Intel DX79TO Specification

Intel® Desktop Board DX79TO

Technical Product Specification

June 2012

Order Number: G44010-003

The Intel® Desktop Board DX79TO may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DX79TO Specification Update.

Revision History

Revision Revision History Date

-001 First release o f the Intel® Desktop Board DX79TO Technical Product Specification

-002 Specification Chang e s January 2012

-003 Specification Clarification June 2012

This product spec ification applies to only the standard In te l® Desktop Board DX79TO with BIOS identifier SIX7910J.86A.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, A ND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATI NG TO FI TNESS FOR A PARTIC U LA R PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, CO PY R IGHT OR OTHER INTELLECTUA L PROPERTY RIGHT. UN LESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJUR Y O R DEATH MAY OCCUR.

All Intel computers (PC) fo r installation in homes, offices, schools, co mputer rooms, and si mila r locations. The suitability of this pr o duct for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, e tc . may not be supporte d without further eva luation by Intel.

Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other intellectual proper ty rights that relate to the p resented subject matte r. The furnishing of d ocuments and other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise, to any such patents, trad e ma r ks, copyrights, or other intellectual property rights.

Intel may make change s to specifications and p roduct descrip tions at any time, without notice. Designers must not rely on the absence o r characteristics o f any features or ins tr uc ti o ns ma r ked “reserved”

or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for conflicts or inco mpatibilities arising from future changes to the m .

Intel desktop boards may contain design defects or errors known as errata, which may cause the prod uc t to deviate from p ub lis he d specifications. C ur rent characterized errata are available o n request.

Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our product order.

Intel, Intel Core, and Xeon are trademark s o f Intel Corpo r a tio n in the U.S. and/or other c o untries. * Other names and b rands may be claimed a s the property of others. Copyright  2011-2012 Intel Corpor ation. All rights reser v e d.

desktop boa r ds are evaluated as Information Techno logy Equipment (I.T.E.) f or use in personal

November 2011

Board Identification Information

Basic Desktop Board DX79TO Identification Information

AA Revision BIOS Revision Notes

G28805-400 SIX7910J.86A.0281 1,2 Notes:

1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.

2. The X79 PCH used on this A A revision consists of the following c o m p onent:

Device Stepping S-Spec Numbers

82X79 PCH C0 SLJHW

Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel

Desktop Board DX79TO.

Table 1. Specification Changes or Clarifications

Date Type of Change Description of Changes or C larifications

January 2012 Spec Change Added Section 1.12.2.10 Power S upervisor June 2012 Spec Clarification Corrected the order of items in Table 10

Errata

Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.

iii

Intel Desktop Board DX79TO T echnical Product Spec ification

The features supported by the BIOS Setup program

Preface

This Technical Product Specification (TPS) specifies the board layo ut, components, connectors, power and environmental requirements, and the BIOS for the

Intel

Desktop Board DX79TO.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop Board DX79TO and its components to the v endors, system integrators, and other engineers and technicia ns who need this level of information. It is specifically not intended for general audiences.

What This Document Contai ns

Chapter Description

1 A description of the hardwar e used on the Intel Desktop Board DX79TO 2 A map of the resources of the Intel Desk top Board

4 A description of the BIOS er r or m es s a ges , beep codes, and POST codes 5 Regulatory compliance and battery disp os al information

Typographical Conventions

This section cont ains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings

NOTE

Notes call attentio n to important information.

CAUTION

Cautions are included to help you avoid damaging hardware or losing da ta.

Intel Desktop Board DX79TO T echnical Product Spec ification

Other Common Notation

# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#) GB Gigabyte (1,073,741,824 bytes) GB/s Gigabytes per second Gb/s Gigabits per second KB Kilobyte (1024 bytes) Kbit Kilo bit (1024 bits) kbits/s 1000 bits per second MB Megabyte (1,048,576 bytes) MB/s Megabytes per second Mbit Megabit (1,048,576 bits) Mbits/s Megabits per second xxh An address or d ata v al ue ending with a lowercas e h ind ic a te s a he x a d e c im al v a lue . x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the p roperty of thei r

respective owners.

Contents

1 Product Description

1.1 Overview ......................................................................................... 11

1.1.1 Feature Summary ................................................................. 11

1.1.2 Board Layout ........................................................................ 13

1.1.3 Block Diagram ...................................................................... 15

1.2 Legacy Considerations ....................................................................... 16

1.3 Online Support ................................................................................. 16

1.4 Processor ........................................................................................ 16

1.4.1 PCI Express x16 Graphics ....................................................... 17

1.5 System Memory ............................................................................... 17

1.5.1 Memory Configurations .......................................................... 19

1.6 Intel

1.7 Real-Time Clock Subsyst em ............................................................... 23

1.8 Legacy I/O Controller ........................................................................ 23

1.9 Audio Subsystem .............................................................................. 24

1.10 LAN Subsystem ................................................................................ 26

1.11 Hardware Management Subsystem ..................................................... 28

1.12 Power Management .......................................................................... 30

1.13 Board Status LEDs ............................................................................ 37

1.14 Onboard Power and Reset Buttons ...................................................... 39

1.15 Trusted Platform Module (TPM) .......................................................... 40

X79 Express Chipset ................................................................ 21

1.6.1 USB ..................................................................................... 21

1.6.2 SATA Interfaces .................................................................... 21

1.8.1 Consumer Infrared (CIR) ........................................................ 23

1.9.1 Audio Subsystem Software ..................................................... 24

1.9.2 Audio Subsystem Components ................................................ 24

1.10.1 Intel

82579L Gigabit Ethernet Controller ................................. 26

1.10.2 LAN Subsystem Software ....................................................... 27

1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27

1.11.1 Hardware Monitoring and Fan Control ...................................... 28

1.11.2 Fan Monitoring ...................................................................... 28

1.11.3 Chassis Intrusion and Detection .............................................. 28

1.11.4 Thermal Monitoring ............................................................... 29

1.12.1 ACPI .................................................................................... 30

1.12.2 Hardware Support ................................................................. 33

vii

Intel Desktop Board DX79TO T echnical Product Spec ification

2 Technical Reference

2.1 Memory Resources ........................................................................... 41

2.1.1 Addressable Memory ............................................................. 41

2.1.2 Memory Map ......................................................................... 43

2.2 Connectors and Headers .................................................................... 43

2.2.1 Back Panel Connectors ........................................................... 44

2.2.2 Component-side Connectors and Headers................................. 46

2.3 Jumper Block ................................................................................... 55

2.4 Mechanical Considerations ................................................................. 57

2.4.1 Form Factor .......................................................................... 57

2.5 Electrical Considerations .................................................................... 58

2.5.1 Power Supply Considerations .................................................. 58

2.5.2 Fan Header Current Capability ................................................ 59

2.5.3 Add-in Board Considerations ................................................... 59

2.6 Thermal Considerations ..................................................................... 60

2.7 Reliability......................................................................................... 62

2.8 Environmental .................................................................................. 62

3 Overview of BIOS Features

3.1 Introduction ..................................................................................... 63

3.2 BIOS Flash Memory Organization ........................................................ 64

3.3 Resource Configuration ..................................................................... 64

3.3.1 PCI Autoconfiguration ............................................................ 64

3.4 System Management BIOS (SMBIOS) ................................................. 65

3.5 Legacy USB Support ......................................................................... 65

3.6 BIOS Updates .................................................................................. 66

3.6.1 Language Support ................................................................. 66

3.6.2 Custom Splash Scr een ........................................................... 67

3.7 BIOS Recovery ................................................................................. 67

3.8 Boot Options .................................................................................... 68

3.8.1 Optical Drive Boot ................................................................. 68

3.8.2 Network Boot ........................................................................ 68

3.8.3 Booting Without Attached Devices ........................................... 68

3.8.4 Changing the Default Boot Device During POST ......................... 68

3.9 Adjusting Boot Speed ........................................................................ 69

3.9.1 Peripheral Selection and Configuration ..................................... 69

3.9.2 BIOS Boot Optimizations ........................................................ 69

3.10 BIOS Security Features ..................................................................... 70

3.11 BIOS Performance Features ............................................................... 71

4 Error Messages and Beep Cod es

4.1 Speaker .......................................................................................... 73

4.2 BIOS Beep Codes ............................................................................. 73

4.3 Front-panel Power LED Blink Codes ..................................................... 74

4.4 BIOS Error Messages

4.5 Port 80h POST Codes ........................................................................ 75

viii

........................................................................ 74

Contents

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 81

5.1.1 Safety Standards................................................................... 81

5.1.2 European Union Declaration of Conformity Statement ................ 82

5.1.3 Product Ecology Statements ................................................... 83

5.1.4 EMC Regulations ................................................................... 85

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 88

5.1.6 Regulatory Compliance Marks (Board Level) ............................. 89

5.2 Battery Disposal Information .............................................................. 90

Figures

1. Major Board Components .................................................................. 13

2. Block Diagram .................................................................................. 15

3. Memory Channel and DIMM Configuration ............................................ 20

4. Back Panel Audio Connectors ............................................................. 25

5. LAN Connector LED Locations ............................................................. 27

6. Thermal Sensors and Fan Headers ...................................................... 29

7. Location of Board Status LEDs ............................................................ 37

8. Location of the Onboard Power and Reset Buttons ................................ 39

9. Detailed System Memory Address Map ................................................ 42

10. Back Panel Connectors ...................................................................... 44

11. I/O Shield Reference Diagram ............................................................ 45

12. Component-side Connectors and Headers ............................................ 46

13. Connection Diagram for Front Panel Header ......................................... 52

14. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54

15. Location of the Jumper Block ............................................................. 55

16. Board Dimensions ............................................................................. 57

17. Localized High Temperature Zones ..................................................... 61

Tables

1. Specification Changes or Clarifications ................................................... iii

2. Feature Summary ............................................................................. 11

3. Components Shown in Figure 1 .......................................................... 14

4. Supported Memory Configurations ...................................................... 18

5. Audio Jack Support ........................................................................... 24

6. LAN Connector LED States ................................................................. 27

7. Effects of Pressing the Power Switch ................................................... 30

8. Power States and Targeted System Power ........................................... 31

9. Wake-up Devices and Events ............................................................. 32

10. Board Status LEDs ............................................................................ 38

11. System Memory Map ........................................................................ 43

12. Component-side Connectors and Headers Shown in Figure 12 ................ 47

13.

Front Panel Audio Header for Intel HD Audio ........................................ 48

14. Front Panel Audio Header for AC ’97 Audio ........................................... 48

Intel Desktop Board DX79TO T echnical Product Spec ification

15. IEEE 1394a Header ........................................................................... 49

16. SATA Connectors .............................................................................. 49

17. USB 2.0 Headers .............................................................................. 49

18. Chassis Intrusion Header ................................................................... 49

19. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 49

20. Back Panel CIR Emitter (Output) Header ............................................. 50

21. Front Panel CIR Receiver (Input) Header ............................................. 50

22. Processor Core Power Connec t or ........................................................ 51

23. Main Power Connector ....................................................................... 51

24. Front Panel Header ........................................................................... 52

25. States for a One-Color Power LED ....................................................... 53

26. States for a Two-Color Power LED ...................................................... 53

27. BIOS Setup Configuration Jumper Settings .......................................... 56

28. Recommended Power Supply Current Values ........................................ 58

29. Fan Header Current Capability ............................................................ 59

30. Thermal Considerations for Components .............................................. 61

31. Environmental Specifications .............................................................. 62

32. BIOS Setup Program Menu Bar ........................................................... 64

33. BIOS Setup Program Function Keys .................................................... 64

34. Acceptable Drives/Media Types for BIOS Recovery ................................ 67

35. Boot Device Menu Options ................................................................. 68

36. Supervisor and User Password Functions ............................................. 70

37. BIOS Beep Codes ............................................................................. 73

38. Front-panel Power LED Blink Codes ..................................................... 74

39. BIOS Error Messages ........................................................................ 74

40. Port 80h POST Code Ranges .............................................................. 75

41. Port 80h POST Codes ........................................................................ 76

42. Typical Port 80h POST Sequence ........................................................ 80

43. Safety Standards .............................................................................. 81

44. EMC Regulations ............................................................................... 85

45. Regulatory Compliance Marks ............................................................ 89

Intel

X79 Express Chip s e t c onsisting of the Inte l® X79 Platform Controller

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 2 summarizes the major features of the board.

Table 2. Feature Summary

Form Factor Processor

Memory

Chipset

Audio Intel® High Definition Audio s ubsystem using the Realte k* ALC892 audio co d e c Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CI R ) Peripheral

Interfaces

ATX (12.00 inches b y 9.60 inches [30 4 .80 millimeters by 243.84 millimeters])

• Intel

• Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) so c kets

• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz,

• Support for 1 Gb, 2 Gb, and 4 Gb memory technology

• Support for up to 64 GB of system mem o ry with eight DIMMs us ing 4 Gb

• Support for non-ECC and ECC memory

• Support for 1.35 V low voltage JEDEC memory

• Support for XMP memory

• Support for manual memory ove r clocking (voltag e , cl o c k, ratio)

Hub (PCH)

• Two USB 3.0 ports are implemented with stacked back p ane l c onnectors

• Fourteen USB 2.0 ports:

• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the I nte l X79 Express

• Four internal SATA 3.0 Gb/s interfac e s through the Intel X79 Express Chipset

• Two IEEE 1394a ports:

Core™ i7 and I ntel® Xeon® processors in an LGA2011 socket:

― Two PCI Express 3.0 x16 graphics interfaces ― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)

arranged as fo ur channels

and 1066 MHz DIMMs

memory technolo g y

(blue)

― Six ports are implemented with stacked back panel connec to rs (black) ― Eight front panel ports implemented through four internal he ad e rs

Chipset with Intel

with Intel Rapid S to rage Technology RAID support (black)

― One port via a back panel connector ― One port via a fr ont-panel header (blue)

Rapid Storag e Te c hno l o gy RAID support (blue)

continued

Intel Desktop Board DX79TO T echnical Product Spec ification

Support for PC I* Local Bus Spec ification Revision 2.2

Table 2. Feature Summary (continued)

BIOS

Instantly Available PC Technology

LAN Support

Expansion Capabilities

Hardware Monitor Subsystem

• Intel

• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and

• Fast Boot

• Support for advanced over clocking

•

• Support for PCI Express * Revision 3.0

• Suspend to RAM support

• Wake on PCI, PCI Express, LAN, front panel, CIR, and US B ports

Gigabit (10/100/1000 Mbits/s) LAN s ub s ystem using the Intel Ethernet Controller

• Two PCI Express 3.0 x16 connectors

• Three PCI Express 2.0 x1 bus add-in card connectors f r om the PCH

• One Conventional PCI bus add-in card connector from the PC H

• Hardware monitoring and fan contro l through the Nuvoton I/O controller

• Voltage sense to detect out of range p ower supply voltages

• Thermal sense to detect out of range thermal values

• Four fan headers using PWM control

• Four fan sense inputs used to monitor fan activity

• Fan speed control using voltage co ntrol (4-pin fan headers for processor,

• Support for Platform Environme nta l C ontrol Interfac e (PEC I)

BIOS resid e nt in the S PI Flash device

Play, and SMBIOS

front, rear, and auxiliary) with selectable s up port in BIOS for 3 wire fans

82579L Gigabit

Product Description

1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DX79TO.

Figure 1. Major Board Components

Table 3 lists the components identified in Figure 1.

Intel Desktop Board DX79TO T echnical Product Spec ification

Label

Description

Front panel audio he ad e r

PCI Express x1 add-in card connecto r

Piezoelectric speaker

Conventional PCI add-in card connector

PCI Express 3.0 x16 add-in card connector

Rear chassis fan header

Battery

Processor fan header

DIMM 1 (Channel A, DIMM 0)

DIMM 5 (Channel B, DIMM 0)

DIMM 6 (Channel B, DIMM 1)

LGA2011 processor socket

12 V processor core voltage connector (2 x 4 pin)

DIMM 8 (Channel D, DIMM 1)

DIMM 4 (Channel C, DIMM 1)

DIMM 7 (Channel D, DIMM 0)

DIMM 3 (Channel C, DIMM 0)

Main power connector (2 x 12 pin)

Front chassis fan he ader

3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA conne c tors (blue)

Intel X79 Express Chipset

Front panel USB 2 .0 headers (4)

BIOS Setup co nfiguration jumper b lock

Power Fault LED

Alternate front pa ne l p ower LED header

Voltage measureme nt te s t p oints

Front panel header

Post Code LED dis p lay

Onboard Rese t b utton

Onboard Power button

Chassis intrusion heade r

Board Status LEDs

Table 3. Components Shown in Figure 1

G PCI Express x1 add-in card connecto r

K Back p anel connectors

O DIMM 2 (Channel A, DIMM 1 )

BB Consumer IR e mitte r (output) header

FF Consumer IR receiver (input) head e r

JJ Front panel IEEE 1 394a header

NN Auxiliary fan heade r

1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.

Product Description

Figure 2. Block Diagram

Intel Desktop Board DX79TO T echnical Product Spec ification

1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:

• No parallel port connector

• No floppy drive connector

• No PS/2 connectors

1.3 Online Support

To find information a bout… Visit this World Wide Web site:

Intel Desktop B oard DX79TO http://www.intel.com/products/motherboard/index.htm Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support Available config ur a tio ns for the Intel

Desktop Board DX79TO Supported processors http://processormatch.intel.com

Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm BIOS and driver updates http://downloadcenter.intel.com Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-

Integration info r m ation http://www.intel.com/support/go/buildit

http://ark.intel.com

025414.htm

1.4 Processor

The board is designed to support Intel Core i7 and Intel Xeon processors in an LGA2011 socket

Other processors may be supported in the future. This boa rd is designed to support processor s with a maximum wattage of 130 W with margin to allow for greater than 200 W operation. The processors listed above are only supported when falling within the wattage requirements of the Intel Desktop Board DX79TO. See the Intel web site listed below for the most up-to-date list of supported processors.

For information about… Refer to:

Supported processors http://processormatch.intel.com

CAUTION

Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power s upp ly.

NOTE

This board has specific requirements for providing power to the processor. Refer to Section 2.5.1 on page 58 for information on power supply requirements for this board.

Product Description

1.4.1 PCI Express x16 Graphics

Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express add-in graphics cards via the board’s PCI Express x16 connectors. These processors support the following generations of PCI Express:

• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of

8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.

• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of

4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 8 GB/s in each direc tion, simultaneously, for a bandwidth of 16 GB/s.

• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of

2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16 interface is 4 GB/s in each direc tion, simultaneously, for a bandwidth of 8 GB/s.

For information about Refer to

PCI Express te c hnology http://www.pcisig.com

1.5 System Memory

The board has eight DIMM sockets and supports the following memory features:

• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)

• Four independent memory channels with interleaved mode support

• Unbuffered, single-sided or double-sided DIMMs with the following restriction:

Double-sided DIMMs with x16 organization are not suppor ted.

• 64 GB maximum total system memory (us ing 4 Gb memory technology). Refer to Section 2.1.1 on page 41 for information on the total amount of addressable memory.

• Minimum total system memory: 1 GB using 512 MB x16 module

• Non-ECC and ECC DIMMs

• Serial Presence Detect

• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz

SDRAM DIMMs

• XMP performance profile support for memory speeds above 1600 MHz

• Full support for over clocking memory (see

www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for more

information about over clocking)

• DIMM slots are numbered in installation order

NOTE

To be fully compliant with all applicable DDR SDRAM memory specifications , the board should be populated with DIMMs that support the Seri a l Presence Detect (SPD) data structure. This al lows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance.

Intel Desktop Board DX79TO T echnical Product Spec ification

CAUTION

1.5 V is the recommended and default setting for DDR3 memory voltage. The other

memory voltage settings in the BIOS Setup program are provided for performance tuning purposes only. Altering the memory voltage may (i) reduce system stability and the useful life of the system, memory, and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv ) cause additional heat o r other damage; and (v) a ffect system data i ntegrity.

Intel has not tested and does not warranty the operation of the processor beyond its specifications. For information on the processor warranty, refer to

http://www.intel.com/support/processors/sb/CS-

020033.htm?wapkw=(processor+warranty).

Intel assumes no r esponsibility that the memory installed on the desktop board, if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with the memory manufacturer for warranty terms and additional details.

Table 4 lists the supported DIMM configurations.

Table 4. Supported Memory Configurations

DIMM Capacity Configuration

512 MB SS 1 Gbit 64 M x16/empty 4 1024 MB SS 1 Gbit 128 M x8/empty 8 1024 MB SS 2 Gbit 128 M x16/empty 4 2048 MB DS 1 Gbit 128 M x8/128 M x8 16 2048 MB SS 2 Gbit 128 M x16/empty 8 4096 MB DS 2 Gbit 256 M x8/256 M x8 16 4096 MB SS 4 Gbit 512 M x8/empty 8 8192 MB DS 4 Gbit 512 M x8/512 M x8 16

Note: “DS” refers to double-sided memo ry modules (containing tw o rows of SDR A M) and “SS” refer s to

single-sided memor y modules (containing o ne r ow of SDRAM).

(Note)

For information about… Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-

XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm

SDRAM Density

025414.htm

SDRAM Organization Front-side/Back-side

Number of SDRA M Devices

Product Description

1.5.1 Memory Configurations

The Intel Core i7 and Intel Xeon processors support the following types of memory organization:

• Quad channel (Interleaved) mode. This mode offers the highest throughput fo r real world applicat ions.

• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed memory capacities of any three DIMM channels are equal.

• Dual channel (Interleaved) mode. Dual channel mod e is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.

• Single channel (Asy mme tr ic) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.

For information about… Refer to:

Memory Config uration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-

011965.htm

Intel Desktop Board DX79TO T echnical Product Spec ification

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

NOTE

For best memory performance always install memory into the blue DIMM memory sockets if installing four DIMMs or less in your configuration.

Product Description

1.6 Intel® X79 Express Chipset

The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI Express interfaces. The PCH is a centralized controller for the board’s I/O paths.

For information about Refer to

The Intel X79 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm Resources used by the chipset Chapter 2

1.6.1 USB

The board support s up to 14 USB 2.0 ports and two USB 3.0 ports. The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The two

USB 3.0 ports are p rovided by an NEC* UPD720200 controller. The port arrangement is as follows:

• Two USB 3.0 ports a re implemented with stacked back panel connectors (blue)

• Six USB 2.0 ports are implemented with stacked back panel connectors (black)

• Eight USB 2.0 front panel ports implemented through four internal headers

All 16 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.

NOTES

Computer systems that have an unshielded cable attached to a USB por t m a y not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB c onnectors on the back panel Figure 10, page 44 The location of the front panel USB headers Figure 12, page 46

1.6.2 SATA Interfaces

The board provides six SATA connectors through the PCH which support one device per connector:

• Two internal SATA 6.0 Gb/s connectors (blue)

• Four internal SATA 3.0 Gb/s connectors (black)

The PCH provides independent SATA ports with a theoretical maximum transfer rate of

6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used

for host to device connections.

Intel Desktop Board DX79TO T echnical Product Spec ification

The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7 operating systems.

NOTE

Many SATA drives use new low-voltage power connectors and require adapters or power supplies equipped with low-voltage power connectors.

For more information, see: http://www.serialata.org/.

For information about Refer to

The location of the SA TA c onnectors Figure 12, page 46

1.6.2.1 SATA RAID

The board supports the following RAID (Redundant Array of Independent Drives) levels via the PCH:

• RAID 0 - data striping

• RAID 1 - data mirroring

• RAID 0+1 (or RAID 10) - data striping and mirroring

• RAID 5 - distributed parity

NOTE

In order to use supported RAID features, you must f i rst enable RAID in the BIOS . Also, during Microsoft Windows XP installation, you must press F6 to install the RAID drivers. See your Micros oft Windows XP documentation f or more information about installing drivers during installation. Both Microsoft Windows Vista and Micros oft Windows 7 include the necess a ry RAID drivers for both AHCI and RAID without the need to install separate RAID drivers using the F6 switch in the operating system ins ta l lation process.

Product Description

1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied via the power supply 5V STBY rail.

NOTE

If the battery and AC po w er fail, date and time values will be reset and the user will be notified during POST.

When the voltage drops b elow a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.

1.8 Legacy I/O Controller

The I/O controller provides the following features:

• Consumer Infrared (CIR) headers

• Serial IRQ interface compatible with serialized IRQ support for PCI systems

• Intelligent power management, including a programmable wake-up event interface

• PCI power management support

The BIOS Setup program provides configuration options for the I/O controller.

1.8.1 Consumer Infrared (CIR)

The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the supported operating systems.

The CIR feature is made up of two separate pieces: the receiving (receiver) header, and the output (emitter) header. The receiving header consists of a filtered translated infrared input compliant with Microsoft CI R specifications, and also a “learning” infrared input. This learning input is simply a high pass input which the computer can use to “learn” to speak the infrared communication language of other user remotes. The emitter header consists of two output ports which the PC can use to emulate “learned” infrared commands in order to control external electronic hardware.

Customers are required to buy or create their own interface modules to p lug into I ntel Desktop Boards for this feature to work.

Intel Desktop Board DX79TO T echnical Product Spec ification

1.9 Audio Subsystem

The board support s the Intel High Definition Audio subsystem bas ed on the Realtek ALC892 audio codec. The audio subsystem supports the following features:

• Advanced jack sense fo r the back panel audio jacks that enables the audio codec to recognize the device tha t is connected to an audio por t . The back panel audio jacks are capable of retasking according to the user’s definition, or can be automatically switched depending on the recognized device type.

• Stereo input and output for a ll back pa nel jacks

• Line out and Mic in functions for front panel audio jacks

• A signal-to-noise (S/N) ratio of 90 dB

Table 5 lists the supported functions of the fro nt pa nel and back panel audio jacks.

Table 5. Audio Jack Support

Audio Jack

FP Green Default FP Pink Default Rear Blue Default Rear Green Ctrl panel Default Rear Pink Default Ctr l p a ne l

Microphone

Head-

phones

Front

Speaker Line In

Side

Surround

1.9.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining audio sof tw a r e and drivers Section 1.3, page 16

1.9.2 Audio Subsystem Components

The audio subsystem includes the following components:

• Intel X79 Express Chipset

• Realtek ALC892 audio codec

• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-

pin header that provides mic in and line out signals for front panel audio connectors) (yellow)

• 3-port analog audio input/output stack on the back panel

The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 4.

Item Description

A Line in B Line out/front speak e rs C Mic in/side surround

Figure 4. Back Panel Audio Connectors

Product Description

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

For information about Refer to

The locations of the f ront panel audio header Figure 12, page 46 The signal names of the f ront panel audio header Section 2.2.2.1, page 48 The back panel audio c onnectors Section 2.2.1, page 44

Intel Desktop Board DX79TO T echnical Product Spec ification

1.10 LAN Subsystem

The Intel GbE LAN subsystem consists of the following:

• Intel 82579L Gigabit Ethernet Controller (10/100/1000 Mbits/s)

• Intel X79 Express Chipset

• RJ-45 LAN connectors with integrated status LEDs

Additional features of the LAN subsystem include:

• CSMA/CD protocol engine

• LAN connect interface between the PCH and the LAN controller

• Conventional PCI bus power management  ACPI tec hnology support  LAN wake capabilities

• LAN subsystem software

For information about Refer to

LAN software and d rivers http://downloadcenter.intel.com

1.10.1 Intel® 82579L Gigabit Ethernet Controller

The Intel 82579L Gigabit Ethernet Controller supports the following features:

• 10/100/1000 BASE-T IEEE 802.3 compliant

• Energy Efficient Ethernet (EEE) I EEE802.3az support [Low Power Idle (LPI) mode]

• Dual interconnect between the Integrated LAN Controller and the Physical Layer

(PHY):

 PCI Express-based interface f or active state operation (S0) state  SMBUS for host and management traff ic (Sx low power state)

• Compliant to IEEE 802.3x flow control support

• 802.1p and 802.1q

• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)

• Full device driver compatibility

• Provides lower power usage to meet Energy Star 5.0 and ErP spe cifications

Product Description

1.10.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

For information about Refer to

Obtaining LAN softw are and drivers http://downloadcenter.intel.com

1.10.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).

Item Description

A Link LED (Green) B Data Rate LED (Green/Ye llow)

Figure 5. LAN Connector LED Locations

Table 6 describes the LED states w hen the board is power ed up and the LAN subsystem is opera ting.

Table 6. LAN Connector LED States

LED LED Color LED State Condition

Off LAN link is not establishe d .

Link Green

Data Rate Green/Yellow

On LA N link is e s tablished. Blinking LAN activity is occurring. Off 10 Mbits/s data rate is selected. Green 100 Mbits/s data rate is selected. Yellow 1000 Mbits/s data rate is selected.

Intel Desktop Board DX79TO T echnical Product Spec ification

1.11 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following:

• Fan monitoring and control

• Thermal and voltage monitoring

• Chassis intrusion detection

1.11.1 Hardware Monitoring and Fan Control

The hardware monitoring and fan control subsystem is based on the Winbond W83677HG-I device, which s upports the following:

• Processor and system ambient temperature monitoring

• Chassis fan speed monitoring

• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and

+VCCP

• SMBus interface

1.11.2 Fan Monitoring

Fan monitoring can be implemented using Intel® Extreme Tuning Utility, Intel® Desktop Utility, or third-party software.

For information about Refer to

The functions of the f an he aders Section 1.12.2.2, page 34

1.11.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.

For information about Refer to

The location of the chas s is intrusion header Figure 12, page 46

1.11.4 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.

Product Description

Item Description

A Rear chassis fan header B Processor fan header C Thermal diode, located on processor d ie D F ront chassis fan heade r E Intel X79 Express Chipset F Auxiliary fan header

Figure 6. Thermal Sensors and Fan Headers

Intel Desktop Board DX79TO T echnical Product Spec ification

state…

pressed for

…the system enters this state

(ACPI G2/G5 – Soft off)

(ACPI G0 – wo rking state)

(ACPI G1 – slee ping state)

(ACPI G0 – wo rking state)

(ACPI G2/G5 – Soft off)

(ACPI G1 – slee ping state)

(ACPI G0 – wo rking state)

(ACPI G1 – slee ping state)

(ACPI G2/G5 – Soft off)

1.12 Power Management

Power management is implemented at several levels, including:

• Software support through Advanced Configuration and P ower Interface (ACPI)

• Hardware support:  Power connector  Fan headers  LAN wake capabilities  Instantly Available PC techno logy  Wake from USB  PME# signal wake-up support  WAKE# signal wake-up support

 Wake from Consumer IR  Wake from S5  Power Supervisor  +5 V Standby Power Indicator LED

1.12.1 ACPI

ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include:

• Plug and Play (including bus and device enumeration)

• Power management control of individual devices, add-in boards (some add-in

boards may require an ACPI-aware driver), video displays, and hard disk drives

• Methods for achieving less than 15-watt system operation in the pow er-on/standby sleeping state

• A Soft-off feature that enables the operating system to power-off the computer (refer to the Advanced Configuration and Power Interface Specification at

http://www.acpi.info/)

• Support for multiple wake-up events (see Table 9 on page 32)

• Support for a front panel power and sleep mode switch

Table 7 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.

Table 7. Effects of Pressing the Power Switch

If the system is in this

Off

…and the power switch is

Less than four seconds Power-on

Less than four seconds Soft-off/Standby

Sleep

More than six second s Fail safe power-off

Less than four seconds Wake-up

More than six second s Power-off

Product Description

1.12.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state transitions. The opera ting sy stem puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.

Table 8 lists the power states supported by the board along with the assoc iate d system power targets. See the ACPI specification for a complete description of the various system and power states.

Table 8. Power States and Targeted System Power

Global States Sleeping States

G0 – working state

G1 – sleeping state

G2/S5 S5 – Soft off.

G3 – mechanical off

AC power is disconnected from the computer.

Notes:

1. To tal system power is d e pendent on the system c o nfiguration, including add-in boards and per i p he rals powered by the system chassis’ power supply.

2. D e p e ndent on the standby po w e r consumption of w ake-up devices used in the system.

S0 – working C0 – working D0 – working

S3 – Suspend to RAM. Context saved to RAM.

S4 – Suspend to disk. Context saved to disk.

Context not saved . Cold boot is required.

No power to the system.

Processor States

No power D3 – no power

No power D3 – no power for

Device States

state.

except for wake-up logic.

wake-up logic, except when provided by battery or external source.

Targeted Sy stem Power

Full power > 30 W

Power < 5 W

No power to the s y s te m . Service can be performed safely.

(Note 1)

(Note 2)

Intel Desktop Board DX79TO T echnical Product Spec ification

Note 1)

(Note 1)

(Note 3)

(Note 1)

(Note 3)

(Note 1)

(Note 3)

(Note 1)

(Note 3)

1.12.1.2 Wake-up Devices and Events

Table 9 lists the devices or specific events that can wake the computer from specific states.

Table 9. Wake-up Devices and Events

Devices/events can wake up the computer… …from this state …from this global state

Power switch S3, S4, S5 RTC alarm S3, S4, S5 LAN S3, S4, S5 USB S3 G1 PME# signal S3, S4, S5 WAKE# S3, S4, S5 Consumer IR S3, S4, S5

Notes:

1. S 4 im p lie s operating system s up port only.

2. Wake from S4 and S5 is recommended by Microsoft.

3. Wak e from device/event not supported im me d i ate ly upon return fro m AC loss.

NOTE

(

G1, G2, G3 G1, G2 G1, G2

G1, G2 G1, G2

(Note 2)

The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drive rs, and periphera l s must fully support ACPI wake events.

Product Description

1.12.2 Hardware Support

CAUTION

Ensure that the powe r supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Avai lable PC technology f eatures are used. Failure to do so can damage the power supply. The total amo unt of standby current required depends on the wake devices supported and manufac turing options.

The board provides several power management hardware features, including:

• Power connector

• Fan headers

• LAN wake capabilities

• Instantly Available PC technology

• Wake from USB

• PME# signal wake-up support

• WAKE# signal wake-up support

• Wake from Consumer IR

• Wake from S5

• Power Supervisor

• +5 V Standby Power Indicator LED

LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.

NOTE

The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.

1.12.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages.

When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computer’s response can be set using the Last Power State feature in the BIOS Setup program’s Boot menu.

For information about Refer to

The location of the main p o w e r connector Figure 12, page 46 The signal names of the main p ower connector Table 23, page 51

Intel Desktop Board DX79TO T echnical Product Spec ification

1.12.2.2 Fan Headers

The function/operation of the fan headers is as follows:

• The fans are on when the board is in the S0 state

• The fans are off when the board is off or in the S3, S4, or S5 state

• Each fan header is wired to a fan tachometer input of the hardware monitoring and

fan control SIO

• All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed

• All fan headers have a +12 V DC connection

• 4-pin fan headers are controlled by Pulse Width Modulation

For information about Refer to

The location of the fan he a d e rs Figure 12, page 46 The location of the fan he a d e rs and sensors for thermal monitoring Figure 6, page 29

1.12.2.3 LAN Wake Capabilities

CAUTION

For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Fail ure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply.

LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem PCI bus network adapter monitors network traffic at the Media Independent Inte rface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer. Depending on the LAN implementation, the board suppor ts LAN wake capabilities with ACPI in the following ways:

• The PCI Express WAKE# signal

• The PCI bus PME# signal for PCI 2.3 co mp liant LAN designs  By Ping  Magic Packet

• The onboard LAN subsystem

Product Description

1.12.2.4 Instantly Available PC Technology

CAUTION

For Instantly Available P C technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply.

Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a w ake-up device or event, the system quickly returns to its last known wake state. Table 9 on page 32 lists the devices and events that can wake the computer from the S3 state.

The board support s the PCI Bus Power Management Interface Specification. Add-in boards that also suppor t this s pecification can participate in power managem ent and can be used to wake the computer.

The use of Instantly Available PC technology requires operating system support and PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.

1.12.2.5 Wake from USB

USB bus activity wakes the computer from an ACPI S3 state.

NOTE

Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.

1.12.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state (with Wake on PME enabled in the BIOS).

1.12.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.

1.12.2.8 Wake from Consumer IR

CIR activity wakes the computer from an ACPI S3, S4, or S5 state.

1.12.2.9 Wake from S5

When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.

Intel Desktop Board DX79TO T echnical Product Spec ification

1.12.2.10 Power Supervisor

The Power Supervisor actively monitors the input voltages from the power supply and protects the board and any attached peripherals from electrical overstress and possible physical damage. The Power Supervisor will activate if it detects the power supply voltage rails have deviated outside the current ATX po wer supply specification and safe operating levels.

If the Power Supervisor detects an out of spec voltage, the following will happen:

1. The board will be powered down immediately to protect circuits from electrical overstress and possible physical damage.

2. A red warning LED on the board will activate as a visual cue.

3. During the next power on, a message will be displayed on the screen to notify the user that the power supply voltage rails have deviated outside the current ATX power supply specification and sa fe operating levels.

4. A message will be added to the BIOS Event Lo g for each event that takes place until the BIOS Event Log is cleared.

1.12.2.11 +5 V Standby Powe r Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the computer appears to be off.

Product Description

1.13 Board Status LEDs

The Desktop Board provides eight board status LEDs that allow you to monitor the board’s progress through the BIOS Power-on Self-Test. At initial power on, all the LEDs are off. When the BIOS starts an activity such as memory initialization, the corresponding LED starts flashing. Once the a ctivity has completed, the LE D will remain on. Six additional LEDs can be used to monitor board functions such as hard drive activity, processor errors, and power faults. Refer to Table 9 for a description of all of the LEDs. Figure 7 shows the location of the LEDs.

Figure 7. Location of Board Status LEDs

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 10. Board Status LEDs

Item in Figure 7

A OS Start Green On/Off/Flash BIOS B Storage

C USB Initialization Green On/Off/Flash BIOS D Option ROM

E Video

F Memory

G CPU Initialization Green On/Off/Flash BIOS H Hard Drive

I CPU Hot Red On/Off Discrete circuit J VR Hot Red On/Off Discrete circuit K Watc h Dog

L +5 V standby

M CPU Error Red On/Off Processor N Power Fault LED Red On/Off Po wer Supply

LED Name

Initialization

Activity

Fire/Back to BIOS

power indicator

LED Color

Green On/Off/Flash BIOS

Blue On/Off Har d drive contro lle r(s)

Red On/Off/Flash BIOS

Green On/Off Power S up ply

Supported Modes

Control Source

Product Description

1.14 Onboard Power and Reset Buttons

The lighted onboard power button has the same behavior as the front pane l pow er button connected via the f ront panel header. The onboard power button does NOT remove standby power. This button is intended fo r use at integration facilities for testing purposes. The power button on the front panel is recommended for all other instances of turning the computer on or off. To turn the computer off using the onboard power button, keep the button pr essed down for three seconds.

The lighted onboard reset button can be used to reset the board. This button duplicates the function of the front panel reset button. Figure 8 shows the location of the onboard power and reset buttons.

Figure 8. Location of the Onboard Power and Reset Buttons

CAUTION

Electrostatic di scharge (ESD) can damage components. The onboard power and reset buttons should be us ed only at an ESD workstation using an antistatic wrist strap and a conductive foam pa d. If such a station is not available, some ESD protection can be provided by wearing an antistatic wrist strap and attaching it to a metal part of the computer chassis.

Item Description

A Onboard power B Onboard reset

Intel Desktop Board DX79TO T echnical Product Spec ification

1.15 Trusted Platform Module (TPM)

The Nuvoton WPCT210 TPM version 1.2 revision 1 03 component is specifically designed to enhance platform security above-and-beyo nd the capabilities of today’s software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages—operations when the keys are being used unencrypted in plain-text form. The TPM shields unencrypted keys and platform authentication informatio n from softw are-based attacks.

For information about Refer to

Nuvoton TPM version 1.2 http://www.nuvoton-usa.com/

2 Technical Reference

2.1 Memory Resources

2.1.1 Addressable Memory

The board utilizes 64 GB of addressable system memory. Typically the address space that is allocated for Conventional PCI bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top o f DRAM (total system memory). On a system that has 64 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following:

• BIOS/SPI Flash device (64 Mbit)

• Local APIC (19 MB)

• Direct Media Interface (40 MB)

• PCI Express configuration space (256 MB)

• PCH base address registers PCI Express ports (up to 256 MB)

• Memory-mapped I/O that is dynamically allocated for Conv entional PCI and PCI

Express add-in cards (256 MB)

The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM bo undary to the 4 GB boundar y to an equivalent sized logical address range located just above the 4 GB boundary. Figure 9 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.

Intel Desktop Board DX79TO T echnical Product Spec ification

Figure 9. Detailed System Memory Address Map

2.1.2 Memory Map

Table 11 lists the system memory map.

Table 11. System Memory Map

Address Range (decimal) Address Range (hex) Size Description

1024 K - 67100672 K 100000 – FFFFFFFFFH 65528 MB Extended memory 960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS 896 K - 960 K E0000 - EFFFF 64 KB Reserved 800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS

640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS 639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by

512 K - 639 K 80000 - 9FBFF 127 KB Exte nded conventional memory 0 K - 512 K 00000 - 7FFFF 512 KB Conventio nal m e mory

Technical Reference

memory (open to the Conventional PCI bus). Depe nd e nt o n video adapter used.

memory manager software)

2.2 Connectors and Headers

CAUTION

Only the following connectors and headers have overcurrent protection: back panel and front panel USB, as well as I EEE 1394a.

The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computer’s chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computer’s chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves.

Furthermore, improper connection of USB or 1394 header single wire connectors may eventually overload the overcurrent protection and cause damage to the board.

This section describes the board’s connectors. The connectors can be divided into these groups:

• Back panel I/O connectors

• Component-side I/O connectors and headers (see page 46)

Intel Desktop Board DX79TO T echnical Product Spec ification

2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.

Item Description

A Back to BIOS button B USB 3.0 ports C LAN connector D USB 2.0 ports E IEEE 1394a connector F USB 2.0 ports G USB 2.0 ports H Line in I Line out/front speakers J Mic in/side surround

Figure 10. Back Panel Connectors

NOTE

The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.

Technical Reference

2.2.1.1 I/O Shield

The I/O shield provided with the board allows access to a ll back pa nel connectors and is compatible with standard mini-ITX and ATX chassis. Figure 11 shows an I/O shield reference diagram.

Figure 11. I/O Shield Reference Diagram

Intel Desktop Board DX79TO T echnical Product Spec ification

2.2.2 Component-side Connectors and Headers

Figure 12 shows the locations of the component-side connectors and headers.

Figure 12. Component-side Connectors and Headers

Table 12 lists the component-side connectors and headers identified in Figure 12.

Technical Reference

Label

Description

Front panel audio he ad e r

PCI Express x1 add-in card connecto r

Conventional PCI add-in card connector

PCI Express 3.0 x16 add-in card connector

PCI Express x1 add-in card connecto r

PCI Express 3.0 x16 add-in card co nne c tor

Rear chassis fan header

Processor fan header

12 V processor core voltage connector (2 x 4 pin)

Front chassis fan he ader

3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA conne c tors (blue)

Front panel USB 2 .0 header

Consumer IR e mitte r (output) header

Consumer IR r e c e i v e r (input) header

Front panel header

Front panel IEEE 1 394a header

Chassis intrusion heade r

Auxiliary fan heade r

Table 12. Component-side Connectors and Headers Shown in Figure 12

K Ma in p ower connector (2 x 12 pin)

O Front panel USB 2.0 he ader

S Alternate front pane l p ower LED header

Intel Desktop Board DX79TO T echnical Product Spec ification

2.2.2.1 Signal Tables for the Connectors and Headers

Table 13. Front Panel Audio Header for Intel HD Audio

Pin Signal Name Description

1 PORT_1L Analog Port 1 – left channel (microphone) 2 GND Ground 3 PORT_1R Analog Port 1 – right channel (microphone) 4 PRESENCE# Active low signal that signals BIOS that an Intel HD Audio

dongle is connecte d to the analog header. PRESENCE#=0

when an Intel HD Audio d o ngle is connected 5 PORT_2R Analog Port 2 – right channel (headphone) 6 SENSE1_RETURN Jack de te c tion return for front panel (JACK1) 7 SENSE_SEND Jack detection sense line f rom the Intel HD Audio CODEC

jack detection re s is tor network 8 KEY No pin 9 PORT_2L Analog Port 2 – left channel (headphone) 10 SENSE2_RETURN Jack detection return for front panel (JACK2)

Table 14. Front Panel Audio Header for AC ’97 Audio

Pin Signal Name Description

1 MIC Front panel microphone input signal (biased w he n

supporting ster e o microphone) 2 AUD_GND Ground used by analog audio circuits 3 MIC_BIAS Microphone power/additional MIC input fo r stereo

microphone supp ort 4 PRESENCE# Active low signal that signals BIOS that an Intel HD Audio

dongle is connecte d to the analog header. PRESENCE#=0

when an Intel HD Audio d o ngle is connected. 5 FP_OUT_R Right channel audio signal to f ront panel (headphone d rive

capable) 6 AUD_GND Ground used by analog audio circuits 7 RESERVED Reserved 8 KEY No pin 9 FP_OUT_L Left channel audio signal to front panel (headphone drive

capable) 10 AUD_GND Ground used by analog aud io circuits

Table 15. IEEE 1394a Header

Pin Signal Name Pin Signal Name

1 Data A (p o s itive) 2 Data A (negative) 3 Ground 4 Ground 5 Data B (positive) 6 Data B (ne g ati v e ) 7 +12 V DC 8 +12 V DC 9 Key (no p in) 10 Ground

Table 16. SATA Connectors

Pin Signal Name

1 Ground 2 TXP 3 TXN 4 Ground 5 RXN 6 RXP 7 Ground

Technical Reference

Table 17. USB 2.0 Headers

Pin Signal Name

1 +5 V DC 2 D− 3 D+ 4 Ground 5 Key (no pin)

Table 18. Chassis Intrusion Header

Pin Signal Name

1 Intruder# 2 Ground

Table 19. Processor, Front and Rear Chassis, and Auxiliary

(4-Pin) Fan Headers

Pin Signal Name

1 Ground 2 +12 V 3 FAN_TACH 4 FAN_CONTROL

Note: These fan headers use Puls e Width Modulation control for fan speed.

(Note)

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 20. Back Panel CIR Emitter (Output) Header

Pin Signal Name

1 Emitter out 1 2 Emitter out 2 3 Ground 4 Key (no pin) 5 Jack detect 1 6 Jack detect 2

Table 21. Front Panel CIR Receiver (Input) Header

Pin Signal Name

1 Ground 2 LED 3 NC 4 Learn-in 5 5 V standb y 6 VCC 7 Key (no pin) 8 CIR Input

2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:

• PCI Express 3.0 x16: two PCI Express 3.0 x16 connectors supporting simultaneous transfer speeds up to 16 GB/s of peak bandwidth per direction and up to 32 GB/s concurrent bandwidth.

• PCI Express 2.0 x1: three PCI Express 2.0 x1 connectors. The x1 interface supports simultaneous transfer speeds up to 500 MB/s of peak bandwidth per direction and up to 1.0 GB/s concurrent bandwidth.

• Conventional PCI (rev 2.3 compliant) bus: one Conve ntional PCI bus add-in card connector.

Note the following considerations for the Conventional PCI bus connector:

• The Conventional PCI bus connectors are bus master capable.

• SMBus signals are routed to the Conventional PCI bus connectors. This enables

Conventional PCI bus add-in boards with SMBus support to access sensor data on the desktop board. The specific SMBus signals are as follows:

 The SMBus clock line is connected to pin A40.  The SMBus data line is connected to pin A41.

Technical Reference

(Note)

2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:

• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, attach that cable on the leftmost pins of the main power connector, leaving pins 1 1, 12, 23, and 24 unconnected.

• Processor core power – a 2 x 4 connector. This connector provides power directly to the proce ssor voltage regulator and must always be used. Failure to do so will prevent the board from booting.

Table 22. Processor Core Power Connector

Pin Signal Name Pin Signal Name

1 Ground 2 +12 V 3 Ground 4 +12 V 5 Ground 6 +12 V 7 Ground 8 +12 V

Table 23. Main Power Connector

Pin Signal Name Pin Signal Name

1 +3.3 V 13 +3.3 V 2 +3.3 V 14 -12 V 3 Ground 15 Ground 4 +5 V 16 PS-ON# (power s up ply remote on/of f) 5 Ground 17 Ground 6 +5 V 18 Ground 7 Ground 19 Ground 8 PWRGD (Power Goo d ) 20 No connect 9 +5 V (Standby) 21 +5 V 10 +12 V 22 +5 V 11 +12 V 12 2 x 12 connector detect

Note: When using a 2 x 10 power supply c a b le , this p i n w ill b e unc onnected.

23 +5 V

24 Ground

For information about Refer to

Power supply c o ns iderations Section 2.5.1 on page 58

Intel Desktop Board DX79TO T echnical Product Spec ification

2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 24 lists the signal names of the front panel header. Figure 13 is a connection diagram for the front panel header.

Table 24. Front Panel Header

Pin Signal

Hard Drive Activity LED Power LED 1 HD_PWR Out Hard disk LED

3 HDA# Out Hard disk active

Reset Switch On/Off Switch 5 Ground Ground 6 FPBUT_IN In Power switch 7 FP_RESET# In Reset switch 8 Ground Ground Power Not Connected 9 +5 V Power 10 N/C Not connected

In/ Out Description

pull-up to +5 V

LED

Pin Signal

2 HDR_BLNK_GRN Out Front panel gr e e n

4 HDR_BLNK_YEL Out F r ont panel yellow

In/ Out Description

LED

Figure 13. Connection Diagram for Front Panel Header

2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to pro vide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard S ATA connector.

Technical Reference

2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.

2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be c onnected to a one- or two-color LED. Table 25 shows the possible states for a one-color LED. Table 26 shows the possible states for a two-color LED.

Table 25. States for a One-Color Power LED

LED State Description

Off Power off/s le e p ing Steady Green Running

Table 26. States for a Two-Color Power LED

LED State Description

Off Power off Steady Green Running Steady Yellow Sleeping

NOTE

The colors listed in Table 25 and Table 26 are suggested colors only. Actual LED colors are chassis-specific.

2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel mome nta ry-contact power switch. The switch must pull the SW_ON# pin to ground for a t lea st 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/o ff signal.

Intel Desktop Board DX79TO T echnical Product Spec ification

2.2.2.5 Front Panel USB 2.0 Headers

Figure 14 is a connection diagram for the front panel USB 2.0 headers.

NOTE

• The +5 V DC power on the headers is fused.

• Use only a front panel USB 2.0 connector that conforms to the USB 2.0

specification for high-speed USB devices.

Figure 14. Connection Diagram for Front Panel USB 2.0 Headers

Technical Reference

2.3 Jumper Block

CAUTION

Do not move the jumper with the p ower on. Always turn off t he power and unpl ug t he power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged.

Figure 15 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup program’s mode. Table 27 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.

Figure 15. Location of the Jumper Block

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 27. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration

Normal 1-2 The BIOS use s current configuration information and

passwords f or booting.

Configure 2-3 After the POST runs, Setup runs automati c ally. The

maintenance menu is display e d . Note that this Configur e mode is the only way to c le ar the

BIOS/CMOS se tting s . Press F9 (resto r e defaults) while in Configure mod e to restore the BIO S/CMOS settings to their default values.

Recovery None The BIOS attempts to reco ver the BIOS co nfiguration. A

recovery CD or flash drive is required.

Technical Reference

2.4 Mechanical Considerations

2.4.1 Form Factor

The board is designed to fit into an ATX-form-factor chassis. Figure 16 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 12.00 inches by 9.60 inches [304.80 millimeters by

243.84 millimeters]. Loc ation of the I/O connectors and mounting holes are in

compliance with the ATX specification.

Figure 16. Board Dimensions

Intel Desktop Board DX79TO T echnical Product Spec ification

2.5 Electrical Considerations

2.5.1 Power Supply Considerations

CAUTION

The +5 V standby line fr om the power supply must be capable of providing adequate +5 V standby current. Failure to do so can dam a ge the power supply. The total amount of standby curr ent required depe nds on the wake devices supported and manufacturing opt ions.

Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor

specification.

• The potential relation between 3.3 VDC and +5 VDC power rails

• The current capability of the +5 VSB line

• All timing parameters

• All voltage tolerances

For example, for a system consisting of a supported 130 W processor (see section 1.4 on page 16 for a list of supported processors), 8 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 460 W. Table 28 lists the recommended power supply current values.

Table 28. Recommended Power Supply Current Values

Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A

For information about Refer to

Selecting an appro priate power sup ply http://support.intel.com/support/motherboards/desktop/sb

/CS-026472.htm

Technical Reference

2.5.2 Fan Header Current Capability

CAUTION

The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation.

Table 29 lists the current capability of the fan headers.

Table 29. Fan Header Current Capability

Fan Header Maximum Available Current

Processor fan 2.0 A Front chassis fan 1.5 A Rear chassis fan 1.5 A Auxiliary fan 1.5 A

2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all six expansion slots filled) must not excee d the system’s power supply +5 V maximum current or 14 A in total.

Intel Desktop Board DX79TO T echnical Product Spec ification

2.6 Thermal Considerations

CAUTION

A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Use a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area. If a non omni-directional thermal solution is used customer might ne ed to provide supplemental cooling to the processor voltage regulator area.

CAUTION

Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that hav e been tested with Intel desktop boards p lease refer to the following website:

http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm

All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.

CAUTION

Ensure that the ambient temperature does not exceed the board’s maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.8.

CAUTION

Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit. The processor voltage regulator area (shown in Figure 17) can reach a temperature of up to 85 an open chassis.

C in

Technical Reference

For information about

Refer to

Figure 17 shows the locations of the localized high temperature zones.

Item Description

A Processor voltage regulator area B Processor

Figure 17. Localized High Temperature Zones

Table 30 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board.

Table 30. Thermal Considerations for Components

Component Maximum Case Temperature

Processor For processor case temperature, see processor datasheets and

processor specification updates

Intel X79 Express Chipset 104 oC (under bias)

Processor datasheets and specification updates Section 1.3, page 16

Intel Desktop Board DX79TO T echnical Product Spec ification

2.7 Reliability

The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 ºC ambient. The MTBF pred iction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is >100,000 hours.

2.8 Environmental

Table 31 lists the environmental specifications for the board.

Table 31. Environmental Specifications

Parameter Specification Temperature

Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/sec o nd² Packaged Half sine 2 millisecond Pr o duct Weight (pounds) Free Fall (inches) Velocity Change (inc he s /s e c ²) <20 36 167 21-40 30 152 41-80 24 136 81-100 18 118 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz 20 Hz to 500 Hz: 0.02 g² Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat) 40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz

-20 °C to +70 °C 0 °C to +55 °C

3 Overview of BIOS Features

3.1 Introduction

The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configur ation utility, LAN EEPROM information, and P lug and Play support.

The BIOS displays a message during POST identifying the type o f BIOS and a revision code. The initial production BIOSs a re identified as SIX7910J.86A.

When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match.

The BIOS Setup program can be used to view and change the BIO S settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the oper a ting sys tem boot begins. The men u bar is shown below .

Maintenance Main Configuration Performance Security Power Boot Exit

NOTE

The maintenance menu is display ed only when the b oard is in con figure mode. Section 2.3 on page 55 shows how to put the board in configure mode.

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 32 lists the BIOS Setup program menu features.

Table 32. BIOS Setup Program Menu Bar

Maintenance Main

Clears passwords and displays processor information

Displays processor and memory configuration

Configuration

Configures advanced features available through the chipset

Performance Security Power

Configures Memory, Bus and Processor overrides

Sets passwords and security features

Table 33 lists the function keys available for menu screens.

Table 33. BIOS Setup Program Function Keys

BIOS Setup Program Function Key

<←> or <→> <↑> or <↓> <Tab> Sele c ts a f i e ld (N o t im p le m e nte d ) <Enter> Executes command or selects the submenu <F9> Load the default configuration values for the current menu <F10> Save the current v alue s and exits the BIOS S e tup p rogram <Esc> Exits the menu

Description

Selects a different menu screen (Moves the cursor left or right) Selects an item (Move s the c ursor up or do w n)

Configures power management features and power supply controls

Boot

Selects boot options

Exit

Saves or discards changes to Setup program options

3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB) flash memory device.

3.3 Resource Configuration

3.3.1 PCI Autoconfiguration

The BIOS can automatically configure PCI devices. PCI devices may be onboard or add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having to configure the system. When a user turns on the system after adding a PCI card, the BIOS automatically configures interrupts, the I/O space, and other system resources. Any interrupts set to Available in Setup are considered to be available for use by the add-in card.

Overview of BIOS Features

3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network.

The main component of SMB IOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obta in the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information:

• BIOS data, such as the BIOS revision level

• Fixed-system data, such as peripherals, serial numbers, and asset tags

• Resource data, such as memory size, cache size, and processor speed

• Dynamic data, such as event detection and error logging

Non-Plug and Play operating systems re quire an additional interface for obtaining the SMBIOS information. The BIOS supports an S MBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board informat io n can be found in the B IOS under the Additional Information header under the Main BIOS page.

3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating system’s USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an oper ating system that supports USB. By default, Legacy USB support is set to Enabled.

Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.

2. POST begins.

3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu.

4. POST completes.

5. The operating system loads. While the operating sys tem is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.)

6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.

7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit.

Intel Desktop Board DX79TO T echnical Product Spec ification

To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating system’s installa tion ins truct ions.

3.6 BIOS Updates

The BIOS can be updated using either of the follo wing utilities, which are available on the Intel World Wide Web site:

• Intel

• Intel® F7 switch allows a user to select where the BIOS .bio file is located and

Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS c an be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), an optical drive, or from the file location on the Web.

Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB dr ive (a flash drive or a USB hard drive), or an optical drive.

perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.

Both utilities verify that the updated BIOS m a tches the target sy stem to prevent accidentally installing an incompatible BIOS.

NOTE

Review the instructions distributed with the upgrade utility before a ttempting a BIOS update.

For information about Refer to

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb

/CS-022312.htm.

3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Check the Intel web site for s upport.

Overview of BIOS Features

3.6.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is available from Intel can be used to create a custom splash screen.

NOTE

If you add a custom splash screen, it will share space with the Intel branded logo.

For information about

Intel® Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/ Additional Intel® software too ls http://developer.intel.com/design/motherbd/software.htm

Refer to

3.7 BIOS Recovery

It is u nlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 34 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable.

Table 34. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?

Optical drive c o nne c te d to the SATA interfac e Yes USB removable drive (a USB Flash Drive, for example) Yes USB diskette dr iv e (with a 1.44 MB diskette ) No USB hard disk drive No

For information about Refer to

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb

/cs-023360.htm

Intel Desktop Board DX79TO T echnical Product Spec ification

3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard drive, USB drive, USB flash drive, optical drive, or the network. The default setting is for the diskette drive to be the first boot device, the hard drive second, and the optical drive third. If enabled, the last default boot device is the network.

3.8.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito boota b le CD-ROM format specification. U nder the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.

3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed.

Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.

3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing the POST, the ope rating system loader is invoked even if the following devices are not present:

• Video adapter

• Keyboard

• Mouse

3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a bo ot device menu to be displayed. This menu displays the list of available bo ot devices (as se t in the B IOS setup program’s Boot Device Priority Submenu). Table 35 lists the boot device menu options.

Table 35. Boot Device Menu Options

Boot Device Menu F unc t ion Keys Description

<↑> or <↓> <Enter> Exits the menu, saves changes, and boots from the s e le c te d

<Esc> Exits the menu without saving c hang e s

Selects a default boot device

device

Overview of BIOS Features

3.9 Adjusting Boot Speed

These factors affect system b oot speed:

• Selecting and configuring peripherals properly

• Optimized BIOS boot parameters

3.9.1 Peripheral Selection and Configuration

The following techniques help improve sy stem boot speed:

• Choose a hard drive with parameters such as “power-up to data ready” in less than eight seconds to minimize hard drive startup delays.

• Select an optical drive with a fast initializat ion rate. This rate can influence POST execution time.

• Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process.

• Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly.

3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.

• In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time.

• In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.

• The BIOS will automat ically not load t he option ROM for the SATA controller if no drives are installed in it during POST.

NOTE

It is possible to optimize the boot process to the point whe re the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drive s with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen.

This boot time may be so fast that some drives might be not be initialized at all. If this condition shoul d occur, it is pos sible to introduce a pro grammable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive C onfiguration Subm enu of the BIOS Setup program).

Intel Desktop Board DX79TO T echnical Product Spec ification

3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password ca n be set for the BIOS Setup program and for booting the computer, with the following restrictions:

• The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the superv isor mode.

• The user password gives restricted access to view and change Setup options in the BIOS Setup progr am. This is the user mode.

• If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted a ccess to Setup.

• If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered.

• Setting the user password restricts who can b oot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots w ithout asking for a passwor d . If both passwords are set, the user can enter either password to boot the computer.

• For enhanced security, use different passwords for the supervisor and user passwords.

• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.

Table 36 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen.

Table 36. Supervisor and User Password Functions

Password Set

Neither Can c hang e a ll

Supervisor only

User only N/A Can change all

Supervisor and user set

Note: If no passwor d is s e t, any user can change all Setup options.

Supervisor Mode

options Can change all

options

Can change all options

(Note)

User Mode

Can change all options

Can change a limited number of options

options Can change a

limited number of options

(Note)

Setup Options

None None None

Supervisor Password Supervisor None

Enter Password Clear User Password

Supervisor Password Enter Password

Password to Enter Setup

User User

Supervisor or user

Password During Boot

Supervisor or user

Overview of BIOS Features

3.11 BIOS Performance Features

The BIOS includes the following options to provide custom performance enhancements when using an Intel Core i7 and Intel Xeon processor in an LGA2011 socket.

• Processor frequency adjustment

• Processor voltage adjustment

• Memory clock adjustments

• Memory voltage adjustments

• QPI Bus voltage adjustm ent

• PCI Bus speed adjustment

• Fast Boot

Intel Desktop Board DX79TO T echnical Product Spec ification

4 Error Messages and Beep Codes

4.1 Speaker

The board-mounted speaker provides audible error code (beep code) information during POST.

For information about Refer to

The location of the onboard speaker Figure 1, page 13

4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s speaker to beep an error message describing the problem (see Table 37).

Table 37. BIOS Beep Codes

Type Pattern Frequency

F2 Setup/F10 B o ot Menu Prompt

BIOS update in progress None Video error On-off (1.0 second eac h) tw o times, then

Memory error On-off (1.0 second each) three times, then

Thermal trip warning Alternate high and low beeps (1 .0 s e c ond each)

One 0.5 second beep when BIOS is ready to accept keyboa r d input

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) o nc e and the BIOS will continue to boot.

2.5-second pause (o ff), entire pattern r e p e ats (beeps and pause) until the s y s te m is p o wered off.

for 8 beeps , followed by sy s te m s hut d own.

932 Hz

932 Hz When no VGA option R O M is found.

932 Hz

High beep 2000 Hz Low beep 1500 Hz

Intel Desktop Board DX79TO T echnical Product Spec ification

4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front panel power LED to blink an error message describing the problem (see Table 38).

Table 38. Front-panel Power LED Blink Codes

Type Pattern Note

F2 Setup/F10 B o ot Menu Prompt

BIOS update in progress Off when the upda te b e g i ns , then on for

Video error On-off (1.0 second eac h) tw o times, then

Memory error On-off (1.0 second each) three times, then

Thermal trip warning Each beep will be accompanied b y the following

None

0.5 seconds, then off for 0.5 seconds. The pattern repeats until the B IOS update is complete.

2.5-second pause (o ff), entire pattern r e p e ats (blink and pause) until the sy s te m is p owered off.

2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off.

blink pattern: .25 se c onds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.

When no VGA option R O M is found.

4.4 BIOS Error Messages

Table 39 lists the error messages and provides a brief description of each.

Table 39. BIOS Error Messages

Error Message Explanation

CMOS Battery Low The battery may be losing power. Re place the battery so o n. CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have

been corrupted. Run Setup to reset values.

Memory Size Decreased Memory size has decreased since the last boot. If no memory

was removed, then memory may be bad.

No Boot Device A vailable System did not find a device to bo ot.

Error Messages and Beep Codes

4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code g enerated is left at port 80h. This code is useful for determining the point where an error occurred.

Displaying the POST codes requires a PCI bus add-in card, often called a POST card. The POST card ca n d ecode the port a nd display the contents on a medium such as a seven-segment display.

NOTE

The POST card must be installed in PCI bus connector 1.

The following tables provide information ab out the POST codes generated by the B IOS:

• Table 40 lists the Port 80h POST code ranges

• Table 41 lists the Port 80h POST codes themselves

• Table 42 lists the Port 80h POST sequence

NOTE

In the tables listed abo ve, all POST codes a nd range values are listed in hexadecimal.

Table 40. Port 80h POST Code Ranges

Range Subsystem

0x00 – 0x05 Entering SX states S0 to S5. 0x10, 0x20, 0x30,

0x40, 0x50 0x08 – 0x0F Security (SEC) phase 0x11 – 0x1F PEI phase pre MRC execution 0x21 – 0x29 MRC memory detection 0x2A – 0x2F PEI phase post MRC execution 0x31 – 0x35 Recovery 0x36 – 0x3F Platform DXE d r i v e r 0x41 – 0x4F CPU Initialization (PEI , DXE, SMM) 0x50 – 0x5F I/O Buses: PCI , USB, ATA etc. 0x5F is an unrecoverable e rror. Start with PCI. 0x60 – 0x6F BDS 0x70 – 0x7F Output devices: All output co ns oles. 0x80 – 0x8F For future us e 0x90 – 0x9F Input device s : Ke y board/Mouse. 0xA0 – 0xAF For future use 0xB0 – 0xBF Boot De vices: Includes f ix e d media and remova b le me dia. Not that critical since

0xC0 – 0xCF For future use 0xD0 – 0xDF F o r future use 0xF0 – 0xFF

Resuming from S X s tate s . 0x10 – 0x20 – S2, 0x30 – S3 , e tc .

consoles should b e up at this point.

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 41. Port 80h POST Codes

Port 80 Code P rogress Code Enumeration

ACPI S States 0x00,0x01,0x02,0x03,0x04,0x05 Entering S 0, S2, S3, S4, or S 5 state 0x10,0x20,0x30,0x40,0x50 Resuming from S2 , S 3, S4, S5 Security Phase (SEC) 0x08 Starting BIOS execution after CPU BIST 0x09 SPI prefetching and caching 0x0A Load BSP microcode 0x0B Load APs microcodes 0x0C Platform program baseaddresses 0x0D Wake Up A ll A Ps 0x0E Initialize NEM 0x0F Pass entry point of the PEI core PEI before MRC PEI Platform driver 0x11 Set bo o tm o de, GPIO init 0x12 Early chipset register programming including graphics init 0x13 Basic PCH init, discrete device init (1394, SATA) 0x14 LAN init 0x15 Exit early platform init driv e r PEI SMBUS 0x16 SMBUSr iver init 0x17 Entry to SMBUS execute read /write 0x18 Exit SMBUS e xecute read/write PEI CK505 Clock Programming 0x19 Entry to CK505 programming 0x1A Exit CK505 pro gramming PEI Over-Clock Programming 0x1B Entry to entry to PEI over-clock pr o gramming 0x1C Exit PEI over-clock p rogramming Memory 0x21 MRC entr y point 0x23 Reading SPD from memory DIMMs 0x24 Detecting presence of memory DIMMs 0x27 Configuring memory 0x28 Testing me mory 0x29 Exit MRC d river PEI after MRC 0x2A Start to Program MTRR Settings 0x2B Done Programming MTRR Settings

continued

Error Messages and Beep Codes

Table 41. Port 80h POST Codes (continued)

Port 80 Code P r ogress Code Enumeration

PEIMs/Recovery 0x31 Crisis R e c overy has initiated 0x33 Loading recovery capsule 0x34 Start re c overy capsule/ v a lid capsule is found CPU Initialization CPU PEI Phase 0x41 Begin CPU PEI Init 0x42 XMM instruction enabling 0x43 End CPU PEI Init CPU PEI SMM Phase 0x44 Begin CPU SMM Init smm relocate bases 0x45 Smm relocate bases for APs 0x46 End CPU S MM Init CPU DXE Phase 0x47 CPU DXE Phas e begin 0x48 Refresh memory space attributes according to MTRRs 0x49 Load the microcode if needed 0x4A Initialize strings to HII database 0x4B Initialize MP support 0x4C CPU DXE Phase End CPU DXE SMM Phase 0x4D CPU DX E SMM Phase begin 0x4E Relocate SM bases for all APs 0x4F CPU DXE SMM Phase end I/O BUSES 0x50 Enumerating PC I buses 0x51 Allocating resources to PC I bus 0x52 Hot Plug PCI controller initialization USB 0x58 Resetting USB bus 0x59 Reserved for USB ATA/ATAPI/SATA 0x5A Resetting PATA/SAT A b us and all devices 0x5B Reserved for ATA

continued

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 41. Port 80h POST Codes (continued)

Port 80 Code P r ogress Code Enumeration

BDS 0x60 BDS driver entry point initializ e 0x61 BDS ser v i c e r outine entry point (can be c alle d multiple times) 0x62 BDS Step2 0x63 BDS Step3 0x64 BDS Step4 0x65 BDS Step5 0x66 BDS Step6 0x67 BDS Step7 0x68 BDS Step8 0x69 BDS Step9 0x6A BDS Step10 0x6B BDS Step11 0x6C BDS Step12 0x6D BDS Step13 0x6E BDS Step14 0x6F BDS return to DXE core (should not get her e ) Keyboard (PS/2 or USB) 0x90 Resetting keyboard 0x91 Disabling the keyboard 0x92 Detecting the presence of the keyboard 0x93 Enabling the k e yboard 0x94 Clearing keyboard inp ut b uffer 0x95 Instr uc ting keyboard co ntr oller to run Self Te s t (PS /2 o nly) Mouse (PS/2 or USB) 0x98 Resetting mouse 0x99 Detecting mouse 0x9A Detecting presence of mouse 0x9B Enabling mouse Fixed Media 0xB0 Resetting fix e d m e d ia 0xB1 Disabling fix e d me dia

0xB2 Detecting pre s e nc e of a fixed media (IDE hard drive d e te c tion etc.) 0xB3 Enabling/config ur i ng a fixed media

continued

Error Messages and Beep Codes

Table 41. Port 80h POST Codes (continued)

Port 80 Code P r ogress Code Enumeration

Removable Media 0xB8 Resetting remova b le me dia 0xB9 Disabling removable media 0xBA Detecting presence of a removable media (IDE, CDROM detection

etc.) 0xBB Enabling/configuring a removable media DXE Core 0xE4 Entered DXE phase BDS 0xE7 Waiting for user input 0xE8 Checking password 0xE9 Entering BIOS setup 0xEB Calling Leg ac y Option ROMs Runtime Phase/EFI OS Boot 0xF8 EFI boot service ExitBootServices ( ) has been called 0xF9 EFI runtime serv ic e S e tVirtualAddressMap ( ) has been called

Intel Desktop Board DX79TO T echnical Product Spec ification

Table 42. Typical Port 80h POST Sequence

POST Code Description

21 Initializing a c hipset component 22 Reading SPD from memory DIMMs 23 Detecting presence of memory DIMMs 25 Config ur i ng me m o ry 28 Testing memory 34 Loading recovery capsule E4 Enter e d DXE phase 12 Starting ap p l ic ation processor initia liza tio n 13 SMM initialization 50 Enumerating PC I buses 51 Allocating r e s ourced to PCI b us 92 Detecting the presence of the keyboard 90 Resetting k e yboard 94 Clearing k e yboard input buffer 95 Keyboard Self Test EB Calling Video B IOS 58 Resetting USB bus 5A Resetting PATA/SATA b us and all devices 92 Detecting the presence of the keyboard 90 Resetting k e yboard 94 Clearing k e yboard input buffer 5A Resetting PATA/SATA b us and all devices 28 Testing memory 90 Resetting k e yboard 94 Clearing k e yboard input buffer E7 Waiting f or user input 01 INT 19 00 Ready to boot

5 Regulatory Compliance and Battery

Disposal Information

5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop Board DX79TO:

• Safety standards

• European Union Declaration of Conformity statement

• Product Ecology statements

• Electromagnetic Compatibility (EMC) standards

• Product certification mark ings

5.1.1 Safety Standards

Intel Desktop Board DX79TO complies with the safety standards stated in Table 43 when correctly installed in a compatible host system.

Table 43. Safety Standards

Standard Title

CSA/UL 60950-1 Information Tec hnology Equipment – Safety - Part 1: Gene ral

Requirements (USA and Canada)

EN 60950-1 Information Tec hno l o gy Equipment – Safety - Part 1: General

Requirements (Euro pean Union)

IEC 60950-1 Information Techno logy Equipment – Safety - Part 1: Genera l

Requirements (I nte r national)

Intel Desktop Board DX79TO T echnical Product Spec ification

5.1.2 European Union Declaration of Conformity Statement

We, Intel Corporation, declare under our sole responsibility that the product Intel® Desktop Board DX79TO is in conformity with all app licable essential require ments necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive).

The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.

This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC.

Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC, 2006/95/EC a 2002/95/EC.

Dansk Dette produkt er i overensstemmelse med det europæiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Dutch Dit product is in navolging van de bepalingen van Europee s Directief 2004/108/EC, 2006/95/EC & 2002/95/EC.

Eesti Antud toode vastab Euro opa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nõuetele.

Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC määräyksiä.

Français Ce produit est conforme aux exigences de la Directive Européenne 2004/108/EC, 2006/95/EC & 2002/95/EC.

Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC.

Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών

2004/108/EC, 2006/95/EC και 2002/95/EC. Magyar E termék megfelel a 2004/108/EC, 2006/95/EC és 2002/95/EC Európai

Irányelv előírásainak. Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer

2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC,

2006/95/EC & 2002/95/EC. Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC, 2006/95/EC un

2002/95/EC noteikumiem. Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC, 2006/95/EC, ir

2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej

2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet

2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej

2004/108/EC, 206/95/EC i 2002/95/EC.

Regulatory Complia nc e and Battery Disposal Information

中文

Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC, 2006/95/EC & 2002/95/EC.

Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC.

Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív 2004/108/EC, 2006/95/EC a 2002/95/EC.

Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC.

Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC.

Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC, 2006/95/EC ve 2002/95/EC yönergelerine uyar.

5.1.3 Product Ecology Statements

The f ollowing information is provided to address worldwide product ecology concerns and regulations.

5.1.3.1 Disposal Considerations

This product contains the fo llowing mater ials that may b e regulated upon disposal: lead solder on the printed wiring board assembly.

5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intel’s branded products to return used products to selected locations for proper recycling.

Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc.

作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program

（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰当的重复使用处理。

请参考http://www.intel.com/intel/other/ehs/product_ecology

了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。

Deutsch

Als Teil von Intels Engagement für d en Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für ordnungsgemäßes Recyc ling zurückzugeben.

Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte, verfügbaren Standorte, Versandanweisung en, Bedingungen usw., finden Sie auf der

http://www.intel.com/intel/other/ehs/product_ecology

Intel Desktop Board DX79TO T echnical Product Spec ification

Español Como parte de su compromiso de responsabilidad medioambiental, Intel ha

implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado.

Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarc a, los lugares disponibles, instrucciones de envío, términos y condiciones, etc.

Français Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis

en œuvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits usés en les retournant à des adresses spécifiées.

Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, à savoir les produits concernés, les adresses disponibles, les instructions d'expé d ition, les conditions générales, etc.

日本語インテルでは、環境保護活動の一環として、使い終えたインテル

ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクルプログラムを発足させました。

対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in

tel/other/ehs/product_ecology （英語）をご覧ください。

Malay

Sebagai sebahagian daripada komitmennya te rhadap tanggungjawab persek itar a n, Intel telah melaksa nakan Program Kitar Semula Produk untu k membenarka n pengguna-pengguna runcit produk jenama Intel memulangkan produk t erguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.

Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk m endapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syar a t, dsb.

Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o

Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos são reciclados de maneira adequada.

Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponíveis, as instruções de envio, os termos e condições, etc.

Regulatory Complia nc e and Battery Disposal Information

Russian

В качестве части своих обязательств к окружающей среде, в Intel создана программа утилизации продукции Intel (Product Recycling Progr am) для предоставления конечным пользователям марок продукции Intel возможности возврата используемой продукции в специализированные пункты для должной утилизации.

Пожалуйста, обратитесь на веб-сайт

http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой

программе, принимаемых продуктах, местах приема, инструкциях об отправке, положениях и условиях и т.д.

Türkçe

Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya koymuştur.

Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen

http://www.intel.com/intel/other/ehs/product_ecology

Web sayfasına gidin.

5.1.4 EMC Regulations

Intel Desktop Board DX79TO complies with the EMC regulations stated in Table 44 when correctly installed in a compatible host system.

Table 44. EMC Regulations

Regulation Title

FCC 47 CFR Part 15, Subpart B

ICES-003 Interference-Causing Equipment Stand ard, Digital Appar atus . (C ana d a) EN55022 Limits and methods of meas ur e m e nt o f Radio Interf e rence Characteris tic s

EN55024 Information Technology Equipment – Im munity Characteristics Lim its and

EN55022 Australian Communications Autho rity, Standard fo r Ele c tromagnetic

CISPR 22 Limits and methods of me as urement of Radio D is turbance Character istics

CISPR 24 Information Tec hno l o gy Equipment – Immunity Characteristics – Limits

VCCI V-3, V-4 Voluntary Control for Interference b y Information Techno l o gy Equipment.

KN-22, KN-24 Kore a n C o m munic a tio ns Commission – Framework Act on

CNS 13438 Bureau of Standards, Metrology, and Inspection (Taiwan)

Title 47 of the Code of Federal R e gulations, Part 15, Subp a r t B , Radio Frequency Devices. (USA)

of Information Technology Equip me nt. (European Union)

methods of measurement. (European Union)

Compatibility. (Austr ali a and N e w Z e al and )

of Information Technology Equip me nt. (International)

and Methods of Measurement. (International)

(Japan)

Telecommunications and Radio Waves Act (So uth Korea)

Intel Desktop Board DX79TO T echnical Product Spec ification

FCC Declaration of Conformity

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

For questions related to the EMC performance of this produc t , contact: Intel Corporation, 5200 N. E. Elam Young Parkway, Hillsboro, OR 97124

1-800-628-8686 This equipment has been teste d a nd found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment to an outlet o n a circuit other than the one to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help. Any changes or modifications to the equipment not expres sly approved by Intel

Corporation could void the us er’s authority to op erate the equipment. Tested to comply with FCC sta nda rds for home or office use.

Canadian Department o f C o mmun ications Compliance Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interf erence Regulations of the Canadian Department of Comm unications.

Le présent appareil numerique német pas de bruits radioélectriques dépassant les limites applicables aux appareils numériques de la classe B prescrites dans le Réglement sur le broullage radioélectrique édicté par le ministére des Communications du Canada.

Regulatory Complia nc e and Battery Disposal Information

Japan VCCI Statement

Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.

Korea Class B Statement

Korea Class B Statement trans lation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.

Intel Desktop Board DX79TO T echnical Product Spec ification

5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance

The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements.

Intel Desktop Board DX79TO meets the following program requirements in an adequate system c onfiguration, including appropriate selection of a n efficient power supply:

• Energy Star v5.0, category B

• EPEAT*

• Korea e-Standby

• European Union Energy-related Products Directive 2009 (ErP) Lot 6

NOTE

Energy Star compliance is based at the system level not the board level. Use of an Intel Desktop Board alone does not guarantee Energy Star compliance.

For information about Refer to

ENERGY STAR req uirements and recomme nded configuratio ns http://www.intel.com/go/energystar Electronic Produc t Environmental Assessm e nt To ol (EPEAT) http://www.epeat.net/ Korea e-Standby Pr o gram http://www.kemco.or.kr/new_eng/pg02

/pg02100300.asp

European Union Energ y-related Products Directive 200 9 (ErP) http://ec.europa.eu/enterprise/policies/s

ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

Regulatory Complia nc e and Battery Disposal Information

5.1.6 Regulatory Compliance Marks (Board Level)

Intel Desktop Board DX79TO has the regulatory compliance marks shown in Table 45.

Table 45. Regulatory Compliance Marks

Description Mark

UL joint US/Canada Rec o gnized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882.

FCC Declaratio n o f Conformity lo g o mark for Clas s B e quipment.

CE mark. Declaring c o m p li anc e to the European Union (EU) EMC d irective, Low Voltage dire c tive, and RoHS dire c tiv e .

Australian Communications A uthority (ACA) and New Z e aland Radio Spectrum Management (NZ RSM) C-tick mark. Inc lud e s adjacent Intel supplier code num b e r, N-232.

Japan VCCI (Voluntary Control Counc il f or Interfer e nc e ) mark.

Korea Certificati o n ma r k. Includes an adjace nt KC C (Korean Communications Com mis s ion) certification numbe r : KCC-REM-CPU-DX79TO.

Taiwan BSMI (Bureau o f Standards, Metrolo g y and Inspections ) mark. Includes adjacent Intel company number, D33025.

Printed wiring boa r d manufacturer’s r e c o gnition mark. Consists o f a unique UL recognized manuf a c tur e r’s logo, along wi th a f la mm ab il ity rating (solder side).

China RoHS/Environme nta lly Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associa te d c o l late ral. The color of the mark may vary depending upon the app lic ation. The Environmental Friendly Usage Period (EFUP) for Intel De s k top Boards has been determined to be 10 years.

V-0

Intel Desktop Board DX79TO T echnical Product Spec ification

PRÉCAUTION

FORHOLDSREGEL

OBS!

VIKTIGT!

VARO

VORSICHT

AVVERTIMENTO

5.2 Battery Disposal Information

CAUTION

Risk of explosion if the battery is r eplaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.

Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des piles usagées doit respecter les réglementations locales en vigueur en matière de protection de l'environnement.

Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i overensstemmelse med gældende miljølovgivning.

Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier bør kastes i henhold til gjeldende miljølovgivning.

Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljövårdsbestämmelserna.

Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on mahdollista. Käytetyt par i stot on hävitettävä paikallisten ympäristömääräysten mukaisesti.

Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.

Esiste il pericolo di un esplosione se la pila non viene s ostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.

Regulatory Complia nc e and Battery Disposal Information

PRECAUCIÓN

WAARSCHUWING

ATENÇÃO

AŚCIAROŽZNAŚĆ

UPOZORNÌNÍ

Προσοχή

VIGYÁZAT

Existe peligro de explosión si la pila no se c a mbia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las rec omendadas por el fabr icante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.

Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.

Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias usadas deve ser feita de acordo com as regulamentações ambientais da região.

Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу. Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.

V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné, baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními předpisy o životním prostředí.

Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με τους κατά τόπο περιβαλλοντικούς κανονισμούς.

Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi előírásoknak megfelelően kell kiselejtezni.

Intel Desktop Board DX79TO T echnical Product Spec ification

AWAS

OSTRZEŻENIE

PRECAUŢIE

ВНИМАНИЕ

UPOZORNENIE

POZOR

UYARI

OСТОРОГА

Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mes tila h mematuhi peraturan alam sekitar tempatan.

Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi przepisami ochrony środowiska.

Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător. Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să respecte reglementările locale privind protecţia mediului.

При использовании батареи несоответствующего типа существует риск ее взрыва. Батареи должны быть утилизированы по возможности. Утилизация батарей должна проводится по правилам, соответствующим местным требованиям.

Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať v súlade s miestnymi predpismi na ochranu životného pros tredia.

Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo. Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi

okoljevarstvenimi predpisi.

Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.

Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху. Якщо можливо, використані батареї слід утилізувати. Утилізація використаних батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.

Regulatory Complia nc e and Battery Disposal Information

Intel Desktop Board DX79TO T echnical Product Spec ification

Intel DX79TO Specification

Specifications and Main Features

Frequently Asked Questions

User Manual