introduction

Thank you for choosing the LEC-2136. This product has
an embedded ultra-low voltage Intel Pineview Processor
ATOM D525 (Dual Core,1M cache,1.8GHz) CPU, which
delivers power-efficient processing. This fanless and
compact platform can be broadly applied across industries
from networking, portable medical, industrial control
while maintaining low power consumption with good
performance.

Here is the list of key features:

Intel integrated Graphics Media Accelerator 3150 •
which supports VGA (up to 2048x1536)

One RJ-45 Management Port 10/100/1000 Mbps LAN •
(provided by 82574L)

5 10/100/1000 Mbps LAN (provided by Intel 82583V) •

One • Mini-PCIe expansion slots (paired with a SIM card

reader to support 3G Internet service)

One SATA hard disk and one CompactFlash support •

One RS-232 serial port via DB9 and one RS-232 serial •
port via pin headers

4 USB Type A connector •

System Specification

LEC 2 Series

Dimension (WxHxD)

Processor

Chipset

System

Memory

Storage

Ethernet Controller

Graphic Controller

IO

Power Input

Hardware Monitor

OS Support

Certications

Compliance
Operating Temperature Range
with
Commercial Components

Technology DDR3 667/800 MHz, non-ECC

Max. Capacity Up to 4GB

IDE CF socket Type I/II x1

SATA 2.5” HDD/SSD drive bay x1

VGA

LAN GbE RJ45 x6

Display

Video Grabber No

Serial I/O DB9 x1 for RS232;

USB 2.0 Type A x4
Power Input DC_in with Phoenix contact

Expansion

Others

LEC-2136

198x42x144.8mm
(7.722”x1.638”x5.6472”)

Intel Atom D525 1.8GHz

Intel ICH8M

1 x Intel 82574L LAN Chip
5 x Intel 82583V LAN Chip
Intel GMA3150

DB15 x1 for VGA, DVI-D
(sup to 2048x1536)

Mini-PCIe x1 (with SIM card
reader)
External: Power-on button,
Power-on switch, 3x SMA
antenna hole, reset.
Internal: PS/2 keyboard and
mouse
+24Vdc 2.5A
Winbond W83627DHG-P
integrated watchdog timer
1~255 level
Linux , XPE/WES2009, XP PRO
FES, WS7E, WS7P, WIN 7 PRO-E
CE, FCC Class A
No

-5~45°C/23~113°F

Embedded and Industrial Computing

4

Chapter 1

Package Contents

Your package contains the following items:

LEC-2136 Embedded System •

DC+12V 60W Power Adapter (24V 60W •
0P0W060240A01)

Serial-ATA/Power Cable (P/N: 080W1N2201001) •

Wall-Mounting Kit (P/N: SE • 9ESA900R100)

Drivers and User’s Manual CD •

Introduction

Embedded and Industrial Computing

5

Chapter 2

Chapter 2:
System Components

System Drawing

Mechanical dimensions of the LEC-2136

Unit: mm

System Components

Embedded and Industrial Computing

6