Intel BXSTS200C User Manual
Intel®
Xeon® Processor E5-1600 /
2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide
October 2015
Order No.: 330786-003US
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described
herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed
herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel product specifications and
roadmaps.
The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725 or visit http://
www.intel.com/design/literature.htm.
Basis, BlueMoon, BunnyPeople, Celeron, Centrino, Cilk, Flexpipe, Intel, the Intel logo, the Intel Anti-Theft technology logo, Intel AppUp, the Intel
AppUp logo, Intel Atom, Intel CoFluent, Intel Core, Intel Inside, the Intel Inside logo, Intel Insider, Intel NetMerge, Intel NetStructure, Intel RealSense,
Intel SingleDriver, Intel SpeedStep, Intel vPro, Intel Xeon Phi, Intel XScale, InTru, the InTru logo, the InTru Inside logo, InTru soundmark, Iris,
Itanium, Kno, Look Inside., the Look Inside. logo, MCS, MMX, Pentium, picoArray, Picochip, picoXcell, Puma, Quark, SMARTi, smartSignaling, Sound
Mark, Stay With It, the Engineering Stay With It logo, The Creators Project, The Journey Inside, Thunderbolt, the Thunderbolt logo, Transcede, Transrf,
Ultrabook, VTune, Xeon, X-GOLD and XMM are trademarks of Intel Corporation in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015, Intel Corporation. All rights reserved.
®
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel
Thermal Mechanical Specification and Design Guide October 2015
2 Order No.: 330786-003
Revision History—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Revision History
Revision
Number
001 Initial release September 2014
002 Added Intel® Xeon® processor E5-4600 v3 product families. June 2015
003 Updated a socket part number on Table 25. October 2015
Description Date
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 3
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
®
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
Intel
Contents
Revision History..................................................................................................................3
1.0 Introduction................................................................................................................10
1.1 Definition of Terms............................................................................................... 10
2.0 LGA2011-3 Socket Overview....................................................................................... 12
2.1 Socket Components.............................................................................................. 13
2.2 Socket Land Pattern Guidance................................................................................ 17
2.3 Socket Loading Requirements.................................................................................20
2.3.1 Socket Loading Specifications.................................................................... 21
2.4 Socket Maximum temperature................................................................................ 21
2.5 Strain Guidance for Socket....................................................................................22
3.0 Independent Loading Mechanism (ILM) Specifications............................................... 23
3.1 ILM Load Specifications......................................................................................... 24
3.2 ILM Keepout Zones (KOZ)......................................................................................25
3.3 Independent Loading Mechanism (ILM)....................................................................25
3.4 ILM Mechanical Design Considerations and Recommendations.....................................25
3.5 ILM Features........................................................................................................ 26
3.6 Intel® ILM Reference Designs................................................................................. 28
3.6.1 Square ILM.............................................................................................. 28
3.6.2 Narrow ILM.............................................................................................. 30
3.7 ILM Cover............................................................................................................32
3.8 ILM Allowable Board Thickness............................................................................... 33
4.0 Processor Thermal Specifications and Features......................................................... 34
4.1 T
and DTS-Based Thermal Specification Implementation........................................34
case
4.1.1 Margin to Thermal Specification (M)............................................................ 34
4.2 Processor Thermal Features................................................................................... 36
4.2.1 Absolute Processor Temperature................................................................. 36
4.2.2 Short Duration TCC Activation .................................................................. 36
4.3 Processor Thermal Specifications............................................................................ 36
4.3.1 Thermal Specifications...............................................................................37
4.3.2 T
and DTS Based Thermal Specifications.................................................37
CASE
4.3.3 Server Processor Thermal Profiles and Form Factors..................................... 38
4.3.4 Server 4S Processor Thermal Profiles and Form Factors.................................40
4.3.5 Workstation Processor Thermal Profiles and Form Factors..............................41
4.3.6 Embedded Server Processor Thermal Profiles...............................................42
4.3.7 Thermal Metrology.................................................................................... 44
5.0 Processor Thermal Solutions.......................................................................................47
5.1 Processor Boundary Conditions for Shadowed and Spread Core Layouts....................... 47
5.2 Heatsink Design Considerations.............................................................................. 49
5.3 Thermal Design Guidelines..................................................................................... 50
5.3.1 Intel® Turbo Boost Technology................................................................... 50
5.3.2 Thermal Excursion Power........................................................................... 50
5.3.3 Thermal Characterization Parameters.......................................................... 51
5.4 Thermal Interface Material (TIM) Considerations....................................................... 52
5.5 Mechanical Recommendations and Targets............................................................... 53
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
4 Order No.: 330786-003
®
Contents—Intel
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
5.5.1 Processor / Socket Stackup Height.............................................................. 53
5.5.2 Processor Heatsink Mechanical Targets........................................................ 54
5.6 Heatsink Mechanical and Structural Considerations....................................................55
5.7 Intel Reference Design Heat Sink............................................................................ 55
5.7.1 2U Square Heatsink Performance................................................................ 57
5.7.2 1U Square Heatsink Performance................................................................ 58
5.7.3 1U Narrow Heatsink Performance................................................................ 59
5.7.4 Workstation Tower Active Heatsink Performance........................................... 60
5.7.5 Mechanical Load Range..............................................................................61
5.7.6 Thermal Interface Material (TIM).................................................................61
6.0 Processor Mechanical Specifications........................................................................... 62
6.1 Package Size........................................................................................................62
6.2 Package Loading Specifications............................................................................... 63
6.3 Processor Mass Specification.................................................................................. 64
6.4 Processor Materials............................................................................................... 64
6.5 Processor Markings............................................................................................... 64
6.6 Package Handling Guidelines.................................................................................. 66
7.0 Boxed Processor Specifications...................................................................................67
7.1 Boxed Processor Thermal Solutions......................................................................... 67
7.1.1 Available Boxed Thermal Solution Configurations...........................................67
7.1.2 Intel® Thermal Solution STS200C (Passive/Active Combination Heat Sink
Solution)................................................................................................ 67
7.1.3 Intel® Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall
Passive Heat Sink Solutions)......................................................................68
7.1.4 Thermal Interface Material (TIM).................................................................68
7.2 Boxed Processor Cooling Requirements....................................................................69
7.3 Mechanical Specifications...................................................................................... 69
7.4 Fan Power Supply [STS200C]................................................................................. 70
7.5 Boxed Processor Contents......................................................................................71
8.0 Quality Reliability and Ecological Requirements..........................................................72
8.1 Use Conditions..................................................................................................... 72
8.2 Intel® Reference Component Validation....................................................................73
8.2.1 Board Functional Test Sequence..................................................................73
8.2.2 Post-Test Pass Criteria Examples.................................................................73
8.2.3 Recommended BIOS/Processor/Memory Test Procedures................................74
8.3 Material and Recycling Requirements.......................................................................74
Appendix A Component Suppliers..................................................................................... 76
Appendix B Mechanical Drawings......................................................................................78
B.1 Large Package Mechanical Drawing Page 1............................................................... 79
B.2 Large Package Mechanical Drawing Page 2............................................................... 80
B.3 Package Mechanical Drawing Page 1........................................................................81
B.4 Package Mechanical Drawing Page 2........................................................................82
B.5 ILM Backplate Keep Out Zone.................................................................................83
B.6 ILM Mounting Hole Keep Out Zone.......................................................................... 84
B.7 Narrow ILM Keep Out Zone.................................................................................... 85
B.8 Narrow ILM 3D Keep Out Zone............................................................................... 86
B.9 ILM Keep Out Zone............................................................................................... 87
B.10 3D Keep Out Zone.............................................................................................. 88
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 5
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Contents
B.11 Heat Sink Retaining Ring......................................................................................89
B.12 Heat Sink Spring.................................................................................................90
B.13 Heat Sink Spring Cup.......................................................................................... 91
B.14 1U Narrow Heat Sink Geometry (Page 1)............................................................... 92
B.15 1U Narrow Heat Sink Geometry (Page 2)............................................................... 93
B.16 1U Narrow Heat Sink Assembly (Page 1)................................................................ 94
B.17 1U Narrow Heat Sink Assembly (Page 2)................................................................ 95
B.18 1U Square Heat Sink Geometry (Page 1)................................................................96
B.19 1U Square Heat Sink Geometry (Page 2)................................................................97
B.20 1U Square Heat Sink Assembly (Page 1)................................................................ 98
B.21 1U Square Heat Sink Assembly (Page 2)................................................................ 99
B.22 2U Square Heat Sink Geometry (Page 1).............................................................. 100
B.23 2U Square Heat Sink Geometry (Page 2).............................................................. 101
B.24 2U Square Heat Sink Assembly (Page 1).............................................................. 102
B.25 2U Square Heat Sink Assembly (Page 2).............................................................. 103
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
6 Order No.: 330786-003
®
Figures—Intel
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Figures
1 Hexagonal Array in LGA2011-3..................................................................................12
2 Socket with Labeled Features.................................................................................... 13
3 Contact Wiping Direction.......................................................................................... 14
4 Contact Tip Offset with Respect to Solder Ball..............................................................15
5 Processor Socket Stack Up........................................................................................16
6 Pick and Place Cover with Labeled Features.................................................................16
7 PnP Cover and Socket Assembly................................................................................ 17
8 Socket 2011-3 Land Pattern......................................................................................18
9 Socket 2011-3 Pad Types and Locations..................................................................... 20
10 Socket Temperature Measurement ............................................................................22
11 Processor Stack.......................................................................................................23
12 ILM Load Plate........................................................................................................ 27
13 ILM Backplate......................................................................................................... 28
14 Exploded Square ILM............................................................................................... 29
15 Assembled Square ILM............................................................................................. 30
16 Exploded Narrow ILM............................................................................................... 31
17 Assembled Narrow ILM.............................................................................................32
18 ILM cover............................................................................................................... 33
19 Margin to Thermal Spec (M)......................................................................................35
20 Typical Thermal Profile Graph (Illustration Only).......................................................... 38
21 Case Temperature (T
22 Case Temperature (T
23 Typical Shadowed Layout......................................................................................... 47
24 Typical Spread Core Layout.......................................................................................48
25 Thermal Characterization Parameters......................................................................... 52
26 Integrated Stack Up Height.......................................................................................53
27 Available Cooling Area for Top of Large and Small IHS..................................................54
28 1U Form Factor Heat Sinks....................................................................................... 56
29 2U Form Factor Heat Sinks....................................................................................... 56
30 Workstation Form Factor Heat Sink............................................................................ 57
31 Processor Package Assembly Sketch...........................................................................62
32 Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Small
Form Factor............................................................................................................ 63
33 Rendering of Intel® Xeon® processor E5-1600 and E5-2600 v3 product families Large
Form Factor............................................................................................................ 63
34 Small Package Labeling............................................................................................ 65
35 Large Package Labeling............................................................................................ 66
36 STS200C Active / Passive Combination Heat Sink (with Removable Fan) ........................ 68
37 STS200P and STS200PNRW 25.5 mm Tall Passive Heat Sinks ....................................... 68
38 Fan Cable Connector Pin Out for 4-Pin Active Thermal Solution...................................... 71
39 Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 1.... 79
40 Intel® Xeon® Processor v3 Product Families Large Package Mechanical Drawing Page 2.... 80
41 Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 1.... 81
42 Intel® Xeon® Processor v3 Product Families Small Package Mechanical Drawing Page 2.... 82
43 ILM Backplate Keep Out Zone................................................................................... 83
44 ILM Mounting Hole Keep Out Zone............................................................................. 84
45 Narrow ILM Keep Out Zone....................................................................................... 85
46 Narrow ILM 3D Keep Out Zone.................................................................................. 86
47 Square ILM Keep Out Zone....................................................................................... 87
48 Square 3D Keep Out Zone........................................................................................ 88
49 Heat Sink Retaining Ring.......................................................................................... 89
50 Heat Sink Spring..................................................................................................... 90
51 Heat Sink Spring Cup............................................................................................... 91
52 1U Narrow Heat Sink Geometry (Page 1).................................................................... 92
) Measurement Location for Large Package ..............................45
CASE
) Measurement Location for Small Package.............................. 46
CASE
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 7
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Figures
53 1U Narrow Heat Sink Geometry (Page 2).................................................................... 93
54 1U Narrow Heat Sink Assembly (Page 1).....................................................................94
55 1U Narrow Heat Sink Assembly (Page 2).....................................................................95
56 1U Square Heat Sink Geometry (Page 1).................................................................... 96
57 1U Square Heat Sink Geometry (Page 2).................................................................... 97
58 1U Square Heat Sink Assembly (Page 1).....................................................................98
59 1U Square Heat Sink Assembly (Page 2).....................................................................99
60 2U Square Heat Sink Geometry (Page 1)...................................................................100
61 2U Square Heat Sink Geometry (Page 2)...................................................................101
62 2U Square Heat Sink Assembly (Page 1)................................................................... 102
63 2U Square Heat Sink Assembly (Page 2)................................................................... 103
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
8 Order No.: 330786-003
®
Tables—Intel
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Tables
1 Terms and Descriptions............................................................................................ 10
2 LGA2011-3 Socket Attributes.................................................................................... 12
3 PIN Count By Pad Definition...................................................................................... 19
4 Socket Load Values..................................................................................................21
5 LGA 2011-3 Maximum Allowable Loads.......................................................................24
6 LGA 2011-3 Minimum Allowable Loads....................................................................... 24
7 LGA 2011-3 Minimum End of Life Loads...................................................................... 25
8 LGA 2011-3 ILM General Keepout Dimensions ............................................................ 25
9 Square ILM Component Thickness and materials..........................................................30
10 Narrow ILM Component Thickness and materials..........................................................32
11 DTS 2.0 Margin From PECI........................................................................................35
12 DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN ................ 36
13 Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families Stack T
DTS Thermal Profiles and Correction Factors............................................................... 38
14 Intel® Xeon® Processor E5-4600 v3 Product Families Stack Product Family T
DTS Thermal Profiles and Correction Factors............................................................... 40
15 Intel® Xeon® Processor E5-1600 and E5-2600 v3 Product Families 1S Workstation
Stack T
and DTS Thermal Profiles and Correction Factors......................................... 41
case
16 Embedded Server Processor Thermal Profiles.............................................................. 43
17 Processor Boundary Conditions for Shadowed and Spread Core Layouts..........................48
18 Target Stackup Heights From Top of Board to Top of IHS.............................................. 53
19 Available Cooling Area for Large and Small IHS........................................................... 54
20 Heatsink Mechanical Targets..................................................................................... 54
21 Processor Loading Specifications................................................................................64
22 Processor Materials..................................................................................................64
23 Load Limits for Package Handling...............................................................................66
24 Intel
®
Reference or Collaboration Thermal Solutions..................................................... 76
25 LGA2011-3 Socket and ILM Components ....................................................................76
26 List of Mechanical Drawings...................................................................................... 78
case
and
case
and
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 9
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Introduction
1.0 Introduction
This document provides specifications and guidelines for the design of thermal and
mechanical solutions for the Intel® Xeon® processor E5-1600, E5-2600, and E5-4600
v3 product families.
The components and information described in this document include:
• Thermal profiles and other processor specifications and recommendations
• Processor Mechanical load limits
The goals of this document are:
• To assist board and system thermal mechanical designers
• To assist designers and suppliers of processor heatsinks
1.1
Definition of Terms
Table 1. Terms and Descriptions
Term Description
Bypass Bypass is the area between a passive heatsink and
DTS Digital Thermal Sensor reports a relative die
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the
Square ILM Independent Loading Mechanism provides the force
Narrow ILM Independent Loading Mechanism provides the force
LGA2011-3 Socket The processor mates with the system board through
PECI The Platform Environment Control Interface (PECI) is
any object that can act to form a duct. For this
example, it can be expressed as a dimension away
from the outside dimension of the fins to the nearest
surface.
temperature as an offset from TCC activation
temperature.
processor package used to enhance the thermal
performance of the package. Component thermal
solutions interface with the processor at the IHS
surface.
needed to seat the 2011-LGA package onto the
socket contacts and has 56 × 94mm heatsink
mounting hole pattern
needed to seat the 2011-LGA package onto the
socket contacts and has 56 × 94mm heatsink
mounting hole pattern
this surface mount, 2011-contact socket.
a one-wire interface that provides a communication
channel between Intel processor and chipset
components to external monitoring devices.
continued...
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
10 Order No.: 330786-003
Introduction—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Term Description
Ψ
CA
Case-to-ambient thermal characterization parameter
(psi). A measure of thermal solution performance
using total package power. Defined as (T
Total Package Power. Heat source should always be
specified for Ψ measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A
measure of thermal interface material performance
using total package power. Defined as (T
Total Package Power.
Ψ
SA
Sink-to-ambient thermal characterization parameter.
A measure of heatsink thermal performance using
total package power. Defined as (TS – TLA) / Total
Package Power.
T
case
The case temperature of the processor measured at
the geometric center of the topside of the IHS.
Tcase-Max The maximum case temperature as specified in a
component specification.
TCC Thermal Control Circuit: Thermal monitor uses the
TCC to reduce the die temperature by using clock
modulation and/or operating frequency and input
voltage adjustment when the die temperature is very
near its operating limits.
T
CONTROL
T
is a static value below TCC activation used
CONTROL
as a trigger point for fan speed control. When DTS >
T
, the processor must comply to the thermal
CONTROL
profile.
TDP Thermal Design Power: Thermal solution should be
designed to dissipate this target power level. TDP is
not the maximum power that the processor can
dissipate.
Thermal Monitor A power reduction feature designed to decrease
temperature after the processor has reached its
maximum operating temperature.
Thermal Profile Line that defines case temperature specification of a
processor at a given power level.
TIM Thermal Interface Material: The thermally conductive
compound between the heatsink and the processor
case. This material fills the air gaps and voids, and
enhances the transfer of the heat from the processor
case to the heatsink.
T
LA
The measured ambient temperature locally
surrounding the processor. The ambient temperature
should be measured just upstream of a passive
heatsink or at the fan inlet for an active heatsink.
T
SA
The system ambient air temperature external to a
system chassis. This temperature is usually
measured at the chassis air inlets.
U A unit of measure used to define server rack spacing
height. 1U is equal to 1.75 in, 2U equals 3.50 in, and
so forth.
LCC Low Core Count, refers to silicon die size
MCC Mid Core Count, refers to silicon die size
HCC High Core Count, refers to silicon die size
CASE
CASE
– TLA) /
– TS) /
October 2015 Thermal Mechanical Specification and Design Guide
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Order No.: 330786-003 11
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
2.0 LGA2011-3 Socket Overview
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
Intel® Xeon® processor E5-1600 and E5-2600 v3 product families processor-based
platform. The socket provides I/O, power and ground contacts for processor operation.
The socket contains 2011 contacts arrayed about a cavity in the center of the socket
with lead-free solder balls for surface mounting on the motherboard.
The LGA2011-3 uses a hexagonal area array ball-out which provides many benefits:
• Socket contact density increased by 12% while maintaining 40 mil minimum via
pitch requirements. as compared to a linear array
• Corresponding square pitch array’s would require a 38mil via pitch for the same
package size.
LGA2011-3 has 1.016 mm (40 mil) hexagonal pitch in a 58x43 grid array with 24x16
grid depopulation in the center of the array and selective depopulation elsewhere.
Overview
Figure 1. Hexagonal Array in LGA2011-3
Table 2. LGA2011-3 Socket Attributes
LGA2011-3 Socket Attributes
Component Size 58.5 mm (L) X 51 mm (W)
Pitch 1.016 mm (Hex Array)
Ball Count 2011
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
12 Order No.: 330786-003
LGA2011-3 Socket Overview—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Families
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). Internal keying posts ensure socket processor
compatibility. An external socket key ensures ILM and socket compatibility. The ILM
reference design includes a back plate; an integral feature for uniform loading on the
socket solder joints and contacts.
2.1
Socket Components
The socket has two main components, the socket body: composed of a housing solder
balls, and processor contacts, and Pick and Place (PnP) cover. The socket is delivered
as a single integral assembly. Below are descriptions of the integral parts of the
socket.
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating
capable of withstanding 260°C for 40 seconds (typical reflow/rework). The socket
coefficient of thermal expansion (in the XY plane), and creep properties, are such that
the integrity of the socket is maintained for the environmental conditions listed in the
TMSDG.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems. A labeled representation of the
socket can be seen in the figure below.
Figure 2. Socket with Labeled Features
Solder Balls
A total of 2011 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 13
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
®
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Intel
• Lead free SAC305 (SnAgCu) solder alloy with a silver (Ag) content 3%, copper
(Cu) 0.5%, tin (Sn) 96.5% and a melting temperature of approximately 217°C.
The immersion silver (ImAg) motherboard surface finish and solder paste alloy
must be compatible with the SAC305 alloy solder paste.
Contacts
The base material for the contacts is high strength copper alloy. For the area on
socket contacts where processor lands will mate, there is a 0.381 mm [0.015 inches]
minimum gold plating over 1.27 mm [0.05 inches] minimum nickel underplate. No
contamination by solder in the contact area is allowed during solder reflow. All socket
contacts are designed such that the contact tip lands within the substrate pad
boundary before any actuation load is applied and remain within the pad boundary at
final installation, after actuation load is applied.
The contacts are laid out in two L-shaped arrays as shown in the figure below. The
detailed view of the contacts indicate the wiping orientation of the contacts in the two
regions to be 29.6°.
Figure 3. Contact Wiping Direction
Overview
The contact between substrate land and socket contact are offset. The following
diagram shows contact offset from solder ball location and orientation of contact tip.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
14 Order No.: 330786-003
®
LGA2011-3 Socket Overview—Intel
Families
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Figure 4. Contact Tip Offset with Respect to Solder Ball
Socket Standoffs
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow. The following diagram highlights each feature of the socket-processor
stack up.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 15
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
®
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Intel
Figure 5. Processor Socket Stack Up
Overview
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The proceeding diagram
labels key features of the Pick and Place cover.
Figure 6. Pick and Place Cover with Labeled Features
The cover remains on the socket during reflow to help prevent contamination during
reflow. The cover can withstand 260°C for 40 seconds (typical reflow/rework profile)
and the environmental conditions listed in the TMSDG.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
16 Order No.: 330786-003
LGA2011-3 Socket Overview—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Families
The following figure diagrams the PnP and socket assembly. To reduce risk of damage
to socket contacts the pick and place (PnP) cover remains on the socket during ILM
installation.
Figure 7. PnP Cover and Socket Assembly
Once the ILM with its cover is installed Intel is recommending the PnP cover be
removed to help prevent damage to the socket contacts. To reduce the risk of bent
contacts the PnP Cover and ILM Cover were designed to not be compatible. Covers
can be removed without tools.
The pick and place covers are designed to be interchangeable between socket
suppliers.
2.2
Socket Land Pattern Guidance
The land pattern guidance provided in this section applies to printed circuit board
design. Recommendation for Printed Circuit Board (PCB) Land Patterns is to ensure
solder joint reliability during dynamic stresses, often encountered during shipping and
handling and hence to increase socket reliability.
LGA 2011-3 Land Pattern
The land pattern for the LGA2011-3 socket is 40 mils hexagonal array see the
following figure for detailed location and land pattern type.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 17
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
®
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Intel
Overview
Note: There is no round-off (conversion) error between socket pitch (1.016 mm) and board
pitch (40 mil) as these values are equivalent.
Figure 8. Socket 2011-3 Land Pattern
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
18 Order No.: 330786-003
®
LGA2011-3 Socket Overview—Intel
Families
Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Table 3. PIN Count By Pad Definition
Pad Definition / Padstack Color Quantity
20 X 17 Oblong Partially SMD / O17X20 RED Pins 43
20 X 17 Oblong Partially SMD / O17X20 LIGHT BLUE Pins 123
17 mil Ø MD / C17 GREY Pins 1845
Notes: 1. RED Pins: Corner nCTF pads (43 total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is
oriented at 45° from the center of the socket. All nCTF pads require thick traces ideally oriented
at 45° toward the package corner.
2. LIGHT BLUE Pins: Edge CTF pads (total) are all designed as 20 X 17 mil oblong partially
soldermask defined pads with an SRO of 17 ±1 mil Ø (shown below). The long axis of the pad is
oriented at 90° to the socket edge.
3. GREY Pins: Critical to function pins are all designed as 17 mil circular MD (Metal Defined) pads.
Pad Type Recommendations
Intel defines two types of pad types based on how they are constructed. A metal
defined (MD) pad is one where a pad is individually etched into the PCB with a
minimum width trace exiting it. The solder mask defined (SMD) pad is typically a pad
in a flood plane where the solder mask opening defines the pad size for soldering to
the component. In thermal cycling a MD pad is more robust than a SMD pad type. The
solder mask that defines the SMD pad can create a sharp edge on the solder joint as
the solder ball / paste conforms to the window created by the solder mask. For certain
failure modes the MD pad may not be as robust in shock and vibration (S&V). During
S&V, the predominant failure mode for a MD pad in the corner of the BGA layout is
pad craters and solder joint cracks. A corner MD pad can be made more robust and
behave like a SMD pad by having a wide trace enter the pad. This trace should be 10
mil minimum wide but not to exceed the pad diameter and exit the pad at a 45 degree
angle (parallel to the diagonal of the socket). During board flexure that results from
shock & vibration, a SMD pad is less susceptible to a crack initiating due to the larger
surface area. Intel has defined selected solder joints of the socket as non-critical to
function (NCTF) when evaluating package solder joints post environmental testing.
The signals at NCTF locations are typically redundant ground or non-critical reserved,
so the loss of the solder joint continuity at end of life conditions will not affect the
overall product functionality.
The following figure diagrams shape and location of solder pad types for socket
2011-3.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 19
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
Figure 9. Socket 2011-3 Pad Types and Locations
Overview
Notes: 1. When ordering PCBs with the Socket R (LGA2011) footprint, it is important to
specify the following verbiage on the FAB drawing as well as within the purchase
requisition: All BGA pads, Soldermask or Metal defined, min/max size tolerance,
should comply with Intel PCB specification, current revision. Nominal BGA pad
size, Soldermask or Metal defined, is Ø +/- 1 mil. This pad size is critical to
function on socket locations.
2. The solder paste stencil aperture recommendation for Socket R (LGA2011) is: 24
mil Ø circular aperture opening with a stencil thickness of 5 mils.
2.3
Socket Loading Requirements
The socket must meet the mechanical loading and strain requirements outlined in the
table below. All dynamic requirements are under room temperature conditions while
all static requirements are under product use condition temperature. Specifically, ILM
and HS load range may vary for different LGA 2011 derivatives (e.g. 2011-0, 2011-1)
due to the package form factor, and the design of loading mechanism and thermal
solution (e.g., HS mass).
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
20 Order No.: 330786-003
LGA2011-3 Socket Overview—Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product
Families
2.3.1
Socket Loading Specifications
The table below provides load specifications for the socket. These mechanical limits
should not be exceeded during component assembly, mechanical stress testing, or
standard drop and shipping conditions. All dynamic requirements are under room
temperature conditions while all static requirements are under 100 °C conditions.
Table 4. Socket Load Values
Parameter Load Limits,
SI Units
Min Max Min Max
Static Compressive
per Contact
Static Compressive
(ILM)
Static Compressive
Beginning of Life
(HS)
Static Compressive
End of Life
(HS)
Static Total
Compressive
Dynamic
Compressive
Board Transient
Bend Strain
15 (gf) 38 (gf) 0.53
445 (N) 712 (N) 100 (lbf) 160 (lbf) The total load applied by the enabling mechanism onto
222 (N) 400 (N) 50 (lbf) 90 (lbf) The total load applied by the heatsink mechanism onto
178 (N) 400 (N) 40 (lbf) 90 (lbf) The total load applied by the heatsink mechanism onto
667 (N) 1068 (N ) 150 (lbf) 240 (lbf) The total load applied by enabling mechanism and heat
NA 588 (N) NA 132 (lbf) Quasi-static equivalent compressive load applied during
NA 500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
Load Limits,
Imperial Units
1.34 (ozf) The compressive load applied by the package on the
(ozf)
NA 500 (ue)
for 62
(mil);
400 (ue)
for 100
(mil)
Definition
LGA contacts to meet electrical performance. This
condition must be satisfied throughout the life of the
product
the socket as transferred through the package, contacts
and socket seating plane.
the socket as transferred through the package, contacts
and socket seating plane. Measured at Beginning of Life
the socket as transferred through the package, contacts
and socket seating plane. Measured at End of Life
sink onto the socket as transferred through the
package, contacts and socket seating plane.
the mechanical shock from heatsink, calculated using a
reference 600g heatsink with a 25G shock input and an
amplification factor of 3 (600g x 25G x 3 =441N=99
lbf). This specification can have flexibility in specific
values, but the ultimate product of mass times
acceleration should not exceed this value. Intel
reference system shock requirement for this product
family is 25G input as measured at the chassis
mounting location.
This is the strain on boards near to socket BGA corners
during transient loading events through manufacturing
flow or testing. The test guidance can be found in Board
Flexure Initiative (BFI) strain guidance from your local
CQE.
2.4
Socket Maximum temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding
the temperature guidance may result in socket body deformation, or increases in
thermal and electrical resistance which can cause a thermal runaway and eventual
electrical failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket <78 °C
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 21
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—LGA2011-3 Socket
• The specific via used for temperature measurement is located on the bottom of
the motherboard between pins BC1 and BE1.
• The socket maximum temperature is defined at Thermal Design Current (TDC). In
addition, the heatsink performance targets and boundary conditions must be met
to limit power dissipation through the socket.
To measure via temperature:
1. Drill a hole through the back plate corresponding to the location of pins BC1 and
BE1.
2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into
the specific measurement via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature
Figure 10. Socket Temperature Measurement
Overview
2.5
Strain Guidance for Socket
Intel provides manufacturing strain guidance commonly referred to as Board Flexure
Initiative or BFI Strain Guidance. The BFI strain guidance apply only to transient bend
conditions seen in board manufacturing assembly environment with no ILM, for
example during In Circuit Test. BFI strain guidance limits do not apply once ILM is
installed. It should be noted that any strain metrology is sensitive to boundary
conditions. Intel recommends the use of BFI to prevent solder joint defects from
occurring in the test process. For additional guidance on BFI, see Manufacturing With
Intel® Components - Strain Measurement for Circuit Board Assembly, also referred as
BFI MAS ( Manufacturing Advantage Services) and BFI STRAIN GUIDANCE SHEET
(LGA2011-3 socket). Consult your Intel Customer Quality Engineer for additional
guidance in setting up a BFI program in your factory.
Note:
When the ILM is attached to the board, the boundary conditions change and the BFI
strain limits are not applicable. The ILM, by design, increases stiffness in and around
the socket and places the solder joints in compression. Intel does not support strain
metrology with the ILM assembled.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
22 Order No.: 330786-003
®
Independent Loading Mechanism (ILM) Specifications—Intel
2600 / 4600 v3 Product Families
Xeon® Processor E5-1600 /
3.0 Independent Loading Mechanism (ILM) Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the land
LGA package onto the socket contacts. See image below for total processor stack
consisting of all relevant mechanical components.
Figure 11. Processor Stack
The ILM is physically separate from the socket body. The assembly of the ILM is
expected to occur after attaching the socket to the board. The exact assembly location
is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
socket. Intel performs detailed studies on integration of processor package, socket
and ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be "built to print" from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 23
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
The ILM has two critical functions: evenly deliver and distribute the force to seat the
processor onto the socket contacts and ultimately through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and
package.
Socket LGA2011-3 has two POR (Plan of Record) ILMs:
1. Square ILM - This ILM has 80x80mm heatsink mounting hole pattern.
2. Narrow ILM - This ILM has 56x94mm heatsink mounting hole pattern.
3.1
ILM Load Specifications
The Independent Loading Mechanism (ILM) provides the force needed to seat the
package onto the socket contacts.
Maximum Allowable Loads
The table below provides load specifications for the processor package. These
maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure or other damage to the system. The processor substrate should not
be used as a mechanical reference or load bearing surface for thermal solutions.
Table 5. LGA 2011-3 Maximum Allowable Loads
Item Maximum
Static Pre-Load Compressive (ILM load) 712N (160 lbf)
Static Pre-Load Compressive (HS load) 400N (90 lbf)
Total Socket Static Compressive (ILM+HS=Socket) 1068N (240 lbf)
Minimum Allowable Loads
The ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load
specification. The thermal solution (heatsink) should apply additional load. The
combination of an ILM and HS will be used to achieve the load targets shown in the
table below.
Table 6. LGA 2011-3 Minimum Allowable Loads
Item Minimum
Static Pre-Load Compressive (ILM load) 445N (100 lbf)
Static Pre-Load Compressive (HS load) 222N (50 lbf)
Total Socket Static Compressive (ILM+HS=Socket) 667N (150 lbf)
End of Life Load Targets
The ILM is designed to achieve the minimum end of life loads for the socket. The
thermal solution (heatsink) should apply a portion of the end of life load. The
combination of an ILM and HS will be used to achieve the load targets shown in the
table below.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
24 Order No.: 330786-003
Independent Loading Mechanism (ILM) Specifications—Intel® Xeon® Processor E5-1600 /
2600 / 4600 v3 Product Families
Table 7. LGA 2011-3 Minimum End of Life Loads
Item End of Life Minimum
Static Pre-Load Compressive (ILM load) 311N (70 lbf)
Static Pre-Load Compressive (HS load) 178N (40 lbf)
Total Socket Static Compressive (ILM+HS=Socket) 490N (110 lbf)
3.2
ILM Keepout Zones (KOZ)
The table below lists envelope dimensions for ILM KOZ , both topside and backplate.
For detailed views, refer to dimensioned drawings in Mechanical Drawings on page
78.
Table 8. LGA 2011-3 ILM General Keepout Dimensions
Keepout Type Square ILM Narrow ILM
Topside envelope 93x93 mm (3.6x3.7in) 80x107.5 mm (3.15x4.2in)
ILM Hole Location 46x69.2 mm (1.8x2.7 in)
Backplate Envelope 78x84 mm (3.1x3.3 in)
3.3
Independent Loading Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
package onto the socket contacts. The ILM is a mechanical assembly that is physically
separate from the socket body. The assembly of the ILM to the motherboard is
expected to occur after attaching the socket to the board. The exact assembly location
is dependent on manufacturing preference and test flow.
The mechanical design of the ILM is a key contributor to the overall functionality of the
socket. Intel performs detailed studies on integration of processor package, socket
and ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be "built to print" from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from
Intel's detailed studies and may not incorporate critical design parameters.
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts resulting in even load transfer through the socket solder joints.
Another purpose of ILM is to ensure electrical integrity/performance of the socket and
package.
3.4
ILM Mechanical Design Considerations and Recommendations
An retention/loading mechanism must be designed to support the processor heatsink
and to ensure processor interface with the socket contact is maintained since there
are no features on the socket for direct attachment of the heatsink or retaining the
processor. In addition to supporting the processor heatsink over the processor, this
mechanism plays a significant role in the robustness of the system in which it is
implemented, in particular:
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 25
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Mechanism (ILM) Specifications
• Ensuring that thermal performance of the TIM applied between the IHS and the
heatsink is achievable. TIMs, especially those based on phase change materials,
are very sensitive to applied pressure: the higher the pressure, the better the
initial performance. TIMs such as thermal greases are not as sensitive to applied
pressure. Designs should consider the impact of shock and vibration events on
TIM performance as well as possible decrease in applied pressure over time due to
potential structural relaxation in enabled components.
• Ensuring that system electrical, thermal, and structural integrity is maintained
under shock and vibration events. The mechanical requirements of the attach
mechanism depend on the weight of the heatsink, as well as the level of shock
and vibration that the system must support. The overall structural design of the
baseboard and system must be considered when designing the heatsink and ILM
attach mechanism. Their design should provide a means for protecting the socket
solder joints as well as preventing package pullout from the socket.
• The load applied by the attachment mechanism and the heatsink must comply
with the package specifications, along with the dynamic load added by the
mechanical shock and vibration requirements of the package and socket.
• Load induced onto the package and socket by the ILM may be influenced with
heatsink installed. Determining the performance for any thermal/mechanical
solution is the responsibility of the customer.
A potential mechanical solution for heavy heatsink is the use of a supporting
mechanism such as a backer plate or the utilization of a direct attachment of the
heatsink to the chassis pan. In these cases, the strength of the supporting component
can be utilized rather than solely relying on the baseboard strength. In addition to the
general guidelines given above, contact with the baseboard surfaces should be
minimized during installation in order to avoid any damage to the baseboard.
3.5
Placement of board-to-chassis mounting holes also impacts board deflection and
resultant socket solder ball stress. Customers need to assess the shock for their
designs as heatsink retention (back plate), heatsink mass and chassis mounting holes
may vary.
ILM Features
The ILM is defined by four basic features
1. ILM Loadplate: Formed sheet metal that when closed applies four point loads onto
the IHS seating the processor into the socket
2. ILM Frame: Single piece or assembly that mounts to PCB board and provides the
hinge locations for the levers the ILM frame also contains captive mounts for
heatsink attach. An insulator is pre applied by the vendor to the bottom side of
the ILM frame.
3. ILM Actuation levers: Formed loading levers designed to place equal force on both
ends of the ILM load plate. Some of the load is passed through the socket body to
the board inducing a slight compression on the solder joints
4. ILM Backplate: A flat steel back plate with threaded studs to attach to the ILM
frame. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors. Two additional cut-outs on the backplate provide
clearance for backside voltage regulator components. An insulator is pre applied
by the vendor to the side with the threaded studs.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
26 Order No.: 330786-003
Independent Loading Mechanism (ILM) Specifications—Intel
2600 / 4600 v3 Product Families
Heatsink mounting studs on ILM frame allow for topside thermal solution attach to a
rigid structure. This eliminates the motherboard thickness dependency from the
heatsink mechanical stackup. ILM assembly provides a clamping force between the
ILM frame, backplate and board, resulting in reduced board bending leading to higher
solder joint reliability. ILM lever design provides an interlocking mechanism to ensure
proper opening or closing sequence for the operator. This has been implemented in
both square and narrow ILM.
ILM Load Plate Design
Four point loading contributes to minimizing package and socket warpage under non
uniformly distributed load. The reaction force from closing the load plate is transmitted
to the frame and through the captive fasteners to the back plate. Some of the load is
passed through the socket body to the board inducing a slight compression on the
solder joints. The load plate design is common between the two POR ILMS and is
shown in the figure below.
Figure 12. ILM Load Plate
®
Xeon® Processor E5-1600 /
Lever Actuation/Release Forces
Maximum allowable force to actuate the levers not to exceed 4.7 lbf (21 N) at the
point of typical finger placement.
ILM Back Plate Design
The backplate assembly consists of a supporting plate and captive standoffs. It
provides rigidity to the system to ensure minimal board and socket deflection. Four
externally threaded (male) inserts which are press fit into the back plate are for ILM
attachment. Three cavities are located at the center of the plate to allow access to the
baseboard test points and backside capacitors. An insulator is pre-applied to prevent
shorting the board.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 27
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Figure 13. ILM Backplate
Mechanism (ILM) Specifications
3.6
3.6.1
Intel® ILM Reference Designs
Intel has designed and validated two ILMs compatible with Socket LGA2011-3 :
1. Square ILM - 80x80 mm heat sink mounting hole pattern.
2. Narrow ILM - 56x94 mm heat sink mounting hole pattern.
The two POR ILMs share most components, only the top plate and active lever differ
between the two assemblies.
Square ILM
The square ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
square ILM assembly consists of several pieces as shown and labeled in the following
diagram. The hinge lever, active lever, load plate, top plate,clevises, and the captive
fasteners. For clarity the ILM cover is not shown in this view.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
28 Order No.: 330786-003
Independent Loading Mechanism (ILM) Specifications—Intel® Xeon® Processor E5-1600 /
2600 / 4600 v3 Product Families
Figure 14. Exploded Square ILM
An assembled view is shown in the following figure.
October 2015 Thermal Mechanical Specification and Design Guide
Order No.: 330786-003 29
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families—Independent Loading
Figure 15. Assembled Square ILM
Mechanism (ILM) Specifications
Table 9. Square ILM Component Thickness and materials
Component Thickness Material
ILM Frame 1.20 mm 310 Stainless Steel
ILM Load Plate 1.50 mm 310 Stainless Steel
ILM Back Plate 2.20 mm S50C low Carbon Steel
The square ILM supports the legacy 80x80 mm heat sink mounting patterns used in
some form factors.
3.6.2
Narrow ILM
The narrow ILM consists of two sub assemblies that will be procured as a set from the
enabled vendors. These two components are the ILM assembly and back plate. The
ILM assembly is shown in the following figure.
Intel® Xeon® Processor E5-1600 / 2600 / 4600 v3 Product Families
Thermal Mechanical Specification and Design Guide October 2015
30 Order No.: 330786-003
Loading...