Intel 6300ESB User Manual

Intel® 6300ESB I/O Controller Hub

Thermal and Mechanical Design Guide

February 2004

Order Number: 300682-001

Contents

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A P ARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Intel specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling

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6300ESB I/O Controller Hub may contain design defects or errors known as errata which may cause the product to deviate from published

2 Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

Contents

1.0 Introduction....................................................................................................................................5

1.1 Definition of Terms................................................................................................................5

1.2 Reference Documents....... .......... .........................................................................................6

2.0 Packaging Technology .................................................................................................................7

3.0 Thermal Specifications ................................................................................................................. 9

3.1 Case Temperature and Thermal Design Power ................................................................... 9

3.2 Case Temperature Metrology...............................................................................................9

4.0 Referen ce Th erm al So lution....................................................................................................... 11

4.1 Reliability Requirements.....................................................................................................11

A Mechanical Drawings.................................................................................................................. 13

Figures

1Intel® 6300ESB I/O Controller Hub Package Dimensions..........................................................14

Tables

1 D e fi n ition of Terms....... .......... .......................................................................................................5

2 Reference Documents..................................................................................................................6

3Intel

4 Reliability Requirements.............................................................................................................11

6300ESB I/O Controller Hub Thermal Specifications .........................................................9

Revision History

Date Revision Description

February 2004 1.0 Initial release of this document.

Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 3

Contents

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4 Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide

1.0 Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is prope rly dissipated. Heat may be dissipated using improved system cooling and/or attaching passive heatsinks.

The objective of thermal management is to ensure that the tempe r atures of all components in a system are maint ai ned within f u nction al limit s . The func tional te mper ature li mit i s the ra nge withi n which the electric al circuits may be expected to meet specified perfor mance requirements. Operation outs ide the functional limit ma y degrade system performance, caus e logic errors, or cause component and /or s ystem damage. Temperatures exceeding the maximum operatin g limits may result in irreversible changes in the operating chara cteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel Controller Hub (ICH).

The simplest and most cost effective method is to improve the inherent sys tem cooling characteristics through careful design and placement of fans, vents, and ducts. When additional cooling is req uired, component therm al solutions may be implem ented in conjunctio n with system thermal solutions. The size of the fan or heatsink may be varied to balance size and space constraints with acoustic noise.

Introduction

6300ESB I/O

This document pres ents the conditions and requirements to properly design a cooling solution for systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications. This is accompli shed by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case temperatures of th e Int el 6300E SB ICH at or be low thos e recommend ed in thi s documen t, a s ystem designer may ensure the pro per functionality, performance, and reliability of these components.

1.1 Definition of Terms

T able 1. Definition of Terms

Term Definition

BGA

case-nhs

j-max

TDP

LFM

Ball G rid Array. A package type defined by a resin-fiber substrate, onto wh ich a die is mounted, bonded and encapsulated in molding compound. The primary electrical interface is an array of solder balls attached to the substrate opposite the die and molding compound.

The max imum package case temperature w ithout any package thermal solution. Th is temperature is measured at the geometric cent er of the top of the package case .

The max imum component temperature specifica tion measu red at the hottest point in the processor die.

Thermal Design Power. Thermal solutions should be de signed to dissipat e this target power level.

Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such as an axial fan or blower.

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Intel

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