Intel DX79TO Specification
Intel® Desktop Board
DX79TO
Technical Product Specification
June 2012
Order Number: G44010-003
The Intel® Desktop Board DX79TO may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board DX79TO Specification Update.
Revision History
Revision Revision History Date
-001 First release o f the Intel® Desktop Board DX79TO Technical Product
Specification
-002 Specification Chang e s January 2012
-003 Specification Clarification June 2012
This product spec ification applies to only the standard In te l® Desktop Board DX79TO with BIOS
identifier SIX7910J.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
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IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
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FOR ANY APPLICATION IN WHICH THE FAILURE O F THE INTEL PRODUCT COULD CREATE A SITUATION
WHERE PERSONAL INJUR Y O R DEATH MAY OCCUR.
®
All Intel
computers (PC) fo r installation in homes, offices, schools, co mputer rooms, and si mila r locations. The
suitability of this pr o duct for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, e tc . may not be supporte d without further eva luation by
Intel.
Intel Corporation may have patents o r pending patent applic a tio ns , trademarks, cop y rights, or other
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other materials and inf ormation does not p rovide any license , e x press or implied , by estoppel or otherwise,
to any such patents, trad e ma r ks, copyrights, or other intellectual property rights.
Intel may make change s to specifications and p roduct descrip tions at any time, without notice.
Designers must not rely on the absence o r characteristics o f any features or ins tr uc ti o ns ma r ked “reserved”
or “undefined.” Intel reserves the s e for future def inition and shall have no resp onsibility whatsoev e r for
conflicts or inco mpatibilities arising from future changes to the m .
Intel desktop boards may contain design defects or errors known as errata, which may cause the prod uc t to
deviate from p ub lis he d specifications. C ur rent characterized errata are available o n request.
Contact your local Intel sales office o r your distributor to obtain the latest sp e c ifications befor e p lac i ng y our
product order.
Intel, Intel Core, and Xeon are trademark s o f Intel Corpo r a tio n in the U.S. and/or other c o untries.
* Other names and b rands may be claimed a s the property of others.
Copyright 2011-2012 Intel Corpor ation. All rights reser v e d.
desktop boa r ds are evaluated as Information Techno logy Equipment (I.T.E.) f or use in personal
November 2011
ii
Board Identification Information
Basic Desktop Board DX79TO Identification Information
AA Revision BIOS Revision Notes
G28805-400 SIX7910J.86A.0281 1,2
Notes:
1. The AA number is fo und on a small label on the comp o ne nt s ide of the board.
2. The X79 PCH used on this A A revision consists of the following c o m p onent:
Device Stepping S-Spec Numbers
82X79 PCH C0 SLJHW
Specification Changes or Clarifications
Table 1 indicates the Specification Changes or Specification Clarifications that apply to
the Intel
®
Desktop Board DX79TO.
Table 1. Specification Changes or Clarifications
Date Type of Change Description of Changes or C larifications
January 2012 Spec Change Added Section 1.12.2.10 Power S upervisor
June 2012 Spec Clarification Corrected the order of items in Table 10
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.
iii
Intel Desktop Board DX79TO T echnical Product Spec ification
iv
3
The features supported by the BIOS Setup program
Preface
This Technical Product Specification (TPS) specifies the board layo ut, components,
connectors, power and environmental requirements, and the BIOS for the
®
Intel
Desktop Board DX79TO.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DX79TO and its components to the v endors, system integrators, and other
engineers and technicia ns who need this level of information. It is specifically not
intended for general audiences.
What This Document Contai ns
Chapter Description
1 A description of the hardwar e used on the Intel Desktop Board DX79TO
2 A map of the resources of the Intel Desk top Board
4 A description of the BIOS er r or m es s a ges , beep codes, and POST codes
5 Regulatory compliance and battery disp os al information
Typographical Conventions
This section cont ains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attentio n to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing da ta.
v
Intel Desktop Board DX79TO T echnical Product Spec ification
Other Common Notation
# Used after a signal na me to identify an active-low s ig na l (s uc h as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilo bit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or d ata v al ue ending with a lowercas e h ind ic a te s a he x a d e c im al v a lue .
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the p roperty of thei r
respective owners.
vi
Contents
1 Product Description
1.1 Overview ......................................................................................... 11
1.1.1 Feature Summary ................................................................. 11
1.1.2 Board Layout ........................................................................ 13
1.1.3 Block Diagram ...................................................................... 15
1.2 Legacy Considerations ....................................................................... 16
1.3 Online Support ................................................................................. 16
1.4 Processor ........................................................................................ 16
1.4.1 PCI Express x16 Graphics ....................................................... 17
1.5 System Memory ............................................................................... 17
1.5.1 Memory Configurations .......................................................... 19
1.6 Intel
1.7 Real-Time Clock Subsyst em ............................................................... 23
1.8 Legacy I/O Controller ........................................................................ 23
1.9 Audio Subsystem .............................................................................. 24
1.10 LAN Subsystem ................................................................................ 26
1.11 Hardware Management Subsystem ..................................................... 28
1.12 Power Management .......................................................................... 30
1.13 Board Status LEDs ............................................................................ 37
1.14 Onboard Power and Reset Buttons ...................................................... 39
1.15 Trusted Platform Module (TPM) .......................................................... 40
®
X79 Express Chipset ................................................................ 21
1.6.1 USB ..................................................................................... 21
1.6.2 SATA Interfaces .................................................................... 21
1.8.1 Consumer Infrared (CIR) ........................................................ 23
1.9.1 Audio Subsystem Software ..................................................... 24
1.9.2 Audio Subsystem Components ................................................ 24
1.10.1 Intel
®
82579L Gigabit Ethernet Controller ................................. 26
1.10.2 LAN Subsystem Software ....................................................... 27
1.10.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.11.1 Hardware Monitoring and Fan Control ...................................... 28
1.11.2 Fan Monitoring ...................................................................... 28
1.11.3 Chassis Intrusion and Detection .............................................. 28
1.11.4 Thermal Monitoring ............................................................... 29
1.12.1 ACPI .................................................................................... 30
1.12.2 Hardware Support ................................................................. 33
vii
Intel Desktop Board DX79TO T echnical Product Spec ification
2 Technical Reference
2.1 Memory Resources ........................................................................... 41
2.1.1 Addressable Memory ............................................................. 41
2.1.2 Memory Map ......................................................................... 43
2.2 Connectors and Headers .................................................................... 43
2.2.1 Back Panel Connectors ........................................................... 44
2.2.2 Component-side Connectors and Headers................................. 46
2.3 Jumper Block ................................................................................... 55
2.4 Mechanical Considerations ................................................................. 57
2.4.1 Form Factor .......................................................................... 57
2.5 Electrical Considerations .................................................................... 58
2.5.1 Power Supply Considerations .................................................. 58
2.5.2 Fan Header Current Capability ................................................ 59
2.5.3 Add-in Board Considerations ................................................... 59
2.6 Thermal Considerations ..................................................................... 60
2.7 Reliability......................................................................................... 62
2.8 Environmental .................................................................................. 62
3 Overview of BIOS Features
3.1 Introduction ..................................................................................... 63
3.2 BIOS Flash Memory Organization ........................................................ 64
3.3 Resource Configuration ..................................................................... 64
3.3.1 PCI Autoconfiguration ............................................................ 64
3.4 System Management BIOS (SMBIOS) ................................................. 65
3.5 Legacy USB Support ......................................................................... 65
3.6 BIOS Updates .................................................................................. 66
3.6.1 Language Support ................................................................. 66
3.6.2 Custom Splash Scr een ........................................................... 67
3.7 BIOS Recovery ................................................................................. 67
3.8 Boot Options .................................................................................... 68
3.8.1 Optical Drive Boot ................................................................. 68
3.8.2 Network Boot ........................................................................ 68
3.8.3 Booting Without Attached Devices ........................................... 68
3.8.4 Changing the Default Boot Device During POST ......................... 68
3.9 Adjusting Boot Speed ........................................................................ 69
3.9.1 Peripheral Selection and Configuration ..................................... 69
3.9.2 BIOS Boot Optimizations ........................................................ 69
3.10 BIOS Security Features ..................................................................... 70
3.11 BIOS Performance Features ............................................................... 71
4 Error Messages and Beep Cod es
4.1 Speaker .......................................................................................... 73
4.2 BIOS Beep Codes ............................................................................. 73
4.3 Front-panel Power LED Blink Codes ..................................................... 74
4.4 BIOS Error Messages
4.5 Port 80h POST Codes ........................................................................ 75
viii
........................................................................ 74
Contents
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 81
5.1.1 Safety Standards................................................................... 81
5.1.2 European Union Declaration of Conformity Statement ................ 82
5.1.3 Product Ecology Statements ................................................... 83
5.1.4 EMC Regulations ................................................................... 85
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 88
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 89
5.2 Battery Disposal Information .............................................................. 90
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration ............................................ 20
4. Back Panel Audio Connectors ............................................................. 25
5. LAN Connector LED Locations ............................................................. 27
6. Thermal Sensors and Fan Headers ...................................................... 29
7. Location of Board Status LEDs ............................................................ 37
8. Location of the Onboard Power and Reset Buttons ................................ 39
9. Detailed System Memory Address Map ................................................ 42
10. Back Panel Connectors ...................................................................... 44
11. I/O Shield Reference Diagram ............................................................ 45
12. Component-side Connectors and Headers ............................................ 46
13. Connection Diagram for Front Panel Header ......................................... 52
14. Connection Diagram for Front Panel USB 2.0 Headers ........................... 54
15. Location of the Jumper Block ............................................................. 55
16. Board Dimensions ............................................................................. 57
17. Localized High Temperature Zones ..................................................... 61
Tables
1. Specification Changes or Clarifications ................................................... iii
2. Feature Summary ............................................................................. 11
3. Components Shown in Figure 1 .......................................................... 14
4. Supported Memory Configurations ...................................................... 18
5. Audio Jack Support ........................................................................... 24
6. LAN Connector LED States ................................................................. 27
7. Effects of Pressing the Power Switch ................................................... 30
8. Power States and Targeted System Power ........................................... 31
9. Wake-up Devices and Events ............................................................. 32
10. Board Status LEDs ............................................................................ 38
11. System Memory Map ........................................................................ 43
12. Component-side Connectors and Headers Shown in Figure 12 ................ 47
13.
Front Panel Audio Header for Intel HD Audio ........................................ 48
14. Front Panel Audio Header for AC ’97 Audio ........................................... 48
ix
Intel Desktop Board DX79TO T echnical Product Spec ification
15. IEEE 1394a Header ........................................................................... 49
16. SATA Connectors .............................................................................. 49
17. USB 2.0 Headers .............................................................................. 49
18. Chassis Intrusion Header ................................................................... 49
19. Processor, Front and Rear Chassis, and Auxiliary (4-Pin) Fan Headers ..... 49
20. Back Panel CIR Emitter (Output) Header ............................................. 50
21. Front Panel CIR Receiver (Input) Header ............................................. 50
22. Processor Core Power Connec t or ........................................................ 51
23. Main Power Connector ....................................................................... 51
24. Front Panel Header ........................................................................... 52
25. States for a One-Color Power LED ....................................................... 53
26. States for a Two-Color Power LED ...................................................... 53
27. BIOS Setup Configuration Jumper Settings .......................................... 56
28. Recommended Power Supply Current Values ........................................ 58
29. Fan Header Current Capability ............................................................ 59
30. Thermal Considerations for Components .............................................. 61
31. Environmental Specifications .............................................................. 62
32. BIOS Setup Program Menu Bar ........................................................... 64
33. BIOS Setup Program Function Keys .................................................... 64
34. Acceptable Drives/Media Types for BIOS Recovery ................................ 67
35. Boot Device Menu Options ................................................................. 68
36. Supervisor and User Password Functions ............................................. 70
37. BIOS Beep Codes ............................................................................. 73
38. Front-panel Power LED Blink Codes ..................................................... 74
39. BIOS Error Messages ........................................................................ 74
40. Port 80h POST Code Ranges .............................................................. 75
41. Port 80h POST Codes ........................................................................ 76
42. Typical Port 80h POST Sequence ........................................................ 80
43. Safety Standards .............................................................................. 81
44. EMC Regulations ............................................................................... 85
45. Regulatory Compliance Marks ............................................................ 89
x
®
Intel
®
X79 Express Chip s e t c onsisting of the Inte l® X79 Platform Controller
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 2 summarizes the major features of the board.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Audio Intel® High Definition Audio s ubsystem using the Realte k* ALC892 audio co d e c
Legacy I/O Control Nuvoton* legacy I/O controller for Consumer Infrared (CI R )
Peripheral
Interfaces
ATX (12.00 inches b y 9.60 inches [30 4 .80 millimeters by 243.84 millimeters])
• Intel
• Eight 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) so c kets
• Support for DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz,
• Support for 1 Gb, 2 Gb, and 4 Gb memory technology
• Support for up to 64 GB of system mem o ry with eight DIMMs us ing 4 Gb
• Support for non-ECC and ECC memory
• Support for 1.35 V low voltage JEDEC memory
• Support for XMP memory
• Support for manual memory ove r clocking (voltag e , cl o c k, ratio)
Hub (PCH)
• Two USB 3.0 ports are implemented with stacked back p ane l c onnectors
• Fourteen USB 2.0 ports:
• Two Serial ATA (SATA) 6.0 Gb/s interfaces through the I nte l X79 Express
• Four internal SATA 3.0 Gb/s interfac e s through the Intel X79 Express Chipset
• Two IEEE 1394a ports:
Core™ i7 and I ntel® Xeon® processors in an LGA2011 socket:
― Two PCI Express 3.0 x16 graphics interfaces
― Four DDR3 memory channels (Quad Channel total of 8 DIMMs)
arranged as fo ur channels
and 1066 MHz DIMMs
memory technolo g y
(blue)
― Six ports are implemented with stacked back panel connec to rs (black)
― Eight front panel ports implemented through four internal he ad e rs
Chipset with Intel
with Intel Rapid S to rage Technology RAID support (black)
― One port via a back panel connector
― One port via a fr ont-panel header (blue)
®
Rapid Storag e Te c hno l o gy RAID support (blue)
continued
11
Intel Desktop Board DX79TO T echnical Product Spec ification
®
Support for PC I* Local Bus Spec ification Revision 2.2
®
Table 2. Feature Summary (continued)
BIOS
Instantly Available
PC Technology
LAN Support
Expansion
Capabilities
Hardware Monitor
Subsystem
• Intel
• Support for Advanced Conf i g uration and Power I nte r face (ACPI), Plug and
• Fast Boot
• Support for advanced over clocking
•
• Support for PCI Express * Revision 3.0
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, CIR, and US B ports
Gigabit (10/100/1000 Mbits/s) LAN s ub s ystem using the Intel
Ethernet Controller
• Two PCI Express 3.0 x16 connectors
• Three PCI Express 2.0 x1 bus add-in card connectors f r om the PCH
• One Conventional PCI bus add-in card connector from the PC H
• Hardware monitoring and fan contro l through the Nuvoton I/O controller
• Voltage sense to detect out of range p ower supply voltages
• Thermal sense to detect out of range thermal values
• Four fan headers using PWM control
• Four fan sense inputs used to monitor fan activity
• Fan speed control using voltage co ntrol (4-pin fan headers for processor,
• Support for Platform Environme nta l C ontrol Interfac e (PEC I)
BIOS resid e nt in the S PI Flash device
Play, and SMBIOS
front, rear, and auxiliary) with selectable s up port in BIOS for 3 wire fans
82579L Gigabit
12
Product Description
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DX79TO.
Figure 1. Major Board Components
Table 3 lists the components identified in Figure 1.
13
Intel Desktop Board DX79TO T echnical Product Spec ification
Label
Description
A
Front panel audio he ad e r
B
PCI Express x1 add-in card connecto r
C
PCI Express x1 add-in card connecto r
D
Piezoelectric speaker
E
Conventional PCI add-in card connector
F
PCI Express 3.0 x16 add-in card connector
H
PCI Express 3.0 x16 add-in card connector
I
Rear chassis fan header
J
Battery
L
Processor fan header
M
DIMM 1 (Channel A, DIMM 0)
N
DIMM 5 (Channel B, DIMM 0)
P
DIMM 6 (Channel B, DIMM 1)
Q
LGA2011 processor socket
R
12 V processor core voltage connector (2 x 4 pin)
S
DIMM 8 (Channel D, DIMM 1)
T
DIMM 4 (Channel C, DIMM 1)
U
DIMM 7 (Channel D, DIMM 0)
V
DIMM 3 (Channel C, DIMM 0)
W
Main power connector (2 x 12 pin)
X
Front chassis fan he ader
Y
3.0 Gb/s SATA connectors (black) and 6.0 Gb/s SATA conne c tors (blue)
Z
Intel X79 Express Chipset
AA
Front panel USB 2 .0 headers (4)
CC
BIOS Setup co nfiguration jumper b lock
DD
Power Fault LED
EE
Alternate front pa ne l p ower LED header
GG
Voltage measureme nt te s t p oints
HH
Front panel header
II
Post Code LED dis p lay
KK
Onboard Rese t b utton
LL
Onboard Power button
MM
Chassis intrusion heade r
OO
Board Status LEDs
Table 3. Components Shown in Figure 1
G PCI Express x1 add-in card connecto r
K Back p anel connectors
O DIMM 2 (Channel A, DIMM 1 )
BB Consumer IR e mitte r (output) header
FF Consumer IR receiver (input) head e r
JJ Front panel IEEE 1 394a header
NN Auxiliary fan heade r
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Product Description
Figure 2. Block Diagram
15
Intel Desktop Board DX79TO T echnical Product Spec ification
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No parallel port connector
• No floppy drive connector
• No PS/2 connectors
1.3 Online Support
To find information a bout… Visit this World Wide Web site:
Intel Desktop B oard DX79TO http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available config ur a tio ns for the Intel
Desktop Board DX79TO
Supported processors http://processormatch.intel.com
Chipset informatio n http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
Integration info r m ation http://www.intel.com/support/go/buildit
http://ark.intel.com
025414.htm
1.4 Processor
The board is designed to support Intel Core i7 and Intel Xeon processors in an
LGA2011 socket
Other processors may be supported in the future. This boa rd is designed to support
processor s with a maximum wattage of 130 W with margin to allow for greater than
200 W operation. The processors listed above are only supported when falling within
the wattage requirements of the Intel Desktop Board DX79TO. See the Intel web site
listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power s upp ly.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.5.1 on page 58 for information on power supply requirements for this board.
16
Product Description
1.4.1 PCI Express x16 Graphics
Intel Core i7 and Intel Xeon processors in an LGA2011 package support PCI Express
add-in graphics cards via the board’s PCI Express x16 connectors. These processors
support the following generations of PCI Express:
• PCI Express 3.0 with a raw bit rate of 8.0 GT/s results in an effective bandwidth of
8.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 16 GB/s in each direction, simultaneously, for a bandwidth of 32 GB/s.
• PCI Express 2.x with a raw bit rate of 5.0 GT/s results in an effective bandwidth of
4.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 8 GB/s in each direc tion, simultaneously, for a bandwidth of 16 GB/s.
• PCI Express 1.x with a raw bit rate of 2.5 GT/s results in an effective bandwidth of
2.0 Gb/s each direction per lane. The maximum theoretical bandwidth of the x16
interface is 4 GB/s in each direc tion, simultaneously, for a bandwidth of 8 GB/s.
For information about Refer to
PCI Express te c hnology http://www.pcisig.com
1.5 System Memory
The board has eight DIMM sockets and supports the following memory features:
• 1.35 V DDR3 SDRAM DIMMs (JEDEC Specification)
• Four independent memory channels with interleaved mode support
• Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not suppor ted.
• 64 GB maximum total system memory (us ing 4 Gb memory technology). Refer to
Section 2.1.1 on page 41 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 512 MB x16 module
• Non-ECC and ECC DIMMs
• Serial Presence Detect
• DDR3 2400 MHz, 2133 MHz, 1866 MHz, 1600 MHz, 1333 MHz, and 1066 MHz
SDRAM DIMMs
• XMP performance profile support for memory speeds above 1600 MHz
• Full support for over clocking memory (see
www.intel.com/support/motherboards/desktop/sb/CS-031689.htm for more
information about over clocking)
• DIMM slots are numbered in installation order
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications , the board
should be populated with DIMMs that support the Seri a l Presence Detect (SPD) data
structure. This al lows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance.
17
Intel Desktop Board DX79TO T echnical Product Spec ification
CAUTION
1.5 V is the recommended and default setting for DDR3 memory voltage. The other
memory voltage settings in the BIOS Setup program are provided for performance
tuning purposes only. Altering the memory voltage may (i) reduce system stability
and the useful life of the system, memory, and processor; (ii) cause the processor and
other system components to fail; (iii) cause reductions in system performance; (iv )
cause additional heat o r other damage; and (v) a ffect system data i ntegrity.
Intel has not tested and does not warranty the operation of the processor beyond its
specifications. For information on the processor warranty, refer to
http://www.intel.com/support/processors/sb/CS-
020033.htm?wapkw=(processor+warranty).
Intel assumes no r esponsibility that the memory installed on the desktop board, if used
with altered clock frequencies and/or voltages, will be fit for any particular purpose.
Check with the memory manufacturer for warranty terms and additional details.
Table 4 lists the supported DIMM configurations.
Table 4. Supported Memory Configurations
DIMM
Capacity Configuration
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memo ry modules (containing tw o rows of SDR A M) and “SS” refer s to
single-sided memor y modules (containing o ne r ow of SDRAM).
(Note)
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
XMP Tested Memory http://www.intel.com/personal/gaming/extremememory.htm
SDRAM
Density
025414.htm
SDRAM Organization
Front-side/Back-side
Number of SDRA M
Devices
18
Product Description
1.5.1 Memory Configurations
The Intel Core i7 and Intel Xeon processors support the following types of memory
organization:
• Quad channel (Interleaved) mode. This mode offers the highest throughput fo r
real world applicat ions.
• Tri channel (Interleaved) mode. Tri channel mode is enabled when the installed
memory capacities of any three DIMM channels are equal.
• Dual channel (Interleaved) mode. Dual channel mod e is enabled when the
installed memory capacities of both DIMM channels are equal. Technology and
device width can vary from one channel to the other but the installed memory
capacity for each channel must be equal. If different speed DIMMs are used
between channels, the slowest memory timing will be used.
• Single channel (Asy mme tr ic) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Config uration Examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
19
Intel Desktop Board DX79TO T echnical Product Spec ification
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
For best memory performance always install memory into the blue DIMM memory
sockets if installing four DIMMs or less in your configuration.
20
Product Description
1.6 Intel® X79 Express Chipset
The Intel X79 Express Chipset consisting of the Intel X79 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LAN, PCI, and PCI
Express interfaces. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel X79 Express Chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 USB
The board support s up to 14 USB 2.0 ports and two USB 3.0 ports.
The Intel X79 Express Chipset provides the USB controller for the 2.0 ports. The two
USB 3.0 ports are p rovided by an NEC* UPD720200 controller. The port arrangement
is as follows:
• Two USB 3.0 ports a re implemented with stacked back panel connectors (blue)
• Six USB 2.0 ports are implemented with stacked back panel connectors (black)
• Eight USB 2.0 front panel ports implemented through four internal headers
All 16 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports
are super-speed capable.
NOTES
Computer systems that have an unshielded cable attached to a USB por t m a y not meet
FCC Class B requirements, even if no device is attached to the cable. Use a shielded
cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB c onnectors on the back panel Figure 10, page 44
The location of the front panel USB headers Figure 12, page 46
1.6.2 SATA Interfaces
The board provides six SATA connectors through the PCH which support one device per
connector:
• Two internal SATA 6.0 Gb/s connectors (blue)
• Four internal SATA 3.0 Gb/s connectors (black)
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
6.0 Gb/s for two ports and 3.0 Gb/s for four ports. A point-to-point interface is used
for host to device connections.
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Intel Desktop Board DX79TO T echnical Product Spec ification
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Microsoft Windows* XP, Windows Vista*, and Windows 7
operating systems.
NOTE
Many SATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/.
For information about Refer to
The location of the SA TA c onnectors Figure 12, page 46
1.6.2.1 SATA RAID
The board supports the following RAID (Redundant Array of Independent Drives) levels
via the PCH:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
NOTE
In order to use supported RAID features, you must f i rst enable RAID in the BIOS . Also,
during Microsoft Windows XP installation, you must press F6 to install the RAID drivers.
See your Micros oft Windows XP documentation f or more information about installing
drivers during installation. Both Microsoft Windows Vista and Micros oft Windows 7
include the necess a ry RAID drivers for both AHCI and RAID without the need to install
separate RAID drivers using the F6 switch in the operating system ins ta l lation process.
22
Product Description
1.7 Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the
computer is not plugged into a wall socket, the battery has an estimated life of three
years. When the computer is plugged in, the standby current from the power supply
extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC
with 3.3 VSB applied via the power supply 5V STBY rail.
NOTE
If the battery and AC po w er fail, date and time values will be reset and the user will be
notified during POST.
When the voltage drops b elow a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
1.8 Legacy I/O Controller
The I/O controller provides the following features:
• Consumer Infrared (CIR) headers
• Serial IRQ interface compatible with serialized IRQ support for PCI systems
• Intelligent power management, including a programmable wake-up event interface
• PCI power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.8.1 Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer
Infrared usage models. Microsoft Windows Vista and Microsoft Windows 7 are the
supported operating systems.
The CIR feature is made up of two separate pieces: the receiving (receiver) header,
and the output (emitter) header. The receiving header consists of a filtered translated
infrared input compliant with Microsoft CI R specifications, and also a “learning”
infrared input. This learning input is simply a high pass input which the computer can
use to “learn” to speak the infrared communication language of other user remotes.
The emitter header consists of two output ports which the PC can use to emulate
“learned” infrared commands in order to control external electronic hardware.
Customers are required to buy or create their own interface modules to p lug into I ntel
Desktop Boards for this feature to work.
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Intel Desktop Board DX79TO T echnical Product Spec ification
1.9 Audio Subsystem
The board support s the Intel High Definition Audio subsystem bas ed on the Realtek
ALC892 audio codec. The audio subsystem supports the following features:
• Advanced jack sense fo r the back panel audio jacks that enables the audio codec to
recognize the device tha t is connected to an audio por t . The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output for a ll back pa nel jacks
• Line out and Mic in functions for front panel audio jacks
• A signal-to-noise (S/N) ratio of 90 dB
Table 5 lists the supported functions of the fro nt pa nel and back panel audio jacks.
Table 5. Audio Jack Support
Audio Jack
FP Green Default
FP Pink Default
Rear Blue Default
Rear Green Ctrl panel Default
Rear Pink Default Ctr l p a ne l
Microphone
Head-
phones
Front
Speaker Line In
Side
Surround
1.9.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining audio sof tw a r e and drivers Section 1.3, page 16
1.9.2 Audio Subsystem Components
The audio subsystem includes the following components:
• Intel X79 Express Chipset
• Realtek ALC892 audio codec
• Front panel audio header that supports Intel HD audio and AC ’97 audio (a 2 x 5-
pin header that provides mic in and line out signals for front panel audio
connectors) (yellow)
• 3-port analog audio input/output stack on the back panel
The back panel audio connectors are configurable through the audio device drivers.
The available configurable back panel audio connectors are shown in Figure 4.
24
Item Description
A Line in
B Line out/front speak e rs
C Mic in/side surround
Figure 4. Back Panel Audio Connectors
Product Description
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about Refer to
The locations of the f ront panel audio header Figure 12, page 46
The signal names of the f ront panel audio header Section 2.2.2.1, page 48
The back panel audio c onnectors Section 2.2.1, page 44
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Intel Desktop Board DX79TO T echnical Product Spec ification
1.10 LAN Subsystem
The Intel GbE LAN subsystem consists of the following:
• Intel 82579L Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• Intel X79 Express Chipset
• RJ-45 LAN connectors with integrated status LEDs
Additional features of the LAN subsystem include:
• CSMA/CD protocol engine
• LAN connect interface between the PCH and the LAN controller
• Conventional PCI bus power management
ACPI tec hnology support
LAN wake capabilities
• LAN subsystem software
For information about Refer to
LAN software and d rivers http://downloadcenter.intel.com
1.10.1 Intel® 82579L Gigabit Ethernet Controller
The Intel 82579L Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• Energy Efficient Ethernet (EEE) I EEE802.3az support [Low Power Idle (LPI) mode]
• Dual interconnect between the Integrated LAN Controller and the Physical Layer
(PHY):
PCI Express-based interface f or active state operation (S0) state
SMBUS for host and management traff ic (Sx low power state)
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Full device driver compatibility
• Provides lower power usage to meet Energy Star 5.0 and ErP spe cifications
26
Product Description
1.10.2 LAN Subsystem Software
LAN software and drivers are available from Intel’s World Wide Web site.
For information about Refer to
Obtaining LAN softw are and drivers http://downloadcenter.intel.com
1.10.3 RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link LED (Green)
B Data Rate LED (Green/Ye llow)
Figure 5. LAN Connector LED Locations
Table 6 describes the LED states w hen the board is power ed up and the LAN
subsystem is opera ting.
Table 6. LAN Connector LED States
LED LED Color LED State Condition
Off LAN link is not establishe d .
Link Green
Data Rate Green/Yellow
On LA N link is e s tablished.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected.
Green 100 Mbits/s data rate is selected.
Yellow 1000 Mbits/s data rate is selected.
27
Intel Desktop Board DX79TO T echnical Product Spec ification
1.11 Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.11.1 Hardware Monitoring and Fan Control
The hardware monitoring and fan control subsystem is based on the Winbond
W83677HG-I device, which s upports the following:
• Processor and system ambient temperature monitoring
• Chassis fan speed monitoring
• Power monitoring of +12 V, +5 V, +3.3 V, V_SM1, V_SM2, 3.3V_Standby and
+VCCP
• SMBus interface
1.11.2 Fan Monitoring
Fan monitoring can be implemented using Intel® Extreme Tuning Utility, Intel®
Desktop Utility, or third-party software.
For information about Refer to
The functions of the f an he aders Section 1.12.2.2, page 34
1.11.3 Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.
For information about Refer to
The location of the chas s is intrusion header Figure 12, page 46
28
1.11.4 Thermal Monitoring
Figure 6 shows the locations of the thermal sensors and fan headers.
Product Description
Item Description
A Rear chassis fan header
B Processor fan header
C Thermal diode, located on processor d ie
D F ront chassis fan heade r
E Intel X79 Express Chipset
F Auxiliary fan header
Figure 6. Thermal Sensors and Fan Headers
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