Lanner HCP-72i1 User Manual
Network
Application Platforms
Hardware platforms for next generation networking infrastructure
HCP-72i1
V1.0
User's Manual
Release Date: 2015/06/19
www.lannerinc.com
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Overview
Icon Descriptions
The icons are used in the manual to serve as an
indication of interest topics or important messages.
Below is a description of these icons:
NOTE: This check mark indicates
that there is a note of interest and is
something that you should pay special
attention to while using the product.
WARNING: This exclamation point
indicates that there is a caution or
warning and it is something that could
damage your property or product.
Online Resources
The listed websites are links to the on-line product
information and technical support.
Resource Website
Lanner http://www.lannerinc.com
Product
Resources
http://www.lannerinc.com/downloadcenter/
RMA http://eRMA.lannerinc.com
Copyright and Trademarks
This document is copyrighted, © 2014 All rights are
reserved. The original manufacturer reserves the right to
make improvements to the products described in this
manual at any time without notice.
No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual
is intended to be accurate and reliable. However, the
original manufacturer assumes no responsibility for its
use, nor for any infringements upon the rights of third
parties that may result from such use.
Acknowledgement
Intel, Pentium and Celeron are registered trademarks of
Intel Corp.
Microsoft Windows and MS-DOS are registered
trademarks of Microsoft Corp.
All other product names or trademarks are properties of
their respective owners.
Compliances
CE
This product has passed the CE test for environmental
specifications. Test conditions for passing included
the equipment being operated within an industrial
enclosure. In order to protect the product from being
damaged by ESD (Electrostatic Discharge) and EMI
leakage, we strongly recommend the use of CEcompliant industrial enclosure products.
FCC Class A
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference when the equipment is operated in a
commercial environment. This equipment generates,
uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction
manual, may cause harmful interference to radio
communications. Operation of this equipment in a
residential area is likely to cause harmful interference
in which case the user will be required to correct the
interference at his own expense.
Safety Guidelines
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during •
and after installation.
Do not wear loose clothing or jewelry that could •
get caught in the chassis. Fasten your tie or scarf
and roll up your sleeves.
Wear safety glasses if you are working under any •
conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential •
hazard to people or makes the equipment unsafe.
Disconnect all power by turning off the power and •
unplugging the power cord before installing or
removing a chassis or working near power supplies
Do not work alone if potentially hazardous •
conditions exist.
Never assume that power is disconnected from a •
circuit; always check the circuit.
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LITHIUM BATTERY CAUTION:
Risk of Explosion if Battery is replaced by an incorrect
type. Dispose of used batteries according to the
instructions
Operating Safety
Electrical equipment generates heat. Ambient air
temperature may not be adequate to cool equipment to
acceptable operating temperatures without adequate
circulation. Be sure that the room in which you choose to
operate your system has adequate air circulation.
Ensure that the chassis cover is secure. The chassis design
allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the
flow of cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment
and impair electrical circuitry. ESD damage occurs when
electronic components are improperly handled and can
result in complete or intermittent failures. Be sure to
follow ESD-prevention procedures when removing and
replacing components to avoid these problems.
Wear an ESD-preventive wrist strap, ensuring that it
makes good skin contact. If no wrist strap is available,
ground yourself by touching the metal part of the
chassis.
Periodically check the resistance value of the antistatic
strap, which should be between 1 and 10 megohms
(Mohms).
EMC Notice
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference when the equipment is operated in a
commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction
manual, may cause harmful interference to radio
communications. Operation of this equipment in a
residential area is likely to cause harmful interference
in which case users will be required to correct the
interference at their own expense.
Consignes de sécurité
Suivez ces consignes pour assurer la sécurité générale :
Laissez la zone du châssis propre et sans poussière •
pendant et après l’installation.
Ne portez pas de vêtements amples ou de bijoux qui •
pourraient être pris dans le châssis. Attachez votre
cravate ou écharpe et remontez vos manches.
Portez des lunettes de sécurité pour protéger vos •
yeux.
N’effectuez aucune action qui pourrait créer un •
danger pour d’autres ou rendre l’équipement
dangereux.
Coupez complètement l’alimentation en éteignant •
l’alimentation et en débranchant le cordon
d’alimentation avant d’installer ou de retirer un
châssis ou de travailler à proximité de sources
d’alimentation.
Ne travaillez pas seul si des conditions dangereuses •
sont présentes.
Ne considérez jamais que l’alimentation est coupée •
d’un circuit, vérifiez toujours le circuit. Cet appareil
génère, utilise et émet une énergie radiofréquence
et, s’il n’est pas installé et utilisé conformément aux
instructions des fournisseurs de composants sans
fil, il risque de provoquer des interférences dans les
communications radio.
Avertissement concernant la pile au
lithium
Risque d’explosion si la pile est remplacée par une •
autre d’un mauvais type.
Jetez les piles usagées conformément aux •
instructions.
L’installation doit être effectuée par un électricien •
formé ou une personne formée à l’électricité
connaissant toutes les spécifications d’installation et
d’appareil du produit.
Ne transportez pas l’unité en la tenant par le câble •
d’alimentation lorsque vous déplacez l’appareil.
La machine ne peut être utilisée qu’à un lieu fixe •
comme en laboratoire, salle d’ordinateurs ou salle de
classe.
Sécurité de fonctionnement
L’équipement électrique génère de la chaleur. La •
température ambiante peut ne pas être adéquate
pour refroidir l’équipement à une température de
fonctionnement acceptable sans circulation adaptée.
Vérifiez que votre site propose une circulation d’air
adéquate.
Vérifiez que le couvercle du châssis est bien •
fixé. La conception du châssis permet à l’air de
refroidissement de bien circuler. Un châssis ouvert
laisse l’air s’échapper, ce qui peut interrompre et
rediriger le flux d’air frais destiné aux composants
internes.
Les décharges électrostatiques (ESD) peuvent •
endommager l’équipement et gêner les circuits
électriques. Des dégâts d’ESD surviennent lorsque
des composants électroniques sont mal manipulés et
peuvent causer des pannes totales ou intermittentes.
Suivez les procédures de prévention d’ESD lors du
retrait et du remplacement de composants.
- Portez un bracelet anti-ESD et veillez à ce qu’il soit
bien au contact de la peau. Si aucun bracelet n’est
disponible, reliez votre corps à la terre en touchant la
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Consignes de sécurité électrique
Avant d’allumer l’appareil, reliez le câble de mise à la •
terre de l’équipement à la terre.
Une bonne mise à la terre (connexion à la terre) est •
très importante pour protéger l’équipement contre
les effets néfastes du bruit externe et réduire les
risques d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble •
de mise à la terre après avoir éteint l’appareil.
Un câble de mise à la terre est requis et la zone •
reliant les sections du conducteur doit faire plus de 4
mm2 ou 10 AWG.
Procédure de mise à la terre pour source
d’alimentation CC Procédure de mise à la
terre pour source d’alimentation CC
Desserrez la vis du terminal de mise à la terre. •
Branchez le câble de mise à la terre à la terre.•
L’appareil de protection pour la source •
d’alimentation CC doit fournir 30 A de courant.
Cet appareil de protection doit être branché à la
source d’alimentation avant l’alimentation CC.
Revision History
Version Date Descriptions
V0.1 2014/12/09 Preliminary
V1.0 2015/06/19 Ocial release
partie métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet
antistatique, qui doit être comprise entre 1 et 10
mégohms (Mohms).
Consignes de sécurité électrique
Avant d’allumer l’appareil, reliez le câble de mise à la •
terre de l’équipement à la terre.
Une bonne mise à la terre (connexion à la terre) est •
très importante pour protéger l’équipement contre les
effets néfastes du bruit externe et réduire les risques
d’électrocution en cas de foudre.
Pour désinstaller l’équipement, débranchez le câble de •
mise à la terre après avoir éteint l’appareil.
Un câble de mise à la terre est requis et la zone reliant •
les sections du conducteur doit faire plus de 4 mm2 ou
10 AWG.
Procédure de mise à la terre pour source
d’alimentation CC Procédure de mise à la
terre pour source d’alimentation CC
Desserrez la vis du terminal de mise à la terre. •
Branchez le câble de mise à la terre à la terre.•
L’appareil de protection pour la source d’alimentation •
CC doit fournir 30 A de courant.
Cet appareil de protection doit être branché à la source
d’alimentation avant l’alimentation CC.
pour refroidir l’équipement à une température de •
fonctionnement acceptable sans circulation adaptée.
Vérifiez que votre site propose une circulation d’air
adéquate.
Vérifiez que le couvercle du châssis est bien fixé. La •
conception du châssis permet à l’air de refroidissement
de bien circuler. Un châssis ouvert laisse l’air s’échapper,
ce qui peut interrompre et rediriger le flux d’air frais
destiné aux composants internes.
Les décharges électrostatiques (ESD) peuvent •
endommager l’équipement et gêner les circuits
électriques. Des dégâts d’ESD surviennent lorsque
des composants électroniques sont mal manipulés et
peuvent causer des pannes totales ou intermittentes.
Suivez les procédures de prévention d’ESD lors du
retrait et du remplacement de composants.
- Portez un bracelet anti-ESD et veillez à ce qu’il soit bien
au contact de la peau. Si aucun bracelet n’est disponible,
reliez votre corps à la terre en touchant la partie
métallique du châssis.
Vérifiez régulièrement la valeur de résistance du bracelet
antistatique, qui doit être comprise entre 1 et 10
mégohms (Mohms).
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Table of Contents
Chapter 1: Introduction 10
System Specification 10
Package Contents 11
Block Diagram 12
Physical Architecture of Lanner’s HybridTCA 13
Chapter 2: System Components 15
Mechanical Drawings 15
Front Components 16
Rear Components 17
Chapter 3: Motherboard Information 19
An Internal Glance of HCP-72i1 19
Jumper and Connector Location 21
Connectors and Jumpers List 22
Jumper Settings & Connectors Pin Definitions 23
Chapter 4: Hardware Installation 27
Preparing the Hardware Installation 27
Accessing the Components 27
Installing CPU and the Heat Sink 28
Installing the System Memory 29
Installing IPMI Card on OPMA Socket 29
Installing HDD/SSD 30
Replacing Network I/O Modules 31
Replacing Power Supply Units 31
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Replacing Cooling Fans 32
Rack Mounting 33
Chapter 5: BIOS Setup 36
Main 37
Advanced 38
WHEA Configuration 40
CPU Configuration 41
SATA Configuration 46
USB Configuration 48
Hardware Monitor 51
LAN Module Hardware Monitor 52
LAN Boot Select 53
Serial Port Console Redirection 54
COM Console Redirection Settings 55
Chipset 60
IOH Configuration 61
Intel (R) VT for Directed I/O Configuration 62
Boot 68
Security 75
Save & Exit 76
Chapter 6: IPMI Navigation 78
Getting Started 78
Dashboard 79
Remote Control 79
Remote Control -- Launched 80
Introducing the Remote Control Functions 81
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Configuration 87
DNS Server Settings 87
Mouse Mode Settings 88
Network Settings 89
Network Link Configuration 90
NTP Settings 91
Services 91
SSL Certificate Configuration 92
User Management 93
Remote Control 94
Console Redirection 94
Server Power Control 95
Maintenance 95
Firmware Update 96
Restore Factory Defaults 96
System Administrator 96
Chapter 7: About the PCIe-Switch Feature of HCP-72i1 98
Brief 98
Default Settings of PCI Express Switch 99
Demonstrating the Switching Methods for the PCIe Switch 99
Initializing the System for Re-planning the Arrangement of PCI Bus ID 100
Scenario 1: Bottom Board as Management Port, Device 2/3 Taken by Bottom Board 101
Scenario 2: Bottom Board as Management Port, Device 2/3 Returned to Upper Board 104
Description of PLX8748 Register 105
Management of the Control Register 105
Secondary Bus Reset 105
Virtual Switch 105
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Appendix 1: About the Non-Transparent Bridge 106
Appendix 2: Programming Watchdog Timer 110
Appendix 3: Setting up Console Redirections 110
Appendix 4: Programming the LCM 111
Appendix 5: On Linux 114
Appendix 6: Terms and Conditions 115
Warranty Policy 115
RMA Service 115
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Chapter 1
Introduction
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Chapter 1:
Introduction
Thank you for choosing HCP-72i1. HCP-72i1 is a
2U rackmount network security appliance built
with Lanner’s unique Hybrid Telecommunications
Computing Architecture (HybridTCA™).
HCP-72i1 integrates control, management and data
processing in one system and is positioned as an ideal
solution for datacenters and telecommunications
carriers. It comes with two x86 mainboards, each
supporting two Intel Xeon E5-2600 series “Ivy Bridge EP”
processors on LGA2011.
HCP-72i1 can be fitted, via the three (max.) swappable
I/O blades, with up to 36 1GbE network ports or 24
10GbE network ports in an array of SFP or copper
combinations. This particular appliance also comes with
8 quad-channel DDR3 modules and 2 removable SAS/
SATA HDD bays, future-proofing most of the expansion
needs.
SFeatures:
Intel Sandy/Ivy Bridge EP Xeon® Processor E5-2697 •
v2 CPUs, with Patsburge-B 602 PCH
2 x86 CPU Blades in the rear, each blade support •
Ivy-Bridge E5-2600 v2 Family up to 130W CPU
Dual Mainboard Communication is through NTB •
port up to 20 Gbs bi-way
Each Blade Support 16x R-DIMM•
3 network I/O Blades on the front•
IPMI Port for Remote Management•
Removable Fan Module•
NEBS Ready Design•
2 x 2.5” HDD Bay•
Hinge LCD Module for Easy Diagnostics and •
Configuration
System Specification
Form Factor 2U Rackmount
Platform
Processor
Options
Intel Sandy / Ivy Bridge EP (Intel®
Xeon® Processor E5-2697 v2 (30M
Cache, 2.70 GHz)
Dual 2011 pin LGA sockets
Chipset Intel Patsburg-B 602
BIOS
64Mb Flash Memory with AMI®
BIOS
System
Memory
Technology
16 x 240-pin DIMM Sockets per
board
Max. Capacity
Up to 32GB DDR3 1600 ECC Registered DIMM
Socket 16 x 240-pin DIMM Sockets
OS Support
Supports 32-bit/64-bit
operating systems
Storage HDD Bays 2 x SATA 2.5” HDD/SSD
Networking
Outputs (per
board)
Management
Port
1 x RJ-45 Intel 82574L Gigabit
supports 10BASE-T,100BASE-T, and
1000BASE-T
SYNC Port 1 x SFP+ port
LOM Port
1 x RJ-45 at 10/100/1000 base-T
speeds
Console Port 1 x RJ-45 port
Ethernet
Expansion
3 x LAN I/O blades for network
modules. Each I/O slot supports PCIe
x8 Gen 3.0
I/O Interface
(per board)
Reset Button
1 x reset button
Software reset by default
Console 1 x RJ45
USB
1 x USB 2.0
1 x USB 2.0 pin header
ESD 1 x ESD jack
SATA
1 x internal SATA II connector
1 x mini PCIe connector (serving as
mSATA)
LCM
128 x 64 Graph LCM with 4 key pad
Hinge LCM
1 LED for power,1 LED for Status
and 1 LED for HDD
Expansion (per
board)
PCIe
3 x PCIe Gen3.0x8 (to front side
module)
1 x PCIe Gen 3.0x8 (NTB)
1 x PCIe Gen2.0x4 (for front I/O)
1 x PCIe Gen2.0 (for Mgmt port)
PCI N/A
Power supply
AC redundant 1,200W hot-plug,
auto-switching 85/264V, 13A
DC redundant 1,010W hot-plug,
auto-switching, -36 to -76V, 30A
System Cooling
5 x system fans each layer
Supports smart fan feature
Environment
Operating
Temperature
0º to 50º C
Operating
Humidity
5% to 95%
Dimensions W 431 xH 88 x D 720(mm)
Certication RoHS
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Package Contents
Your package contains the following items:
HCP-72i1 Network Security Platform•
4 passive CPU heatsink•
2 power cords•
2 SATA cables•
1 crossover Ethernet cable (1.8 meters)•
1 straight-through Ethernet cable (1.8 meters)•
1 RJ-45 to DB-9 female console cable•
Drivers and user’s manual CD.•
Ordering Information
HCP-72i1 HybridTCA. High-performance Network
Appliance with 4 x IntelR XeonR E5-2600
series, (Sandy/Ivy-Bridge-EP) processor
+ 2 bays for 2.5” HDD with 3 Ethernet
modules
Optional Accessories
NCM-BPGC01A 12 ports GbE RJ-45, Gen 2 Bypass
NCM-BPGC01B 12 ports GbE RJ-45, Without Bypass
NCM-BPSC01A 12 ports GbE SFP, Without Bypass
NCM-BPX402A 4 ports 10G SFP+, Without Bypass
TCM-IXT801A 8 ports 10G SFP+, Without Bypass
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Molex
ZD
Conn
Molex
ZD
Conn
Molex
ZD
Conn
DDR3 x 8
DDR3 x 8
Intel Xeon
CPU1
Intel Xeon
CPU0
Patsburg
PCH
Back
plane
LAN Module
Bottom (Slot2)
LAN Module
Top (Slot0)
Intel Xeon
CPU0
(Another MB)
LAN Module
Middle (Slot1)
SATA HDD/SSD
Memory
Bus
Memory
Bus
QPI
DMI
USB
SATA
mSATA
USB2.0
SATA
OPMA
VGA
PCIEC1
PCIe x 8
PCIe x 8
PCIe x 8
I/O Board:
USB
Console
LOM
LAN controller
Cave
Creek
PCIe x 8 (NTB)
PCIe x 8
PCIe x 8
PCIe x 4
USB2.0
PCIe 1x
SPI
PCIe x1
MDI
Block Diagram
PCIe
Debug Pin Header
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Physical Architecture of Lanner’s HybridTCA
The diagram presents all necessary components of Lanner’s Hybrid TCA
architecture applied for HCP-72i1.
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Chapter 2
System Components
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Chapter 2:
System Components
Mechanical Drawings
Unit: mm
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Front Components
Component Description
F1 Console
RJ-45 console port for connecting to a computer terminal
for local, out-of-band diagnostic or configuration
purpose.
F2 LCM
128 x 64 Graph LCM with 4 key pad•
Hinge LCM•
1 LED for power, 1 LED for Status and 1 LED for HDD•
F3 USB 2.0 Ports USB 2.0 type A connectors.
F4 Onboard Management Port RJ-45 onboard management port
F5 IPMI ports IPMI ports
F6 LCM Unlock Button
Push it to unlock LCM pad to access the two 2.5” drive
bays
F7 ESD Jack 1 x ESD Jack
F8 GND Ground
F9 Other RJ-45/SFP+ ports
Network ports (number and type of network ports may
vary depending on the modules installed)
F2
F1
F3
F1
F5
F4
F3
F6
F9
F7
F8
F5
F4
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Rear Components
Component Description
R1 Cooling fans 5x cooling fans each layer
R2 Power supply Redundent power supply for each layer
R3 Power Switch Turn on/off of the system
R1 R2
R3
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Chapter 3
Motherboard Information
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An Internal Glance of HCP-72i1
The inside of HCP-72i1 is designed based on Lanner’s exclusive HybridTCA structure. This hybrid design integrates
two identical, high-performance motherboards for optimal system boost.
Chapter 3:
Motherboard Information
Upper Board
Bottom Board
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An Internal Glance of HCP-72i1
HCP-72i1 can be connected with up to 3 LAN modules for networking applications. The image below shows the
LAN module “TCM-IXT801A”.
SFP+ 10G ports
Power
PCIe Hot-Swap
PCIe
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Jumper and Connector Location
The illustration below presents the jumper and
connector location of each board.
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Connectors and Jumpers List
The tables below list the jumper and connector label of each board.
Labels Function
FAN1~5 FAN connectors
J14 Front Panel Reset Button Setting
CONN2 Power-On Button Pin Header
J12 CPLD Flash Pin Header
MPCIE1 Mini PCIe Socket
USBA1 USB connector
JSDO23 Security Override
J13 LPC Port 80
SPIROM1 SPI Flash ROM Update Pin Header
J23 SATA Connector
J26 SATA Re-driver Value Flash Pin Header
J11 CMOS clear
VGA1 VGA connector
CONN3 Hot Swap LED Pin Header
CONN1 Hot Swap MRL (Manual Retention Latch) Pin Header
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Jumper Settings & Connectors Pin
Definitions
FAN connectors (FAN1~5):
Five-pin FAN connectors
FAN1
Pin Description
1 HM_PWMOUT1
2 FAN_TECH_IN_FAN1
3 FAN_TECH_IN_FAN2
4 12V
5 GND
FAN2
Pin Description
1 HM_PWMOUT2
2 FAN_TECH_IN_FAN7
3 FAN_TECH_IN_FAN8
4 12V
5 GND
FAN3
Pin Description
1 HM_PWMOUT1
2 FAN_TECH_IN_FAN3
3 FAN_TECH_IN_FAN4
4 12V
5 GND
FAN4
Pin Description
1 HM_PWMOUT2
2 FAN_TECH_IN_FAN9
3 FAN_TECH_IN_FAN10
4 12V
5 GND
FAN5
Pin Description
1 HM_PWMOUT3
2 FAN_TECH_IN_FAN5
3 FAN_TECH_IN_FAN6
4 12V
5 GND
Front Panel Reset Button Setting(J14)
The jumper setting for selecting hardware reset or
software reset. Software reset is the default option.
Pin Description
1-2 Hardware reset
2-3 Software reset (default)
Power-On Button (CONN2)
Pin Description
1 GND
2 PWR_BUTTON
CPLD Flash Pin Header (J12):
Complex Programmable Logic Device can be used to
bridge JTAG and ash memory data interface
Pin Description
1 3.3V standby
2 JIAG_PLD_TDO
3 JTAG_PLD_TDI
4 NC
5 NC
6 JTAG_PLD_TMS
7 GND
8 JTAG_PLD_TCK
CONN2
1
2
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Mini-PCIe socket (MPCIE1):
Serves as mSATA storage socket
Pin Description Pin Description
1 NC 2 3.3V
3 NC 4 GND
5 NC 6 NC
7 NC 8 NC
9 GND 10 NC
11 PCIe Clock_N 12 NC
13 PCIe Clock_P 14 NC
15 GND 16 NC
Mechanical key
17 NC 18 3.3V
19 NC 20 NC
21 GND 22 PCIe Reset#
23 SATA_RX_N 24 3.3V
25 SATA_RX_P 26 GND
27 GND 28 NC
29 GND 30 NC
31 SATA_TX_N 32 NC
33 SATA_TX_P 34 GND
35 GND 36 NC
37 GND 38 NC
39 3.3V 40 GND
41 3.3V 42 NC
43 GND 44 NC
45 NC 46 NC
47 NC 48 NC
49 Active#/LED 50 GND
51 NC 52 3.3V
USB connector (USBA1)
Pin Description Pin Description
1 5V 2 5V
3 USB2- 4 USB35 USB2+ 6 USB3+
7 USB23GND 8 USB23GND
9 USB23GND 10 USB23GND
Security Override (JSDO23)
FLASH DESCRIPTOR SECURITY OVERRIDE WHEN HIGH
(Default Not Connect)
Port 80 (J13): This is the Port 80h, which is used as
BIOS debug port. Once the system is initialized, BIOS
will send POST (Power-On Self-Test) codes to Port 80.
If POST fails, the last generated POST code will be left
in Port 80. This is used for debug purpose. If a sevensegment display is connected, the hexadecimal BIOS
debug code will appear.
Pin Description Pin Description
1 CLK_33M_P80 2 LPC_LAD_1
3 RST_PORT80_N 4 LPC_LAD_0
5 LPC_FRAME_N 6 3.3V
7 LPC_LAD_3 8 X
9 LPC_LAD_2 10 GND
SPIROM1:
SPI ROM pin header
Pin Description Pin Description
1 No Connect 2 No Connect
3 Dual_CS00_N 4 3.3V
5 SPI_MISO_DUAL 6 SPI_HOLD0_L
7 No Connect 8 SPI_CLK_DUAL
9 GND 10 SPI_MOSI_DUAL
1 2 9
10
USBA1
J13
9
10
2
1
SPI-ROM1
9
10
2
1
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SATA (J23): used to connect SATA disk drive
Pin Description
1 GND
2 TX+
3 TX4 GND
5 RX6 RX+
7 GND
SATA Re-Driver value flash (J26)
SATA signal redriver and conditioner
Pin Description
1 PCIE_R_SDA2
2 3.3V
3 PCIE_R_SCL2
4 MOSI2
5 REST_MCU2#
6 GND
CMOS clear (J11): clear CMOS jumper
Pin Description
Short 1-2 (default) Normal
Short 2-3 Clear CMOS
VGA connector (VGA1): VGA display
Pin Description Pin Description
1 RED 2 GND
3 GREEN 4 GND
5 BLUE 6 GND
7 HSYNC 8 X
9 VSYNC 10 GND
11 DDC_DATA_CONT 12 DDC_CLK_CONT
Hot swap LED(CONN3)
Pin Description
1 LED_P
2 LED_N
Hot swap MRL(Manual Retention Latch) pin
header(CONN1)
Pin Description
1 Power Enable#
2 GND
CONN3
1
2
CONN1
1
2
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Chapter 4
Hardware Installation
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Chapter 4:
Hardware Installation
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING:
1. To avoid the risk of personal injury, electric shock, or
damage to the equipment, please remove all power
connections as well as all power sources.
2. Please wear ESD gloves to avoid potential injury or
damage.
Accessing the Components
1. Due to the hybrid architecture of HCP-72i1, you may
access the Upper Board or the Bottom Board. First, locate
the rear lock-handles and lock-screws. There should be 2
pairs on each side: two for the Upper Board and the other
two for the Bottom Board.
2. To access the Bottom Board, loosen the two lockscrews and then pull the two lock-handles.
3. Pull the blade out while holding the lock-handles.
4. To return the bottom blade to its original place, simply
push it to the end and use the two lock-handles and lockscrews to secure it.
5. To access the Upper Board, use the same method from
Step 2 and 3.
6. Pull the top blade out while holding the lock-handles.
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Installing CPU and the Heat Sink
Follow the procedures below for installing a CPU
1. Locate the CPU socket(s)
2. Press the left load lever down, move it out of the
retention tab. Then, do the same to the right. There are
two levers for each CPU socket.
3. Lift the load levers.
4. Open the load plate and also the protective cap.
Press down
Press down
Load plate
Protective cap
5. Align the CPU and the notch on the socket. The CPU should
fit perfectly into the socket. Note that the CPU fits in the
socket in only one direction.
6. Put the protective cap onto the CPU. Close the load plate
and push the load lever to lock it back to the retention tab.
7. Put the heat sink on the installed CPU and match the
screws with the screw holes on the board. Fasten two screws
which are opposite to each other at a time and then the other
two. It is easier this way to avoid the force of spring.
Place the heat sink cover on top of the installed heat sink and
fasten it with screws on the chassis.
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Installing IPMI Card on OPMA Socket
The motherboard of HCP-72I1 comes with a OPMA
socket for IPMI card installation.
1. Locate the OPMA socket.
2. Insert your IPMI card. Make sure the notches
between the card and the socket are aligned.
3. Your IPMI card may come with a display connector.
You may use a cable for connections.
Installing the System Memory
The motherboard supports DDR3 memory to meet the
higher bandwidth requirement of the latest operating
system and Internet applications. It comes with two
double data rate type three (DDR3) Small Outline Dual
Inline Memory Modules (SO-DIMM) sockets.
1. Power o the system
2. Locate the DIMM socket
3. Pull open the latches
4. Align the module and the socket and then insert
the module into the socket. Make sure the notches
are aligned. Press the module until it's fully seated and
close the latches.
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Installing HDD/SSD
The system is built to accommodate two 2.5” SATA disk
drives. Please follow instructions below.
1. The two 2.5” SATA disk drives are located behind the
hinge LCM. Rotate and loosen the lock-screw.
2. Open the hinge LCM and locate the HDD/SSD bays as
the images shown below.
3. Push the disk drive lock as the arrow of direction in the
image below. Then the disk drive bay will be released out.
4. Insert your HDD/SSD into the bay by aiming the SATA
connector of the drive as the arrow of direction in the
image shown below. Remember to use screws to fix both
sides of the disk drives.
SATA Connector direction
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