Intel BXF80646I74770K User Manual

LGA1150 Socket

Application Guide

September 2013

Order No.: 328999-002

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Contents—LGA1150 Socket

Revision History..................................................................................................................6

1.0 Introduction................................................................................................................. 7

1.1 Related Documents.................................................................................................7

1.2 Definition of Terms................................................................................................. 7

2.0 LGA1150 Socket...........................................................................................................9

2.1 Board Layout......................................................................................................... 9

2.2 Attachment to Motherboard....................................................................................10

2.3 Socket Components.............................................................................................. 11

2.4 Package Installation / Removal............................................................................... 13

2.5 Durability.............................................................................................................14

2.6 Markings............................................................................................................. 14

2.7 Component Insertion Forces...................................................................................15

2.8 Socket Size..........................................................................................................15

3.0 Independent Loading Mechanism (ILM)......................................................................16

3.1 Design Concept.................................................................................................... 16

3.2 Assembly of Independent Loading Mechanism (ILM) to a Motherboard......................... 19

3.3 Independent Loading Mechanism (ILM) Interchangeability..........................................21

3.4 Markings............................................................................................................. 21

3.5 Independent Loading Mechanism (ILM) Cover...........................................................21

4.0 LGA1150 Socket and ILM Specifications......................................................................24

4.1 Mechanical Specifications....................................................................................... 24

4.2 Electrical Requirements......................................................................................... 25

4.3 Environmental Requirements..................................................................................26

Appendix A Component Suppliers..................................................................................... 28

Appendix B Mechanical Drawings......................................................................................29

Appendix C Heatsink Back Plate Drawings........................................................................ 34

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LGA1150 Socket

LGA1150 Socket—Figures

Figures

1 LGA1150 Pick and Place Cover.................................................................................... 9

2 LGA1150 Socket Land Pattern................................................................................... 10

3 Attachment to Motherboard...................................................................................... 11

4 Pick and Place Cover................................................................................................ 13

5 Package Installation / Removal Features.....................................................................14

6 ILM Assembly with Installed Processor........................................................................17

7 Back Plate.............................................................................................................. 18

8 Shoulder Screw....................................................................................................... 19

9 Independent Loading Mechanism (ILM) Assembly.........................................................20

10 Pin1 and Independent Loading Mechanism (ILM) Lever................................................. 20

11 Independent Loading Mechanism (ILM) Cover..............................................................22

12 ILM Cover and PnP Cover Interference........................................................................23

13 Flow Chart of Knowledge-Based Reliability Evaluation Methodology................................ 27

14 Socket/Heatsink / ILM Keep-out Zone Primary Side (Top)............................................. 30

15 Socket / Heatsink / ILM Keep-out Zone Secondary Side (Bottom)...................................31

16 Socket / Processor / ILM Keep-out Zone Primary Side (Top).......................................... 32

17 Socket / Processor / ILM Keep-out Zone Secondary Side (Bottom)................................. 33

18 Heatsink Back Plate Keep-in Zone.............................................................................. 35

19 Heatsink Back Plate................................................................................................. 36

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Tables—LGA1150 Socket

Tables

1 Related Documents ...................................................................................................7

2 Terms and Descriptions..............................................................................................7

3 Socket Component Mass...........................................................................................24

4 1150-land Package and LGA1150 Socket Stackup Height.............................................. 24

5 Socket and ILM Mechanical Specifications .................................................................. 25

6 Electrical Requirements for LGA1150 Socket ...............................................................26

7 LGA1150 Socket and ILM Components........................................................................28

8 Supplier Contact Information ....................................................................................28

9 Mechanical Drawing List........................................................................................... 29

10 Mechanical Drawing List........................................................................................... 34

11 Supplier Contact Information.....................................................................................34

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LGA1150 Socket

Revision History

Revision Number Description Revision Date

001 • Initial release June 2013

002 • Added Desktop Intel® Pentium processor family September 2013

LGA1150 Socket—Revision History

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Introduction—LGA1150 Socket

1.0 Introduction

This document covers the LGA1150 socket for Desktop systems using the Desktop 4th Generation Intel® Core™ processor family, Desktop Intel® Pentium® processor family,

and for UP Server / Workstation systems using the Intel® Xeon® processor E3-1200 v3 product family.

The information in this document include:

• The thermal and mechanical specifications for the socket

• The mechanical interface requirements to properly integrate the socket into a board design

1.1

Definition of Terms

Table 2. Terms and Descriptions

Term Description

Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct.

CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal

DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation

For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.

event.

temperature.

Title Document Number /

Location

328897

328898

328900

328906

continued...

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LGA1150 Socket

LGA1150 Socket—Introduction

Term Description

FSC Fan Speed Control

IHS Integrated Heat Spreader: a component of the processor package used to enhance the

thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.

ILM Independent Loading Mechanism provides the force needed to seat the LGA1150 land

package onto the socket contacts.

MD Metal Defined pad is one where a pad is individually etched into the PCB with a minimum

width trace exiting it.

PCH Platform Controller Hub. The PCH is connected to the processor using the Direct Media

Interface (DMI) and Intel® Flexible Display Interface (Intel® FDI).

LGA1150 socket The processor mates with the system board through this surface mount, 1150-land

socket.

PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a

communication channel between Intel processor and chipset components to external monitoring devices.

Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution performance using total package power. Defined as (T The heat source should always be specified for Y measurements.

– TLA ) / Total Package Power.

CASE

Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (T

– TS ) / Total Package Power.

CASE

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA ) / Total Package Power.

SMD The Solder Mask Defined pad is typically a pad in a flood plane where the solder mask

opening defines the pad size for soldering to the component to the printed circuit board.

CASE

or T

MAX

The case temperature of the processor, measured at the geometric center of the topside of the TTV IHS.

The maximum case temperature as specified in a component specification.

TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by

using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.

CONTROL

is a static value that is below the TCC activation temperature and used as a

CONTROL

trigger point for fan speed control. When DTS > T the TTV thermal profile.

, the processor must comply to

CONTROL

TDP Thermal Design Power: Thermal solution should be designed to dissipate this target

power level. TDP is not the maximum power that the processor can dissipate.

Thermal Monitor A power reduction feature designed to decrease temperature after the processor has

reached its maximum operating temperature.

Thermal Profile Line that defines case temperature specification of the TTV at a given power level.

TIM Thermal Interface Material: The thermally conductive compound between the heatsink

and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.

TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater

in the die to evaluate thermal solutions.

The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.

The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.

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LGA1150 Socket—LGA1150 Socket

2.0 LGA1150 Socket

This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1150 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.

The contacts are arranged in two opposing L-shaped patterns within the grid array. The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and selective depopulation elsewhere.

The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The ILM design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in LGA1150 Socket and ILM Specifications on page 24.

Figure 1. LGA1150 Pick and Place Cover

2.1

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Board Layout

The land pattern for the LGA1150 socket is 36 mils X 36 mils (X by Y) within each of the two L-shaped sections. There is no round-off (conversion) error between socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm (122.6 mil) in the y direction see Figure 2 on page 10. This was to achieve a common package land to PCB land offset that ensures a single PCB layout for socket designs from the multiple vendors.

LGA1150 Socket

Figure 2. LGA1150 Socket Land Pattern

LGA1150 Socket—LGA1150 Socket

2.2

Attachment to Motherboard

The socket is attached to the motherboard by 1150 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket.

As indicated in Figure 1 on page 9, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process.

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LGA1150 Socket—LGA1150 Socket

Figure 3. Attachment to Motherboard

2.3

Socket Components

The socket has two main components, the socket body and Pick and Place (PnP) cover, and is delivered as a single integral assembly. Refer to Socket Mechanical

Drawings for detailed drawings.

Socket Body Housing

The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable of withstanding 260 °C for 40 seconds, which is compatible with typical reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane) and creep properties must be such that the integrity of the socket is maintained for the conditions listed in LGA1150 Socket and ILM Specifications on page 24.

The color of the housing will be dark as compared to the solder balls to provide the contrast needed for pick and place vision systems.

Solder Balls

A total of 1150 solder balls corresponding to the contacts are on the bottom of the socket for surface mounting with the motherboard. The socket solder ball has the following characteristics:

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LGA1150 Socket

+ 25 hidden pages