JVC KD-S747, KD-SX747 Service Manual

Page 1
49822200303
KD-S747
SERVICE MANUAL
CD RECEIVER
KD-S747
COMPACT
DIGITAL AUDIO
EE --------- Russian Fedeation
Area Suffix
1 Important Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
2 Disassembly method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
3 Adjustment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
4 Description of major ICs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-27
COPYRIGHT © 2003 VICTOR COMPANY OF JAPAN, LTD.
No.49822
2003/03
Page 2
KD-S747

1.1 Safety Precautions

SECTION 1

Important Safety Precautions
!
!
Burrs formed during molding may be left over on some parts of the chassis. Therefore, pay attention to such burrs in the case of preforming repair of this system.
Please use enough caution not to see the beam directly or touch it in case of an adjustment or operation check.
1-2 (No.49822)
Page 3

1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.
1.2.1 Grounding to prevent damage by static electricity
Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as DVD players. Be careful to use proper grounding in the area where repairs are being performed.
(1) Ground the workbench
Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the traverse unit (optical pickup) on it.
(2) Ground yourself
Use an anti-static wrist strap to release any static electricity built up in your body.
(caption) Anti-static wrist strap
KD-S747
1M
Conductive material (conductive sheet) or iron plate
(3) Handling the optical pickup
• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical pickup are shorted. After replacement, return the shorted parts to their original condition. (Refer to the text.)
• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit. (2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the
replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long
a time when attaching it to the connector. (3) Handle the flexible cable carefully as it may break when subjected to strong force. (4) I t is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.
• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit. (If the flexible wire is disconnected without applying solder, the CDpickup may be destroyed by static electricity.)
• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.
Short-circuit point
(Soldering)
Flexible wire
Short-circuit point
Pickup
Pickup
(No.49822)1-3
Page 4
KD-S747
Disassembly method

2.1 Main body

2.1.1 Removing the front panel assembly (See Fig.1)
(1) Push the detach button in the lower right part of the front
panel assembly and remove the front panel assembly in the direction of the arrow.
2.1.2 Removing the front chassis assembly (See Figs.2 and 3)
• Prior to performing the following procedure, remove the front
panel assembly. (1) Remove the screw A on the both sides of the main body. (2) Release the two joints a and two joints b on both sides
of the main body using a screwdriver, and remove the front chassis assembly forward.

SECTION 2

Front panel assembly
Fig.1
Detach button
a
Joint
A
Joint b
A
Joint b
Front chassis assembly
Joint a
Front chassis assembly
Fig.2
Fig.3
1-4 (No.49822)
Page 5
2.1.3 Removing the heat sink
(See Fig.4)
(1) Remove the two screws B and two screws C on the left
side of the main body.
KD-S747
B
2.1.4 Removing the bottom cover
(See Figs.5 and 6)
• Prior to performing the following procedure, remove the front
panel assembly, front chassis assembly and heat sink. (1) Turn over the body and release the two joints c, two joints
d and joint e .
CAUTION:
Do not damage the main board when releasing the joint e us- ing a screwdriver. (See Figs.5 and 6)
Joint
Joint e
C
Heat sink
Fig.4
c
Bottom cover
Joint d
Fig.5
Joint d
Bottom cover
Joint c
Joint e
Fig.6
(No.49822)1-5
Page 6
KD-S747
2.1.5 Removing the rear bracket (See Fig.7)
• Prior to performing the following procedure, remove the front
panel assembly, front chassis assembly, heat sink and bottom cover. (1) Remove the three screws D, screw E and two screws F on
the back of the body.
(2) Remove the rear bracket.
Rear bracket
F
2.1.6 Removing the main board (See Fig.8)
• Prior to performing the following procedure, remove the front
panel assembly, front chassis assembly, heat sink, bottom cover and rear bracket. (1) Remove the two screws G attaching the main board. (2) Disconnect connector CN501 and remove the main board.
2.1.7 Removing the CD mechanism assembly (See Fig.9)
• Prior to performing the following procedure, remove the front
panel assembly,front chassis assembly, heat sink, bottom cov­er, rear bracket and main board. (1) Remove the three screws H .
DD
Fig.7
Main board
G
CN501
Fig.8
E
G
H
1-6 (No.49822)
CD mechanism assembly
Top chassis
H
Fig.9
Page 7
2.1.8 Removing the front board
f
(See Figs.10 to 12)
• Prior to performing the following procedure, remove the front
panel assembly. (1) Remove the four screws J on the back side of the front
panel assembly. (2) Release the twelve joints f . (3) Take out the front board.
KD-S747
J
J
Front panel
Joint f
Front board
J
Fig.10
Joint f
Joint
Joint f
Joint f
Rear cover
Fig.11
Fig.12
(No.49822)1-7
Page 8
KD-S747
A

2.2 CD Mechanism Assembly

2.2.1 Removing the top cover (See Figs.1 and 2)
(1) Remove the two screws A on the both side of the body. (2) Lift the front side of the top cover and move the top cover
backward to release the two joints a.
Top cover
Joints a
A
Joints a
A
Fig.1
Fig.2
Top cover
1-8 (No.49822)
Page 9
KD-S747
2.2.2 Removing the connector board
(See Figs.3 to 5)
CAUTION:
Before disconnecting the flexible wire from the pickup, solder the short-circuit point on the pickup. No observance of this in­struction may cause damage of the pickup. (1) Remove the screw B fixing the connector board. (2) Solder the short-circuit point on the connector board. (3) Disconnect the flexible wire from the pickup. (4) Move the connector board in the direction of the arrow to
release the two joints b.
(5) Unsolder the wire on the connector board if necessary.
CAUTION:
Unsolder the short-circuit point after reassembling.
B
Connector board
Flexible wire
Wires
Joints b
Short-circuit point
Fig.3
Short-circuit point
(Soldering)
Pickup
Flexible wire
Frame
Pickup
Fig.4
B
Connector board
Fig.5
(No.49822)1-9
Page 10
KD-S747
2.2.3 Removing the DET switch (See Figs.6 and 7)
(1) Extend the two tabs c of the feed sw. holder and pull out
the switch.
(2) Unsolder the DET switch wire if necessary.
DET switch
Connector board
Pickup
Fig.6
DET switch
Tab c
Tab c
DET switch wire
Feed sw. holder
Fig.7
1-10 (No.49822)
Page 11
2.2.4 Removing the chassis unit
r
(See Figs.8 and 9)
• Prior to performing the following procedure, remove the top
cover and connector board. (1) Remove the two suspension springs (L) and (R) attaching
the chassis unit to the frame.
CAUTION:
• The shape of the suspension spring (L) and (R) are dif­ferent. Handle them with care.
• When reassembling, make sure that the three shafts on the underside of the chassis unit are inserted to the dampers certainly.
Suspension spring (R)
KD-S747
Chassis unit
Suspension spring (L)
Frame
Suspension spring (R)
Chassis unit
Shafts
Damper
Damper
Suspension spring (L)
Fig.8
Shaft
Dampe
Frame
Fig.9
(No.49822)1-11
Page 12
KD-S747
2.2.5 Removing the clamper assembly (See Figs.10 and 11)
• Prior to performing the following procedure, remove the top
cover. (1) Remove the clamper arm spring. (2) Move the clamper assembly in the direction of the arrow to
release the two joints d.
Clamper arm spring
Joint d
Clamper assembly
Fig.10
Clamper arm spring
Chassis rivet assembly
Joint d
Joint d
Chassis rivet assembly
Clamper assembly
Joint d
Fig.11
1-12 (No.49822)
Page 13
2.2.6 Removing the loading / feed motor assembly
(See Figs.12 and 13)
• Prior to performing the following procedure, remove the top
cover, connector board and chassis unit. (1) Remove the screw C and move the loading / feed motor
assembly in the direction of the arrow to remove it from the chassis rivet assembly.
(2) Disconnect the wire from the loading / feed motor assembly
if necessary.
CAUTION:
When reassembling, connect the wire from the loading / feed motor assembly to the flame as shown in Fig.12.
KD-S747
Loading / feed motor assembly
Fig.12
Loading / feed motor assembly
C
Fig.13
(No.49822)1-13
Page 14
KD-S747
2.2.7 Removing the pickup unit (See Figs.14 to 18)
• Prior to performing the following procedure, remove the top
cover, connector board and chassis unit. (1) Remove the screw D and pull out the pu. shaft holder from
the pu. shaft. (2) Remove the screw E attaching the feed sw. holder. (3) Move the part e of the pickup unit upward with the pu. shaft
and the feed sw. holder, then release the joint f of the feed
sw. holder in the direction of the arrow. The joint g of the
pickup unit and the feed rack is released, and the feed sw.
holder comes off. (4) Remove the pu. shaft from the pickup unit. (5) Remove the screw F attaching the feed rack to the pickup
unit.
2.2.8 Reattaching the pickup unit (See Figs.14 to 17)
(1) Reattach the feed rack to the pickup unit using the screw F. (2) Reattach the feed sw. holder to the feed rack while setting
the joint g to the slot of the feed rack and setting the part f of the feed rack to the switch of the feed sw. holder correct­ly.
(3) As the feed sw. holder is temporarily attached to the pickup
unit, set to the gear of the joint g and to the bending part of the chassis (joint h) at a time.
CAUTION:
Make sure that the part i on the underside of the feed rack is certainly inserted to the slot j of the change lock
lever. (4) Reattach the feed sw. holder using the screw E. (5) Reattach the pu. shaft to the pickup unit. Reattach the pu.
shaft holder to the pu. shaft using the screw D.
Joint g
Feed sw. holder
Part e
Feed rack
Part i
E
F
Pickup unit
Slot j
Fig.15
Joint f
Fig.16
Feed rack
Pickup unit
Feed sw. holder
Pu. shaft
Joint h
D
Pu. shaft holder
Joint f
Pu. shaft
D
Pu. shaft holder
Feed sw. holder
Pickup unit
Fig.14
Part e
E
Joint g
Pickup unit
Feed rack
Fig.17
Pickup unit
Joint g
Joint f
Feed sw. holder
Fig.18
1-14 (No.49822)
Page 15
KD-S747
r
2.2.9 Removing the trigger arm (See Figs.19 and 20)
• Prior to performing the following procedure, remove the top
cover, connector board and clamper unit. (1) Turn the trigger arm in the direction of the arrow to release
the joint k and pull out upward.
CAUTION:
When reassembling, insert the part m and n of the trigger arm into the part p and q at the slot of the chassis rivet assembly respectively and join the joint k at a time.
Chassis rivet assembly
Trigger arm
Chassis rivet assembly
Joint k
Trigger arm
Fig.19
Part p
Part q
Part m
Part n
2.2.10 Removing the top plate assembly (See Fig.21)
• Prior to performing the following procedure, remove the top
cover, connector board, chassis unit, and clamper assembly. (1) Remove the screw H. (2) Move the top plate assembly in the direction of the arrow to
release the two joints r.
(3) Unsolder the wire marked s if necessary.
H
Fig.20
Top plate assembly
Joints
s
Fig.21
(No.49822)1-15
Page 16
KD-S747
2.2.11 Removing the mode sw. / select lock arm (See Figs.22 and 23)
• Prior to performing the following procedure, remove the top
plate assembly. (1) Bring up the mode sw. to release from the link plate (joint t)
and turn in the direction of the arrow to release the joint u. (2) Unsolder the wire of the mode sw. marked s if necessary. (3) Turn the select lock arm in the direction of the arrow to re-
lease the two joints v. (4) The select lock arm spring comes off the select lock arm at
the same time.
Top plate
Link plate
Joint u
Joint t
s
Fig.22
Select lock arm
Select lock arm
Mode sw.
Select lock arm
Top plate
Hook w
Select lock arm spring
Link plate
Joints v
Fig.23
1-16 (No.49822)
Page 17
KD-S747
2.2.12 Reassembling the mode sw. / select lock arm (See Figs.24 to 26)
REFERENCE:
Reverse the above removing procedure. (1) Reattach the select lock arm spring to the top plate and set
the shorter end of the select lock arm spring to the hook w on the top plate.
(2) Set the other longer end of the select lock arm spring to the
boss x on the underside of the select lock arm, and join the select lock arm to the slots (joint v). Turn the select lock arm as shown in the figure.
(3) Reattach the mode sw. while setting the part t to the first
peak of the link plate gear, and join the joint u.
CAUTION:
When reattaching the mode sw., check if the points y and z are correctly fitted and if each part operates properly.
Select lock arm spring
Hook w
Joint v
Joint v
Select lock arm
Boss x
Fig.24
Joint t
Point y
Link plate
Point z
Link plate
Fig.25
Mode sw.
Select lock arm
Joint t
Joint u
Fig.26
(No.49822)1-17
Page 18
KD-S747
2.2.13 Removing the select arm R / link plate (See Figs.27 and 28)
• Prior to performing the following procedure, remove the top
plate assembly. (1) Bring up the select arm R to release from the link plate
(joint a') and turn as shown in the figure to release the two joints b' and joint c'.
(2) Move the link plate in the direction of the arrow to release
the joint d'. Remove the link plate spring at the same time.
REFERENCE:
Before removing the link plate, remove the mode sw..
Select arm R
Joint b'
Link plate spring
Top plate
Joint c'
Joint a'
Link plate
Link plate
Joint b'
Fig.27
Joint d'
Fig.28
Joint r
2.2.14 Reattaching the Select arm R / link plate (See Figs.29 and 30)
REFERENCE:
Reverse the above removing procedure. (1) Reattach the link plate spring. (2) Reattach the link plate to the link plate spring while joining
them at joint d'.
(3) Reattach the joint a' of the select arm R to the first peak of
the link plate while joining the two joints b' with the slots. Then turn the select arm R as shown in the figure. The top plate is joined to the joint c'.
CAUTION:
When reattaching the select arm R, check if the points e' and f' are correctly fitted and if each part operates prop­erly.
Select arm R
Joint b'
Joint a'
Link plate spring
Joint c'
Joint d'
Joint b'
Joint a'
Fig.29
Link plate
1-18 (No.49822)
Point e'
Point f'
Fig.30
Page 19
KD-S747
2.2.15 Removing the loading roller assembly
(See Figs.31 to 33)
• Prior to performing the following procedure, remove the
clamper assembly and top plate assembly. (1) Push inward the loading roller assembly on the gear side
and detach it upward from the slot of the joint g' of the lock arm rivet assembly.
(2) Detach the loading roller assembly from the slot of the joint
h' of the lock arm rivet assembly.
The roller guide comes off the gear section of the loading roller assembly.
Remove the roller guide and the HL washer from the shaft
of the loading roller assembly. (3) Remove the screw J attaching the lock arm rivet assembly. (4) Push the shaft at the joint i' of the lock arm rivet assembly
inward to release the lock arm rivet assembly from the slot
of the L side plate. (5) Extend the lock arm rivet assembly outward and release
the joint j' from the boss of the chassis rivet assembly. The
roller guide springs on both sides come off at the same
time.
CAUTION:
When reassembling, reattach the left and right roller guide springs to the lock arm rivet assembly before reat­taching the lock arm rivet assembly to the chassis rivet assembly. Make sure to fit the part k' of the roller guide spring inside of the roller guide. (Refer to Fig.34.)
Roller guide spring
Part k'
Chassis rivet assembly
Loading roller assembly
Loading roller assembly
Roller guide spring
Fig.32
Boss
Roller guide
Joint h'
Roller guide spring
Loading roller assembly
HL washer
Loading roller assembly
Joint g'
Lock arm rivet assembly
Fig.31
Roller guide
Roller guide spring
Roller guide spring
J
Lock arm rivet assembly
Lock arm rivet assembly
L side plate
Roller guide spring
Joint i'
Part j'
Fig.33
Roller guide
HL washer
Roller shaft assembly
Loading roller
Roller guide spring
Fig.34
(No.49822)1-19
Page 20
KD-S747
2.2.16 Removing the loading gear 5, 6 and 7 (See Figs.35 and 36)
• Prior to performing the following procedure, remove the top
cover, chassis unit, pickup unit and top plate assembly. (1) Remove the screw K attaching the loading gear bracket.
The loading gear 6 and 7 come off the loading gear brack­et.
(2) Pull out the loading gear 5.
K
Loading gear 5
Loading gear bracket
K
Loading gear 6
Loading gear 5
Loading gear 3
Fig.35
Loading gear bracket
Loading gear 6
Loading gear 7
1-20 (No.49822)
Fig.36
Page 21
KD-S747
2.2.17 Removing the gears
(See Figs.37 to 40)
• Prior to performing the following procedure, remove the top
cover, chassis unit, top plate assembly and pickup unit.
• Pull out the loading gear 3. (See Fig.35.)
(1) Pull out the feed gear. (2) Move the loading plate assembly in the direction of the ar-
row to release the L side plate from the two slots m' of the chassis rivet assembly. (See Fig.37.)
(3) Detach the loading plate assembly upward from the chas-
sis rivet assembly while releasing the joint n'. Remove the slide hook and loading plate spring from the loading plate assembly.
(4) Pull out the loading gear 2 and remove the change lock le-
ver.
(5) Remove the E ring and washer attaching the changer gear
2.
(6) The changer gear 2, change gear spring and adjusting
washer come off. (7) Remove the loading gear 1. (8) Move the change plate rivet assembly in the direction of the
arrow to release from the three shafts of the chassis rivet
assembly upward. (See Fig.38.) (9) Detach the loading gear plate rivet assembly from the shaft
of the chassis rivet assembly upward while releasing the
joint p'. (See Figs.38 and 40.)
(10) Pull out the loading gear 4.
Change plate rivet assembly
Shafts
E ring
Loading plate assembly
Loading plate spring
Joint p'
Loading gear 4
Loading gear plate rivet assembly
Shaft
Loading gear 2
Loading gear 1
Chassis rivet assembly
Change gear 2
Fig.38
Joint n'
Slide hook
Feed gear
Fig.37
Slot m'
L side plate
Loading plate assembly
Joint n'
Slot m'
Chassis rivet assembly
Chassis rivet assembly
E ring
Washer
Change gear 2
Change gear spring
Adjusting washer
Change plate
rivet assembly
Chassis rivet assembly
L side plate
Slot m'
Slot m'
Fig.39
Loading gear 1
Loading gear 2
Change lock lever
Loading gear 4
Loading gear plate rivet assembly
Fig.40
(No.49822)1-21
Page 22
KD-S747
2.2.18 Removing the turn table / spindle motor (See Figs.41 and 42)
• Prior to performing the following procedure, remove the top
cover, connector board, chassis unit and clamper assembly. (1) Remove the two screws L attaching the spindle motor as-
sembly through the slot of the turn table on top of the body.
(2) Unsolder the wire on the connector board if necessary.
Turn table
L
Fig.41
L
Turn table
1-22 (No.49822)
Spindle motor
Fig.42
Page 23

3.1 Adjustment method

KD-S747

SECTION 3

Adjustment
Test instruments required for adjustment
1. Digital oscilloscope (100MHz)
2. AM Standard signal generator
3. FM Standard signal generator
4. Stereo modulator
5. Electric voltmeter
6. Digital tester
7. Tracking offset meter
8. Test Disc JVC :CTS-1000
9. Extension cable for check
EXTSH002-22P 1
Standard measuring conditions Power supply voltage DC14.4V(11~16V) Load impedance 20Kohm(2 Speakers connection) Output Level Line out 2.0V (Vol. MAX)
How to connect the extension cable for adjusting
Standard volume position Balance and Bass &Treble volume : lndication"0" Loudness : OFF
Frequency Band FM1/FM2 87.5MHz ~ 108.0MHz FM3 65.0MHz ~ 74.0MHz MW 522kHz ~ 1620kHz L
W 144kHz ~ 279kHz
Dummy load Exclusive dummy load should be used for AM,and FM. For FM dummy load,there is a loss of 6dB between SSG output and antenna input.The loss of 6dB need not be considered since direct reading of figures are applied in this working standard.
The cardboard is cut in a suitable size. uses for the insulation stand of mechanism.
Caution: Be sure to attach the heat sink and rear bracket onto the power amplifier IC301 and regulator IC901 respectively, before supply the power. If voltage is applied without attaching these parts, the power amplifier IC and regulator IC will be destroyed by heat.
Heat sink
Extension cable
EXTSH002-22P
Rear bracket
(No.49822)1-23
Page 24
KD-S747

3.2 Troubleshooting

3.2.1 Feed section
Is the voltage output at IC521 pin u 5V or 0V?
YES
Is the wiring for IC521
(90) (100) correct?
YES
Is 5V present at IC581
Check the vicinity of
pin 6?
IC521.
YES
NONO
Check CD 9V
and 5V.
Is 4V present at both
sides of the feed motor?
YES
Check the feed motor.
3.2.2 Focus section
3.2.3 Spindle section
Is the disk rotated?
YES
Does the RF signal
appear at TP1?
YES
NO
Is 6V or 2V present at
IC581 Q and R?
Check IC581.
When the lens is
moving:
Does the S-search waveform appear at IC581 pins H and I?
YES
NO
Is 4V present between
IC581 pins 1 and 2?
Check the spindle motor
and its wiring.
NO
4V
NO
YES
NO
Check the feed motor
connection wiring.
Check the circuits in
the vicinity of IC581
pins H K.
YES
Check the pickup and
its connections.
NO NO
Is 4V present at IC521
pin x?
YES
Check the vicinity of
IC581.
Check IC501 and
IC521.
Is the RF waveform at TP1
distorted?
YES
Proceed to the Tracking
section
3.2.4 Tracking section
When the disc is rotated
Is the tracking error
signal output at TP3?
Check IC521.
1-24 (No.49822)
at first:
Approx. 1.2 V
YES
Check the circuits in the
vicinity of IC501 J O or
NO
the pickup
Check the circuit in the
vicinity of IC501 pins
2C.
YESYES
Check the pickup and
its connections.
Page 25
3.2.5 Signal processing section
Is the sound output from both channels (L, R)?
YES
Normal
No sound from either
channel.
YES
Is 9V present at IC101 pin
(8)?
YES
Is the audio signal
(including sampling output
components) output to
IC521 pins ^and | during
YES
KD-S747
NONO
Compare the L-ch and
R-ch to locate the
defective point.
NO
Check the vicinity of the
Q981 audio power
supply.
NO
Check IC521 and its
peripheral circuits.
Is the audio signal output
at IC101 pins 1
and7during playback?
YES
Check the muting circuit.
NO
Check IC101 and its
peripheral circuits
(No.49822)1-25
Page 26
KD-S747

3.3 Maintenance of laser pickup

(1) Cleaning the pick up lens
Before you replace the pick up, please try to clean the lens with a alcohol soaked cotton swab.
(2) Life of the laser diode
When the life of the laser diode has expired, the following symptoms will appear.
• The level of RF output (EFM output:ampli tude of eye pattern) will be low.
Is RF output
1.0 0.35Vp-p?
NO
Replace it.
YES
O.K
(3) Semi-fixed resistor on the APC PC board
The semi-fixed resistor on the APC printed circuit board which is attached to the pickup is used to adjust the laser power.Since this adjustment should be performed to match the characteristics of the whole optical block, do not touch the semi-fixed resistor. If the laser power is lower than the specified value,the laser diode is almost worn out, and the laser pickup should be re­placed. If the semi-fixed resistor is adjusted while the pickup is functioning normally,the laser pickup may be damaged due to excessive current.

3.4 Replacement of laser pickup

Turn off the power switch and,disconnect the power cord from the ac outlet.
Replace the pickup with a normal one.(Refer to "Pickup Removal" on the previous page)
Plug the power cord in,and turn the power on. At this time,check that the laser emits for about 3seconds and the objective lens moves up and down. Note: Do not observe the laser beam directly.
Play a disc.
Check the eye-pattern at TP1.
Finish.
1-26 (No.49822)
Page 27

4.1 HA13164A (IC901) : Regulator

• Terminal layout
123456789101112131415
• Block diagram
ANT OUT
EXT OUT
ANT CTRL
CTRL
CD OUT
AUDIO OUT
C3
0.1u
C4
0.1u
C5
0.1u
C6
10u
2
1
7
11
12
10

SECTION 4

Description of major ICs
C1
100u
VCC ACC
8
Surge Protector
BIAS TSD
15
3
TAB
ILM AJGND GND
13
C2
0.1u
+B
ACC
BATT.DET OUT
9
COMPOUT
6
VDD OUT
4
SW5VOUT
5
ILMOUT
14
R1
C7
0.1u
C8
0.1u
KD-S747
UNIT R:
C:F
note1) TAB (header of IC)
connected to GND
• Pin function
Pin No. Symbol Function
1 EXTOUT Output voltage is VCC-1 V when M or H level applied to CTRL pin.
2 ANTOUT Output voltage is VCC-1 V when M or H level to CTRL pin and H level to ANT-CTRL.
3 ACCIN Connected to ACC.
4 VDDOUT Regular 5.7V.
5 SW5VOUT Output voltage is 5V when M or H level applied to CTRL pin.
6 COMPOUT Output for ACC detector.
7 ANT CTRL L:ANT output OFF H:ANT output ON
8 VCC Connected to VCC.
9 BATT DET Low battery detect.
10 AUDIO OUT Output voltage is 9V when M or H level applied to CTRL pin.
11 CTRL L:BIAS OFF M:BIAS ON H:CD ON
12 CD OUT Output voltage is 8V when H level applied to CTRL pin.
13 ILM AJ Adjustment pin for ILM output voltage.
14 ILM OUT Output voltage is 10V when M or H level applied to CTRL pin.
15 GND Connected to GND.
(No.49822)1-27
Page 28
KD-S747

4.2 LA4743K (IC301) : Power amp.

• Block diagram
IN 1
TAB
IN 2
+
0.22 F
+
0.22 F
11
1
12
Vcc 1/2 Vcc 3/4
6 20
-
+
Protective
circuit
-
+
2200 F 0.022 F
+
9
­7
+
OUT 1+
OUT 1-
PWR GND1
8
+
OUT 2+
5
-
OUT 2-
3
PWR GND2
2
ST BY
R.F
47 F
IN 3
PRE GND
IN 4
+5V ST ON
+
0.22 F
N.C
+
0.22 F
4
Stand by
Switch
Mute
10
+
Ripple
Filter
Mute
22
circuit
3.3 F
+
15
-
+
-
17
19
10K
+
OUT 3+
OUT 3-
Low Level Mute ON
25
18
21
23
PWR GND3
OUT 4+
OUT 4-
13
14
Protective
circuit
-
+
+
-
ON TIME C
1-28 (No.49822)
22 F
Muting &
16
+
ON Time Control
Circuit
PWR GND4
24
Page 29
•Pin layout
TAB
GND
FR-
STDBY
FR+
VP1
RR-
GND
RR+
RIPPLE
INRF
INRR
SGND
FLIN
RLIN
DNTIME
RL+
GND
RL-
VP3
FL+
MUTE
FL-
GND
NC
• Pin function
Pin No. Symbol Function Pin No. Symbol Function
1 TAB Header of IC 14 FLIN Front Lch input
2 GND Power GND 15 RLIN Rear Lch input
3 FR- Outpur(-) for front Rch 16 ONTIME Power on time control
4 STDBY Stand by input 17 RL+ Output (+) for rear Lch
5 FR+ Output (+) for front Rch 18 GND Power GND
6 VP1 Power input 19 RL- Output (-) for rear Lch
7 RR- Output (-) for rear Rch 20 VP3 Power input
8 GND Power GND 21 FL+ Output (+) for front
9 RR+ Output (+) for rear Rch 22 MUTE Muting control input
10 RIPPLE Ripple filter 23 FL- Output (-) for front
11 RRIN Rear Rch input 24 GND Power GND
12 FRIN Front Rch input 25 NC Non connection
13 SGND Signal GND
KD-S747
(No.49822)1-29
Page 30
KD-S747
W

4.3 LA6579H-X (IC561) : 4-Channel bridge driver

• Pin layout & Block diagram
VIN1-A
1
­+
VIN1+A
VCCP1
2
3
VIN1_SW [H]: OP-AMP_A [L]: OP-AMP_B
[H]
[L]
28
VIN1
27
VIN1-B
-
+
26
VIN1+B
VO+
VO-
VO2+
VO2-
FR
VO3+
VO3-
VO4+
4
5
6
7
FR
8
9
10
Power system GND
­+
Level shift
Level shift
Level shift
Level shift
33k
11k
-
+
All outputs ON/OFF
H : ON L : OFF
3.3VREG (External:PTP Tr)
Signal system power supply
MUTE
Power system GND
Signal system power supply
+
-
25
24
23
22
FR
21
20
19
S-GND
VIN1-S
MUTE
VREFIN
FR
VCCS
3.3VREG
REGIN
VO4-
VCCP2
VIN4
VIN4G
1-30 (No.49822)
11
12
13
14
11k
33k
­+
33k
33k
18
VIN2G
11k
-
17
VIN2
+
16
VIN3G
11k
-
15
VIN3
+
Page 31
• Pin function
Pin No. Symbol Function
1 VIN1-A CH1 input AMP_inverted input
2 VIN1+A CH1 input AMP_non-inverted input
3 VCCP1 CH1 and CH2 power stage power supply
4 VO1+ Output pin(+)for channel 1
5 VO1- CH1 output pin (-) for channel 1
6 VO2+ Output pin(+)for channel 2
7 VO2- Output pin(-)for channel 2
8 VO3+ Output pin(+)for channel 3
9 VO3- Output pin(-)for channel 3
10 VO4+ Output pin(+)for channel 4
11 VO4- Output pin(-)for channel 4
12 VCCP2 CH3 and CH4 power stage powr supply
13 VIN4 Input pin for channel 4
14 VIN4G Input pin for channel 4(for gain adjustment)
15 VIN3 Input pin for channel 3
16 VIN3G Input pin for channel 3(for gain adjustment)
17 VIN2 Input pin for channel 2
18 VIN2G Input pin for channel 2(for gain adjustment)
19 REGIN External PNP transistor base connection
20 3.3VREG 3.3VREG output pin external PNP transistor,collector connection
21 VCCS Signal system GND
22 VREFIN Reference voltage application pin
23 MUTE Output ON/OFF pin
24 VIN1_SW CH1 input OP AMP_changeover pin
25 S_GND Signal system GND
26 VIN1+B CH1 AMP_B non-inverted input pin
27 VIN1-B CH1 AMP_B inverted input pin
28 VIN1 CH1 input pin input OP_AMP output pin
KD-S747
(No.49822)1-31
Page 32
KD-S747

4.4 LC75823W (IC601) : LCD driver

• Pin Layout
DICLCE
OSC
Vss
VDD2
VDD1
INH
VDD
COM3
COM2
COM1
S52
S51
S50
S49
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
S1 S2 S3 S4 S5 S6 S7 S8
S9 S10 S11 S12 S13 S14 S15 S16
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
S48 S47 S46 S45 S44 S43 S42 S41 S40 S39 S38 S37 S36 S35 S34 S33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
S17
S18
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
• Pin function
Pin No. Symbol I/O Functions
1 to 52 S1 to S52 O Segment output pins used to display data transferred by serial data input.
53 to 55 COM1 to COM3 O Common driver output pins. The frame frequency is given by : t0=(fosc/384)Hz.
56 VDD -- Power supply connection. Provide a voltage of between 4.5 and 6.0V.
57 INH
58 VDD1 I Used for applying the LCD drive 2/3 bias voltage externally.
59 VDD2 I Used for applying the LCD drive 1/3 bias voltage externally.
60 Vss -- Power supply connection. Connect to GND.
61 OSC I/O Oscillator connection.
62 CE I Serial data interface connection to the controller. CE : Chip enable
63 CL I Serial data interface connection to the controller. CL : Sync clock
64 DI I Serial data interface connection to the controller. DI : Transfer data
I Display turning off input pin.
INT="L" (Vss) ----- off (S1 to S52, COM1 to COM3="L"
="H" (VDD)----- on
INT Serial data can be transferred in display off mode.
Must be connected to VDD2 when a 1/2 bias drive scheme is used.
Must be connected to VDD1 when a 1/2 bias drive scheme is used.
An oscillator circuit is formed by connecting an external resistor and capacitor at this pin.
1-32 (No.49822)
Page 33

4.5 NJM4565M-WE (IC571) : CD L.P.F.

T
A
OUTPUT
KD-S747
+
1
8
V
-
A INPUT
+
A INPUT

4.6 IC-PST600M/G/-W (IC702) : System reset

3
-
4
V
Co1
2
OP1
B OUTPU
7
B INPUT
6
5
B INPUT
-
+
1
IN
3
Vout
2
GND
(No.49822)1-33
Page 34
KD-S747

4.7 TA2157FN-X (IC501) : RF amp

• Terminal layout
24 ~ 13
1 ~ 12
• Block diagram
13
14
15
16
17
18
19
21
20
10pF
20k
40k30k
20k 20k
20k
15k
50 A
12k
12k
BOTTOM
PEAK
20k
20k
20k
PEAK
1.3V
40k
240k
15pF
240k
15pF
40k
50k
2k
20k
50k
14k
K
1
15k
x0.5 x2
x0.5 x2
1k
2k
1.75k
10pF
12
11
10
9
8
7
6
5
4
PIN
VCTRLPIN
1-34 (No.49822)
180k
40pF
22
23
24
SEL
(APC SW)
180k
40pF
3k
3k
TEB
(TE BAL)
60k
60k
RFGC
(AGC Gian)
VCC APC ON -50% +12dB
HiZ APC ON 0% +6dB
GND
APC OFF
(LDO=H)
50% 0dB
94k
94k
22k
22k
3
2
1
TEB
(TE BAL)
Normal mode
(0dB)
Normal mode
(0dB)
CD-RW mode
(+12dB)
Page 35
• Pin function
Pin No. Symbol I/O Function
1 VCC - 3.3V power supply pin
2 FNI I Main-beam amp input pin
3 FPI I Main-beam amp input pin
4 TPI I Sub-beam amp input pin
5 TNI I Sub-beam amp input pin
6 MDI I Monitor photo diode amp input pin
7 LDO O Laser diode amp output pin
8 SEL I APC circuit ON/OFF control signal, laser diode (LDO) control signal input
or bottom/peak detection frequency change pin.
KD-S747
SEL
GND
Hiz
VCC
9 TEB I Tracking error balance adjustment signal input pin
Adjusts TE signal balance by eliminating carrier component from PWM signal (3-state output,
PWM carrier = 88.2kHz) output from TC94A14F/FA TEBC pin using RC-LPF and inputting DC.
TEBC input voltage:GND~VCC
10 TEN I Tracking error signal generation amp negative-phase input pin
11 TEO O Tracking error signal generation amp output pin.
Combining TEO signal RFRP signal with TC94A14F/FA configures tracking search system.
12 RFDC O RF signal peak detection output pin
13 GVSW I AGC/FE/TE amp gain change pin
APC circuit
LDO
OFF Connected VCC through 1k resistor
ON
Control signal output
ON Control signal output
GVSW Mode
GND
Hiz
CD-RW
Normal
VCC
14 VRO O Reference voltage (VRO) output pin
*VRO=1/2VCC When VCC=3.3V
15 FEO O Focus error signal generation amp output pin
16 FEN I Focus error signal generation amp negative-phase input pin
17 RFRP O Signal amp output pin for track count
Combining RFRP signal and TEO signal with TC94A14F/FA configures tracking search system.
18 19 20
21 AGCIN I RF signal amplitude adjustment amp input pin
22 RFO O RF signal generation amp output pin
23 RFI I RF signal generation amp input pin
24 GND - GND pin
REIS
RFGO
RFGC
I
OIRF signal amplitude adjustment amp output pin
RF amplitude adjustment control signal input pin
Adjusts RF signal amplitude by eliminating carrier component from PWM signal (3-state output, PWM carrier=88.2kHz)output fromTC94A14F/14FA *RFGC pin using RC-LPF and inputting DC.
*RFGC input voltage:GND~VCC
(No.49822)1-35
Page 36
KD-S747

4.8 TC94A14FA (IC521) : DSP & DAC

• Terminal layout & block daiagram
48 47 46 45 44 43 42 41 40 39
38 37 36 35 34 33
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
LPF
generator
Micro-
controller
interface
Clock
1-bit DAC
Audio out
Correction
circuit
circuit
Address
circuit
16 k
RAM
Digital output
PWM
Servo control
ROM
RAM
CLV servo
Synchronous
guarantee
EFM
decoder
Sub code
decoder
Digital equalizer
automatic
adjustment circuit
A/D
Data
slicer
VCO
PLL
TMAX
D/A
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
64
17
161514131211101 2 3 4 5 6 7 8 9
• Pin function
Pin
Symbol I/O Descroption
No
1 BCK O Bit clock output pin.32fs48fsor 64fs selectable by command. 2 LRCK O L/R channel clock output pin."L" for L channel and "H" for R channel.
Output polarity can be inverted by command. 3 AOUT O Audio data output pin. MSB-first or LSB-first selectable by command. 4 DOUT O Digital data output pin.Outputs up to double-speed playback. 5 IPF O Correction flag output pin. When set to "H" AOUT output cannot be corrected by C2 correction processing. 6V
DD3
7V
SS3
- Digital 3.3V power supply voltage pin.
- Digital GND pin. 8 SBOK O Subcode Q data CRCC result output pin. "H" level when result is OK. 9 CLCK O Subcode P-W data read I/O pin. I/O polarity selectable by command.
10 DATA O Subcode P-W data output pin. 11 SFSY O Playback frame sync signal output pin. 12 SBSY O Subcode block sync signal output pin. "H" level at S1 when subcode sync is detected. 13 HSO 14 UHSO 15 PV
I/O General-purpose input / output pins.Input port at reset.
- PLL-only 3.3V power supply voltage pin.
DD3
16 PDO O EFM and PLCK phase difference signal output pin.
1-36 (No.49822)
Page 37
Pin
Symbol I/O Descroption
No 17 TMAX O TMAX detection result output pin.
KD-S747
TMAX Detection Result Longer than fixed period
Within fixed period Shorter than fixed period
TMAX Output
DD3"
"PV "HiZ" "AV
SS3"
18 LPFN I Inverted input pin for PLL LPF amp. 19 LPFO O Output pin for PLL LPF amp. 20 PVREF - PLL-only VREF pin. 21 VCOF O VCO filter pin. 22 AV
- Analog GND pin.
SS3
23 SLCO O DAC output pin for data slice level generation. 24 RFI I RF signal input pin. Zin selectable by command. 25 AV
- Analog 3.3V power supply voltage pin.
DD3
26 RFCT I RFRP signal center level input pin. 27 RFZI I RFRP signal zero-cross input pin. 28 RFRP I RF ripple signal input pin. 29 FEI I Focus error signal input pin. 30 SBAD I Sub-beam adder signal input pin. 31 TEI I Tracking error input pin. Inputs when tracking servo is on. 32 TEZI I Tracking error signal zero-cross input pin. 33 FOO O Focus equalizer output pin. 34 TRO O Tracking equalizer output pin. 35 VREF - Analog reference power supply voltage pin. 36 RFGC O RF amplitude adjustment control signal output pin. 37 TEBC O Tracking balance control signal output pin. 38 SEL O APC circuit ON/OFF signal output pin. At laser on, high impedance with UHS="L",
H output with UHS="H".
39 AV
- Analog 3.3V power supply voltage pin.
DD3
40 FMO O Feed equalizer output pin. 41 DMO O Disc equalizer output pin. 42 V 43 V
SS3
DD3
- Digital GND pin.
- Digital 3.3V power supply voltage pin. 44 TESIN I Test input pin. Normally, fixed to "L". 45 XV
- System clock oscillator GND pin.
SS3
46 XI I System clock oscillator input pin. 47 XO O System clock oscillator output pin. 48 XV 49 DV
SS3
- System clock oscillator 3.3V power supply voltage pin.
DD3
R - DA converter GND pin. 50 RO O R-channel data forward output pin. 51 DV
- DA converter 3.3V power supply pin.
DD3
52 DVR - Reference voltage pin. 53 LO O L-channel data forward output pin. 54 DV
L - DA converter GND pin.
SS3
55 ZDET O 1 bit DA converter zero detection flag output pin. 56 V
SS5
- Microcontroller interface GND pin. 57 BUS0 58 BUS1
I/O Microcontroller interface data I/O pins.59 BUS2 60 BUS3 61 BUCK I Microcontroller interface clock input pin. 62 /CCE I Microcontroller interface chip enable signal input pin.At "L", BUS0 to BUS3 are active. 63 /RST I Reset signal input pin. At reset, "L". 64 V
DD5
- Microcontroller interface 5V power supply pin.
(No.49822)1-37
Page 38
KD-S747

4.9 TB2118F-X (IC31) : PLL

• Terminal Layout
2423222120191817161514
13
• Block diagram
FM VCO
AMVCO
DIN
CK
DOUT
123456789
osc
XO
IFC
XI
CE
2
1
24
15
16
13
3
4
5
6
Buff.
ON/OFF
OSC circuit
AMP
AMP
AMP
Serial
Interface
101112
Prescaler
Reference Counter
4-bit
Swallow counter
Programmable counter
20-bit BINARY COUNTER
Resistor 1
Resistor 2
I/O PORT
22-bit
OUTPUT PORT
Phase
Comparator
12-bit
40bit shift register
Constant
power supply voltage
switch
Vdd
switch
Vcc
AM CP.
20
­+
+
-
RF
22
19
Vt
18
FM cp
7
SL
8
9
I/O -2I/O -1
10 11
12
out-2out-1
vdd2
14
17
21
23
a-gnd
vccd-gndvdd
• Pin Function Pin
Symbol I/O Function
No.
Pin
Symbol I/O Function
No.
1 XOUT O Crystal oscillator pin 13 IFC I IF signal input
2 OSC - Non connect 14 VDD - Power pins for digital block
3 CE I Chip enable input 15 FMIN I FM band local signal input
4 DI I Serial data input 16 AMIN I AM band local signal input
5 CK I Clock input 17 DGND - Connect to GND (for digital circuit)
6 DOUT O Serial data output 18 FMCP O Charge pump output for FM
7 SR O Register control pin 19 Vt - Tuning voltage biased to 2.5V.
8 I/01 I/O I/O ports 20 AMCP O Charge pump output for AM
9 I/02 I/O I/O ports 21 VCC - Power pins for analog block
10 OUT1 - Non connect 22 RF I Ripple filter connecting pin
11 OUT2 - Non connect 23 AGND - Connect to GND (for analog circuit)
12 VDD2 - Single power supply for REF. frequency block 24 XIN I Crystal oscillator pin
1-38 (No.49822)
Page 39

4.10 TEA6320T-X (IC161) : E.volume

•Pin layout
TAPE
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
SDA
GND
OUTLR
OUTLF
TL B2L B1L
IVL ILL
QSL
IDL
MUTE
ICL
IMD
IBL IAL
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
CD-CH
TUNER
• Block diagram
10 8 9 7 6
SCL VCC OUTRR OUTRF TR B2R B1R IVR ILR QSR IDR Vref ICR CAP IBR IAR
KD-S747
5
12
21 31
2
19
POWER
SUPPLY
VOLUME 1
+20 to -31 dB
LOUDNESS
LEFT
16 15 13 11
14
22 20
SOURCE
SELECTOR
VOLUME 1
+20 to -31 dB
LOUDNESS
RIGHT
18 17
23 25 24 26 27 28
• Pin functions
Pin
No.
Symbol I/O Functions
1 SDA I/O Serial data input/output. 2 GND - Ground. 3 OUTLR O output left rear. 4 OUTLF O output left front. 5 TL I Treble control capacitor left channel
or input from an external equalizer.
6 B2L - Bass control capacitor left channel or
output to an external equalizer. 7 B1L - Bass control capacitor left channel. 8 IVL I Input volume 1. left control part. 9 ILL I Input loudness. left control part.
10 QSL O Output source selector. left channel. 11 IDL - Not used 12 MUTE - Not used 13 ICL I Input C left source. 14 IMO - Not used 15 IBL I Input B left source. 16 IAL I Input A left source.
BASS LEFT
+15 dB
LOGIC
BASS RIGHT +15 dB
VOLUME 2 0 to 55 dB BALANCE
FENDER REAR
VOLUME 2
0 to 55 dB BALANCE
FENDER FRONT
HC BUS
REC
3
4
32
TREBLE
LEFT
+12 dB
MUTE
FUNCTION
ZERO CROSS
DETECTOR
1
VOLUME 2
TREBLE
RIGHT
+12 dB
Pin
No.
Symbol I/O Functions
0 to -55dB BALANCE
FENDER FRONT
VOLUME 2
0 to -55dB BALANCE
FENDER REAR
29
30
17 IAR I Input A right source. 18 IBR I Input B right source. 19 CAP - Electronic filtering for supply. 20 ICR I Input C right source. 21 Vref - Reference voltage (0.5Vcc) 22 IDR - Not used 23 QSR O Output source selector right channel. 24 ILR I Input loudness right channel. 25 IVR I Input volume 1. right control part. 26 B1R - Bass control capacitor right channel 27 B2R O Bass control capacitor right channel
or output to an external equalizer.
28 TR I Treble control capacitor right channel
or input from an external equalizer. 29 OUTRF O Output right front. 30 OUTRR O Output right rear. 31 Vcc - Supply voltage. 32 SCL I Serial clock input.
(No.49822)1-39
Page 40
KD-S747

4.11 UPD784215AGC224 (IC701) : CPU

• Pin Layout
75 ~ 51
76 ~ 100
50 ~ 26
1 ~ 25
• Pin function
Pin No. Symbol I/O function
1~2 no use O output L
3 SW2 I CD mecha SW2
4 PSW I CD mecha Position Setting SW
5 LM O loading motor control output
6 MOTOR SEL O Loading/feed motor selecting output
7~8 no use O output L
9 VDD maicon power supply
10 X2
11 X1
12 VSS - GND
13 XT2
14 XT1
15 RESET I SYSTEM RESET
16 SW1 I CD mecha sw1
17 no use O output L
18 PS2 I power save2, H means STOP mode
19~22 no use O output L
23 AVDD A/D converter power supply
24 AVREF0 A/D reference voltage
25 VOLÇP I volume encoder pulse input 1
26 VOLÇQ I volume encoder pulse input 2
27 KEY0 I key input 0
28 KEY1 I key input 1
29 KEY2 I key input 2
30 LEVEL I level meter input
31 no use I Input
32 SM I S DMETER input
33 AVSS - GND
34~35 no use O output L
36 AVREF
37~40 no use O output L
41 LCD-DA O data output for LCD driver
42 LCD-SCK O CLK output for LCD driver
43 LCD-CE O CE for LCD driver
44 no use O output L
45 E2PROM-DI I I2C data input
46 E2PROM-DO O I2C data output
1-40 (No.49822)
Page 41
Pin No. Symbol I/O function
47 E2PROM-CLK O I2C clock output
48~50 no use O output L
51 no use O output L
53 SD/ST I station detector or streo indicator input ; H means a station is there. L means the program is stereo.
54 no use O output L
55 MONO O monoral selection output ; H means monoral
56~60 no use O output L
61 DETACH I detach detect input ; H means detaching
62 no use O output L
63 SEEK/STOP O auto seek and stop selecting output ; H means seeking, L means receiving.
64 IFC CONT O IFC control output
65 FM/AM O FM, AM band selecting output ; H = FM CL= AM
66 PLL-CE O CE output for PLL IC
67 PLL-DO O data output for PLL IC
68 PLL-CLK O clock output for PLL IC
69 PLL-DI I data input from PLL IC
70 TEL-MUTING I telphone muting detection input ; Active level can be selected H or L in PSM
71 no use O output L
72 VSS - GND
73 no use I output L
74 PS1 I POWER SAVE1 Çk= ACC off
75 POWER O POWER ON/OFF control output H=power on
76 CD-ON O CD power supply control output H=CD power on
77 MUTING O muting output L=muting on
78~80 no use O output L
81 VDD - maicon power supply
82 no use O output L
83 VOL-DA O data output for e-vol IC
84 VOL-CLK O clock output for e-vol IC
85~88 no use I output L
89~90 no use I output L
91 BUCK O clock output for CD LSI
92 CCE O CE output for CD LSI
93 RST O reset output for CD LSI
94 TEST for rewriting flash memory
95 BUS0 I/O data output and input 0 for CD LSI
96 BUS1 I/O data output and input 1 for CD LSI
97 BUS2 I/O data output and input 2 for CD LSI
98 BUS3 I/O data output and input 3 for CD LSI
99 no use O output L
100 CD-RW RF gain control L=CD-RW, H=CD-DA
KD-S747
(No.49822)1-41
Page 42
KD-S747
VICTOR COMPANY OF JAPAN, LIMITED
AV & MULTIMEDIA COMPANY MOBILE ENTERTAINMENT CATEGORY 10-1,1chome,Ohwatari-machi,Maebashi-city,371-8543,Japan
(No.49822)
Printed in Japan
200303WPC
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