Intel 631xESB, 632xESB User Manual

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Thermal and Mechanical Design Guidelines

Februa r y 2007

Order Number: 315 263-001

Lega l Li nes and Discl a imers

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHAT SOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELA T ING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the

present e d subject m at ter. The f urnishing o f do c um ent s a nd ot h er ma te ri al s a nd i nfo rm at io n do es n ot provide a n y l ic e n se, ex p res s o r impli ed, by es topp el or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/products/processor_number for details.

The NAME OF PRODUCT may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature may be obtained by calling

1-800-548-4725 or by visiting Intel's website at http://www.intel.com. BunnyPeople, Celeron, Celeron Inside, Centrino, Centrino logo, Core Inside, Dialogic, FlashFile, i960, InstantIP, Intel, Intel logo, Intel386, Intel486,

Intel740, IntelDX2, IntelDX4, IntelSX2, Intel Core, Intel Inside, Intel Inside logo, Intel. Leap ahead., Intel. Leap ahead. logo, Intel NetBurst, Intel NetMerge, Intel NetStructure, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel Viiv, Intel vPro, Intel XScale, IPLink, Itanium, Itanium Inside, MCS, MMX, Oplus, OverDrive, PDCharm, Pentium, Pentium Inside, skoool, Sound Mark, The Journey Inside, VTune, Xeon, and Xeon Inside are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications TMDG February 2007 2

Contents—Intel

6321ESB ICH

1.0 Introduction..............................................................................................................5

1.1 Design Flow........................................................................................................5

1.2 Definition of Terms..............................................................................................7

1.3 Reference Documents.......................................................................................... 7

2.0 Packaging Technology...............................................................................................9

3.0 Thermal Specifications ............................................................................................11

3.1 Thermal Design Power (TDP) ..............................................................................11

3.2 Die Case Temperature .......................................................................................11

4.0 Thermal Simulation .................................................................................................12

5.0 Thermal Solution Requirements...............................................................................13

5.1 Characterizing the Thermal Solution Requirement..................................................13

6.0 Thermal Metrology ..................................................................................................16

6.1 Die Case Temperature Measurements ..................................................................16

6.1.1 Zero Degree Angle Attach Methodology................................................... ..16

7.0 Reference Thermal Solution.....................................................................................19

7.1 Operating Environment ......................................................................................19

7.2 Heatsink Performance........................................................................................19

7.3 Mechanical Design Envelope ...............................................................................20

7.4 Board-Level Components Keepout Dimensions ......................................................21

7.5 Torsional Clip Heatsink Thermal Solution Assembly................................................22

7.5.1 Heatsink Orientation...............................................................................23

7.5.2 Mechanical Interface Material...................................................................24

7.5.3 Thermal Interface Material.......................................................................24

7.5.4 Heatsink Clip.........................................................................................25

7.5.5 Clip Retention Anchors............................................................................25

8.0 Reliability Guidelines...............................................................................................26

A Thermal Solution Component Suppliers...................................................................27

A.1 Torsional Clip Heatsink Thermal Solution..............................................................27

B Mechanical Drawings...............................................................................................28

Figures

1 Thermal Design Process.............................................................................................. 6

2 Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View).................................9

3 Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)................................9

4 Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)..........................10

5 Processor Thermal Characterization Parameter Relationships .........................................14

6 Thermal Solution Decision Flowchart...........................................................................17

7 Zero Degree Angle Attach Heatsink Modifications .........................................................17

8 Zero Degree Angle Attach Methodology (Top View).......................................................18

9 Torsional Clip Heatsink Measured Thermal Performance Versus Approach Velocity and Target

at 65C Local-Ambient ...............................................................................................20

10 Torsional Clip Heatsink Volumetric Envelope for the Intel® 6321ESB I/O Controller Hub .... 21

11 Torsional Clip Heatsink Board Component Keepout .......................................................23

12 Torsional Clip Heatsink Assembly ...............................................................................24

13 Torsional Clip Heatsink Assembly Drawing...................................................................29

14 Torsional Clip Heatsink Drawing.................................................................................30

Februa ry 2007 TMDG

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel® 6321ESB ICH—Revision History

15 Heat Sink Foam Gasket Drawing.................................................................................31

16 Torsional Clip Drawing ..............................................................................................32

Tables

1 Definition of Terms .................................................................................................... 7

2 Referenced Documents............................................................................................... 8

3 Intel® 6321ESB I/O Controller Hub Thermal Specifications ............................................11

4 Required Heat Sink Thermal Performance (YCA)...........................................................15

5 Honeywell PCM45 F TIM Performance as a Function of Attach Pressure ............................25

6 Reliabilit y Guidelines.................................................................................................26

7 Mechanical Drawing List ...................................................................................... ......28

Revision History

Date Revision Description

February 2007 001 Initial public release.

631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel TMDG February 2007 4

Introduction—Intel

6321ESB ICH

1.0 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the Intel® 6321ESB I/O Controller Hub.

• Describe a reference thermal solution that meets the specification of Intel® 6321ESB I/O Controller Hub in Embedded applications.

Properly designed thermal solutions provide adequate cooling to maintain the Intel® 6321ESB I/O Controller Hub component die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel® 6321ESB I/O Controller Hub component die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The sim plest and most cost-effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel® 6321ESB I/O Controller Hub component only. For thermal design information on other chipset components, refer to the respective component datasheet.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided to the system designer. Figure 1 illustrates the design process implicit to this document and the tools appropriate for each step.

Februa ry 2007 TMDG

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Figure 1. Thermal Design Process

Step 1: Thermal Simulation

y Thermal Model y Thermal Model User's Guide

Intel® 6321ESB ICH—Introduction

Step 2: Heatsink Selection

y Thermal Reference y Mechanical Reference

Step 3: Thermal Validation

y Thermal Testing Software y Software User's Guide

631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel TMDG February 2007 6

Introduction—Intel

6321ESB ICH

1.2 Definition of Terms

Table 1. Definiti on of Ter ms

Term Definition

BLT

FCBGA

Intel® 6321ESB I/O Controller Hub

LFM

MCH

Tcase-ma x

Tcase-min

TDP

Bond line thickness. Final settled thickness of the thermal interface material after installation of heatsink.

Flip Chip Ball Grid Array. A ball grid array packaging technology where the die is exposed on the package substrate.

The chipset component that integrates an Ultra ATA 100 controller, six Serial ATA host controller ports, one EHCI host controller supporting eight external USB 2.0 ports, LPC interface controller, flash BIOS interface controller, PCI/PCI-X interface controller, PCI Express interface, BMC controller, Azalia / AC'97 digital controller, integrated LAN controller, an ASF contr oll er an d a ESI fo r comm u nic at ion wit h the MCH.

Linear Feet Per Minute. A measure o f airflow emitted from a forced convection device, such as an axial fan or blower.

Memory controller hub. The chipset component that contains the processor interface, the memory interface, and the South Bridge Interface.

Maxi mum die temperature allowed. This temp erature is measured at the geometric center of the top of the package die.

Minimum die temperature allowed. This temperature is measured at the geometric center of the top of the package die.

Thermal Design Power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can dissipate.

Case-to-ambient thermal characterization parameter. A measure of the thermal solution thermal performance including the TIM using total package power. Defined as (TCASE – TLA) / Total P ack age Power.

Note: Heat source must be specified when using Ψ calculations.

Case-to-Sink thermal characterization parameter. A measure of the thermal interface material performance using total package power. Defined as (TCASE - TSINK)/ Total Package Power.

Note: Heat source must be specified when using Ψ calculations.

Sink-to- Ambient thermal c haracterization parameter. A measure of the heat sink performance using total package power. Defined as (TSINK - TLA)/Total Package Power.

Note: Heat source must be specified when using Ψ calculations.

1.3 Reference Documents

The reader of this specification should also be familiar with material and concepts presented in the following documents:

Februa ry 2007 TMDG

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Table 2. Referenced Documents

Intel® 631xESB / 632xESB I/O Controller Hub Datasheet

Intel® 631xESB / 632xESB I/O Controller Hub Specification Update

Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guide

Intel® 6700PXH 64-bit PCI H ub/6702PX H 64-bi t PCI Hub (PXH/PXHV) Thermal Mechanical Design Guidelines

Intel® 6700PXH 64-bit PCI Hub (PXH) Datasheet

BGA/OLGA Assembly Development Guide Various system thermal design suggestions http://www.formfactors.org

1. Unless otherwise specified, these documents are available through your Intel field sales representative. Some documents may not be available at this time.

Intel® 6321ESB ICH—Introduction

Title Location

http://www.intel.com/design/ chipsets/datashts/313082.htm

http://www.intel.com/design/ chipsets/specupdt/313075.htm

Reference# 31307301

http://www.intel.com/design/ chipsets/designex/302817.htm

http://www.intel.com/design/ chipsets/datashts/302628.htm

631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel TMDG February 2007 8

Packaging Technology—Intel

–

6321ESB ICH

2.0 Packaging Technology

The Intel® 6321ESB I/O Controller Hub component uses a 40 mm x 40 mm, 10-layer FC-BGA3 package (see Figure 2 and Figure 3).

Figure 2. Intel® 6321ESB I/O Controller Hub Package Dimensions (Top View)

Die

Handling

Exclusion

Area

10.78mm.

19.49mm.

6.17mm.

Keepout

Area

20.19mm.

ESB2

Die

30.0mm.26.0mm.13.99mm.

40.0mm

3.10mm.

26.0mm.

30.0mm.

40.0mm.

Figure 3. Intel® 6321ESB I/O Controller Hub Package Dimensions (Side View)

Substrate

.535 ± 0.123 mm

2.100 ± 0.121 mm

Decoup

Cap

0.84 ± 0.05 mm

Die

0.7 mm Max

0.20

See note 4.

0.435 ± 0.025 mm

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to AN SI Y14.5M- 1994

3. BGA has a pr e-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard atta ch; FCBGA ha s a convex (dome shaped) orientation before reflow and is expect ed to have a slightly concave (bowl shaped) orientation after reflow

See note 3

Seating Plane

0.20 –C

See note 1.

Februa ry 2007 TMDG

Intel® 631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel® 6321ESB ICH—Packaging Technology

Figure 4. Intel® 6321ESB I/O Controller Hub Package Dimensions (Bottom View)

A R

A N

A H

A D

A C

19.11

35X 1.092

2822 26242018161412108642 36343230

35X

1.092

11 2523211917151397531 2729 333531

19.11

40 + 0.05

CA0.2

40 + 0.05

- A -

Notes:

1. All dimensions are in millimeters.

2. All dimensions and tolerances conform to ANSI Y14.5M-1994.

3. Package Mechanical Requirements

The Intel® 6321ESB I/O Controller Hub package has an exposed bare die which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT capable of sustaining a dynamic or static compressive load applied to any edge of the bare die. These mechanical load limits must not be exceeded during heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use condition.

Notes:

1. The heatsink attach solutions must not include continuous stress onto the chipset package with the exception of a uniform load to maintain the heatsink-to-package thermal interface.

2. These specifications apply to uniform compressive loading in a direction perpendicular to the bare die/ IHS top surface.

3. These specifications are based on limited testing for design characterization. Loading limits are for the package only.

631xESB/632xESB I/O Controller Hub for Embedded Applications

Intel TMDG February 2007 10

+ 22 hidden pages