Hardware platforms for next generation networking infrastructure
FW-7575
V1.0
>>
User's Manual
Publication date:2013-03-14
About
About
Overview
Icon Descriptions
The icons are used in the manual to serve as an indication
of interest topics or important messages. Below is a
description of these icons:
NOTE: This check mark indicates that
there is a note of interest and is something
that you should pay special attention to
while using the product.
Online Resources
The listed websites are links to the on-line product
information and technical support.
ResourceWebsite
Lannerhttp://www.lannerinc.com
P r o d u c t
Resources
RMAhttp://eRMA.lannerinc.com
WARNING: This exclamation point
indicates that there is a caution or
warning and it is something that could
damage your property or product.
http://assist.lannerinc.com
Acknowledgement
Intel, Pentium and Celeron are registered trademarks of
Intel Corp.
Microsoft Windows and MS-DOS are registered trademarks
of Microsoft Corp.
All other product names or trademarks are properties of
their respective owners.
Compliances
CE
This product has passed the CE test for environmental
specifications. Test conditions for passing included the
equipment being operated within an industrial enclosure.
In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly
recommend the use of CE-compliant industrial enclosure
products.
FCC Class A
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required
to correct the interference at his own expense.
No part of this manual may be reproduced, copied,
translated or transmitted in any form or by any means
without the prior written permission of the original
manufacturer. Information provided in this manual is
intended to be accurate and reliable. However, the original
manufacturer assumes no responsibility for its use, nor for
any infringements upon the rights of third parties that
may result from such use.
Network Application Platforms
Follow these guidelines to ensure general safety:
Keep the chassis area clear and dust-free during and after •
installation.
Do not wear loose clothing or jewelry that could get •
caught in the chassis. Fasten your tie or scarf and roll up
your sleeves.
Wear safety glasses if you are working under any •
conditions that might be hazardous to your eyes.
Do not perform any action that creates a potential hazard •
to people or makes the equipment unsafe.
Disconnect all power by turning off the power and •
unplugging the power cord before installing or removing a
chassis or working near power supplies
Do not work alone if potentially hazardous conditions •
exist.
Never assume that power is disconnected from a circuit; •
always check the circuit.
i
About
LITHIUM BATTERY CAUTION:
Risk of Explosion if Battery is replaced by an incorrect type.
Dispose of used batteries according to the instructions
Operating Safety
Electrical equipment generates heat. Ambient air temperature
may not be adequate to cool equipment to acceptable
operating temperatures without adequate circulation. Be sure
that the room in which you choose to operate your system has
adequate air circulation.
Ensure that the chassis cover is secure. The chassis design
allows cooling air to circulate effectively. An open chassis
permits air leaks, which may interrupt and redirect the flow of
cooling air from internal components.
Electrostatic discharge (ESD) can damage equipment and
impair electrical circuitry. ESD damage occurs when electronic
components are improperly handled and can result in complete
or intermittent failures. Be sure to follow ESD-prevention
procedures when removing and replacing components to avoid
these problems.
Wear an ESD-preventive wrist strap, ensuring that it makes
good skin contact. If no wrist strap is available, ground yourself
by touching the metal part of the chassis.
Periodically check the resistance value of the antistatic strap,
which should be between 1 and 10 megohms (Mohms).
About
EMC Notice
This equipment has been tested and found to comply
with the limits for a Class A digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference when
the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio
frequency energy and, if not installed and used in
accordance with the instruction manual, may cause
harmful interference to radio communications. Operation
of this equipment in a residential area is likely to cause
harmful interference in which case users will be required
to correct the interference at their own expense.
Thank you for choosing the FW-7575. This system
integrates the newest Intel® Xeon E3 1125C Processor
(or Intel® Core i3 Processor 2115C), codenamed Sandy
Bridge Gladden, with the Intel Cave Creek PCH to upscale
the network platform to the next level. It supports up
to 32GB of DDR3 system memory at 1066,1333 or
1600MHz on dual-channel DIMM banks.
The built-in Intel QuickAssist technology on the Cave
Creek chipset provides bulk data encryption/decryption
using AES, 3DES or (A)RC4 algorithms and hash using
MD5, SHA-1/2 and HMAC algorithms and compression.
The chipset will support Intel Virtualization Technology,
too.
The FW-7575 is equipped with advanced I/O capabilities
which incorporates a console port, an RJ-45 management
port, a PCIex8 golden nger connected directly to the
CPU for utmost packet processing performance and one
Serial-ATA port as well as a ComplactFlash slot. The front
panel also features 6 GbE ports.
The system can add additional 8 LAN ports with 1
Ethernet module, providing a total of 14 LAN ports.
Moreover, these LAN modules can be congured with
Lanner Generation2 or Generation3 bypass depending
on the module specication.
Please refer to the chart below for a summary of the
system’s specifications.
System Specification
Form Factor1U Rackmount
Processor Options
Platform
ChipsetIntel® Cave Creek
BIOSEFI BIOS 64Mbit
Technology
System
Memory
OS SupportLinux kernel 2.6 or above
Storage
Networking
I/O Interface
Expansion
Cooling
Environmental
Parameters
Miscellaneous
Max. Capacity32GB
Socket4 x 240P DIMM
HDD Bays
CompactFlash1 x Type II CompactFlash
Ethernet Ports6 x GbE RJ45
Bypass2 pairs Generation 3
PHY chip & LAN
chip
Ethernet Modules Yes (optional)
Management Port 1 x GbE RJ45
Security Acceleration
Reset Button
Console1 x RJ45
USB2 x USB 2.0
PCIe
PCIN/A
Processor
System
Temperature,
ambient operating
/ storage
Humidity (RH),
ambient operating
/ ambient nonoperating
LCD ModuleYes
WatchdogYes
Internal RTC with
Li Battery
Intel® Xeon Processor E31125C (FW-7575A/B)
Intel® Core i3 Processor
2115C (FW-7575 C/D)
DDR3
1066/1333/1600MHz
unbuffered, non-ECC
1 x 2.5” (Default) or 1 x
3.5” SATA HDD (Optional)
i347-ATZ, 82580DB
Cave Creek QuickAssist
Technology
1 x reset button
Software reset by default
PCIe*8 Ethernet Module or
Standard PCIe*8 add-on
card
CPU heatsink with fan
duct
3 x cooling fans with smart
fan control
0 ~ 40º C / -20~70º C
5~95%, non-condensing
Yes
Network Application Platforms
1
Chapter 1
Introduction
Physical
Dimensions
Power
Approvals and Compliance
Dimensions
(WxHxD)
Weight5 kg
Type/Watts
Input100~240V@50~60Hzs
431 x 44 x 305.8 mm
1U ATX 180W Power
Supply
CE emission, FCC Class A,
RoHS
Package Contents
Your package contains the following items:
FW-7575 Network Security Platform•
Power cable•
1 crossover Ethernet cable (1.8 meters)•
1 straight-through Ethernet cable (1.8 meters)•
1 console cable•
Serial-ATA hard drive cable •
1 threaded screw set•
1 ear bracket set•
Drivers and user’s manual CD.•
Optional Accessories
The system has a variety of optional accessories, visit the
following website for more information.
Power: If the LED is on it indicates that the system is powered on. If it is off, it indicates that the system is powered off.
Status: This LED is programmable. You could program it to display the operating status with the following behavior:
If the LED is green, it indicates that the system’s operational state is normal. If it is red, it indicates that the system is
malfunctioning.
HDD: If the LED blinks, it indicates data access activities; otherwise, it remains off.
F2 LCD System Panel
The LCD System Panel can be programmed to display operating status and configuration information. For more details or
sample programming code, please browse the Drivers and user’s manual CD.
F3 Console Port
By using suitable rollover cable or RJ-45 to DB-9 console cable, you can connect to a computer terminal for diagnostic or
configuration purpose. Terminal Configuration Parameters: 115200 baud, 8 data bits, no parity, 1 stop bit , no flow control.
F4 Two USB 2.0 Ports
It connects to any USB devices, for example, a flash drive.
F5 Management Port (provided by Intel 82574L)
This gigabit Ethernet port can be connected for configuration or troubleshooting purpose. You can also enable the Preboot
eXecution Environment (PXE) remote boot in the BIOS on this port (in the BIOS menu: Advanced->PXE).
F6 Reset Switch
The reset switch can be used to reboot the system without turning off the power.
On/Flashing: The port is linking and active in data transmission.•
Off: The port is not linking.•
SPEED (Green/Amber)
Amber: The connection speed is 1000Mbps.•
Green: The connection speed is 100Mbps•
Off: .The connection speed is 10Mbps.•
4 on-board Ethernet ports with 2 pairs of LAN bypass. These 6 GbE ports are provided by Intel Ethernet 82580DB and i347.
The management port (provided by Intel 82574L) is capable of Preboot eXecution Environment (PXE) (This feature needs to
be enabled or disable in the BIOS; the default is disabled). LAN1 and LAN2 are based on the Intel 82580DB , they are built
Network Application Platforms
3
Chapter 1
Introduction
with Intel Virtualization for Connectivity (VT-c) as part of the Intel Virtualization Technology to improve networking and I/O
throughput on a virtualized system. Moreover, 2 pairs (LAN3-LAN4, LAN5-LAN6; provided by Intel i347) can be configured
as LAN Bypass by using Lanner Gen3 Bypass technology when failure events occur. This feature can be enabled dynamically
with a watch dog timer. Refer to your User’s Manual CD for a sample implementation of this feature.
F8 Swappable Ethernet Module (optional)
Depending on the module specication, it may support Lanner Generation 2 or Generation 3 bypass function; for more
information, refer to Chapter 4 BIOS Settings and Appendix B Programming Generation 2 and 3 LAN Bypass.
Note:
The Bypass is only available on model A and C1.
The Ethernet expansion module occupies the same place as the 3.5” HDD. So if an Ethernet module is used in the 2.
system, you can only install a 2.5” HDD.
2
Network Application Platforms
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Chapter 1
Rear Panel Features
Introduction
R1
FAN4 FAN3 FAN2
AUX Fan CPU Fan CPU Fan
R1 Standard Low Profile and Half Length PCIe Expansion Slot
R2 System Fans
These fans have smart fan feature. These fans have smart fan feature which can be turned on automatically when the
temperature exceed the set threshold.
R3 Power-on Switch
It is a switch to turn on or off the power.
R4 AC Power Socket
The system equips an ATX 180W Power Supply.
R2
R3
R4
Network Application Platforms
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Chapter 2
Chapter 2:
Hardware Setup
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from the
server. The front panel Power On/Standby button
does not completely shut off system power.
Portions of the power supply and some internal
circuitry remain active until AC power is removed.
Unpower the FW-7575 and remove the power cord.1.
Unscrew 3 screws on each side of the top cover of the 2.
FW-7575 System.
Slide the cover backwards to open it.3.
1
2
Note:
We recommend that all DIMMs installed must 1.
be the same speed and size (DDR3 1066,1333 or
1600, unbuffered ECC or non-ECC). Do not install
DIMMs supporting different speeds or sizes.
The system can support up to32 GB in maximum.2.
Since the system is capable of dual channel 3.
memory architecture, some installation
guidelines have to be met to enable dual channel
mode as directed. To insert two DIMMs on the
system, insert DIMMS on slot J13 (blue) and J15
(blue). And use slot J12 (black) and J14 (black) if
more slots are required.
J12 Channel B DIMM1 (black)
J13 Channel B DIMM0 (blue)
J14 Channel A DIMM1 (black)
1
Installing the System Memory
The motherboard supports DDR3 memory that features
data transfer rates of 1066, 1333 or 1600 MHz to meet the
higher bandwidth requirements of the latest operating
system and Internet applications. To install the memory:
Open the DIMM slot latches.1.
Install the DIMM.2.
J15 Channel A DIMM0 (blue)
Installing the Hard Disk
The system can accommodate one 2.5” or 3.5” Serial-ATA
disks. Follow these steps to install a hard disk into the FW7575:
Unscrew the 4 screws on the hard disk tray to take out 1.
the hard disk tray from the system.
Place hard disk on the hard disk tray and align the holes 2.
of the hard disk with the mounting holes on the tray.
Secure the hard disk with 4 mounting screws on the 3.
hard disk tray.
Connect the Serial-ATA power and data disk cables 4.
to the hard disk’s power and drive connectors
respectively.
Plug the Serial-ATA cable to the Serial-ATA Connector 5.
on the main board.
Put the hard disk tray with the installed hard disk back 6.
to the system and secure it with the mounting screws.
Network Application Platforms
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Chapter 2
2.5” HDD installation
.
3.5” HDD installation
3.5” HDD is installed on the opposite side of
the power supply unit
Hardware Setup
Installing Front Ethernet Module
Bottom view of the system
2.5” HDD is installed on the same side of the
power supply unit
To install the front Ethernet module, take off the front 1.
bezel first by unfastening the threaded screws on the
bottom of the case.
Insert the Ethernet module into the front expansion 2.
slot. You should hear a click when the module connects
to the system’s mainboard.
Fasten the screw back on the bottom of the case to 3.
secure the module on the system.
Note:The Ethernet expansion module occupies the same
space as the 3.5” HDD. So if an Ethernet module is used on
the system, it is only possible to install a 2.5” HDD.
Network Application Platforms
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Chapter 2
Hardware Setup
Installing the CompactFlash Card
FW-7575 provides one CompactFlash slot. Follow the
procedures bellow for installing a CompactFlash card.
Align CompactFlash card and the card slot with the 1.
arrow pointing toward the connector. The card fits
only the correct way into the slot; do not force the card
into the slot.
Push the card to insert into the connector.2.
This side is left blank intentionally.
Network Application Platforms
8
Chapter 2
Hardware Setup
Installing the PCIe Riser Card
FW-7575 provides one PCIe expansion golden finger for
either standard PCI-E add-on card or Ethernet expansion
module installation. The Ethernet expansion module
is installed through the front panel slot whereas the
standard PCI-E Add-on card is installed through the back
slot. In order to install the PCIe expansion module, you’ll
need to install the riser card first. Follow the procedures
below for installing PCIe expansion card.
Align the riser card and the card slot1.
Push the card to insert into the connector.2.
Secure the card by fastening with screws.3.
Riser card for PCIe expansion (standard low prole and half
length) installation through the back panel
Riser card for PCIe expansion for Ethernet module installation
The block diagram depicts the relationships among the
interfaces or modules on the motherboard. Please refer
to the following figure for your motherboard’s layout
design.
Motherboard Information
Network Application Platforms
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