Intel® 6300ESB I/O Controller
Hub
Thermal and Mechanical Design Guide
February 2004
Order Number: 300682-001
Contents
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®
The Intel
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6300ESB I/O Controller Hub may contain design defects or errors known as errata which may cause the product to deviate from published
2 Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
Contents
Contents
1.0 Introduction....................................................................................................................................5
1.1 Definition of Terms................................................................................................................5
1.2 Reference Documents....... .......... .........................................................................................6
2.0 Packaging Technology .................................................................................................................7
3.0 Thermal Specifications ................................................................................................................. 9
3.1 Case Temperature and Thermal Design Power ................................................................... 9
3.2 Case Temperature Metrology...............................................................................................9
4.0 Referen ce Th erm al So lution....................................................................................................... 11
4.1 Reliability Requirements.....................................................................................................11
A Mechanical Drawings.................................................................................................................. 13
Figures
1Intel® 6300ESB I/O Controller Hub Package Dimensions..........................................................14
Tables
1 D e fi n ition of Terms....... .......... .......................................................................................................5
2 Reference Documents..................................................................................................................6
3Intel
4 Reliability Requirements.............................................................................................................11
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6300ESB I/O Controller Hub Thermal Specifications .........................................................9
Revision History
Date Revision Description
February 2004 1.0 Initial release of this document.
Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 3
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4 Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
1.0 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is prope rly dissipated. Heat may be dissipated
using improved system cooling and/or attaching passive heatsinks.
The objective of thermal management is to ensure that the tempe r atures of all components in a
system are maint ai ned within f u nction al limit s . The func tional te mper ature li mit i s the ra nge withi n
which the electric al circuits may be expected to meet specified perfor mance requirements.
Operation outs ide the functional limit ma y degrade system performance, caus e logic errors, or
cause component and /or s ystem damage. Temperatures exceeding the maximum operatin g limits
may result in irreversible changes in the operating chara cteristics of the component. The goal of
this document is to provide an understanding of the operating limits of the Intel
Controller Hub (ICH).
The simplest and most cost effective method is to improve the inherent sys tem cooling
characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is req uired, component therm al solutions may be implem ented in conjunctio n with system
thermal solutions. The size of the fan or heatsink may be varied to balance size and space
constraints with acoustic noise.
Introduction
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6300ESB I/O
This document pres ents the conditions and requirements to properly design a cooling solution for
systems using the Intel 6300ESB ICH. Properly designed solutions should provide adequate
cooling to maintain the Intel 6300ESB ICH case temperatures at or below thermal specifications.
This is accompli shed by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the case
temperatures of th e Int el 6300E SB ICH at or be low thos e recommend ed in thi s documen t, a s ystem
designer may ensure the pro per functionality, performance, and reliability of these components.
1.1 Definition of Terms
T able 1. Definition of Terms
Term Definition
BGA
T
case-nhs
T
j-max
TDP
LFM
Ball G rid Array. A package type defined by a resin-fiber substrate, onto wh ich a die is
mounted, bonded and encapsulated in molding compound. The primary electrical interface is
an array of solder balls attached to the substrate opposite the die and molding compound.
The max imum package case temperature w ithout any package thermal solution. Th is
temperature is measured at the geometric cent er of the top of the package case .
The max imum component temperature specifica tion measu red at the hottest point in the
processor die.
Thermal Design Power. Thermal solutions should be de signed to dissipat e this target power
level.
Linear Feet Per Minute. A measure of airflow emitted from a forced convection device, such
as an axial fan or blower.
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 5
Intel
Introduction
1.2 Reference Documents
Table 2. Reference Documents
Document Document Number / Location
®
Intel
6300ESB I/O Cont roller Hu b Datasheet 300641
Thermal Design Suggestions fo r Var ious Form Factors http://www.formfactors.org
NOTE: Unless otherwise noted, t hese documents are available through your Intel Field Sales representative
6 Intel
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
2.0 Packaging Technology
Packaging Technology
The Intel 6300ESB ICH component is available in a 37.5 mm square package as shown in
Appendix A, “Mechanical Dra wings”. Packa ge inform ation is al so provi ded in th e Intel
I/O Controller Hub Datasheet.
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6300ESB
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 7
Intel
Packaging Technology
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Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
Thermal Specifications
3.0 Thermal Specifications
3.1 Case Temperature and Thermal Design Power
To ensure proper operation and reliability of the Intel 6300ESB ICH component, the case and
junction temperatures must be at or below the val ues specified in Table 3. System and/or
component level thermal solutions are required to maintain the case temperature below the
maximum temperature specification while dissipating the thermal design power (TDP) listed in
Table 3.
Table 3. Intel
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6300ESB I/O Controller Hub Thermal Specifications
Parameter Maximum Notes
T
case-nhs
T
j-max
TDP 3.9 W
NOTES:
1. T
thermal solution attached.
2. T
measured at the hottest point in the processor die.
is defi ned as the maximum package case temperature without a
case-nhs
is defined as the maximum compon ent temperature specification
j-max
105 °C 1
11 5 ° C 2
3.2 Case Temperature Metrology
The component case te mpera tur e should b e mea sured by att aching a t hermocoupl e to the geome tric
center of the packag e case top. Refer to Appendix A, “Mechanic al Dra w ings” for package
dimensions.
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 9
Intel
Thermal Specifications
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Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
4.0 Reference Thermal Solution
Based on a component local operating environment of natural convection (zero LFM of airflow)
with a maximum local-ambient temperature of 55° C, the Intel 6300ESB ICH component does not
require an attached heatsi n k to meet therma l specifications. F o r systems where the loca l-ambient
temperatur e is se vere (greater than 55° C, nat ural convection), a component level thermal solution
or system thermal so lut ion impr ovement may be required . Attac hing a heatsin k to th e package cas e
and/or improving airflow at the component may be potential solutions.
4.1 Reliability Requirements
If an atta ched heatsink is implemented due to a severe component local operating environment, the
reliabi lity requiremen ts in Table 4 are recommended. Each motherboard, heatsink, and attach
combination may vary the mechanical loading of the component. It is recommended that the user
carefully evaluate the reliabili ty of the completed assembly pri or to use in high volume.
Table 4. Reliability Requirements
1
Test
Mechanical Shock 50g, board level, 11 ms ec, 3 shocks/axis Visual check and electrical functi onal test
Random Vibration
Temper ature Life
Thermal Cycling
Humidity 85% relative humidity, 55° C, 1000 hours Visual check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 lots of material.
2. Additional pass/fail criteria may be added at the discretion of the user.
7.3g, board level, 45 min/ axis, 50 Hz to
2000 Hz
85° C, 2000 hours total, checkpoints at
168, 500 , 1000, an d 2000 hour s
-5° C to +70° C, 500 cycles, ° C/min rise
and fal l
Requirement Pass/Fail Criteria
Reference Thermal Solution
2
Visual check and electrical functi onal test
Visual check
Visual check
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 11
Intel
Reference Thermal Solution
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Intel® 6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
Appendix A Mechanical Drawings
Figure 1 shows the package dimensions for the Intel 6300ESB ICH. Unless otherwis e specified,
the unit s in th e f ig u r e ar e in mi llimeter s.
Mechanical Drawings
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide 13
Intel
Mechanical Drawings
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Figure 1. Intel
6300ESB I/O Controller Hub Package Dimensions
14 Intel
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6300ESB I/O Controller Hub Thermal and Mechanical Design Guide
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