Intel LGA1155, CORE PROCESSOR FAMILY DESKTOP User Manual

2nd Generation Intel

Core™ Processor Family Desktop and LGA1155 Socket

Thermal Mechanical Specifications and Design Guidelines (TMSDG)

Supporting the Intel® Core™ i7, i5 and i3 Desktop Processor January 2011

Document Number #: 324644-002

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The processor and Intel Series 6 Chipset and LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

“Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see

http://www.intel.com/technology/turboboost.”

Enhanced Intel

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See www.intel.com/products/processor_number for details.

SpeedStep® Technology See the Processor Spec Finder or contact your Intel representative for more information.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Intel, Intel Core, Pentium, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.

* Other brands and names may be claimed as the property of others.

2 Thermal/Mechanical Specifications and Design Guidelines

Contents

1Introduction..............................................................................................................9

1.1 References ....................................................................................................... 10

1.2 Definition of Terms ............................................................................................ 10

2 Package Mechanical & Storage Specifications.......................................................... 13

2.1 Package Mechanical Specifications ....................................................................... 13

2.1.1 Package Mechanical Drawing.................................................................... 14

2.1.2 Processor Component Keep-Out Zones...................................................... 14

2.1.3 Package Loading Specifications ................................................................ 15

2.1.4 Package Handling Guidelines.................................................................... 15

2.1.5 Package Insertion Specifications............................................................... 15

2.1.6 Processor Mass Specification.................................................................... 15

2.1.7 Processor Materials................................................................................. 16

2.1.8 Processor Markings................................................................................. 16

2.1.9 Processor Land Coordinates ..................................................................... 17

2.2 Processor Storage Specifications ......................................................................... 18

3 LGA1155 Socket ...................................................................................................... 19

3.1 Board Layout .................................................................................................... 20

3.1.1 Suggested Silkscreen Marking for Socket Identification................................ 22

3.2 Attachment to Motherboard ................................................................................ 22

3.3 Socket Components........................................................................................... 23

3.3.1 Socket Body Housing .............................................................................. 23

3.3.2 Solder Balls ........................................................................................... 23

3.3.3 Contacts ............................................................................................... 23

3.3.4 Pick and Place Cover............................................................................... 23

3.4 Package Installation / Removal ........................................................................... 24

3.4.1 Socket Standoffs and Package Seating Plane.............................................. 25

3.5 Durability ......................................................................................................... 25

3.6 Markings .......................................................................................................... 25

3.7 Component Insertion Forces ............................................................................... 26

3.8 Socket Size ...................................................................................................... 26

4 Independent Loading Mechanism (ILM)................................................................... 27

4.1 Design Concept................................................................................................. 27

4.1.1 ILM Assembly Design Overview ................................................................ 27

4.1.2 ILM Back Plate Design Overview............................................................... 28

4.1.3 Shoulder Screw and Fasteners Design Overview ......................................... 29

4.2 Assembly of ILM to a Motherboard....................................................................... 30

4.3 ILM Interchangeability ....................................................................................... 32

4.4 Markings .......................................................................................................... 32

4.5 ILM Cover ........................................................................................................ 33

5 LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications .. 37

5.1 Component Mass............................................................................................... 37

5.2 Package/Socket Stackup Height .......................................................................... 37

5.3 Loading Specifications........................................................................................ 38

5.4 Electrical Requirements...................................................................................... 39

5.5 Environmental Requirements .............................................................................. 40

6 Thermal Specifications ............................................................................................ 41

6.1 Thermal Specifications ....................................................................................... 41

6.1.1 Intel

Core™ i7-2000 and i5-2000 Desktop Processor Series

(Quad Core 95W) Thermal Profile ............................................................. 43

Thermal/Mechanical Specifications and Design Guidelines 3

6.1.2 Intel® Core™ i7-2000 and i5-2000 Desktop Processor Series (Quad Core 65W) and Intel

(Dual Core 65W) Thermal Profile..............................................................44

6.1.3 Intel

Thermal Profile.......................................................................................46

6.1.4 Intel

Core™ i5-2000 desktop processor series (Quad Core 45W)

Core™ i5-2000 and i3-2000 Desktop Processor Series

Core™ i3-2000 Desktop Processor Series

(Dual Core 35W) Thermal Profile...............................................................47

6.1.5 Processor Specification for Operation Where Digital Thermal Sensor Exceeds T

CONTROL

...................................................................................48

6.1.6 Thermal Metrology..................................................................................52

6.2 Processor Thermal Features ................................................................................53

6.2.1 Processor Temperature............................................................................53

6.2.2 Adaptive Thermal Monitor ........................................................................53

6.2.2.1 Frequency/VID Control...............................................................54

6.2.2.2 Clock Modulation.......................................................................55

6.2.2.3 Immediate Transition to combined TM1 and TM2 ...........................55

6.2.2.4 Critical Temperature Flag ...........................................................56

6.2.2.5 PROCHOT# Signal .....................................................................56

6.2.3 THERMTRIP# Signal................................................................................56

6.3 Intel® Turbo Boost Technology ............................................................................57

6.3.1 Intel® Turbo Boost Technology Frequency..................................................57

6.3.2 Intel® Turbo Boost Technology Graphics Frequency ....................................57

6.4 Thermal Considerations ......................................................................................58

6.4.1 Intel

Turbo Boost Technology Power Control and Reporting ........................58

6.4.2 Package Power Control ............................................................................59

6.4.3 Power Plane Control ................................................................................60

6.4.4 Turbo Time Parameter.............................................................................60

7 PECI Interface .........................................................................................................61

7.1 Platform Environment Control Interface (PECI) ......................................................61

7.1.1 Introduction...........................................................................................61

7.1.1.1 Fan Speed Control with Digital Thermal Sensor .............................61

8 Sensor Based Thermal Specification Design Guidance ..............................................63

8.1 Sensor Based Specification Overview (DTS 1.0) .....................................................63

8.2 Sensor Based Thermal Specification .....................................................................65

8.2.1 TTV Thermal Profile.................................................................................65

8.2.2 Specification When DTS value is Greater than TCONTROL.............................66

8.3 Thermal Solution Design Process .........................................................................66

8.3.1 Boundary Condition Definition ..................................................................67

8.3.2 Thermal Design and Modelling ..................................................................68

8.3.3 Thermal Solution Validation......................................................................68

8.3.3.1 Test for Compliance to the TTV Thermal Profile..............................68

8.3.3.2 Thermal Solution Characterization for Fan Speed Control ................68

8.4 Fan Speed Control (FSC) Design Process...............................................................69

8.4.1 Fan Speed Control Algorithm without TAMBIENT Data..................................70

8.4.2 Fan Speed Control Algorithm with TAMBIENT Data ......................................71

8.4.3 DTS 1.1 A New Fan Speed Control Algorithm without TAMBIENT Data............73

8.4.4 Fan Speed Control Implementation Details.................................................75

8.5 System Validation..............................................................................................76

8.6 Thermal Solution Characterization........................................................................77

9 ATX Reference Thermal Solution..............................................................................79

9.1 Heatsink Thermal Solution ..................................................................................79

9.2 Geometric Envelope for the Intel Reference ATX Thermal Mechanical Design..............81

9.3 Reference Design Components ............................................................................82

9.3.1 Extrusion...............................................................................................82

4 Thermal/Mechanical Specifications and Design Guidelines

9.3.2 Clip ...................................................................................................... 82

9.3.3 Core ..................................................................................................... 83

9.4 Mechanical Interface to the Reference Attach Mechanism........................................ 84

9.5 Heatsink Mass & Center of Gravity....................................................................... 86

9.6 Thermal Interface Material.................................................................................. 86

9.7 Heat Pipe Thermal Considerations........................................................................ 87

10 Thermal Solution Quality and Reliability Requirements............................................ 89

10.1 Reference Heatsink Thermal Verification ............................................................... 89

10.2 Mechanical Environmental Testing ....................................................................... 89

10.2.1 Recommended Test Sequence.................................................................. 90

10.2.2 Post-Test Pass Criteria ............................................................................ 90

10.2.3 Recommended BIOS/Processor/Memory Test Procedures............................. 90

10.3 Material and Recycling Requirements ................................................................... 91

11 Boxed Processor Specifications ............................................................................... 93

11.1 Introduction ..................................................................................................... 93

11.2 Mechanical Specifications ................................................................................... 94

11.2.1 Boxed Processor Cooling Solution Dimensions ............................................ 94

11.2.2 Boxed Processor Fan Heatsink Weight ....................................................... 96

11.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly ..... 96

11.3 Electrical Requirements...................................................................................... 96

11.3.1 Fan Heatsink Power Supply...................................................................... 96

11.4 Thermal Specifications ....................................................................................... 98

11.4.1 Boxed Processor Cooling Requirements ..................................................... 98

11.4.2 Variable Speed Fan............................................................................... 100

Figures

2-1 Processor Package Assembly Sketch ........................................................................ 13

2-2 Package View ....................................................................................................... 14

2-3 Processor Top-Side Markings .................................................................................. 16

2-4 Processor Package Lands Coordinates ...................................................................... 17

3-1 LGA1155 Socket with Pick and Place Cover ............................................................... 19

3-2 LGA1155 Socket Contact Numbering (Top View of Socket).......................................... 20

3-3 LGA1155 Socket Land Pattern (Top View of Board) .................................................... 21

3-4 Suggested Board Marking....................................................................................... 22

3-5 Attachment to Motherboard .................................................................................... 22

3-6 Pick and Place Cover.............................................................................................. 24

3-7 Package Installation / Removal Features................................................................... 25

4-1 ILM Assembly with Installed Processor ..................................................................... 28

4-2 Back Plate ............................................................................................................ 29

4-3 Shoulder Screw..................................................................................................... 30

4-4 ILM Assembly ....................................................................................................... 31

4-5 Pin1 and ILM Lever................................................................................................ 32

4-6 ILM Cover ............................................................................................................ 34

4-7 ILM Cover and PnP Cover Interference ..................................................................... 35

5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................. 40

6-1 Thermal Test Vehicle Thermal Profile for Intel

Processor Series (Quad Core 95W) .......................................................................... 43

6-2 Thermal Test Vehicle Thermal Profile for Intel

Processor Series (Quad Core 65W) and Intel

Series (Dual Core 65W) ........................................................................................ 44

6-3 Thermal Test Vehicle Thermal Profile for Intel

Series (Quad Core 45W) ........................................................................................ 46

Core™ i7-2000 and i5-2000 Desktop

Core™ i3-2000 Desktop Processor

Core™ i5-2000 Desktop Processor

Thermal/Mechanical Specifications and Design Guidelines 5

6-4 Thermal Test Vehicle Thermal Profile for Intel® Core™ i5-2000 and i3-2000 Desktop

Processor Series (Dual Core 35W) ...........................................................................47

6-5 TTV Case Temperature (TCASE) Measurement Location ..............................................52

6-6 Frequency and Voltage Ordering..............................................................................55

6-7 Package Power Control ...........................................................................................59

8-1 Comparison of Case Temperature versus Sensor Based Specification ............................64

8-2 Intel

Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)

Thermal Profile......................................................................................................65

8-3 Thermal solution Performance .................................................................................66

8-4 Example: Required YCA for Various TAMBIENT Conditions ...........................................67

8-5 Thermal Solution Performance versus Fan Speed .......................................................69

8-6 Fan Response Without TAMBIENT Data .....................................................................71

8-7 Fan Response with TAMBIENT Aware FSC..................................................................72

8-8 DTS 1.1 Definition Points ........................................................................................74

8-9 Fan Response Comparison with Various Fan Speed Control Options ..............................76

9-1 ATX Heatsink Reference Design Assembly .................................................................80

9-2 ATX KOZ 3-D Model Primary (Top) Side ....................................................................81

9-3 RCBFH Extrusion ...................................................................................................82

9-4 Clip for Existing Solutions to straddle LGA1155 Socket................................................83

9-5 Core ....................................................................................................................84

9-6 Clip Core and Extrusion Assembly ............................................................................85

9-7 Critical Parameters for Interface to the Reference Clip ................................................85

9-8 Critical Core Dimensions .........................................................................................86

9-9 TTV Die Size and Orientation...................................................................................87

11-1 Mechanical Representation of the Boxed Processor .....................................................94

11-2 Space Requirements for the Boxed Processor (side view) ............................................95

11-3 Space Requirements for the Boxed Processor (top view) .............................................95

11-4 Space Requirements for the Boxed Processor (overall view) ........................................96

11-5 Boxed Processor Fan Heatsink Power Cable Connector Description................................97

11-6 Baseboard Power Header Placement Relative to Processor Socket.................................98

11-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view).....................99

11-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view)....................99

11-9 Boxed Processor Fan Heatsink Set Points ................................................................100

6 Thermal/Mechanical Specifications and Design Guidelines

Tables

1-1 Reference Documents ............................................................................................. 10

1-2 Terms and Descriptions........................................................................................... 10

2-1 Processor Loading Specifications .............................................................................. 15

2-2 Package Handling Guidelines.................................................................................... 15

2-3 Processor Materials................................................................................................. 16

2-4 Storage Conditions ................................................................................................. 18

5-1 Socket Component Mass ......................................................................................... 37

5-2 1155-land Package and LGA1155 Socket Stackup Height ............................................. 37

5-3 Socket & ILM Mechanical Specifications ..................................................................... 38

5-4 Electrical Requirements for LGA1155 Socket .............................................................. 39

6-1 Processor Thermal Specifications.............................................................................. 42

6-2 Thermal Test Vehicle Thermal Profile for Intel

Processor Series (Quad Core 95W) ........................................................................... 43

6-3 Thermal Test Vehicle Thermal Profile for Intel

Processor Series (Quad Core 65W) and Intel

(Dual Core 65W) .................................................................................................. 45

6-4 Thermal Test Vehicle Thermal Profile for Intel

Series (Quad Core 45W) ......................................................................................... 46

6-5 Thermal Test Vehicle Thermal Profile for Intel

Processor Series (Dual Core 35W) ........................................................................... 47

6-6 Thermal Solution Performance above TCONTROL for the Intel

i5-2000 Desktop Processor Series (Quad Core 95W) ................................................... 48

6-7 Thermal Solution Performance above TCONTROL for the Intel

i5-2000 Desktop Processor Series (Quad Core 65W) and Intel

Desktop Processor Series (Dual Core 65W) ............................................................... 49

6-8 Thermal Solution Performance above TCONTROL for the Intel

Desktop Processor Series (Quad Core 45W)............................................................... 50

6-9 Thermal Solution Performance above TCONTROL for the Intel

i3-2000 Desktop Processor Series (Dual Core 35W) .................................................... 51

8-1 DTS 1.1 Thermal Solution Performance above TCONTROL............................................ 74

8-2 Fan Speed control example for 95W TDP processor1 ................................................... 75

8-3 Thermal Solution Performance above TCONTROL ........................................................ 77

9-1 Reference Thermal Solutions ................................................................................... 79

10-1 Use Conditions (Board Level) ................................................................................... 89

11-1 Fan Heatsink Power and Signal Specifications............................................................. 97

11-2 Fan Heatsink Power and Signal Specifications........................................................... 101

Core™ i7-2000 and i5-2000 Desktop

Core™ i3-2000 Desktop Processor Series

Core™ i5-2000 Desktop Processor

Core™ i5-2000 and i3-2000 Desktop

Core™ i7-2000 and

Core™ i3-2000

Core™ i5-2000

Core™ i5-2000 and

Thermal/Mechanical Specifications and Design Guidelines 7

Revision History

Revision

Number

001 • Initial release January 2011

002 • Minor edits for clarity January 2011

Description Revision Date

8 Thermal/Mechanical Specifications and Design Guidelines

Introduction

1 Introduction

The goal of this document is to provide thermal and mechanical specifications for the processor and the associated socket. The usual design guidance is also included.

The components described in this document include:

• The thermal and mechanical specifications for the following Intel® desktop processors:

—Intel® Core™ i7-2000 desktop processor series

—Intel

• The LGA1155 socket and the Independent Loading Mechanism (ILM) and back plate.

• The reference design thermal solution (heatsink) for the processors and associated retention hardware.

The Intel different thermal specifications. When required for clarity, this document will use:

—Intel® Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 95W)

—Intel

Core™ i5-2000 desktop processor series

Core™ i3-2000 desktop processor series

Core™ i7-2000, i5-2000 and i3-2000 desktop processor series has the

Core™ i7-2000 and i5-2000 desktop processor series (Quad Core 65W)

Core™ i3-2000 desktop processor series (Dual Core 65W)

Core™ i5-2000 desktop processor series (Quad Core 45W)

Core™ i5-2000 and i3-2000 desktop processor series (Dual Core 35W)

Note: When the information is applicable to all products the this document will use

“processor” or “processors” to simplify the document.

Thermal/Mechanical Specifications and Design Guidelines 9

1.1 References

Material and concepts available in the following documents may be beneficial when reading this document.

Table 1-1. Reference Documents

Document Location Notes

2nd Generation Intel Volume 1

2nd Generation Intel Volume 2

2nd Generation Intel Update

4-Wire Pulse Width Modulation (PWM) Controlled Fans

Core™ Processor Family Desktop Datasheet,

Core™ Processor Family Desktop Specification

1.2 Definition of Terms

http://

download.intel.com/

design/processor/

datashts/324641.pdf

http://

download.intel.com/

design/processor/

datashts/324642.pdf

http://

download.intel.com/

design/processor/

specupdt/324643.pdf

Available at http://

www.formfactors.org/

Introduction

Table 1-2. Terms and Descriptions

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this

CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal event.

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal

ILM Independent Loading Mechanism provides the force needed to seat the 1155-LGA land package onto the

PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media Interface (DMI) and

LGA1155 socket The processor mates with the system board through this surface mount, 1155-land socket.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication



CASE or TC

CASE_MAX

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock

example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

performance of the package. Component thermal solutions interface with the processor at the IHS surface.

socket contacts.

Intel® Flexible Display Interface (Intel® FDI).

channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T be specified for  measurements.

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (T

The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.

The maximum case temperature as specified in a component specification.

modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

– TLA) / Total Package Power.

– TLA) / Total Package Power. The heat source should always

CASE

– TS) / Total Package Power.

CASE

10 Thermal/Mechanical Specifications and Design Guidelines

Introduction

Table 1-2. Terms and Descriptions (Continued)

Term Description

CONTROL

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum

Thermal Profile Line that defines case temperature specification of the TTV at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor

TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater in the die to

Tcontrol is a static value that is below the TCC activation temperature and used as a trigger point for fan speed control. When DTS > Tcontrol, the processor must comply to the TTV thermal profile.

the maximum power that the processor can dissipate.

operating temperature.

case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

evaluate thermal solutions.

The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

Thermal/Mechanical Specifications and Design Guidelines 11

Introduction

12 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

IHS

Substrate

System Board

Capacitors

Core (die)

TIM

LGA1155 Socket

2 Package Mechanical & Storage

Specifications

2.1 Package Mechanical Specifications

The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with the motherboard via the LGA1155 socket. The package consists of a processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to the package substrate and core and serves as the mating surface for processor thermal solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package components and how they are assembled together. Refer to Chapter 3 and Chapter 4 for complete details on the LGA1155 socket.

The package components shown in Figure 2-1 include the following:

1. Integrated Heat Spreader (IHS)

2. Thermal Interface Material (TIM)

3. Processor core (die)

4. Package substrate

5. Capacitors

Figure 2-1. Processor Package Assembly Sketch

Note:

1. Socket and motherboard are included for reference and are not part of processor package.

2. For clarity the ILM not shown.

Thermal/Mechanical Specifications and Design Guidelines 13

2.1.1 Package Mechanical Drawing

37.5

Figure 2-2 shows the basic package layout and dimensions. The detailed package

mechanical drawings are in Appendix D. The drawings include dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, and so on)

2. IHS parallelism and tilt

3. Land dimensions

4. Top-side and back-side component keep-out dimensions

5. Reference datums

6. All drawing dimensions are in mm.

Figure 2-2. Package View

Package Mechanical & Storage Specifications

2.1.2 Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mechanical solution design must not intrude into the required keep-out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keepout zones. The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in. This keep-in zone includes solder paste and is a post reflow maximum height for the components.

14 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

2.1.3 Package Loading Specifications

Ta b le 2 - 1 provides dynamic and static load specifications for the processor package.

These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for

Table 2-1. Processor Loading Specifications

thermal and mechanical solution.

Parameter Minimum Maximum Notes

Static Compressive Load - 600 N [135 lbf] 1, 2, 3

Dynamic Compressive Load - 712 N [160 lbf ] 1, 3, 4

Notes:

1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface.

3. These specifications are based on limited testing for design characterization. Loading limits are for the package only and do not include the limits of the processor socket.

4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum thermal solution.

2.1.4 Package Handling Guidelines

Ta b le 2 - 2 includes a list of guidelines on package handling in terms of recommended

maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 2-2. Package Handling Guidelines

Parameter Maximum Recommended Notes

Shear 311 N [70 lbf] 1, 4

Tensile 111 N [25 lbf] 2, 4

Torque 3.95 N-m [35 lbf-in] 3, 4

Notes:

1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4. These guidelines are based on limited testing for design characterization.

2.1.5 Package Insertion Specifications

The processor can be inserted into and removed from an LGA1155 socket 15 times. The socket should meet the LGA1155 socket requirements detailed in Chapter 5.

2.1.6 Processor Mass Specification

The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all the components that are included in the package.

Thermal/Mechanical Specifications and Design Guidelines 15

2.1.7 Processor Materials

Sample (QDF):

GRP1LINE1: i{M}{C}YY GRP1LINE2: INTEL CONFIDENTIAL GRP1LINE3: QDF ES SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

Production (SSPEC):

GRP1LINE1: i{M}{C}YY GRP1LINE2: BRAND PROC# GRP1LINE3: SSPEC SPEED GRP1LINE4: COUNTRY OF ORIGIN GRP1LINE5: {FPO} {e4}

Package Mechanical & Storage Specifications

Tab l e 2- 3 lists some of the package components and associated materials.

Table 2-3. Processor Materials

Component Material

Integrated Heat Spreader (IHS) Nickel Plated Copper

Substrate Fiber Reinforced Resin

Substrate Lands Gold Plated Copper

2.1.8 Processor Markings

Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the

identification of the processor.

Figure 2-3. Processor Top-Side Markings

GRP1LINE1 GRP1LINE2 GRP1LINE3 GRP1LINE4 GRP1LINE5

S/N

16 Thermal/Mechanical Specifications and Design Guidelines

Package Mechanical & Storage Specifications

1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31

33 35 37 39

2 4 6 8 101214 1618202224 26283032

34 36 38 40

2.1.9 Processor Land Coordinates

Figure 2-4. Processor Package Lands Coordinates

Thermal/Mechanical Specifications and Design Guidelines 17

Figure 2-4 shows the bottom view of the processor package.

Package Mechanical & Storage Specifications

2.2 Processor Storage Specifications

Tab l e 2- 4 includes a list of the specifications for device storage in terms of maximum

and minimum temperatures and relative humidity. These conditions should not be

Table 2-4. Storage Conditions

exceeded in storage or transportation.

Parameter Description Min Max Notes

ABSOLUTE STORAGE

SUSTAINED STORAGE

TIME

SUSTAINED STORAGE

Notes:

1. Refers to a component device that is not assembled in a board or socket that is not to be electrically connected to a voltage reference or I/O signals.

2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in by applicable JEDEC standard Non-adherence may affect processor reliability.

3. T

ABSOLUTE STORAGE

moisture barrier bags or desiccant.

4. Intel branded board products are certified to meet the following temperature and humidity limits that are given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%, non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not specified for non-Intel branded boards.

5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture sensitive devices removed from the moisture barrier bag.

6. Nominal temperature and humidity conditions and durations are given and tested within the constraints imposed by T

The non-operating device storage temperature. Damage (latent or otherwise) may occur when subjected to for any length of time.

The ambient storage temperature limit (in shipping media) for a sustained period of time.

The maximum device storage relative humidity for a sustained period of time.

A prolonged or extended period of time; typically associated with customer shelf life.

applies to the unassembled component only and does not apply to the shipping media,

SUSTAINED STORAGE

and customer shelf life in applicable intel box and bags.

-55 °C 125 °C 1, 2, 3

-5 °C 40 °C 4, 5

60% @ 24 °C 5, 6

Months6 Months

18 Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3 LGA1155 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Chapter 5.

Figure 3-1. LGA1155 Socket with Pick and Place Cover

Thermal/Mechanical Specifications and Design Guidelines 19

Figure 3-2. LGA1155 Socket Contact Numbering (Top View of Socket)

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

7 5

15 13

23 21

14 12

22 20

30 28

38 36

LGA1155 Socket

3.1 Board Layout

The land pattern for the LGA1155 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. Note that there is no round-off (conversion) error between

20 Thermal/Mechanical Specifications and Design Guidelines

socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction, see Figure 3-3. This was to achieve a common package land to PCB land offset which ensures a single PCB layout for socket designs from the multiple vendors.

LGA1155 Socket

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

7 5

15 13

23 21

14 12

22 20

38 36

B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY

A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW

122.6 mi l (3.1 144mm )

36mil (0.9144 mm )

Figure 3-3. LGA1155 Socket Land Pattern (Top View of Board)

Thermal/Mechanical Specifications and Design Guidelines 21

LGA1155 Socket

Load plate

Frame

Load Lever

Back Plate

Shoulder Screw

Load plate

Frame

Load Lever

Back Plate

Shoulder Screw

3.1.1 Suggested Silkscreen Marking for Socket Identification

Intel is recommending that customers mark the socket name approximately where shown in Figure 3-4.

Figure 3-4. Suggested Board Marking

3.2 Attachment to Motherboard

The socket is attached to the motherboard by 1155 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 3-1, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

Figure 3-5. Attachment to Motherboard

22 Thermal/Mechanical Specifications and Design Guidelines

LGA1155 Socket

3.3 Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Appendix C for detailed drawings.

3.3.1 Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane), and creep properties, must be such that the integrity of the socket is maintained for the conditions listed in Chapter 5.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

3.3.2 Solder Balls

A total of 1155 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:

• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3% and 4% and a melting temperature of approximately 217 °C. The alloy is compatible with immersion silver (ImAg) and Organic Solderability Protectant (OSP) motherboard surface finishes and a SAC alloy solder paste.

• Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead.

The co-planarity (profile) and true position requirements are defined in Appendix C.

3.3.3 Contacts

Base material for the contacts is high strength copper alloy.

For the area on socket contacts where processor lands will mate, there is a 0.381 m [15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel underplate.

No contamination by solder in the contact area is allowed during solder reflow.

3.3.4 Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in the Surface Mount Technology (SMT) manufacturing line. The cover remains on the socket during reflow to help prevent contamination during reflow. The cover can withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions listed in Chapter 5 without degrading.

As indicated in Figure 3-6, the cover remains on the socket during ILM installation, and should remain on whenever possible to help prevent damage to the socket contacts.

Thermal/Mechanical Specifications and Design Guidelines 23

Cover retention must be sufficient to support the socket weight during lifting,

Pick & Place Cover

Pin 1

ILM Installation

Pick & Place Cover

Pin 1

ILM Installation

translation, and placement (board manufacturing), and during board and system shipping and handling. PnP Cover should only be removed with tools, to prevent the cover from falling into the contacts.

The socket vendors have a common interface on the socket body where the PnP cover attaches to the socket body. This should allow the PnP covers to be compatible between socket suppliers.

As indicated in Figure 3-6, a Pin1 indicator on the cover provides a visual reference for proper orientation with the socket.

Figure 3-6. Pick and Place Cover

LGA1155 Socket

3.4 Package Installation / Removal

24 Thermal/Mechanical Specifications and Design Guidelines

As indicated in Figure 3-7, access is provided to facilitate manual installation and removal of the package.

To assist in package orientation and alignment with the socket:

• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation.

• The package substrate has orientation notches along two opposing edges of the package, offset from the centerline. The socket has two corresponding orientation posts to physically prevent mis-orientation of the package. These orientation features also provide initial rough alignment of package to socket.

• The socket has alignment walls at the four corners to provide final alignment of the package.

LGA1155 Socket

Pin 1 Chamfer

Package Pin 1 Indicator

Alignment Post (2 Places)

Finger/Tool Access (2 Pla ces)

Orientation Notch (2 Place s)

Figure 3-7. Package Installation / Removal Features

3.4.1 Socket Standoffs and Package Seating Plane

Standoffs on the bottom of the socket base establish the minimum socket height after solder reflow and are specified in Appendix C.

Similarly, a seating plane on the topside of the socket establishes the minimum package height. See Section 5.2 for the calculated IHS height above the motherboard.

3.5 Durability

The socket must withstand 20 cycles of processor insertion and removal. The max chain contact resistance from Tab l e 5 - 4 must be met when mated in the 1st and 20th cycles.

The socket Pick and Place cover must withstand 15 cycles of insertion and removal.

3.6 Markings

There are three markings on the socket:

• LGA1155: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark will also appear on the pick and place cap.

• Manufacturer's insignia (font size at supplier's discretion).

• Lot identification code (allows traceability of manufacturing date and location).

Thermal/Mechanical Specifications and Design Guidelines 25

All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile) without degrading, and must be visible after the socket is mounted on the motherboard.

LGA1155 and the manufacturer's insignia are molded or laser marked on the side wall.

3.7 Component Insertion Forces

Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/ Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force to insert the package into the socket.

3.8 Socket Size

Socket information needed for motherboard design is given in Appendix C.

This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal mechanical components.

LGA1155 Socket

26 Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

4 Independent Loading

Mechanism (ILM)

The ILM has two critical functions: deliver the force to seat the processor onto the socket contacts and distribute the resulting compressive load evenly through the socket solder joints.

The mechanical design of the ILM is integral to the overall functionality of the LGA1155 socket. Intel performs detailed studies on integration of processor package, socket and ILM as a system. These studies directly impact the design of the ILM. The Intel reference ILM will be “build to print” from Intel controlled drawings. Intel recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's detailed studies and may not incorporate critical design parameters.

Note: There is a single ILM design for the LGA1155 socket and LGA1156 socket.

4.1 Design Concept

The ILM consists of two assemblies that will be procured as a set from the enabled vendors. These two components are ILM assembly and back plate. To secure the two assemblies, two types of fasteners are required a pair (2) of standard 6-32 thread screws and a custom 6-32 thread shoulder screw. The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once assembled the ILM is not required to be removed to install / remove the motherboard from a chassis.

4.1.1 ILM Assembly Design Overview

The ILM assembly consists of 4 major pieces: ILM cover, load lever, load plate and the hinge frame assembly.

All of the pieces in the ILM assembly except the hinge frame and the screws used to attach the back plate are fabricated from stainless steel. The hinge frame is plated. The frame provides the hinge locations for the load lever and load plate. An insulator is preapplied to the bottom surface of the hinge frame.

The ILM assembly design ensures that once assembled to the back plate the only features touching the board are the shoulder screw and the insulated hinge frame assembly. The nominal gap of the load plate to the board is ~1 mm.

When closed the load plate applies two point loads onto the IHS at the “dimpled” features shown in Figure 4-1. The reaction force from closing the load plate is transmitted to the hinge frame assembly and through the fasteners to the back plate. Some of the load is passed through the socket body to the board inducing a slight compression on the solder joints.

A pin 1 indicator will be marked on the ILM assembly.

Thermal/Mechanical Specifications and Design Guidelines 27

Figure 4-1. ILM Assembly with Installed Processor

Fasteners

Load Lever

Load Plate

Hinge / Frame Assy

Shoulder Screw

Pin 1 Indicator

Fasteners

Load Lever

Load Plate

Hinge / Frame Assy

Shoulder Screw

Pin 1 Indicator

Independent Loading Mechanism (ILM)

4.1.2 ILM Back Plate Design Overview

The back plate is a flat steel back plate with pierced and extruded features for ILM attach. A clearance hole is located at the center of the plate to allow access to test points and backside capacitors if required. An insulator is pre-applied. A notch is placed in one corner to assist in orienting the back plate during assembly.

Caution: Intel does NOT recommend using the server back plate for high-volume desktop

applications at this time as the server back plate test conditions cover a limited envelope. Back plates and screws are similar in appearance. To prevent mixing, different levels of differentiation between server and desktop back plate and screws have been implemented.

For ILM back plate, three levels of differentiation have been implemented:

• Unique part numbers, please refer to part numbers listed in Appendix A.

• Desktop ILM back plate to use black lettering for marking versus server ILM back plate to use yellow lettering for marking.

• Desktop ILM back plate using marking “115XDBP” versus server ILM back plate using marking “115XSBP”.

Note: When reworking a BGA component or the socket that the heatsink, battery, ILM and

ILM Back Plate are removed prior to rework. The ILM back plate should also be removed when reworking through hole mounted components in a mini-wave or solder pot). The maximum temperature for the pre-applied insulator on the ILM is approximately 106 °C.

28 Thermal/Mechanical Specifications and Design Guidelines

Independent Loading Mechanism (ILM)

Die Cut Insulator

Pierced & Extruded Thread Features

Assembly Orientation Feature

Die Cut Insulator

Pierced & Extruded Thread Features

Assembly Orientation Feature

Figure 4-2. Back Plate

4.1.3 Shoulder Screw and Fasteners Design Overview

Note: The screws for Server ILM are different from Desktop design. The length of Server ILM

Note: Unique part numbers, please refer to Appendix A. Note: The reference design incorporates a T-20 Torx* head fastener. The Torx* head fastener

The shoulder screw is fabricated from carbonized steel rod. The shoulder height and diameter are integral to the mechanical performance of the ILM. The diameter provides alignment of the load plate. The height of the shoulder ensures the proper loading of the IHS to seat the processor on the socket contacts. The design assumes the shoulder screw has a minimum yield strength of 235 MPa.

A dimensioned drawing of the shoulder screw is available for local sourcing of this component. Please refer to Figure B-13 for the custom 6-32 thread shoulder screw drawing.

The standard fasteners can be sourced locally. The design assumes this fastener has a minimum yield strength of 235 MPa. Please refer to Figure B-14 for the standard 6-32 thread fasteners drawing.

screws are shorter than the Desktop screw length to satisfy Server secondary-side clearance limitation.

was chosen to ensure end users do not inadvertently remove the ILM assembly and for consistency with the LGA1366 socket ILM.

Thermal/Mechanical Specifications and Design Guidelines 29

Figure 4-3. Shoulder Screw

Shoulder

6-32 thread

Cap

Independent Loading Mechanism (ILM)

4.2 Assembly of ILM to a Motherboard

The ILM design allows a bottoms up assembly of the components to the board. See

Figure 4-4 for step by step assembly sequence.

1. Place the back plate in a fixture. The motherboard is aligned with the fixture.

2. Install the shoulder screw in the single hole near Pin 1 of the socket. Torque to a minimum and recommended 8 inch-pounds, but not to exceed 10 inch-pounds.

3. Align and place the ILM assembly over the socket.

4. Install two (2) 6-32 fasteners. Torque to a minimum and recommended 8 inchpounds, but not to exceed 10 inch-pounds.

The thread length of the shoulder screw accommodates a nominal board thicknesses of

0.062”.

30 Thermal/Mechanical Specifications and Design Guidelines

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