Prior to shipment from the factory, JVC products are strictly
inspected to conform with the recognized product safety and
electrical codes of the countries in which they are to be
sold.However,in order to maintain such compliance, it is equally
important to implement the following precautions when a set is
being serviced.
1.1.1 Precautions during Servicing
(1) Locations requiring special caution are denoted by labels
and inscriptions on the cabinet, chassis and certain parts of
the product.When performing service, be sure to read and
comply with these and other cautionary notices appearing
in the operation and service manuals.
(2) Parts identified by the symbol and shaded ( ) parts
are critical for safety.
Replace only with specified part numbers.
NOTE :
Parts in this category also include those specified to
comply with X-ray emission standards for products
using cathode ray tubes and those specified for
compliance with various regulations regarding
spurious radiation emission.
(3) Fuse replacement caution notice.
Caution for continued protection against fire hazard.
Replace only with same type and rated fuse(s) as
specified.
(4) Use specified internal wiring. Note especially:
• Wires covered with PVC tubing
• Double insulated wires
• High voltage leads
(5) Use specified insulating materials for hazardous live parts.
Note especially:
• Insulation Tape
• PVC tubing
•Spacers
• Insulation sheets for transistors
•Barrier
(6) When replacing AC primary side components (transformers,
power cords, noise blocking capacitors, etc.) wrap ends of
wires securely about the terminals before soldering.
emission. Consequently, when servicing these products,
replace the cathode ray tubes and other parts with only the
specified parts. Under no circumstances attempt to modify
these circuits.Unauthorized modification can increase the
high voltage value and cause X-ray emission from the
cathode ray tube.
(12) Crimp type wire connectorIn such cases as when replacing
the power transformer in sets where the connections
between the power cord and power trans former primary
lead wires are performed using crimp type connectors, if
replacing the connectors is unavoidable, in order to prevent
safety hazards, perform carefully and precisely according
to the following steps.
• Connector part number :E03830-001
• Required tool : Connector crimping tool of the proper
type which will not damage insulated parts.
• Replacement procedure
a) Remove the old connector by cutting the wires at a
point close to the connector.Important : Do not
reuse a connector (discard it).
cut close to connector
Fig.1-1-3
b) Strip about 15 mm of the insulation from the ends
of the wires. If the wires are stranded, twist the
strands to avoid frayed conductors.
15 mm
Fig.1-1-4
c) Align the lengths of the wires to be connected.
Insert the wires fully into the connector.
Metal sleeve
Fig.1-1-1
(7) Observe that wires do not contact heat producing parts
(heatsinks, oxide metal film resistors, fusible resistors, etc.)
(8) Check that replaced wires do not contact sharp edged or
pointed parts.
(9) When a power cord has been replaced, check that 10-15
kg of force in any direction will not loosen it.
Power cord
Fig.1-1-2
(10) Also check areas surrounding repaired locations.
(11) Products using cathode ray tubes (CRTs)In regard to such
products, the cathode ray tubes themselves, the high
voltage circuits, and related circuits are specified for
compliance with recognized codes pertaining to X-ray
Connector
Fig.1-1-5
d) As shown in Fig.1-1-6, use the crimping tool to crimp
the metal sleeve at the center position. Be sure to
crimp fully to the complete closure of the tool.
1.2
5
2
.0
5.5
Crimping tool
Fig.1-1-6
e) Check the four points noted in Fig.1-1-7.
Not easily pulled free
Wire insulation recessed
more than 4 mm
Crimped at approx. cente
of metal sleev
Conductors extended
Fig.1-1-7
(No.YF042)1-3
Page 4
1.1.2 Safety Check after Servicing
Examine the area surrounding the repaired location for damage
or deterioration. Observe that screws, parts and wires have been
returned to original positions, Afterwards, perform the following
tests and confirm the specified values in order to verify
compliance with safety standards.
(1) Insulation resistance test
Confirm the specified insulation resistance or greater
between power cord plug prongs and externally exposed
parts of the set (RF terminals, antenna terminals, video and
audio input and output terminals, microphone jacks,
earphone jacks, etc.).See table 1 below.
(2) Dielectric strength test
Confirm specified dielectric strength or greater between
power cord plug prongs and exposed accessible parts of
the set (RF terminals, antenna terminals, video and audio
input and output terminals, microphone jacks, earphone
jacks, etc.). See Fig.1-1-11 below.
(3) Clearance distance
When replacing primary circuit components, confirm
specified clearance distance (d), (d') between soldered
terminals, and between terminals and surrounding metallic
parts. See Fig.1-1-11 below.
d
Chassis
d'
Power cord
primary wire
Fig.1-1-8
(4) Leakage current test
Confirm specified or lower leakage current between earth
ground/power cord plug prongs and externally exposed
accessible parts (RF terminals, antenna terminals, video
and audio input and output terminals, microphone jacks,
earphone jacks, etc.).
Measuring Method : (Power ON)Insert load Z between
earth ground/power cord plug prongs and externally
exposed accessible parts. Use an AC voltmeter to
measure across both terminals of load Z. See Fig.1-1-9
and following Fig.1-1-12.
ab
Externally
exposed
accessible part
Z
V
c
A
Fig.1-1-9
(5) Grounding (Class 1 model only)
Confirm specified or lower grounding impedance between
earth pin in AC inlet and externally exposed accessible
parts (Video in, Video out, Audio in, Audio out or Fixing
screw etc.).Measuring Method:
Connect milli ohm meter between earth pin in AC inlet and
exposed accessible parts. See Fig.1-1-10 and grounding
specifications.
AC inlet
Earth pin
Exposed accessible part
MIlli ohm meter
Grounding Specifications
Region
USA & Canada
Europe & Australia
Grounding Impedance (Z
Z0.1 ohm
Z0.5 ohm
)
Fig.1-1-10
AC Line Voltage
100 V
100 to 240 V
110 to 130 V
110 to 130 V
200 to 240 V
Region
Japan
USA & Canada
Europe & Australia
Insulation Resistance (R
R 1 M /500 V DC
1 M R 12 M /500 V DC
R 10 M /500 V DC
)
Dielectric Strength
AC 1 kV 1 minute
AC 1.5 kV 1 minute
AC 1 kV 1 minute
AC 3 kV 1 minute
AC 1.5 kV 1 minute
(
Class
(
Class
Clearance Distance (d), (d'
d, d' 3 mm
d, d' 4 mm
d, d' 3.2 mm
d 4 m m
)
d' 8 m m (Power cord
d' 6 m m (Primary wire
)
Fig.1-1-11
AC Line Voltage
100 V
110 to 130 V
110 to 130 V
220 to 240 V
Region
Japan
USA & Canada
Europe & Australia
Load Z
1
0.15
1.5
2
50
Leakage Current (i)
i 1 mA rms
i 0.5 mA rms
i 0.7 mA peak
i 2 mA dc
i 0.7 mA peak
i 2 mA dc
a, b, c
Exposed accessible parts
Exposed accessible parts
Antenna earth terminals
Other terminals
Fig.1-1-12
NOTE :
These tables are unofficial and for reference only. Be sure to confirm the precise values for your particular country and locality.
)
)
)
1-4 (No.YF042)
Page 5
SECTION 2
SPECIFIC SERVICE INSTRUCTIONS
2.1DIFFERENCE LIST
The following table indicate main different points between models GR-D230US and GR-D231US.
MODELGR-D230USGR-D231US
BODY COLORSilver & BlueSilver & Silver
(No.YF042)1-5
Page 6
SECTION 3
DISASSEMBLY
3.1BEFORE ASSEMBLY AND DISASSEMBLY
3.1.1 Precautions
• Be sure to disconnect the power supply unit prior to mounting
and soldering of parts.
• Prior to removing a component part that needs to disconnect
its connector(s) and its screw(s), first disconnect the wire(s)
from the connector(s), and then remove the screw(s).
• When connecting/disconnecting wires, pay enough attention
not to damage the connectors.
• When inserting the flat wire to the connector, pay attention to
the direction of the flat wire.
• Be careful in removing the parts to which some spacer or
shield is attached for reinforcement or insulation.
• When replacing chip parts (especially IC parts), first remove
the solder completely to prevent peeling of the pattern.
• Tighten screws properly during the procedures. Unless
specified otherwise, tighten screws at a torque of 0.118N
·cm). However, 0.118N·m (1.2kgf·cm) is a value at the
(1.2kgf
time of production. At the time of service, perform the
procedure at a torque 10% less than 0.118N
·m (1.2kgf·cm).
(See "SERVICE NOTE" as for tightening torque.)
3.1.2 Destination of connectors
Two kinds of double-arrows in connection tables respectively
show kinds of connector/wires.
: Wire: Flat wire: Board to board (B-B)
: The connector of the side to remove
CONN. No.PIN No.CONNECTOR
CN2a
CN2b
MAIN CN101
MAIN CN103
MONI BW CN761
MINI BW CN7624010
3.1.3 Disconnection of connectors (Wires)
Wire
· Pull both ends of the connector in the arrow
direction, remove the lock and disconnect the flat
wire.
B-B Connector
B-B Connector
· Pull the both ends of the board in the direction of the arrow, and remove the B-B Connector.
FPC Connector
· Extend the locks in the direction of the arrow for
unlocking and then pull out the wire. After
removing the wire, immediately restore the locks
to their original positions because the locks are
apt to come off the connector.
Wire
FPC Connector
Lock
B-B Connector
Fig.3-1-1
3.1.4 Tools required for disassembly and assembly
Torque driver
YTU94088
Bit
YTU94088-003
Tweezers
P-895
·m
• Torque driver
Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.
• Bit
This bit is slightly longer than those set in conventional torque
drivers.
• Tweezers
To be used for removing and installing parts and wires.
• Chip IC replacement jig
To be used for replacement of IC.
• Cleaning cloth
Recommended cleaning cloth to wipe down the video heads,
mechanism (tape transport system), optical lens surface.
3.2ASSEMBLY AND DISASSEMBLY OF MAIN PARTS
3.2.1 Assembly and disassembly
When reassembling, perform the step(s) in reverse order.
When reassembling, preform the step(s) in the reverseorder.
These numbers are also used as the identification (location)
No. of parts Figures.
(∗2) Part to be removed or installed.
(∗3) Fig. No. showing Procedure or Part Location.
C = CABINET
(∗4) Identification of part to be removed, unhooked, unlocked,
released, unplugged, unclamped or unsoldered.
S = Screw
L = Lock, Release, Hook
SD = Solder
CN = Connector
[Example]
• 4 (S1a) = Remove four S1a screws.
• 3 (L1a) = Disengage three L1a hooks.
• 2 (SD1a) = Unsolder two SD1a points.
• CN1a = Remove a CN1a connector.
(∗5) Adjustment information for installation.
Fig.
No.
4(S1a),3(L1a),CN1a
Fig.C1
(S2a),2(S2b),3(S2c)
Fig.C2-1
2(SD1a),
L2,CN2a,b
2(S8),L8,CN8a
Fig.C2-2
POINT
( 4)( 5)( 2)( 3)( 1)
NOTE
-
-
NOTE8
Chip IC replacement jig
PTS40844-2
1-6 (No.YF042)
Cleaning cloth
KSMM-01
Fig.3-1-2
Page 7
3.2.2 ASSEMBLY/DISASSEMBLY OF CABINET PARTS AND ELECTRICAL PARTS(1)
zDisassembly procedure
STEP
No.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10]
[11]
PARTNOTE
TOP COVER ASSEMBLY
UPPER CASE ASSEMBLY
(Inc. MONITOR ASSEMBLY)
REAR COVER ASSEMBLY
FRONT COVER ASSEMBLY
(Inc.MIC ASSEMBLY)
VF ASSEMBLY
BASE
LOWER ASSEMBLY
(Inc. FRONT BOARD ASSEMBLY/
SD BOARD ASSEMBLY)
OP BLOCK ASSEMBLY/
CCD BOARD ASSEMBLY
MAIN BOARD ASSEMBLY
MDA BOARD ASSEMBLY
MECHA ASSEMBLY
Fig.
No.
2(S1a),2(S1b),CN1
Fig.FA1
(S2a),(S2b),4(S2c),2(L2a),2(L2b)
Fig.FA2
CN2a,b
CN3,4(S3),4(L3)
Fig.FA3
(S4a),(S4b),
Fig.FA4
2(S4c),CN4
CN5a,b,2(S5),L5
Fig.FA5
2(S6)
CN7a,SPACER,CN7b,c,4㧔S7㧕
Fig.FA6
2(S8),L8
CN9a,b,(S9a),2(S9b),CN9c
Fig.FA7
CN10a,b,c,d,2(S10)
Fig.FA8
(S11),SHIELD COVER(1),3(S11)
Fig.FA9
BKT(MECHA)ASSEMBLY
POINT
JACK COVER(AV)ASSEMBLY
Fig.3-2-1
NOTE2:
For disassembly of the MONITOR ASSEMBLY, see "3.2.6
DISASSEMBLY of [12] MONITOR ASSEMBLY".
NOTE5a:
-
NOTE2
-
-
NOTE5a,b
-
NOTE7
NOTE8
-
-
-
zDestination of connectors
CONN.
No.
CN1 MAIN CN109 ZOOM SW(OPE) - 6
CN2a MAIN CN112 MONITOR
/CN7602
CN2b MAIN CN110 JUNCTION CN401 10
CN3 MAIN CN104 REAR CN501 40
CN4 MAIN CN107 MICASSY - 4
CN5a MAIN CN105 SD CN901 22
CN5b MAIN CN103 VF FPC ASSY - 22
CN7a FRONT CN701 MAIN CN108 24
CN7b MAIN CN102 CCD CN5201 20
CN7c MAIN CN101 OP BLOCK ASSY - 24
CN9a MAIN CN106 MDA CN305 30
CN9b MAIN CN113 HEAD - 8
CN9c MAIN CN114 SENSOR - 16
CN10a MDA CN301 CAPSTAN MOTOR - 18
CN10b MDA CN302 DRUM MOTOR - 11
CN10c MDA CN303 ROTARY ENCODER SW - 6
CN10d MDA CN304 LOADING MOTOR - 6
Another FPC overlaps the FPC of the VF ASSEMBLY. Before removing the FPC of the VF ASSEMBLY, remove
CN5a.
NOTE5b:
For disassembly of the VF ASSEMBLY, see "3.2.4 DISASSEMBLY of [5] VF ASSEMBLY".
NOTE7:
In removing the LOWER ASSEMBLY, remove the SPACER, and remove the FPC.
Be careful not to damage the FPC.
NOTE8:
For disassembly of the OP BLOCK ASSEMBLY, see "3.2.5
DISASSEMBLY of [8] OP BLOCK ASSMBLY/CCD BOARD
ASSEMBLY ".
CONNECTOR
Fig.3-2-2
CN7601
PIN.
No
39/20,
20
(No.YF042)1-7
Page 8
1
(S1a)
[1]
4
(S1b)
3
(S1b)
2
(S1a)
CN1
Fig.FA1
5
(S2a)
7
(S2c)
(S2c)
: 0.088N.m (0.9kgf.cm)
1-8 (No.YF042)
[2]
NOTE2
L2b
b
6
8
9
(S2c)
10
(S2c)
(S2b)
a
Fig.FA2
b
CN2b
L2a
a
CN2a
Page 9
11
(S3)
(S3)
12
(S3)
13
14
(S3)
16
(S4b)
JACK COVER
(AV)ASSEMBLY
CASSETTE
COVER
ASSEMBLY
15
(S4a)
18
(S4c)
17
(S4c)
[3]
L3
[4]
CN3
Fig.FA3Fig.FA4
19
(S5)
CN4
: 0.088N.m (0.9kgf.cm)
[5]
NOTE5b
L5
CN5b
a
21
(S6)
b
22
(S6)
20
(S5)
Fig.FA5
[6]
NOTE5a
a
b
CN5a
(No.YF042)1-9
Page 10
NOTE8
[8]
NOTE7
SPACER
28
(S8)
26
(S7)
27
(S8)
29
(S9a)
25
(S7)
23
(S7)
24
(S7)
L8
Fig.FA6
[7]
CN7b
CN7c
CN7a
[9]
CN9c
CN9a
31
(S9b)
30
(S9b)
CN9b
Fig.FA7Fig.FA8
CN10a
CN10b
[10]
CN10d
CN10c
33
(S10)
32
(S10)
: 0.088N.m (0.9kgf.cm)
1-10 (No.YF042)
Page 11
SHIELD COVER(1)
34
(S11)
[11]
BKT(MECHA)
ASSEMBLY
NOTE1a
JACK COVER(AV)
ASSEMBLY
35
(S11)
1
36
(S11)
(S1)
NOTE1b
37
(S11)
: 0.088N.m (0.9kgf.cm)
Fig.FA9Fig.LO1
3.2.3 ASSEMBLY/DISASSEMBLY OF CABINET PARTS AND ELECTRICAL PARTS(2)
zDisassembly procedure
STEP
No.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
PARTNOTE
FRONT BOARD ASSEMBLY
BKT(TOP)ASSEMBLY
LOWER CASE
ARM ASSEMBLY
POWER UNIT
SD BOARD ASSEMBLY
SPEAKER
NOTE1a:
Prior to the procedure, remove the JACK COVER(AV)
ASSEMBLY.
NOTE1b:
In attaching the FRONT BOARD ASSEMBLY, be careful not
to damage the EJECT SWITCH (S701).
NOTE2:
Be careful not to damage the FPC.
NOTE3:
To remove one screw (9), open the CASSETTE COVER
ASSEMBLY.
NOTE4a:
Be careful not to damage the FPC.
NOTE4b:
In attaching the ARM ASSEMBLY, be careful so that the
SLIDE KNOB of the CASSETTE COVER and the SLIDE
KNOB of the ARM ASSEMBLY are correctly engaged.
After attaching the ARM ASSEMBLY, confirm that the
SLIDE KNOB operates properly.
Fig.
No.
JACK COVER(AV)ASSEMBLY,2(S1)
Fig.LO1
3(S2),2(L2a),L2b,2(L2c)
Fig.LO2
5(S3),L3
Fig.LO3
3(S4a),COVER(ADJUST),4(S4b),2(S4a)
Fig.LO4
Fig.LO5
CN5,2(S5a),(S5b),(S5a),L5a,2(L5b)
Fig.LO6
3(S6),2(L6)
CN7
POINT
NOTE1a,b
NOTE2
NOTE3
NOTE4a,b
NOTE6
NOTE7
2
(S1)
NOTE6:
Prior to removing the SD BOARD ASSEMBLY, remove the
SD card.
NOTE7:
Prior to removing the SPEAKER, remove the SD BOARD
ASSEMBLY. Be careful of handing the parts.
Be careful enough not to cut or damage the wire.
zDestination of connectors
CONN.
No.
CN5 SD CN902 POWER UNIT - 9
CN7 SD CN903 SPEAKER - 2
[1]
CONNECTOR
PIN.
No
(No.YF042)1-11
Page 12
4
(S2)
L2a
[3]
[2]
a
b
c
3
L2b
a
NOTE2
5
(S2)
(S2)
NOTE3
9
(S3)
BKT
CASSETTE COVER
ASSEMBLY
14
(S4b)
11
(S4a)
b
c
L2c
6
(S3)
7
(S3)
L3
8
(S3)
: 0.098N.m (1.0kgf.cm)
Fig.LO2Fig.LO3
COVER(ADJUST)
13
(S4a)
NOTE4a
10
(S3)
15
(S4b)
16
(S4b)
: 0.098N.m (1.0kgf.cm)
1-12 (No.YF042)
12
(S4a)
17
(S4b)
18
(S4a)
19
(S4a)
NOTE4b
[4]
Fig.LO4
Page 13
L5a
20
(S5a)
21
(S5a)
22
(S5b)
: 0.088N.m (0.9kgf.cm)
L5a
L5b
23
(S5a)
Fig.LO5
L5b
CN5
a
a
[5]
[7]
NOTE7
24
(S6)
25
(S6)
26
(S6)
: 0.088N.m (0.9kgf.cm)
L6
CN7
[6]
NOTE6
Fig.LO6
(No.YF042)1-13
Page 14
3.2.4 DISASSEMBLY of [5] VF ASSEMBLY
zDisassembly of exterior parts
(1) Remove the two screws (1,2).
(2) Remove the SPACER so that the SWITCH BOARD
ASSEMBLY moves easily.
(3) Remove gradually the FPC attached to two places of the
HOLDER(VF) ASSEMBLY so that the HOLDER(VF)
ASSEMBLY moves easily.
NOTE5a:
Be careful enough not to cut or damage the removed
FPC since the FPC is attached again.
(4) Remove the four screws (3-6), and remove the VF
ASSEMBLY from the HOLDER(VF) ASSEMBLY.
(5) Remove the two screws (7,8), and remove the VF CASE
(L).
(6) Remove one screw (9), and remove the LEVER (VF).
NOTE5b:
In an assembly procedure, be careful of the position of
the LENS HOLDER ASSEMBLY, and confirm that the
LEVER (VF) moves smoothly.
(7) Remove the GUIDE(LENS) part and the HOLDER(LCD)
part from the VF CASE(U).
NOTE5c:
Remove the HOLDER(LCD) part together with the
GUIDE(LENS) part.
zDisassembly of HOLDER(LCD) part
Parts are engaged in the both sides of the HOLDER(LCD).
See the figure below, and disassemble the parts if necessary.
NOTE5d:
In an assembly procedure, be careful not to insert foreign
materials or attach fingerprints in the parts.
zDisassembly of GUIDE(LENS) part
Parts are attached to the GUIDE(LENS) part from the EYE
CUP side.
See the following figure, and remove the EYE CUP if
necessary to disassemble the parts.
NOTE5e:
Be careful not to lose the parts.
< HOLDER(LCD)BLOCK >
NOTE5d
VF BL BOARD
ASSEMBLY
STOPPER
(POLA)
SHEET
(POLA)
HOLDER
(LCD)
L5
GUIDE(LENS)
F1
F1
< GUIDE(LENS)BLOCK >
SPRING(LENS)
LENS HOLDER
ASSEMBLY
FPC
CASE
(B.LIGHT)
SPRING
(LCD)
SHEET
(DIFF)
SHEET
(POLA)
HOLDER
(SHEET)
LCD
MODULE
GUIDE
(LCD)
NOTE5d
NOTE5e
LEVER SWITCH
SWITCH
BOARD
ASSEMBLY
(S5b)
(S5a)
7
(S5d)
FPC
NOTE5a
VF CASE (U)
3
(S5b)
c
1
(S5a)
: 0.069N.m (0.7kgf.cm)
: 0.078N
4
2
.
m (0.8kgf.cm)
VF CASE (L)
b
GUIDE(LENS)
BLOCK
NOTE5c
b
a
HOLDER(LCD)
BLOCK
a
LEVER(VF)
NOTE5b
HOLDER(VF)
ASSEMBLY
(S5f)
8
(S5e)
9
1-14 (No.YF042)
SHEET(LENS)
EYE CUP
Fig.3-2-4
5
(S5c)
c
SPACER(A)
6
(S5c)
Page 15
3.2.5 DISASSEMBLY of [8] OP BLOCK ASSMBLY/CCD BOARD ASSEMBLY
zCAUTIONS
(1) During the procedure, remove the OP BLOCK ASSEMBLY
ASSEMBLY. Instead, replace the entire CCD BASE
ASSEMBLY.
if necessary. When removing the OP BLOCK ASSEMBLY,
be careful not to damage the lens.
(2) During the procedure, be careful in handling CCD
IMAGE SENSOR, OP LPF, lens, and so on. Be careful
not to damage or soil the surface of them.
If they are soiled with fingerprints, etc., gently clean them
with chamois or the cleaning cloth.
(3) When products are shipped from the factory, protection
seals are applied onto transparent glass of some CCD
image sensors. Leave the protection seal as it is, and
take it off just before assembling the CCD image sensor
to the OP BLOCK ASSEMBLY.
(4) When removing OP LPF, be careful of the attachment
direction of OP LPF. (Marking is attached to some OP
LPFs.) When reassembling OP LPF, reattach OP LPF to
the original position.
zDisassembly procedure of OP BLOCK ASSEMBLY/CCD
BOARD ASSEMBLY
(1) Unsolder the fourteen soldered parts (SD8) on the CCD
BOARD ASSEMBLY, and remove the CCD BOARD
ASSEMBLY.
(2) Remove the two screws (1 and 2), and remove the CCD
BASE ASSEMBLY.
NOTE8b:
When removing the CCD BASE ASSEMBLY, be
careful in handling a sheet and OP LPF since a sheet
or OP LPF may be removed together with the CCD
BASE ASSEMBLY.
NOTE8c:
When replacing the CCD image sensor, don't remove
zAssembly procedure of OP BLOCK ASSEMBLY/CCD
BOARD ASSEMBLY
(1) Attach the OP LPF to the OP BLOCK ASSEMBLY, and
then the sheet to the OP BLOCK ASSEMBLY.
NOTE8d:
When attaching OP LPF to the OP BLOCK ASSEMBLY,
be careful about the attachment direction.
(2) Attach the CCD ASSEMBLY so that the sheet is not
shifted, and attach the CCD ASSEMBLY and the sheet
to the OP BLOCK ASSEMBLY by tightening them with
the two screws (1 and 2).
(3) Insert the CCD BOARD ASSEMBLY to the CCD BASE
ASSEMBLY, and solder the fourteen points (SD8).
zReplacement of service repair parts
Service repair parts of the OP BLOCK ASSEMBLY are as
follows. When replacing the parts, be careful not to cut or
damage the FPC, and not to damage the parts due to
soldering (overheat).
(1) Focus motor
(2) Zoom motor
(3) Iris motor unit
NOTE8e:
When replacing the focus motor or the zoom motor, lift
the FPC approx.1mm away from the jack to solder the
FPC.
NOTE8f:
Iris motor unit contains the FPC ASSEMBLY and the
SENSOR ×2.
the CCD image sensor from the CCD BASE
SENSOR
9
(S8c)
7
(S8b)
IRIS MOTOR UNIT
NOTE 8e, f
8
(S8c)
6
5
(S8b)
(S8b)
OP BLOCK ASSEMBLY
OP
side
FOCUS MOTOR
NOTE 8e
(S8b)
3
(S8b)
Fig.3-2-4
OP LPF
Blue
CCD
side
4
ZOOM MOTOR
<NOTE 8e>
14(SD8)
OP LPF
NOTE 8d
NOTE 8a
CCD BOARD ASSEMBLY
NOTE 8b, c
CCD BASE ASSEMBLY
SHEET
1
(S8a)
2
(S8a)
(No.YF042)1-15
Page 16
3.2.6 DISASSEMBLY of [12] MONITOR ASSEMBLY
zNotice
(1) First remove the MONITOR ASSEMBLY from the
LOWER ASSEMBLY since the MONITOR ASSEMBLY
is removed together with the LOWER ASSEMBLY in
ASSEMBLY AND DISASSEMBLY OF MAIN PARTS.
(2) During the procedure, be careful in handling the LCD
MODULE,etc., especially not to damage or soil the
monitor screen. If it is soiled with fingerprints, etc., gently
clean it with chamois or the cleaning cloth.
(3) Since the BACKLIGHT is soldered to the BOARD
ASSEMBLY (SD12), the BACKLIGHT should not be
separated from the BOARD ASSEMBLY except when
replacing the BACKLIGHT.
zDisassembly
<Removing the MONITOR ASSEMBLY>
(1) Remove the two screws (1,2) so that the FPC moves
easily.
(2) Remove the four screws (3-6), and remove the
COVER(UPPER).
(3) Remove the three screws (7-9). Leave the FPCs
connected to the JUNCTION BOARD ASSEMBLY.
NOTE12a:
To remove the MONITOR ASSEMBLY, the FPCs of
JUNCTION BOARD ASSEMBLY need not be removed.
(4) Remove the two screws (10,11), and remove the
MONITOR ASSEMBLY.
NOTE12b:
In attaching the MONITOR ASSEMBLY, be careful not
to damage the MONI_ON/OFF SWITCH.
<Disassembly of MONITOR ASSEMBLY>
(1) Remove the four screws (12-15), and remove the MON-
ITOR COVER ASSEMBLY while removing the three
hooks (L12).
(2) Remove the U/D SWITCH BOARD ASSEMBLY from the
MONITOR CASE ASSEMBLY.
(3) Unlock the connector CN12a and then CN12b, and raise
and remove the HINGE UNIT ASSEMBLY.
NOTE12c:
During the procedure, be careful in handling the FPC.
(4) Unlock one connector CN12c, and remove the FPC.
(5) Remove the MONITOR BOARD ASSEMBLY together
with the BACKLIGHT.
(6) Remove the SHIELD CASE.
(7) Remove the LCD MODULE.
<Disassembly of HINGE UNIT>
(1) Remove the two screws (16,17) and remove the HINGE
COVER(L) with care not to damage the FPC.
NOTE12d:
Be careful not to lose the P.C.MAGNET.
If the P.C.MAGNET is removed, attach the P.C.MAG-
NET so that a side with a mark comes inside.
(2) Remove the FPC from the HINGE COVER(L).
(3) Remove the FPC from the HINGE COVER(U).
(4) Remove the FPC from the HINGE ASSEMBLY.
NOTE12e:
Be careful in handling the FPC.
Wind the FPC around the rotational axis of the HINGE
ASSEMBLY 2.5 times so that the CONNECTOR of
FPC to be connected to the MONITOR ASSEMBLY
BOARD comes under the whole FPC.
HINGE UNIT ASSEMBLY
16(S12g) HINGE COVER(L)
HINGE ASSEMBLY
HINGE
COVER(U)
NOTE12c
FPC
U/D
SWITCH
BOARD
ASSEMBLY
MONITOR CASE
ASSEMBLY
c
P.C.MAGNET NOTE12d
17(S12g)
CN12b
CN12c
c
F2
F1
SD12
NOTE12c,e
F1
F2
CN12a
MONITOR BOARD
ASSEMBLY
SD12
F3
BACK LIGHT
SHIELD CASE
LCD MODULE
F1
FPC
2
(S12a)
c
9
8
(S12c)
(S12c)
7
(S12c)
NOTE12b
VIDEO-DSC SW
: 0.246N.m (2.5kgf.cm)
b
1
(S12a)
d
10
(S12d)
11
(S12d)
JUNC BOARD
ASSEMBLY
NOTE12a
MONI_ON/OFF SW
NOTE12b
14
(S12f)
15
(S12f)
: 0.078N.m (0.8kgf.cm)
.
12
b
m (2.0kgf.cm)
COVER
(UPPER)
c
(S12b)
d
4
(S12b)
(S12c)
6
(S12c)
13
(S12e)
MONITOR
COVER
ASSEMBLY
a
L12
: 0.196N
(S12e)
3
5
1-16 (No.YF042)
Fig.3-2-6
Page 17
SECTION 4
ADJUSTMENT
4.1PREPARATION
4.1.1 Precaution
Camera system and deck system of this model are specially
adjusted by using PC.
However, if parts such as the following are replaced, an
adjustment is required. The adjustment must be performed in a
Service Center equipped with the concerned facilities.
• OP BLOCK ASSEMBLY
• EEP ROM (IC1005 of MAIN board)
In the event of malfunction with electrical circuits, first find a
defective portion with the aid of proper test instruments as shown
in the following electrical adjustment procedure, and then
commence necessary repair/ replacement/adjustment.
• In observing chip TP, use IC clips, etc. to avoid any stress.
Prior to replacement of chip parts (especially IC), remove the
solder completely to prevent peeling of the pattern.
• Use a patch cord if necessary. As for a patch cord, see the
BOARD INTERCONNECTIONS.
• Since connectors are fragile, carefully handle them in
disconnecting and connecting the FPC.
4.1.2 REQUIRED TEST EQUIPMENT
• Personal computer (for Windows)
• Color TV monitor
• Oscilloscope (dual-trace type, observable 100MHz or higher
frequency). The one observable 300 MHz or higher frequency
is recommended.
• Digital voltmeter
• DC power supply or AC adapter
• Frequency counter (with threshold level adjuster)
4.1.3 TOOLS REQUIRED FOR ADJUSTMENT
Torque Driver
YTU94088
Chip IC Replacement Jig
PTS40844-2
INF Adjustment Lens
YTU92001B
Light box Assembly
YTU93096A
Alignment Tape
MC-1
INF Adjustment Lens Holder
Bit
YTU94088-003
Cleaning Cloth
KSMM-01
YTU94087
Gray Scale Chart
YTU94133A
PC Cable
QAM0099-002
Guide Driver (Hexagonal)
Camera Stand
YTU93079
Color Bar Chart
YTU94133C
Communication Cable
YTU93107A
Tweezers
P-895
D-770-1.27
Service Support System
YTU94057-81
Jig Connector Cable
YTU93106C
Extension Connector
YTU94145D-40
• Torque driver
Be sure to use to fastening the mechanism and exterior parts
because those parts must strictly be controlled for tightening
torque.
• Bit
This bit is slightly longer than those set in conventional torque
drivers.
• Tweezers
To be used for removing and installing parts and wires.
• Chip IC replacement jig
To be used for adjustment of the camera system.
• Cleaning cloth
Recommended the Cleaning cloth to wipe down the video
heads, mechanism (tape transport system), optical lens surface.
(No.YF042)1-17
Page 18
• Guide driver (Hexagonal)
To be used to turn the guide roller to adjustment of the linarity
of playback envelope.
• INF adjustment lens
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
• INF lens holder
To be used together with the Camera stand for operating the
Videocamera in the stripped-down condition such as the status without the exterior parts or for using commodities that are
not yet conformable to the interchangeable ring. For the usage
of the INF lens holder, refer to the Service Bulletin No. YA-SB-
10035.
• Camera stand
To be used together with the INF adjustment lens holder. For
the usage of the Camera stand, refer to the Service Bulletin
No. YA-SB-10035.
• Light box assembly
To be used for adjustment of the camera system. For the
usage of the Light box assembly, refer to the Service Bulletin
No. YA-SB-10035.
• Gray scale chart
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
• Color bar chart
To be used for adjustment of the camera system. For the
usage of the INF adjustment lens, refer to the Service Bulletin
No. YA-SB-10035.
• Alignment tape
To be used for check and adjustment of interchangeability of
the mechanism.
• PC cable
To be used to connect the Videocamera and a personal computer
with each other when a personal computer issued for adjustment.
• Communication cable
Connect the Communication cable between the PC cable and
Jig connector cable when performing a PC adjustment.
• Service support system
To be used for adjustment with a personal computer. Software
can be downloaded also from JS-net.
• Jig connector cable
Connected to JIG CONNECTOR of the main board and used
for electrical adjustment, etc.
• Extension connector
Connect this extension connector to the connector of the Jig
connector cable for extending the cable connector.
4.2JIG CONNECTOR CABLE CONNECTION
Connection procedure
GUIDE ROLLER (TU)
COVER
(ADJUST)
GUIDE ROLLER (SUP)
JIG CONNECTOR
COVER (JIG)
EXTENSION CONNECTOR
JIG CONNECTOR CABLE
TO GND
RED
WHITE
BLACK
TO JLIP_RX
TO JLIP_TX
COMMUNICATION CABLE
COMMUNICATION CABLEJIG CONNECTOR
SCREW
1
PC CABLE
FOR
COMMUNICATION CABLE
TO ENV_OUT
SERVICE SUPPORT SYSTEM
RS232C
COM PORT
PERSONAL COMPUTER
TO HID1
Fig.4-2-1
SCREW
MENU
OSCILLOSCOPEJIG CONNECTOR
1-18 (No.YF042)
Page 19
Jig connector diagrams
JIG CONNECTOR CABLE
MAIN
CN111
DDI
DDO
DMS
DCK
DRST
FL_MDO
RESET
AL_3VSYS
IF_TX
JLIP_TX
JLIP_RX
TMS_DSC
TCK_DSC
TDI_DSC
TRST_DSC
TDO_DSC
PB_CLK
ENV_OUT
MAIN_VCO
ATFI
HID1
DISCRI
FS_PLL
TXD2
SPA
SBE
RXD2
GND
GND
V_OUT
VCOM_M
CVF_B
CVF_R
CVF_G
HD_M
VCOM_E
NC
EMU1
KENTO
MVD
1
21
2
22
3
23
4
24
5
25
6
26
7
27
8
28
9
29
10
30
11
31
12
32
13
33
14
34
15
35
16
36
17
37
18
38
19
39
20
40
NOTE :
The JIG CONNECTOR BOARD uses
30 of the 40 pins of the MAIN BOARD.
10 Pins (1 to 5, 21 to 24 and 34) on
the JIG CONNECTOR BOARD on the
Main board are NC.
JIG CONN. BOARD
(PIN NO.)
JLIP_RX
6
TCK_DSC
7
TRST_DSC
8
PB_CLK
9
MAIN_VCO
10
HID1
11
FS_PLL
12
SPA
13
RXD2
14
GND
15
VCOM_M
16
CVF_R
17
HD_M
18
NC
19
KENTO
20
JLIP_TX
25
TMS_DSC
26
TDI_DSC
27
TDO_DSC
28
ENV_OUT
29
ATFI
30
DISCRI
31
TXD2
32
SBE
33
V_OUT
35
CVF_B
36
CVF_G
37
VCOM_E
38
EMU1
39
MVD
40
4.3MECHANISM COMPATIBILITY ADJUSTMENT
4.3.1 Tape pattern adjustment
NOTE:
Prior to the adjustment, remove the COVER (ADJUST).
(1) Play back the compatibility adjustment tape.
(2) While triggering the HID1, observe the waveform of
ENV_OUT.
(3) Set the manual tracking mode (ATF OFF).
(4) Confirm that the waveform is entirely parallel and straight,
and free from remarkable level-down, through the tracking
operation.
Make the confirmation as follows if necessary.
(5) If level-down is observed on the left hand side of the
waveform, straighten the level by turning the GUIDE
ROLLER (SUP).
If level-down is observed on the right hand side of the
waveform, straighten the
level by turning the GUIDE ROLLER (TU).
(6) After the adjustment, try the unloading motion once, and
confirm that the waveform is flat when the tape has been
played back again.
(7) Play back the self-recording.
(8) Confirm that the waveform is flat.
ENV_OUT
HID1
Fig.4-3-1
Flatten the waveform.
Fig.4-2-2
Misalignment of guide
roller height on the
supply side
Misalignment of guide roller
height on the take-up side
Fig.4-3-2
4.4ELECTRICAL ADJUSTMENT
Electrical adjustment is performed by using a personal computer
and software for SERVICE SUPPORT SYSTEM. Read
README.TXT file to use the software properly.
As for the connection of cables, see "4.2 JIG CONNECTOR
CABLE CONNECTION".
(No.YF042)1-19
Page 20
5.1SERVICE NOTE
SECTION 5
TROUBLE SHOOTING
b
[9]
[7][8][1][2][3][4]
[5][6]
FA7
[5][11]
ab
FA5FA6
㧖㧖㧖㧖㧖㧖㧖㧖㧖㧖㧖
㧖
LO5
cb
[7] OP BLOCK ASSEMBLY/CCD BOARD ASSEMBLY
Place to stick screwψ
Screw tightening torqueψ
Removing order of screwψ
Reference drawing (Fig.No.)ψ
[2][3][4][6]
ASSEMBLY/DISASSEMBLY OF CABINET PARTS AND ELECTRICAL PARTS(2)
㧝) Mark* (position to attach screws)㧦To prevent screws from loosening, screws that use Lock are used.
㧨Notice㧪
Reference drawing (Fig.No.)ψ
The following values are specified values for attachment procedure in a production assembly line. Therefore, tighten screws at values under the following values.
A screw that is removed once must not be used, and a new specified screw must be used.
During the procedure, be careful enough not to damage screws and screw holes.
㧞) In tightening screws
Torque setting value of torque driver is limited. At the values over the maximum torque setting value, fasten a screw manually.
Page 21
5.2TAKE OUT CASSETTE TAPE
(1) Remove the Power Unit (battery or DC code) from the set.
(2) Open the CASSETTE COVER till it is completely opened
and fixed.
(3) Attach a PVC tape as shown in the figure.
NOTE:
Be careful of cassette tape damage caused because the
CASSETTE HOUSING ASSEMBLY is moved upward at
the unloading end (EJECT mode).
(4) To set the SLIDE DECK ASSEMBLY to the unloading end,
apply DC 3V to the electrode (terminal) on the top surface
of the LOADING MOTOR ASSEMBLY that is seen through
a hole under the plate removed in the procedure (2).
NOTE:
Be careful not to attach grease or a similar substance to
the surface of the cassette tape on the tape transport
system.
(5) Wind the cassette tape by directly turning the REEL DISK
ASSEMBLY (SUP) from the backside of the SLIDE DECK
ASSEMBLY by using a sharp tool (Chip IC replacement
tool).
(6) Confirm that the cassette tape is completely wound, and
then peel off the PVC tape from the CASSETTE HOUSING
ASSEMBLY and take out the cassette tape.
NOTE:
To confirm that the cassette tape is completely wound,
confirm that one REEL DISK ASSEMBLY (TU) rotates
as you rotate the other REEL DISK ASSEMBLY (SUP).
(7) Make sure that grease or a similar substance is not
attached to the surface of the tape taken out in the
procedure (7). Similarly, also make sure that grease or a
similar substance is not attached on the MECHANISM
ASSEMBLY, especially the tape transport system.
(DC3V)
LOADING MOTOR
ASSEMBLY
REEL DISK
ASSEMBLY (SUP)
SLIDE DECK
ASSEMBLY
CASSETTE COVER
TAPE
CASSETTE HOUSING
ASSEMBLY
Fig.5-2-1
(No.YF042)1-21
Page 22
5.3EMERGENCY DISPLAY
Example (in case of the error number E01):
Whenever some abnormal signal is input to the syscon CPU, an
error number (E01, as an example) is displayed on the LCD
monitor or (in the electronic view finder).In every error status,
such the message as shown below alter nately appear over and
E01
UNIT IN
SAFEGUARD MODE
E01
REMOVE AND
REATTACH BATTERY
over.
• In an emergency mode, all operations except turning on/off the
POWER switch are ineffectual.
LCD displayEmergencymodeDetailsPossible cause
E01LOADINGIn the case the encoder position is
not shifted to the next point though
the loading motor has rotated in the
loading direction for 4 seconds or
more. This error is defined as [E01].
E02UNLOADINGIn the case the encoder position is
not shifted to the next point though
the loading motor has rotated in the
unloading direction for 4 seconds or
1. The mechanism is locked during mode shift.
2. The mechanism is locked at the mechanism loading end,
because the encoder position is skipped during
mechanism mode shift.
3. No power is supplied to the loading MDA.
1. The mechanism is locked during mode shift.
2. The mechanism is locked at the mechanism loading end,
because the encoder position is skipped during
mechanism mode shift.
more. This error is defined as [E02].
E03TU & SUP REEL FG In the case no REEL FG is
produced for seconds shown in the
table below or more in the capstan
rotation mode after loading was
complete, the mechanism mode is
shifted to STOP with the pinch roller
set off. This error is defined as
[E03].However, no REEL EMG is
detected in the SLW/STILL mode.
REEL(SUP) REEL(TU)
PB/REC
S-FWD
S-REW
FF
REW
3 SEC
3 SEC
0.3 SEC
3 SEC
0.1 SEC
3 SEC
0.3 SEC
3 SEC
0.1 SEC
3 SEC
E04DRUM FGIn the case there is no DRUM FG
input in the drum rotation mode for
4 seconds or more. This error is
defined as [E04], and the
mechanism mode is shifted to
STOP with the pinch roller set off.
1. The idler gear does not engage with the reel disk well.
2. Though the idler gear and reel disk are engaged with
each other, the tape is not wound because of overload
to the mechanism.
3. No FG pulse is output from the reel sensor.
4. No power is supplied to the reel sensor.
5. Tape transport operation takes place with a cassette
having no tape inside.
6. The tape slackens and no pulse is produced until the
slack is taken up and the tape comes into the normal
status.
1. The drum cannot be started or drum rotation is stopped
because tape transport load is too high.
1) Tape tension is extremely high.
2) The tape is damaged or soiled with grease, etc.
2. The DRUM FG signal is not received by the syscon CPU.
1) Disconnection in the middle of the signal line.
2) Failure of the DRUM FG pulse generator (hall
element).
3. No drum control voltage is supplied to the MDA.
4. No power is supplied to the DRUM MDA.
E05---
E06CAPSTAN FGIn the case no CAPSTAN FG is
produced in the capstan rotation
mode for 2 seconds or more. This
error is defined as [E06], and the
mechanism mode is shifted to
STOP with the pinch roller set
off.However, no CAPSTAN EMG is
detected in the STILL/FF/REW
mode.
1. The CAPSTAN FG signal is not received by the syscon
CPU.
1) Disconnection in the middle of the signal line.
2) Failure of the CAPSTAN FG pulse generator (MR
element).
2. No capstan control voltage is supplied to the MDA.
3. The capstan cannot be started or capstan rotation is
stopped because tape transport load is too high.
1) Tape tension is extremely high. (Mechanical locking)
2) The tape is damaged or soiled with grease, etc. (Tape
tangling occurs, etc.)
Fig.5-3-1
1-22 (No.YF042)
Page 23
JVC SERVICE & ENGINEERING COMPANY OF AMERICA
DIVISION OF JVC AMERICAS CORP.
www.jvcservice.com(US Only)
JVC CANADA INC.
Head office : 21 Finchdene Square Scarborough, Ontario M1X 1A7(416)293-1311
(No.YF042)
Printed in Japan
WPC
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