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2
C is a two-wire communication bus /protocol developed by Phillips. SMBus is a subset of the I2C bus/protocol developed by Intel.
I
Implementation of the I
Electronics, N.V. and North American Phillips Corporation.
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor
(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary
depending on hardware and software configur ations and may re quire a BIOS update. S oftware applicatio ns may not be compatible
2
C bus/protocol or the SMBus bus/protocol may require licenses from various entities, including Phillips
Itanium® Processor 9300 Series Package Drawing (Sheet 1 of 4)................. 121
®
Itanium® Processor 9300 Series Processor Package Drawing (Sheet 2 of 4)... 122
®
Itanium® Processor 9300 Series Package Drawing (Sheet 3 of 4)................. 123
®
Itanium® Processor 9300 Series Package Drawing (Sheet 4 of 4)................. 124
®
Itanium® Processor 9500 Series Package Drawing (Sheet 1 of 4)................ 125
®
Itanium® Processor 9500 Series Package Drawing (Sheet 2 of 4)................. 126
®
Itanium® Processor 9500 Series Package Drawing (Sheet 3 of 4)................. 127
®
Itanium® Processor 9500 Series Package Drawing (Sheet 4 of 4)................. 128
®
Itanium® Processor 9300 Series and
®
Itanium® Processor 9500 Series’ Thermal States ....................................... 134
Intel
®
Itanium® Processor 9300 Series and
®
Itanium® Processor 9500 Series Package Thermocouple Location................. 140
Intel
Intel® Itanium® Processor 9500 Series Package................................................. 151
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet 5
Tables
1-1Intel® Itanium® Processor 9300 Series and
Intel® Itanium® Processor 9500 Series Feature Comparison....................................19
2-1Signals with RTT................................................................................................24
2-2Signal Groups ...................................................................................................24
2-3Intel
2-4Intel® Itanium® Processor 9300 Series Clock Frequency Table.................................29
2-5Intel
2-6Intel
2-7Intel
2-8Intel
2-9Intel
2-10 Intel
2-11 Intel
2-12 PLL Specification for TX and RX ...........................................................................38
2-13 Intel
2-14 Intel
2-15 FMB Voltage Specifications for the Intel
2-16 FMB 130W Current Specifications for the Intel
2-17 FMB 155W/185W Current Specifications for the
2-18 FMB Voltage Specifications for the Intel
2-19 FMB 170W and 130W Current Specifications for the
2-20 VCCUNCORE Static and Transient Tolerance for
2-21 VCCCORE Static and Transient Tolerance for
2-22 VCCCACHE Static and Transient Tolerance for
2-23 VCCUNCORE Static and Transient Tolerance for the
2-24 VCCCORE Static and Transient Tolerance for the
2-25 Overshoot and Undershoot Specifications For Differential
2-26 Overshoot and Undershoot Specifications For Differential
2-27 Voltage Regulator Signal Group DC Specifications ..................................................53
2-28 Voltage Regulator Control Group DC Specification ..................................................54
2-29 TAP and System Management Group DC Specifications...........................................54
2-30 Error, FLASHROM, Power-Up, Setup, and Thermal Group DC Specifications................54
2-31 VID_VCCCORE[6:0], VID_VCCUNCORE[6:0] and VID_VCCCACHE[5:0] DC
2-32 SVID Group DC Specifications for the Intel
®
QuickPath Interconnect/Intel® Scalable Memory
‘Interconnect Reference Clock Specifications26
®
Itanium® Processor 9300 Series Transmitter Parameter Values for Intel®
QuickPath Interconnect and Intel SMI Channels @ 4.8 GT/s ....................................29
®
Itanium® Processor 9300 Series Receiver Parameter
Values for Intel® QuickPath Interconnect and Intel® SMI Channels @ 4.8 GT.. ........... 30
®
Itanium® Processor 9500 Series Clock Frequency Table.................................33
®
Itanium® Processor 9500 Series Link Speed Independent Specifications ..........33
®
Itanium® Processor 9500 Series Transmitter and
Receiver Parameter Values for Intel
®
Itanium® Processor 9500 Series Transmitter and
®
QPI Channel at 4.8 GT/s.................................34
Receiver Parameter Values for Intel® QPI at 6.4 GT/s.............................................35
®
Itanium® Processor 9500 Series Transmitter and
Receiver Parameter Values for Intel® SMI at 6.4 GT/s and lower..............................37
®
Itanium® Processor 9300 Series Absolute Maximum Ratings..........................39
®
Itanium® Processor 9500 Series Processor Absolute Maximum Ratings............39
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet 7
Revision History
Document
Number
322821-002• Initial release of the 9300/9500 document.November 2012
322821-001• Initial release of the document.February 2010
Revision
Number
DescriptionDate
§
8Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
1Introduction
1.1Overview
The Intel® Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500 Series
employ Explicitly Parallel Instruction Computing (EPIC) design concepts for a tighter
coupling between hardware and software. In this design style, the interface between
hardware and software is designed to enable the software to exploit all available
compile-time information, and efficiently deliver this information to the hardware. It
addresses several fundamental performance bottlenecks in modern computers, such as
memory latency, memory address disambiguation, and control flow dependencies. The
EPIC constructs provide powerful architectural semantics, and enable the software to
make global optimizations across a large scheduling scope, thereby exposing available
Instruction Level Parallelism (ILP) to the hardware. The hardware takes advantage of
this enhanced ILP, and provides abundant execution resources. Additionally, it focuses
on dynamic run-time optimizations to enable the compiled code schedule to flow at
high throughput. This strategy increases the synergy between hardware and software,
and leads to greater overall performance.
®
The Intel
system interface, with its 4 full width and 2 half width Intel® QuickPath Interconnects,
enables each processor to directly connect to other system components, thus can be
used as an effective building block for very large systems. The balanced core and
memory subsystem provide high performance for a wide range of applications ranging
from commercial workloads to high performance technical computing.
The Intel
are pin compatible and support a range of computing needs and configurations from a
2-way to large SMP servers (although OEM field upgrade methodologies vary). This
document provides the electrical, mechanical and thermal specifications that must be
met when using the Intel
Processor 9500 Series in your systems.
Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500 Series
®
Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500 Series
®
Itanium® Processor 9300 Series and Intel® Itanium®
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet9
Introduction
10Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
Intel® Itanium® Processor 9300 SeriesIntel® Itanium® Processor 9300 Series
Itanium® Processor Dual-Core 1.60 GHz Fixed Frequency with 10 MB L3 Cache 9310
Product Features
Quad Core
— Four complete 64-bit processing cores on one
processor.
— Includes Dynamic Domain Partitioning.
Advanced EPIC (Explicitly Parallel Instruction
Computing) Architecture for current and future
requirements of high-end enterprise and technical
workloads.
— Provide a variety of advanced implementations of
parallelism, predication, and speculation,
resulting in superior Instruction-Level Parallelism
(ILP).
®
Intel
Hyper-Threading Technology
— Two times the number of OS threads per core.
Wide, parallel hardware based on Intel
®
Itanium®
architecture for high performance:
— Integrated on-die L3 cache of up to 24 MB; cache
hints for L1, L2, and L3 caches for reduced
memory latency.
— 128 general and 128 floating-point registers
supporting register rotation.
— Register stack engine for effective management
of processor resources.
— Support for predication and speculation.
Extensive RAS features for business-critical
applications, for example:
— Machine check architecture with extensive ECC
and parity protection.
— On-chip thermal management.
— Built-in processor information ROM (PIROM).
— Built-in programmable EEPROM.
—Hot-Plug Socket
— Hot-add and hot removal.
— Double Device Data Correction (DDDC) for x4
DRAMs, plus correction of a single bit error.
— Single Device Data Correction (SDDC) for x8
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet11
Introduction
The Intel® Itanium® Processor 9300 Series delivers new levels of flexibility, reliability,
performance, and cost-effective scalability for your most data-intensive business and
technical applications. It provides 24 megabytes L3 cache accessed at core speed,
Hyper-Threading Technology for increased performance, Intel
Technology for improved virtualization, Intel
®
Cache Safe Technology for increased
®
Virtualization
availability.
®
The Intel
Itanium® Processor 9300 Series consists of up to 4 core processors and a
system interface unit. Each processor core provides a 6-wide, 8-stage deep execution
pipeline. The resources consist of six integer units, six multimedia units, two load and
two store units, three branch units and two floating-point units each capable of
extended, double and single precision arithmetic. The hardware employs dynamic
prefetch, branch prediction, a register scoreboard, and non-blocking caches to optimize
for compile-time non-determinism. Each core provides duplication of all architectural
state to support hardware multithreading, thus enabling greater throughput. Three
levels of on-die cache minimize overall memory latency. It interfaces with the Ararat
“1” Voltage Regulator Module, which used exclusively with the Intel
®
Itanium®
Processor 9300 Series.
12Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Computing) Architecture for current and future
requirements of high-end enterprise and technical
workloads.
— Provide a variety of advanced implementations of
parallelism, predication, and speculation,
resulting in superior Instruction-Level Parallelism
(ILP).
®
Intel
Wide, parallel hardware based on Intel
Hyper-Threading Technology
— Dual Domain Multithreading with independent
front end and back end thread domains providing
hardware support for 2 threads per core.
— Support for Intel
Instructions.
architecture for high performance:
— Integrated on-die LLC cache of up to 32MB;
cache hints for FLC, MLC, and LLC caches for
®
Itanium® Processor New-
®
Itanium®
reduced memory latency.
— 160 general and 128 floating-point registers
supporting register rotation.
— Register stack engine for effective management
of processor resources.
— Support for predication and speculation.
Extensive RAS features for business-critical
applications, for example:
— Machine check architecture with extensive ECC
and parity protection with firmware first error
handling.
— End-to-end error detection.
— On-chip thermal management and power
management.
— Built-in processor information ROM (PIROM).
— Built-in programmable EEPROM.
—Hot Plug Socket.
— Hot-add and hot removal support.
— Double Device Data Correction (DDDC) for x4
DRAMs, plus correction support of a single bit
error.
— Single Device Data Correction (SDDC) for x8 and
x4 DRAMs, plus correction of a single bit error.
—Intel
—Intel
—Intel
®
QuickPath Interconnect Dynamic Link
Width Reduction.
®
QuickPath Interconnect Clock Fail-Safe
Feature.
®
QuickPath Interconnect Hot-Add and
Removal.
— Memory DIMM and Rank Sparing, Memory
Scrubbing, Memory Mirroring, and Memory
Migration.
—Intel
®
Turbo Boost Technology, featuring
sustained boost.
— Architected firmware stack, including PAL and
SAL support.
— Directory-based and source-based coherency
protocol.
— Intel QPI poisoning, viral containment and
cleanup.
Two On-die Memory Controllers
— Each memory controller supports two Intel
Scalable Memory Interconnects that operate in
lockstep.
®
— Support for one Scalable Memory Buffer per Intel
Scalable Memory Interconnect; four Scalable
Memory Buffers per processor.
— High memory bandwidth, thus improved
performance.
— 4.8 GT/s for the Intel
Buffer.
— 6.4 GT/s for the Intel
Buffer.
Intel
Intel
®
Instruction Replay Technology to replay core
pipeline for pipeline management and core RAS.
®
Virtualization Technology (Intel® VT) for
Intel® 64 or Itanium ®architecture (Intel ® Vt-i) 3 Virtualization Support Extensions for Intel
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet13
Introduction
The Intel® Itanium® Processor 9500 Series delivers increased levels of flexibility,
reliability, performance, and cost-effective scalability for your most data-intensive
business and technical applications.
®
The Intel
cache, Hyper-Threading Technology for increased performance, Intel
Itanium® Processor 9500 Series processor provides up to 32 megabytes LLC
®
Virtualization
Technology for improved virtualization, Intel® Cache Safe Technology for increased
availability. Intel® Turbo Boost Technology, featuring sustained boost. The Intel®
Itanium
®
Processor 9500 Series employs advanced power monitoring and control to
deliver a higher processor frequency at all times, for maximum performance on all
workloads. The result is a higher thermal envelope utilization for more overall
performance. The Intel
®
Itanium® Processor 9500 Series offers large cache arrays
covered by ECC including the large LLC utilizing double correct/triple detect (DECTED)
and protecting the MLI/MLD with in-line single correct/double detect (SECDED). In
addition, the processor provides extensive parity protection and parity interleaving on
nearly all RFs, end-to-end parity protection with recovery-support on all critical internal
buses and data paths including the ring. Residue protection on Floating Point unit,
along with the adoption of radiation-hardened (RAD) sequential latching elements for
vulnerable architectural and state. The Intel
®
Itanium® Processor 9500 Series
processor interfaces exclusively with the Ararat II Voltage Regulator Module.
®
The Intel
Itanium® Processor 9500 Series consists of up to 8 core processors and a
system interface unit. Each processor core provides a 12-wide, 11-stage deep
execution pipeline. The resources consist of six integer units, one integer multiply unit,
four multimedia units, two load/store units, three branch units and two floating-point
units each capable of extended, double and single precision arithmetic. The hardware
employs dynamic prefetch, branch prediction, a register scoreboard, and non-blocking
caches to optimize for compile-time non-determinism. 32 additional stacked general
registers are provided over the Intel
®
Itanium® Processor 9300 Series, and hardware
support is provided for denormal, unnormal, and pseudo-normal operands for floating
point software assist offloading.
®
New instructions on the Intel
Itanium® Processor 9500 Series simplify common tasks.
They include: clz (count leading zeros), mpy4 and mpyshl4(unsigned integer multiply/
shift and multiply), mov-to-DAHR/mv-from-DAHR (for improved MLD/FLD prefetcher
hinting and performance), and hint@priority (used by the processor to temporarily
allocate more resources to a thread). Advanced Explicitly Parallel Instruction
Computing (EPIC) is enhanced on the Intel
®
Itanium® Processor 9500 Series by
increasing the capacity of retiring instructions per cycle from 6 to a maximum of 12
instructions per cycle per core.
®
Hyper-threading Technology is enhanced in the Intel® Itanium® Processor 9500
Intel
Series with dual domain multithreading, which enables independent front-end and
back-end pipeline execution to improve multi-thread efficiency and performance for
both new and legacy applications. It provides hardware support for two threads per
core, with a threaded 96 entry per thread Instruction Buffer and threaded MLDTLB and
FLDTLB, and a dedicated load return path from the MLD to the integer register file.
Three levels of on-die cache minimize overall memory latency, with 16 KB instruction
cache FLI/16 KB write-through data cache FLD that comprise the FLC and 512 KB MLI/
256 KB writeback data cache MLD that comprise the MLC.
®
The Intel
Itanium® Processor 9500 Series offers a new RAS feature: Intel®
Instruction Replay Technology. Pipeline replay resolves stall conditions that occur when
the microprocessor pipeline encounters a resource hazard that prevents immediate
execution. In a replay , the instruction that encountered the resource hazard is removed
from the pipeline, along with all the instructions that come after it. The instruction is
then read again out of the instruction buffer for replay and re-executed. To ensure a
14Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
replay can be initiated for any instruction in the pipeline that encounters a resource
hazard, a copy of each instruction is maintained in the instruction buffer until the
instruction has successfully traversed the pipeline and is no longer needed. If
necessary, an instruction can replay multiple times. As a result, Intel
®
Instruction
Replay Technology automatically detects and many corrects soft errors in the
instruction pipeline. With this technology, soft errors can be identified and corrected in
as few as seven clock cycles, which is fast enough to be invisible to the software
running on the platform.
1.2Architectural Overview
The sections below give an overview of the Intel® Itanium® Processor 9300 Series and
Intel® Itanium® Processor 9500 Series.
1.2.1Intel® Itanium® Processor 9300 Series Overview
The Intel® Itanium® Processor 9300 Series processor is a quad-core architecture. It
supports up to four processor cores, each with its own L3, L2, and L1 level cache. Also
supported are the following page sizes for purges or inserts: 4K, 8K, 16K, 64K, 256K,
1M, 4M, 16M, 64M, 256M, 1G, 4G.
The architecture interfacing the cores to the system is referred to as the System
Interface. Each processor core has it own Caching Agent (CPE). The CPE interfaces
between the processor core and the Intel QuickPath Interconnect. The Intel
Processor 9300 Series processor has two Home Agents (Bbox). The Bbox interfaces
between the memory controller and the Intel
directory cache. Each Bbox interfaces with a memory controllers (Zbox). Each memory
controller supports two Intel SMI in lockstep. The Intel SMI are the interconnects to
®
7500 Scalable Memory Buffer. The processor supports six Intel QuickPath
Intel
Interconnects at the socket, four full width and two half width. The Caching Agent,
Home Agent, and Intel QuickPath Interconnects are connected via a 12-port Crossbar
Router, each port supporting the Intel QuickPath Interconnect protocol. Figure 1-1
shows the Intel
®
Itanium® Processor 9300 Series block diagram.
®
QuickPath Interconnect and supports a
®
Itanium®
The Intel QPI viral and poison fields are used to flag corrupted system state and bad
data accordingly. Once it has “gone viral”, an Intel QPI agent will set the viral field
within all packet headers. Viral mode is entered in three ways: receiving a viral packet,
upon a detecting fatal/panic error, or when a global viral signal (from Cboxes) is
asserted. Viral is cleared on Reset. Poisoning is used to indicate bad data on a per-flit
basis. Poison does not indicate corrupted system coherency, but rather that a particular
block of data is not reliable.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet15
Introduction
Core0Core3Core2Core1
CPE0CPE3CPE2CPE1
RboxBbox0Zbox0Zbox1Bbox1
Pbox
PZ1
Pbo x
PR1
Pbo x
PR 0
Pbo x
PH4
Pbo x
PH5
Pbo x
PR 3
Pbo x
PR 2
Intel® SM I
Intel® SM I
Intel®
QPI
Intel®
QPI
Intel®
QPI
Intel®
QPI
Intel®
QPI
Intel®
QPI
Pbox
PZ0
Intel® SM I
Intel® SM I
0xA0
873
16 9 5240xB
Figure 1-1. Intel
®
Itanium® Processor 9300 Series Processor Block Diagram
1.2.2Intel® Itanium® Processor 9500 Series Overview
The Intel® Itanium® Processor 9500 Series is an eight core architecture. It supports up
to eight cores, each with its own First Level Cache (FLC) and Mid Level Cache (MLC),
both of which are split into instruction and data caches (FLI/FLD and MLI/MLD,
respectively). The Last Level Cache (LLC) is shared among the cores and supports up to
32 MB. Also supported are the following page sizes for purges or inserts: 4K, 8K, 16K,
64K, 256K, 1M, 4M, 16M, 64M, 256M, 1G, 4G.
The architecture interfacing the cores to the system is referred to as the uncore. Each
®
Itanium® Processor 9500 Series core interfaces to the Ring. The Ring provides
Intel
connectivity to the Last Level Cache via the Cache Controllers (Cboxes). The Ring also
provides connectivity to Intel QPI via Ring/Sbox. The Sbox and Cbox provide the
supports for the two Intel QPI Caching Agents. The processor has two Home Agents
(Bbox). The Bbox interfaces between the memory controller and the Intel
Interconnect and supports a directory cache. Each memory controller supports two
®
Scalable Memory Interconnects (Intel® SMI) in lockstep. The Intel SMI are the
Intel
interconnects to Scalable Memory Buffer. The Intel
processor supports six Intel® QuickPath Interconnects at the socket, four full width and
two half width. The Caching Agent, Home Agent, and Intel
are connected via a 10-port Crossbar Router, each port supporting the Intel
Interconnect protocol. Figure 1-2 shows the processor block diagram.
®
QuickPath
®
Itanium® Processor 9500 Series
®
QuickPath Interconnects
®
QuickPath
16Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
Figure 1-2. Intel
®
Itanium® Processor 9500 Series Processor Block Diagram
The Intel QPI viral and poison fields are used to flag corrupted system state and bad
data accordingly. Once it has “gone viral”, an Intel QPI agent will set the viral field
within all packet headers. Viral mode is entered in three ways: receiving a viral packet,
upon a detecting fatal/panic error, or when a global viral signal (from Cboxes) is
asserted. Viral is cleared on Reset. Poisoning is used to indicate bad data on a per-flit
basis. Poison does not indicate corrupted system coherency, but rather that a particular
block of data is not reliable.
®
Itanium® Processor 9500 Series PAL's Demand Based Switching (DBS) support
Intel
includes implementations of Power/Performance states (P-states) and Halt states (Cstates). For the PAL Halt state interface and architected specifications of the PAL Pstate interface, see the Intel
Volume 2, Section 11.6. PAL controls the Intel
Itanium® Processor 9500 Series
processor power through a special built-in microcontroller that manipulates voltage and
frequency. PAL communicates requested P-states to this controller through internal
registers.
As shown in Figure 1-3, Itanium architecture-based firmware consists of several major
components: Processor Abstraction Layer (PAL), System Abstraction Layer (SAL),
Unified Extensible Firmware Interface (UEFI) and Advanced Configuration and Power
Interface (ACPI). PAL, SAL, UEFI and ACPI together provide processor and system
initialization for an operating system boot. PAL and SAL provide machine check abort
handling. PAL, SAL, UEFI and ACPI provide various run-time services for system
functions which may vary across implementations. The interactions of the various
services that PAL, SAL, UEFI and ACPI provide are illustrated in Figure 1-3. In the
context of this model and throughout the rest of this chapter, the System Abstraction
Layer (SAL) is a firmware layer which isolates operating system and other higher level
software from implementation differences in the platform, while PAL is the firmware
layer that abstracts the processor implementation.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet17
Protection Keys provide a method to restrict permission by tagging each virtual page
with a unique protection domain identifier. The Protection Key Registers (PKR)
represent a register cache of all protection keys required by a process. The operating
system is responsible for management and replacement polices of the protection key
cache. Before a memory access (including IA-32) is permitted, the processor compares
a translation’s key v alue against all keys contained in the PKRs. If a matching key is not
found, the processor raises a Key Miss fault. If a matching Key is found, access to the
page is qualified by additional read, write and execute protection checks specified by
the matching protection key register. If these checks fail, a Key Permission fault is
raised. Upon receipt of a Key Miss or Key P e rmission fault, software can implement the
desired security policy for the protection domain. Some processor models may
implement additional protection key registers and protection key bits. Unimplemented
bits and registers are reserved. Please see the processor-specific documentation for
further information on the number of protection key registers and protection key bits
implemented on the processor.
Figure 1-3. Intel
®
Itanium® Processor 9500 Series Firmware Diagram
Introduction
18Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
1.3Processor Feature Comparison
The Intel® Itanium® Processor 9300 Series processor and Intel® Itanium® Processor
9500 Series processor features are compared below in Table 1-1.
®
Table 1-1.Intel
Intel
Description
SocketLG1248LG1248
Transistors2 billion3.1 billion
Cores/Threadsup to 4/8up to 8/16
Clock speedsup to 1.86 GHz via Intel
Integrated on-die cacheL1 (L1I 16K/L1D 16K),
Ararat Voltage Regulator Module SupportArarat “I”Ararat II
Supported speedsDDR3-800DDR3-800 and DDR3-1067
Intel QPI links6
Hot add/hot removal at Intel QPI link and
DIMM memory interface
Hot add CPUSupported
Hot add memorySupported
Hot remove/hot replace memorySupported
Memory sparing techniqueDIMMDIMM and Rank
Memory scrubbingSupportedSupported
Memory mirroringSupportedSupported
Itanium® Processor 9300 Series and
®
Itanium® Processor 9500 Series Feature Comparison
®
Intel
Itanium® Processor 9300
Series
®
with sustained boost
L2 (L2I 512K, L2D 256K),
inclusive L3 (6 MB per core,
up to 24 MB)
(4 full/2 half width at up to 4.8 GT/s)6 (4 full/2 half width at up to 6.4 GT/s)
(4.8 GT/s)
50 physical/64 virtual50 physical/64 virtual
each agent is responsible for all of the
address space and dedicated to a core
SupportedSupported
T urbo Boost
2,3
2,3
2,3
Intel® Itanium® Processor 9500
FLC (FLI 16K/FLD 16K),
MLC (MLI 512K, MLD 256K),
LLC (shared, up to 32 MB)
Intel® 7500 Scalable Memory Buffer
®
7510 Scalable Memory Buffer
Intel
two caching agents per socket are
responsible for half the address space
and shared among the cores
Series
1.73 - 2.53 GHz
1
(4.8 GT/s)
(6.4 GT/s)
Supported
Supported
Supported
2,3
2,3
2,3
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet19
Notes:
®
Itanium® Processor 9300
Description
Memory patrollingSupportedSupported
Memory migrationSupportedSupported
Support for mixing of x4 and x8 on the
same DDR channel
Online/Offline CPU (OS assisted)SupportedSupported
Online/Offline Memory (OS assisted)SupportedSupported
Online/Offline I/O HubSupportedSupported
Thermal Design Power (TDP) SKUs130W, 155W, 185W130W and 170W
1. OEM responsible for specifying platform-specific retraining interval.
2. Electrical isolation only, no physical add/remove supported.
3. Assume spare is installed.
Intel
Series
Not SupportedSupported
Intel® Itanium® Processor 9500
Series
1.4Processor Abstraction Layer
The Intel® Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500 Series
require implementation-specific Processor Abstraction Layer (PAL) firmware. PAL
firmware supports processor initialization, error recovery, and other functionality. It
provides a consistent interface to system firmware and operating systems across
processor hardware implementations. The IntelDeveloper’s Manual, Volume 2: System Architecture, describes PAL. Platforms must
provide access to the firmware address space and PAL at reset to allow the processors
to initialize.
®
Itanium® Architecture Software
Introduction
The System Abstraction Layer (SAL) firmware contains platform-specific firmware to
initialize the platform, boot to an operating system, and provide runtime functionality.
Further information about SAL is available in the Intel
®
Itanium® Processor Family
System Abstraction Layer Specification.
1.5Mixing Processors of Different Frequencies and
Cache Sizes
All Intel® Itanium® Processor 9300 Series processors and Intel® Itanium® Processor
9500 Series in the same system partition are required to have the same last level
cache size and identical core frequency . Mixing processors of different core frequencies,
cache sizes, and mixing Intel
®
Itanium® Processor 9300 Series with Intel® Itanium®
Processor 9500 Series is not supported and has not been validated by Intel. Operating
system support for multiprocessing with mixed components should also be considered.
1.6Terminology
In this document, “the processor” refers to the Intel® Itanium® Processor 9300 Series
and/or Intel
An ‘_N’ notation after a signal name refers to an active low signal. This means that a
signal is in the active state (based on the name of the signal) when driven to a low
level. For example, when RESET_N is low, a processor reset has been requested. When
NMI is high, a non-maskable interrupt has occurred. In the case of lines where the
name does not imply an active state but describes part of a binary sequence (such as
Itanium® Processor 9300 Series and 9500 Series Datasheet
Introduction
address or data), the ‘_N’ notation implies that the signal is inverted. For example,
D[3:0] = ‘HLHL’ refers to a Hex ‘A’, and D [3:0] _N = ‘LHLH’ also refers to a Hex ‘A’ (H
= High logic level, L = Low logic level).
A signal name has all capitalized letters, for example, VCTERM.
A symbol referring to a voltage level, current level, or a time value carries a plain
subscript, for example, Vccio, or a capitalized abbreviated subscript, for example, TCO.
1.7State of Data
The data contained in this document is subject to change. It is the best information
that Intel is able to provide at the publication date of this document.
1.8Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
Document Name
®
Intel
Itanium® Processor 9300 Series and 9500 Series Specification Update
Itanium® 9300 Series Processor Reference Manual for Software
Intel
Development and Optimization
®
Itanium® 9500 Series Processor Reference Manual for Software
Intel
Development and Optimization
®
Itanium® Processor Family System Abstraction Layer Specification
Intel
®
Intel
Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500
Series Platform Design Guide
System Management Bus (SMBus) Specification
Note:Contact your Intel representative or check http://developer.intel.com for the latest
revision of the reference documents.
§
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet21
Introduction
22Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
T
X
R
X
R
TT
R
TT
R
TT
R
TT
Signal
Signal
2Electrical Specifications
This chapter describes the electrical specifications of the Intel® Itanium® Processor
9300 Series and 9500 Series processors.
2.1Intel® QuickPath Interconnect and Intel®
Scalable Memory Interconnect
Differential Signaling
The links for Intel® QuickPath Interconnect (Intel® QPI) and Intel® Scalable Memory
Interconnect (Intel® SMI) signals use differential signaling. The Intel® SMI bus pins are
referred to as FB-DIMM pins on the package. The termination voltage level for the
processor for uni-directional serial differential links, each link consisting of a pair of
opposite-polarity (D+, D-) signals, is V
SS
.
Termination resistors are provided on the processor silicon and are terminated to V
thus eliminating the need to terminate the links on the system board for the Intel®
QuickPath Interconnect and FB-DIMM signals.
When designing a system, Intel strongly recommends that design teams perform
analog simulations of the Intel
refer to the latest available revision of the Intel® Itanium® Processor 9300 Series and
Intel® Itanium® Processor 9500 Series Platform Design Guide.
Figure 2-1 illustrates the active on-die termination (ODT) of these differential signals.
All the differential signals listed in Table 2-1 have ODT resistors. Also included in the
table are the debug signals.
Figure 2-1. Active ODT for a Differential Link Example
®
QuickPath Interconnect and FB-DIMM pins. Please
SS,
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet23
The signals are grouped by buffer type and similar characteristics as listed in Table 2-2.
The buffer type indicates which signaling technology and specifications apply to the
signals.
Table 2-2.Signal Groups (Sheet 1 of 3)
Signal GroupBuffer TypeSignals 1, 2, 3
Differential System Reference Clock
DifferentialCMOS In Differential PairSYSCLK, SYSCLK_N;
1. CMOS signals have a reference voltage (Vref) equal to VCCIO/2.
2. GTL signals have a reference voltage (Vref) equal to VCCIO*(2/3).
3. All single-ended buffer types, including inputs, outputs and input/outputs, include an on-die pull up resistor
between 4 kOhms and 8.7 kOhms. Recommended values for external pull-downs on the inputs and input/
output signals must meet the V
specification for that buffer.
il
2.3Reference Clocking Specifications
The processor has one input reference clock, SYSCLK/SYSCLK_N for the Intel® QPI
interface. The processor timing specified in this section is defined at the processor pins
unless otherwise noted.
2.The given PLL parameters are: Underdamping (z) = 0.8 an d natural frequency = fn = 7.86E6 Hz; wn = 2 *fn. N_minUI = 12
for Intel
3.Measurement taken from differential waveform.
4.Measured from -150 mV to +150 mV on the differential waveform (derived from SYSCLK minus SYSCLK_N). The signal must
be monotonic through the measurement region for rise and fall time. The 300 mV measurement window is centered on the
differential zero crossing. See Figure 2-4.
5.Measured at crossing point where the instantaneous voltage value of the rising edge SYSCLK equals the falling edge
SYSCLK_N. See Figure 2-2.
6.Refers to the total variation from the lowest crossing point to the highest, regardless of which edge is crossing. Refers to all
crossing points for this measurement. See Figure 2-3.
7.Defined as the total variation of all crossing voltages of Rising SYSCLK and falling SYSCLK_N. This is the maximum allowed
variance in Vcross for any particular system. See Figure 2-2.
8.Defined as the maximum instantaneous voltage including overshoot. See Figure 2-2.
9.Defined as the minimum instantaneous voltage including undershoot. See Figure 2-2.
10. T
is the time the differential clock must maintain a minimum ±150 mV differential voltage after rising/falling edges
Stable
before it is allowed to droop back into the VRB ±100 mV range. See Figure 2-5.
Allowed time before ringback500ps3, 10
Accumulated rms jitter over n UI of a
given PLL model output in response to
the jittery reference clock input. The
PLL output is generated by conv olving
the measured reference clock phase
jitter with a given PLL transfer
function. Here n=12.
®
QuickPath Interconnect 4.8 Gt/s channel.
0.5ps2
Figure 2-2. Single-ended Maximum and Minimum Levels and V
Figure 2-3. V
cross-delta
Definition
cross
Levels
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet27
Figure 2-4. Differential Edge Rate Definition
REFCLK
diff
ER
Refclk-diff-Fall
ER
Refclk-diff-Rise
V
Refclk-diff-ih
= 150 mV
V
Refclk-diff-il
= –150 mV
0.0 V
REFCLK
di ff
V
RB- di ff max
100 mV
0.0 V
V
RB-diff min
= – 100 mV
V
Ref cl k-diff-ih
= 150 mV
V
Ref cl k-diff-ih
= – 150 mV
T
Sta bl e
T
Stab le
Electrical Specifications
Figure 2-5. VRB and T
Stable
Definitions
2.4Intel® QuickPath Interconnect and Intel® SMI
Signaling Specifications
.
2.4.1Intel® Itanium® Processor 9300 Series Intel® QuickPath
Interconnect and Intel
The applicability of this section applies to Intel® QPI for the Intel® Itanium® Processor
9300 Series. This section contains information for Intel
(1/4 frequency of the reference clock) and processor’s normal operating frequency, 4.8
GT/s, for Intel
®
QPI and Intel® SMI.
®
SMI Specifications for 4.8 GT/s
®
QPI slow boot up speed
28Intel
®
For Intel
QPI slow boot up speed, the signaling rate is defined as 1/4 the rate of the
system reference clock. For example, a 133 MHz system reference clock would have a
forwarded clock frequency of 33.33 MHz and the signaling rate would be 66.67 MT/s.
The transfer rates available for the processor are shown in Table 2-4. Transmitter and
receiver parameters for Intel
®
QPI slow mode, Intel® QPI and Intel® SMI are shown in
Table 2-5 and Table 2-6 respectively.
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
Table 2-4.Intel® Itanium® Processor 9300 Series Clock Frequency Table
Intel® QuickPath Interconnect
Forwarded Clock Frequency
33.33 MHz66.66 MT/s (see note 1
2.40 GHz4.8 GT/s
1. This speed is the 1/4 SysClk Frequency.
Intel® QuickPath Interconnect Data
Transfer Rate
)
Table 2-5. Intel® Itanium® Processor 9300 Series Transmitter Parameter Values for
Intel
®
QuickPath Interconnect and Intel SMI Channels @ 4.8 GT/s (Sheet 1 of
2)
SymbolParameterMinNomMaxUnitsNotes
UI
avg
N
MIN-UI-Validation
T
slew-rise-fall-pin
V
Tx-diff-pp-pin
R
TX
Z
TX_LINK_DETECT
V
TX_LINK_DETECT
T
DATA_TERM_SKEW
Intel® QPI
T
DATA_TERM_SKEW
Intel® SMI
T
INBAND_RESET_SENSE
T
CLK_DET
T
SYSCLK-TX-VARIABILITY
TX
EQ-BOOST
V
TX-CM-PIN
V
TX-CM-RIPPLE-PIN
Average UI size at 4.8 GT/s208.33ps
# of UI over which the eye mask voltage and
timing spec needs to be validated
Defined as the slope of the rising or falling
waveform as measured between ±100 mV of
the differential transmitter output, data or
clock
1E6
612V/ns
Transmitter differential swing9001300mV
Transmitter termination resistance37.447.6Ω4
Link Detection Resistor5002000Ω
Link Detection Resistor Pull-up Voltagemax VCCIOV
Skew between first to last data termination
meeting Z
Skew between first to last data termination
meeting Z
Time taken by inband reset detector to sense
Inband Reset
Time taken by clock detector to observe clock
stability
RX_LOW_CM_DC
RX_LOW_CM_DC
Phase variability between re ference Clk (at Tx
600UI2
780UI2
8k256kUI
8k256kUI
500ps
input) and Tx output.
Voltage ratio between the cursor and the
post-cursor when transmitting successive
ones
025dB3
T ransmitte r data or clock co mmon mode level 2327%
Transmitter data or clock common mode
ripple
014%8,9
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet29
Electrical Specifications
Table 2-5. Intel® Itanium® Processor 9300 Series Transmitter Parameter Values for
Intel
®
QuickPath Interconnect and Intel SMI Channels @ 4.8 GT/s (Sheet 2 of
2)
SymbolParameterMinNomMaxUnitsNotes
TX
DUTY-CYCLE-PIN
Transmitter clock or data duty cycle at the
pin. T rans mit duty cy cle at the pin, defined as
UI to UI jitter as specified by the Intel
®
QPI
Electrical Specification, Rev 1.0.
T
TX-DATA-CLK-SKEW-PIN
TX
ACC-JIT-N_UI-1E-9
TX
JITUI-UI-1E-9PIN
RL
TX-DIFF
RL
TX-DIFF
Delay of any data lane relative to clock lane,
as measured at Tx output
Peak-to-peak accumulated jitter out of an y TX
data or clock over 0<= n <= N UI where
N=12, measured with 1E-9 probability.
Transmitter clock or data UI-UI jitter at 1E-9
probability.
Transmitter Differential return loss from
50MHz to 2GHz
Transmitter Differential return loss from
2GHz to 4GHz
Notes:
1.Parameter value at full Intel
2.Stagger offset = 0xF.
3.See Figure 2-6.
4.The termination small signal resistance; tolerance over the entire signalling voltage range shall not exceed ±5 ohms.
5.Requires Matlab script.
6.Refer to Intel
definition is used herein, where the value of UI-UI DCD = 2*UI DCD.
7.See Figure 2-7.
8.Applies to Vtx-diff-pp-pin.
9.Peak-to-peak value of the ripple.
®
QuickPath Interconnect (Intel® QPI) - Electrical Specifications for calculation of this value. Note that UI to UI.
®
QPI Refclk.
-0.0760.076UI-UI6
-0.50.5UI1,2
00.18UI5
00.17UI5
-10dB7
-6dB7
Table 2-6.Intel® Itanium® Processor 9300 Series Receiver Parameter Values for Intel®
QuickPath Interconnect and Intel
®
SMI Channels @ 4.8 GT (Sheet 1 of 2)
SymbolParameterMinNomMaxUnitsNotes
R
RX
T
Rx-data-clk-skew-pin
T
Rx-data-clk-skew-pin
RL
RX-DIFF
RL
RX-DIFF
V
Rx-data-cm-pin
V
Rx-data-cm-ripple-
pin
V
Rx-clk-cm-pin
V
Rx-clk-cm-ripple-pin
V
RX-eye-data-pin
V
RX-eye-clk-pin
RX termination resistance37.447.6Ω3
Delay of any data lane relative to the clock lane, as
measured at the end of Tx+ channel. This parameter is
a collective sum of effects of data clock mismatches in
Tx and on the medium connecting Tx and Rx.
Delay of any data lane relative to the clock lane, as
measured at the end of Tx+ channel. This parameter is
a collective sum of effects of data clock mismatches in
Tx and on the medium connecting Tx and Rx.
-0.53.5UI2
0.480.52UI1
Receiver differential return loss from 50 MHz to 2 GHz-10dB6
Receiver differential return loss from 2GHz to 4GHz-6dB6
Receiver data common mode level125350mV2
Receiver data common mode ripple0100mV
p-p
Receiver clock common mode level175350mV
Receiver clock common mode ripple0100mV
p-p
Minimum eye height at pin for data200mV4
Minimum eye height at pin for clk225mV5
30Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Table 2-6.Intel® Itanium® Processor 9300 Series Receiver Parameter Values for Intel®
QuickPath Interconnect and Intel
®
SMI Channels @ 4.8 GT (Sheet 2 of 2)
SymbolParameterMinNomMaxUnitsNotes
T
RX-eye-pin
QPI BER
SMI BER
Notes:
1.Parameter value at 1/4 Intel
2.Parameter value at full Intel
3.The termination small signal resistance; tolerance over the entire signalling voltage range shall not exceed ±5 ohms with
4.HVM guaranteed error free value for stressed PRBS signaling across PVT. Link BER is the dominant spec of which eye
5.HVM guaranteed error free value for stressed ‘1010 signaling across PVT. Link BER is the dominant spec of which eye
Lane
Lane
regard to the average of the values measured in the high output voltage state and the low output voltage state for that pin.
dimensions are only one factor, and improving another factor could compensate for eye height or width.
dimensions are only one factor, and improving another factor could compensate for eye height or width.
Minimum eye width at pin for clk and data0.6UI4
Bit Error Rate per lane valid for 4.8 and 6.4 GT/s1.0E-14Events
Bit Error Rate per lane valid for 4.8 and 6.4 GT/s1.0E-12Events
®
QPI Refclk.
®
QPI Refclk.
6.See Figure 2-8.
Figure 2-6. TX Equalization Diagram
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet31
Figure 2-7. TX Return Loss
Figure 2-8. RX Return Loss
Electrical Specifications
2.4.2Intel® Itanium® Processor 9500 Series Requirements for
Intel® QuickPath Interconnect for 4.8 and 6.4 GT/s
The applicability of this section applies to Intel® Itanium® Processor 9500 Series. This
section contains information for slow boot up speed (1/4 frequency of the reference
clock), 4.8 GT/s, and 6.4 GT/s, for Intel
For Intel® QPI slow boot up speed, the signaling rate is defined as 1/4 the rate of the
system reference clock. For example, a 133 MHz system reference clock would have a
forwarded clock frequency of 33.33 MHz and the signaling rate would be 66.67 MT/s.
32Intel
®
QPI and Intel® SMI.
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
The transfer rates available for the processor are shown in Table 2-7. Transmitter and
receiver parameters for Intel® QPI slow mode, Intel® QPI and Intel® SMI are shown in
Table 2-8 and Table 2-9 respectively.
Table 2-7.Intel
®
Itanium® Processor 9500 Series Clock Frequency Table
Intel® QuickPath Interconnect
Forwarded Clock Frequency
33.33 MHz66.66 MT/s (see note 1)
2.40 GHz4.8 GT/s
3.2 GHz6.4 GT/s
1. This speed is the 1/4 SysClk Frequency.
The applicability of this section applies to Intel
Intel® QuickPath Interconnect Data
Transfer Rate
®
QPI for the Intel® Itanium® Processor
9500 Series. This section contains information for slow boot up speed (1/4 frequency of
the reference clock), 4.8 GT/s, and 6.4 GT/s.
Specifications for link speed independent specifications are called out in Table 2-8.
Electrical specifications for Transmit and Receive for 4.8 GT/s are captured in Table 2-9
and for 6.4 GT/s are captured in Table 2-10.
Table 2-8.Intel® Itanium® Processor 9500 Series Link Speed Independent Specifications
(Sheet 1 of 2)
SymbolParameterMinNomMaxUnitNotes
UIavgAverage UI size at “G”
T
slew-rise-fall-pin
ΔZ
TX_LOW_CM_DC
ΔZ
RX_LOW_CM_DC
N
MIN-UI-Validation
Z
TX_HIGH_CM_DC
Z
RX_HIGH_CM_DC
GT/s (Where G = 4.8,
6.4, and so on)
Defined as the slope of
the rising or falling
waveform as measured
between ±100mV of the
differential transmitter
output, for any data or
clock
Defined as:
(max(Z
TX_LOW_CM_DC
min(Z
TX_LOW_CM_DC))
Z
TX_LOW_CM_DC
in %, over full range of Tx
single ended voltage
Defined as:
(max(Z
min(Z
TX_LOW_CM_DC))
Z
TX_LOW_CM_DC
in %, over full range of Tx
single ended voltage
# of UI over which the
eye mask voltage and
timing spec needs to be
validated
Single ended DC
impedance to GND for
either D+ or D- of any
data bit at Tx
Single ended DC
impedance to GND for
either D+ or D- of any
data bit at Rx
expressed
TX_LOW_CM_DC
expressed
0.999 *
nominal
920V/nsec
-66% of
) -
/
-606% of
) -
/
1,000,000
4k
4k
1000/G1.001 *
nominal
psec
Z
TX_LOW_CM_DC
Z
TX_LOW_CM_DC
Ω
Ω
1
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet33
Electrical Specifications
Notes:
Table 2-8.Intel® Itanium® Processor 9500 Series Link Speed Independent Specifications
(Sheet 2 of 2)
SymbolParameterMinNomMaxUnitNotes
Z
TX_LINK_DETECT
V
TX_LINK_DETECT
T
DATA_TERM_SKEW
T
INBAND_RESET_
SENSE
Tclk
_DET
T
CLK_FREQ_DET
T
Refclk-Tx-Variability
T
Refclk-Rx-Variability
L
D+/D-RX-Skew
BER
Lane
Link Detection Resistor5002000
Link Detection Resistor
Pull-up Voltage
Skew between first to last
data termination meeting
Z
RX_LOW_CM_DC
Time taken by inband
reset detector to sense
Inband Reset
Time taken by clock
detector to observe clock
stability
Time taken by clock
frequency detector to
decide slow vs.
operational clock after
stable clock
Phase variability between
reference Clk (at Tx
input) and Tx output.
Phase variability between
reference Clk (at Rx
input) and Rx output.
Phase skew between D+
and D- lines for any data
bit at Rx
Bit Error Rate per lane
1000psec
max VCCIO V
128UI
1.5μs
20KUI
32Reference
500psec
0.03UI
1.0E-14Events
valid for 4.8 and 6.4 GT/s
Ω
Clock Cycles
1. Used during initialization. It is the state of “OFF” condition for the receiver when o nly the minimum termination
is connected.
Table 2-9.Intel® Itanium® Processor 9500 Series Transmitter and Receiver Pa rameter
Values for Intel
®
QPI Channel at 4.8 GT/s (Sheet 1 of 2)
SymbolParameterMinNomMaxUnitNotes
V
Tx-diff-pp-pin
Z
TX_LOW_CM_DC
Z
RX_LOW_CM_DC
V
Tx-cm-dc-pin
V
Tx-cm-ac-pin
TX
duty-pin
TX
jitUI-UI-1E-7-pin
TX
jitUI-UI-1E-9-pin
Transmitter differential swing9001400mV1
DC resistance of Tx terminations
at half the single ended swing
(which is usually 0.25*V
) bias point
pin
DC resistance of Rx terminations
at half the single ended swing
(which is usually 0.25*V
) bias point
pin
Transmitter output DC common
mode, defined as average of V
and V
D-
Transmitter output AC common
mode, defined as ((V
V
Tx-cm-dc-pin
)
Tx-diff-pp-
Tx-diff-pp-
+ VD-)/2 -
D+
37.450Ω
37.450Ω
0.230.27Fraction of
D+
-0.03750.0375Fraction of
V
Tx-diff-pp-pin
V
Tx-diff-pp-pin
Average of UI-UI jitter-0.0550.055UI
UI-UI jitter measured at Tx output
pins with 1E-7 probability
UI-UI jitter measured at Tx output
pins with 1E-9 probability.
-0.0750.075UI
-0.0850.085UI
2
34Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Table 2-9.Intel® Itanium® Processor 9500 Series Transmitter and Receiver Parameter
Values for Intel
®
QPI Channel at 4.8 GT/s (Sheet 2 of 2)
SymbolParameterMinNomMaxUnitNotes
TX
clk-acc-jit-N_UI-1E-7
p-p accumulated jitter out of
transmitter over 0 <= n <= N UI
where N=12, measured with 1E-7
00.15UI
probability.
TX
clk-acc-jit-N_UI-1E-9
T
Tx-data-clk-skew-pin
p-p accumulated jitter out of
transmitter over 0 <= n <= N UI
where N=12, measured with 1E-9
probability.
Delay of any data lane relative to
clock lane, as measured at Tx
00.17UI
-0.50.5UI
output
V
Rx-diff-pp-pin
Voltage eye opening at the end of
Tx+ channel for any data or clock
channel measured with a
cumulative probability of 1E-9
2251200mV
(UI).
T
Rx-diff-pp-pin
T
Rx-data-clk-skew-pin
Forward CLK Rx input voltage
V
Rx-CLK
V
Rx-cm-dc-pin
V
Rx-cm-ac-pin
Timing eye opening at the end of
Tx+ channel for any data or clock
channel measured with a
cumulative probability of 1E-9 (UI)
Delay of any data lane relative to
the clock lane, as measured at the
end of Tx+ channel. This
parameter is a collective sum of
effects of data clock mismatches
in Tx and on the medium
connecting Tx and Rx.
sensitivity (differential pp)
DC common mode ranges at the
Rx input for any data or clock
channel
AC common mode ranges at the
Rx input for any data or clock
0.631UI
-13UI
180mV
125350mV
-5050mV2
channel, defined as:
((V
D+
+ VD-/2 - V
RX-cm-dc-pin
)
Notes:
1.1300 mVpp swing is recommended when CPU to CPU or CPU to IOH length is within 2” of PDG max trace
length. Note that default value is 1100 mVpp.
2.Measure AC CM noise at the TX and decimate to its spectral components. For all spectral components above
3.2 GHz, apply the attenuation of the channel at the appropriate frequency. If the resultant AC CM at the
receiver is met after taking out the appropriate spectral components meets the RX AC CM spec then we can
allow the transmitter AC CM noise to pass.
Table 2-10. Intel® Itanium® Processor 9500 Series Transmitter and Receiver Parameter
Values for Intel
®
QPI at 6.4 GT/s (Sheet 1 of 2)
SymbolParameterMinNomMaxUnitNotes
V
Tx-diff-pp-pin
Z
TX_LOW_CM_DC
Z
RX_LOW_CM_DC
V
Tx-cm-dc-pin
Transmitter differential swing9001400mV1
DC resistance of Tx terminations
at half the single ended swing
(which is usually 0.25*V
) bias point
pin
DC resistance of Rx terminations
at half the single ended swing
(which is usually 0.25*V
) bias point
pin
Tx-diff-pp-
Tx-diff-pp-
Transmitter output DC common
mode, defined as average of V
and V
D-
37.450Ω
37.450Ω
0.230.27Fraction of
D+
V
Tx-diff-pp-pin
4
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet35
Electrical Specifications
Table 2-10. Intel® Itanium® Processor 9500 Series Transmitter and Receiver Pa rameter
Values for Intel
®
QPI at 6.4 GT/s (Sheet 2 of 2)
SymbolParameterMinNomMaxUnitNotes
V
Tx-cm-ac-pin
TX
duty-pin
TX
jitUI-UI-1E-7-pin
TX
jitUI-UI-1E-9-pin
TX
clk-acc-jit-N_UI-1E-7
Transmitter output AC common
mode, defined as ((V
V
Tx-cm-dc-pin
)
+ VD-)/2 -
D+
-0.03750.0375Fraction of
Average of absolute UI-UI jitter-0.060.06UI
UI-UI jitter measured at Tx output
-0.0850.085UI3
pins with 1E-7 probability.
UI-UI jitter measured at Tx output
pins with 1E-9 probability.
p-p accumulated jitter out of
transmitter over 0 <= n <= N UI
where N=12, measured with 1E-7
-0.090.09UI
00.15UI
V
Tx-diff-pp-pin
2
probability.
TX
clk-acc-jit-N_UI-1E-9
T
Tx-data-clk-skew-pin
V
Rx-diff-pp-pin
p-p accumulated jitter out of
transmitter over 0 <= n <= N UI
where N=12, measured with 1E-9
probability.
Delay of any data lane relative to
clock lane, as measured at Tx
output
Voltage eye opening at the end of
Tx+ channel for any data or clock
channel measured with a
cumulative probability of 1E-9
00.17UI
-0.50.5UI
1551400mV2, 5
(UI).
T
Rx-diff-pp-pin
T
Rx-data-clk-skew-pin
Forward CLK Rx input voltage
V
Rx-CLK
V
Rx-cm-dc-pin
V
Rx-cm-ac-pin
Timing eye opening at the end of
Tx+ channel for any data or clock
channel measured with a
cumulative probability of 1E-9 (UI)
Delay of any data lane relative to
the clock lane, as measured at the
end of Tx+ channel. This
parameter is a collective sum of
effects of data clock mismatches
in Tx and on the medium
connecting Tx and Rx.
sensitivity (differential pp)
DC common mode ranges at the
Rx input for any data or clock
channel
AC common mode ranges at the
Rx input for any data or clock
channel, defined as:
+ VD-/2 - V
((V
D+
RX-cm-dc-pin
0.611UI
-14UI
150mV
90350mV
-5050mV
)
Notes:
1.1300 mVpp swing is recommended when CPU to CPU or CPU to IOH length is within 2” of PDG max trace
length. Note that default value is 1200 mVpp.
2.Measure AC CM noise at the TX and decimate to its spectral components. For all spectral components above
3.2 GHz, apply the attenuation of the channel at the appropriate frequency. If the resultant AC CM at the
receiver is met after taking out the appropriate spectral co mponents meets the RX AC CM spec t hen we can
allow the transmitter AC CM noise to pass.
3.Measured with neighboring lines being quiet and the remaining lines toggling PRBS patterns.
4.DC CM can be relaxed to 0.20 and 0.30 Vdiffp-p swing if RX has wide DC common mode range.
5.Based on transmitting a PRBS pattern.
36Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
2.4.3Intel® Itanium® Processor 9500 Series Processor
Requirements for Intel® SMI Specifications for 6.4 GT/s
This section defines the high-speed differential point-to-point signaling link for Intel®
®
SMI for the Intel
Itanium® Processor 9500 Series. The link consists of a transmitter
and a receiver and the interconnect between them. The specifications described in this
®
section covers 6.4 Gb/s operation. The parameters for Intel
SMI at 6.4 GT/s and
lower are captured in Table 2-11 and the PLL specification for transmit and receive are
captured in Table 2-12.
Table 2-11. Intel® Itanium® Processor 9500 Series Transmitter and Receiver Parameter
Values for Intel
SymbolParameterMinNomMaxUnitNot es
V
Tx-diff-pp-pin
Z
TX_LOW_CM_DC
Z
RX_LOW_CM_DC
V
Tx-diff-pp-CLK-pin
V
Tx-cm-dc-pin
V
Tx-cm-ac-pin
TX
duty-UI-pin
TX1UI-Rj-NoXtalk-pin
TX1UI-Dj-NoXtalk--pin
TXN-UI-Rj-NoXtalkpin
TXN-UI-Dj-NoXtalkpin
T
Tx-data-clk-skew-pin
T
Rx-data-clk-skew-pin
Forward CLK Rx input voltage sensitivity
V
Rx-CLK
Transmitter differential swing8001200mV
DC resistance of Tx terminations at half
the single ended swing (which is usually
0.25*V
Tx-diff-pp-pin
DC resistance of Rx terminations at half
the single ended swing (which is usually
0.25*V
Tx-diff-pp-pin
Transmitter differential swing using a CLK
like pattern
Transmitter output DC common mode,
defined as average of V
Transmitter output AC common mode,
defined as ((V
This is computed as absolute difference
between average value of all UI with that
of average of odd UI, which in magnitude
would equal absolute difference between
average of all UI and average of all even
UI.
Rj value of 1-UI jitter. With X-talk off, but
on-die system like noise present. This
extraction is to be done after software
correction of DCD
pp Dj value of 1-UI jitter. With X-talk off,
but on-die system like noise present.
Rj value of N-UI jitter. With X-talk off, but
on-die system like noise present. Here 1
< N < 9.This extraction is to be done
after software correction of DCD
pp Dj value of N-UI jitter. With X-talk off,
but on-die system like noise present.
Here 1 < N < 9.Dj here indicated Djdd of
dual-dirac fitting, after software
correction of DCD
Delay of any data lane relative to clock
lane, as measured at Tx output
Delay of any data lane relative to the
clock lane, as measured at the end of Tx+
channel. This parameter is a collective
sum of effects of data clock mismatches
in Tx and on the medium connecting Tx
and Rx.
(differential pp)
®
SMI at 6.4 GT/s and lower (Sheet 1 of 2)
37.450Ω
) bias point
37.450Ω
) bias point
0.9*min(VTxdiff-pp-pin)
0.230.27Fraction of
-0.03750.0375Fraction of
)
00.018UI
00.008UI2
-0.010.01UI2
00.012UI2
-0.040.040.2UI2
-0.50.5UI
-13.5UI
+ VD-)/2 - V
D+
D+
and V
Tx-cm-dc-pin
D-
max(VTxdiff
-pp-pin)
150mV
mV1
V
pin
V
pin
Tx-diff-pp-
3
Tx-diff-pp-
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet37
Electrical Specifications
Table 2-11. Intel® Itanium® Processor 9500 Series Transmitter and Receiver Pa rameter
Values for Intel
SymbolParameterMinNomMaxUnitNotes
VRx-Vmargin
TRx-Tmargin
V
Rx-cm-dc-pin
V
Rx-cm-ac-pin
Notes:
1.This is the swing specification for the forwarded CLK output. Note that this specification will also have to be suitably deembedded for package/PCB loss to translate the value to the pad, since there is a significant variation between traces in a
setup.
2.While the X-talk is off, on-die noise similar to that occurring with all the transmitter and receiver lanes toggling will still need
to be present. When a socket is not present in the transmitter measurement setup, in many cases the contribution of the
cross-talk is not significant or can be estimated within tolerable error even with all the transmitter lanes sending patterns.
Therefore for all Tx measurements, use of a socket should be avoided. The contribution of cross-talk may be significant and
should be done using the same setup at Tx and compared against the expectations of full link si gnaling. Note that there may
be cases when one of Dj and Rj specs is met and another violated in which case the signaling analysis should be ran to
determine link feasibility.
3.DC CM can be relaxed to 0.20 and 0.30 Vdiffp-p swing if RX has wide DC common mode range.
Any data lane Rx input voltage
(differential pp) measured at BER=1E-9
Timing width for any data lane using
repetitive patterns and clean forwarded
CLK, measured at BER=1E-9
DC common mode ranges at the Rx input
for any data or clock channel, defined as
average of VD+ and VD-.
AC common mode ranges at the Rx input
for any data or clock channel, defined as:
+ VD-/2 - V
((V
D+
®
SMI at 6.4 GT/s and lower (Sheet 2 of 2)
100mV
0.8UI
125350mV
-5050mV
RX-cm-dc-pin
)
Table 2-12. PLL Specification for TX and RX
SymbolParameterMinMaxUnitsNotes
F
PLL-BW_TX-RX
JitPk
TX-RX
-3dB bandwidth416MHz
Jitter Peaking3dB
2.5Processor Absolute Maximum Ratings
Table 2-13 specifies absolute maximum and minimum ratings for the Intel® Itanium®
Processor 9300 Series. Within operational maximum and minimum limits, the
processor functionality and long-term reliability can be expected. The processor
maximum ratings listed in Table 2-13 are applicable for the 130 W, 155 W, and 185 W
parts.
Table 2-14 specifies absolute maximum and minimum ratings for the Intel
Processor 9500 Series. Within operational maximum and minimum limits, the
processor functionality and long-term reliability can be expected. The processor
maximum ratings listed in Table 2-14 are applicable for the 130 W and 170 W parts.
At conditions outside operational maximum ratings, but within absolute maximum and
minimum ratings, neither functionality nor long-term reliability can be expected. If a
device is returned to conditions within operational maximum and minimum ratings
after having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
®
Itanium®
38Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time, then, when returned to conditions within the
functional operating condition limits, it will either not function, or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
2.5.1Intel® Itanium® Processor 9300 Series Absolute
Maximum Ratings
®
Table 2-13. Intel
SymbolParameterMinMaxUnitsNotes
V
CCCORE
V
CCUNCORE
V
CCA
V
CCIO
V
CC33_SM
Notes:
1.For functional operation, all processor electrical, signal quality, mechanical, and thermal specifications must be satisfied.
2.Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined inSection 2.6.3. Excessive
overshoot or undershoot on any signal will likely result in permanent damage to the processor.
Processor core supply voltage with respect to VSS–0.31.55V1,2
Processor uncore suppl y voltage with respect to VSS–0.31.55V1,2
Processor Analog Supply Voltage with respect to VSS–0.31.89V1,2
Processor I/O Supply Voltage with respect to VSS–0.31.55V1,2
Processor 3.3 V Supply Voltage with respect to VSS-0.33.465V1,2
Itanium® Processor 9300 Series Absolute Maximum Ratings
2.5.2Intel® Itanium® Processor 9500 Series Absolute
Maximum Ratings
Table 2-14. Intel® Itanium® Processor 9500 Series Processor Absolute Maximum Ratings
SymbolParameterMinMaxUnits
V
CCCORE
V
CCUNCORE
V
CCA
V
CCIO
V
CC33_SM
Notes:
1.For functional operation, all processor electrical, signal quality, mechanical, and thermal specifications must be satisfied.
2.Overshoot and undershoot voltage guidelines for input, output, and I/O signals are outlined inSection 2.6.4. Excessive
overshoot or undershoot on any signal will likely result in permanent damage to the processor.
Processor core supply voltage with respect to VSS-0.31.42V1,2
Processor uncore supply voltage with respect to VSS-0.31.42V1,2
Processor Analog Supply Voltage with respect to VSS-0.31.89V1,2
Processor I/O Supply Voltage with respect to VSS-0.31.55V1,2
Processor 3.3 V Supply Voltage with respect to VSS-0.33.465V1,2
Notes
2.6Processor DC Specifications
Table 2-15 through Table 2-35 list the DC specifications for the Intel® Itanium®
Processor 9300 Series and 9500 Series and are valid only while meeting specifications
for case temperature, clock frequency, and input voltages.
The following notes apply:
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet39
Electrical Specifications
Notes:
• Unless otherwise noted, all specifications in the tables apply to all frequencies
• For the Intel® Itanium® Processor 9300 Series and Intel® Itanium® Processor
9500 Series, these specifications are based on characterized data from silicon
measurements.
2.6.1Flexible Motherboard Guidelines for the Intel® Itanium®
Processor 9300 Series
The Flexible Motherboard (FMB) guidelines are estimates of the maximum ratings that
the processor will have over certain time periods. The ratings are only estimates as
actual specifications for future processors may differ. The processor may or may not
have specifications equal to the FMB value in the foreseeable future.
Table 2-15 defines the FMB voltage specification values applied to the 130W, and
®
155W/185W Intel
Itanium® Processor 9300 Series stock-keeping units (SKUs).
Current specifications are identified for each processor SKU separately in Table 2-16
through Table 2-17.
Table 2-18 defines the FMB voltage specification values applied to the 130 W and
®
170 W SKUs for the Intel
Itanium® Processor 9500 Series. Current specifications are
identified for each processor SKU separately in Table 2-19.
Table 2-15. FMB Voltage Specifications for the Intel
SymbolParameterMinTypMaxUnitsNotes
VID
Range
UVID
Range
VCCUNCOREProcessor uncore supply voltageSee Table 2-20 and Figure 2-10V2,1
VCCCOREProcessor core supply voltageSee Table 2-21 and Figure 2-11V2,3,4
VCCCACHEProcessor cache supply voltageSee Tab le 2-22 and Figure 2-12V5
VID TransitionVID step size during transition± 12.5mV
VID_DCshiftTotal allowable DC load line shift from VID
VCCIOProcessor I/O supply voltage at die
VCCIOProcesso r I/O supply voltage (high
VCCIOProcessor I/O supply voltage at package
VCCAProcessor analog supply voltage (DC spec)1.7641.81.836V
VCCAProcessor analog supply voltage (AC
VCCAProcessor analog supply voltage (AC
VCCAProcessor analog supply voltage (Total =
VCC33_SM3.3 V supply voltage3.1353.33.465V
VCCCORE VID Range0.81.11.35V
VCCUNCORE VID Range0.81.11.35V
steps.
including all AC and DC
frequency AC p-p noise at die)
pin including all AC and DC
tolerance for noise at scope full
bandwidth)
tolerance for noise > 1MHz)
DC spec + AC tolerance)
1.1471.1751.203V8
1.7391.81.861V
®
Itanium® Processor 9300 Series
-450mV6
1.081.151.22V7
050mV
1.8±25mV9, 10
1.8±15mV9, 11
1. The voltage specification requirements are measured across the VCC UNCORESENSE and VSSUNCORESENSE pins using an
oscilloscope set to a 100 MHz bandwidth and probes that are 1.5 pF maximum capacitance and 1 mOhms minimum impedance
at the processor socket. The maximum length of gr ound wire on the probe should be le ss than 5 mm. Ensure external noise from
the system is not coupled into the scope probe.
40Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
2. These voltages are target only. A variable voltage source should exist on systems in the event that a different voltage is required.
See Ararat Voltage Regulator Module Design Guide for more information.
3. Uncore, Core, and Cache voltage and Current Rating are at the Package Pad.
4. The voltage specification requirements are measured across the VCCCORESENSE and VSSCORESENSE pins using an oscilloscope
set to a 100 MHz bandwidth and probes that are 1.5 pF maximum capacitance and 1 MOhm minimum impedance at the processor
socket. The maximum length of ground wire on the probe sh ould be less th an 5 mm. Ens ure exte rnal no ise from the sys t em is
not coupled into the scope probe.
5. The voltage specification requirements are measured across the VCCCACHESENSE and VSSCACHESENSE pins using an
oscilloscope set to a 100 MHz bandwidth and probes that are 1.5 pF maximum capacitance and 1 mOhms minimum impedanc e
at the processor socket. The maximum length of g round wire on the probe should be less than 5 mm. Ensure exter nal noise from
the system is not coupled into the scope probe.
6. Warm boot reset, only in downward direction.
7. Min and Max range is spec at the die for both VCCIO. This range includes 50 mV p-p AC noise. It also includes any DC and AC
tolerances at package pin.
8. The FMB remote sense tolerance is ±2.5% for DC to 20 MHz at the package, whe re ±1.5% is allotted for a DC to 1 MHz range
and an additional ±1% for 1 MHz to 20 MHz. Similarly , ±6.4% is allotted for DC to 20 MHz at the die. It is expected that VCCIO
regulators meet ±1.5% at the remote sense location based on the general remote sense termination po int location as described
in Figure 2-16, VR Sense Point (Representation). F or future processor compatibility, it is strongly recommended that the platform
query the PIROM to assure VCCIO is set to the appropriate level prior to powering up the VCCIO supply.
9. All voltage regulation measurements taken at remote sense termination points.
10.For peak-to-peak Ripple and Noise (R&N) measured with full bandwidth (BW) of the scope (Min 1 GHz BW scope is required):
set scope diff probe and the scope at full BW (capture waveform A, channel 1).
11.For peak-to-peak Ripple and Noise (R&N) measured above 1 MHz:
Step 1 = set both: scope diff probe and/or the scope at 1 MHz BW limit (capture waveform B, channel 2).
Step 2 = calculate A-B (use scope Math function: subtract channel 1 - channel 2).
Table 2-16. FMB 130W Current Specifications for the Intel® Itanium® Processor 9300
Series
SymbolParameterMaxUnitsNotes
I
CC_CORE
I
CC_CORE_TDC
I
CC_CORE_STEP
d
ICC_CORE/dt
I
CC_UNCORE
I
CC_UNCORE_TDC
I
CC_UNCORE_STEP
dI
CC_UNCORE/dt
I
CC_IO
I
CC_Analog
I
CC33_SM
I
for core151A
CC
Thermal Design Current for Core100A1
Max Load step for core95A2
Slew rate for core at Ararat output154A/us
ICC for uncore50A
Thermal Design Current for Uncore43A3
Max Load step for uncore22A4
Slew rate for uncore at Ararat output75A/us
ICC for processor I/O22A5
ICC for processor Analog4A
ICC33 for main supply200mA
1. ICC_CORE_TDC is the sustained (DC equivalent) current that the processor core is capable of drawing indefinitely and should be
used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for monitoring its
temperature and asserting the VR_FAN_N, VR_THERMALERT_N, VR_THERMTRIP_N signals sequentially to inform the processor
and platform of a thermal excursion. Of the three signals, only VR_THERMALTERT_N is monitored by the processor. Please see
the Ararat Voltage Regulator Module Design Guide for further details. The processor is capable of drawing ICC_CORE_TDC
indefinitely. Refer to Figure 2-9 for further details on the average processor current draw over various time durations. This
parameter is based on design characterization and is not tested.
2. During system power on, the pulse inrush (ICC_CORE_STEP) can be as high as 130A peak-to-peak.
3. ICC_UNCORE_TDC is the sustained (DC equivalent) current that the processor uncore is capable of drawing indefinitely and
should be used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for
monitoring its temperature and asserting the VR_FAN_N, VR_THERMALERT_N, VR_THERMTRIP_N si gnals sequentially to inform
the processor and platform of a thermal excursion. Of the three signals, only VR_THERMAL TER T_N is monitored by the processor.
Please see the Ararat Voltage Regulator Module Design Guide for further details. The processor is capable of drawing
ICC_UNCORE_TDC indefinitely. This parameter is based on design characterization and is not tested.
4. During system power on, the pulse inrush (ICC_UNCORE_STEP) can be as high as 40A peak-to-peak.
5. The ICC_IO current specification applies to the total current from VCCIO pins.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet41
Electrical Specifications
Notes:
0.01100 10001010.1
ITDC
IMax
Time Duration (us)
Sustained Current (A)
Table 2-17. FMB 155W/185W Current Specifications for the Intel® Itanium® Processor
9300 Series
SymbolParameterMaxUnitsNotes
I
CC_CORE
I
CC_CORE_TDC
I
CC_CORE_STEP
d
ICC_CORE/dt
I
CC_UNCORE
I
CC_UNCORE_TDC
I
CC_UNCORE_STEP
dI
CC_UNCORE/dt
I
CC_IO
I
CC_Analog
I
CC33_SM
1. ICC_CORE_TDC is the sustained (DC equivalent) current that the processor core is capable of drawing indefinitely and should be
used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for monitoring its
temperature and asserting the VR_FAN_N, VR_THE RMALERT_N, VR_THERMTRIP_N signals sequentially to inform the processor
and platform of a thermal excursion. Of the three signals, only VR_THERMALTERT_N is monitored by the processor. Please see
the Ararat Voltage Regulator Module Design Guide for further details. The processor is capable of drawing ICC_CORE_TDC
indefinitely. Refer to Figure 2-9 for further details on the average processor current draw over various time durations. This
parameter is based on design characterization and is not tested.
2. During system power on, the pulse inrush (ICC_CORE_STEP) can be as high as 130A peak-to-peak.
3. ICC_UNCORE_TDC is the sustained (DC equivalent) current that the processor uncore is capable of drawing indefinitely and
should be used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for
monitoring its temperature and asserting the VR_FA N_N, VR_THERMALER T_N, VR_THERMTRIP_N signals sequentially to inform
the processor and platform of a thermal excursion. Of the three signals, only VR_THERMAL TER T_N is monitored by the processor.
Please see the Ararat Voltage Regulator Module Design Guide for further details. The processor is capable of drawing
ICC_UNCORE_TDC indefinitely. This parameter is based on design characterization and is not tested.
4. During system power on, the pulse inrush (ICC_UNCORE_STEP) can be as high as 40A peak-to-peak.
5. The ICC_IO current specification applies to the total current from VCCIO pins.
I
for core180A
CC
Thermal Design Current for Core131A1
Max Load step for core95A2
Slew rate for core at Ararat output154A/us
I
for uncore50A
CC
Thermal Design Current for Uncore43A3
Max Load step for uncore22A4
Slew rate for uncore at Ararat output75A/us
I
for processor I/O22A5
CC
ICC for processor Analog4A
I
for main supply200mA
CC33
Figure 2-9. Processor I
CC_CORE
Load Current versus Time
42Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
2.6.2Flexible Motherboard Guidelines for the Intel® Itanium®
Processor 9500 Series
The Flexible Motherboard (FMB) guidelines are estimates of the maximum ratings that
the processor will have over certain time periods. The ratings are only estimates as
actual specifications for future processors may differ. The processor may or may not
have specifications equal to the FMB value in the foreseeable future.
Table 2-18 defines the FMB voltage specification values applied to the 130 W and
®
170 W SKUs for the Intel
Itanium® Processor 9500 Series. Current specifications are
identified for each processor SKU separately in Table 2-19.
Table 2-18. FMB Voltage Specifications for the Intel® Itanium® Processor 9500 Series
SymbolParameterMinTypMaxUnitsNotes
CVID
Range
CVID
Boot
UVID
Range
UVID
Boot
VCCUNCOREProcessor uncore supply voltageSee Table 2-23 and Figure 2-15V2, 1
VCCCOREProcessor core supply voltageSee Ta ble 2-24 and Figure 2-14V2, 3, 4
VID TransitionVID step size during transition± 5mV
VID_DCshiftTotal allowable DC load line shift from VID
VCCIOProcessor I/O supply voltage at die
VCCIOProcessor I/O supply voltage (high
VCCIOProcessor I/O supply voltage at package
VCCAProcessor analog supply voltage (DC spec)1.7641.81.836V
VCCAProcessor analog supply voltage (AC
VCCAProcessor analog supply voltage (AC
VCCAProcessor analog supply voltage (Total =
VCCA RampMin time allowed to ramp VCCA from 10%
VCC33_SM3.3 V supply voltage3.1353.33.465V
VCCCORE VID Range0.8001.1051.22V
VCCCORE VID default value0V
VCCUNCORE VID Range0.8000.9751.19V
VCCUNCORE VID default value1.0V
steps.
including all AC and DC
frequency AC p-p noise at die)
pin including all AC and DC
tolerance for noise at scope full
bandwidth)
tolerance for noise > 1MHz)
DC spec + AC tolerance)
to 90% typical value
1.0111.0501.094V6
1.0261.0751.088V7
1.8±25mV8, 9
1.8±15mV9, 10
1.7391.81.861V
110ms
-420mV5
35mV
1
1
1
1
8
1. The voltage specification requirements are measured across the VCCUNCORESENSE and VSSUNCORESENSE pins using an
oscilloscope set to a 100 MHz bandwidth and probes that are 1.5 pF maximum capacitance and 1 mOhms minimum impedanc e
at the processor socket. The maximum length of g round wire on the probe should be less than 5 mm. Ensure exter nal noise from
the system is not coupled into the scope probe.
2. These voltages are target only. A variable voltage source should exist on systems in th e event that a different voltage is required.
See the Ararat II Voltage Regulator Module Design Guide for more information.
3. Uncore and Core voltage and Current Rating are at the Package Pad.
4. The voltage specification requirements are measured across the VCCCORESENSE and VSSCORESENSE pins using an oscilloscope
set to a 100 MHz bandwidth and probes that are 1.5 pF maximum capacitance and 1 mOhms minimum impedance at the
processor socket. The maximum length of ground wire on the pr obe should be less than 5 mm. Ensure external noise fro m the
system is not coupled into the scope probe.
5. Warm boot reset, only in downward direction.
6. Min and Max range is spec at the die for VCCIO. This range includes 35 mV p-p AC noise. It also includes any DC and AC
tolerances at package pin.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet43
Electrical Specifications
Notes:
7. The FMB remote sense tolerance is ±2.5% for DC to 20 MHz at the package, where ±1.5% is allotted for a DC to 1 MHz range
and an additional ±1.0% for 1 MHz to 20 MHz. Similarly , ±6.4% is allotted for DC to 20 MHz at the die. It is expected that VCCIO
regulators meet ±1.5% at the remote sense location based on the general remote sense termination point location as described
in Figure 2-16 VR Sense Point (Representation). For future processor compatibility , it is strongly recommended that the platform
query the PIROM to assure VCCIO is set to the appropriate level prior to powering up the VCCIO supply.
8. All voltage regulation measurements taken at remote sense termination points.
9. For peak-to-peak Ripple and Noise (R&N) measured with full band width (BW) of the sc ope (Min 1 GHz BW scope is requir ed):
set scope diff probe an d the scope at full BW (capture waveform A, channel 1).
10.For peak-to-peak Ripple and Noise (R&N) measured above 1 MHz:
Step 1 = set both: scope diff probe and/or the scope at 1 MHz BW limit (capture waveform B, channel 2)
Step 2 = calculate A-B (use scope Math function: subtract channel 1 - channel 2).
Table 2-19. FMB 170W and 130W Current Specifications for the Intel® Itanium® Processor
9500 Series
SymbolParameterMaxMinUnitsNotes
I
CC_CORE
I
CC_CORE_TDC
I
CC_CORE_STEP
d
ICC_CORE/dt
I
CC_UNCORE
I
CC_UNCORE_TDC
I
CC_UNCORE_STEP
dI
CC_UNCORE/dt
I
CC_IO
d
ICC_IO/dt
I
CC_IO_STEP
T
CC_IO_STEP
I
CC_Analog
I
CC33_SM
1. Values per core pair.
2. ICC_CORE_TDC is the sustained (DC equivalent) current that the processor core is capable of drawing indefinitely and should be
used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for monitoring its
temperature and asserting the VR_FAN_N, VR_THERMALERT_N, VR_T HERMTRIP_N signals sequentially to inform the processor
and platform of a thermal excursion. Of the three signals, only VR_THERMALTERT_N is monitored by the processor. Please see
the Ararat II Voltage Regulator Module Design Guide for further details. The processor is capable of drawing ICC_CORE_TDC
indefinitely.
3. During system power on, the pulse inrush (ICC_CORE_STEP) can be as high as 35A peak-to-peak.
4. ICC_UNCORE_TDC is the sustained (DC equivalent) current that the processor uncore is capable of drawing indefinitely and
should be used for the Ararat voltage regulator temperature assessment. The Ararat voltage regulator is responsible for
monitoring its temperature and asserting the VR_FAN_N, VR_THERMALERT_N, VR_THERMTRIP_N signals sequentially to inform
the processor and platform of a thermal excursion. Of the three signals, only VR_THERMAL TERT_N is monitored by the processor.
Please see the Ararat II Voltage Regulator Module Design Guide for further details. The processor is capable of drawing
ICC_UNCORE_TDC indefinitely. This parameter is based on design characterization and is not tested.
5. During system power on, the pulse inrush (ICC_UNCORE_STEP) can be as high as 40A peak-to-peak.
6. The ICC_IO current specification applies to the total current from VCCIO pins.
7. The max load step represents the maximum current required during Intel
between steps represents the time between Intel
I
for core3 5.0A1
CC
Thermal Design Current for Core30.0A1, 2
Max Load step for core14.62A1, 3
Slew rate for core at Ararat output34.4A/us
1
ICC for uncore80.0A
Thermal Design Current for Uncore75.0A4
Max Load step for uncore30.4A5
Slew rate for uncore at Ararat output168.0A/us
I
for processor I/O17.2A6
CC
Slew rate for IO at the package pin54.0A/us
Max Load step for max slew rate5.1A7
Time between steps4.7us
7
ICC for processor Analog4A
I
for main supply200mA
CC33
®
®
QPI and Intel® SMI initialization.
QPI and Intel® SMI port initialization. The min time
2.6.3Intel® Itanium® Processor 9300 Series Uncore, Core, and
Cache Tolerances
2.6.3.1Uncore Static and Transient Tolerances
Table 2-20 and Figure 2-10 specify static and transient tolerances for the uncore
outputs.
44Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
VccUNCORE Tolerance Bands
-0.24
-0.22
-0.20
-0.18
-0.16
-0.14
-0.12
-0.10
-0.08
-0.06
-0.04
-0.02
0.00
05101520253035404550
Icc (A)
Normal iz ed Vcc (V )
AC max (V)
DC max (V)
Typical Vcc (V)
DC min (V)
AC min (V)
Table 2-20. V
CC
UNCORE
Series
Uncore
Current (A)
I
CC_UNCORE
Static and Transient Tolerance for Intel® Itanium® Processor 9300
2.This table is intended to aid in reading discrete points on Figure 2-10.
3.The load lines specify voltage limits at the die measured at the V
Voltage regulation feedback for voltage regulator circuits must be taken from processor V
Refer to the Ararat Voltage Regulator Module Design Guide for socket load line guidelines and VR
implementation.
2.This table is intended to aid in reading discrete points on
3.The load lines specify voltage limits at the die measured at the V
4.V
CC
Series
Static and Transient Tolerance for Intel® Itanium® Processor 9300
CORE
Core Current (A)Voltage Deviation from VID Setting (V)1,2,3,4
I
CC_CORE
170VID - 0.145VID - 0.165VID - 0.185
175VID - 0.149VID - 0.169VID - 0.189
180
and V
CC_MIN
Voltage regulation feedback for voltage regulator circuits must be taken from processor V
Refer to the Ararat Voltage Regulator Module Design Guide for socket load line guidelines and VR
implementation.
2.This table is intended to aid in reading discrete points o
3.The load lines specify voltage limits at the die measured at the V
Voltage regulation feedback for voltage regulator circuits must be taken from processor V
Refer to the Ararat Vo ltage Regulator Module Design Guide for socket load line guidelines and VR
implementation.
2. This table is intended to aid in reading discrete points on Figure 2-14.
3. The load lines specify voltage limits at the die measured at the VCCUNCORESENSE and VSSUNCORESENSE
pins. Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS
pins. Refer to the Ararat II Voltage Regulator Module Design Guide for socket load line guidelines and VR
implementation.
4. V
DC
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet49
Static and Transient Tolerance for the Intel® Itanium® Processor
Load Line for the Intel® Itanium® Processor 9500 Series
2.6.4.2Core Static and Transient Tolerances
Table 2-24 and Figure 2-15 specify static and transient tolerances for the core outputs.
50Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
VccCore[1-4] Toler ance Band
-0.11
-0.1
-0.09
-0.08
-0.07
-0.06
-0.05
-0.04
-0.03
-0.02
-0.01
0
0.01
0.02
051015202530354045
IccCor e (A)
Normalized VccCore (V)
VccCore ACMax (V)
VccCore DCMax (V)
Nor malized VccCore (V)
VccCore DCMin (V)
VccCore ACMin (V)
Table 2-24. V
Figure 2-15. V
CC
9500 Series
1. The V
2. This table is intended to aid in reading discrete points on Figure 2-15.
3. The load lines specify voltage limits at the die measured at the VCCCORESENSE and VSSCOR ESENSE pins.
Voltage regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS pins.
Refer to the Ararat II Voltage Regulator Module Design Guide for socket load line guidelines and VR
implementation.
4. V
CC
Static and Transient Tolerance for the Intel® Itanium® Processor
CORE
Core Current (A)Voltage Deviation from VID Setting (V)1,2,3,4
Load Line for the Intel® Itanium® Processor 9500 Series
CORE
load lines represent static and transient limits.
CC_MAX
V
CC_Max
V
CC_Typ
V
CC_Min
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet51
Electrical Specifications
2.6.5Overshoot and Undershoot Guidelines
Overshoot (or undershoot) is the value of the maximum voltage above or below VSS.
The overshoot and undershoot specifications limit transitions beyond VCCIO or VSS due
to the fast signal edge rates. The processor can be damaged by single and/or repeated
overshoot or undershoot events on any input, output, or I/O buffer if the charge is
large enough (that is, if the overshoot or undershoot is great enough). Determining the
impact of an overshoot or undershoot condition requires knowledge of the magnitude,
the pulse duration, and the activity factor (AF). Permanent damage to the processor is
the likely result of excessive overshoot or undershoot.
2.6.5.1Overshoot/Undershoot Ma gnitude, Pulse Duration and Activity Factor
Magnitude describes the maximum potential difference between a signal and its voltage
reference level. For the Intel® Itanium® Processor 9300 Series and Intel® Itanium®
Processor 9500 Series, both are referenced to VSS. It is important to note that
overshoot and undershoot conditions are separate and their impact must be
determined independently.
Pulse duration describes the total amount of time that an overshoot or undershoot
event exceeds the overshoot or undershoot reference voltage. Activity factor (AF)
describes the frequency of overshoot or undershoot occurrence relative to a clock.
Since the highest frequency of assertion of a single-ended signal is every other clock,
an AF = 1 indicates that the specific overshoot or undershoot waveform occurs every
other clock cycle. Thus, an AF = 0.01 indicates that the specific overshoot or
undershoot waveform occurs one time in every 200 clock cycles. The highest frequency
of assertion of any differential signal is every active edge of its associated clock (not
the reference clock). So, an AF = 1 indicates that the specific overshoot or undershoot
waveform occurs every cycle.
2.6.5.2Overshoot/Undershoot Specifications
The overshoot and undershoot specifications listed in the following table specify the
allowable overshoot or undershoot for a single overshoot or undershoot event.
Table 2-25 specifies the maximum overshoot and undershoot for the Intel® Itanium®
Processor 9300 Series, while Table 2-26 specifies the maximum overshoot and undershoot for the Intel
single ended and the differential signalling pins. The overshoot and undershoot values
assume an activity factor of 100% and a pulse width of 25% over the signal pulse
width. The tables also include the absolute maximum and minimum values beyond
which the processor is not guaranteed to operate properly. These values assume a
pulse width of 1% and an activity factor of 100%.
2.6.5.2.1Overs hoot and Un de rshoot Specifications for the Intel
9300 Series
Table 2-25. Overshoot and Undershoot Specifications For Differential
Intel
®
QuickPath Interconnect and Intel® SMI and Single-Ended Signals
for the Intel
SymbolParameterMinMaxUnit
V
MAX-OS-SE
V
MIN-US-SE
V
ABSMAX-OS-SE
V
ABSMIN-US-SE
®
Itanium® Processor 9500 Series, respectively, identifying both the
®
Itanium® Processor
®
Itanium® Processor 9300 Series (Sheet 1 of 2)
Overshoot for single-ended signals1.45V
Undershoot for single-ended signals-0.247V
Absolute Max for single-ended signals1.6V
Absolute Min for single-ended signals-0.425V
52Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
Table 2-25. Overshoot and Undershoot Specifications For Differential
®
Intel
for the Intel
QuickPath Interconnect and Intel® SMI and Single-Ended Signals
SymbolParameterMinMaxUnit
V
MAX-OS-DIFF
V
MAX-US-DIFF
V
ABSMAX-OS-DIFF
V
ABSMAX-US-DIFF
V
MAX_OS_SYSCLK
V
MIN_US_SYSCLK
®
Itanium® Processor 9300 Series (Sheet 2 of 2)
Overshoot for Intel® QPI and Intel® SMI
signals
Undershoot for Intel® QPI and Intel® SMI
signals
Absolute Max for Intel® QPI and Intel®
SMI signals
Absolute Min for Intel® QPI and Intel® SMI
signals
Sysclk single-ended maximum voltage1.54V
Sysclk single-ended minimum voltage-0.337V
-0.337V
-0.525V
1.54V
1.7V
2.6.5.2.2Overshoot and Undershoot Specifications for the Intel® Itanium® Processor
9500 Series
Table 2-26. Overshoot and Undershoot Specifications For Differential
®
Intel
Signals for the Intel
QuickPath Interconnect and Intel® SMI and Single-Ended
SymbolParameterMinMaxUnit
V
MAX-OS-SE
V
MIN-US-SE
V
ABSMAX-OS-SE
V
ABSMIN-US-SE
V
MAX-OS-DIFF
V
MAX-US-DIFF
V
ABSMAX-OS-DIFF
V
ABSMAX-US-DIFF
V
MAX_OS_SYSCLK
V
MIN_US_SYSCLK
®
Itanium® Processor 9500 Series
Overshoot for single-ended signals1.36V
Undershoot for single-ended signals-0.22V
Absolute Max for single-ended signals1.46V
Absolute Min for single-ended signals-0.32V
Overshoot for Intel® QPI and Intel® SMI
signals
Undershoot for Intel® QPI and Intel®
SMI signals
Absolute Max for Intel® QPI and Intel®
SMI signals
Absolute Min for Intel® QPI and Intel®
SMI signals
Sysclk single-ended maximum voltage1.3V
Sysclk single-ended minimum voltage-0.3V
-0.3V
-0.4V
1.3V
1.4V
2.6.6Signal DC Specifications
Table 2-27through Table 2-35state the DC specifications for the single-ended signal
groups defined in Table 2-2.
Table 2-27. Voltage Regulator Signal Group DC Specifications
SymbolParameterMinMaxUnitNotes
V
IL
V
IH
V
OH
V
OL
1. Open collector and drain outputs need pull-up resistors on the motherboard.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet53
Input Low Voltage00.4V
Input High Voltage0.83.6V
Output High Voltage0.83.6V1, 2, 3, 4, 5
Output Low Voltage00.4V1, 2, 3, 4, 5
2. These outputs can be pulled up to VCCIO or VCC_STDBY on the platform.
Notes:
Notes:
Notes:
3. Pull-up resistance should limit current to 2 mA.
4. Actual V
5. These values are based on 2.2 KΩ pull-up to 3 .3 V supply.
and VOL levels are determined by pull-up resistance and supply voltage values.
OH
Table 2-28. Voltage Regulator Control Group DC Specification
SymbolParameterMinMaxUnitNotes
V
IL
V
IH
V
OH
V
OL
1. Open collector and drain outputs need pull-up resistors on the motherboard.
2. Actual V
Voltage Regulator Module Design Guide or the Ararat II Voltage Regulator Module Design Guide for I
3. See Intel
resistor values.
4. VR_THERMALERT_N is an input to the top of the package and an output from the bottom of the package. V
and V
output levels on the package pins at the bottom of the package.
Input Low Voltage0(VCCIO*0.67) - 0.2V
Input High Voltage(VCCIO*0.67) + 0.2VCCIOV
Output High VoltageV1, 2, 3, 4
Output Low VoltageV
and VOL levels determined by pull-up resistance and supply voltage value. Refer to the Ararat
OH
®
Itanium® 9300 Series and Intel® Itanium® 9500 Series Platform Design Guide for recommended
levels are for the input at the top of the package, sensed by the processor; VOH and VOL are for the
IL
Table 2-29. TAP and System Management Group DC Specifications
Electrical Specifications
1, 2, 3, 4
max.
OL
IH
SymbolParameterMinMaxUnitNotes
V
IL
V
IH
V
OH
V
OL
I
OL
I
ILeak
I
OLeak
1. With 50 W termination to VCCIO at the far end.
2. With V at the pin at 1.1 V and 0 V. System designers are advised to check the tolerance of their voltage
regulator solutions to ensure V at the pin is 1.1 V.
3. Internal weak pull-up included for TCLK.
4. Internal weak pull-up included for TRST_N, TMS and TDI.
Input Low Voltage0(VCCIO*0.5) - 0.2V
Input High Voltage(VCCIO*0.5) + 0.2VCCIOV
Output High VoltageVCCIO-0.2VCCIOV
Output Low Voltage00.25V
Output Low Current1623mA1
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
Notes:
Notes:
2. With input leakage current measured at the pin with 0V and with 1.1 V supplied to the pin. System designer s
are advised to check the tolerance of their voltage regulator solutions to ensure a voltage of 1.1 V at the pin.
2.6.6.1VID_VCCCORE, VID_VCCUNCORE, and VID_VCCCACHE DC
Specifications for the Intel
®
Itanium® Processor 9300 Series
The Intel® Itanium® Processor 9300 Series processor supplies top side VID signal pins
to the Arafat Voltage Regulator Module, as shown in Table 2-31.
Table 2-31. VID_VCCCORE[6:0], VID_VC CUNCORE[6:0] and VID_VCCCACHE[5 :0] DC
Specifications for the Intel
SymbolParameterMinMaxUnitNotes
V
OH
V
OL
I
OLeak
1. These parameters are not tested and are based on design simulations.
2. Leakage to VSS with pin held at 1.1 V and leakage to 1.1 V with pin held at VSS.
2.6.6.2SVID Group DC Specifications for the Intel® Itanium® Processor 9500
Series
The Intel® Itanium® Processor 9500 Series implements a Serial VID BUS that is used
to transfer power management information between the microprocessor and the five
output voltages. Voltage levels are compliant to the VR12.0 1V TTL signaling
requirements and are shown in Table 2-32.
Table 2-32. SVID Group DC Specifications for the Intel® Itanium® Processor 9500 Series
SymbolParameterMinMaxUnitNotes
V
IL
V
IH
V
OH
V
OL
I
OL
I
ILeak
I
OLeak
1. With 50W termination to VCCIO at the far end.
2. With input leakage current measured at the pin with 0V and with 1.075V supplied to the pin. System designers
are advised to check the tolerance of their voltage regulator solutions to ensure Vpin of 1.1 V.
Input Low Voltage0(VCCIO*0.5) - 0.2V
Input High Voltage(VCCIO*0.5) + 0.2VCCIOV
Output High VoltageVCCIO-0.2VCCIOV
Output Low Voltage00.25V
Output Low Current1623mA1
1. VIL(min) and VIH(max) are reference only and are not tested.
2. Applicable over recommended operating range T = -40 °C to +88 °C; Vcc = +1.7 V to +3.6 V.
56Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
FBD pins
VR Sense point
FBD pins
VR Sense point
2.6.7Motherboard-Socket Specification for VR Sense Point
Figure 2-16. VR Sense Point (Representation)
Note:±1.5% DC (DC to 1 MHz) and ±1% AC (1 MHz to 20 MHz) specified at MB/socket.
2.7Core and Uncore Voltage Identification
The VID_VCCCORE[6:0] and VID_VCCUNCORE[6:0] lands supply the encoding that
determine the voltage to be supplied by the VCCCORE and VCCUNCORE voltage
regulators. The VID_VCCCORE and VID_VCCUNCORE specifications for the Intel®
Itanium
Voltage Regulator Module Design Guide and Ararat II Voltage Regulator Module
Design Guide, respectively. The voltage set by the VID_VCCCORE and
VID_VCCUNCORE lands are the maximum VCCCORE and VCCUNCORE voltage allowed
by the processor.
Individual processor VID_VCCCORE and VID_VCCUNCORE values may be calibrated
during manufacturing such that two devices at the same core speed may have different
default VID_VCCCORE and VID_VCCUNCORE settings. Furthermore, any Intel
Itanium
different VID_VCCCORE and VID_VCCUNCORE settings during normal operation.
Table 2-36 and Table 2-37 specify the voltage levels corresponding to the state of
VID_VCCCORE and VID_VCCUNCORE for the Intel
and Intel
high voltage level and a ‘0’ refers to a low voltage level.
The Intel
provide the ability to operate while transitioning to an adjacent VID and its associated
processor core voltage (VCCCORE). This will represent a DC shift in the load line. It
should be noted that a low-to-high or high-to-low voltage state change may result in
many VID transitions as necessary to reach the target core voltage. Transitions above
the specified VID are not permitted.
®
Processor 9300 Series and 9500 Series are defined in the Ararat 170 Watt
®
Processor 9300 Series and Intel® Itanium® Processor 9500 Series can drive
®
®
Itanium® Processor 9500 Series respectively. A ‘1’ in this table refers to a
®
Itanium® Processor 9300 Series and Intel® Itanium® Processor 9500 Series
Itanium® Processor 9300 Series
®
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet57
The Ararat voltage regulator must be capable of regulating its output to the value
defined by the new VID. Please refer to the Ararat 170 Watt Voltage Regulator Module
®
Design Guide for the Intel
Voltage Regulator Module Design Guide for the Intel
Itanium® Processor 9300 Series processor or the Ararat II
®
Itanium® Processor 9500 Series.
Electrical Specifications
2.7.1Core and Uncore Voltage Identification for the Intel®
Itanium® Processor 9300 Series
Table 2-36. Intel® Itanium® Processor 9300 Series VCCCORE (VID_VCCCORE) and
VCCUNCORE and (VID_VCCUNCORE) Voltage Identification Definition for
Ararat (Sheet 1 of 2)
2.8Cache Voltage Identification (Intel® Itanium®
Processor 9300 Series only)
The Cache Voltage Identification (CVID) value supplies the voltage for VCCCACHE, the
L3 cache voltage for the Intel
specification for the processor is supported by the Ararat I Regulator Module Design Guide. The voltage set by the VID_VCCCACHE value is the maximum VCCCACHE
voltage allowed by the processor.
Individual processor CVID values may be calibrated during manufacturing such that
two devices at the same core speed may have different default VID_VCCCACHE
settings.
62Intel
®
Itanium® Processor 9300 Series. The VID_VCCCACHE
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
The processor uses the VID_VCCCACHE value to support automatic selection of the
power supply voltages. Table 2-38 specifies the voltage level corresponding to the state
of VID_VCCCACHE. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to a
low voltage level. See the Ararat I Regulator Module Design Guide for more details.
Table 2-38. Cache (VID_VCCCACHE) Voltage Identification Definition for Ararat
All RSVD (RESERVED) pins must be left unconnected. Connection of these pins to
power, VSS, or to any other signal (including each other) can result in component
malfunction or incompatibility with future processors.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet63
Electrical Specifications
For reliable operation, always terminate unused inputs or bi-directional signals to their
respective deasserted states. A resistor must be used when tying bi-directional signals
®
to power or ground, also allowing for system testability. Unused pins of Intel
QuickPath Interconnect and FB-DIMM ports may be left as no-connects since
termination is provided on the processor silicon.
Unused outputs may be terminated on the system board or left connected. Note that
leaving unused outputs unterminated may interfere with some Test Access Port (TAP)
functions, complicate debug probing, and prevent boundary scan testing. Signal
®
termination for these signal types is discussed in latest revisions of Intel
Itanium®
Processor 9300 Series and Intel® Itanium® Processor 9500 Series Platform Design
Guide.
Debug pins have ODT and can be left as no-connects. Their routing guidelines are
®
provided in the Intel
Itanium® Processor 9300 Series and Intel® Itanium® Processor
9500 Series Platform Design Guide.
2.10Mixing Processors
Intel will support mixing CPUs in the same system or hard partition as defined below. A
hard partition is a smaller system capable of booting an OS, consisting of one or more
processors, memory and I/O controller hubs that are formed by domain partitioning.
1. CPUs from adjacent steppings. For example if one cpu is from stepping N, and
another cpu is from the next stepping, N+1, then CPU
Similarly CPU
is not compatible with CPU
N
N+2
.
and CPU
N
2. All CPUs in the system or hard partition must have the same core clock speed or
speed range and the same cache size.
®
3. All Intel
QPI links must have the same data rate, except for Intel® QPI links which
are disabled or in slow mode.
®
Additionally, for the Intel
Itanium® Processor 9300 Series:
4. If variable frequency mode (VFM) is enabled in one CPU it must be enabled in all
CPUs. If VFM mode is disabled in one CPU it must be disabled in all CPUs.
5. Mixing an enabled VFM part with an fixed frequency mode (FFM) part within the
same system or hard partition.
2.11Supported Power-up Voltage Sequence
are compatible.
N+1
The supported order of voltage sequencing for the processor, detailed in Figure 2-17
and Figure 2-18 and Table 2-39, is VCC33_SM, VccArarat(12V), VCCA, VCCIO,
VCCUNCORE and VCCCORE for the Intel
and followed by VCCCACHE for the Intel
customers need to apply VccArarat(12V) before VCC33_SM, the processor will not
sustain damage. The application of VCC33_SM before VccArarat(12V) allows the PIROM
to be read before the processor is powered.
Once started, the power up sequence must complete within 1000 ms, as defined by the
time limit for PWRGOOD to be asserted. VCC33_SM is brought up first to allow
platforms to read the socket Processor Information data and the PROCTYPE pin.
VccArarat (12V) is the input voltage to the Arar at regulator. The VCCA supply is used to
power the processor’s analog circuits. VCCIO is used to power the I/O circuits. Once
VCCIO is up and stable the external environment can generate the SYSINT clock
signals. Once the SYSINT clocks are valid, the external environment can assert the
64Intel
®
Itanium® Processor 9500 Series processor
®
Itanium® Processor 9300 Series processor . If
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
VROUTPUT_ENABLE0 signal. After VROUTPUT_ENABLE0 is asserted the sequence of
powering up the VCCUNCORE and VCCCORE supplies and the VCCCACHE (Inte l®
Itanium
For the Intel® Itanium® Processor 9300 Series, the VCCUNCORE, VCCCORE and
VCCCACHE supplies power the sysint, cores and large cache arrays respectively.
For the Intel
supplies power the sysint, the cores and the large cache arrays respectively.
When all supplies are up and stable, Ararat asserts VRPWRGD which signals the
external environment that it can assert the PWRGOOD signal. PWRGOOD assertion
initiates the processor internal cold reset sequence.
With reference to the power sequencing timing requirements imposed by the Ararat VR
as shown in Figure 2-17 and Figure 2-18, timing specifications for the elapsed time
taken for an Ararat regulator to bring up each of its output voltages can be found in the
Ararat 170 Watt Voltage Regulator Module Design Guide for the Intel
Processor 9300 Series and the Ararat II Voltage Regulator Module Design Guide for the
Intel® Itanium® Processor 9500 Series.
When the platform asserts PWRGOOD to the processor, the Intel® Itanium® Processor
9300 Series requires a minimum of 10 ms to complete its internal reset sequence
before deasserting RESET_N, while the Intel® Itanium® Processor 9500 Series
requires a minimum of 15 ms. For platforms that use both processors, a minimum of
15 ms is needed to meet the requirements of both processors.
®
Processor 9300 Series) begins.
®
Itanium® Processor 9500 Series, the VCCUNCORE and VCCCORE
®
Itanium®
During platform initialization, the RESET_N pin to any component in the platform can
be removed ONLY after all other components have had sufficient time to sample their
respective reset pins. This is needed to prevent unknown behavior that may result if
any one system component comes out of reset before other components have received
the reset signal.
With the exception of standby miscellaneous pins, all input pins, bi-directional pins, and
terminated output pins must not be allowed to exceed the processor's actual VCCIO
voltage prior to and during ramp up of the VCCIO supply.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet65
Electrical Specifications
VCC33_SM (3.3v)
PROCTYPE
VCCIO
VCCA (1.8V)
VccArarat (12V)
>= 0us
VROUTPUT_ENABLE0
RESET_N
PWRGOOD
VCCCORE
VCCCACHE
VCCUNCORE
VCCUNCORE VID Value
VCCCORE VID Value
VCCCACHE VID Value
VRPWRGD
>0us
SYSCLK (133MHz)
<= 1000mS
>=10ms
Core and Cache Vids
may change to vfus e values
Core Vi d may
change in response
to power manager
>0us
>0us
>0us
>0us
>0us
>0us
>100ms *
>1uS
>1us *
>0us
>0us
>0us
Uncore Vid may
change to on-di e
fuse based value
> 200 ms*
>1
us *
pulled to VSS on package f or Intel® Itanium® processor 9300 series (VCC33_SM for other products)
>0uS
>0us
pulled to VSS on package for Intel® Itanium® processor 9300 series (VCC33_S M for other products)
* Nominal value; refer to Ararat Spec for actual number
VR_PROCTYPE[1:0]
>=0us
uncore fuse valuevfuse valueVids = 0x29 (1. 1V)
> 0us
2.11.1Supported Power-up Voltage Sequence for the Intel®
Itanium® Processor 9300 Series
Figure 2-17. Supported Power-up Voltage Sequence Timing Requirements for the
Intel® Itanium® Processor 9300 Series
66Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
VCCSTBY33
(3.3V)
PROCTYPE
VCCIO
VCCA
(1.8V)
VCC (12V)
>= 0us
VROUTPUT_ENABLE0
RESET_N
PWRGOOD
VCCCORE[1- 4]
VCCUNCORE
SVID
VR_READY
1V
Vstr ap
V=hfuse
>0us
SYSCLK
(133MHz)
> 0us
VR_PROCTYPE
Pulled to 3.3VSM pin on platform
Pulled to Ararat’ s internal 3.3V rai l on Ararat it self
≥15ms
>= 0us
svid changes
to vfuse
values
svid_vcccore
may change in
response to
power
manager
VCCVUNCOREREADY
svids change
to hfuse val ues
Vhfu se
0.9V
Pwrgd reset can change core VR set
V=vf use
<=1000ms
>0us
> 0us
> 100ms
> 1 ms
All i nputs low prior to VCCIO
<200ms
Electrical Specifications
2.11.2Supported Power-up Voltage Sequence for the Intel®
Itanium® Processor 9500 Series
Figure 2-18. Supported Power-up Sequence Timing Requirements for Intel® Itanium®
Processor 9500 Series
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet67
Electrical Specifications
2.11.3Power-up Voltage Sequence Timing Requirements
Table 2-39. Power-up Voltage Sequence Timing Requirements
ParameterMinMaxUnit
VCC33_SM stable high to VCCA delay>0
VCCA to VCCIO delay time 0μs
VCCIO to PWRGOOD high delay time 1000ms
VCCIO stable high to SYSCLK >0μs
SYSCLK valid before VROUTPUTENABLE0 high >0μs
VCCIO stable before VROUTPUT_ENABLE0 high for Intel
®
Itanium
VCCIO stable before VROUTPUT_ENABLE0 high for Intel
Itanium
VROUTPUT_ENABLE0 high to VRPWRGOOD high for Intel
Itanium
VROUTPUT_ENABLE0 high to VR_READY for Intel
Processor 9500 Series
Processor 9300 Series
®
Processor 9500 Series
®
Processor 9300 Series
2
VCCUNCORE time to stabilize
1
2
1
1
Delay from VCCUNCORE at programmed VID value to VCCCORE
VCCCORE steady at safe VID value
1
VCCCORE transition time from safe VID to programmed VID
Delay from VCCCORE/VCCUNCORE/VCCCACHE at programmed
values to VRPWRGOOD high for Intel
1
Series
VRPWRGD high to PWRGOOD high for Intel® Intel
Processor 9300 Series
VR_READY high to PWRGOOD high for Intel
®
Itanium® Processor 9300
®
Itanium® Processor
9500 Series
PWRGOOD high to RESET_N high (t
Processor 9300 Series
PWRGOOD high to RESET_N high (t
Processor 9500 Series
) Intel® Itanium®
RESET_N
) Intel® Itanium®
RESET_N
®
®
®
Itanium®
®
Itanium®
®
>1μs
>1ms
200ms
200ms
15ms
1
0.058ms
0.053ms
1
2.5
0.053
>0ms
>0ms
10ms
15ms
2.12Supported Power-down Voltage Sequence
The supported power down sequence of voltage for the processor is detailed in
Figure 2-19. It should be noted that when the processor is required to be physically
removed from its socket, power rails VCC33_SM and Vcc(12V) must also be powered
down before removal of the processor.
68Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Electrical Specifications
RESET_N
PWGOOD
VR_OUTPUT_EN
(133 MHz)
VIDs
VCCCORE
VCCUNCORE
VCCA
VCCCACHE
REFCLK
VCCIO
t
RESET_N
A s fast as p o s s ib le
All supplies to power down as fast as
Possible after PW RGO O D deassertion
> 1us
> 0us
VCCA MUST UNPOWER ALONG WITH VCCIO
t
RESET_N
= 10ms for Intel Itanium 9300 Series Processor
= 15m s fo r P oulso n -M C P ro c e s sor
> =0us
All signal inputs on VCCIO plane can power down with VCCIO
change to safe VID
Figure 2-19. Supported Power-down Voltage Sequence Timing Requirements
2.13Timing Relationship Between RESET_N and SKTID
In the processor, the SKTID pins are time-shared:
SKTID[0] is interpreted as a NodeID bit during cold reset and pwrgood reset. It is
interpreted as the error reset modifier during warm-logic reset if SKTID[0] is asserted.
SKTID[2] is interpreted as a NodeID bit during cold reset and pwrgood reset, and it is
interpreted as an error input being signaled by the system at all other times (except
during non-cold resets when it is ignored). Figure 2-20 and Table 2-40 show the timing
relationship between RESET_N and SKTID pins for different reset cases.
The LRGSCLSYS pin is sampled only during the PWRGOOD and cold reset period.
The BOOTMODE[2:0] and FLASHROM_CFG[1:0] pins are sampled during the assertion
of all resets except warm-logic resets.
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet69
Figure 2-20. RESET_N and SKITID Timing for Warm and Cold Resets
BOOTMODE[2:0]
FLASHROM
_CFG
[1:0]
PWRGOOD
RESET_N
SKTID[1:0 ]
T2
T
5
T4
SKTID[2]
LRGSCLSYS
socket id
Error Reset
(Warm-Logic) if
SKTID [0]==1
socket id
error_in
strap value
T9
T7
T8
T 11
T 13
T 13
T10
(PWR CYCLE OR PWRGOOD)
COLD RESET
WARM-
STATE OR WARM-
LOGIC RESETS
T12
T 14
strap values strap values
T1
T6
T3 T3
SYSCLK
Electrical Specifications
Table 2-40. RESET_N and SKTID Timing (Sheet 1 of 2)
SKTID[2:0] (as socket id), LRGSCLSYS hold
after RESET_N deasserted
SKTID[1:0] (as rst modifier) setup to RESET_N
asserted
SKTID[1:0] (as rst modifier) hold after RESET_N
asserted
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
0200ns
10ms
15ms
500ps
8
10ms
15ms
0ns
0ns
0ns
200ns
200ns
SYSCLK
cycles
Electrical Specifications
Table 2-40. RESET_N and SKTID Timing (Sheet 2 of 2)
ParameterDescriptionMINMAXUNIT
T11
T12
T13
T14
RESET_N deasserted delay to SKTID[2]
deasserted (as error in)
SKTID[2] (as error in) asserted pulse width
BOOTMODE[2:0], FLASHROM_CFG[1:0] hold
after RESET_N deasserted
BOOTMODE[2:)], FLASHROM_CFG[1:0] setup to
RESET_N asserted
3
1us
0ns
2.14Test Access Port (TAP) Connection
The recommended TAP connectivity is detailed in the Intel® Itanium® Platform Debug
Port Design Guide (DPDG).
§
100ns
SYSCLK
cycles
Intel® Itanium® Processor 9300 Series and 9500 Series Datasheet71
Electrical Specifications
72Intel
®
Itanium® Processor 9300 Series and 9500 Series Datasheet
Pin Listing
3Pin Listing
3.1Processor Package Bottom Pin Assignments
This section provides a sorted package bottom pin list in Table 3-1 and Table 3-2.
Table 3-1 is a listing of all processor package bottom side pins ordered alphabetically
by pin name. Table 3-2 is a listing of all processor package bottom side pins ordered by
pin number. All pins are defined for both Intel
Intel® Itanium® Processor 9500 Series except where noted.