Intel BOXD875PBZLK, KD875PBZLKPAK10 - 10PK 875P P4-800/533MHZ Fsbatx Ddr AGP8X SATA150 5PCI, D875PBZ Technical Product Specification
Intel® Desktop Board D875PBZ
Technical Product Specification
The Intel® Desktop Board D875PBZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D875PBZ Specification Update.
April 2003
Order Number: C31765-001
Revision History
Revision Revision History Date
-001 First release of the Intel Desktop Board D875PBZ Technical Product
Specification.
This product specification applies to only the standard Intel Desktop Board D875PBZ with BIOS
identifier BZ87510A.86A.
Changes to this specification will be published in the Intel Desktop Board D875PBZ Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
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WARRANTY, RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES
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rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
Intel® desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
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Intel and Pentium are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2003, Intel Corporation. All rights reserved.
April 2003
Preface
This Technical Product Specification (TPS) specifies the Intel® Desktop Board D875PBZ layout,
components, connectors, power and environmental requirements, and BIOS. The TPS describes
the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board and its
components to the vendors, system integrators, and other engineers and technicians who need this
level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D875PBZ
2 A map of the resources of the Desktop Board D875PBZ
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
iii
Intel Desktop Board D875PBZ Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D875PBZ, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview ....................................................................................................................12
1.1.1 Feature Summary ........................................................................................12
1.1.2 Manufacturing Options .................................................................................13
1.1.3 Board Layout................................................................................................14
1.1.4 Block Diagram..............................................................................................15
1.2 Online Support ...........................................................................................................16
1.3 Operating System Support .........................................................................................16
1.4 Design Specifications .................................................................................................17
1.5 Processor ...................................................................................................................20
1.6 System Memory .........................................................................................................21
1.6.1 Memory Features.........................................................................................21
1.6.2 Memory Configurations ................................................................................23
1.7 Intel® 875P Chipset ....................................................................................................28
1.7.1 AGP .............................................................................................................29
1.7.2 USB..............................................................................................................29
1.7.3 IDE Support .................................................................................................30
1.7.4 Real-Time Clock, CMOS SRAM, and Battery...............................................32
1.7.5 Intel® 82802AC Firmware Hub (FWH)..........................................................32
1.8 I/O Controller..............................................................................................................32
1.8.1 Serial Port ....................................................................................................33
1.8.2 Parallel Port..................................................................................................33
1.8.3 Diskette Drive Controller ..............................................................................33
1.8.4 Keyboard and Mouse Interface ....................................................................33
1.9 Audio Subsystem (Optional).......................................................................................34
1.9.1 Audio Subsystem Software ..........................................................................34
1.9.2 Intel® Flex 6 Audio Subsystem .....................................................................34
1.9.3 Audio Connectors.........................................................................................36
1.10 LAN Subsystem..........................................................................................................37
1.10.1 LAN Subsystem Software ............................................................................37
1.10.2 Intel® 82547EI Platform LAN Connect Device ..............................................37
1.10.3 RJ-45 LAN Connector with Integrated LEDs ................................................37
1.11 Hardware Management Subsystem............................................................................38
1.11.1 Hardware Monitoring and Fan Control ASIC ................................................38
1.11.2 Thermal Monitoring ......................................................................................39
1.11.3 Fan Monitoring .............................................................................................40
1.11.4 Chassis Intrusion and Detection...................................................................40
1.12 Power Management ...................................................................................................40
1.12.1 ACPI.............................................................................................................41
1.12.2 Hardware Support ........................................................................................43
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Intel Desktop Board D875PBZ Technical Product Specification
2 Technical Reference
2.1 Introduction.................................................................................................................49
2.2 Memory Resources ....................................................................................................49
2.2.1 Addressable Memory ...................................................................................49
2.2.2 Memory Map ................................................................................................51
2.3 DMA Channels ...........................................................................................................51
2.4 Fixed I/O Map.............................................................................................................52
2.5 PCI Configuration Space Map ....................................................................................53
2.6 Interrupts ....................................................................................................................54
2.7 PCI Interrupt Routing Map..........................................................................................55
2.8 Connectors.................................................................................................................57
2.8.1 Back Panel Connectors................................................................................58
2.8.2 Internal I/O Connectors ................................................................................60
2.8.3 External I/O Connectors...............................................................................68
2.9 Jumper Blocks............................................................................................................72
2.9.1 Front Panel Audio Connector/Jumper Block.................................................72
2.9.2 BIOS Setup Configuration Jumper Block......................................................73
2.10 Mechanical Considerations.........................................................................................74
2.10.1 D875PBZ Form Factor .................................................................................74
2.10.2 I/O Shield .....................................................................................................75
2.11 Electrical Considerations ............................................................................................77
2.11.1 DC Loading ..................................................................................................77
2.11.2 Add-in Board Considerations........................................................................77
2.11.3 Fan Connector Current Capability ................................................................77
2.11.4 Power Supply Considerations ......................................................................78
2.12 Thermal Considerations..............................................................................................79
2.13 Reliability ....................................................................................................................81
2.14 Environmental ............................................................................................................81
2.15 Regulatory Compliance ..............................................................................................82
2.15.1 Safety Regulations.......................................................................................82
2.15.2 EMC Regulations .........................................................................................82
2.15.3 European Union Declaration of Conformity Statement .................................83
2.15.4 Product Ecology Statements ........................................................................83
2.15.5 Product Certification Markings (Board Level) ...............................................84
3 Overview of BIOS Features
3.1 Introduction.................................................................................................................85
3.2 BIOS Flash Memory Organization ..............................................................................85
3.3 Resource Configuration..............................................................................................86
3.3.1 PCI Autoconfiguration ..................................................................................86
3.3.2 PCI IDE Support...........................................................................................86
3.4 System Management BIOS (SMBIOS).......................................................................87
3.5 Legacy USB Support ..................................................................................................88
3.6 BIOS Updates ............................................................................................................88
3.6.1 Language Support........................................................................................89
3.6.2 Custom Splash Screen.................................................................................89
3.7 Recovering BIOS Data ...............................................................................................89
vi
3.8 Boot Options...............................................................................................................90
3.8.1 CD-ROM Boot..............................................................................................90
3.8.2 Network Boot................................................................................................90
3.8.3 Booting Without Attached Devices ...............................................................90
3.8.4 Changing the Default Boot Device During POST..........................................91
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot....................................................91
3.9.1 Peripheral Selection and Configuration ........................................................91
3.9.2 Intel Rapid BIOS Boot ..................................................................................92
3.10 BIOS Security Features..............................................................................................93
4 BIOS Setup Program
4.1 Introduction.................................................................................................................95
4.2 Maintenance Menu.....................................................................................................96
4.3 Main Menu..................................................................................................................97
4.4 Advanced Menu..........................................................................................................98
4.4.1 PCI Configuration Submenu.........................................................................99
4.4.2 Boot Configuration Submenu .....................................................................100
4.4.3 Peripheral Configuration Submenu.............................................................101
4.4.4 Drive Configuration Submenu ....................................................................103
4.4.5 Floppy Configuration Submenu..................................................................107
4.4.6 Event Log Configuration Submenu.............................................................108
4.4.7 Video Configuration Submenu....................................................................109
4.4.8 USB Configuration Submenu .....................................................................110
4.4.9 Chipset Configuration Submenu.................................................................111
4.4.10 Fan Control Configuration Submenu ..........................................................114
4.4.11 Hardware Monitoring..................................................................................115
4.5 Security Menu ..........................................................................................................116
4.6 Power Menu .............................................................................................................117
4.6.1 ACPI Submenu ..........................................................................................117
4.7 Boot Menu................................................................................................................118
4.7.1 Boot Device Priority Submenu....................................................................119
4.7.2 Hard Disk Drives Submenu ........................................................................120
4.7.3 Removable Devices Submenu ...................................................................120
4.7.4 ATAPI CD-ROM Drives Submenu..............................................................121
4.8 Exit Menu .................................................................................................................121
Contents
5 Error Messages and Beep Codes
5.1 BIOS Error Messages...............................................................................................123
5.2 Port 80h POST Codes..............................................................................................125
5.3 Bus Initialization Checkpoints ...................................................................................129
5.4 Speaker....................................................................................................................130
5.5 BIOS Beep Codes ....................................................................................................130
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Intel Desktop Board D875PBZ Technical Product Specification
Figures
1. Desktop Board D875PBZ Components ......................................................................14
2. Block Diagram ............................................................................................................15
3. Memory Channel Configuration ..................................................................................23
4. Examples of Dual Channel configuration with Dynamic Mode....................................24
5. Example of Dual Channel configuration without Dynamic Mode.................................25
6. Examples of Single Channel configuration with Dynamic Mode..................................26
7. Examples of Single Channel configuration without Dynamic Mode.............................27
8. Intel 875P Chipset Block Diagram ..............................................................................28
9. Back Panel Audio Connector Options for Flex 6 Audio Subsystem ............................34
10. Adapter for S/PDIF Back Panel Connector.................................................................35
11. Flex 6 Audio Subsystem Block Diagram.....................................................................35
12. LAN Connector LED Locations...................................................................................37
13. Thermal Monitoring.....................................................................................................39
14. Location of the Standby Power Indicator LED ............................................................46
15. Detailed System Memory Address Map......................................................................50
16. Back Panel Connectors ..............................................................................................58
17. Audio Connectors .......................................................................................................61
18. Power and Hardware Control Connectors ..................................................................63
19. D875PBZ Add-in Board and Peripheral Interface Connectors ....................................66
20. External I/O Connectors .............................................................................................68
21. Connection Diagram for Front Panel Connector .........................................................69
22. Connection Diagram for Front Panel USB Connector.................................................71
23. Location of the Jumper Blocks....................................................................................72
24. Board Dimensions ......................................................................................................74
25. I/O Shield Dimensions for Boards with the Optional Audio Subsystem.......................75
26. I/O Shield Dimensions for Boards without the Audio Subsystem ................................76
27. Localized High Temperature Zones............................................................................80
Tables
1. Feature Summary.......................................................................................................12
2. Manufacturing Options ...............................................................................................13
3. Specifications .............................................................................................................17
4. Supported System Bus Frequency and Memory Speed Combinations.......................21
5. Supported Memory Configurations .............................................................................22
6. Characteristics of Dual and Single Channel Configuration with and without
Dynamic Mode ...........................................................................................................23
7. LAN Connector LED States ........................................................................................38
8. Effects of Pressing the Power Switch .........................................................................41
9. Power States and Targeted System Power ................................................................42
10. Wake-up Devices and Events.....................................................................................43
11. Fan Connector Function/Operation.............................................................................44
12. System Memory Map..................................................................................................51
13. DMA Channels ...........................................................................................................51
14. I/O Map ......................................................................................................................52
15. PCI Configuration Space Map ....................................................................................53
viii
Contents
16. Interrupts ....................................................................................................................54
17. PCI Interrupt Routing Map..........................................................................................56
18. Audio Line In Connector .............................................................................................59
19. Mic In Connector ........................................................................................................59
20. Audio Line Out Connector ..........................................................................................59
21. Auxiliary Line Input Connector....................................................................................62
22. Front Panel Audio Connector .....................................................................................62
23. ATAPI CD-ROM Connector ........................................................................................62
24. Rear Chassis Fan Connector .....................................................................................64
25. ATX12V Power Connector..........................................................................................64
26. Voltage Regulator Fan Connector ..............................................................................64
27. Processor Fan Connector...........................................................................................64
28. Main Power Connector...............................................................................................65
29. Front Chassis Fan Connector.....................................................................................65
30. Chassis Intrusion Connector.......................................................................................65
31. SCSI Hard Drive Activity LED Connector....................................................................67
32. Serial ATA/Serial ATA RAID Connectors....................................................................67
33. Front Panel Connector ...............................................................................................69
34. States for a One-Color Power LED.............................................................................70
35. States for a Two-Color Power LED.............................................................................70
36. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector ........................70
37. Front Panel Audio Connector or Jumper Block...........................................................73
38. BIOS Setup Configuration Jumper Settings................................................................73
39. DC Loading Characteristics........................................................................................77
40. Fan Connector Current Capability ..............................................................................77
41. Thermal Considerations for Components ...................................................................80
42. Desktop Board D875PBZ Environmental Specifications.............................................81
43. Safety Regulations .....................................................................................................82
44. EMC Regulations........................................................................................................82
45. Product Certification Markings....................................................................................84
46. Boot Device Menu Options.........................................................................................91
47. Supervisor and User Password Functions..................................................................93
48. BIOS Setup Program Menu Bar .................................................................................95
49. BIOS Setup Program Function Keys ..........................................................................96
50. Maintenance Menu.....................................................................................................96
51. Main Menu..................................................................................................................97
52. Advanced Menu..........................................................................................................98
53. PCI Configuration Submenu .......................................................................................99
54. Boot Configuration Submenu....................................................................................100
55. Peripheral Configuration Submenu...........................................................................101
56. Drive Configuration Submenu...................................................................................103
57. SATA/PATA Submenus............................................................................................106
58. Floppy Configuration Submenu ................................................................................107
59. Event Log Configuration Submenu...........................................................................108
60. Video Configuration Submenu..................................................................................109
61. USB Configuration Submenu....................................................................................110
62. Chipset Configuration Submenu...............................................................................111
63. Burn-In Mode Submenu ...........................................................................................113
ix
Intel Desktop Board D875PBZ Technical Product Specification
64. Fan Control Configuration Submenu ........................................................................114
65. Hardware Monitoring Display....................................................................................115
66. Security Menu ..........................................................................................................116
67. Power Menu .............................................................................................................117
68. ACPI Submenu.........................................................................................................117
69. Boot Menu................................................................................................................118
70. Boot Device Priority Submenu..................................................................................119
71. Hard Disk Drives Submenu ......................................................................................120
72. Removable Devices Submenu..................................................................................120
73. ATAPI CD-ROM Drives Submenu ............................................................................121
74. Exit Menu .................................................................................................................121
75. BIOS Error Messages...............................................................................................123
76. Uncompressed INIT Code Checkpoints....................................................................125
77. Boot Block Recovery Code Checkpoints ..................................................................125
78. Runtime Code Uncompressed in F000 Shadow RAM ..............................................126
79. Bus Initialization Checkpoints ...................................................................................129
80. Upper Nibble High Byte Functions............................................................................129
81. Lower Nibble High Byte Functions............................................................................130
82. Beep Codes..............................................................................................................131
x
1 Product Description
What This Chapter Contains
1.1 Overview ....................................................................................................................12
1.2 Online Support ...........................................................................................................16
1.3 Operating System Support .........................................................................................16
1.4 Design Specifications .................................................................................................17
1.5 Processor ...................................................................................................................20
1.6 System Memory .........................................................................................................21
1.7 Intel® 875P Chipset ....................................................................................................28
1.8 I/O Controller..............................................................................................................32
1.9 Audio Subsystem (Optional).......................................................................................34
1.10 LAN Subsystem..........................................................................................................37
1.11 Hardware Management Subsystem............................................................................38
1.12 Power Management ...................................................................................................40
11
Intel Desktop Board D875PBZ Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Intel® Desktop Board D875PBZ.
Table 1. Feature Summary
Form Factor
ATX (11.52 inches by 9.6 inches [292.61 millimeters by 243.84 millimeters])
Processor
Memory
Chipset
Video
Audio
USB
Peripheral
Interfaces
Expansion
Capabilities
I/O Control
LAN
Hardware Monitor
Subsystem
Support for an Intel® Pentium® 4 processor in an mPGA478 socket with a
533/800 MHz system bus
• Four 184-pin DDR SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR400 and DDR333 SDRAM DIMMs
• Support for up to 4 GB of system memory
Intel® 875P Chipset, consisting of:
®
• Intel
• Intel
• Intel
Universal 0.8/1.5 V AGP 3.0 connector (with integrated retention mechanism)
supporting 1x, 4x, and 8x AGP cards
See Manufacturing Options on page 13
Support for USB 2.0 devices
• Eight USB ports
• One serial port
• One parallel port
• Two Serial ATA IDE interfaces
• Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2* keyboard and mouse ports
Five PCI bus add-in card connectors
LPC Bus I/O controller
Intel
(10/100/1000 Mbits/sec) Ethernet LAN connectivity
• Hardware management ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan connectors
• Four fan sense inputs used to monitor fan activity
• Fan speed control
82875P Memory Controller Hub (MCH)
®
82801ER I/O Controller Hub (ICH5-R)
®
82802AC (8 Mbit) Firmware Hub (FWH)
®
82547EI Platform LAN Connect (PLC) device for Gigabit
continued
12
Table 1. Feature Summary (continued)
BIOS
Instantly Available
PC Technology
• Intel/AMI BIOS (resident in the Intel 82802AC FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
• Support for PCI Local Bus Specification Revision 2.2
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
For information about Refer to
The Desktop Board D875PBZ’s compliance level with ACPI,
Plug and Play, and SMBIOS.
Section 1.4, page 17
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options for the Desktop Board D875PBZ. Not every
manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Product Description
Table 2. Manufacturing Options
Audio
For information about Refer to
Available configurations for the Desktop Board D875PBZ Section 1.2, page 16
Flex 6 audio subsystem using the Analog Devices AD1985 codec
13
Intel Desktop Board D875PBZ Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components on the Desktop Board D875PBZ.
B F GC D E
A
FF
H
I
J
K
EE
L
M
DD
CC
N
O
BB
AA
P
Z
Y
A Auxiliary line input connector Q Power connector
B AD1985 audio codec R Diskette drive connector
C Front panel audio connector S Parallel ATA IDE connectors
D ATAPI CD-ROM connector T Serial ATA/Serial ATA RAID IDE connectors
E AGP connector U SCSI Hard Drive Activity LED connector
F Intel 82547EI Gigabit LAN PLC device V Front chassis fan connector
G Rear chassis fan W BIOS setup configuration jumper
H Back panel connectors X Intel 82802AC Firmware Hub (FWH)
I +12 V power connector (ATX12V) Y Front panel connector
J Voltage regulator fan Z Speaker
K mPGA478 processor socket AA Auxiliary front panel power LED
L Processor fan connector BB Front panel USB connector
M Intel 82875P Memory Controller Hub (MCH) CC Chassis intrusion connector
N DIMM channel A DD Battery
O DIMM channel B EE Intel 82801ER I/O Controller Hub (ICH5-R)
P I/O controller FF PCI bus add-in card connectors
RQTWVXSU
OM15883
Figure 1. Desktop Board D875PBZ Components
14
1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the Desktop Board D875PBZ.
Product Description
mPGA478
Processor Socket
LAN
Connector
AGP
Interface
Universal
0.8/1.5 V
AGP 3.0
Connector
Channel A
DIMMs (2)
Channel B
DIMMs (2)
= connector or socket
Parallel ATA IDE
Connectors (2)
System Bus
(533/800 MHz)
Intel
82547EI
PLC
Device
Memory Controller
CSA
Interface
Intel 82875P
Hub (MCH)
Dual-Channel
Memory Bus
SMBus
Parallel ATA
IDE Interface
AHA
Bus
USB
LPC Bus
Controller
Intel 82801ER
I/O Controller Hub
(ICH5-R)
IDE Interface
AC
Link
I/O
LPC
Bus
Serial ATA
Back Panel/
Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Connector
Intel 82802AC
8 Mbit
Firmware Hub
(FWH)
Intel 875P Chipset
Serial ATA IDE
Connectors (2)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
PCI Slot 5
PCI Bus
SMBus
Audio Codec
Hardware
Monitoring
and Fan
Control
ASIC
Figure 2. Block Diagram
AD1985
(Optional)
Front Left and Right Out
Center and LFE Out
Rear Left and Right Out
S/PDIF
Line In
Mic In
CD-ROM
Auxiliary Line In
OM15976
15
Intel Desktop Board D875PBZ Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
The Desktop Board D875PBZ, look
under “Desktop Board Products” or
“Desktop Board Support”
Available configurations for the Desktop
Board D875PBZ
Processor data sheets http://www.intel.com/design/litcentr
ICH5-R addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://www.intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/bz/bz_available.htm
1.3 Operating System Support
The Desktop Board D875PBZ support drivers for onboard hardware and subsystems under the
following operating systems:
• Microsoft Windows* XP
• Windows 2000
• Windows ME
• Windows 98 SE
NOTES
✏
• RAID is supported only on Microsoft Windows XP.
• Native USB 2.0 support has been tested with drivers for Windows 2000 (with Service Pack 3)
and Windows XP (with Service Pack 1) and is not currently supported by any other operating
system in the list above. Check Intel’s Desktop Board website for possible driver updates for
other operating systems.
• Third party vendors may offer other drivers.
For information about Refer to
Supported drivers Section 1.2, page 16
16
1.4 Design Specifications
Table 3 lists the specifications applicable to the Desktop Board D875PBZ.
Table 3. Specifications
Reference
Name
AC ’97 Audio Codec ’97 Revision 2.2,
ACPI Advanced Configuration
AGP Accelerated Graphics Port
AMI BIOS AMIBIOS Desktop Core 8.0 AMIBIOS 8.0,
ASF Alert Standard Format
ATA/
ATAPI-5
ATX ATX Specification Version 2.1,
ATX12V ATX/ATX12V Power
BIS Boot Integrity Services
Specification
Title
and Power Interface
Specification
Interface Specification
(ASF) Specification
Information Technology-AT
Attachment with Packet
Interface - 5
(ATA/ATAPI-5)
Supply Design Guide
(BIS) Application
Programming Interface
(API)
Version, Revision Date,
and Ownership
September 2000,
Intel Corporation.
Version 2.0a,
March 31, 2002,
Compaq Computer
Corporation,
Intel Corporation,
Microsoft Corporation,
Phoenix Technologies
Limited, and
Toshiba Corporation.
Revision 3.0,
September, 2002,
Intel Corporation.
2001,
American Megatrends, Inc.
Version 1.03,
June 20, 2001,
DMTF,
Intel Corporation.
Revision 3,
February 29, 2000,
Contact: T13 Chair,
Seagate Technology.
June 2002,
Intel Corporation.
Version 1.2,
August 2000,
Intel Corporation.
Version 1.0,
August 4, 1999,
Intel Corporation.
Product Description
The information is
available from…
ftp://download.intel.com/ial/
scalableplatforms/
ac97r22.pdf
http://www.acpi.info/
DOWNLOADS/
ACPIspec-2-0a.pdf
http://www.agpforum.org/
specs_specs.htm
http://www.ami.com/support/
doc/amibios8.pdf
http://www.dmtf.org/
standards/documents/ASF/
DSP0114.pdf
http://www.t13.org
http://www.formfactors.org/
developer/specs/atx/
atx2_1.pdf
http://www.formfactors.org/
developer/specs/atx/
atxspecs.htm
http://www.intel.com/labs/
manage/wfm/wfmspecs.htm
continued
17
Intel Desktop Board D875PBZ Technical Product Specification
Table 3. Specifications (continued)
Reference
Name
DDR
SDRAM
EHCI
EPP IEEE Std 1284.1-1997
El Torito Bootable CD-ROM
LPC Low Pin Count Interface
OHCI OpenHCI – Open Host
PCI PCI Local Bus
PCI Bus Power
Plug and
Play
Specification
Title
Double Data Rate (DDR)
SDRAM Specification
Design Specification for
a 184 Pin DDR
Unbuffered DIMM
®
JEDEC DDR
Intel
200/266 Unbuffered
DIMM Specification
Addendum
Enhanced Host
Controller Interface
Specification for
Universal Serial Bus
(Enhanced Parallel Port)
Format Specification
Specification
Controller Interface
Specification for USB
Specification
Management Interface
Specification
Plug and Play BIOS
Specification
Version, Revision Date and
Ownership
Version 2.0,
May 2002,
JEDEC Solid State Technology
Association.
Revision 1.0,
October 2001,
JEDEC Solid State Technology
Association.
Revision 0.9,
September 27, 2001,
Intel Corporation.
Revision 1.0,
March 12, 2002,
Intel Corporation.
Version 1.7, 1997,
Institute of Electrical and
Electronic Engineers.
Version 1.0,
January 25, 1995,
Phoenix Technologies Limited
and International Business
Machines Corporation.
Revision 1.0,
September 29, 1997,
Intel Corporation.
Release 1.0a,
October 10, 1996,
Compaq computer Corp.,
Microsoft Corporation, and
National Semiconductor Corp.
Revision 2.2,
December 18, 1998,
PCI Special Interest Group.
Revision 1.1,
December 18, 1998,
PCI Special Interest Group.
Version 1.0a,
May 5, 1994,
Compaq Computer Corporation,
Phoenix Technologies Limited,
and Intel Corporation.
The information is
available from…
http://www.jedec.org/
http://www.jedec.org/
http://developer.intel.com/
technology/memory/
index.htm
http://developer.intel.com/
technology/usb/download/
ehci-r10.pdf
http://standards.ieee.org/
reading/ieee/std_public/
description/busarch/
1284.1-1997_desc.html
http://www.phoenix.com/en/
support/download/
product+documentation/
platform_system_
software.htm
http://www.intel.com/
design/chipsets/industry/
lpc.htm
http://www.usb.org/
developers/docs.html
http://www.pcisig.com/
specifications
http://www.pcisig.com/
specifications
http://www.microsoft.com/
hwdev/tech/PnP/
default.asp
continued
18
Table 3. Specifications (continued)
Reference
Name
PXE Preboot Execution
Serial ATA
(SATA)
SMBIOS System Management
UHCI Universal Host Controller
USB Universal Serial Bus
WfM Wired for Management
Specification
Title
Environment
Serial ATA: High Speed
Serialized AT
Attachment
BIOS
Interface Design Guide
Specification
Baseline
Version, Revision Date
and Ownership
Version 2.1,
September 20, 1999,
Intel Corporation.
Revision 1.0,
August 29, 2001,
APT Technologies, Inc.,
Dell Computer Corporation,
IBM Corporation,
Intel Corporation,
Maxtor Corporation,
Seagate Technology.
Version 2.3.1,
March 16, 1999,
American Megatrends
Incorporated,
Award Software International
Incorporated,
Compaq Computer Corporation,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
Revision 1.1,
March 1996,
Intel Corporation.
Revision 2.0,
April 27, 2000,
Compaq Computer Corporation,
Hewlett-Packard Company,
Lucent Technologies Inc.,
Intel Corporation,
Microsoft Corporation,
NEC Corporation, and
Koninklijke Philips
Electronics N.V.
Version 2.0,
December 18, 1998,
Intel Corporation.
Product Description
The information is
available from…
ftp://download.intel.com/
labs/manage/wfm/
download/pxespec.pdf
http://www.serialata.com/
http://www.dmtf.org/
download/standards/
DSP0119.pdf
http://www.usb.org/
developers/docs.html
http://www.usb.org/
developers/docs.html
http://www.intel.com/labs/
manage/wfm/
wfmspecs.htm
19
Intel Desktop Board D875PBZ Technical Product Specification
1.5 Processor
NOTE
✏
Refer to Thermal Considerations (Section 2.12, page 79) for important information when using an
Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board.
The board is designed to support Intel Pentium
a 533/800 MHz system bus.
See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors for the D875PBZ board http://www.intel.com/design/motherbd/bz/bz_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
4 processors in an mPGA478 processor socket with
INTEGRATOR’S NOTES
#
• Use only ATX12V-compliant power supplies with the board. ATX12V power supplies have an
additional power lead that provides required supplemental power for the processor. Always
connect the 20-pin and 4-pin leads of ATX12V power supply to the corresponding connectors,
otherwise the board will not boot.
• Do not use a standard ATX power supply. The board will not boot with a standard ATX power
supply.
• Refer to Table 4 on page 21 for a list of supported system bus frequency and memory speed
combinations.
For information about Refer to
Power supply connectors Section 2.8.2.2, page 61
20
Product Description
1.6 System Memory
1.6.1 Memory Features
The Desktop Board D875PBZ has four DIMM sockets and supports the following memory
features:
• 2.5 V (only) 184-pin DDR SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 4 GB maximum total system memory. Refer to Section 2.2.1 on page 49 for information on
the total amount of addressable memory.
• Minimum total system memory: 64 MB
• ECC and non-ECC DIMMs supported
• Serial Presence Detect
• DDR400 and DDR333 SDRAM DIMMs
Table 4 lists the supported system bus frequency and memory speed combinations.
Table 4. Supported System Bus Frequency and Memory Speed Combinations
To use this type of DIMM… The processor's system bus frequency must be…
DDR400 800 MHz
DDR333 800 or 533 MHz (Note)
Note: When using an 800 MHz system bus frequency processor, DDR333 memory is clocked at 320 MHz. This
minimizes system latencies to optimize system throughput.
✏ NOTES
• When ECC DIMMs are used, the Power-On Self Test (POST) will take longer to complete.
• Remove the AGP video card before installing or upgrading memory to avoid interference with
the memory retention mechanism.
• To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to accurately
configure memory settings for optimum performance. If non-SPD memory is installed, the
BIOS will attempt to correctly configure the memory settings, but performance and reliability
may be impacted or the DIMMs may not function under the determined frequency.
For information about Refer to
Obtaining DDR SDRAM specifications Section 1.4, page 17
21
Intel Desktop Board D875PBZ Technical Product Specification
Table 5 lists the supported DIMM configurations.
Table 5. Supported Memory Configurations
DIMM
Capacity
64 MB SS 64 Mbit 8 M x 8/empty 8
64 MB SS 128 Mbit 8 M x 16/empty 4
128 MB DS 64 Mbit 8 M x 8/8 M x 8 16
128 MB SS 128 Mbit 16 M x 8/empty 8
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB DS 128 Mbit 16 M x 8/16 M x 8 16
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of DDR SDRAM) and “SS”
refers to single-sided memory modules (containing one row of DDR SDRAM).
Configuration
DDR SDRAM
Density
DDR SDRAM Organization
Front-side/Back-side
Number of DDR
SDRAM Devices
22
Product Description
1.6.2 Memory Configurations
The Intel 82875P MCH component provides two features for enhancing memory throughput:
• Dual Channel memory interface. The board has two memory channels, each with two DIMM
sockets, as shown in Figure 3
• Dynamic Addressing Mode. Dynamic mode minimizes overhead by reducing memory
accesses
Table 6 summarizes the characteristics of Dual and Single Channel configurations with and
without the use of Dynamic Mode.
Table 6. Characteristics of Dual and Single Channel Configuration with and without
Dynamic Mode
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Characteristics
(Example configurations are shown in Figure 4)
• DIMMs not matched within channels
(Example configuration is shown in Figure 5)
(Example configurations are shown in Figure 6)
(Example configurations are shown in Figure 7)
23
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 3. Memory Channel Configuration
OM15894
Intel Desktop Board D875PBZ Technical Product Specification
Dual Channel Configuration with Dynamic Mode
(All DIMMs matched)
Channel A - DIMM 0 Channel B - DIMM 0
Example
1
Channel A - DIMM 1
82875P
Intel
Channel B - DIMM 1
MCH
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 4. Examples of Dual Channel configuration with Dynamic Mode
Channel B - DIMM 1
OM15978
24
Product Description
Dual Channel Configuration without Dynamic Mode
- DIMMs not matched within channel
- DIMMs match Channel A to Channel B
Channel A - DIMM 0 Channel B - DIMM 0
Channel A - DIMM 1 Channel B - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 5. Example of Dual Channel configuration without Dynamic Mode
OM15979
25
Intel Desktop Board D875PBZ Technical Product Specification
Single Channel Configuration with Dynamic Mode
(Single DIMM or DIMMs matched within Channel)
Channel A - DIMM 0 Channel B - DIMM 0
Example
1
Channel A - DIMM 1
82875P
Intel
Channel B - DIMM 1
MCH
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 6. Examples of Single Channel configuration with Dynamic Mode
Channel B - DIMM 1
OM15980
26
Example
1
Product Description
Single Channel Configuration without Dynamic Mode
(DIMMs not matched)
Channel A - DIMM 0 Channel B - DIMM 0
Channel A - DIMM 1
Intel
82875P
MCH
Channel B - DIMM 1
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 7. Examples of Single Channel configuration without Dynamic Mode
Channel B - DIMM 1
OM15981
27
Intel Desktop Board D875PBZ Technical Product Specification
1.7 Intel® 875P Chipset
The Intel 875P chipset consists of the following devices:
• Intel 82875P Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus
• Intel 82801ER I/O Controller Hub (ICH5-R) with AHA bus
• Intel 82802AC (8 Mbit) Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH5-R is a centralized controller for the Desktop
Board D875PBZ’s I/O paths. The FWH provides the nonvolatile storage of the BIOS. The
component combination provides the chipset interfaces as shown in Figure 8.
Parallel ATA
IDE Interface
System Bus
875P Chipset
USB
82801ER
I/O Controller Hub
(ICH5-R)
SMBus
PCI
Bus
AC Link
LPC Bus
82802AC
8 Mbit Firmware
Hub (FWH)
OM15967
CSA
Interface
82875P
Memory Controller
Hub (MCH)
Dual-Channel
AGP
Interface
DDR SDRAM
Bus
AHA
Bus
Serial
ATA
IDE
Interface
Figure 8. Intel 875P Chipset Block Diagram
For information about Refer to
The Intel 875P chipset http://developer.intel.com
Resources used by the chipset Chapter 2
28
Product Description
1.7.1 AGP
The AGP connector supports the following:
• 4x, 8x AGP 3.0 add-in cards with 0.8 V I/O
• 1x, 4x AGP 2.0 add-in cards with 1.5 V I/O
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.
While based on the PCI Local Bus Specification, Rev. 2.2, AGP is independent of the PCI bus and
is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of
the PCI bus related to handling large amounts of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent efficiency
INTEGRATOR’S NOTES
#
• AGP 2x operation is not supported.
• Install memory in the DIMM sockets prior to installing the AGP video card to avoid
interference with the memory retention mechanism.
• The AGP connector is keyed for Universal 0.8 V AGP 3.0 cards or 1.5 V AGP 2.0 cards only.
Do not attempt to install a legacy 3.3 V AGP card. The AGP connector is not mechanically
compatible with legacy 3.3 V AGP cards.
For information about Refer to
The location of the AGP connector Figure 1, page 14
Obtaining the Accelerated Graphics Port Interface Specification Section 1.4, page 17
1.7.2 USB
The Desktop Board D875PBZ supports up to eight USB 2.0 ports, supports UHCI and EHCI, and
uses UHCI- and EHCI-compatible drivers.
The ICH5-R provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with stacked back panel connectors, adjacent to the PS/2
connectors
• Two ports are implemented with stacked back panel connectors, adjacent to the audio
connectors
• Two ports are routed to the front panel USB connector
NOTES
✏
• Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets
the requirements for full-speed devices.
• Native USB 2.0 support has been tested with drivers for Windows 2000 (with Service Pack 3)
and Windows XP (with Service Pack 1) and is not currently supported by any other operating
system. Check Intel’s Desktop Board website for possible driver updates for other operating
systems.
29
Intel Desktop Board D875PBZ Technical Product Specification
For information about Refer to
The location of the USB connectors on the back panel Figure 16, page 58
The location of the front panel USB connector Figure 20, page 68
The signal names of the front panel USB connector Figure 22, page 71
The front panel, EHCI, UHCI, and USB specifications Section 1.4, page 17
1.7.3 IDE Support
The board provides four IDE interface connectors:
• Two Parallel ATA IDE connectors, which support a total of four devices (two per connector)
• Two Serial ATA IDE connectors, which support one device per connector
1.7.3.1 Parallel ATA IDE Interfaces
The ICH5-R’s Parallel ATA IDE controller has two independent bus-mastering Parallel ATA IDE
interfaces that can be independently enabled. The Parallel ATA IDE interfaces support the
following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH5-R’s ATA-
100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
NOTE
✏
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes listed in Section 4.4.4.1 on page 105.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The Desktop Board D875PBZ supports Laser Servo (LS-120) diskette technology through the
Parallel ATA IDE interfaces. The BIOS supports booting from an LS-120 drive.
✏ NOTE
The BIOS will always recognize an LS-120 drive as an ATAPI floppy drive. To ensure correct
operation, do not configure the drive as a hard disk drive.
For information about Refer to
The location of the Parallel ATA IDE connectors Figure 19, page 66
30
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