Intel BOXD875PBZLK, KD875PBZLKPAK10 - 10PK 875P P4-800/533MHZ Fsbatx Ddr AGP8X SATA150 5PCI, D875PBZ Technical Product Specification
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Intel® Desktop Board D875PBZ
Technical Product Specification
The Intel® Desktop Board D875PBZ may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board D875PBZ Specification Update.
April 2003
Order Number: C31765-001
Page 2
Revision History
Revision Revision History Date
-001 First release of the Intel Desktop Board D875PBZ Technical Product
Specification.
This product specification applies to only the standard Intel Desktop Board D875PBZ with BIOS
identifier BZ87510A.86A.
Changes to this specification will be published in the Intel Desktop Board D875PBZ Specification
Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED
BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH
PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY, RELATING TO SALE AND/OR USE OF INTEL® PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT,
COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN
MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property
rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not
provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other
intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.”
Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them.
Intel® desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,
Germany 44-0-1793-421-333, other Countries 708-296-9333.
Intel and Pentium are registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2003, Intel Corporation. All rights reserved.
April 2003
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Preface
This Technical Product Specification (TPS) specifies the Intel® Desktop Board D875PBZ layout,
components, connectors, power and environmental requirements, and BIOS. The TPS describes
the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board and its
components to the vendors, system integrators, and other engineers and technicians who need this
level of information. It is specifically not intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Desktop Board D875PBZ
2 A map of the resources of the Desktop Board D875PBZ
3 The features supported by the BIOS Setup program
4 The contents of the BIOS Setup program’s menus and submenus
5 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these
symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
✏
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
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Intel Desktop Board D875PBZ Technical Product Specification
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
(NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Board D875PBZ, and X is the instance of the
particular part at that general location. For example, J5J1 is a connector, located at 5J. It is
the first connector in the 5J area.
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
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Contents
1 Product Description
1.1 Overview ....................................................................................................................12
1.1.1 Feature Summary ........................................................................................12
1.1.2 Manufacturing Options .................................................................................13
1.1.3 Board Layout................................................................................................14
1.1.4 Block Diagram..............................................................................................15
1.2 Online Support ...........................................................................................................16
1.3 Operating System Support .........................................................................................16
1.4 Design Specifications .................................................................................................17
1.5 Processor ...................................................................................................................20
1.6 System Memory .........................................................................................................21
1.6.1 Memory Features.........................................................................................21
1.6.2 Memory Configurations ................................................................................23
1.7 Intel® 875P Chipset ....................................................................................................28
1.7.1 AGP .............................................................................................................29
1.7.2 USB..............................................................................................................29
1.7.3 IDE Support .................................................................................................30
1.7.4 Real-Time Clock, CMOS SRAM, and Battery...............................................32
1.7.5 Intel® 82802AC Firmware Hub (FWH)..........................................................32
1.8 I/O Controller..............................................................................................................32
1.8.1 Serial Port ....................................................................................................33
1.8.2 Parallel Port..................................................................................................33
1.8.3 Diskette Drive Controller ..............................................................................33
1.8.4 Keyboard and Mouse Interface ....................................................................33
1.9 Audio Subsystem (Optional).......................................................................................34
1.9.1 Audio Subsystem Software ..........................................................................34
1.9.2 Intel® Flex 6 Audio Subsystem .....................................................................34
1.9.3 Audio Connectors.........................................................................................36
1.10 LAN Subsystem..........................................................................................................37
1.10.1 LAN Subsystem Software ............................................................................37
1.10.2 Intel® 82547EI Platform LAN Connect Device ..............................................37
1.10.3 RJ-45 LAN Connector with Integrated LEDs ................................................37
1.11 Hardware Management Subsystem............................................................................38
1.11.1 Hardware Monitoring and Fan Control ASIC ................................................38
1.11.2 Thermal Monitoring ......................................................................................39
1.11.3 Fan Monitoring .............................................................................................40
1.11.4 Chassis Intrusion and Detection...................................................................40
1.12 Power Management ...................................................................................................40
1.12.1 ACPI.............................................................................................................41
1.12.2 Hardware Support ........................................................................................43
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Intel Desktop Board D875PBZ Technical Product Specification
2 Technical Reference
2.1 Introduction.................................................................................................................49
2.2 Memory Resources ....................................................................................................49
2.2.1 Addressable Memory ...................................................................................49
2.2.2 Memory Map ................................................................................................51
2.3 DMA Channels ...........................................................................................................51
2.4 Fixed I/O Map.............................................................................................................52
2.5 PCI Configuration Space Map ....................................................................................53
2.6 Interrupts ....................................................................................................................54
2.7 PCI Interrupt Routing Map..........................................................................................55
2.8 Connectors.................................................................................................................57
2.8.1 Back Panel Connectors................................................................................58
2.8.2 Internal I/O Connectors ................................................................................60
2.8.3 External I/O Connectors...............................................................................68
2.9 Jumper Blocks............................................................................................................72
2.9.1 Front Panel Audio Connector/Jumper Block.................................................72
2.9.2 BIOS Setup Configuration Jumper Block......................................................73
2.10 Mechanical Considerations.........................................................................................74
2.10.1 D875PBZ Form Factor .................................................................................74
2.10.2 I/O Shield .....................................................................................................75
2.11 Electrical Considerations ............................................................................................77
2.11.1 DC Loading ..................................................................................................77
2.11.2 Add-in Board Considerations........................................................................77
2.11.3 Fan Connector Current Capability ................................................................77
2.11.4 Power Supply Considerations ......................................................................78
2.12 Thermal Considerations..............................................................................................79
2.13 Reliability ....................................................................................................................81
2.14 Environmental ............................................................................................................81
2.15 Regulatory Compliance ..............................................................................................82
2.15.1 Safety Regulations.......................................................................................82
2.15.2 EMC Regulations .........................................................................................82
2.15.3 European Union Declaration of Conformity Statement .................................83
2.15.4 Product Ecology Statements ........................................................................83
2.15.5 Product Certification Markings (Board Level) ...............................................84
3 Overview of BIOS Features
3.1 Introduction.................................................................................................................85
3.2 BIOS Flash Memory Organization ..............................................................................85
3.3 Resource Configuration..............................................................................................86
3.3.1 PCI Autoconfiguration ..................................................................................86
3.3.2 PCI IDE Support...........................................................................................86
3.4 System Management BIOS (SMBIOS).......................................................................87
3.5 Legacy USB Support ..................................................................................................88
3.6 BIOS Updates ............................................................................................................88
3.6.1 Language Support........................................................................................89
3.6.2 Custom Splash Screen.................................................................................89
3.7 Recovering BIOS Data ...............................................................................................89
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3.8 Boot Options...............................................................................................................90
3.8.1 CD-ROM Boot..............................................................................................90
3.8.2 Network Boot................................................................................................90
3.8.3 Booting Without Attached Devices ...............................................................90
3.8.4 Changing the Default Boot Device During POST..........................................91
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot....................................................91
3.9.1 Peripheral Selection and Configuration ........................................................91
3.9.2 Intel Rapid BIOS Boot ..................................................................................92
3.10 BIOS Security Features..............................................................................................93
4 BIOS Setup Program
4.1 Introduction.................................................................................................................95
4.2 Maintenance Menu.....................................................................................................96
4.3 Main Menu..................................................................................................................97
4.4 Advanced Menu..........................................................................................................98
4.4.1 PCI Configuration Submenu.........................................................................99
4.4.2 Boot Configuration Submenu .....................................................................100
4.4.3 Peripheral Configuration Submenu.............................................................101
4.4.4 Drive Configuration Submenu ....................................................................103
4.4.5 Floppy Configuration Submenu..................................................................107
4.4.6 Event Log Configuration Submenu.............................................................108
4.4.7 Video Configuration Submenu....................................................................109
4.4.8 USB Configuration Submenu .....................................................................110
4.4.9 Chipset Configuration Submenu.................................................................111
4.4.10 Fan Control Configuration Submenu ..........................................................114
4.4.11 Hardware Monitoring..................................................................................115
4.5 Security Menu ..........................................................................................................116
4.6 Power Menu .............................................................................................................117
4.6.1 ACPI Submenu ..........................................................................................117
4.7 Boot Menu................................................................................................................118
4.7.1 Boot Device Priority Submenu....................................................................119
4.7.2 Hard Disk Drives Submenu ........................................................................120
4.7.3 Removable Devices Submenu ...................................................................120
4.7.4 ATAPI CD-ROM Drives Submenu..............................................................121
4.8 Exit Menu .................................................................................................................121
Contents
5 Error Messages and Beep Codes
5.1 BIOS Error Messages...............................................................................................123
5.2 Port 80h POST Codes..............................................................................................125
5.3 Bus Initialization Checkpoints ...................................................................................129
5.4 Speaker....................................................................................................................130
5.5 BIOS Beep Codes ....................................................................................................130
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Intel Desktop Board D875PBZ Technical Product Specification
Figures
1. Desktop Board D875PBZ Components ......................................................................14
2. Block Diagram ............................................................................................................15
3. Memory Channel Configuration ..................................................................................23
4. Examples of Dual Channel configuration with Dynamic Mode....................................24
5. Example of Dual Channel configuration without Dynamic Mode.................................25
6. Examples of Single Channel configuration with Dynamic Mode..................................26
7. Examples of Single Channel configuration without Dynamic Mode.............................27
8. Intel 875P Chipset Block Diagram ..............................................................................28
9. Back Panel Audio Connector Options for Flex 6 Audio Subsystem ............................34
10. Adapter for S/PDIF Back Panel Connector.................................................................35
11. Flex 6 Audio Subsystem Block Diagram.....................................................................35
12. LAN Connector LED Locations...................................................................................37
13. Thermal Monitoring.....................................................................................................39
14. Location of the Standby Power Indicator LED ............................................................46
15. Detailed System Memory Address Map......................................................................50
16. Back Panel Connectors ..............................................................................................58
17. Audio Connectors .......................................................................................................61
18. Power and Hardware Control Connectors ..................................................................63
19. D875PBZ Add-in Board and Peripheral Interface Connectors ....................................66
20. External I/O Connectors .............................................................................................68
21. Connection Diagram for Front Panel Connector .........................................................69
22. Connection Diagram for Front Panel USB Connector.................................................71
23. Location of the Jumper Blocks....................................................................................72
24. Board Dimensions ......................................................................................................74
25. I/O Shield Dimensions for Boards with the Optional Audio Subsystem.......................75
26. I/O Shield Dimensions for Boards without the Audio Subsystem ................................76
27. Localized High Temperature Zones............................................................................80
Tables
1. Feature Summary.......................................................................................................12
2. Manufacturing Options ...............................................................................................13
3. Specifications .............................................................................................................17
4. Supported System Bus Frequency and Memory Speed Combinations.......................21
5. Supported Memory Configurations .............................................................................22
6. Characteristics of Dual and Single Channel Configuration with and without
Dynamic Mode ...........................................................................................................23
7. LAN Connector LED States ........................................................................................38
8. Effects of Pressing the Power Switch .........................................................................41
9. Power States and Targeted System Power ................................................................42
10. Wake-up Devices and Events.....................................................................................43
11. Fan Connector Function/Operation.............................................................................44
12. System Memory Map..................................................................................................51
13. DMA Channels ...........................................................................................................51
14. I/O Map ......................................................................................................................52
15. PCI Configuration Space Map ....................................................................................53
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Contents
16. Interrupts ....................................................................................................................54
17. PCI Interrupt Routing Map..........................................................................................56
18. Audio Line In Connector .............................................................................................59
19. Mic In Connector ........................................................................................................59
20. Audio Line Out Connector ..........................................................................................59
21. Auxiliary Line Input Connector....................................................................................62
22. Front Panel Audio Connector .....................................................................................62
23. ATAPI CD-ROM Connector ........................................................................................62
24. Rear Chassis Fan Connector .....................................................................................64
25. ATX12V Power Connector..........................................................................................64
26. Voltage Regulator Fan Connector ..............................................................................64
27. Processor Fan Connector...........................................................................................64
28. Main Power Connector...............................................................................................65
29. Front Chassis Fan Connector.....................................................................................65
30. Chassis Intrusion Connector.......................................................................................65
31. SCSI Hard Drive Activity LED Connector....................................................................67
32. Serial ATA/Serial ATA RAID Connectors....................................................................67
33. Front Panel Connector ...............................................................................................69
34. States for a One-Color Power LED.............................................................................70
35. States for a Two-Color Power LED.............................................................................70
36. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector ........................70
37. Front Panel Audio Connector or Jumper Block...........................................................73
38. BIOS Setup Configuration Jumper Settings................................................................73
39. DC Loading Characteristics........................................................................................77
40. Fan Connector Current Capability ..............................................................................77
41. Thermal Considerations for Components ...................................................................80
42. Desktop Board D875PBZ Environmental Specifications.............................................81
43. Safety Regulations .....................................................................................................82
44. EMC Regulations........................................................................................................82
45. Product Certification Markings....................................................................................84
46. Boot Device Menu Options.........................................................................................91
47. Supervisor and User Password Functions..................................................................93
48. BIOS Setup Program Menu Bar .................................................................................95
49. BIOS Setup Program Function Keys ..........................................................................96
50. Maintenance Menu.....................................................................................................96
51. Main Menu..................................................................................................................97
52. Advanced Menu..........................................................................................................98
53. PCI Configuration Submenu .......................................................................................99
54. Boot Configuration Submenu....................................................................................100
55. Peripheral Configuration Submenu...........................................................................101
56. Drive Configuration Submenu...................................................................................103
57. SATA/PATA Submenus............................................................................................106
58. Floppy Configuration Submenu ................................................................................107
59. Event Log Configuration Submenu...........................................................................108
60. Video Configuration Submenu..................................................................................109
61. USB Configuration Submenu....................................................................................110
62. Chipset Configuration Submenu...............................................................................111
63. Burn-In Mode Submenu ...........................................................................................113
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Intel Desktop Board D875PBZ Technical Product Specification
64. Fan Control Configuration Submenu ........................................................................114
65. Hardware Monitoring Display....................................................................................115
66. Security Menu ..........................................................................................................116
67. Power Menu .............................................................................................................117
68. ACPI Submenu.........................................................................................................117
69. Boot Menu................................................................................................................118
70. Boot Device Priority Submenu..................................................................................119
71. Hard Disk Drives Submenu ......................................................................................120
72. Removable Devices Submenu..................................................................................120
73. ATAPI CD-ROM Drives Submenu ............................................................................121
74. Exit Menu .................................................................................................................121
75. BIOS Error Messages...............................................................................................123
76. Uncompressed INIT Code Checkpoints....................................................................125
77. Boot Block Recovery Code Checkpoints ..................................................................125
78. Runtime Code Uncompressed in F000 Shadow RAM ..............................................126
79. Bus Initialization Checkpoints ...................................................................................129
80. Upper Nibble High Byte Functions............................................................................129
81. Lower Nibble High Byte Functions............................................................................130
82. Beep Codes..............................................................................................................131
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1 Product Description
What This Chapter Contains
1.1 Overview ....................................................................................................................12
1.2 Online Support ...........................................................................................................16
1.3 Operating System Support .........................................................................................16
1.4 Design Specifications .................................................................................................17
1.5 Processor ...................................................................................................................20
1.6 System Memory .........................................................................................................21
1.7 Intel® 875P Chipset ....................................................................................................28
1.8 I/O Controller..............................................................................................................32
1.9 Audio Subsystem (Optional).......................................................................................34
1.10 LAN Subsystem..........................................................................................................37
1.11 Hardware Management Subsystem............................................................................38
1.12 Power Management ...................................................................................................40
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Intel Desktop Board D875PBZ Technical Product Specification
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Intel® Desktop Board D875PBZ.
Table 1. Feature Summary
Form Factor
ATX (11.52 inches by 9.6 inches [292.61 millimeters by 243.84 millimeters])
Processor
Memory
Chipset
Video
Audio
USB
Peripheral
Interfaces
Expansion
Capabilities
I/O Control
LAN
Hardware Monitor
Subsystem
Support for an Intel® Pentium® 4 processor in an mPGA478 socket with a
533/800 MHz system bus
• Four 184-pin DDR SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR400 and DDR333 SDRAM DIMMs
• Support for up to 4 GB of system memory
Intel® 875P Chipset, consisting of:
®
• Intel
• Intel
• Intel
Universal 0.8/1.5 V AGP 3.0 connector (with integrated retention mechanism)
supporting 1x, 4x, and 8x AGP cards
See Manufacturing Options on page 13
Support for USB 2.0 devices
• Eight USB ports
• One serial port
• One parallel port
• Two Serial ATA IDE interfaces
• Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
• One diskette drive interface
• PS/2* keyboard and mouse ports
Five PCI bus add-in card connectors
LPC Bus I/O controller
Intel
(10/100/1000 Mbits/sec) Ethernet LAN connectivity
• Hardware management ASIC
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Four fan connectors
• Four fan sense inputs used to monitor fan activity
• Fan speed control
82875P Memory Controller Hub (MCH)
®
82801ER I/O Controller Hub (ICH5-R)
®
82802AC (8 Mbit) Firmware Hub (FWH)
®
82547EI Platform LAN Connect (PLC) device for Gigabit
continued
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Table 1. Feature Summary (continued)
BIOS
Instantly Available
PC Technology
• Intel/AMI BIOS (resident in the Intel 82802AC FWH)
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
• Support for PCI Local Bus Specification Revision 2.2
• Suspend to RAM support
• Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
For information about Refer to
The Desktop Board D875PBZ’s compliance level with ACPI,
Plug and Play, and SMBIOS.
Section 1.4, page 17
1.1.2 Manufacturing Options
Table 2 describes the manufacturing options for the Desktop Board D875PBZ. Not every
manufacturing option is available in all marketing channels. Please contact your Intel
representative to determine which manufacturing options are available to you.
Product Description
Table 2. Manufacturing Options
Audio
For information about Refer to
Available configurations for the Desktop Board D875PBZ Section 1.2, page 16
Flex 6 audio subsystem using the Analog Devices AD1985 codec
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Intel Desktop Board D875PBZ Technical Product Specification
1.1.3 Board Layout
Figure 1 shows the location of the major components on the Desktop Board D875PBZ.
B F GC D E
A
FF
H
I
J
K
EE
L
M
DD
CC
N
O
BB
AA
P
Z
Y
A Auxiliary line input connector Q Power connector
B AD1985 audio codec R Diskette drive connector
C Front panel audio connector S Parallel ATA IDE connectors
D ATAPI CD-ROM connector T Serial ATA/Serial ATA RAID IDE connectors
E AGP connector U SCSI Hard Drive Activity LED connector
F Intel 82547EI Gigabit LAN PLC device V Front chassis fan connector
G Rear chassis fan W BIOS setup configuration jumper
H Back panel connectors X Intel 82802AC Firmware Hub (FWH)
I +12 V power connector (ATX12V) Y Front panel connector
J Voltage regulator fan Z Speaker
K mPGA478 processor socket AA Auxiliary front panel power LED
L Processor fan connector BB Front panel USB connector
M Intel 82875P Memory Controller Hub (MCH) CC Chassis intrusion connector
N DIMM channel A DD Battery
O DIMM channel B EE Intel 82801ER I/O Controller Hub (ICH5-R)
P I/O controller FF PCI bus add-in card connectors
RQTWVXSU
OM15883
Figure 1. Desktop Board D875PBZ Components
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1.1.4 Block Diagram
Figure 2 is a block diagram of the major functional areas of the Desktop Board D875PBZ.
Product Description
mPGA478
Processor Socket
LAN
Connector
AGP
Interface
Universal
0.8/1.5 V
AGP 3.0
Connector
Channel A
DIMMs (2)
Channel B
DIMMs (2)
= connector or socket
Parallel ATA IDE
Connectors (2)
System Bus
(533/800 MHz)
Intel
82547EI
PLC
Device
Memory Controller
CSA
Interface
Intel 82875P
Hub (MCH)
Dual-Channel
Memory Bus
SMBus
Parallel ATA
IDE Interface
AHA
Bus
USB
LPC Bus
Controller
Intel 82801ER
I/O Controller Hub
(ICH5-R)
IDE Interface
AC
Link
I/O
LPC
Bus
Serial ATA
Back Panel/
Front Panel
USB Ports
Serial Port
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Connector
Intel 82802AC
8 Mbit
Firmware Hub
(FWH)
Intel 875P Chipset
Serial ATA IDE
Connectors (2)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
PCI Slot 5
PCI Bus
SMBus
Audio Codec
Hardware
Monitoring
and Fan
Control
ASIC
Figure 2. Block Diagram
AD1985
(Optional)
Front Left and Right Out
Center and LFE Out
Rear Left and Right Out
S/PDIF
Line In
Mic In
CD-ROM
Auxiliary Line In
OM15976
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Intel Desktop Board D875PBZ Technical Product Specification
1.2 Online Support
To find information about… Visit this World Wide Web site:
The Desktop Board D875PBZ, look
under “Desktop Board Products” or
“Desktop Board Support”
Available configurations for the Desktop
Board D875PBZ
Processor data sheets http://www.intel.com/design/litcentr
ICH5-R addressing http://developer.intel.com/design/chipsets/datashts
Custom splash screens http://www.intel.com/design/motherbd/gen_indx.htm
Audio software and utilities http://www.intel.com/design/motherbd
LAN software and drivers http://www.intel.com/design/motherbd
http://www.intel.com/design/motherbd
http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/bz/bz_available.htm
1.3 Operating System Support
The Desktop Board D875PBZ support drivers for onboard hardware and subsystems under the
following operating systems:
• Microsoft Windows* XP
• Windows 2000
• Windows ME
• Windows 98 SE
NOTES
✏
• RAID is supported only on Microsoft Windows XP.
• Native USB 2.0 support has been tested with drivers for Windows 2000 (with Service Pack 3)
and Windows XP (with Service Pack 1) and is not currently supported by any other operating
system in the list above. Check Intel’s Desktop Board website for possible driver updates for
other operating systems.
• Third party vendors may offer other drivers.
For information about Refer to
Supported drivers Section 1.2, page 16
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1.4 Design Specifications
Table 3 lists the specifications applicable to the Desktop Board D875PBZ.
Table 3. Specifications
Reference
Name
AC ’97 Audio Codec ’97 Revision 2.2,
ACPI Advanced Configuration
AGP Accelerated Graphics Port
AMI BIOS AMIBIOS Desktop Core 8.0 AMIBIOS 8.0,
ASF Alert Standard Format
ATA/
ATAPI-5
ATX ATX Specification Version 2.1,
ATX12V ATX/ATX12V Power
BIS Boot Integrity Services
Specification
Title
and Power Interface
Specification
Interface Specification
(ASF) Specification
Information Technology-AT
Attachment with Packet
Interface - 5
(ATA/ATAPI-5)
Supply Design Guide
(BIS) Application
Programming Interface
(API)
Version, Revision Date,
and Ownership
September 2000,
Intel Corporation.
Version 2.0a,
March 31, 2002,
Compaq Computer
Corporation,
Intel Corporation,
Microsoft Corporation,
Phoenix Technologies
Limited, and
Toshiba Corporation.
Revision 3.0,
September, 2002,
Intel Corporation.
2001,
American Megatrends, Inc.
Version 1.03,
June 20, 2001,
DMTF,
Intel Corporation.
Revision 3,
February 29, 2000,
Contact: T13 Chair,
Seagate Technology.
June 2002,
Intel Corporation.
Version 1.2,
August 2000,
Intel Corporation.
Version 1.0,
August 4, 1999,
Intel Corporation.
Product Description
The information is
available from…
ftp://download.intel.com/ial/
scalableplatforms/
ac97r22.pdf
http://www.acpi.info/
DOWNLOADS/
ACPIspec-2-0a.pdf
http://www.agpforum.org/
specs_specs.htm
http://www.ami.com/support/
doc/amibios8.pdf
http://www.dmtf.org/
standards/documents/ASF/
DSP0114.pdf
http://www.t13.org
http://www.formfactors.org/
developer/specs/atx/
atx2_1.pdf
http://www.formfactors.org/
developer/specs/atx/
atxspecs.htm
http://www.intel.com/labs/
manage/wfm/wfmspecs.htm
continued
17
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Intel Desktop Board D875PBZ Technical Product Specification
Table 3. Specifications (continued)
Reference
Name
DDR
SDRAM
EHCI
EPP IEEE Std 1284.1-1997
El Torito Bootable CD-ROM
LPC Low Pin Count Interface
OHCI OpenHCI – Open Host
PCI PCI Local Bus
PCI Bus Power
Plug and
Play
Specification
Title
Double Data Rate (DDR)
SDRAM Specification
Design Specification for
a 184 Pin DDR
Unbuffered DIMM
®
JEDEC DDR
Intel
200/266 Unbuffered
DIMM Specification
Addendum
Enhanced Host
Controller Interface
Specification for
Universal Serial Bus
(Enhanced Parallel Port)
Format Specification
Specification
Controller Interface
Specification for USB
Specification
Management Interface
Specification
Plug and Play BIOS
Specification
Version, Revision Date and
Ownership
Version 2.0,
May 2002,
JEDEC Solid State Technology
Association.
Revision 1.0,
October 2001,
JEDEC Solid State Technology
Association.
Revision 0.9,
September 27, 2001,
Intel Corporation.
Revision 1.0,
March 12, 2002,
Intel Corporation.
Version 1.7, 1997,
Institute of Electrical and
Electronic Engineers.
Version 1.0,
January 25, 1995,
Phoenix Technologies Limited
and International Business
Machines Corporation.
Revision 1.0,
September 29, 1997,
Intel Corporation.
Release 1.0a,
October 10, 1996,
Compaq computer Corp.,
Microsoft Corporation, and
National Semiconductor Corp.
Revision 2.2,
December 18, 1998,
PCI Special Interest Group.
Revision 1.1,
December 18, 1998,
PCI Special Interest Group.
Version 1.0a,
May 5, 1994,
Compaq Computer Corporation,
Phoenix Technologies Limited,
and Intel Corporation.
The information is
available from…
http://www.jedec.org/
http://www.jedec.org/
http://developer.intel.com/
technology/memory/
index.htm
http://developer.intel.com/
technology/usb/download/
ehci-r10.pdf
http://standards.ieee.org/
reading/ieee/std_public/
description/busarch/
1284.1-1997_desc.html
http://www.phoenix.com/en/
support/download/
product+documentation/
platform_system_
software.htm
http://www.intel.com/
design/chipsets/industry/
lpc.htm
http://www.usb.org/
developers/docs.html
http://www.pcisig.com/
specifications
http://www.pcisig.com/
specifications
http://www.microsoft.com/
hwdev/tech/PnP/
default.asp
continued
18
Page 19
Table 3. Specifications (continued)
Reference
Name
PXE Preboot Execution
Serial ATA
(SATA)
SMBIOS System Management
UHCI Universal Host Controller
USB Universal Serial Bus
WfM Wired for Management
Specification
Title
Environment
Serial ATA: High Speed
Serialized AT
Attachment
BIOS
Interface Design Guide
Specification
Baseline
Version, Revision Date
and Ownership
Version 2.1,
September 20, 1999,
Intel Corporation.
Revision 1.0,
August 29, 2001,
APT Technologies, Inc.,
Dell Computer Corporation,
IBM Corporation,
Intel Corporation,
Maxtor Corporation,
Seagate Technology.
Version 2.3.1,
March 16, 1999,
American Megatrends
Incorporated,
Award Software International
Incorporated,
Compaq Computer Corporation,
Dell Computer Corporation,
Hewlett-Packard Company,
Intel Corporation,
International Business Machines
Corporation,
Phoenix Technologies Limited,
and SystemSoft Corporation.
Revision 1.1,
March 1996,
Intel Corporation.
Revision 2.0,
April 27, 2000,
Compaq Computer Corporation,
Hewlett-Packard Company,
Lucent Technologies Inc.,
Intel Corporation,
Microsoft Corporation,
NEC Corporation, and
Koninklijke Philips
Electronics N.V.
Version 2.0,
December 18, 1998,
Intel Corporation.
Product Description
The information is
available from…
ftp://download.intel.com/
labs/manage/wfm/
download/pxespec.pdf
http://www.serialata.com/
http://www.dmtf.org/
download/standards/
DSP0119.pdf
http://www.usb.org/
developers/docs.html
http://www.usb.org/
developers/docs.html
http://www.intel.com/labs/
manage/wfm/
wfmspecs.htm
19
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Intel Desktop Board D875PBZ Technical Product Specification
1.5 Processor
NOTE
✏
Refer to Thermal Considerations (Section 2.12, page 79) for important information when using an
Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board.
The board is designed to support Intel Pentium
a 533/800 MHz system bus.
See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors for the D875PBZ board http://www.intel.com/design/motherbd/bz/bz_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the
board, the processor, and the power supply.
4 processors in an mPGA478 processor socket with
INTEGRATOR’S NOTES
#
• Use only ATX12V-compliant power supplies with the board. ATX12V power supplies have an
additional power lead that provides required supplemental power for the processor. Always
connect the 20-pin and 4-pin leads of ATX12V power supply to the corresponding connectors,
otherwise the board will not boot.
• Do not use a standard ATX power supply. The board will not boot with a standard ATX power
supply.
• Refer to Table 4 on page 21 for a list of supported system bus frequency and memory speed
combinations.
For information about Refer to
Power supply connectors Section 2.8.2.2, page 61
20
Page 21
Product Description
1.6 System Memory
1.6.1 Memory Features
The Desktop Board D875PBZ has four DIMM sockets and supports the following memory
features:
• 2.5 V (only) 184-pin DDR SDRAM DIMMs with gold-plated contacts
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
• 4 GB maximum total system memory. Refer to Section 2.2.1 on page 49 for information on
the total amount of addressable memory.
• Minimum total system memory: 64 MB
• ECC and non-ECC DIMMs supported
• Serial Presence Detect
• DDR400 and DDR333 SDRAM DIMMs
Table 4 lists the supported system bus frequency and memory speed combinations.
Table 4. Supported System Bus Frequency and Memory Speed Combinations
To use this type of DIMM… The processor's system bus frequency must be…
DDR400 800 MHz
DDR333 800 or 533 MHz (Note)
Note: When using an 800 MHz system bus frequency processor, DDR333 memory is clocked at 320 MHz. This
minimizes system latencies to optimize system throughput.
✏ NOTES
• When ECC DIMMs are used, the Power-On Self Test (POST) will take longer to complete.
• Remove the AGP video card before installing or upgrading memory to avoid interference with
the memory retention mechanism.
• To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to accurately
configure memory settings for optimum performance. If non-SPD memory is installed, the
BIOS will attempt to correctly configure the memory settings, but performance and reliability
may be impacted or the DIMMs may not function under the determined frequency.
For information about Refer to
Obtaining DDR SDRAM specifications Section 1.4, page 17
21
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Intel Desktop Board D875PBZ Technical Product Specification
Table 5 lists the supported DIMM configurations.
Table 5. Supported Memory Configurations
DIMM
Capacity
64 MB SS 64 Mbit 8 M x 8/empty 8
64 MB SS 128 Mbit 8 M x 16/empty 4
128 MB DS 64 Mbit 8 M x 8/8 M x 8 16
128 MB SS 128 Mbit 16 M x 8/empty 8
128 MB SS 256 Mbit 16 M x 16/empty 4
256 MB DS 128 Mbit 16 M x 8/16 M x 8 16
256 MB SS 256 Mbit 32 M x 8/empty 8
256 MB SS 512 Mbit 32 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 512 Mbit 64 M x 8/empty 8
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of DDR SDRAM) and “SS”
refers to single-sided memory modules (containing one row of DDR SDRAM).
Configuration
DDR SDRAM
Density
DDR SDRAM Organization
Front-side/Back-side
Number of DDR
SDRAM Devices
22
Page 23
Product Description
1.6.2 Memory Configurations
The Intel 82875P MCH component provides two features for enhancing memory throughput:
• Dual Channel memory interface. The board has two memory channels, each with two DIMM
sockets, as shown in Figure 3
• Dynamic Addressing Mode. Dynamic mode minimizes overhead by reducing memory
accesses
Table 6 summarizes the characteristics of Dual and Single Channel configurations with and
without the use of Dynamic Mode.
Table 6. Characteristics of Dual and Single Channel Configuration with and without
Dynamic Mode
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Characteristics
(Example configurations are shown in Figure 4)
• DIMMs not matched within channels
(Example configuration is shown in Figure 5)
(Example configurations are shown in Figure 6)
(Example configurations are shown in Figure 7)
23
Channel A, DIMM 0
Channel A, DIMM 1
Channel B, DIMM 0
Channel B, DIMM 1
Figure 3. Memory Channel Configuration
OM15894
Page 24
Intel Desktop Board D875PBZ Technical Product Specification
Dual Channel Configuration with Dynamic Mode
(All DIMMs matched)
Channel A - DIMM 0 Channel B - DIMM 0
Example
1
Channel A - DIMM 1
82875P
Intel
Channel B - DIMM 1
MCH
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 4. Examples of Dual Channel configuration with Dynamic Mode
Channel B - DIMM 1
OM15978
24
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Product Description
Dual Channel Configuration without Dynamic Mode
- DIMMs not matched within channel
- DIMMs match Channel A to Channel B
Channel A - DIMM 0 Channel B - DIMM 0
Channel A - DIMM 1 Channel B - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 5. Example of Dual Channel configuration without Dynamic Mode
OM15979
25
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Intel Desktop Board D875PBZ Technical Product Specification
Single Channel Configuration with Dynamic Mode
(Single DIMM or DIMMs matched within Channel)
Channel A - DIMM 0 Channel B - DIMM 0
Example
1
Channel A - DIMM 1
82875P
Intel
Channel B - DIMM 1
MCH
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 6. Examples of Single Channel configuration with Dynamic Mode
Channel B - DIMM 1
OM15980
26
Page 27
Example
1
Product Description
Single Channel Configuration without Dynamic Mode
(DIMMs not matched)
Channel A - DIMM 0 Channel B - DIMM 0
Channel A - DIMM 1
Intel
82875P
MCH
Channel B - DIMM 1
Channel A - DIMM 0 Channel B - DIMM 0
Example
2
Channel A - DIMM 1
Throughput
Level
Highest Dual Channel with Dynamic Mode All DIMMs matched
Lowest Single Channel without Dynamic Mode DIMMs not matched
Configuration
Dual Channel without Dynamic Mode • DIMMs matched from Channel A to Channel B
Single Channel with Dynamic Mode Single DIMM or DIMMs matched within a channel
Intel
82875P
MCH
Characteristics
• DIMMs not matched within channels
Figure 7. Examples of Single Channel configuration without Dynamic Mode
Channel B - DIMM 1
OM15981
27
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Intel Desktop Board D875PBZ Technical Product Specification
1.7 Intel® 875P Chipset
The Intel 875P chipset consists of the following devices:
• Intel 82875P Memory Controller Hub (MCH) with Accelerated Hub Architecture (AHA) bus
• Intel 82801ER I/O Controller Hub (ICH5-R) with AHA bus
• Intel 82802AC (8 Mbit) Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the AGP bus, and the
Accelerated Hub Architecture interface. The ICH5-R is a centralized controller for the Desktop
Board D875PBZ’s I/O paths. The FWH provides the nonvolatile storage of the BIOS. The
component combination provides the chipset interfaces as shown in Figure 8.
Parallel ATA
IDE Interface
System Bus
875P Chipset
USB
82801ER
I/O Controller Hub
(ICH5-R)
SMBus
PCI
Bus
AC Link
LPC Bus
82802AC
8 Mbit Firmware
Hub (FWH)
OM15967
CSA
Interface
82875P
Memory Controller
Hub (MCH)
Dual-Channel
AGP
Interface
DDR SDRAM
Bus
AHA
Bus
Serial
ATA
IDE
Interface
Figure 8. Intel 875P Chipset Block Diagram
For information about Refer to
The Intel 875P chipset http://developer.intel.com
Resources used by the chipset Chapter 2
28
Page 29
Product Description
1.7.1 AGP
The AGP connector supports the following:
• 4x, 8x AGP 3.0 add-in cards with 0.8 V I/O
• 1x, 4x AGP 2.0 add-in cards with 1.5 V I/O
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications.
While based on the PCI Local Bus Specification, Rev. 2.2, AGP is independent of the PCI bus and
is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of
the PCI bus related to handling large amounts of graphics data with the following features:
• Pipelined memory read and write operations that hide memory access latency
• Demultiplexing of address and data on the bus for nearly 100 percent efficiency
INTEGRATOR’S NOTES
#
• AGP 2x operation is not supported.
• Install memory in the DIMM sockets prior to installing the AGP video card to avoid
interference with the memory retention mechanism.
• The AGP connector is keyed for Universal 0.8 V AGP 3.0 cards or 1.5 V AGP 2.0 cards only.
Do not attempt to install a legacy 3.3 V AGP card. The AGP connector is not mechanically
compatible with legacy 3.3 V AGP cards.
For information about Refer to
The location of the AGP connector Figure 1, page 14
Obtaining the Accelerated Graphics Port Interface Specification Section 1.4, page 17
1.7.2 USB
The Desktop Board D875PBZ supports up to eight USB 2.0 ports, supports UHCI and EHCI, and
uses UHCI- and EHCI-compatible drivers.
The ICH5-R provides the USB controller for all ports. The port arrangement is as follows:
• Four ports are implemented with stacked back panel connectors, adjacent to the PS/2
connectors
• Two ports are implemented with stacked back panel connectors, adjacent to the audio
connectors
• Two ports are routed to the front panel USB connector
NOTES
✏
• Computer systems that have an unshielded cable attached to a USB port may not meet FCC
Class B requirements, even if no device is attached to the cable. Use shielded cable that meets
the requirements for full-speed devices.
• Native USB 2.0 support has been tested with drivers for Windows 2000 (with Service Pack 3)
and Windows XP (with Service Pack 1) and is not currently supported by any other operating
system. Check Intel’s Desktop Board website for possible driver updates for other operating
systems.
29
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Intel Desktop Board D875PBZ Technical Product Specification
For information about Refer to
The location of the USB connectors on the back panel Figure 16, page 58
The location of the front panel USB connector Figure 20, page 68
The signal names of the front panel USB connector Figure 22, page 71
The front panel, EHCI, UHCI, and USB specifications Section 1.4, page 17
1.7.3 IDE Support
The board provides four IDE interface connectors:
• Two Parallel ATA IDE connectors, which support a total of four devices (two per connector)
• Two Serial ATA IDE connectors, which support one device per connector
1.7.3.1 Parallel ATA IDE Interfaces
The ICH5-R’s Parallel ATA IDE controller has two independent bus-mastering Parallel ATA IDE
interfaces that can be independently enabled. The Parallel ATA IDE interfaces support the
following modes:
• Programmed I/O (PIO): processor controls data transfer.
• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
• Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
• ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of
up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
• ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH5-R’s ATA-
100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to
88 MB/sec.
NOTE
✏
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections,
noise, and inductive coupling.
The Parallel ATA IDE interfaces also support ATAPI devices (such as CD-ROM drives) and ATA
devices using the transfer modes listed in Section 4.4.4.1 on page 105.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS)
translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The Desktop Board D875PBZ supports Laser Servo (LS-120) diskette technology through the
Parallel ATA IDE interfaces. The BIOS supports booting from an LS-120 drive.
✏ NOTE
The BIOS will always recognize an LS-120 drive as an ATAPI floppy drive. To ensure correct
operation, do not configure the drive as a hard disk drive.
For information about Refer to
The location of the Parallel ATA IDE connectors Figure 19, page 66
30
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Product Description
1.7.3.2 Serial ATA Interfaces
The ICH5-R’s Serial ATA controller offers two independent Serial ATA ports with a theoretical
maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a
maximum of two Serial ATA devices. A point-to-point interface is used for host to device
connections, unlike Parallel IDE which supports a master/slave configuration and two devices per
channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system.
The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard
IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI resource
steering is used. Native mode is the preferred mode for configurations using the Windows XP and
Windows 2000 operating systems.
NOTE
✏
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power
supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/
1.7.3.3 Serial ATA RAID
The ICH5-R supports RAID (Redundant Array of Independent Drives) level 0 on the Serial ATA
ports. RAID 0 provides the ability to support striping. Two physical drives, of identical size, can
be teamed together to create one logical drive. As data is written or retrieved from the logical
drive, both drives operate in parallel, thus increasing the throughput.
NOTE
✏
The ICH5-R provides support for RAID O and RAID boot in Windows XP only.
1.7.3.4 RAID Boot Configuration Overview
A RAID array can be created by using the existing Serial ATA ports, correctly configuring the
BIOS, and installing drivers. The following steps are required to successfully establish a RAID
configuration.
1. Enable RAID Support in BIOS
2. Create a RAID array using the Intel
3. Install the IAA 3.0 RAID driver
4. Format the RAID array
5. Install the IAA 3.0 Companion Utility (this step is optional)
®
Application Accelerator (IAA) utility
31
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Intel Desktop Board D875PBZ Technical Product Specification
For information about Refer to
The location of the Serial ATA/Serial ATA RAID connectors Figure 19, page 66
The signal names of the Serial ATA/Serial ATA RAID connectors Table 32, page 67
The BIOS Setup program’s Boot menu Table 69, page 118
Serial ATA RAID configuration http://developer.intel.com/design/
motherbd/bz/index.htm
1.7.3.5 SCSI Hard Drive Activity LED Connector
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in
hard drive controller to use the same LED as the onboard IDE controller. For proper operation,
this connector should be wired to the LED output of the add-in hard drive controller. The LED
indicates when data is being read from, or written to, either the add-in hard drive controller or the
onboard IDE controller (Parallel ATA or Serial ATA).
For information about Refer to
The location of the SCSI hard drive activity LED connector Figure 19, page 66
The signal names of the SCSI hard drive activity LED connector Table 31, page 67
1.7.4 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer
is not plugged into a wall socket, the battery has an estimated life of three years. When the
computer is plugged in, the standby current from the power supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
✏ NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS
RAM at power-on.
1.7.5 Intel® 82802AC Firmware Hub (FWH)
The 8 Mbit FWH provides the following:
• System BIOS program
• Logic that enables protection for storing and updating of platform information
1.8 I/O Controller
The I/O controller provides the following features:
• One serial port
• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• PS/2-style mouse and keyboard interfaces
• Interface for one 1.44 MB diskette drive
32
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Product Description
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
For information about Refer to
SMSC LPC47M172 I/O controller http://www.smsc.com
National Semiconductor PC87372 I/O Controller http://www.national.com
1.8.1 Serial Port
The board has one serial port connector located on the back panel. The serial port supports data
transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port connector Figure 16, page 58
1.8.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup
program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 16, page 58
Setting the parallel port’s mode Table 55, page 101
1.8.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the
diskette drive interface.
For information about Refer to
The location of the diskette drive connector Figure 19, page 66
The supported diskette drive capacities and sizes Table 58, page 107
1.8.4 Keyboard and Mouse Interface
The PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
✏
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top
PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 16, page 58
33
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Intel Desktop Board D875PBZ Technical Product Specification
1.9 Audio Subsystem (Optional)
The Desktop Board D875PBZ provides a Flex 6 audio subsystem based on the Analog Devices
AD1985 codec. The audio subsystem supports the following features:
• Advanced jack sense with Auto Topology Switching that enables the audio codec to recognize
what device is connected to an audio port and alerts the user if the wrong type of device has
been connected
• Split digital/analog architecture for improved S/N (signal-to-noise) ratio: > 94 dB
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio software and drivers Section 1.2, page 16
1.9.2 Intel® Flex 6 Audio Subsystem
The Flex 6 audio subsystem includes the following:
• Intel 82801ER I/O Controller Hub (ICH5-R)
• Analog Devices AD1985 audio codec
• Microphone input that supports a single dynamic, condenser, or electret microphone
The subsystem has the following connectors:
• ATAPI-style CD-ROM connector
• ATAPI-style auxiliary line input connector
• Front panel audio connector, including pins for:
Line out
Mic in
• Back panel audio connectors that are configurable through the audio devices drivers. The
available configurations are shown in Figure 9.
Two-Channel Analog
Jack Option
Line In
Line Out
Mic In
Six-Channel Analog
Shared Jack Option
Rear Channel
Left and Right Out
Front Channel
Left and Right Out
Center Channel and
LFE (Subwoofer) Out
5.1 Digital
Shared Jack Option
Line In
S/PDIF
Mic In
Figure 9. Back Panel Audio Connector Options for Flex 6 Audio Subsystem
34
OM15974
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Product Description
INTEGRATOR’S NOTE
#
To access the S/PDIF signal with the 5.1 Digital Shared Jack option, connect an 1/8-inch stereo
phone plug to RCA jack adapter/splitter as shown in Figure 10.
Connect to
S/PDIF output
on Back Panel
1/8-inch Stereo
Phone Plug
Figure 10. Adapter for S/PDIF Back Panel Connector
RCA Jack
Left Channel
(White, if colored)
Connect to 5.1
speaker system or
an S/PDIF decoder
OM16108
Figure 11 is a block diagram of the Flex 6 audio subsystem.
Rear Left and Right Out
Front Left and Right Out
Center and LFE (Subwoofer) Out
82801ER (ICH5-R)
I/O Controller Hub
AC ’97 Link
AD1985
Audio Codec
S/PDIF
Line In
Mic In
CD-ROM
Auxiliary Line In
OM16109
Figure 11. Flex 6 Audio Subsystem Block Diagram
For information about Refer to
The front panel audio connector Section 2.8.3, page 68
The back panel audio connectors Section 2.8.1, page 58
35
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Intel Desktop Board D875PBZ Technical Product Specification
1.9.3 Audio Connectors
1.9.3.1 Auxiliary Line In Connector
A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio
device to the audio subsystem.
For information about Refer to
The location of the optional auxiliary line in connector Figure 17, page 61
The signal names of the optional auxiliary line in connector Table 21, page 62
1.9.3.2 Front Panel Audio Connector
A 2 x 5-pin connector provides mic in and line out signals for front panel audio connectors.
For information about Refer to
The location of the connector Section 2.8.3, page 68
The signal names of the front panel audio connector Table 22, page 62
NOTE
✏
The front panel audio connector is alternately used as a jumper block for routing audio signals.
Refer to Section 2.9.1 on page 72 for more information.
1.9.3.3 ATAPI-Style CD-ROM Connector
A 1 x 4-pin connector connects an internal ATAPI CD-ROM drive to the audio mixer.
For information about Refer to
The location of the ATAPI-style CD-ROM connector Figure 19, page 66
The signal names of the ATAPI-style CD-ROM connector Table 23, page 62
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1.10 LAN Subsystem
The LAN subsystem consists of the following:
• Intel 82875P MCH device with an integrated LAN Media Access Controller (MAC)
• Intel 82547EI Platform LAN Connect (PLC) device for Gigabit (10/100/1000 Mbits/sec)
Ethernet LAN connectivity
• RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
• PCI bus master interface
• 8-bit CSA port interface (Hublink 1.5) interface that support the 82547EI PLC device
• PCI power management
Supports ACPI technology
Supports LAN wake capabilities
1.10.1 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN software and drivers Section 1.2, page 16
Product Description
1.10.2 Intel® 82547EI Platform LAN Connect Device
Intel 82547EI provides the following functions:
• Basic 10/100/1000 Ethernet LAN connectivity
• Communication Streaming Architecture (CSA) port provides higher throughput and lower
latencies resulting in up to 30% higher bus throughput (up to wirespeed)
• Full device driver compatibility
• Programmable transit threshold
• Configuration EEPROM that contains the MAC address
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (as shown in Figure 12). Table 7 describes the
LED states when the board is powered up and the 10/100/1000 Mbits/sec LAN subsystem is
operating.
Green LED
Figure 12. LAN Connector LED Locations
Green/Orange LED
OM15977
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Intel Desktop Board D875PBZ Technical Product Specification
Table 7. LAN Connector LED States
LED Color LED State Condition
Off LAN link is not established.
Left Green
On (steady state) LAN link is established.
On (brighter and pulsing) The computer is communicating with another
computer on the LAN.
Off 10 Mbit/sec data rate is selected.
On 100 Mbit/sec data rate is selected.
On
1000 Mbit/sec data rate is selected.
Right
Green
Orange
1.11 Hardware Management Subsystem
The hardware management features enable the Desktop Board D875PBZ to be compatible with the
Wired for Management (WfM) specification. The Desktop Board D875PBZ has the following
hardware management features:
• Fan monitoring and control (through the I/O controller or the hardware monitoring and fan
control ASIC)
• Thermal and voltage monitoring
• Chassis intrusion detection
For information about Refer to
The WfM specification Section 1.4, page 17
1.11.1 Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC (Standard Microsystems
SMSC EMC6D101 or equivalent) include:
• Internal ambient temperature sensor
• Two remote thermal diode sensors for direct monitoring of processor temperature and ambient
temperature sensing
• Power supply monitoring of five voltages (+5 V, +12 V, +3.3 V Standby, +1.5 V, and +VCCP)
to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control, for all four fans, that can adjust the fan speed or
switch the fans on or off as needed
• SMBus interface
For information about Refer to
The location of the fan connectors and sensors for thermal monitoring Figure 13, page 39
The Standard Microsystems SMSC EMC6D101 http://www.smsc.com
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1.11.2 Thermal Monitoring
Figure 13 shows the location of the sensors and fan connectors.
Product Description
1
3
1
3
3
1
F EG
Item Description
A Thermal diode, located on processor die
B Remote ambient temperature sensor
C Ambient temperature sensor, internal to hardware monitoring ASIC
D Processor fan
E Rear chassis fan
F Front chassis fan
G Voltage regulator fan
1
3
A
B
C
D
OM15884
39
Figure 13. Thermal Monitoring
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Intel Desktop Board D875PBZ Technical Product Specification
1.11.3 Fan Monitoring
Fan monitoring can be implemented using Intel® Active Monitor, LANDesk* software, or thirdparty software.
For information about Refer to
The functions of the fan connectors Section 1.12.2.2, page 44
1.11.4 Chassis Intrusion and Detection
The boards support a chassis security feature that detects if the chassis cover has been removed.
The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion
connector. When the chassis cover is removed, the mechanical switch is in the closed position.
For information about Refer to
The location of the chassis intrusion connector Figure 18, page 63
The signal names of the chassis intrusion connector Table 30, page 65
1.12 Power Management
Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
Power connector
Fan connectors
LAN wake capabilities
Instantly Available PC technology
Wake from USB
Wake from PS/2 devices
Power Management Event (PME#) wake-up support
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Product Description
1.12.1 ACPI
ACPI gives the operating system direct control over the power management and Plug and Play
functions of a computer. The use of ACPI with the Desktop Board D875PBZ requires an operating
system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in boards may
require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the standby or sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 10 on page 43)
• Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed, depending on how
ACPI is configured with an ACPI-aware operating system.
Table 8. Effects of Pressing the Power Switch
If the system is in this state…
Off
(ACPI S5 – Soft off)
On
(ACPI S0 – working state)
On
(ACPI S0 – working state)
Sleep
(ACPI S1 or S3 – sleeping state)
Sleep
(ACPI S1 or S3 – sleeping state)
…and the power switch is
pressed for
Less than four seconds Power-on
Less than four seconds Soft-off/Standby
More than four seconds Fail safe power-off
Less than four seconds Wake-up
More than four seconds Power-off
…the system enters this state
(ACPI S0 – working state)
(ACPI S1 or S3 – sleeping state)
(ACPI S5 – Soft off)
(ACPI S0 – working state)
(ACPI S5 – Soft off)
For information about Refer to
The Desktop Board D875PBZ's compliance level with ACPI Section 1.4, page 17
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Intel Desktop Board D875PBZ Technical Product Specification
1.12.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The
operating system puts devices in and out of low-power states based on user preferences and
knowledge of how devices are being used by applications. Devices that are not being used can be
turned off. The operating system uses information from applications and user settings to put the
system as a whole into a low-power state.
Table 9 lists the power states supported by the Desktop Board D875PBZ along with the associated
system power targets. See the ACPI specification for a complete description of the various system
and power states.
Table 9. Power States and Targeted System Power
Global States Sleeping States
G0 – working
state
G1 – sleeping
state
G1 – sleeping
state
G1 – sleeping
state
G2/G5 S5 – Soft off.
G3 –
mechanical off
AC power is
disconnected
from the
computer.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals powered
by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
S0 – working C0 – working D0 – working
S1 – Processor
stopped
S3 – Suspend to
RAM. Context
saved to RAM.
S4 – Suspend to
disk. Context
saved to disk.
Context not saved.
Cold boot is
required.
No power to the
system.
Processor
States
C1 – stop
grant
No power D3 – no power
No power D3 – no power
No power D3 – no power
No power D3 – no power for
Device States
state.
D1, D2, D3 –
device
specification
specific.
except for
wake-up logic.
except for
wake-up logic.
except for
wake-up logic.
wake-up logic,
except when
provided by
battery or external
source.
Targeted System
(Note 1)
Power
Full power > 30 W
5 W < power < 52.5 W
Power < 5 W
Power < 5 W
Power < 5 W
No power to the system.
Service can be performed
safely.
(Note 2)
(Note 2)
(Note 2)
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Product Description
1.12.1.2 Wake-up Devices and Events
Table 10 lists the devices or specific events that can wake the computer from specific states.
Table 10. Wake-up Devices and Events
These devices/events can wake up the computer… …from this state
LAN S1, S3, S4, S5
Modem (back panel Serial Port A) S1, S3
PME# S1, S3, S4, S5
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S1, S3, S4, S5
USB S1, S3
Note: For LAN and PME#, S5 is disabled by default in the BIOS Setup program. Setting this option to Power On will
enable a wake-up event from LAN in the S5 state.
NOTE
✏
The use of these wake-up events from an ACPI state requires an operating system that provides full
ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake
events.
(Note)
(Note)
1.12.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities
and Instantly Available PC technology features are used. Failure to do so can damage the power
supply. The total amount of standby current required depends on the wake devices supported and
manufacturing options.
The Desktop Board D875PBZ provides power management hardware features, including:
• Power connector
• Fan connectors
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• Wake from PS/2 keyboard
• PME# wake-up support
LAN wake capabilities and Instantly Available PC technology require power from the +5 V
standby line. The sections discussing these features describe the incremental standby power
requirements for each.
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1.12.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When
an ACPI-enabled system receives the correct command, the power supply removes all non-standby
voltages.
When resuming from an AC power failure, the computer returns to the power state it was in before
power was interrupted (on or off). The computer’s response can be set using the Last Power State
feature in the BIOS Setup program’s Boot menu.
For information about Refer to
The power connector locations Figure 18, page 63
The power connector signal names Table 28, page 65 and Table 25, page 64
The BIOS Setup program’s Boot menu Table 69, page 118
The ATX specification Section 1.4, page 17
1.12.2.2 Fan Connectors
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 11 summarizes the fan connector function/operation.
Table 11. Fan Connector Function/Operation
Connector Description
Processor fan • +12 V DC connection for a processor fan or active fan heatsink.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Wired to a fan tachometer input of the hardware monitoring and fan control ASIC.
• Closed-loop fan control that can adjust the fan speed or switch the fan on or off as
needed.
Front and rear
chassis fans
Voltage regulator
fan
• +12 V DC connection for a system or chassis fan.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Wired to a fan tachometer input of the hardware monitoring and fan control ASIC.
• Closed-loop fan control that can adjust the fan speed or switch the fan on or off as
needed.
• +12 V DC connection for a system or chassis fan.
• Fan is on in the S0 or S1 state.
Fan is off when the system is off or in the S3, S4, or S5 state.
• Wired to a fan tachometer input of the hardware monitoring and fan control ASIC.
For information about: Refer to:
The location of the fan connectors Figure 18, page 63
The signal names of the fan connectors Pages 64 and 65
The location of the fan connectors and sensors for thermal monitoring Figure 13, page 39
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Product Description
1.12.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of
providing adequate +5 V standby current. Failure to provide adequate standby current when
implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN
subsystem PCI bus network adapter monitors network traffic at the Media Independent Interface.
Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers
up the computer. Depending on the LAN implementation, the Desktop Board D875PBZ supports
LAN wake capabilities with ACPI in the following ways:
• PCI bus PME# signal for PCI 2.2 compliant LAN designs
• Onboard LAN subsystem
1.12.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate standby current
when implementing Instantly Available PC technology can damage the power supply.
Instantly Available PC technology enables the Desktop Board D875PBZ to enter the ACPI S3
(Suspend-to-RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single colored.)
When signaled by a wake-up device or event, the system quickly returns to its last known wake
state. Table 10 on page 43 lists the devices and events that can wake the computer from the
S3 state.
The Desktop Board D875PBZ supports the PCI Bus Power Management Interface Specification.
For information on the version of this specification, see Section 1.4. Add-in boards that also
support this specification can participate in power management and can be used to wake the
computer.
The use of Instantly Available PC technology requires operating system support and PCI 2.2
compliant add-in cards and drivers.
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Intel Desktop Board D875PBZ Technical Product Specification
1.12.2.5 Standby Power (+5 V) Indicator LED
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power
cord before installing or removing any devices connected to the Desktop Board D875PBZ. Failure
to do so could damage the Desktop Board D875PBZ and any attached devices.
The standby power indicator LED shows that power is still present even when the computer
appears to be off. Figure 14 shows the location of the standby power indicator LED.
CR7J1
Figure 14. Location of the Standby Power Indicator LED
1.12.2.6 Wake from USB
USB bus activity wakes the computer from an ACPI S1 or S3 state.
NOTE
✏
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
46
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Product Description
1.12.2.7 Wake from PS/2 Devices
PS/2 device activity wakes the computer from an ACPI S1 or S3 state.
1.12.2.8 PME# Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI S1, S3, S4,
or S5 state (with Wake on PME enabled in BIOS).
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Intel Desktop Board D875PBZ Technical Product Specification
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2 Technical Reference
What This Chapter Contains
2.1 Introduction.................................................................................................................49
2.2 Memory Resources ....................................................................................................49
2.3 DMA Channels ...........................................................................................................51
2.4 Fixed I/O Map.............................................................................................................52
2.5 PCI Configuration Space Map ....................................................................................53
2.6 Interrupts ....................................................................................................................54
2.7 PCI Interrupt Routing Map..........................................................................................55
2.8 Connectors.................................................................................................................57
2.9 Jumper Blocks............................................................................................................72
2.10 Mechanical Considerations.........................................................................................74
2.11 Electrical Considerations ............................................................................................77
2.12 Thermal Considerations..............................................................................................79
2.13 Reliability ....................................................................................................................81
2.14 Environmental ............................................................................................................81
2.1 Introduction
Sections 2.2 - 2.6 contain several standalone tables. Table 12 describes the system memory map,
Table 13 lists the DMA channels, Table 14 shows the fixed I/O map, Table 15 defines the PCI
configuration space map, and Table 16 describes the interrupts. The remaining sections in this
chapter are introduced by text found with their respective section headings.
2.2 Memory Resources
2.2.1 Addressable Memory
The D875PBZ utilizes 4 GB of addressable system memory. Typically the address space that is
allocated for PCI add-in cards, AGP aperture, BIOS (firmware hub), and chipset overhead resides
above the top of DRAM (total system memory). On a system that has 4 GB of system memory
installed, it is not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• Memory-mapped I/O that is dynamically allocated for PCI and AGP cards
• AGP aperture
• APIC and chipset overhead (approximately 18 MB)
• BIOS/firmware hub (approximately 2 MB)
The amount of installed memory that can be used will vary based on add-in cards and BIOS
settings. For example, if the PCI cards are requesting 200 MB of system memory and the AGP
aperture is set to 256 MB in the BIOS Setup program, there will be approximately 3.54 GB of
memory that can be accessed. Figure 15 shows a schematic of the system memory map. All
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Intel Desktop Board D875PBZ Technical Product Specification
installed system memory can be used when there is no overlap of system addresses. For example,
all of the system address space can be utilized on a system that has 2 GB of installed system
memory, AGP aperture set for 256 MB, and the PCI cards are requesting 200 MB of system
address space.
4 GB
Top of System Address Space
FLASH
PCI Memory Range
(contains AGP window,
AGP aperture, PCI, and
ICH ranges)
DRAM
Range
Compatibility
Memory
DOS
APIC
Reserved
~20 MB
Top of usable
DRAM (memory
visible to the
operating
system)
1 MB
640 KB
0 MB
0FFFFFH
0F0000H
0EFFFFH
0E0000H
0DFFFFH
0C0000H
0BFFFFH
0A0000H
09FFFFH
00000H
Upper BIOS
area (64 KB)
Lower BIOS
area
(64 KB;
16 KB x 4)
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB *
DOS area
(640 KB)
1 MB
960 KB
896 KB
768 KB
640 KB
0 KB
Figure 15. Detailed System Memory Address Map
50
* Optionally mapped
to the internal AGP
OM16106
Page 51
2.2.2 Memory Map
Table 12 lists the system memory map.
Table 12. System Memory Map
Address Range (decimal) Address Range (hex) Size Description
1024 K - 4194304 K 100000 - FFFFFFFF 4095 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Technical Reference
memory (open to the PCI bus).
Dependent on video adapter used.
memory manager software)
2.3 DMA Channels
Table 13. DMA Channels
DMA Channel Number Data Width System Resource
0 8 or 16 bits Open
1 8 or 16 bits Parallel port
2 8 or 16 bits Diskette drive
3 8 or 16 bits Parallel port (for ECP or EPP)
4 8 or 16 bits DMA controller
5 16 bits Open
6 16 bits Open
7 16 bits Open
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2.4 Fixed I/O Map
Table 14. I/O Map
Address (hex) Size Description
0000 - 00FF 256 bytes Used by the Desktop Board D875PBZ. Refer to the ICH5-
R data sheet for dynamic addressing information
0170 - 0177 8 bytes Secondary Parallel ATA IDE channel command block
01F0 - 01F7 8 bytes Primary Parallel ATA IDE channel command block
0228 - 022F (Note 1) 8 bytes LPT3
0278 - 027F (Note 1) 8 bytes LPT2
02E8 - 02EF (Note 1) 8 bytes COM4
02F8 - 02FF (Note 1) 8 bytes COM2
0374 – 0377 4 bytes Secondary Parallel ATA IDE channel control block
0378 - 037F 8 bytes LPT1
03B0 - 03BB 12 bytes Intel 82875P MCH
03C0 - 03DF 32 bytes Intel 82875P MCH
03E8 - 03EF 8 bytes COM3
03F0 - 03F5 6 bytes Diskette channel
03F4 – 03F7 4 bytes Primary Parallel ATA IDE channel control block
03F8 - 03FF 8 bytes COM1
04D0 - 04D1 2 bytes Edge/level triggered PIC
LPTn + 400 8 bytes ECP port, LPTn base address + 400h
0CF8 - 0CFB (Note 2) 4 bytes PCI configuration address register
0CF9 (Note 3) 1 byte Reset control register
0CFC - 0CFF 4 bytes PCI configuration data register
FFA0 - FFA7 8 bytes Primary Parallel ATA IDE bus master registers
FFA8 - FFAF 8 bytes Secondary Parallel ATA IDE bus master registers
Notes:
1. Default, but can be changed to another address range
2. Dword access only
3. Byte access only
For information about Refer to
ICH5-R addressing Section 1.2, page 16
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2.5 PCI Configuration Space Map
Table 15. PCI Configuration Space Map
Bus
Number (hex)
00 00 and 06 00 Memory controller of Intel 82875P component
00 01 00 Host to AGP bridge (virtual PCI-to-PCI)
00 03 00 PCI to CSA bridge (virtual PCI-to-PCI)
00 1E 00 Hub link to PCI bridge
00 1F 00 Intel 82801ER ICH5-R PCI-to-LPC bridge
00 1F 01 Parallel ATA IDE controller
00 1F 02 Serial ATA controller
00 1F 03 SMBus controller
00 1F 05 AC ’97 audio controller
00 1F 06 AC ’97 modem controller (optional)
00 1D 00 USB UHCI controller 1
00 1D 01 USB UHCI controller 2
00 1D 02 USB UHCI controller 3
00 1D 03 USB UHCI controller 4
00 1D 07 EHCI controller
01 00 00 AGP add-in card
02 01 00 Intel 82547EI Gigabit LAN PLC device
03 00 00 PCI bus connector 1
03 01 00 PCI bus connector 2
03 02 00 PCI bus connector 3
03 03 00 PCI bus connector 4
03 04 00 PCI bus connector 5
Device
Number (hex)
Function
Number (hex) Description
Technical Reference
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Intel Desktop Board D875PBZ Technical Product Specification
2.6 Interrupts
The interrupts can be routed through either the Programmable Interrupt Controller (PIC) or the
Advanced Programmable Interrupt Controller (APIC) portion of the ICH5-R component. The PIC
is supported in Windows 98 SE and Windows ME, and uses the first 16 interrupts. The APIC is
supported in Windows 2000 and Windows XP, and supports a total of 24 interrupts.
Table 16. Interrupts
IRQ System Resource
NMI I/O channel check
0 Reserved, interval timer
1 Reserved, keyboard buffer full
2 Reserved, cascade interrupt from slave PIC
3 COM2
4 COM1
5 LPT2 (Plug and Play option)/User available
6 Diskette drive
7 LPT1
8 Real-time clock
9 Reserved for ICH5-R system management bus
10 User available
11 User available
12 Onboard mouse port (if present, else user available)
13 Reserved, math coprocessor
14 Primary IDE/Serial ATA (if present, else user available)
15 Secondary IDE/Serial ATA (if present, else user available)
(Note 2)
16
17
18
19
20
21
22
23
Notes:
1. Default, but can be changed to another IRQ.
2. Available in APIC mode only.
USB UHCI controller 1 / USB UHCI controller 4 (through PIRQA)
(Note 2)
AC ‘97 audio/modem/User available (through PIRQB)
(Note 2)
ICH5-R USB controller 3 (through PIRQC)
(Note 2)
ICH5-R USB controller 2 (through PIRQD)
(Note 2)
ICH5-R LAN (through PIRQE)
(Note 2)
User available (through PIRQF)
(Note 2)
User available (through PIRQG)
(Note 2)
ICH5-R USB 2.0 EHCI controller/User available (through PIRQH)
(Note 1)
(Note 1)
(Note 1)
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Technical Reference
2.7 PCI Interrupt Routing Map
This section describes interrupt sharing and how the interrupt signals are connected between the
PCI bus connectors and onboard PCI devices. The PCI specification specifies how interrupts can
be shared between devices attached to the PCI bus. In most cases, the small amount of latency
added by interrupt sharing does not affect the operation or throughput of the devices. In some
special cases where maximum performance is needed from a device, a PCI device should not share
an interrupt with other PCI devices. Use the following information to avoid sharing an interrupt
with a PCI add-in card.
PCI devices are categorized as follows to specify their interrupt grouping:
• INTA: By default, all add-in cards that require only one interrupt are in this category. For
almost all cards that require more than one interrupt, the first interrupt on the card is also
classified as INTA.
• INTB: Generally, the second interrupt on add-in cards that require two or more interrupts is
classified as INTB. (This is not an absolute requirement.)
• INTC and INTD: Generally, a third interrupt on add-in cards is classified as INTC and a
fourth interrupt is classified as INTD.
The ICH5-R has eight programmable interrupt request (PIRQ) input signals. All PCI interrupt
sources either onboard or from a PCI add-in card connect to one of these PIRQ signals. Some PCI
interrupt sources are electrically tied together on the Desktop Board D875PBZ and therefore share
the same interrupt. Table 17 shows an example of how the PIRQ signals are routed.
For example, using Table 17 as a reference, assume an add-in card using INTA is plugged into PCI
bus connector 3. In PCI bus connector 3, INTA is connected to PIRQB, which is already
connected to the ICH5-R audio controller. The add-in card in PCI bus connector 3 now shares an
interrupt with the onboard interrupt source.
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Intel Desktop Board D875PBZ Technical Product Specification
Table 17. PCI Interrupt Routing Map
PCI Interrupt Source
AGP connector INTA INTB
ICH5-R USB UHCI controller 1
SMBus controller INTB
ICH5-R USB UHCI controller 2
AC ’97 ICH5-R Audio
ICH5-R LAN INTA
ICH5-R USB UHCI controller 3
ICH5-R USB UHCI controller 4
ICH5-R USB 2.0 EHCI
controller
PCI bus connector 1 INTD INTA INTB INTC
PCI bus connector 2 INTC INTB INTA INTD
PCI bus connector 3 INTD INTA INTB INTC
PCI bus connector 4 INTB INTA INTC INTD
PCI bus connector 5 INTC INTA INTD INTB
Serial ATA/Serial ATA RAID INTA
PIRQA PIRQB PIRQC PIRQD PIRQE PIRQF PIRQG PIRQH
INTA
INTB
INTB
INTC
INTA
INTD
ICH5-R PIRQ Signal Name
NOTE
✏
In PIC mode, the ICH5-R can connect each PIRQ line internally to one of the IRQ signals (3, 4, 5,
6, 7, 9, 10, 11, 12, 14, and 15). Typically, a device that does not share a PIRQ line will have a
unique interrupt. However, in certain interrupt-constrained situations, it is possible for two or
more of the PIRQ lines to be connected to the same IRQ signal. Refer to Table 16 for the
allocation of PIRQ lines to IRQ signals in APIC mode.
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Technical Reference
2.8 Connectors
CAUTION
On the Desktop Board D875PBZ, only the following connectors have overcurrent protection:
• Back panel USB and PS/2
• Front panel USB
The other internal connectors of the Desktop Board D875PBZ are not overcurrent protected and
should connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors to power devices external to the computer’s chassis. A
fault in the load presented by the external devices could cause damage to the computer, the
interconnecting cable, and the external devices themselves.
The connectors are described on the following pages and are divided into these groups:
• Back panel I/O connectors (see page 58):
PS/2 keyboard and mouse
USB
Serial port A
Parallel port
LAN
Audio
• Internal I/O connectors (see page 60):
Audio (auxiliary line input, front panel audio, and ATAPI-style CD-ROM)
Fans
Power and hardware control
PCI add-in boards
AGP add-in board
Parallel ATA IDE
Diskette drive
SCSI hard drive activity LED
Serial ATA/Serial ATA RAID
• External I/O connectors (see page 68):
Front panel audio
Front panel USB
Front panel (power, sleep, and message-waiting LED; power switch; hard drive activity
LED; and reset switch)
Auxiliary front panel power, sleep, and message-waiting LED
57
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Intel Desktop Board D875PBZ Technical Product Specification
2.8.1 Back Panel Connectors
Figure 16 shows the location of the back panel connectors. The back panel connectors are
color-coded in compliance with PC 99 recommendations. The figure legend below lists the
colors used.
C
F
A
HE
J
B
G ID
OM15891
Item Description Color
A PS/2 mouse port Green
B PS/2 keyboard port Purple
C USB ports [four] Black
D Serial port A Teal
E Parallel port Burgundy
F LAN Black
G USB ports [two] Black
H Audio line in Light blue
I Mic in Pink
J Audio line out Lime green
Figure 16. Back Panel Connectors
58
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Technical Reference
NOTE
✏
The back panel audio line out connector is designed for headphones or amplified speakers only.
Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
Table 18. Audio Line In Connector
Pin Signal Name
Tip Audio left in
Ring Audio right in
Sleeve Ground
Table 19. Mic In Connector
Pin Signal Name
Tip Mono in
Ring Mic bias voltage
Sleeve Ground
Table 20. Audio Line Out Connector
Pin Signal Name
Tip Audio left out
Ring Audio right out
Sleeve Ground
59
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Intel Desktop Board D875PBZ Technical Product Specification
2.8.2 Internal I/O Connectors
The internal I/O connectors are divided into the following functional groups:
• Audio (see page 61):
Auxiliary line input
Front panel audio
ATAPI CD-ROM
• Power and hardware control (see page 63):
Fans [four]
ATX12V
Main power
Chassis intrusion
• Add-in boards and peripheral interfaces (see page 66):
PCI bus [five]
AGP
Parallel ATA IDE [two]
Serial ATA/Serial ATA RAID [two]
Diskette drive
SCSI hard drive activity LED
2.8.2.1 Expansion Slots
The Desktop Board D875PBZ has the following expansion slots:
• AGP connector: The AGP connector is keyed for Universal 0.8 V AGP 3.0 cards or 1.5 V
AGP 2.0 cards only. Do not install a legacy 3.3 V AGP card. The AGP connector is not
mechanically compatible with legacy 3.3 V AGP cards.
• Five PCI rev 2.2 compliant local bus slots: PCI add-in cards with SMBus support can access
sensor data and other information residing on the Desktop Board D875PBZ.
NOTE
✏
This document references back-panel slot numbering with respect to processor location on the
Desktop Board D875PBZ. The AGP slot is not numbered. PCI slots are identified as PCI slot #x,
starting with the slot closest to the processor. Figure 19 on page 66 illustrates the Desktop Board
D875PBZ’s PCI slot numbering.
60
Page 61
2.8.2.2 Audio Connectors
Figure 18 shows the location of the audio connectors.
BA
C
Technical Reference
1
4
12
910
1
4
Item Description For more information see:
A ATAPI-style auxiliary line input Table 21
B Front panel audio Table 22
C ATAPI CD-ROM Table 23
OM15893
61
Figure 17. Audio Connectors
Page 62
Intel Desktop Board D875PBZ Technical Product Specification
Table 21. Auxiliary Line Input Connector
Pin Signal Name
1 Left auxiliary line in
2 Ground
3 Ground
4 Right auxiliary line in
Table 22. Front Panel Audio Connector
Pin Signal Name Pin Signal Name
1 Mono Mic in (Stereo Mic 1) 2 Ground
3 Mono Mic Bias (Stereo Mic 2) 4 +5 V
5 RIGHT_OUT 6 Right channel return
7 Ground 8 Key
9 LEFT_OUT 10 Left channel return
NOTE
✏
The front panel audio connector is alternately used as a jumper block for routing audio signals.
For more information, see Section 2.9.1 on page 72.
Table 23. ATAPI CD-ROM Connector
Pin Signal Name
1 Left audio input from CD-ROM
2 CD audio differential ground
3 CD audio differential ground
4 Right audio input from CD-ROM
62
Page 63
2.8.2.3 Power and Hardware Control Connectors
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Figure 18 shows the location of the power and hardware control connectors.
BA
Technical Reference
1
3
4213
1
3
1
20
3
1
10
11
1
EFG
Item Description For more information see:
A Rear chassis fan Table 24
B +12 V power connector (ATX12V) Table 25
C Voltage regulator fan Table 26
D Processor fan Table 27
E Main power Table 28
F Front chassis fan Table 29
G Chassis intrusion Table 30
1
3
OM15888
C
D
Figure 18. Power and Hardware Control Connectors
63
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Intel Desktop Board D875PBZ Technical Product Specification
NOTE
✏
Do not use a standard ATX power supply. The Desktop Board D875PBZ will not boot with a
standard ATX power supply. Use only ATX12V-compliant power supplies with the Desktop Board
D875PBZ. ATX12V power supplies have an additional power lead that provides required
supplemental power for the Intel Pentium 4 processor. The Desktop Board D875PBZ will not boot
if the ATX12V power supply is not connected to both the 4-pin and 20-pin power connectors.
For information about Refer to
The power connector Section 1.12.2.1, page 44
The functions of the fan connectors Section 1.12.2.2, page 44
Table 24. Rear Chassis Fan Connector
Pin Signal Name
1 Control
2 +12 V
3 TACH
Table 25. ATX12V Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 26. Voltage Regulator Fan Connector
Pin Signal Name
1 Control
2 +12 V
3 TACH
Table 27. Processor Fan Connector
Pin Signal Name
1 Control
2 +12 V
3 TACH
64
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Technical Reference
Table 28. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 11 +3.3 V
2 +3.3 V 12 -12 V
3 Ground 13 Ground
4 +5 V 14 PS-ON# (power supply remote on/off)
5 Ground 15 Ground
6 +5 V 16 Ground
7 Ground 17 Ground
8 PWRGD (Power Good) 18 Not connected
9 +5 V (Standby) 19 +5 V
10 +12 V 20 +5 V
Table 29. Front Chassis Fan Connector
Pin Signal Name
1 Control
2 +12 V
3 TACH
Table 30. Chassis Intrusion Connector
Pin Signal Name
1 Intruder
2 Ground
65
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Intel Desktop Board D875PBZ Technical Product Specification
2.8.2.4 Add-in Board and Peripheral Interface Connectors
Figure 19 shows the location of the add-in board and peripheral connectors for the Desktop Board
D875PBZ. Note the following considerations for the PCI bus connectors:
• All of the PCI bus connectors are bus master capable.
• The SMBus is routed to PCI bus connector 2. This enables PCI bus add-in boards with SMBus
support to access sensor data on the Desktop Board D875PBZ. The specific SMBus signals
are as follows:
The SMBus clock line is connected to pin A40
The SMBus data line is connected to pin A41
A
B C D E F
Item
Description Item
A PCI bus connector 5 G Diskette drive
B PCI bus connector 4 H Primary Parallel ATA IDE [black]
C PCI bus connector 3 I Secondary Parallel ATA IDE [white]
D PCI bus connector 2 J SCSI hard drive activity LED connector
E PCI bus connector 1 K Serial ATA/Serial ATA RAID connector 1
F AGP L Serial ATA/Serial ATA RAID connector 0
Figure 19. D875PBZ Add-in Board and Peripheral Interface Connectors
66
2
1
1
L H G
JKI
2
1
40
2
39
39
1
Descsription
34
33
OM15889
Page 67
Technical Reference
NOTE
✏
The AGP connector is keyed for universal 0.8 V AGP 3.0 cards or 1.5 V AGP 2.0 cards only. Do
not attempt to install a legacy 3.3 V AGP card. The AGP connector is not mechanically
compatible with legacy 3.3 V AGP cards.
Table 31. SCSI Hard Drive Activity LED
Connector
Pin Signal Name
1 SCSI_ACT#
2 No connect
Table 32. Serial ATA/Serial ATA RAID Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
67
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Intel Desktop Board D875PBZ Technical Product Specification
2.8.3 External I/O Connectors
Figure 20 shows the locations of the external I/O connectors.
10
C
B
3
1
7
1
2
8
9
1
2
A
OM15890
Item Description For more information see:
A Front panel Table 33
B Auxiliary front panel power/sleep/message-waiting LED Table 36
C Front panel USB [black] Figure 22
Figure 20. External I/O Connectors
68
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Technical Reference
2.8.3.1 Front Panel Connector
This section describes the functions of the front panel connector. Table 33 lists the signal names
of the front panel connector. Figure 21 is a connection diagram for the front panel connector.
Table 33. Front Panel Connector
Pin Signal In/Out Description Pin Signal In/Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED pull-up
(750 Ω) to +5 V
3 HAD# Out Hard disk active LED 4 HDR_BLNK_
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected−
2 HDR_BLNK_
GRN
YEL
Out Front panel green
LED
Out Front panel yellow
LED
9
8
7
6
5
4
3
2
1
+5 V DC
Reset
Switch
Hard Drive
Activity LED
OM15966
Dual-colored
Power LED
N/C
Power
Switch
Single-colored
Power LED
Figure 21. Connection Diagram for Front Panel Connector
2.8.3.1.1 Hard Drive Activity LED Connector
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from
or written to a hard drive. Proper LED function requires one of the following:
• A Serial ATA hard drive connected to an onboard Serial ATA connector
• A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
• An add-in hard drive connected to the SCSI hard drive activity LED connector
For information about Refer to
The SCSI hard drive activity LED connector Section 1.7.3.2, page 31
69
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Intel Desktop Board D875PBZ Technical Product Specification
2.8.3.1.2 Reset Switch Connector
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is
normally open. When the switch is closed, the Desktop Board D875PBZ resets and runs the
POST.
2.8.3.1.3 Power/Sleep/Message Waiting LED Connector
Pins 2 and 4 can be connected to a one- or two-color LED. Table 34 shows the possible states for
a one-color LED. Table 35 shows the possible states for a two-color LED.
Table 34. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Blinking Green Running/message waiting
Table 35. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Blinking Green Running/message waiting
Steady Yellow Sleeping
Blinking Yellow Sleeping/message waiting
✏ NOTE
To use the message waiting function, ACPI must be enabled in the operating system and a
message-capturing application must be invoked.
2.8.3.1.4 Power Switch Connector
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must
pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off.
(The time requirement is due to internal debounce circuitry on the Desktop Board D875PBZ.) At
least two seconds must pass before the power supply will recognize another on/off signal.
2.8.3.2 Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector
Pins 1 and 3 of this connector duplicate the signals on pins 2 and 4 of the front panel connector.
Table 36. Auxiliary Front Panel Power/Sleep/Message-Waiting LED Connector
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
70
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Technical Reference
2.8.3.3 Front Panel USB Connector
Figure 22 is a connection diagram for the front panel USB connector.
INTEGRATOR’S NOTES
#
• The +5 V DC power on the USB connector is fused.
• Pins 1, 3, 5, and 7 comprise one USB port.
• Pins 2, 4, 6, and 8 comprise one USB port.
• Use only a front panel USB connector that conforms to the USB 2.0 specification for high-
speed USB devices.
10
8
7
6
5
4
3
2
1
Key (no pin)
Ground
D+
D−
Power
(+5 V DC)
OM15965
One
USB
Port
One
USB
Port
No Connect
Ground
D+
D−
Power
(+5 V DC)
Figure 22. Connection Diagram for Front Panel USB Connector
71
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Intel Desktop Board D875PBZ Technical Product Specification
2.9 Jumper Blocks
CAUTION
Do not move any jumpers with the power on. Always turn off the power and unplug the power
cord from the computer before changing a jumper setting. Otherwise, the Desktop Board
D875PBZ could be damaged.
Figure 23 shows the location of the jumper blocks on the Desktop Board D875PBZ.
A
2
1
10
9
J8A1
B
31
J7J2
OM15887
Item Description Reference Designator
A Front panel audio connector/jumper block J8A1
B BIOS Setup configuration jumper block J7J2
Figure 23. Location of the Jumper Blocks
2.9.1 Front Panel Audio Connector/Jumper Block
CAUTION
Do not place jumpers on this block in any configuration other than the one described in Table 37.
Other jumper configurations are not supported and could damage the board.
This connector has two functions:
• With jumpers installed, the audio line out signals are routed to the back panel audio line out
connector.
• With jumpers removed, the connector provides audio line out and mic in signals for front panel
audio connectors.
72
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Technical Reference
Table 37 describes the two configurations of this connector/jumper block.
Table 37. Front Panel Audio Connector or Jumper Block
Jumper Setting Configuration
✏
1
34
5
7
9
2
6
10
1
34
5
7
9
2
6
10
NOTE
1 and 2
3 and 4
5 and 6
9 and 10
No jumpers
installed
Front out signals if 6-channel audio (line out signals if 2-channel audio)
are routed to the back panel line out connector. The back panel audio line
out connector is shown in Figure 16 on page 58.
Mic in and front out signals if 6-channel audio (line out signals if 2-channel
audio) are available for connection to front panel audio connectors. Table
22 on page 62 lists the names of the signals available on this connector
when no jumpers are installed.
When the jumpers are removed and this connector is used for front panel audio, the back panel
audio line out and mic in connectors are disabled.
2.9.2 BIOS Setup Configuration Jumper Block
The 3-pin jumper block determines the BIOS Setup program’s mode. Table 38 describes the
jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to
configure mode and the computer is powered-up, the BIOS compares the processor version and the
microcode version in the BIOS and reports if the two match.
Table 38. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal
1-2
Configure
2-3
Recovery
None
1
13
13
For information about Refer to
How to access the BIOS Setup program Section 4.1, page 95
The maintenance menu of the BIOS Setup program Section 4, page 95
BIOS recovery Section 3.7, page 89
The BIOS uses current configuration information and
3
passwords for booting.
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
The BIOS attempts to recover the BIOS configuration. A
recovery diskette is required.
73
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Intel Desktop Board D875PBZ Technical Product Specification
2.10 Mechanical Considerations
2.10.1 D875PBZ Form Factor
The Desktop Board D875PBZ is designed to fit into an ATX-form-factor chassis. In Figure 24,
dimensions are given in inches [millimeters]. The outer dimensions of the board are 11.52 inches
by 9.6 inches [292.61 millimeters by 243.84 millimeters]. Location of the I/O connectors and
mounting holes are in compliance with the ATX specification (see Section 1.4).
1.800
[45.72]
6.500
[165.10]
6.100
[154.94]
0.00
2.85
[72.39]
3.100
[78.74]
5.070
[128.78]
4.900
[124.46]
0.00
6.200
[157.48]
5.200
[132.08]
6.450
[163.83]
74
Figure 24. Board Dimensions
OM15886
Page 75
Technical Reference
2.10.2 I/O Shield
The back panel I/O shield for Desktop Board D875PBZ must meet specific dimension and material
requirements. Systems based on the Desktop Board D875PBZ need the back panel I/O shield to
pass certification testing. Figure 25 shows the critical dimensions of the I/O shield for boards
equipped with the optional audio subsystem. Figure 26 shows the critical dimensions of the I/O
shield for boards without the audio subsystem.
The figure indicates the position of each cutout and gives dimensions in inches to a tolerance of
±0.02 inches. Additional design considerations for I/O shields relative to chassis requirements are
described in the ATX specification. See Section 1.4 for information about the ATX specification.
NOTE
✏
The I/O shield drawings in this document are for reference only. An I/O shield compliant with the
ATX chassis specification 2.03 is available from Intel.
162.3 REF
[6.390]
1.6 ± 0.12
[0.063 ± 0.005]
1.55 REF
[0.061]
[0.884]
7.012
[0.276]
Ø 1.00
[0.039]
0.00
[0.00]
11.811
[0.465]
12.04
[0.474]
22.45
0.00
[0.00]
11.345
[0.447]
20. ± 0.254 TYP
[0.787 ± 0.10]
30.36
45.892
[1.807]
[1.195]
159.2 ± 0.12
[6.268 ± 0.005]
52.804
[2.079]
127.25
[5.010]
[5.732]
145.584
8x R 0.5 MIN
Ø 8.38
[0.330]
13.19
[0.519]
0.69
[0.027]
11.813
[0.465]
14.0
[0.567]
Figure 25. I/O Shield Dimensions for Boards with the Optional Audio Subsystem
75
Pictorial
View
OM16136
Page 76
Intel Desktop Board D875PBZ Technical Product Specification
162.3 REF
[6.390]
20. ± 0.254 TYP
1.55 REF
[0.061]
[0.787 ± 0.10]
159.2 ± 0.12
[6.268 ± 0.005]
1.6 ± 0.12
[0.063 ± 0.005]
7.012
[0.276]
0.00
[0.00]
12.04
[0.474]
22.45
[0.884]
Ø 1.00
[0.039]
11.811
[0.465]
0.00
[0.00]
11.345
[0.447]
30.36
[1.195]
45.892
[1.807]
52.804
[2.079]
127.25
[5.010]
Pictorial
View
8x R 0.5 MIN
14
[0.567]
76
Figure 26. I/O Shield Dimensions for Boards without the Audio Subsystem
OM16137
Page 77
Technical Reference
2.11 Electrical Considerations
2.11.1 DC Loading
Table 39 lists the DC loading characteristics of the board.
Table 39. DC Loading Characteristics
DC Current at:
Mode DC Power +3.3 V +5 V +12 V -12 V +5 VSB
Minimum loading 199.00 W 5.00 A 10.00 A 10.00 A 0.03 A 0.60 A
Maximum loading 284.00 W 10.00 A 14.00 A 13.30 A 0.10 A 1.40 A
2.11.2 Add-in Board Considerations
The Desktop Board D875PBZ is designed to provide 2 A (average) of +5 V current for each add-in
board. The total +5 V current draw for add-in boards for a fully loaded Desktop Board D875PBZ
(all five expansion slots and the AGP slot filled) must not exceed 12 A.
2.11.3 Fan Connector Current Capability
CAUTION
The processor fan must be connected to the processor fan connector, not to a chassis fan
connector. Connecting the processor fan to a chassis fan connector may result in onboard
component damage that will halt fan operation.
Table 40 lists the current capability of the fan connectors on the Desktop Board D875PBZ.
Table 40. Fan Connector Current Capability
Fan Connector Maximum Available Current
Processor fan 1000 mA
Front chassis fan 600 mA
Rear chassis fan 600 mA
Voltage regulator fan 1000 mA
77
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Intel Desktop Board D875PBZ Technical Product Specification
2.11.4 Power Supply Considerations
CAUTION
The +5 V standby line for the power supply must be capable of providing adequate +5 V standby
current. Failure to do so can damage the power supply. The total amount of standby current
required depends on the wake devices supported and manufacturing options.
System integrators should refer to the power usage values listed in Table 39 when selecting a
power supply for use with the Desktop Board D875PBZ.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the following recommendations found in the indicated
sections of the ATX form factor specification.
• The potential relation between 3.3 VDC and +5 VDC power rails (Section 4.2)
• The current capability of the +5 VSB line (Section 4.2.1.2)
• All timing parameters (Section 4.2.1.3)
• All voltage tolerances (Section 4.2.2)
For information about Refer to
The ATX form factor specification
Section 1.4, page 17
78
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Technical Reference
2.12 Thermal Considerations
CAUTION
The use of an Intel Pentium 4 processor operating above 2.80 GHz with this Intel desktop board
requires the following:
• A chassis with appropriate airflow to ensure proper cooling of the components on the board
• A processor fan heatsink that meets the thermal performance targets for Pentium 4 processors
operating above 2.80 GHz
Failure to ensure appropriate airflow may result in reduced performance of both the processor
and/or voltage regulator or, in some instances, damage to the desktop board. For a list of chassis
that have been tested with Intel desktop boards please refer to the following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design remains solely
with the reader. Intel makes no warranties or representations that merely following the
instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the Desktop Board D875PBZ’s maximum
operating temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating temperature, see the
environmental specifications in Section 2.14.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do
so may result in damage to the voltage regulator circuit. The processor voltage regulator area
(item A in Figure 27) can reach a temperature of up to 85 °C in an open chassis.
79
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Intel Desktop Board D875PBZ Technical Product Specification
Figure 27 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82875P MCH
D Intel 82801ER ICH5-R
Figure 27. Localized High Temperature Zones
Table 41 provides maximum case temperatures for components on the Desktop Board D875PBZ
that are sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the Desktop Board D875PBZ.
Table 41. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82875P MCH 99 oC (under bias)
Intel 82801ER ICH5-R 115 oC (under bias)
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.2, page 16
80
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Technical Reference
2.13 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF calculation for the Desktop
Board D875PBZ is 96,624 hours.
2.14 Environmental
Table 42 lists the environmental specifications for the Desktop Board D875PBZ.
Table 42. Desktop Board D875PBZ Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 °C to +70 °C
Operating 0 °C to +55 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
81
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Intel Desktop Board D875PBZ Technical Product Specification
2.15 Regulatory Compliance
This section describes the Desktop Boards’ compliance with U.S. and international safety and
electromagnetic compatibility (EMC) regulations.
2.15.1 Safety Regulations
Table 43 lists the safety regulations the Desktop Board D875PBZ complies with when correctly
installed in a compatible host system.
Table 43. Safety Regulations
Regulation Title
UL 60950 3rd ed.,2000/CSA
C22.2 No. 60950-00
EN 60950:2000 The Standard for Safety of Information Technology Equipment including
IEC 60950, 3rd Edition, 1999 The Standard for Safety of Information Technology Equipment including
Bi-National Standard for Safety of Information Technology Equipment
including Electrical Business Equipment. (USA and Canada)
Electrical Business Equipment. (European Union)
Electrical Business Equipment. (International)
2.15.2 EMC Regulations
Table 44 lists the EMC regulations the Desktop Board D875PBZ complies with when correctly
installed in a compatible host system.
Table 44. EMC Regulations
Regulation Title
FCC (Class B) Title 47 of the Code of Federal Regulations, Parts 2 and 15, Subpart B,
Radio Frequency Devices. (USA)
ICES-003 (Class B) Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 1998 (Class B) Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024: 1998 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
AS/NZS 3548 (Class B) Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22, 3rd Edition (Class B) Limits and methods of measurement of Radio Disturbance Characteristics
of Information Technology Equipment. (International)
CISPR 24: 1997 Information Technology Equipment – Immunity Characteristics – Limits
and Methods of Measurements. (International)
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Technical Reference
2.15.2.1 FCC Compliance Statement (USA)
Product Type: D875PBZ Desktop Board
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment to a different electrical branch circuit from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could
void the user’s authority to operate the equipment.
2.15.2.2 Canadian Compliance Statement
This Class B digital apparatus complies with Canadian ICES-003.
Cet appereil numérique de la classe B est conforme à la norme NMB-003 du Canada.
2.15.3 European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product: Intel
D875PBZ is in conformity with all applicable essential requirements necessary for CE marking,
following the provisions of the European Council Directive 89/336/EEC (EMC Directive) and
Council Directive 73/23/EEC (Safety/Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for distribution within all
member states of the EU with no restrictions.
This product follows the provisions of the European Directives 89/336/EEC and 73/23/EEC.
®
Desktop Board
2.15.4 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and
regulations.
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2.15.4.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on
the printed wiring board assembly.
2.15.4.2 Recycling Considerations
Intel encourages its customers to recycle its products and their components (e.g., batteries, circuit
boards, plastic enclosures, etc.) whenever possible. In the U.S., a list of recyclers in your area can
be found at:
http://www.eiae.org
In the absence of a viable recycling option, products and their components must be disposed of in
accordance with all applicable local environmental regulations.
2.15.5 Product Certification Markings (Board Level)
Table 45 lists the board’s product certification markings.
Table 45. Product Certification Markings
Description Marking
UL joint US/Canada Recognized Component mark. Includes adjacent
UL file number for Intel Desktop Boards: E210882 (component side).
FCC Declaration of Conformity logo mark for Class B equipment;
includes Intel name and D875PBZ model designation (component side).
CE mark. Declares compliance to European Union (EU) EMC directive
(89/336/EEC) and Low Voltage directive (73/23/EEC) (component side).
The CE mark should also be on the shipping container.
Australian Communications Authority (ACA) C-Tick mark. Includes
adjacent Intel supplier code number, N-232. The C-tick mark should
also be on the shipping container.
Printed wiring board manufacturer’s recognition mark: consists of a
unique UL recognized manufacturer’s logo, along with a flammability
rating (solder side).
94V-0
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3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction.................................................................................................................85
3.2 BIOS Flash Memory Organization ..............................................................................85
3.3 Resource Configuration..............................................................................................86
3.4 System Management BIOS (SMBIOS).......................................................................87
3.5 Legacy USB Support ..................................................................................................88
3.6 BIOS Updates ............................................................................................................88
3.7 Recovering BIOS Data ...............................................................................................89
3.8 Boot Options...............................................................................................................90
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot....................................................91
3.10 BIOS Security Features..............................................................................................93
3.1 Introduction
The Desktop Board uses an Intel/AMI BIOS that is stored in the Firmware Hub (FWH) and can be
updated using a disk-based program. The FWH contains the BIOS Setup program, POST, the PCI
auto-configuration utility, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision code. The
initial production BIOS is identified as BZ87510A.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer is poweredup, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the
two match.
For information about Refer to
The Desktop Board’s compliance level with Plug and Play Section 1.4, page 17
3.2 BIOS Flash Memory Organization
The Firmware Hub (FWH) includes an 8 Mbit (1024 KB) symmetrical flash memory device.
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3.3 Resource Configuration
3.3.1 PCI Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards.
Autoconfiguration lets a user insert or remove PCI cards without having to configure the system.
When a user turns on the system after adding a PCI card, the BIOS automatically configures
interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are
considered to be available for use by the add-in card.
For information about Refer to
The versions of PCI and Plug and Play supported by the BIOS Section 1.4, page 17
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two
PCI IDE connectors with independent I/O channel support. The IDE interface supports hard drives
up to ATA-66/100 and recognizes any ATAPI compliant devices, including CD-ROM drives, tape
drives, and Ultra DMA drives (see Section 1.4 for the supported version of ATAPI). The BIOS
determines the capabilities of each drive and configures them to optimize capacity and
performance. To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4, depending
on the capability of the drive. You can override the auto-configuration options by specifying
manual configuration in the BIOS Setup program.
To use ATA-66/100 features the following items are required:
• An ATA-66/100 peripheral device
• An ATA-66/100 compatible cable
• ATA-66/100 operating system device drivers
NOTE
✏
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master device. For
example, do not connect an ATA hard drive as a slave to an ATAPI CD-ROM drive.
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3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in
a managed network.
The main component of SMBIOS is the Management Information Format (MIF) database, which
contains information about the computing system and its components. Using SMBIOS, a system
administrator can obtain the system types, capabilities, operational status, and installation dates for
system components. The MIF database defines the data and provides the method for accessing this
information. The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and logging
Non-Plug and Play operating systems, such as Windows NT*, require an additional interface for
obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such
operating systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information.
For information about Refer to
The compliance level of the Desktop Board D875PBZ with SMBIOS Section 1.4, page 17
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3.5 Legacy USB Support
Legacy USB support enables USB devices such as keyboards, mice, and hubs to be used even
when the operating system’s USB drivers are not yet available. Legacy USB support is used to
access the BIOS Setup program, and to install an operating system that supports USB. By default,
Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and
configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB keyboards and mice
are recognized and may be used to configure the operating system. (Keyboards and mice are
not recognized during this period if Legacy USB support was set to Disabled in the BIOS
Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are
recognized by the operating system, and Legacy USB support from the BIOS is no
longer used.
To install an operating system that supports USB, verify that Legacy USB support in the BIOS
Setup program is set to Enabled and follow the operating system’s installation instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on the Intel
World Wide Web site:
®
• Intel
• Intel
Both utilities support the following BIOS maintenance functions:
• Verifying that the updated BIOS matches the target system to prevent accidentally installing
• Updating both the BIOS boot block and the main BIOS. This process is fault tolerant to
• Updating the BIOS boot block separately.
• Changing the language section of the BIOS.
• Updating replaceable BIOS modules, such as the video BIOS module.
• Inserting a custom splash screen.
Express BIOS Update utility, which enables automated updating while in the Windows
environment. Using this utility, the BIOS can be updated from a file on a hard disk, a 1.44 MB
diskette, or a CD-ROM, or from the file location on the Web.
®
Flash Memory Update Utility, which requires creation of a boot diskette and manual
rebooting of the system. Using this utility, the BIOS can be updated from a file on a 1.44 MB
diskette (from a legacy diskette drive or an LS-120 diskette drive) or a CD-ROM.
an incompatible BIOS.
prevent boot block corruption.
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NOTE
✏
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
For information about Refer to
The Intel World Wide Web site Section 1.2, page 16
3.6.1 Language Support
The BIOS Setup program and help messages are supported in six languages: US English, German,
Italian, French, Spanish, and Japanese. Only two languages (US English and another language)
can be loaded on the board at one time.
The default language for the BIOS Setup program and help messages is US English. Another
language can be selected by using the program’s Main menu (page 97).
3.6.2 Custom Splash Screen
During POST, an Intel® splash screen is displayed by default. This splash screen can be
augmented with a custom splash screen. A utility is available from Intel to assist with creating a
custom splash screen. The custom splash screen can be programmed into the flash memory using
the BIOS upgrade utility. Information about this capability is available on the Intel Support World
Wide Web site.
NOTE
✏
If you add a custom splash screen, it will share space with the Intel branded logo.
For information about Refer to
The Intel World Wide Web site Section 1.2, page 16
3.7 Recovering BIOS Data
Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage
occurs while the BIOS is being updated in flash memory. The BIOS can be recovered from a
1.44 MB diskette or CD-ROM using the BIOS recovery mode. When recovering the BIOS, be
aware of the following:
• Because of the small amount of code available in the non-erasable boot block area, there is no
video support. You can only monitor this procedure by listening to the speaker or looking at
the diskette drive LED.
• The recovery process may take several minutes; larger BIOS flash memory devices require
more time.
• Two beeps and the end of activity in the diskette drive indicate successful BIOS recovery.
• A series of continuous beeps indicates a failed BIOS recovery.
To create a BIOS recovery diskette, a bootable diskette must be created and the BIOS update files
copied to it. BIOS upgrades and the Intel Flash Memory Update Utility are available from Intel
Customer Support through the Intel World Wide Web site.
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NOTE
✏
Even if the computer is configured to boot from an LS-120 diskette (in the Setup program’s
Removable Devices submenu), the BIOS recovery diskette must be a standard 1.44 MB diskette not
a 120 MB diskette.
For information about Refer to
The BIOS recovery mode jumper settings Section 2.9.1, page 72
The Boot menu in the BIOS Setup program Section 4.3, page 97
Contacting Intel customer support Section 1.2, page 16
3.8 Boot Options
In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drives,
CD-ROM, or the network. The default setting is for the diskette drive to be the first boot device,
the hard drive second, and the ATAPI CD-ROM third. The fourth device is disabled.
3.8.1 CD-ROM Boot
Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM format
specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-ROM is listed as a
boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD
in the CD-ROM drive, the system will attempt to boot from the next defined drive.
For information about Refer to
The El Torito specification Section 1.4, page 17
3.8.2 Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard
LAN or from a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key
during POST, the User Access Level in the BIOS Setup program’s Security menu must be
set to Full.
For information about Refer to
The BIOS Setup program’s Security menu Table 66, page 116
3.8.3 Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the
operating system loader is invoked even if the following devices are not present:
• Video adapter
• Keyboard
• Mouse
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3.8.4 Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. To use this key
during POST, the User Access Level in the BIOS Setup program’s Security menu must be
set to Full.
For information about Refer to
The BIOS Setup program’s Security menu Table 66, page 116
The menu displayed after pressing the <F10> key lists the available boot devices (as set in the
BIOS Setup program’s Boot Device Priority submenu). Table 46 lists the boot device menu
options.
Table 46. Boot Device Menu Options
Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without making changes
3.9 Fast Booting Systems with Intel® Rapid BIOS Boot
These factors affect system boot speed:
• Selecting and configuring peripherals properly
®
• Using an optimized BIOS, such as the Intel
3.9.1 Peripheral Selection and Configuration
The following techniques help improve system boot speed:
• Choose a hard drive with parameters such as “power-up to data ready” less than eight seconds,
that minimize hard drive startup delays.
• Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode
changes in POST. These features may add time to the boot process.
• Try different monitors. Some monitors initialize and communicate with the BIOS more
quickly, which enables the system to boot more quickly.
Rapid BIOS
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3.9.2 Intel Rapid BIOS Boot
Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot menu:
• Set the hard disk drive as the first boot device. As a result, the POST does not first seek a
diskette drive, which saves about one second from the POST execution time.
• Disable Quiet Boot, which eliminates display of the logo splash screen. This could save
several seconds of painting complex graphic images and changing video modes.
• Enable Intel Rapid BIOS Boot. This feature bypasses memory count and the search for a
diskette drive.
In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can
reduce up to four seconds of option ROM boot time.
NOTE
✏
It is possible to optimize the boot process to the point where the system boots so quickly that the
Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives
with minimum initialization times can also contribute to a boot time that might be so fast that
necessary logo screens and POST messages cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If this condition
should occur, it is possible to introduce a programmable delay ranging from three to 30 seconds
(using the Hard Disk Pre-Delay feature of the Advanced menu in the Drive Configuration
Submenu of the BIOS Setup program).
For information about Refer to
Drive Configuration Submenu in the BIOS Setup program Section 4.4.4, page 103
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3.10 BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can
boot the computer. A supervisor password and a user password can be set for the BIOS Setup
program and for booting the computer, with the following restrictions:
• The supervisor password gives unrestricted access to view and change all the Setup options in
the BIOS Setup program. This is the supervisor mode.
• The user password gives access to view and change Setup options in the BIOS Setup program
based on the setting of the User Access Level option in the BIOS Setup program’s Security
menu. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the BIOS Setup program’s
password prompt allows the user access to Setup based on the setting of the User Access Level
option in the BIOS Setup program’s Security menu.
• If both the supervisor and user passwords are set, users can enter either the supervisor
password or the user password to access Setup. Users have access to Setup respective to
which password is entered.
• Setting the user password restricts who can boot the computer. The password prompt will be
displayed before the computer is booted. If only the supervisor password is set, the computer
boots without asking for a password. If both passwords are set, the user can enter either
password to boot the computer.
Table 47 shows the effects of setting the supervisor password and user password. This table is for
reference only and is not displayed on the screen.
Table 47. Supervisor and User Password Functions
Password Set
Neither Can change all
Supervisor
only
User only N/A Can change all
Supervisor
and user set
Note: If no password is set, any user can change all Setup options.
For information about Refer to
Setting user and supervisor passwords Section 4.5, page 116
NOTES
✏
Supervisor
Mode
options
Can change all
options
Can change all
options
(Note)
User Mode Setup Options
Can change all
options
Can change a
limited number
of options
options
Can change a
limited number
of options
(Note)
None None None
Supervisor Password Supervisor None
Enter Password
Clear User Password
Supervisor Password
Enter Password
Password to
Enter Setup
User User
Supervisor or
user
• For enhanced security, use different passwords for the supervisor and user passwords.
Password
During Boot
Supervisor or
user
• Valid password characters are A-Z, a-z, and 0-9.
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4 BIOS Setup Program
What This Chapter Contains
4.1 Introduction.................................................................................................................95
4.2 Maintenance Menu.....................................................................................................96
4.3 Main Menu..................................................................................................................97
4.4 Advanced Menu..........................................................................................................98
4.5 Security Menu ..........................................................................................................116
4.6 Power Menu .............................................................................................................117
4.7 Boot Menu................................................................................................................118
4.8 Exit Menu .................................................................................................................121
4.1 Introduction
The BIOS Setup program can be used to view and change the BIOS settings for the computer. The
BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST)
memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
Table 48 lists the BIOS Setup program menu features.
Table 48. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Selects boot
options
✏
Clears
passwords and
displays
processor
information
NOTE
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
In this chapter, all examples of the BIOS Setup program menu bar include the maintenance menu;
however, the maintenance menu is displayed only when the Desktop Board is in configure mode.
Section 2.9.2 on page 73 tells how to put the Desktop Board in configure mode.
Saves or
discards
changes to
Setup
program
options
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Table 49 lists the function keys available for menu screens.
Table 49. BIOS Setup Program Function Keys
BIOS Setup Program Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects a field
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
4.2 Maintenance Menu
To access this menu, select Maintenance on the menu bar at the top of the screen.
Maintenance
The menu shown in Table 50 is for clearing Setup passwords and displaying processor
information. Setup only displays this menu in configure mode. See Section 2.9.2 on page 73 for
configure mode setting information.
Main Advanced Security Power Boot Exit
Table 50. Maintenance Menu
Feature Options Description
Clear All Passwords • Ok (default)
• Cancel
CPU Stepping
Signature
CPU Microcode
Update Revision
No options Displays CPU’s Stepping Signature.
No options Displays CPU’s Microcode Update Revision.
Clears the user and supervisor passwords.
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BIOS Setup Program
4.3 Main Menu
To access this menu, select Main on the menu bar at the top of the screen.
Maintenance
Main
Table 51 describes the Main menu. This menu reports processor and memory information and is
for configuring the system date and system time.
Table 51. Main Menu
Feature Options Description
BIOS Version No options Displays the version of the BIOS.
Processor Type No options Displays processor type.
Hyper-Threading
Technology
Processor Speed No options Displays processor speed.
System Bus Speed No options Displays the system bus speed.
System Memory Speed No options Displays the system memory speed.
Cache RAM No options Displays the size of second-level cache.
Total Memory No options Displays the total amount of RAM.
Memory Mode No options Displays the memory mode (Dual Channel or Single
Memory Channel A Slot 0
Memory Channel A Slot 1
Memory Channel B Slot 0
Memory Channel B Slot 1
Language • English
System Time Hour, minute, and
System Date Day of week
Advanced Security Power Boot Exit
Disabled
Enabled (default)
No options Displays the amount and type of RAM in the DIMM
(default)
• (other language
loaded on the
board)
second
Month/day/year
Disables/enables Hyper-Threading Technology. This
option is present only when a processor that supports
Hyper-Threading Technology is installed.
Channel).
sockets.
Selects the current default language used by the BIOS.
Specifies the current time.
Specifies the current date.
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4.4 Advanced Menu
To access this menu, select Advanced on the menu bar at the top of the screen.
Maintenance Main
Advanced
PCI Configuration
Boot Configuration
Peripheral Configuration
Drive Configuration
Floppy Configuration
Event Log Configuration
Video Configuration
USB Configuration
Chipset Configuration
Fan Control Configuration
Hardware Monitoring
Table 52 describes the Advanced Menu. This menu is used for setting advanced features that are
available through the chipset.
Security Power Boot Exit
Table 52. Advanced Menu
Feature Options Description
PCI Configuration Select to display
submenu
Boot Configuration Select to display
submenu
Peripheral Configuration Select to display
submenu
Drive Configuration Select to display
submenu
Floppy Configuration Select to display
submenu
Event Log Configuration Select to display
submenu
Video Configuration Select to display
submenu
USB Configuration Select to display
submenu
Chipset Configuration Select to display
submenu
Fan Control Configuration Select to display
submenu
Hardware Monitoring Select to display
submenu
Configures individual PCI slot’s IRQ priority.
Configures Plug and Play and the Numlock key, and resets
configuration data.
Configures peripheral ports and devices.
Specifies type of connected IDE devices.
Configures the diskette drive.
Configures Event Logging.
Configures video features.
Configures USB support.
Configures advanced chipset features.
Configures fan operation.
Monitors system temperatures, voltages, and fan speeds.
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4.4.1 PCI Configuration Submenu
To access this submenu, select Advanced on the menu bar and then PCI Configuration.
Maintenance Main
Advanced
PCI Configuration
Boot Configuration
Peripheral Configuration
Drive Configuration
Floppy Configuration
Event Log Configuration
Video Configuration
USB Configuration
Chipset Configuration
Fan Control Configuration
Hardware Monitoring
The submenu shown in Table 53 is used to configure the IRQ priority of PCI slots individually.
Security Power Boot Exit
Table 53. PCI Configuration Submenu
Feature Options Description
PCI Slot1 IRQ Priority
(Note)
PCI Slot2 IRQ Priority
(Note)
PCI Slot3 IRQ Priority
(Note)
PCI Slot4 IRQ Priority
(Note)
• Auto (default)
• 3
• 5
• 9
• 10
• 11
• Auto (default)
• 3
• 5
• 9
• 10
• 11
• Auto (default)
• 3
• 5
• 9
• 10
• 11
• Auto (default)
• 3
• 5
• 9
• 10
• 11
Allows selection of IRQ priority for PCI bus connector 1.
Allows selection of IRQ priority for PCI bus connector 2.
Allows selection of IRQ priority for PCI bus connector 3.
Allows selection of IRQ priority for PCI bus connector 4.
continued
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Table 53. PCI Configuration Submenu (continued)
Feature Options Description
PCI Slot5 IRQ Priority
(Note)
Note: Additional interrupts may be available if certain onboard devices (such as the serial and parallel ports) are disabled.
• Auto (default)
• 3
• 5
• 9
• 10
• 11
Allows selection of IRQ priority for PCI bus connector 5.
4.4.2 Boot Configuration Submenu
To access this submenu, select Advanced on the menu bar and then Boot Configuration.
Maintenance Main
Advanced
PCI Configuration
Boot Configuration
Peripheral Configuration
Drive Configuration
Floppy Configuration
Event Log Configuration
Video Configuration
USB Configuration
Chipset Configuration
Fan Control Configuration
Hardware Monitoring
The submenu represented by Table 54 is for setting Plug and Play options and the power-on state
of the Numlock key.
Security Power Boot Exit
Table 54. Boot Configuration Submenu
Feature Options Description
Plug & Play O/S • No (default)
Numlock • Off
100
• Yes
• On (default)
Specifies if manual configuration is desired.
No lets the BIOS configure all devices. This setting is
appropriate when using a Plug and Play operating system.
Yes lets the operating system configure Plug and Play
devices not required to boot the system. This option is
available for use during lab testing.
Specifies the power-on state of the Numlock feature on the
numeric keypad of the keyboard.
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