Intel CW8064701471001 User Manual

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Overclocking Unlocked Intel

™

Core

Processors for High Performance Gaming and Content Creation

Michael Moe n – Sr. System Enginee r, Intel Corporation Dan Ragland – Sr. System Engineer, Int e l Corpor a tion

JJ Guerrero – Sr. Technical Marke ti ng Spe ci al ist, Asus

AIOS001

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Risk Reminder

WARNING: Altering clock frequency and/or voltage ma y: (i) reduce system stabi li ty and useful l ife of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system d ata integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no r esponsibi li ty that the

processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit:

http://www.intel.com/consumer/game/gaming-power.htm

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Defining Overclocking

• What is Overclockin g (OC)?

– The process of increa si ng cl o ck rates beyond

specification

• Why Overclock?

– Increase performance for compute intensive tasks,

e.g., transc ode, ga ming , renderi ng

– Compete, Promote, Socialize

• How is this done?

– Obtain a motherboard optimized for Intel® unlocked

processors – Change unlocked ratios or platform clock frequency – Increase voltage on relevant interfaces – Improve cooling on overclocked/overvoltaged

components

Overclocking Theory

General Principles

The Rule: Maximize frequency, mini mize voltage/current and maximize heat dissipation to meet personal stability requirements

What Benefits How

Processor Cores

Processor Integrated Graphics (pGfx)

Memory Processor Graphics

Platform Base Clock

†

Rendering, Music, Photo and Video editing, Transcode, Gaming Physics, AI, Compute Intensive

Gaming frame rates, Media Transcode

performance, Sound engineering, Photo and Video ed it ing

All of the above  Increase all domain voltages

 Increase Power Limits and Max

Current

 Raise Core voltage  Increase active Core ratios

 Increase Power Limits and Max

Current

 Raise pGfx voltage  Raise pGfx max ratio

 Increase memory ratio  Raise memory IO voltage  Change timings  Increase system agent voltage

 Reduce weakest domain

Increasing Comp le xity

frequency via ratios

† pGfx utilizes Intel® Iris™ Pro., Intel® Iris , or Intel® HD Graphics

Observed Frequency Trends in OC

Q: How much OC can I expect from my CPU? A: There are many fac tors

– Every CPU is designed to meet nominal requirements with

intentional guardband – not specifically for OC – Overclocking is the act of tapping into the intentional guardband

+ design conservatism + Si process conservatism – This changes with each CPU process stepping, architecture change

and overall design targets

HEDT = High End Desktop. Today th is includes Socket LGA2011. This data was collecte d from overclocking forums and should be considered approximate for illustrative purposes only.

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Intel® Core™ i7 Desktop Processors Based on Socket LGA2011 with Intel® X79 Express Chipset

• Core Frequency

DMICLK

DB1200

Processor

1 2

4 5

×1

Memory

PCIE

PEG

DMI

P D

– Unlocked Intel® Turbo Boost

Technology limits

†

– Unlocked core ratios up to 63 in

†

100MHz increments

– Programmable voltage offset

• Memory Ratio

– Unlocked memory controller – Granularity in 266MHz steps – Ratios supported up to 2400Hz

• DMICLK (aka BCLK)

– Fine Grain range ± 5-7% – BCLK ratios = 1.0, 1.25, 1.67

• PEG and DMI Ratios

– PEG/DMI ratios = 80/50, 64/40,

48/30

CK505

Example : Core Freq x 1.25 requires PEG/DMI ratios at 64/40 x 1.25 to keep at 8 GHz/5 GHz nominal

† Only some processors enable par t or all of these features. Consult pro c e s s or documentation f or details.

– Ratio option must reflect selected

BCLK coarse ratio

Intel® Core™ i7 Desktop Processors Based on Socket LGA2011 with Inte l® X79 Express Chipset

Feature Overview

SKU i7-4960X i7-4930K i7-4820K

Cores/Cache 6/15M 6/12M 4/10M Turbo Ratio Overrides (100MHz

Steps)

†

Up to 63

PL1, PL2, Tau, ICCMax Overrides √ √ √ Real-time Core Overclocking (in

OS) DDR Frequency Overrides

Up to 2400

Yes

Up to 2400

Yes

Up to 2400

(266MHz Steps) DDR Timing Overrides √ √ √

Enhanced Ratio

Coarse BCLK Ratios supported with PEG, DMI ratios

Support (1.0,

1.25, 1.67)

Support (1.0,

1.25, 1.67)

Support (1.0,

1.25, 1.67)

† Memory ratio not fuse limited, but support above 2400 via ratio not guaranteed. Use BCLK for higher frequencies.

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Overclocking Design Tips

What board designers consider for unlocked Processors

COLLABORATION

Work closely with Intel to understand the platform ar chitecture and gauge hardware requirements. T his helps to define customized overclocking options for different segments.

POWER DESIGN

Ensuring that onboard power delivery circuitry is capable of exceeding

processor p ow er req uirements under extreme lo ading conditions.

CIRCUITRY DESIGN

Tuning of trace layouts and platform microcode to extend overclocking headroom for CPU and DRAM.

CUSTOM SETUP

Utilize customized hardware to mitigate platform overclocking o bstacles.

PRODUCT DEVELOPMENT

Develop software and hardware solutions to provide automated overclocking features.

These recommendations are the sole opinion of an expert overclocker based on experience. Intel does not endorse or support these recommendations. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications

Overclocking De sig n Tips

How enthusiast board/system designs influence overclockability

• High Quality Compon ent s

− Long-life solid polymer & MLCC Capacitors

− High current MOSFETs

− Low DCR inductors

− Advanced digital buck controllers

− More copper in power plane

• Efficient Cooling Through L a y ou t Des ign

• Careful Analy sis of Sign al I nt egrit y:

− Tight control of trace impedance on PCB, more layers, shorter lengths & length matching

− Tuning of MRC to improve signal margins and memory compatibility

• Dedicated hardware and software solutions:

− Hardware and software features that allow realtime changes to overclocking parameters and improve system stability for smooth overclocking experience

• Intuitive UEFI

− Intuitive layout with customizable menus, overclocking profiles (presets and user configured) and extensive auto-rules for all parameters

− OC recovery with low-level UEFI flashing capabilities

Live Demo:

Optimization of Core, Memory and

BCLK to achieve visibly better

performance experience on

content creation with a Intel

Core™ i7-4960X Extreme Edition

Processor

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Next Generation Intel Haswe ll Microarchite cture

×C

• Core Frequency

– Unlocked Intel® Turbo Boost

†

DMICLK

CPU

1 2

×C

3 4

pGfx

×G

BCLK

Memory

×M

Memory

PCIe

×P

×D

PEG

DMI

DMICLK/BCLK

DMI

×D

Technology limits

– Unlocked core ratios up to 80 in

100MHz increments

– Programmable voltage via iVR

×G

• Graphics Frequency (pGfx)

– Unlocked Intel® HD Gr aph ics limit s† – Unlocked gra phics ratios up to 60 in

50MHz increments

– Programmable voltage via iVR

×M

• Memory Ratio

– Unlocked memory controller – Options for 200 and 266MHz steps † – Logical ratios up to 2933MHz†

• DMICLK (aka BCLK)

Non-OC

100MHz

PCIe = PCI Express

† Only some processors enable part or all of these features.

PCIe

×P ×D

– Unlocked PCH clock controller (1MHz

†

increments upwards of 200MHz)

• PEG and DMI Ratios

– V ariable rat ios (must reflect selected

†

BCLK frequency)

OC VR Design on Legacy Platforms

CORE

PLL

GFX

External VRs External VRs

CPU

• In current generation platforms, CPU VRs are on the motherboard

• Often, a separate VR exists for each rail to the CPU

• Voltage margining is accomplished using platform VRs

4th Generation Intel ® Core™ processor

changes this dramatically with integrated

voltage regulation

Next Generation Inte l Haswell Microar chitecture

Voltage Planes for Performance Tuning

CCIN

DDR

Core

Cores

Last Level Cache

System

iVR

Ring

Agent

PCIe

DDQ

• 1.5V Nom

for DDR3

• <=1.65V

for XMP

• 1.35V

Nom for DDR3L

DMI

pGfx

IOA,IOD

pGfx

• V

SA, VIOA

: Up

IOD

to 500mV

• V

: SVID 1.8V Nom up to 2 .3V+, static V up to 3.04V

CCIN

: dynamic additional V, static V up to 2.0 V

CORE

: dynamic additional V, static V up to 2.0 V

RING

: dynamic additional V, static V up to 2.0 V

PCIe* = PCI Express

Offset V from nominal

Next Generation Inte l Haswell Microar chitecture

non-turbo

freq

volts

turbo

Fused V/f

non-turbo

freq

volts

turbo

Interpolation V/f

non-turbo

freq

volts

turbo

Offset V/f

non-turbo

freq

volts

turbo

Override V/f

Voltage Override Modes

• Default V/f curve

(SVID operation)

• Positive /

Negative offset applied to t h e entire curve. Important for mainstream

• Interpolation

(adaptive) in the overclocking region

• O ver r ide applied

to the entire curve. Important for

overclocking.

iVR provides flexibility consistent with all

margining modes generally supported by

current generation external VR designs

extreme OC.

Next Generation Intel Haswell Microarchitecture

Clock Tree

BCLK @100, 125 or 167

MHz +/1 5-7%

• Single BCLK input comes

Cores

Last Level

Cache

pGfx

DDR

from PCH in <1MHz steps

• Acceptable input to CPU

limited by PIC Express

(PCIe) and DMI PLL interface:

100MHz x ±5-7% PEG/DMI @ 5:5

System

125MHz x ±5-7% PEG/DMI @ 5:4 167MHz x ±5-7% PEG/DMI @ 5:3

Agent

Ring

PCIe

DMI

• Frequency Relationships

f(GT) = BCLK/2*GT Ratio f(Core) = BCLK*Core Ratio f(Ring) = BCLK*Ring Ratio f(DDR) = BCLK*1.33*DDR Ratio

-Or-

f(DDR) = BCLK*1.00*DDR Ratio

Enhanced BCLK Ca p a b ilit ie s

Key Differences Between Generatio n s

Coarse Adjustment

Fine

Range Peak Observed

†

Intel® Core™ i7 processors on LGA2011

BCLK multipl iers

{1.0,1.25,1.67} input

to CPU

CPU adjusts PEG/DMI

ratios {5:5,5:4,5:3}

based on BCLK multi

External clock device

output adjustment ± 5-

7% over nominal

100MHz

168 MHz

(non-continuous)

3rd Gen Intel Core processors on LGA1155

None Select CPU PEG/DMI

PCH output

adjustment ± 5-7%

over nominal 100MHz

116.95 MHz >167 MHz

Next Gen Intel Haswell Microarchitecture

ratios of {5:5,5:4,5:3}

depending on what

clock frequency you

request from PCH

PCH output ± 5-7%

around frequency

points 100MHz,

125MHz, 167MHz

(non-continuous)

4th Generation Intel Core processors deliver BCLK

overclocking experience consistent with current

generation high-end platforms based on LGA2011

† This data was collecte d from overclocking forums and should be considered approximate for illustrative purposes only.

Next Generation Intel Haswell Microarchitecture

Available Performance Tu n ing Ratios

Core

Turbo

Ratios

• Core ratios up

to 80

• Unlocked Turbo

Limits

• Current Limit

Override

• Graphics ratios

up to 60

†

pGfx

Ratios

†

Cores

Last Level Cache

pGfx

DDR Ratios

DDR

• 266MHz Steps

up to 2933MHz

System

• 200MHz steps

Agent

PCIe

up to 2800MHz

• Timing

Overrides

DMI

Ring

PEG DMI

Ratios

• Manual or can

be automated through XMP

1.3

Ring

Ratios

†

PEG, DMI

Ratios

PCIe* = PCI Express

• Ring Ratios up

to 80

• BIOS sets based on requested BCLK f

•

100MHz: 80/50 (PEG/DMI Ratios)

• 125MHz: 64/40

• 167MHz: 48/30

† = Changeable at OS Level

• Ring Ratio

typically <= Core or GT

Desktop: 4th Generation Intel® Core™ i7/i5 Processors Based on Socket LGA 1150

Unlocked “K”

Intel

Z87 Express Chipset

Intel H87 Express Chipset

Turbo Ratio Overrides √

DDR Frequency Overrides √

Fine BCLK Overrides √1 √1

Coarse BCLK Ratios √

iVR Overvoltage √ √

PL1, PL2, Tau, ICCMax Overrides √

DDR Timing Overrides √ √

pGfx Ratio Overrides √ √

• Turbo r a tios and power, pGfx Ratios, iVR voltages are updateable real-time in OS

• Fine BCLK, DDR timings are changeable real-time over very small range

• Larger changes can be made with reset. BCLK r a n g e h ig h ly limit e d .

• DDR Frequency requires reset

†

Others

Unlocked Processors:

√

Intel

Core™ i7 Processors 4770K

Intel Core i5 Processors

†

√

Pentium™, and Intel

will be limited. ~5 %

are unlocked with K SKU p r oc e s s ors only Note: Actual overclocking results will vary

and capabilities are subject to change.

4670K

This includes Intel Core i3, Intel®

Actual Fine BCLK frequency adjustments

Coarse BCLK Ratios (1.0, 1.25, 1.67)

Celeron™

Mobile: 4

DDR Ratio &

Generation Intel® Core™

†

Processor Overclocking

Summary:

• Core overclocking on select Intel® Core™ i7 SKUs

• Graphics and memory overclocking on all Intel Cor e i7 and Core i5 based -H, -M, and -U series processors

-H and

-M Series

-U Series i7-4600U 4 bins Yes No No Yes Yes

-Y Series All None No No No No No

Turbo

Ratio

Overrides

i7-4930MX Unlimited Yes Yes Yes Yes Yes i7-4900MQ 6 bins Yes Yes Yes Yes Yes i7-4950HQ 6 bins Yes No Yes Yes Yes i7-4800MQ 4 bins Yes Yes Yes Yes Yes i7-4850HQ 4 bins Yes No Yes Yes Yes i7-4702MQ 2 bins Yes Yes Yes Yes Yes i7-4700MQ 2 bins Yes Yes Yes Yes Yes i7-4750HQ 2 bins Yes No Yes Yes Yes i5 None No No Yes Yes Yes i3 None No No No No No

i7-4650U 4 bins Yes No No Yes Yes i7-4558U 4 bins Yes No i5 None No No No Yes Yes i3 None No No No No No

iVR Over-

voltage

BCLK

Coarse

(1)

BCLK

(1)

Fine

No Yes Yes

Timing

Overrides

Processor

Gfx Ratio

Overrides

Requires Intel HM87 or QM87 chipsets and results will vary.

†

Actual overclocking results will vary and capabilities are subject to change.

Live Demo:

Mobile Overclocking using the

Intel

Core™ i7-4950HQ processor

in the Clevo W740SU Notebook

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Intel® Extreme Memory Profile (Intel® XMP)

• Expansion of the standard DDR3 memory specification. Enables speeds, latencies outside of JEDEC Specification.

– Easy, rob ust, overclocking so lution designed

to take advantage of the unlocked capability of Intel

– Predefined and tested Intel XMP pr ofiles can

be loaded via BIOS or a specific operating system-level tuning a pplica tion

 Intel® XMP compliant DIMMs available

– Supports all Intel Core i7, i5 Processors † – Corsair*, G.Skil*, Kingston*, Patriot*, Crucial*

and others

Core™ Processors

– XMP Ready: Module has been programmed

with an uncertified profile GOOD

– XMP Cer tified: Mod ule has pa ssed supplier

test and submission pr ocess for specific CPU and motherboard BEST

– C ertifications posted a t:

http://www.intel.com/consumer/game/extreme-memory.htm

†CPU must support unlocked memory multiplier and be paired with correct chipset. Intel XMP is overclocking

System boots with highest supported JEDEC defined parameters by default

Select XMP profile v ia enabled BIOS or tuning app and profile and reset

Intel® Extreme Tun ing Util ity ( Intel® XTU)

• Simple-to-use

Windows* application

• Exposes CPU and

PCH knobs for performance tuning by user

• Real-time

adjustment of key settings without rebooting1

• Version 4.2 now

av a ilable for download from Intel or other motherboard suppliers †

http://www.intel.com/go/xtu

†Motherboard BIOS must be configured correctly to work with XTU. Contact your motherboard supplier for more information.

Available se lect 3rd and 4th Generation Intel® Core™ Processor SKUs.

Intel® XTU and HWBot.org

Combined Features

• Upload/Download overclocking settings reliably

• Export/Import XTU overclocking settings

• Compare benchmark scores and

configurations with others

• Link other benchmark scores to XTU profiles

• Compete with others for higher scores

• Integrated with existing social networks: F ace book* and Twitter

Live Demo:

Intel

Extreme Tuning Utility

v4.2 with AppTune Beta

Feature using a Intel

i7-4770K Processor

Core™

Live Demo:

SSD Overclocking Te chnol ogy

Agenda

• Overclocking Theory and Trends

• High-end Desktop Overclocking Architecture

• Overclocking Design Tips

• Desktop and Mobile Overclocking Architecture

• Harnessing Overclocking

• Summary

Summary

• Intel® Core™ i7 Processors based on Socket LGA2011 offer Core, DDR and BCLK ov e rcl o cki ng expe ri e nce o n proce sso rs with the highest core count and memory capacity

• Desktop and Mobile 4th Generation Intel Core processors offer select SKUs with unlocked core, memory and graphics r a ti os

• Real-time overclocking offers an improved user experience for content creation and gaming users

• The AppTune beta feature, in Intel® Extreme Tuning Util i ty v4.2, is an exciting new way to tune system performance dynamically and uniquely for each speci fi c a ppl i cati o n

• Intel has not tested, and does not warranty, the operation of the processor beyond its specifica tions

• For designers w a nting to develo p overcl ocking pl atforms, documentation is available under NDA that details all tuning knobs. Contact your I ntel field representative.

Legal Disclaimer

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must no t rely on the absence or characteristics of any features or instructions marked " reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not fina liz e a de si gn wi th thi s inf orma tio n . The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized e rrata are available on request. Contact your local Intel sale s off ice or your distributor to o btain the l atest specifications and be fo re pl acing your product order. Copies of documents which have an order number and are refe rence d in this document , o r other Intel l iterature , ma y be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm

Haswell and o the r co de name s fe atu red are used interna ll y within Intel to i de nti fy p roduc t s that are in devel o pme nt and not yet publicly announced fo r release. Customers, licensees and other third parties are not authorize d by Intel to use code names in advertising, promotion or marketing of any product or services and any such use of Intel's internal code names is at the sole risk of the user.

Intel, Core, Look Inside and the Intel logo are trademarks of Intel Corp oratio n in the Uni ted States and othe r countrie s. *Other names and brands may be claimed as the property of others.

Legal Disclaimer

• Ov e rc lo c kin g D is cla ime r WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful

life of the system an d proces sor ; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit O ve r clo c kin g In t el Processors

• Overclocked Memory Warning: Altering PC memory frequency and/or voltage may (i) reduce system stability and use

life of the system, mem ory and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel assumes no responsibility that the memory, included if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. Check with memory manufacturer for warranty and additional details.

• Overspeed Protection Removed Warning: Altering clock frequency and/or voltage may (i) reduce system stability and

useful life of the sys t em and processor; (ii) cause the processor and other system comp on en ts to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications.

• Proce ss or Numbering N otice: Intel processor numbers are not a measure of performance. Proces so r numbers

differentiate features within each processor family, not across different processor families: Go to:

Learn About Intel® Processor Numbers

• Intel® Turbo Boost Technology requires a system with Intel Turbo Boost Technology. Intel Turbo Boost Technology and

Intel Turbo Boost Tech n ology 2.0 are only av a ilable on select Intel ® proc essors. Consult your PC manufacturer. Performance varies depending on hardware, software, and system configuration. For more information, visit http://www.intel.com/go/turbo

Risk Factors

The above statements and any others in this document that refer to plans and expectations for the third quarter, the year and the future are forwa rd-l ooking statements that i nvolve a number of risks and uncertainties. Words such as “anticipates,” “expects,” “int ends,” “plans,” “beli eves,” “seeks,” “estimates,” “may,” “wil l ,” “should” a nd th ei r variations identify forward-looking statements. Statement s t ha t refer to or are ba sed on projecti on s, uncertai n even ts or assu mp ti ons al so i dent i fy forward-looking statements. Many factors could affect Intel ’s actu al results, and vari ances from Int el’s cu rrent expect ati ons rega rdi ng such fa ctors could cause actua l results t o differ materia ll y from those expressed in these forward-looking statements. Intel presently considers the following to be the important factors that could cause actual results to differ materially from the company’s expectations. Demand could be different from Intel's expectations due to factors including changes in business and economic conditions; customer acceptance of Intel’s and competitors’ products; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Uncertainty in global economic and financial conditions poses a risk that consumers and businesses may defer purchases in response to negative financi al events, wh i ch could n ega ti vel y affect p rodu ct dema nd and other rel at ed ma tters. Intel op erates in inten sel y comp etitive industries that are ch a ract erized b y a hi g h percen t a ge of costs that are fixed or diffi cu lt to reduce i n the sh ort term and product demand that is highly variable and difficult to forecast. Revenue and the gross margin percentage are affected by the timing of Intel product introductions and the demand for and market acceptance of Intel's products; actions taken by Intel's competitors, including product offerings and introductions, marketing programs and pricing pressures and Intel’s response to such actions; and Intel’s ability to respond quickly to technological developments and to incorporate new features into its products. The gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; start-up costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; product manufacturing quality/yields; and impairments of long-lived assets, including manufacturing, assembly/test and intangible assets. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and othe r security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exc h an g e rates. Expen s es, particularly certai n m ark et ing and compensa t ion exp en s es, as wel l as restructuring and asset impairm ent charges, vary dependi ng on th e lev el of demand for Intel 's prod uct s a nd th e level of revenue and profi ts. Int el ’s results could be affected by the timing of closing of acquisitions and divestitures. Intel's results could be affected by adverse effects associated with product defects and errata (deviations from published specifications), and by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues, such as the litigation and regulatory ma tters descri bed i n Intel's S EC report s. An unfav orabl e ru l in g could i ncl u de moneta ry d ama ges or an inj unc ti on prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel’s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. A detailed discussion of th ese an d other fact ors th at coul d affect Int el’s resu lt s i s incl ud ed in Intel’s SEC fi l i ngs, includ i ng the company’s most recent reports on Form 10-Q, Form 10-K and earnings release.

Rev. 7/17/13

Intel CW8064701471001 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Agenda

Risk Reminder

Agenda

Defining Overclocking

Observed Frequency Trends in OC

Agenda

Intel® Core™ i7 Desktop Processors Based on Socket LGA2011 with Intel® X79 Express Chipset

Agenda

Agenda

Next Generation Intel Haswe ll Microarchite cture

OC VR Design on Legacy Platforms

Desktop: 4th Generation Intel® Core™ i7/i5 Processors Based on Socket LGA 1150

Agenda

Intel® Extreme Memory Profile (Intel® XMP)

Intel® Extreme Tun ing Util ity ( Intel® XTU)

Agenda

Summary

Legal Disclaimer

Legal Disclaimer

Risk Factors