How it Works
Intel
Loading...
631xESB
User Manual
32 pgs836.96 Kb0
Table of contents
Loading...

Intel 631xESB, 632xESB User Manual

Download

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Thermal and Mechanical Design Guidelines
Februa r y 2007
Order Number: 315 263-001

Lega l Li nes and Discl a imers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHAT SOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELA T ING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.
Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
present e d subject m at ter. The f urnishing o f do c um ent s a nd ot h er ma te ri al s a nd i nfo rm at io n do es n ot provide a n y l ic e n se, ex p res s o r impli ed, by es topp el or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details.
The NAME OF PRODUCT may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling
1-800-548-4725 or by visiting Intel's website at http://www.intel.com. BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino logo, Core Inside, Dialogic, FlashFile, i960, InstantIP, Intel, Intel logo, Intel386, Intel486,
Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Core, Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, IPLink, Itanium, Itanium Inside, MCS, MMX, Oplus, OverDrive, PDCharm, Pentium, Pentium Inside, skoool, Sound Mark, The Journey Inside, VTune, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
*Other na m es and bra nds may be claimed as the pro perty of others. Copyright © 2007, Intel Corporation. All Rights Reserved.
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDG February 2007 2
Contents—Intel
®
6321ESB ICH

Contents

1.0 Introduction..............................................................................................................5
1.1 Design Flow........................................................................................................5
1.2 Definition of Terms..............................................................................................7
1.3 Reference Documents.......................................................................................... 7
2.0 Packaging Technology...............................................................................................9
3.0 Thermal Specifications ............................................................................................11
3.1 Thermal Design Power (TDP) ..............................................................................11
3.2 Die Case Temperature .......................................................................................11
4.0 Thermal Simulation .................................................................................................12
5.0 Thermal Solution Requirements...............................................................................13
5.1 Characterizing the Thermal Solution Requirement..................................................13
6.0 Thermal Metrology ..................................................................................................16
6.1 Die Case Temperature Measurements ..................................................................16
6.1.1 Zero Degree Angle Attach Methodology................................................... ..16
7.0 Reference Thermal Solution.....................................................................................19
7.1 Operating Environment ......................................................................................19
7.2 Heatsink Performance........................................................................................19
7.3 Mechanical Design Envelope ...............................................................................20
7.4 Board-Level Components Keepout Dimensions ......................................................21
7.5 Torsional Clip Heatsink Thermal Solution Assembly................................................22
7.5.1 Heatsink Orientation...............................................................................23
7.5.2 Mechanical Interface Material...................................................................24
7.5.3 Thermal Interface Material.......................................................................24
7.5.4 Heatsink Clip.........................................................................................25
7.5.5 Clip Retention Anchors............................................................................25
8.0 Reliability Guidelines...............................................................................................26
A Thermal Solution Component Suppliers...................................................................27
A.1 Torsional Clip Heatsink Thermal Solution..............................................................27
B Mechanical Drawings...............................................................................................28

Figures

1 Thermal Design Process.............................................................................................. 6
2 Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View).................................9
3 Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)................................9
4 Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)..........................10
5 Processor Thermal Characterization Parameter Relationships .........................................14
6 Thermal Solution Decision Flowchart...........................................................................17
7 Zero Degree Angle Attach Heatsink Modifications .........................................................17
8 Zero Degree Angle Attach Methodology (Top View).......................................................18
9 Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target
at 65C Local-Ambient ...............................................................................................20
10 Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub .... 21
11 Torsional Clip Heatsink Board Component Keepout .......................................................23
12 Torsional Clip Heatsink Assembly ...............................................................................24
13 Torsional Clip Heatsink Assembly Drawing...................................................................29
14 Torsional Clip Heatsink Drawing.................................................................................30
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
3
Intel® 6321ESB ICH—Revision History
15 Heat Sink Foam Gasket Drawing.................................................................................31
16 Torsional Clip Drawing ..............................................................................................32

Tables

1 Definition of Terms .................................................................................................... 7
2 Referenced Documents............................................................................................... 8
3 Intel® 6321ESB I/O Controller Hub Thermal Specifications ............................................11
4 Required Heat Sink Thermal Performance (YCA)...........................................................15
5 Honeywell PCM45 F TIM Performance as a Function of Attach Pressure ............................25
6 Reliabilit y Guidelines.................................................................................................26
7 Mechanical Drawing List ...................................................................................... ......28

Revision History

Date Revision Description
February 2007 001 Initial public release.
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Introduction—Intel
®
6321ESB ICH

1.0 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 6321ESB I/O Controller Hub.
• Describe a reference thermal solution that meets the specification of Intel® 6321ESB I/O Controller Hub in Embedded applications.
Properly designed thermal solutions provide adequate cooling to maintain the Intel® 6321ESB I/O Controller Hub component die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The sim plest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 6321ESB I/O Controller Hub component only. For thermal design information on other chipset components, refer to the respective component datasheet.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
5

Figure 1. Thermal Design Process

Step 1: Thermal Simulation
y Thermal Model y Thermal Model User's Guide
Intel® 6321ESB ICH—Introduction
Step 2: Heatsink Selection
y Thermal Reference y Mechanical Reference
Step 3: Thermal Validation
y Thermal Testing Software y Software User's Guide
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Introduction—Intel
®
6321ESB ICH

1.2 Definition of Terms

Table 1. Definiti on of Ter ms

Term Definition
BLT
FCBGA
Intel® 6321ESB I/O Controller Hub
LFM
MCH
Tcase-ma x
Tcase-min
TDP
Ψ
CA
Ψ
CS
Ψ
SA
Bond line thickness. Final settled thickness of the thermal interface material after installation of heatsink.
Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is exposed on the package substrate.
The chipset component that integrates an Ultra ATA 100 controller, six Serial ATA host controller ports, one EHCI host controller supporting eight external USB 2.0 ports, LPC interface controller, flash BIOS interface controller, PCI/PCI-X interface controller, PCI Express interface, BMC controller, Azalia / AC'97 digital controller, integrated LAN controller, an ASF contr oll er an d a ESI fo r comm u nic at ion wit h the MCH.
Linear Feet Per Minute. A measure o f airflow emitted from a forced convection device, such as an axial fan or blower.
Memory controller hub. The chipset component that contains the processor interface, the memory interface, and the South Bridge Interface.
Maxi mum die temperature allowed. This temp erature is measured at the geometric center of the top of the package die.
Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.
Thermal Design Power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.
Case-to-ambient thermal characterization parameter. A measure of the thermal solution thermal performance including the TIM using total package power. Defined as (TCASE – TLA) / Total P ack age Power.
Note: Heat source must be specified when using Ψ calculations.
Case-to-Sink thermal characterization parameter. A measure of the thermal interface material performance using total package power. Defined as (TCASE - TSINK)/ Total Package Power.
Note: Heat source must be specified when using Ψ calculations.
Sink-to- Ambient thermal c haracterization parameter. A measure of the heat sink performance using total package power. Defined as (TSINK - TLA)/Total Package Power.
Note: Heat source must be specified when using Ψ calculations.

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
7

Table 2. Referenced Documents

Intel® 631xESB / 632xESB I/O Controller Hub Datasheet
Intel® 631xESB / 632xESB I/O Controller Hub Specification Update
Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guide
Intel® 6700PXH 64-bit PCI H ub/6702PX H 64-bi t PCI Hub (PXH/PXH­V) Thermal Mechanical Design Guidelines
Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet
BGA/OLGA Assembly Development Guide Various system thermal design suggestions http://www.formfactors.org
1. Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.
Intel® 6321ESB ICH—Introduction
Title Location
http://www.intel.com/design/ chipsets/datashts/313082.htm
http://www.intel.com/design/ chipsets/specupdt/313075.htm
Reference# 31307301
http://www.intel.com/design/ chipsets/designex/302817.htm
http://www.intel.com/design/ chipsets/datashts/302628.htm
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Packaging Technology—Intel
.
–
2
®
6321ESB ICH

2.0 Packaging Technology

The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer FC-BGA3 package (see Figure 2 and Figure 3).

Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)

Die
Handling
Exclusion
Area
10.78mm.
19.49mm.
6.17mm.
Keepout
Area
20.19mm.
ESB2
Die
30.0mm.26.0mm.13.99mm.
40.0mm
3.10mm.
26.0mm.
30.0mm.
40.0mm.

Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)

Substrate
.535 ± 0.123 mm
2.100 ± 0.121 mm
Decoup
Cap
0.84 ± 0.05 mm
Die
0.7 mm Max
0.20
See note 4.
0.435 ± 0.025 mm
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to AN SI Y14.5M- 1994
3. BGA has a pr e-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard atta ch; FCBGA ha s a convex (dome shaped) orientation before reflow and is expect ed to have a slightly concave (bowl shaped) orientation after reflow
See note 3
Seating Plane
0.20 –C
See note 1.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
9
Intel® 6321ESB ICH—Packaging Technology

Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)

AT
A R
AP
A N
AM
AL
AK
AJ
A H
AG
AF
AE
A D
A C
AB
19.11
35X 1.092
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
2822 26242018161412108642 36343230
35X
1.092
11 2523211917151397531 2729 333531
19.11
40 + 0.05
CA0.2
40 + 0.05
- A -
A
B
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
3. Package Mechanical Requirements
The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/ IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the package only.
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal Specifications—Intel
®
6321ESB ICH

3.0 Thermal Specifications

3.1 Thermal Design Power (TDP)

Analysis indicates that real applications are unlikely to cause the Intel® 6321ESB I/O Controller Hub component to consume maximum power dissipation for sustained time periods. Therefore, in order to arrive at a more realistic power level for thermal design purposes , I ntel cha racterizes power cons ump tio n ba se d on k now n pl at for m ben ch ma rk applications. The resulting power consumption is referred to as the Thermal Design Power (TDP). TDP is the target power level that the thermal solutions should be designed to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see Table 3. Flip chip ball grid array (FC-BGA) packages have poor heat transfer capability into the board and have minimal thermal capability without a ther mal s oluti on. I ntel r eco mmends that s ystem d esig ners p lan f or a he atsi nk when using the Intel® 6321ESB I/O Controller Hub component.

3.2 Die Case Temperature

To ensure proper operation and reliability of the Intel® 6321ESB I/O Controller Hub component, the die temperatures must be at or between the maximum/minimum operating temperature ranges as specified in Table 3. Sy st em and / or com p on en t leve l thermal solutions are required to maintain these temperature specifications. Refer to
Chapter 6.0 for guidelines on accurately measuring package die temperatures.

Table 3. Intel® 6321ESB I/O Controller Hub Thermal Specifications

Parameter Value Notes
Tcase_max 105°C Tcase_min 5°C TDP 12.4W
Note: These specifications are based on silicon characterization; however, they may be
updated as further data becomes available.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
11

4.0 Thermal Simulation

Intel provides thermal simulation models of the Intel® 6321ESB I/O Controller Hub component and associated user's guides to aid system designers in simulating, analyzing, and optimizing their thermal solutions in an integrated, system-level environment. The models are for use with the commercially available Computational Fluid Dynamics (CFD)-based thermal analysis tool Flotherm* (version 5.1 or higher) by Flomerics, Inc*. These models are also available in IcePak* format. Contact your Intel field sales representative to order the thermal models and user's guides.
Intel® 6321ESB ICH—Thermal Simulation
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal Solution Requirements—Intel
®
6321ESB ICH

5.0 Thermal Solution Requirements

5.1 Characterizing the Thermal Solution Requirement

The idea of a “thermal characterization parameter” Ψ (the Greek letter psi), is a convenient way to characterize the performance needed for the thermal solution and to compare thermal solutions in identical situations (i.e., heating source, local ambient conditions, etc.). The thermal characterization parameter is calculated using total package power, whereas actual thermal resistance, θ (theta), is calculated using actual power dissipated between two points. Measuring actual power dissipated into the heat sink is difficult, since some of the power is dissipated via heat transfer into the package and board .
The case-to-local ambient thermal characterization parameter (Ψ measure of the thermal performance of the overall thermal solution. It is defined by
Equation 1 and measured in units of °C/W.
Equation 1. Case-to-Local Ambient Therm al Characte rization Para meter (Ψ
T
CASE
Ψ
CA
The case-to-local ambient thermal characterization parameter, Ψ
Ψ
, the thermal interface material (TIM) thermal characterization parameter, and of
CS
Ψ
, the sink-to-local ambient thermal characterization parameter:
SA
Equation 2. Case-to-Local Ambient Therm al Characte rization Para meter (Ψ
Ψ
CA
-------------------------
=
Ψ
CS
TDP
Ψ
+=
TLA–
SA
) is used as a
CA
, is comprised of
CA
CA
CA
)
)
is strongly dependent on the thermal conductivity and thickness of the TIM
Ψ
CS
between the heat sink and device package.
Ψ
is a measure of the thermal characterization parameter from the bottom of the
SA
heat sink to the local ambient air. Ψ conductivity, and geometry. It is also strongly dependent on the air velocity through the fins of the heat sink. Figure 5 illustrates the combination of the different thermal characterization parameters.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
is dependent on the heat sink material, thermal
SA
13
Intel® 6321ESB ICH—Thermal Solution Requirements
S
T
C
A
SA
TIM Device
T
S
T
C
A
SA

Figure 5. Processor Thermal Characterizatio n Pa ram ete r Relati o nshi ps

T
T
Ψ
HEATSINK
Ψ
Ψ
Ψ
CA
CA
T

Example 1. Calculating the Required Thermal Performance

The cooling performance, Ψ previously described. The process to determine the required thermal performance to cool the device includes:
1. Define a target component temperature T
2. Define a target local ambient temperature, T
3. Use Equation 1 and Equation 2 to determine the required thermal performance needed to cool the device.
The following provides an example of how you might determine the appropriate performance targets.
Assume:
• TDP = 12.4 W and T
• Local processor ambient temperature, T
Then the following could be calculated using Equation 1 for the given chipset configuration:
is defined using the thermal characterization parameter
CA,
and corresponding TDP.
CASE
LA
= 105° C
CASE
= 65° C.
LA
Ψ
Ψ
CS
CS
.
T
CASE
-------------------------
Ψ
To determine the required heat sink performance, a heat sink solution provider would need to determine Ψ configuration. If the heat sink solution were designed to work with a TIM material performing at Ψ the heat sink is:
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
===
CA
performance for the selected TIM and mechanical load
CS
≤ 0.35 °C/W, solvin g fro m Equation 2, the performance needed from
CS
TDP
TLA–
105 65–
---------------
3.23°
12.4
C
--- -
W
Thermal Solution Requirements—Intel
Ψ
SA
If the local ambient temperature is relaxed to 45° C, the same calculation can be carried out to determine the new case-to-ambient thermal resistance:
®
6321ESB ICH
C
===
Ψ
CA
Ψ
– 3.23 0.35–2.88°
CS
--- -
W
T
-----------------
Ψ
It is evident from the above calculations that a reduction in the local ambient temperature has a significant effect on the case-to-ambient thermal resistance requir em ent. Thi s effe ct ca n con tri bute to a mor e reas ona ble t her mal so lut ion in clu din g reduced cost, heat sink size, heat sink weight, and a lower system airflow rate.
Table 4 summarizes the thermal budget required to adequately cool the Intel
6321ESB I/O Controller Hub in one configuration using a TDP of 12.4 W. Further calculations would need to be performed for different TDPs. Since the results are based on air data at sea level, a correction factor would be required to estimate the thermal performance at other altitudes.
Table 4. Required Heat Sink Thermal Performance (ΨCA)
Device ΨCA (º C/W) at TLA = 45º C ΨCA (º C/W) at TLA = 65º C
®
6321ESB I/O Controller
Intel Hub @ 12.4 W
===
CA
C
TDP
TLA–
105 45–
---------------
12.4
4.84 3.23
4.84°
C
----
W
®
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
15
Intel® 6321ESB ICH—Thermal Metrology

6.0 Thermal Metrology

The system designer must make temperature measurements to accurately determine the thermal performance of the system. Intel has established guidelines for proper techniques to measure the Intel® 6321ESB I/O Controller Hub die temperatures.
Section 6.1 provides guidelines on how to accurately measure the Intel
die temperatures. The flowchart in Figure 6 offers useful guidelines for thermal performance and evaluation.

6.1 Die Case Temperature Measurements

To ensure functionality and reliability, the Tcase of the Intel® 6321ESB ICH must be maintained at or between the maximum/minimum operating range of the temperature specification as noted in Table 3. The surface temperature at the geometric center of the die corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate temperature measurement.
®
6321ESB ICH
Temperature differences between the temperature of a surface and the surrounding local ambient air can introduce errors in the measurements. The measurement errors could be due to a poor thermal contact between the thermocouple junction and the surface of the package , heat loss by radiation and/or convection, conduction through thermocouple leads, and/or contact between the thermocouple cement and the heatsink base. For maximize measurement accuracy, only the 0° thermocouple attach approach is recommended.

6.1.1 Zero Deg r ee Angle Attach M e t ho d ol og y

1. Mill a 3.3 m m (0.13 i n.) d iam eter a nd 1.5 m m (0 .06 in. ) dee p hol e cen ter ed on t he botto m of th e he at s i nk ba se .
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered hole to one edge of the heatsink. The slot should be parallel to the heatsink fins (see Figure 7).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to the center of the top surface of the die using a high thermal conductivity cement. During this step, ensure no contact is present between the thermocouple cement and the heatsink base because any contact will affect the thermocouple reading. It is critical that the thermocouple bead makes contact with the die (see Figure 8).
6. Attach heatsink assembly to the MCH and route thermocouple wires out through the milled slot.
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal Metrology—Intel
®
6321ESB ICH
Figure 6. Thermal Solution Decision Flowchart
Start
Attach device
to board
using normal
reflow
process.
Attach
thermocouples
using recommended
metrology. Setup the system in the
desired
configuration.
Select
Heatsink
Run the Power
program and
monitor the
devi ce die
temperature.
Heatsink Required
Figure 7. Zero Degree Angle Attach Heatsink Modifications
Tdie >
Specification?
Yes
No
End
001240
Note: Not to scale.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
17
Intel® 6321ESB ICH—Thermal Metrology
Figure 8. Zero Degree Angle Attach Methodology (Top View)
Die
Thermocouple
Wire
Substrate
Note: Not to scale.
Cement + Thermocouple Bead
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Reference Thermal Solution—Intel
®
6321ESB ICH

7.0 Reference Thermal Solution

Intel has developed one reference thermal solution to meet the cooling needs of the Intel® 6321ESB I/O Controller Hub component under operating environments and specifications defined in this document. This chapter describes the overall requirements for the Torsional Clip Heatsink reference thermal solution including critical-to-function dimensions, operating environment, and validation criteria. Other chipset components may or may not need attached thermal solutions, depending on your specific system local-ambient operating conditions.

7.1 Operating Environment

The Intel® 6321ESB ICH reference thermal solution was designed assuming a maximum local- ambient temperature of 65°C. The minimum recommended airflow velocity through the cross section of the heatsink fins is 150 linear feet per minute (LFM). The approaching airflow temperature is assumed to be equal to the local­ambient temperature. The thermal designer must carefully select the location to measure airflow to obtain an accurate estimate. These local-ambient conditions are based on a 55°C external-ambient temperature at sea level. (External-ambient refers to the environment external to the system.)

7.2 Heatsink Performance

Figure 9 depicts the measured thermal performance of the reference thermal solution
versus approach air velocity. Since this data was measured at sea level, a correction factor would be required to estimate thermal performance at other altitudes.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
19
Intel® 6321ESB ICH—Reference Thermal Solution
Figure 9. Torsional Clip Heatsink Measured Thermal Performance Versus Approach
Velocity and Target at 65C Local-Ambient
8.000
7.000 Thermal Target
6.000
5.000
4.000
3.000
2.000
Psi-ca (mean plus 2.3 sigm a) [C/W]
1.000
0.000
0 50 100 150 200 250 300 350 400
LFM through fin area
Simulation results with EOLife TI M performance

7.3 Mechanical Design Envelope

While each design may have unique mechanical volume and height restrictions or implement ati on requi re ment s, t he heig ht , wi dth, an d de pt h co nst ra i nts typ ical l y pla ce d on the Intel
When using heatsinks that extend beyond the Intel® 6321ESB I/O Controller Hub reference heatsink envelope shown in Figure 10, any motherboard components placed between the heatsink and motherboard cannot exceed 2.46 mm (0.10 in.) in height.
®
6321ESB ICH thermal solution are shown in Figure 10.
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Reference Thermal Solution—Intel
®
6321ESB ICH
Figure 10. Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O
Controller Hub
ESB2
ESB2
ESB2
Passive
Passive
Passive
Passive
Passive
Passive
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
Die + TIM
Die + TIM
Die + TIM
Die + TIM
Die + TIM
Die + TIM
FCBGA + Solder Balls
FCBGA + Solder Balls
FCBGA + Solder Balls
FCBGA + Solder Balls
FCBGA + Solder Balls
FCBGA + Solder Balls
Motherboard
Motherboard
Motherboard
Motherboard
Motherboard
Motherboard
42.30 mm
42.30 mm
42.30 mm
42.30 mm
42.30 mm
42.30 mm .
42.30 mm .
42.30 mm .
42.30 mm .
42.30 mm .
42.30 mm .
TNB
TNB
TNB
TNB
TNB
TNB
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
21.33mm
21.33mm
21.33mm
21.33mm
21.33mm
21.33mm
21.33mm
21.33mm21.33mm
21.33mm
21.33mm
21.33mm
21.33 mm
21.33 mm
21.33 mm
21.33 mm
21.33 mm
33.30 mm.
33.30 mm.
33.30 mm.
33.30 mm.
33.30 mm.
33.30 mm.
2.61 mm
2.61 mm
2.61 mm
2.61 mm
2.61 mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30mm
4.30 mm.
4.30 mm.
4.30 mm.
4.30 mm.
4.30 mm.
4.30 mm.
.
.
.
.
.
. m
m
m
m
m
ESB2
ESB2
ESB2
Passive
Passive
Passive
Passive
Passive
Passive
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
Heatsink
m 0m
0m
0m
0m
0m
0m
42.3
42.3
42.3
42.3
42.3
42.3
42.30 mm
42.30 mm
42.30 mm
42.30 mm
42.30 mm

7.4 Board-Level Components Keepout Dimensions

The location of holes pattern and keepout zones for the reference thermal solution are shown in Figure 11. This reference thermal solution has the same mounting hole pattern as that of the Intel® E7500/E7501/E7505 chipset.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
21
Intel® 6321ESB ICH—Reference Thermal Solution

7.5 Torsional Clip Heatsink Thermal Solution Assembly

The reference thermal solution for the Intel® 6321ESB ICH component is a passive heatsink with thermal interface. It is attached using a clip with each end hooked through an anchor soldered to the board. Figure 12 shows the reference thermal solut i on as se m bly an d as so c i ate d co mp one nt s . Th e t or s io na l c l ip a nd th e clip re t en ti on anchor are the same as the one used on the Intel® E7500/E7501/E7505 and 3100 chipset reference thermal solutions.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in Appendix B, “Mechanic al Drawings ”. Appendix A, “Thermal Solution
Componen t Supp lier s” contains vendor information for each thermal solution
component.
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Reference Thermal Solution—Intel
®
6321ESB ICH

Figure 11. Torsional Clip Heatsink Board Component Keepout

Note: Same Keepout zones as Intel ® 3100 Ch ipset

7.5.1 Heatsink Orientation

Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned with the direction of the heatsink fins.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
23
Figure 12. Torsional Clip Heatsink Assembly
Intel® 6321ESB ICH—Reference Thermal Solution

7.5.2 Mechanical Interface Material

There is no mechanical interface material associated with this reference solution.

7.5.3 Ther m a l Int erface M aterial

A Thermal Inte rface Materi al (TIM) prov ides imp roved con ductivi ty between th e die and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.254 mm (0.010 in.) thick, 15 mm x 15 mm (0.59 in. x 0.59 in.) square.
Note: Unflowed or "dry" Honewell PCM-45F has a material thickness of 0.010 inch. The
flowed or "wet" Honeywell PCM-45F has a material thickness of ~0.003 inch after it reaches its phase change temperature.
7.5.3.1 Effect of Pressure on TIM Performance
As mechanical pressure increases on the TIM, the thermal resistance of the TIM decreases. This phenomenon is due to the decrease of the bond line thickness (BLT). BLT is the final settled thickness of the thermal interface material after installation of heatsink. The effect of pressure on the thermal resistance of the Honeywell PCM45 F TIM is shown in Table 5.
Intel provides both End of Line and End of Life TIM thermal resistance values of Honeywell PCM45F. End of Line and End of Life TIM thermal resistance values are obtained through measurement on a Test Vehicle similar to the Intel® 631xESB/ 632xESB I/O's physical attributes using an extruded aluminum heatsink. The End of Line value represents the TIM performance post heatsink assembly while the End of
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Reference Thermal Solution—Intel
®
6321ESB ICH
Life value is the predicted TIM performance when the product and TIM reaches the end of its life. The heatsink clip provides enough pressure for the TIM to achieve End of Line thermal resistance of 0.345 °C x in
2
in
/W.
2
/W and End of Life thermal resistance of 0.459°C
Table 5. Honeywell PCM45 F TIM Performance as a Function of Attach Pressure
Pressure on IHS(psi)
Thermal Resistance (°C × in
End of Line End of Life End of Line End of Life
2.18 0.391 0.551
4.35 0.345 0.459 Note: All measured at 50ºC.
2
)/W

7.5.4 Heatsink Clip

The reference solution uses a wire clip with hooked ends. The hooks attach to wire anchors to fasten the clip to the board. See Appendix B, “Mechanical Drawings” for a mechanical drawing of the clip.

7.5.5 Clip Retention Anchors

For Intel® 6321ESB I/O Controller Hub-based platforms that have very limited board space, a clip retention anchor has been developed to minimize the impact of clip retention on the board. It is based on a standard three-pin jumper and is soldered to the board like any common through-hole header. A new anchor design is available with 45° bent leads to increase the anchor attach reliability over time. See Appendix A,
“Thermal Solution Component Suppliers” for the part number and supplier information.
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
25

8.0 Reliability Guidelines

Each motherboard, heatsink and attach combination may vary the mechanical loading of the component. Based on the end user environment, the user should define the appropriate reliability test criteria and carefully evaluate the completed assembly prior to use in high volume. Some general recommendations are shown in Table 6.

Table 6. Reliability Guidelines

Test (1) Requirement Pass/Fail Criteria (2)
Mechanical Shock 50 g, board level, 11 msec, 3 shocks/axis Visual Check and Electrical Functional Test
Random Vibration
Temperature Life
Thermal Cycling -5°C to +70°C, 500 cycles Visual Check Humidity 85% relative humidity, 55°C, 1000 hours Visual Check
Notes:
1. It is recommended that the above tests be performed on a sample size of at least twelve assemblies from three lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
7.3 g, board level, 45 min/axis, 50 Hz to 2000 Hz
85°C, 2000 hours total, checkpoints at 168, 500, 1000, and 2000 hours
Intel® 6321ESB ICH—Reliability Guidelines
Visual Check an d Electrical Fu nctional Test
Visual Check
§ §
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Thermal Solution Component Suppliers—Intel
®
6321ESB ICH

Appendix A Thermal Solution Component Suppliers

A.1 Torsional Clip Heatsink Thermal Solution

Part
AdvancedTCA* and Embedded Form Factor Heat Sink
Thermal Interface (PCM45F)
Heatsink Attach Clip A69230-001 CCI/ACK
Heat Sink Attach Clip A69230-001 Fox c on n*
Solder-Down Anchor A13494-005
Note: The enabled components may not be currently available from all suppliers. Contact the supplier
directly to verify time of component availability.
Intel Part
N/A
N/A
Number
Supplier
(Part Number)
ECB-00306-01-GP (Aluminum)
Honeywell* PCM45F
Foxconn (HB96030-DW)
Contact Information
Wendy Lin 510-770-8566 , x211 Wendy@coolermaster.com
Paula Knoll 858-705-1274 paula.knoll@honeywell.com
Harry Lin (USA) 714-739-5797 hlinack@aol.com
Monica Chih (Taiwan) 866-2-299526 66, x131 monica_chih@ccic.com.tw
Bob Hall (USA) 503-693-3509 , x235 bhall@foxconn.com
Julia Jiang (USA) 408-919-6178 juliaj@foxconn.com
Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
27

Appendix B Mechanical Drawings

Table 7 lists the mechanical drawings included in this appendix.

Table 7. Mechanical Drawing List

Drawing Description Figure Number
T or s ional Clip Heatsink Assembly Drawing Figure 13 T ors ional Clip Heatsink Drawing Figure 14 Heat Sink Foam Gasket Drawing Figure 15 T ors ional Clip Drawing Figure 16
Intel® 6321ESB ICH—Mechanical Drawings
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Mechanical Drawings—Intel
®
6321ESB ICH

Figure 13.Torsional Clip Heatsink Assembly Drawing

Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
29

Figure 14. Torsional Cl ip H eatsink Dr awing

Intel® 6321ESB ICH—Mechanical Drawings
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Mechanical Drawings—Intel
®
6321ESB ICH

Figure 15. Heat Sink Foam Gasket Drawing

Februa ry 2007 TMDG
Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications
31

Figure 16.Torsional Clip Drawing

Intel® 6321ESB ICH—Mechanical Drawings
®
631xESB/632xESB I/O Controller Hub for Embedded Applications
Loading...
Buy Points How it Works FAQ Contact Us Questions and Suggestions Privacy Policy Cookie Policy Terms of Use