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BCR139F
Schematic [ru]
12 pgs214.27 Kb0

Infineon BCR139F, BCR139L3, BCR139T Schematic [ru]

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NPN Silicon Digital Transistor
g
g
• Switching circuit, inverter, interface circuit,
driver circuit
BCR139...
• Built in bias resistor (R
1
BCR139F/L3 BCR139T
C
3
R
1
12
BE
EHA07264
Type Markin
BCR139F
WYs
1=B
Pin Configuration Package
2=E
3=C
-
-
-
TSFP-3
BCR139L3
BCR139T
WY
WY
1=B
1=B
2=E
2=E
Maximum Ratings
Parameter
Symbol Value Unit
Collector-emitter voltage V
Collector-base voltage V
Input forward voltage V
Input reverse voltage V
Collector current I
Total power dissipation-
BCR139F, T
BCR139L3, T
BCR139T, T
≤ 128°C
S
≤ 135°C
S
≤ 109°C
S
P
Junction temperature T
Storage temperature T
3=C
3=C
CEO
CBO
i(fwd)
i(rev)
C
tot
j
st
-
-
-
-
-
-
TSLP-3-4
SC75
50 V
50
60
5
100 mA
mW
250
250
250
150 °C
-65 ... 150
1
2006-06-01
Thermal Resistance Parameter
BCR139...
Symbol Value Unit
Junction - soldering point1)
BCR139F
BCR139L3
BCR139T
Electrical Characteristics at T
= 25°C, unless otherwise specified
Parameter
DC Characteristics
Collector-emitter breakdown voltage
I
= 100 µA, IB = 0
C
Collector-base breakdown voltage
I
= 10 µA, IE = 0
C
Collector-base cutoff current
V
= 40 V, IE = 0
CB
Emitter-base cutoff current
V
= 5 V, IC = 0
EB
DC current gain2)
I
= 5 mA, VCE = 5 V
C
R
thJS
K/W
≤ 90
≤ 60
≤ 165
Symbol Values Unit
min. typ. max.
V
(BR)CEO
V
(BR)CBO
I
CBO
I
EBO
h
FE
50 - -
50 - -
- - 100 nA
- - 100 nA
120 - 630 -
V
Collector-emitter saturation voltage2)
I
= 10 mA, IB = 0.5 mA
C
Input off voltage
I
= 100 µA, VCE = 5 V
C
Input on voltage
I
= 2 mA, VCE = 0.3 V
C
V
V
V
Input resistor R
AC Characteristics
Transition frequency
= 10 mA, VCE = 5 V, f = 100 MHz
I
C
Collector-base capacitance
= 10 V, f = 1 MHz
V
CB
1
For calculation of
2
Pulse test: t < 300µs; D < 2%
R
please refer to Application Note Thermal Resistance
thJA
f
C
CEsat
i(off)
i(on)
1
T
cb
- - 0.3 V
0.4 - 0.8
0.5 - 1.1
15 22 29 kΩ
- 150 - MHz
- 3 - pF
2
2006-06-01
BCR139...
DC current gain h
= 5V (common emitter configuration)
V
CE
3
10
FE
h
2
10
1
10
-4
10
FE
10
= ƒ(I
-3
)
C
-2
10
Collector-emitter saturation voltage
CEsat
10
A
10
C
I
10
10
= ƒ(I
-1
-2
-3
-4
V
A
I
-1
10
C
), hFE = 20
C
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
V
V
CEsat
1
Input on Voltage Vi
= 0.3V (common emitter configuration)
V
CE
-1
10
A
-2
10
C
I
-3
10
-4
10
-1
10
10
(on)
0
= ƒ(IC)
10
1
Input off voltage V
= 5V (common emitter configuration)
V
CE
-2
10
A
-3
10
C
I
-4
10
-5
10
-6
10
0 0.5 1 1.5 2
i(on)
10
2
V
V
i(off)
= ƒ(I
)
C
V
V
3
i(off)
3
2006-06-01
BCR139...
Total power dissipation P
BCR139F
300
mW
250
225
200
tot
P
175
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
= ƒ(T
tot
)
S
Total power dissipation P
= ƒ(T
tot
)
S
BCR139L3
300
mW
250
225
200
tot
P
175
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
°C
150
T
S
T
°C
150
S
Total power dissipation P
BCR139T
300
mW
250
225
200
tot
P
175
150
125
100
75
50
25
0
0 15 30 45 60 75 90 105 120
= ƒ(T
tot
)
S
°C
150
T
S
4
2006-06-01
BCR139...
Permissible Puls Load R
BCR139F
2
10
K/W
1
10
thJS
R
0
10
-1
10
10
-6
10
-5
10
-4
10
thJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005 0
-3
= ƒ (t
-2
10
)
p
Permissible Pulse Load
P
totmax/PtotDC
= ƒ(t
)
p
BCR139F
3
10
totDC
/P
2
10
totmax
P
1
10
0
10
s
t
0
10
p
10
-6
10
-5
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
-3
10
-2
s
t
0
10
p
Permissible Puls Load R
BCR139L3
2
10
1
10
thJS
R
0
10
-1
10
-7
-6
-5
10
10
10
10
-4
thJS
10
= ƒ (t
0.5
0.2
0.1
0.05
0.02
0.01
0.005 D = 0
-3
10
)
p
Permissible Pulse Load
P
totmax/PtotDC
= ƒ(t
)
p
BCR139L3
3
10
totDC
/ P
2
10
totmax
P
1
10
0
-2
s
t
0
10
p
10
10
-7
-6
10
-5
10
10
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
-3
10
10
-2
t
0
s
10
p
5
2006-06-01
BCR139...
Permissible Puls Load R
BCR139T
3
10
K/W
2
10
thJS
R
1
10
D=0.5
0.2
0.1
0.05
10
0.02
0.01
0.005 0
-4
10
10
10
-1
0
10
-6
10
-5
thJS
-3
= ƒ (t
-2
10
)
p
Permissible Pulse Load
P
totmax/PtotDC
= ƒ(t
)
p
BCR139T
3
10
totDC
/ P
10
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
-4
10
-3
10
-2
s
t
0
10
p
2
10
totmax
P
1
10
0
s
t
0
10
p
10
10
-6
10
-5
6
2006-06-01
Package Outline
Foot Print
Package SC75
±0.2
1.6
+0.1
0.2
-0.05
A
0.2
0.10
+0.1
-0.05
0.5
M
3
1 2
0.5
0.4
0.1 MAX.
±0.2
1.6
MAX.
10˚
0.20MA
0.7
0.15
±0.1
±0.1
±0.1
0.8
MAX.
10˚
BCR139...
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
Pin 1
4
0.65
0.65
0.45
1.15
0.4
0.50.5
2005, December
Date code
BCR108T
Type code
0.2 MAX.
Pin 1
1.75
1.4
7
8
1.8
0.9
2006-06-01
BCR139...
Date Code marking for discrete packages with one digit (SCD80, SC79, SC75
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSd s DSdsDS
05et ETe t ETe t ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08h xHXh x HXh x HX
09jyJYjyJYjyJY
10k zKZkzKZk z KZ
11l 2L4 l 2L4 l 2L4
12n3N5n3N5n3N5
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
8
2006-06-01
Package Outline
Foot Print
Package TSFP-3
±0.05
1.2
±0.05
0.2
3
±0.05
±0.05
1.2
12
0.4
0.2
0.4
±0.05
±0.05
±0.05
0.4
0.2
0.55
±0.04
0.15
BCR139...
±0.05
0.8
10˚ MAX.
±0.05
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel
Pin 1
0.45
1.05
0.4 0.4
Manufacturer
BCR847BF
Type code
Pin 1
4
1.35
0.3
1.2
1.5
9
0.2
8
0.7
2006-06-01
Package Outline
Package TSLP-3-4
BCR139...
Top view
+0.1
0.4
0.05 MAX.
1
3
2
Pin 1 marking
±0.035
0.5
0.35
2x0.15
Bottom view
0.6
1)
3
±0.05
2
0.575
±0.05
±0.035
±0.05
1)
1
1)
±0.035
0.25
1) Dimension applies to plated terminal
2x
Foot Print
For board assembly information please refer to Infineon website "Packages"
1
0.225
0.15
0.6
0.225
0.45
0.35
R0.19
0.2
0.2
0.17
0.5
0.38
0.255
0.95
R0.1
0.2
1)
±0.035
0.4
0.315
±0.05
1
Marking Layout
Standard Packing
Reel ø180 mm = 15.000 Pieces/Reel
Stencil aperturesCopper Solder mask
BCR133L3
Type code
Pin 1 marking
Laser marking
4
1.16
8
0.5
Pin 1 marking
0.76
10
2006-06-01
BCR139...
Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2006. All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
11
2006-06-01
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