Intel BOXD925XEBC2LK - Desktop Board D925XEBC2LK, D925XEBC2, D925XEBC2LK - Desktop Board Motherboard, D925XECV2 User Manual

Intel® Desktop Boards D925XECV2/D925XEBC2
Technical Product Specification
The Intel® Desktop Boards D925XECV2/D925XEBC2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Boards D925XECV2/D925XEBC2 Specification Update.
October 2004 Order Number: C90152-001
Revision History
Revision Revision History Date
-001 First release of the Intel® Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
October 2004
This product specification applies to only standard Intel
®
Desktop Boards D925XECV2 and
D925XEBC2 with BIOS identifier CV92510A.86A. Changes to this specification will be published in the Intel Desktop Boards
D925XECV2/D925XEBC2 Specification Update before being incorporated into a revision of this document.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. INTEL PRODUCTS ARE NOT INTENDED FOR USE IN MEDICAL, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS.
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Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
®
Intel
desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
®
PRODUCTS INCLUDING LIABILITY OR WARRANTIES
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from: Intel Corporation
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* Other names and brands may be claimed as the property of others. Copyright © 2004, Intel Corporation. All rights reserved.
Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for these Intel D925XECV2 and D925XEBC2. It describes the standard product and available manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Boards D925XECV2 and D925XEBC2 and their components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains
®
Desktop Boards:
Chapter Description
1 A description of the hardware used on the Desktop Boards D925XECV2 and
D925XEBC2 2 A map of the resources of the Desktop Boards 3 The features supported by the BIOS Setup program 4 A description of the BIOS error messages, beep codes, and POST codes
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
#
NOTE
Notes call attention to important information.
INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
WARNING
Warnings indicate conditions, which if not observed, can cause personal injury.
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#) (NxnX) When used in the description of a component, N indicates component type, xn are the relative
coordinates of its location on the Desktop Boards D925XECV2 and D925XEBC2, and X is the instance of the particular part at that general location. For example, J5J1 is a connector,
located at 5J. It is the first connector in the 5J area. GB Gigabyte (1,073,741,824 bytes) GB/sec Gigabytes per second KB Kilobyte (1024 bytes) Kbit Kilobit (1024 bits) kbits/sec 1000 bits per second MB Megabyte (1,048,576 bytes) MB/sec Megabytes per second Mbit Megabit (1,048,576 bits) Mbit/sec Megabits per second xxh An address or data value ending with a lowercase h indicates a hexadecimal value. x.x V Volts. Voltages are DC unless otherwise specified. * This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 PCI Bus Terminology Change......................................................................................11
1.2 Board Differences ........................................................................................................11
1.3 Overview......................................................................................................................12
1.3.1 Feature Summary..........................................................................................12
1.3.2 Manufacturing Options ..................................................................................13
1.3.3 Board Layouts ...............................................................................................14
1.3.4 Block Diagram...............................................................................................18
1.4 Online Support.............................................................................................................19
1.5 Processor.....................................................................................................................19
1.6 System Memory...........................................................................................................20
1.6.1 Memory Configurations .................................................................................21
1.7 Intel® 925XE Chipset ...................................................................................................25
1.7.1 USB...............................................................................................................25
1.7.2 IDE Support...................................................................................................25
1.7.3 Real-Time Clock, CMOS SRAM, and Battery................................................28
1.8 PCI Express Connectors..............................................................................................28
1.9 Auxiliary Power (AUX PWR) Output Connector...........................................................28
1.10 I/O Controller................................................................................................................29
1.10.1 Serial Port......................................................................................................29
1.10.2 Parallel Port...................................................................................................29
1.10.3 Diskette Drive Controller................................................................................30
1.10.4 Keyboard and Mouse Interface .....................................................................30
1.11 Audio Subsystem .........................................................................................................31
1.11.1 Audio Subsystem Software ...........................................................................31
1.11.2 Audio Connectors..........................................................................................31
1.11.3 8-Channel (7.1) Audio Subsystem.................................................................32
1.11.4 6-Channel (5.1) Audio Subsystem.................................................................34
1.12 LAN Subsystem ...........................................................................................................35
1.12.1 Marvell Yukon 88E8050 PCI Express 1.0a Integrated MAC/PHY
Gigabit Ethernet Controller............................................................................35
1.12.2 RJ-45 LAN Connector with Integrated LEDs.................................................35
1.12.3 Alert Standard Format (ASF) Support...........................................................36
1.12.4 LAN Subsystem Software..............................................................................36
1.13 Hardware Management Subsystem.............................................................................37
1.13.1 Hardware Monitoring and Fan Control ASIC.................................................37
1.13.2 Thermal Monitoring........................................................................................38
1.13.3 Fan Monitoring...............................................................................................40
1.13.4 Chassis Intrusion and Detection....................................................................40
1.14 Power Management.....................................................................................................40
1.14.1 ACPI..............................................................................................................40
1.14.2 Hardware Support .........................................................................................43
v
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.15 Trusted Platform Module (Optional).............................................................................47
1.15.1 System Requirements...................................................................................47
1.15.2 Warning of Potential Data Loss.....................................................................47
1.15.3 Security Precautions......................................................................................48
1.15.4 Trusted Platform Module Ownership.............................................................49
1.15.5 Enabling the Trusted Platform Module..........................................................50
1.15.6 Assuming Trusted Platform Module Ownership............................................50
1.15.7 Recovery Procedures....................................................................................51
1.15.8 Clearing Trusted Platform Module Ownership...............................................52
1.15.9 Software Support...........................................................................................53
2 Technical Reference
2.1 Introduction ..................................................................................................................55
2.2 Memory Resources......................................................................................................55
2.2.1 Addressable Memory.....................................................................................55
2.2.2 Memory Map..................................................................................................57
2.3 DMA Channels.............................................................................................................57
2.4 Fixed I/O Map...............................................................................................................58
2.5 PCI Configuration Space Map......................................................................................59
2.6 Interrupts......................................................................................................................60
2.7 PCI Conventional Interrupt Routing Map .....................................................................61
2.8 Connectors...................................................................................................................63
2.8.1 Back Panel Connectors.................................................................................63
2.8.2 Component-side Connectors.........................................................................68
2.9 Jumper Block ...............................................................................................................80
2.10 Mechanical Considerations..........................................................................................81
2.10.1 D925XECV2 Form Factor..............................................................................81
2.10.2 D925XEBC2 Form Factor..............................................................................82
2.10.3 I/O Shield.......................................................................................................83
2.11 Electrical Considerations..............................................................................................85
2.11.1 DC Loading....................................................................................................85
2.11.2 Add-in Board Considerations.........................................................................85
2.11.3 Fan Connector Current Capability.................................................................86
2.11.4 Power Supply Considerations .......................................................................86
2.12 Thermal Considerations...............................................................................................87
2.13 Reliability......................................................................................................................89
2.14 Environmental ..............................................................................................................90
2.15 Regulatory Compliance................................................................................................91
2.15.1 Safety Regulations ........................................................................................91
2.15.2 EMC Regulations...........................................................................................91
2.15.3 European Union Declaration of Conformity Statement..................................92
2.15.4 Product Ecology Statements.........................................................................93
2.15.5 Product Certification Markings (Board Level)................................................94
vi
3 Overview of BIOS Features
3.1 Introduction ..................................................................................................................95
3.2 BIOS Flash Memory Organization ...............................................................................96
3.3 Resource Configuration ...............................................................................................96
3.3.1 PCI Autoconfiguration....................................................................................96
3.3.2 PCI IDE Support............................................................................................96
3.4 System Management BIOS (SMBIOS) ........................................................................97
3.5 Legacy USB Support....................................................................................................97
3.6 BIOS Updates..............................................................................................................98
3.6.1 Language Support.........................................................................................98
3.6.2 Custom Splash Screen..................................................................................98
3.7 Boot Options ................................................................................................................99
3.7.1 CD-ROM Boot ...............................................................................................99
3.7.2 Network Boot.................................................................................................99
3.7.3 Booting Without Attached Devices................................................................99
3.7.4 Changing the Default Boot Device During POST..........................................99
3.8 Fast Booting Systems with Intel® Rapid BIOS Boot...................................................100
3.8.1 Peripheral Selection and Configuration.......................................................100
3.8.2 Intel Rapid BIOS Boot .................................................................................100
3.9 BIOS Security Features .............................................................................................101
Contents
4 Error Messages and Beep Codes
4.1 BIOS Error Messages................................................................................................103
4.2 Port 80h POST Codes ...............................................................................................105
4.3 Bus Initialization Checkpoints ....................................................................................109
4.4 Speaker ..................................................................................................................... 110
4.5 BIOS Beep Codes......................................................................................................110
Figures
1. Desktop Board D925XECV2 Components...................................................................14
2. Desktop Board D925XEBC2 Components...................................................................16
3. Block Diagram..............................................................................................................18
4. Memory Channel and DIMM Configuration..................................................................21
5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs ..............................22
6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs............................22
7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs..............................23
8. Single Channel (Asymmetric) Mode Configuration with One DIMM.............................24
9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs........................24
10. Front/Back Panel Audio Connector Options for 8-Channel (7.1) Audio Subsystem....32
11. 8-channel (7.1) Audio Subsystem Block Diagram........................................................33
12. Front/Back Panel Audio Connector Options for 6-Channel (5.1) Audio Subsystem....34
13. 6-Channel (5.1) Audio Subsystem Block Diagram.......................................................34
14. LAN Connector LED Locations....................................................................................35
15. Thermal Monitoring for D925XECV2 Board.................................................................38
16. Thermal Monitoring for D925XEBC2 Board.................................................................39
17. Location of the Standby Power Indicator LED on the D925XECV2 Board ..................46
18. Detailed System Memory Address Map.......................................................................56
19. Back Panel Connectors for 8-Channel (7.1) Audio Subsystem ...................................64
vii
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
20. Back Panel Connectors for 6-Channel (5.1) Audio Subsystem ...................................66
21. D925XECV2 Component-side Connectors..................................................................68
22. D925XEBC2 Component-side Connectors..................................................................70
23. Connection Diagram for Front Panel Connector..........................................................77
24. Connection Diagram for Front Panel USB Connectors................................................78
25. Connection Diagram for IEEE 1394a Connectors........................................................79
26. Location of the Jumper Block.......................................................................................80
27. Desktop Board D925XECV2 Dimensions....................................................................81
28. Desktop Board D925XEBC2 Dimensions....................................................................82
29. I/O Shield Dimensions for Boards with the 8-Channel (7.1) Audio Subsystem............83
30. I/O Shield Dimensions for Boards with the 6-Channel (5.1) Audio Subsystem............84
31. Processor Heatsink for Omni-directional Airflow..........................................................87
32. Localized High Temperature Zones.............................................................................88
Tables
1. Summary of Board Differences....................................................................................11
2. Feature Summary ........................................................................................................12
3. Manufacturing Options.................................................................................................13
4. D925XECV2 Components Shown in Figure 1. ............................................................15
5. D925XEBC2 Components Shown in Figure 2. ............................................................17
6. Supported Memory Configurations ..............................................................................20
7. LAN Connector LED States .........................................................................................35
8. Effects of Pressing the Power Switch ..........................................................................41
9. Power States and Targeted System Power .................................................................42
10. Wake-up Devices and Events......................................................................................43
11. System Memory Map ...................................................................................................57
12. DMA Channels.............................................................................................................57
13. I/O Map ........................................................................................................................58
14. PCI Configuration Space Map......................................................................................59
15. Interrupts......................................................................................................................60
16. PCI Interrupt Routing Map ...........................................................................................62
17. Back Panel Connectors Shown in Figure 19................................................................65
18. Back Panel Connectors Shown in Figure 20................................................................67
19. D925XECV2 Component-side Connectors Shown in Figure 21..................................69
20. D925XEBC2 Component-side Connectors Shown in Figure 22..................................71
21. ATAPI CD-ROM Connector (Optional).........................................................................72
22. Front Panel Audio Connector.......................................................................................72
23. Front Chassis Fan and Rear Chassis Fan Connectors...............................................72
24. Processor Fan Connector and Auxiliary Rear Fan Connector....................................72
25. Chassis Intrusion Connector........................................................................................73
26. SCSI Hard Drive Activity LED Connector (Optional)....................................................73
27. Serial ATA Connectors.................................................................................................73
28. Auxiliary Power Output Connector...............................................................................73
29. Main Power Connector.................................................................................................75
30. ATX12V Power Connector...........................................................................................75
31. Alternate Power Connector..........................................................................................75
32. Auxiliary Front Panel Power/Sleep LED Connector.....................................................76
33. Front Panel Connector.................................................................................................76
34. States for a One-Color Power LED..............................................................................77
35. States for a Two-Color Power LED..............................................................................77
viii
Contents
36. BIOS Setup Configuration Jumper Settings.................................................................80
37. DC Loading Characteristics .........................................................................................85
38. Fan Connector Current Capability................................................................................86
39. Thermal Considerations for Components ....................................................................89
40. Desktop Board D925XECV2/D925XEBC2 Environmental Specifications....................90
41. Safety Regulations.......................................................................................................91
42. EMC Regulations.........................................................................................................91
43. Product Certification Markings.....................................................................................94
44. BIOS Setup Program Menu Bar...................................................................................96
45. BIOS Setup Program Function Keys............................................................................96
46. Boot Device Menu Options ..........................................................................................99
47. Supervisor and User Password Functions.................................................................101
48. BIOS Error Messages................................................................................................103
49. Uncompressed INIT Code Checkpoints.....................................................................105
50. Boot Block Recovery Code Checkpoints ...................................................................105
51. Runtime Code Uncompressed in F000 Shadow RAM...............................................106
52. Bus Initialization Checkpoints ....................................................................................109
53. Upper Nibble High Byte Functions.............................................................................109
54. Lower Nibble High Byte Functions.............................................................................110
55. Beep Codes ...............................................................................................................110
ix
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
x
1 Product Description
What This Chapter Contains
1.1 PCI Bus Terminology Change......................................................................................11
1.2 Board Differences ........................................................................................................11
1.3 Overview......................................................................................................................12
1.4 Online Support.............................................................................................................19
1.5 Processor.....................................................................................................................19
1.6 System Memory...........................................................................................................20
1.7 Intel® 925X Chipset......................................................................................................25
1.8 PCI Express Connectors..............................................................................................28
1.9 Auxiliary Power (AUX PWR) Output Connector...........................................................28
1.10 I/O Controller................................................................................................................29
1.11 Audio Subsystem .........................................................................................................31
1.12 LAN Subsystem ...........................................................................................................35
1.13 Hardware Management Subsystem.............................................................................37
1.14 Power Management.....................................................................................................40
1.1 PCI Bus Terminology Change
Previous generations of Intel® Desktop Boards used an add-in card connector referred to as PCI. This generation of Intel Desktop Boards adds a new technology for add-in cards: PCI Express*. The 32-bit parallel bus previously referred to as PCI is now called PCI Conventional.
1.2 Board Differences
This TPS describes these Intel Desktop Boards: D925XECV2 and D925XEBC2. The Desktop Boards are identical with the exception of the items listed in Table 1.
Table 1. Summary of Board Differences
D925XECV2
D925XEBC2
ATX Form Factor (10.20 inches by 9.60 inches [259.08 millimeters by
243.84 millimeters])
Four PCI Conventional bus add-in card connectors
Two PCI Express x1 bus add-in card connectors
Auxiliary rear fan connector
Option for auxiliary power output connector
Option for SCSI hard drive indicator LED
Option for Trusted Platform Module (TPM)
microATX Form Factor (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Two PCI Conventional bus add-in card connectors
One PCI Express x1 bus add-in card connector
11
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
NOTE
Most of the illustrations in this document show only the Desktop Board D925XECV2. When there are significant differences, illustrations of both boards are provided.
1.3 Overview
1.3.1 Feature Summary
Table 2 summarizes the major features of the Desktop Boards D925XECV2 and D925XEBC2.
Table 2. Feature Summary
Form Factor
Processor
Memory
Chipset
Video Audio I/O Control USB Peripheral
Interfaces
BIOS
Instantly Available PC Technology
D925XECV2: ATX (10.20 inches by 9.60 inches [259.08 millimeters by
243.84 millimeters])
D925XEBC2: microATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Support for an Intel® Pentium® 4 processor in an LGA775 socket with a 1066, 800, or 533 MHz system bus
Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
Support for DDR2 400 MHz and DDR2 533 MHz DIMMs
Support for up to 4 GB of system memory
Support for 1.9 V DIMMs with 3-3-3 memory timing
Intel® 925XE Chipset, consisting of:
Intel® 82925XE Memory Controller Hub (MCH)
Intel® 82801FR I/O Controller Hub (ICH6-R)
8 Mbit Firmware Hub (FWH)
One PCI Express x16 connector supporting PCI Express x16 graphics cards
®
High Definition Audio subsystem
Intel LPC Bus I/O controller Support for USB 2.0 devices
Eight USB ports
One serial port
One parallel port
Four Serial ATA interfaces
One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
One diskette drive interface
PS/2* keyboard and mouse ports
Intel/AMI BIOS (resident in the 8 Mbit FWH)
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Support for PCI Local Bus Specification Revision 2.2
Support for PCI Express Revision 1.0a
Suspend to RAM support
Wake on PCI, RS-232, front panel, PS/2 devices, and USB ports
continued
12
Product Description
Table 2. Feature Summary (continued)
LAN Support
Expansion Capabilities
Hardware Monitor Subsystem
Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Marvell* Yukon* 88E8050 PCI Express Gigabit Ethernet Controller
D925XECV2: Four PCI Conventional bus add-in card connectors (SMBus routed to PCI Conventional bus connector 2), two PCI Express x1 bus add-in card connectors, and one PCI Express x16 bus add-in card connector
D925XEBC2: Two PCI Conventional bus add-in card connectors (SMBus routed to PCI Conventional bus connector 2), one PCI Express x1 bus add-in card connector, and one PCI Express x16 bus add-in card connector
Hardware monitoring and fan control ASIC
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Three fan connectors
Three fan sense inputs used to monitor fan activity
Fan speed control
1.3.2 Manufacturing Options
Table 3 describes the manufacturing options on the Desktop Boards D925XECV2 and D925XEBC2. Not every manufacturing option is available in all marketing channels. Please contact your Intel representative to determine which manufacturing options are available to you.
Table 3. Manufacturing Options
Audio Subsystem
Alternate (ALT) Power Input Connector
ATAPI CD-ROM connector
Auxiliary (AUX) Power Output Connector
IEEE-1394a Interface
SCSI Hard Drive Activity LED Connector
Trusted Platform Module (TPM)
For information about Refer to
Available configurations for the Desktop Boards D925XECV2 and D925XEBC2 Section 1.4, page 19
Intel High Definition Audio subsystem in one of the following configurations:
8-channel (7.1) audio subsystem with five analog audio outputs and two S/PDIF
6-channel (5.1) audio subsystem with three analog audio outputs using the
Provides required additional power when using a power supply with a 20-pin (2x10) main power connector. Not required when using a power supply with a 24-pin (2x12) main power connector.
A 1 x 4-pin ATAPI-style connector for connecting an internal ATAPI CD-ROM drive to the audio mixer
Provides power for internal chassis lighting (D925XECV2 board only)
IEEE-1394a controller and three IEEE-1394a connectors (one back panel connector, two front-panel connectors)
Allows add-in hard drive controllers (SCSI or other) to use the same LED as the onboard IDE controller. (D925XECV2 board only)
A component that enhances platform security (D925XECV2 board only)
digital audio outputs (coaxial and optical) using the Realtek ALC880 audio codec
Realtek ALC860 audio codec
13
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.3.3 Board Layouts
Figure 1 shows the location of the major components on the Desktop Board D925XECV2.
LL
KK
JJ
HH
GG
FF
MM
II
E F G HA C
I JB D
K
L
M
N O
P
Q
EE
DD
ZBB
Figure 1. Desktop Board D925XECV2 Components
Table 4 lists the D925XECV2 components identified in Figure 1.
RSTUCC VWAAXY
OM16676
14
Table 4. D925XECV2 Components Shown in Figure 1
Item/callout from Figure 1 Description
A B C D E F G H
I
J K L
M N O
P
Q R
S T
U
V
W
X Y Z
AA BB CC DD EE
FF GG HH
II
JJ
KK
LL
MM
Auxiliary rear fan connector ATAPI CD-ROM connector (optional) PCI Express x1 bus add-in card connectors Audio codec Front panel audio connector PCI Conventional bus add-in card connectors Marvell Yukon 88E8050 PCI Express Gigabit Ethernet Controller PCI Express x16 bus add-in card connector Rear chassis fan connector Back panel connectors Alternate power connector +12V power connector (ATX12V) LGA775 processor socket Processor fan connector Intel 82925XE MCH DIMM Channel A sockets DIMM Channel B sockets I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Chassis intrusion connector BIOS Setup configuration jumper block 8 Mbit Firmware Hub (FWH) Front chassis fan connector Serial ATA connectors Auxiliary front panel power LED connector Front panel connector SCSI hard drive indicator LED (optional) Auxiliary power output connector (optional) Front panel USB connector TPM component (optional) Front panel USB connector Intel 82801FR I/O Controller Hub (ICH6-R) Front panel IEEE-1394a connectors (optional) IEEE-1394a controller (optional) Speaker PCI Conventional bus add-in card connectors
Product Description
15
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
Figure 2 shows the location of the major components on the Desktop Board D925XEBC2.
HH
GG
FF
EE DD CC
BB
AA
B C D E
F GA
H
I
J
K L
M
N
Z
WY
Figure 2. Desktop Board D925XEBC2 Components
Table 5 lists the D925XECV2 components identified in Figure 2.
OPQRSTXUV
OM16686
16
Table 5. D925XEBC2 Components Shown in Figure 2
Item/callout from Figure 2 Description
A
B C D
E
F G H
I
J K L
M N O
P
Q R
S T
U
V
W
X Y Z
AA
BB CC DD
EE
FF GG HH
Audio codec Front panel audio connector PCI Conventional bus add-in card connectors Marvell Yukon 88E8050 PCI Express Gigabit Ethernet Controller PCI Express x16 bus add-in card connector Rear chassis fan connector Back panel connectors Alternate power connector +12V power connector (ATX12V) LGA775 processor socket Processor fan connector Intel 82925XE MCH DIMM Channel A sockets DIMM Channel B sockets I/O controller Power connector Diskette drive connector Parallel ATE IDE connector Battery Chassis intrusion connector BIOS Setup configuration jumper block 8 Mbit Firmware Hub (FWH) Front chassis fan connector Serial ATA connectors Auxiliary front panel power LED connector Front panel connector Front panel USB connector Front panel USB connector Intel 82801FR I/O Controller Hub (ICH6-R) Front panel IEEE-1394a connectors (optional) IEEE-1394a controller (optional) Speaker ATAPI CD-ROM connector (optional) PCI Express x1 bus add-in card connector
Product Description
17
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.3.4 Block Diagram
Figure 3 is a block diagram of the major functional areas of the boards.
PCI Express x1 Slot 1
PCI Express x1 Slot 2
Parallel ATA
IDE Connector
LGA775
Processor Socket
PCI Express
x16 Interface
PCI Express
x16
Connector
Channel A DIMMs (2)
PCI Express x1 Interface
D925XECV2
only
Parallel ATA
IDE Interface
System Bus
(1066/800/533 MHz)
Intel 82925XE
Memory Controller
Hub (MCH)
Dual-Channel
Memory Bus
SMBus
Gigabit Ethernet
Controller
USB
LPC Bus
I/O
Controller
LPC Bus
Intel 82801FR
I/O Controller Hub
(ICH6-R)
DMI Interconne ct
Back Panel/Front Panel
USB Ports
Serial Ports
Parallel Port
PS/2 Mouse
PS/2 Keyboard
Diskette Drive
Firmware Hub
Intel 925XE Chipset
LPC Bus
TPM Component
LAN
Connector
Connector
8 Mbit
(FWH)
(Optional)
Channel B DIMMs (2)
IEEE-1394a Connectors
(Optional)
PCI Slot 1
PCI Slot 2
PCI Slot 3
PCI Slot 4
= connector or socket
PCI Bus
D925XECV2
only
PCI Bus
SMBus
Hardware Monitoring
and Fan Control ASIC
Figure 3. Block Diagram
High Definition Audio Link
Serial ATA
IDE Interface
Front Panel Retasking Jack A/E
Front Panel Retasking Jack F
Mic In/Retasking Jack B
Line In/Retasking Jack C
Audio
Codec
Surround Left-Right/Retasking Jack H
Line Out/Retasking Jack D
CD-ROM (optional)
Center and LFE/Retasking Jack G
Serial ATA IDE Connectors (4)
S/PDIF
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1.4 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Boards D925XECV2 and D925XEBC2 under “Desktop Board Products” or “Desktop Board Support”
Available configurations for the Desktop Board D925XECV2
Available configurations for the Desktop Board D925XEBC2
Processor data sheets http://www.intel.com/design/litcentr ICH6-R addressing http://developer.intel.com/design/chipsets/datashts Custom splash screens http://intel.com/design/motherbd/gen_indx.htm Audio software and utilities http://www.intel.com/design/motherbd LAN software and drivers http://www.intel.com/design/motherbd
1.5 Processor
Product Description
http://www.intel.com/design/motherbd http://support.intel.com/support/motherboards/desktop
http://developer.intel.com/design/motherbd/cv2/cv2_available.htm
http://developer.intel.com/design/motherbd/bc2/bc2_available.htm
The boards are designed to support Intel Pentium 4 processors in an LGA775 processor socket with a 1066, 800, or 533 MHz system bus. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about… Refer to:
Supported processors for the D925XECV2 board http://www.intel.com/design/motherbd/cv2/cv2_proc.htm Supported processors for the D925XEBC2 board http://www.intel.com/design/motherbd/bc2/bc2_proc.htm
CAUTION
Use only the processors listed on web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
INTEGRATOR’S NOTES
#
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.8.1.1, page 64
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Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.6 System Memory
The boards have four DIMM sockets and support the following memory features:
1.8 V and 1.9 V DDR2 SDRAM DIMMs
3-3-3 memory timing with 1.9 V DIMMs
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMS with x16 organization are not supported.
4 GB maximum total system memory. Refer to Section 2.2.1 on page 55 for information on the total amount of addressable memory.
Minimum total system memory: 128 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 533 MHz or DDR2 400 MHz SDRAM DIMMs
NOTES
The BIOS will recognize 1.9 V DIMMs (via the SPD data structure) and reconfigure the memory voltage regulator circuit for 1.9 V, 3-3-3 memory timing operation.
Remove the PCI Express x16 video card before installing or upgrading memory to avoid interference with the memory retention mechanism.
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
Table 6 lists the supported DIMM configurations.
Table 6. Supported Memory Configurations
DIMM Capacity
128 MB SS 256 Mbit 16 M x 16/empty 4 256 MB SS 256 Mbit 32 M x 8/empty 8 256 MB SS 512 Mbit 32 M x 16/empty 4 512 MB DS 256 Mbit 32 M x 8/32 M x 8 16 512 MB SS 512 Mbit 64 M x 8/empty 8 512 MB SS 1 Gbit 64 M x 16/empty 4 1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16 1024 MB SS 1 Gbit 128 M x 8/empty 8 2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers
to single-sided memory modules (containing one row of SDRAM).
Configuration
SDRAM Density
SDRAM Organization Front-side/Back-side
Number of SDRAM Devices
20
Product Description
0
0
INTEGRATOR’S NOTE
#
Refer to Section 2.2.1, on page 55 for additional information on available memory.
1.6.1 Memory Configurations
The Intel 82925XE MCH supports two types of memory organization:
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Figure 4 illustrates the memory channel and DIMM configuration.
NOTE
The DIMM0 sockets of both channels are blue. The DIMM1 sockets of both channels are black.
Channel A, DIMM Channel A, DIMM 1
Channel B, DIMM Channel B, DIMM 1
Figure 4. Memory Channel and DIMM Configuration
OM16677
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Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.6.1.1 Dual Channel (Interleaved) Mode Configurations
Figure 5 shows a dual channel configuration using two DIMMs. In this example, the DIMM0 (blue) sockets of both channels are populated with identical DIMMs.
1 GB
Channel A, DIMM 0 Channel A, DIMM 1
1 GB
Channel B, DIMM 0 Channel B, DIMM 1
OM17123
Figure 5. Dual Channel (Interleaved) Mode Configuration with Two DIMMs
Figure 6 shows a dual channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
256 MB 256 MB
512 MB
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
Figure 6. Dual Channel (Interleaved) Mode Configuration with Three DIMMs
22
OM17122
Product Description
Figure 7 shows a dual channel configuration using four DIMMs. In this example, the combined capacity of the two DIMMs in Channel A equal the combined capacity of the two DIMMs in Channel B. Also, the DIMMs are matched between DIMM0 and DIMM1 of both channels.
256 MB 512 MB
256 MB 512 MB
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
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Figure 7. Dual Channel (Interleaved) Mode Configuration with Four DIMMs
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Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.6.1.2 Single Channel (Asymmetric) Mode Configurations
NOTE
Dual channel (Interleaved) mode configurations provide the highest memory throughput.
Figure 8 shows a single channel configuration using one DIMM. In this example, only the DIMM0 (blue) socket of Channel A is populated. Channel B is not populated.
256 MB
Figure 8. Single Channel (Asymmetric) Mode Configuration with One DIMM
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
OM17125
Figure 9 shows a single channel configuration using three DIMMs. In this example, the combined capacity of the two DIMMs in Channel A does not equal the capacity of the single DIMM in the DIMM0 (blue) socket of Channel B.
256 MB 512 MB
512 MB
Figure 9. Single Channel (Asymmetric) Mode Configuration with Three DIMMs
Channel A, DIMM 0 Channel A, DIMM 1
Channel B, DIMM 0 Channel B, DIMM 1
OM17126
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Product Description
1.7 Intel® 925XE Chipset
The Intel 925XE chipset consists of the following devices:
Intel 82925XE Memory Controller Hub (MCH) with Direct Media Interface (DMI) interconnect
Intel 82801FR I/O Controller Hub (ICH6-R) with DMI interconnect
Firmware Hub (FWH)
The MCH is a centralized controller for the system bus, the memory bus, the PCI Express bus, and the DMI interconnect. The ICH6-R is a centralized controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS.
For information about Refer to
The Intel 925XE chipset http://developer.intel.com/ Resources used by the chipset Chapter 2
1.7.1 USB
The boards support up to eight USB 2.0 ports, supports UHCI and EHCI, and uses UHCI- and EHCI-compatible drivers.
The ICH6-R provides the USB controller for all ports. The port arrangement is as follows:
Four ports are implemented with dual stacked back panel connectors adjacent to the audio connectors
Four ports are routed to two separate front panel USB connectors
NOTES
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use shielded cable that meets the requirements for full-speed devices.
For information about Refer to
The location of the USB connectors on the back panel Figure 20, page 66 The location of the front panel USB connectors on the Desktop Board
D925XECV2 The location of the front panel USB connectors on the Desktop Board
D925XEBC2
Figure 21, page 68
Figure 22, page 70
1.7.2 IDE Support
The board provides five IDE interface connectors:
One parallel ATA IDE connector, which supports two devices
Four serial ATA IDE connectors, which support one device per connector
1.7.2.1 Parallel ATE IDE Interface
The ICH6-R’s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE interface. The Parallel ATA IDE interface supports the following modes:
25
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to 16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and transfer rates
of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH6-R’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives) and ATA devices using the transfer modes.
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector (ECHS) translation modes. The drive reports the transfer rate and translation mode to the BIOS.
The boards support Laser Servo (LS-120) diskette technology through the Parallel ATA IDE interfaces. An LS-120 drive can be configured as a boot device by setting the BIOS Setup program’s Boot menu to one of the following:
ARMD-FDD (ATAPI removable media device – floppy disk drive)
ARMD-HDD (ATAPI removable media device – hard disk drive)
For information about Refer to
The location of the Parallel ATA IDE connector on the D925XECV2 board Figure 21, page 68 The location of the Parallel ATA IDE connector on the D925XEBC2 board Figure 22, page 70
1.7.2.2 Serial ATA Interfaces
The ICH6-R’s Serial ATA controller offers four independent Serial ATA ports with a theoretical maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a maximum of four Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows XP and Windows 2000 operating systems.
26
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adaptors or power supplies equipped with low-voltage power connectors.
Product Description
For more information, see: http://www.serialata.org/
For information about Refer to
The location of the Serial ATA IDE connectors on the D925XECV2 board Figure 21, page 68 The location of the Serial ATA IDE connectors on the D925XEBC2 board Figure 22, page 70
1.7.2.3 Serial ATA RAID
The ICH6-R supports RAID (Redundant Array of Independent Drives) level 0 and RAID level 1 on the Serial ATA ports as follows:
RAID 0 supports data striping. Two physical drives, of identical size, can be teamed together to create one logical drive. As data is written or retrieved from the logical drive, both drives operate in parallel, thus increasing the throughput.
RAID 1 supports data mirroring. Two physical drives, of identical size, maintain duplicate sets of all data on separate disk drives. Level 1 provides the highest data reliability because two complete copies of all information are maintained.
1.7.2.4 RAID Boot Configuration Overview
A RAID array can be created by using the existing Serial ATA ports, correctly configuring the BIOS, and installing drivers. The following steps are required to successfully establish a RAID configuration.
1. Enable RAID Support in BIOS.
2. Create a RAID array using the Intel Application Accelerator (IAA) utility.
3. Install the IAA RAID driver.
4. Format the RAID array.
5. Install the IAA Companion Utility (this step is optional).
For information about Refer to
Serial ATA RAID configuration http://developer.intel.com/design/motherbd/cv2/index.htm
1.7.2.5 SCSI Hard Drive Activity LED Connector (Optional)
The SCSI hard drive activity LED connector is a 1 x 2-pin connector that allows an add-in hard drive controller to use the same LED as the onboard IDE controller. For proper operation, this connector should be wired to the LED output of the add-in hard drive controller. The LED indicates when data is being read from, or written to, either the add-in hard drive controller or the onboard IDE controller (Parallel ATA or Serial ATA).
NOTE
The SCSI Hard Drive Activity LED connector is an option available only on the D925XECV2 board. It is not available on the D925XEBC2 board.
For information about Refer to
The location of the SCSI hard drive activity LED connector on the D925XECV2 board
The signal names of the SCSI hard drive activity LED connector Table 26, page 73
27
Figure 21, page 68
Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.7.3 Real-Time Clock, CMOS SRAM, and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.
1.8 PCI Express Connectors
The boards provide the following PCI Express connectors:
One PCI Express x16 connector. The x16 interface supports simultaneous (full duplex) transfer speeds up to 8 GBytes/sec. Single-ended (half duplex) transfers are supported at up to 4 Gbytes/sec.
Two PCI Express x1 connectors on the D925XECV2 board; one PCI Express x1 connector on the D925XEBC2 board. The x1 interfaces support simultaneous transfer speeds up to 500 MBytes/sec
The PCI Express interface supports the PCI Conventional bus configuration mechanism so that the underlying PCI Express architecture is compatible with PCI Conventional compliant operating systems. Additional features of the PCI Express interface includes the following:
Support for the PCI Express enhanced configuration mechanism
Automatic discovery, link training, and initialization
Support for Active State Power Management (ASPM)
SMBus 2.0 support
Wake# signal supporting wake events from ACPI S1, S3, S4, or S5
Software compatible with the PCI Power Management Event (PME) mechanism defined in the
PCI Power Management Specification Rev. 1.1
1.9 Auxiliary Power (AUX PWR) Output Connector
The D925XECV2 board includes a 1x4 power connector that can be used to provide power for internal chassis lighting or additional fans. The use of this connector requires an ATX12V power supply with a 24-pin (2x12) main power cable. If a power supply with a 20-pin (2x10) main power cable is used, the auxiliary power output connector may not function.
The on/off function of this connector is controlled from within the BIOS Setup Program. The default setting in the BIOS is for this connector to be off.
28
Product Description
INTEGRATOR’S NOTES
#
When using this connector, observe the following precautions:
Do not use a Y-adapter, power splitter, or SATA power adapter to attach storage devices (such as hard disk drives or CD/DVD drives) to this connector. This connector will not provide adequate power for storage devices.
Do not connect any devices to this connector that draw more than 1.5 A. The connector circuitry includes overcurrent protection components that limit the current draw to a maximum of 1.5 A.
For information about Refer to
The location of the auxiliary power output connector Figure 21, page 68 The signal names of the auxiliary power output connector Table 28, page 73
NOTE
The auxiliary power output connector is present only on the D925XECV2 board. It is not present on the D925XEBC2 board.
1.10 I/O Controller
The I/O controller provides the following features:
One serial port
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.44 MB or 2.88 MB diskette drive
Intelligent power management, including a programmable wake-up event interface
PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.10.1 Serial Port
The boards have one serial port connector located on the back panel. The serial port supports data transfers at speeds up to 115.2 kbits/sec with BIOS support.
For information about Refer to
The location of the serial port A connector Figure 20, page 66
1.10.2 Parallel Port
The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS Setup program to set the parallel port mode.
For information about Refer to
The location of the parallel port connector Figure 20, page 66
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Intel Desktop Boards D925XECV2/D925XEBC2 Technical Product Specification
1.10.3 Diskette Drive Controller
The I/O controller supports one diskette drive. Use the BIOS Setup program to configure the diskette drive interface.
For information about Refer to
The location of the diskette drive connector on the D925XECV2 board Figure 21, page 68 The location of the diskette drive connector on the D925XEBC2 board Figure 22, page 70
1.10.4 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported in the top PS/2 connector. Power to the computer should be turned off before a keyboard or mouse is connected or disconnected.
For information about Refer to
The location of the keyboard and mouse connectors Figure 20, page 66
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