INFICON MDC-360 User Manual

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OPERATION AND SERVICE MANUAL

MODEL MDC-360

MAXTEK FILM DEPOSITION CONTROLLER

P/N 179800

S/N _____________

MAXTEK, INC.

http://www.maxtekinc.com

5980 Lakeshore Drive, Cypress, CA 90630-3371

Tel: (714) 828-4200 • Fax: (714) 828-4443

Email: sales@maxtekinc.com • support@maxtekinc.com

© 1995-2002 MAXTEK, INC. All rights reserved. First Edition, March 1995 Second Edition, Revision A, March 1996 Revision B, June 1996 Revision C, December 1996 Revision D, February 1997 Revision E, January 1998 Revision F, March 1998 Revision G, May 1998

Revision H, January 1999 Revision I, November 1999 Revision J, February 2000 Revision K, August 2000 Revision L, October 2002 Revision M, November 2002 Revision N, June 2005

WARRANTY

Maxtek, Inc. warrants the product to be free of functional defects in material and workmanship and that it will perform in accordance with its published specification for a period of (twenty-four) 24 months.

The foregoing warranty is subject to the condition that the product be properly operated in accordance with instructions provided by Maxtek, Inc. or has not been subjected to improper installation or abuse, misuse, negligence, accident, corrosion, or damage during shipment.

Purchaser's sole and exclusive remedy under the above warranty is limited to, at Maxtek's option, repair or replacement of defective equipment or return to purchaser of the original purchase price. Transportation charges must be prepaid and upon examination by Maxtek the equipment must be found not to comply with the above warranty. In the event that Maxtek elects to refund the purchase price, the equipment shall be the property of Maxtek.

This warranty is in lieu of all other warranties, expressed or implied and constitutes fulfillment of all of Maxtek's liabilities to the purchaser. Maxtek does not warrant that the product can be used for any particular purpose other than that covered by the applicable specifications. Maxtek assumes no liability in any event, for consequential damages, for anticipated or lost profits, incidental damage of loss of time or other losses incurred by the purchaser or third party in connection with products covered by this warranty or otherwise.

DISCLOSURE

The disclosure of this information is to assist owners of Maxtek equipment to properly operate and maintain their equipment, and does not constitute the release of rights thereof. Reproduction of this information and equipment described herein is prohibited without prior written consent from Maxtek, Inc., 5980 Lakeshore Drive, Cypress, California, 90630-3371.

SAFETY

All standard safety procedures associated with the safe handling of

electrical equipment must be observed. Always disconnect power when

working inside the controller. Only properly trained personnel should

attempt to service the instrument.

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Table of Contents

1. GENERAL DESCRIPTION.............................................................................................1-1

1.1 PURPOSE....................................................................................................................... 1-1

1.2 FEATURES .................................................................................................................... 1-1

1.2.1 EXTENSIVE PROGRAM STORAGE ......................................................................... 1-1

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE.......................................................... 1-1

1.2.3 SUPERIOR GRAPHICS DISPLAY ............................................................................ 1-1

1.2.4 PROGRAM SECURITY.............................................................................................. 1-1

1.2.5 DESIGNED FOR UNATTENDED OPERATION......................................................1-1

1.2.6 FAIL SAFE ABORTS..................................................................................................1-1

1.2.7 ABOR T STATUS RETENTION .................................................................................. 1-2

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE.........................................................1-2

1.2.9 POWER FU L SYSTEM INTERFACE.......................................................................... 1-2

1.2.10 POWER SUPPLY NOISE TOLERANCE............................................................... 1-2

1.2.11 INTERNATIONAL STANDARD POWER CONNECTOR ..................................... 1-2

1.2.12 FIEL D UPGRADABLE.........................................................................................1-2

1.3 SPECIFICATIONS......................................................................................................... 1-3

1.3.1 MEASUREMENT.......................................................................................................1-3

1.3.2 DISPLAY....................................................................................................................1-3

1.3.3 COMMUNICATION...................................................................................................1-3

1.3.4 PROGRAM STORAGE CAPACITY ........................................................................... 1-3

1.3.5 PROCESS PARAMETERS ......................................................................................... 1-3

1.3.6 MATER IAL P ARAMETERS ....................................................................................... 1-3

1.3.7 INPUT/OUTPUT CAPABILITY................................................................................. 1-5

1.3.8 SENSOR PARAMETERS............................................................................................ 1-5

1.3.9 SOURCE PARAMETERS...........................................................................................1-5

1.3.10 RECOR DER P ARAMETERS.................................................................................1-6

1.3.11 UTILITY SETUP PARAMETER............................................................................ 1-6

1.3.12 OTHER.................................................................................................................. 1-6

1.4 ACCESSORIES..............................................................................................................1-6

2. FRONT PANEL DISPLAYS AND CONTROLS........................................................... 2-1

2.1 OPERATING DISPLAYS.............................................................................................. 2-1

2.1.1 RATE..........................................................................................................................2-1

2.1.2 POWER...................................................................................................................... 2-1

2.1.3 THICKNESS............................................................................................................... 2-1

2.1.4 LAYER NUMBER ....................................................................................................... 2-1

2.1.5 CRYST AL HEALTH %...............................................................................................2-1

2.1.6 TIME TO GO..............................................................................................................2-2

2.2 PARAMETER/STATUS DISPLAYS............................................................................2-2

2.3 OPERATING CONTROLS............................................................................................2-2

2.3.1 MANUAL KEY ........................................................................................................... 2-2

2.3.2 START KEY................................................................................................................ 2-3

2.3.3 ABORT KEY............................................................................................................... 2-3

2.3.4 RESET KEY................................................................................................................2-3

2.3.5 ZERO KEY.................................................................................................................2-3

2.3.6 SHUTTER KEY .......................................................................................................... 2-3

2.3.7 STATUS KEY.............................................................................................................. 2-3

2.3.8 ARROW KEYS............................................................................................................2-4

2.3.9 PROGRAM KEY......................................................................................................... 2-4

2.3.10 ALPHANUMERIC KEYBOARD............................................................................2-5

3. BENCH CHECKOUT & INSPECTION......................................................................... 3-1

3.1 INSPECTION.................................................................................................................3-1

3.2 INITIAL POWER UP..................................................................................................... 3-1

3.3

SAMPLE PROGRAM.................................................................................................... 3-1

3.3.1 MATER IAL #1 PARAMETERS.................................................................................. 3-2

3.3.2 MATER IAL #2 PARAMETERS.................................................................................. 3-3

3.3.3 PROCESS PARAMETERS......................................................................................... 3-4

3.4 SIMULATE OPERATION............................................................................................. 3-4

3.5 MANUAL OPERATION............................................................................................... 3-4

3.6 INSTALLING OPTION BOARDS................................................................................ 3-4

3.6.1 SOURCE-SENSOR BOARD ...................................................................................... 3-5

3.6.2 DISCRETE I/O BOARD............................................................................................. 3-5

3.6.3 IEEE -488 OPTION BOARD...................................................................................... 3-5

3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT..................................... 3-5

4. PROGRAMMING AND CONTROLLER SETUP........................................................ 4-1

4.1 GENERAL...................................................................................................................... 4-1

4.1.1 NAVIGATING THE MENU STRUCTURE ................................................................ 4-1

4.1.2 ENTERING ALPHA CHARACTERS.......................................................................... 4-2

4.1.3 ENTERING TIME PARAMETERS............................................................................. 4-2

4.1.4 COPYING AND DELETING ..................................................................................... 4-2

4.1.5 PASSWORD PROTECTION...................................................................................... 4-2

4.1.5.1 VIEW/RUN PROCESS PASSWORD ...........................................................................4-3

4.1.5.2 EDIT PROCESS PASSWORD...................................................................................... 4-3

4.1.5.3 EDIT MATERIAL PASSWORD...................................................................................4-3

4.1.6 ADJUSTING PARAMETER/STATUS DISPLAY CONTRAST................................... 4-3

4.2 GETTING STARTED.................................................................................................... 4-4

4.2.1 UTI LI TY SET UP........................................................................................................ 4-4

4.2.2 DAC SET UP.............................................................................................................. 4-4

4.2.3 SOURCE SETUP....................................................................................................... 4-4

4.2.4 SENSOR SETUP........................................................................................................ 4-7

4.2.4.1 EXAMPLE USING MAXTEK’S RSH-600 SIX CRYSTAL SENSOR HEAD ............4-9

4.2.5 INPUT , OU TPUT AND ACTION SETUP.................................................................. 4-9

4.2.6 DI SPL AY SETUP......................................................................................................4-10

4.2.7 MATER IAL SETUP...................................................................................................4-10

4.2.7.1 POWER RAMPS..........................................................................................................4-11

4.2.7.2 AUTOMATIC CRYSTAL SWITCHING.................................................................... 4-12

4.2.7.3 RATE ESTABLISH..................................................................................................... 4-12

4.2.7.4 RATE RAMPS.............................................................................................................4-12

4.2.7.5 RATE SAMPLE MODE.............................................................................................. 4-12

4.2.7.6 RATE DEVIATION ALARM......................................................................................4-12

4.2.8 PROCESS SETUP.....................................................................................................4-13

4.2.9 STARTING A NEW PROCESS..................................................................................4-13

4.2.10 RESUMING A PROCESS FROM ABORT OR HALT..........................................4-13

4.3 DETAILED PROGRAMMING....................................................................................4-13

4.3.1 VIEW/EDIT PROCESS.............................................................................................4-13

4.3.1.1 DEFINE A PROCESS.................................................................................................. 4-14

4.3.2 VIEW/EDIT MATERIAL...........................................................................................4-16

4.3.2.1 DEFINE A MATERIAL...............................................................................................4-16

4.3.3 SYSTEM SETUP.......................................................................................................4-23

4.3.3.1 EDIT DISPLAY SETUP.............................................................................................. 4-23

4.3.3.2 PROGRAM INPUTS...................................................................................................4-24

4.3.3.3 PROGRAM OUTPUTS................................................................................................4-26

4.3.3.4 PROGRAM ACTIONS................................................................................................4-31

4.3.3.5 EDIT SENSOR SETUP................................................................................................4-33

4.3.3.6 EDIT SOURCE SETUP...............................................................................................4-36

4.3.3.7 EDIT DAC SETUP...................................................................................................... 4-39

4.3.3.8 EDIT UTILITY SETUP...............................................................................................4-39

5. OPERATING THE MDC-360.......................................................................................... 5-1

5.1 SIGN-ON SCREEN........................................................................................................ 5-1

5.2 STARTING A NEW PROCESS .................................................................................... 5-1

5.3 STARTING A NEW LAYER........................................................................................ 5-2

5.4

RESUMING AN ABORTED OR HALTED PROCESS................................................5-2

5.5 STATUS DISPLAYS ..................................................................................................... 5-3

5.6 VIEWING RESULTS..................................................................................................... 5-4

5.7 MODES .......................................................................................................................... 5-7

5.7.1 PROCESS READY......................................................................................................5-7

5.7.2 ABORT ....................................................................................................................... 5-7

5.7.3 HALT (SOFT ABORT) ............................................................................................... 5-7

5.7.4 IN PROCESS..............................................................................................................5-7

5.7.5 NOT SAMP LI NG........................................................................................................5-7

5.7.6 PROCESS COMPLETE ............................................................................................. 5-7

5.7.7 MANUAL....................................................................................................................5-8

5.7.8 SIMULATE.................................................................................................................5-8

5.8 STATES..........................................................................................................................5-8

5.9 TROUBLE, ERROR AND WARNING MESSAGES ................................................... 5-8

5.9.1 DESCRIPTION .......................................................................................................... 5-9

5.9.1.1 MIN RATE&MAX POWER.......................................................................................... 5-9

5.9.1.2 MAX RATE&MIN POWER.......................................................................................... 5-9

5.9.1.3 SYSTEM SETUP MEMORY CORRUPTED................................................................ 5-9

5.9.1.4 PROCESS MEMORY CORRUPTED........................................................................... 5-9

5.9.1.5 MATERIAL MEMORY CORRUPTED...................................................................... 5-10

5.9.1.6 RATE EST. ERROR.................................................................................................... 5-10

5.9.1.7 CRYSTAL FAILURE.................................................................................................. 5-10

5.9.1.8 SOURCE FAULT........................................................................................................ 5-10

5.9.1.9 SENSOR FAULT......................................................................................................... 5-10

5.9.1.10 TIME POWER............................................................................................................. 5-10

5.9.1.11 RATE DEV. ALARM.................................................................................................. 5-10

5.9.1.12 ALARM ACTION ....................................................................................................... 5-10

5.9.1.13 CRYSTAL MARGINAL ............................................................................................. 5-10

5.9.1.14 RATE DEV. ALERT ................................................................................................... 5-11

5.9.1.15 MAX POWER ALERT................................................................................................ 5-11

5.9.1.16 MIN POWER ALERT................................................................................................. 5-11

5.9.1.17 ALERT ACTION......................................................................................................... 5-11

5.9.1.18 XTAL FAIL SWITCH................................................................................................. 5-11

5.9.1.19 XTAL MRGN SWITCH.............................................................................................. 5-11

5.9.1.20 RATE DEV. ATTEN................................................................................................... 5-11

5.9.1.21 MAXIMUM POWER.................................................................................................. 5-11

5.9.1.22 MINIMUM POWER.................................................................................................... 5-11

5.9.1.23 CHANGE POCKET... .................................................................................................. 5-11

5.9.1.24 CHANGE CRYSTAL.................................................................................................. 5-12

5.9.1.25 ATTENTION ACTION............................................................................................... 5-12

6. TUNING THE MDC-360 CONTROL LOOP................................................................. 6-1

6.1 CONTROL LOOP BASICS...................................................................................................6-1

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION....................................................... 6-2

6.3 ESTABLISHING MDC-360 CONTROL LOOP PARAMETERS................................................ 6-3

7. INPUT/OUTPUT CHARACTERISTICS........................................................................7-1

7.1 SOURCE CONTROL VOLTAGE OUTPUT.................................................................7-1

7.2 SENSOR INPUT ............................................................................................................ 7-1

7.3 DISCRETE OUTPUTS...................................................................................................7-1

7.4 DISCRETE INPUTS.......................................................................................................7-1

7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS.................................................... 7-2

7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS.................................... 7-2

8. CONTROLLER INSTALLATION ................................................................................. 8-1

8.1 MOUNTING................................................................................................................... 8-1

8.2 PROPER GROUNDING................................................................................................8-1

8.3 EXTERNAL CONNECTIONS ...................................................................................... 8-1

8.3.1 POWER...................................................................................................................... 8-1

8.3.2

VOLTAGE SELECTION............................................................................................ 8-1

8.3.3 GROUND LUG.......................................................................................................... 8-2

8.3.4 REMOTE POWER HANDSET................................................................................... 8-2

8.3.5 SOURCE-SENSOR .................................................................................................... 8-2

8.3.6 RS-232 COMMUNICATION...................................................................................... 8-2

8.3.7 DISCRETE INPUT/OUTPUT.................................................................................... 8-3

8.3.8 DIGITAL-TO-ANALOG CONVERTER (DAC).......................................................... 8-3

9. SYSTEM INSTALLATION............................................................................................. 9-1

9.1 SENSOR HEAD DESCRIPTION.................................................................................. 9-1

9.2 SENSOR HEAD INSTALLATION............................................................................... 9-1

9.3 SENSOR OSCILLATOR............................................................................................... 9-2

9.3.1 INSTALLATION ......................................................................................................... 9-2

9.4 INSTRUMENTATION FEEDTHROUGH.................................................................... 9-2

9.5 SENSOR CRYSTAL REPLACEMENT........................................................................ 9-2

9.6 TYPICAL SYSTEM INSTALLATION......................................................................... 9-3

10. THEORY OF OPERATION......................................................................................10-1

10.1 BASIC MEASUREMENT ............................................................................................10-1

10.2 FILM THICKNESS CALCULATION..........................................................................10-1

10.3 CRYSTAL HEALTH CALCULATION.......................................................................10-3

10.4 RATE CALCULATION................................................................................................10-4

10.5 RATE CONTROL.........................................................................................................10-4

10.6 EMPIRICAL CALIBRATION......................................................................................10-4

10.6.1 FILM DENSITY....................................................................................................10-4

10.6.2 TOOLING FACTOR.............................................................................................10-5

10.6.3 ACOUSTIC IMPEDANCE...................................................................................10-5

11. COMPUTER INTERFACE........................................................................................11-1

11.1 GENERAL.....................................................................................................................11-1

11.2 RS-232 SERIAL INTERFACE .....................................................................................11-1

11.3 RS-485 SERIAL INTERFACE .....................................................................................11-1

11.4 IEEE-488 PARALLEL INTERFACE...........................................................................11-2

11.5 PROTOCOL..................................................................................................................11-2

11.6 DATA TYPES...............................................................................................................11-3

11.7 MESSAGE RECEIVED STATUS................................................................................11-3

11.8 INSTRUCTION SUMMARY.......................................................................................11-4

11.9 INSTRUCTION DESCRIPTIONS................................................................................11-5

12. REPAIR AND MAINTENANCE...............................................................................12-1

12.1 HANDLING PRECAUTIONS......................................................................................12-1

12.2 MAINTENANCE PHILOSOPHY................................................................................12-1

12.3 TROUBLE SHOOTING AIDS.....................................................................................12-2

12.4 RETURNING THE MDC-360 TO THE FACTORY....................................................12-3

13. APPENDIX A...............................................................................................................13-1

14. APPENDIX B – PARAMETER TEMPLATES........................................................14-2

14.1 MATERIAL...................................................................................................................14-3

14.2 PROCESS......................................................................................................................14-5

14.3 DISPLAY SETUP.........................................................................................................14-6

14.4 INPUTS .........................................................................................................................14-7

14.5 OUTPUTS .....................................................................................................................14-8

14.6 ACTIONS......................................................................................................................14-9

14.7 SENSOR SETUP.........................................................................................................14-10

14.8 SOURCE SETUP ........................................................................................................14-10

14.9 DAC SETUP................................................................................................................14-11

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14.10

UTILITY SETUP........................................................................................................14-11

viii

Table of Figures

FIGURE 2-1 OPERATING DISPLAY........................................................................................ 2-1

FIGURE 2-2 PARAMETER/STATUS DISPLAY...................................................................... 2-2

FIGURE 2-3 PROGRAMMING SECTION................................................................................ 2-4

FIGURE 2-4 ARROW KEYS...................................................................................................... 2-4

FIGURE 2-5 ALPHANUMERIC KEYBOARD......................................................................... 2-5

FIGURE 3-1 REMOTE POWER HANDSET............................................................................. 3-7

FIGURE 4-1 THE MAIN MENU................................................................................................ 4-1

FIGURE 4-2 SELECT PROCESS SCREEN..............................................................................4-14

FIGURE 4-3 DEFINE PROCESS SCREEN..............................................................................4-14

FIGURE 4-4 SELECT LAYER MATERIAL SCREEN.............................................................4-16

FIGURE 4-5 SELECT MATERIAL SCREEN............................................................................4-16

FIGURE 4-6 DEFINE MATERIAL SCREEN............................................................................4-17

FIGURE 4-7 SYSTEM SETUP MENU SCREEN.....................................................................4-23

FIGURE 4-8 DISPLAY SETUP SCREEN.................................................................................4-23

FIGURE 4-9 SELECT OUTPUT SCREEN ...............................................................................4-27

FIGURE 4-10 PROGRAM OUTPUT SCREEN ........................................................................4-27

FIGURE 4-11 SENSOR SETUP SCREEN................................................................................4-33

FIGURE 4-12 SOURCE SETUP SCREEN................................................................................4-36

FIGURE 4-13 DAC SETUP SCREEN.......................................................................................4-39

FIGURE 4-14 UTILITY SETUP SCREEN................................................................................4-39

FIGURE 5-1 SIGN-ON SCREEN............................................................................................... 5-1

FIGURE 5-2 RUN PROCESS SELECTION SCREEN .............................................................. 5-2

FIGURE 5-3 RATE VS. TIME GRAPH..................................................................................... 5-3

FIGURE 5-4 RATE DEVIATION VS. TIME GRAPH .............................................................. 5-3

FIGURE 5-5 THICKNESS VS. TIME GRAPH.......................................................................... 5-3

FIGURE 5-6 POWER VS. TIME GRAPH.................................................................................. 5-4

FIGURE 5-7 SOURCE/SENSOR STATUS SCREEN................................................................ 5-4

FIGURE 5-8 I/O STATUS SCREEN.......................................................................................... 5-4

FIGURE 5-9 VIEW RESULTS SCREEN................................................................................... 5-6

FIGURE 5-10 RATE VS. TIME PROCESS LOG GRAPH........................................................ 5-6

FIGURE 5-11 TYPICAL PROCESS PROFILE.........................................................................5-13

FIGURE 7-1 PASSIVE INPUT BUFFER CIRCUIT.................................................................. 7-3

FIGURE 7-2 ACTIVE INPUT BUFFER CIRCUIT..................................................................... 7-4

FIGURE 7-3 DAC OUTPUT CIRCUIT...................................................................................... 7-5

FIGURE 7-4 SENSOR INPUT BUFFER CIRCUIT.................................................................. 7-6

FIGURE 7-5 SOURCE OUTPUT DRIVER CIRCUIT............................................................... 7-7

FIGURE 8-1 MDC-360 FRONT PANEL.................................................................................... 8-4

FIGURE 8-2 MDC-360 REAR PANEL...................................................................................... 8-5

FIGURE 8-3 DAC SOCKET CONNECTOR PIN OUT............................................................. 8-6

FIGURE 8-4 SOURCE SOCKET CONNECTOR PIN OUT...................................................... 8-6

FIGURE 8-5 D9S DTE REAR-PANEL RS-232 SOCKET CONNECTOR................................ 8-7

FIGURE 8-6 D37P DISCRETE I/O PLUG CONNECTOR......................................................... 8-8

FIGURE 8-7 RJ11 FRONT PANEL RS-232 CONNECTOR ..................................................... 8-9

FIGURE 8-8 FRONT PANEL MANUAL POWER CONNECTOR.......................................... 8-9

FIGURE 8-9 MDC-360 TOP VIEW (COVER REMOVED).....................................................8-10

FIGURE 9-1 SENSOR OSCILLATOR SCHEMATIC............................................................... 9-4

FIGURE 9-2 SENSOR OSCILLATOR OUTLINE..................................................................... 9-5

FIGURE 9-3 IF-111 INSTRUMENTATION FEEDTHROUGH OUTLINE.............................. 9-6

FIGURE 9-4 SH-102 SENSOR HEAD OUTLINE..................................................................... 9-7

FIGURE 9-5 TYPICAL SYSTEM INSTALLATION................................................................. 9-8

FIGURE 13-1 PLUG PIN OUT - SOURCE CABLE CONNECTOR.........................................13-1

FIGURE 13-2 PLUG PIN OUT - DAC CABLE CONNECTOR................................................13-2

FIGURE 15-1 MENU MAP ........................................................................................................15-1

List of Tables

TABLE 5-1 TROUBLE CONDITIONS AND WARNINGS......................................................5-9

TABLE 8-1 DAC SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS....................8-6

TABLE 8-2 SOURCE CONTROL SYSTEM INTERFACE CONNECTOR PIN

ASSIGNMENTS ................................................................................................................. 8-6

TABLE 8-3 D9 REAR PANEL RS-232/RS-485 CONNECTOR PIN ASSIGNMENTS............ 8-7

TABLE 8-4 DISCRETE I/O SYSTEM INTERFACE CONNECTOR PIN ASSIGNMENTS....8-8

TABLE 8-5 RJ11 FRONT PANEL RS-232 CONNECTOR PIN ASSIGNMENTS................... 8-9

TABLE 8-6 FRONT PANEL MANUAL POWER CONNECTOR PIN ASSIGNMENTS........ 8-9

TABLE 10-1 MATERIAL DENSITY AND ACOUSTIC IMPEDANCE VALUE...................10-6

TABLE 13-1 SOURCE CONTROL CABLE COLOR CODE - (4 PIN MINI DIN)...............13-1

TABLE 13-2 DAC CABLE COLOR CODE - (7 PIN MINI DIN).........................................13-2

MDC-360 DEPOSITION CONTROLLER

1. GENERAL DESCRIPTION

1.1 PURPOSE

The MDC-360 provides both automatic control of single or multi-layer film deposition in either a production or development environment and improved predictability and repeatability of deposited film characteristics through dependable digital control of the deposition process. It runs unattended in the fully automatic mode and provides such features as run completion in the event of crystal failure, and extensive internal checking. Performance limits and the abort feature can be set by the user.

1.2 FEATURES

The MDC-360 incorporates numerous features which are economically justifiable as a result of rapid advances in semiconductor technology and the advent of low cost microprocessors.

1.2.1 EXTENSIVE PROGRAM STORAGE

The MDC-360 is capable of storing up to 99 processes, 999 layer definitions and 32 complete material definitions. Once a program is entered it will be maintained in memory for a minimum of 5 years without external power.

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE

Measurement is dynamically adjusted from 0.5 to 10 Hz for optimum resolution and control.

1.2.3 SUPERIOR GRAPHICS DISPLAY

The MDC-360 features a 256x64 pixel LCD graphics display allowing real time graphing of important process information such as rate, rate deviation, thickness and power.

1.2.4 PROGRAM SECURITY

To assure the integrity of stored programs, the MDC-360 incorporates edit passwords to guard against unauthorized program changes.

1.2.5 DESIGNED FOR UNATTENDED OPERATION

The MDC-360 has been designed for truly automatic operation and toward this end incorporates extensive internal monitoring and overriding abort circuitry to minimize the possibility of damage in the event of a failure or other problem in the total deposition system. In addition there are attention, alert and alarm signals with adjustable volume for trouble and routine operator call.

1.2.6 FAIL SAFE ABORTS

In the event of an MDC-360 failure, as evidenced by unsatisfactory internal checks, the MDC-360 will abort the process and shut off all outputs. In addition to the internal checks, the MDC-360 also provides user enabled aborts on excessive rate control error or crystal failure.

GENERAL DESCRIPTION 1-1

MDC-360 DEPOSITION CONTROLLER

1.2.7 ABORT STATUS RETENTION

In the event that the MDC-360 does abort during the deposition process, pertinent information is stored at the time of abort. The process can be resumed after the problem is corrected.

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE

The extensive monitoring and abort functions are designed to protect the system and/or process from serious and hopefully infrequent malfunctions of the deposition system. A condition which need not cause an abort is the condition of crystal failure. The MDC-360 can be set to abort upon crystal failure, or run to completion using a backup crystal or time/power method.

1.2.9 POWERFUL SYSTEM INTERFACE

Fully programmable discrete inputs and outputs permit the MDC-360 to be easily interfaced into deposition systems controlling the most complex processes. Also, source control outputs are fully isolated avoiding ground loop problems. The MDC-360 also supports input from an optical monitor for optical termination of film thickness.

1.2.10 POWER SUPPLY NOISE TOLERANCE

Integral RFI filter and large energy storage capacitors will tolerate high levels of power supply noise and power interruptions of 700 ms or less without effect.

1.2.11 INTERNATIONAL STANDARD POWER CONNECTOR

The power connector is internationally approved and meets IEC (International Electrotechnical Commission) standards. It allows selection of input power voltages ranging from 100 to 240 volts at a frequency of 50 or 60 Hz and includes an integral RFI filter.

1.2.12 FIELD UPGRADABLE

Plug-in interface boards and option boards allow the basic unit to be upgraded in the field to the maximum system level.

GENERAL DESCRIPTION 1-2

MDC-360 DEPOSITION CONTROLLER

1.3 SPECIFICATIONS

1.3.1 MEASUREMENT

Frequency Resolution 0.03 Hz @6.0 MHz Mass Resolution 0.375 ng/cm

Thickness Accuracy 0.5% + 1 count Measurement Update Rate Dynamically adjusted, 0.5 to 10 Hz Display Update Rate 10 Hz Sensor Crystal Frequency 2.5, 3, 5, 6, 9, 10 MHz

1.3.2 DISPLAY

Thickness Display Autoranging: 0.000 to 999.9 KÅ Rate Display Autoranging: 0.0 to 999 Å/sec Power Display 0.0 to 99.9% Time To Go 0 to 9:59:59 H:MM:SS Crystal Health % 0 to 99% Layer Number 1 to 999 Graphics Display 256X64 LCD with CCFL

backlighting

1.3.3 COMMUNICATION

RS-232 serial port standard RS-485 serial port optional IEEE-488 bus interface optional

1.3.4 PROGRAM STORAGE CAPACITY

Process 99, user definable Layer 999, user definable Material 32, user definable

1.3.5 PROCESS PARAMETERS

Process Name 12 character string Edit password 4 character string Run/View password 4 character string Layer# 1 to 999 Material name, Thickness

1.3.6 MATERIAL PARAMETERS

Material Name 10 character string

GENERAL DESCRIPTION 1-3

MDC-360 DEPOSITION CONTROLLER

Sensor # 1 to 4 Crystal # 1 to 8 Source # 1 to 4 Pocket # 1 to 8 Material Density 0.80 to 99.9 gm/cm

Acoustic Impedance 0.50 to 59.9 gm/cm2 sec Tooling Factor 10.0 to 499.9% Proportional gain 0.00 to 9999 Integral Time constant 0 to 99.9 sec Derivative Time constant 0 to 99.9 sec Rise to Soak Time 0 to 9:59:59 H:MM:SS Soak Power 0 to 99% Soak Time 0 to 9:59:59 Rise to Predeposit Time 0 to 9:59:59 Predeposit Power 0 to 99.9% Predeposit Time 0 to 9:59:59 Rate Establish Time 0 to 60 sec Rate Establish Error 0 to 99.9% Deposition Rate (1 to 5) 00.0 to 999.9 Å/sec Rate Ramp Start (1 to 4) 0.000 to 999.9 KÅ Rate Ramp Stop (1 to 4) 0.000 to 999.9 KÅ Time Setpoint 0 to 9:59:59 Ramp to Feed Time 0 to 9:59:59 Feed Power 0 to 99.9% Feed Time 0 to 9:59:59 Ramp to Idle Time 0 to 9:59:59 Idle Power 0 to 99.9% Maximum Power 0 to 99.9% Power Alarm Delay 0 to 99 sec Minimum Power 0 to 99.9% Rate Deviation Attention 0 to 99.9% Rate Deviation Alarm 0 to 99.9% Rate Deviation Abort 0 to 99.9% Sample Dwell % 0 to 100.0% Sample Period 0 to 9:59:59 Crystal Fail Switch, Time Power, or Halt Backup Sensor # 1 to 4 Backup Crystal # 1 to 8 Backup Tooling Factor 0 to 499.9% Material Password 4 character string

The MDC-360 also has a built in material library that contains many common material names along with their density and acoustic impedance values.

GENERAL DESCRIPTION 1-4

MDC-360 DEPOSITION CONTROLLER

1.3.7 INPUT/OUTPUT CAPABILITY

Sensor Inputs 2 Standard and 2 optional BNC inputs Source Outputs 2 Standard and 2 optional fully

isolated, 2.5, 5, 10 volts @ 20 ma.

0.002% resolution

Discrete Inputs 8 Standard and 8 optional fully

programmable inputs. The Passive I/O card (PN#179216) has TTL level inputs activated by a short across the input pins. The Active I/O card (PN#179239) has inputs activated by 12 to 120 volt AC/DC across the input pins.

Discrete Outputs 8 standard and 8 optional fully

programmable, SPST relay, 120VA, 2A max.

Abort Output 1 standard and 1 optional SPST

Relay, 120VA, 2A max. Remote Power Handset Front panel, RJH jack RS-232 Communication Rear panel, 9 pin, Full duplex, DTE

Front panel, RJ11 jack, Full duplex DAC Recorder Outputs Two 0 to 5 volts, 0.02% resolution

1.3.8 SENSOR PARAMETERS

Number of Crystals 1 to 8 Shutter Relay Type Normally open, normally closed,

dual, or none. Position Control Manual, direct, BCD, or individual. Position Drive Up, down, Fast, inline, single step, or

double step. Feedback Type Individual, BCD, single home, in

position, or no feedback. Rotator Delay 0 to 99 sec

1.3.9 SOURCE PARAMETERS

Number of Pockets 1 to 8 Shutter Relay Type Normally open, normally closed, or

none. Shutter Delay 0.0 to 9.9 sec Position Control Manual, direct, BCD, or individual. Position Drive Up, down, Fast, inline, single step, or

double step. Feedback Type Individual, BCD, single home, in

position, or no feedback.

GENERAL DESCRIPTION 1-5

MDC-360 DEPOSITION CONTROLLER

Rotator Delay 0 to 99 sec Source Voltage Range 2.5, 5, 10 volts

1.3.10 RECORDER PARAMETERS

Recorder #1/#2 Output Rate, rate dev., power or thickness Recorder #1/#2 Scale Full scale %, 2/3 digit

1.3.11 UTILITY SETUP PARAMETER

Crystal Frequency 2.5, 3, 5, 6, 9, 10 MHz Simulate Mode On/Off Interface Address 1 to 32 Attention Volume 0 to 10 Alert Volume 0 to 10 Alarm Volume 0 to 10 Data Points/Minute 30,60,120,300,600 PPM Time 0 to 23:59 Date MM/DD/YY

1.3.12 OTHER

Input Power Requirements 100, 120, 200, 240 VAC; 50/60 Hz;

25 watts

Operating Temperature Range

0 to 50°C Physical Weight 10 LB Physical Size 19” rackmount case

3 1/2” high x 9 3/8” deep

1.4 ACCESSORIES

Part Number Description 179215 Dual Source/Sensor Board 179216 Passive I/O Board 179217 IEEE-488 Communication Board 179218 Internal Storage Data/Time Clock 179219 RS-232 to RS-485 conversion 179220 Remote Power Handset 179239 Active I/O Board 180200-4 DCM-200 software 3.5” diskette 123200-5 SH-102 Sensor Head , cables, and

carousel of 10 each 6MHz Gold SC-

101 sensor crystals 124201-4 SO-100 Oscillator with 6" and 10'

BNC Cables.

GENERAL DESCRIPTION 1-6

MDC-360 DEPOSITION CONTROLLER

130200-2 IF-111 Instrument Feedthrough, 1" O-

Ring with 1 electrical connector and dual 3/16" water tubes.

130204-2 IF-276 Instrumentation Feedthrough,

2 3/4" Conflat® Flange seal with 1 electrical connector and dual 3/16" water tubes.

150902 SF-120 Combination Sensor Head,

Feedthrough, Cables, Crystals and

Oscillator. 123204-1 Internal Coax Cable 30". 123204-2 Internal Coax Cable 60". 124202-1 BNC Cable Assembly 10'. 124202-2 BNC Cable Assembly 20' 124204 BNC Cable Assembly 6". 103220 SC-101 Carousel of 10 each 6MHz

gold sensor crystals. 103221 SC-102 Carousel of 10 each 6MHz

silver sensor crystals. Refer to Maxtek Price List for more accessories and other products.

GENERAL DESCRIPTION 1-7

MDC-360 DEPOSITION CONTROLLER

2. FRONT PANEL DISPLAYS AND CONTROLS

The front panel is divided into two sections, the operating section and the programming section. The left half of the panel is devoted to the operating displays and controls. The right half is used for programming, viewing stored processes, and displaying the status of the selected process.

2.1 OPERATING DISPLAYS

All of the operating displays are updated ten times per second unless the controller is in the Abort mode. When in the Abort mode, the values of the operating displays are held constant so the operator will know the values at the time of the Abort. The controller will also flash the operating displays while in Abort to alert the operator.

Figure 2-1 Operating Display

2.1.1 RATE

A three digit display with a floatin

g decimal point is used to display deposition rate in angstroms per second at a resolution of 0.1 Å/sec from 0 to 99.9 Å/sec, and a resolution of 1.0 Å/se

2.1.2 POWER

A three digit display with a fixed decimal point displays percent of m

c for rates from 100 to 999 Å/sec.

aximum power with a resolution of 0.1% from 0 to 99.9%. This corresponds to the control voltage range of 0 to 9.99 v

2.1.3 THICKNESS

Four digits with an autoranging

olts.

decimal point display measured thickness in KÅ with a resolution of 1 Å from 0 to 9.999 KÅ, a resolution of 10 Å from 10.00 KÅ to 99.99 KÅ and a resolution of 100 Å from 100.0 KÅ

2.1.4 LAYER NUMB

to 999.9 KÅ.

Three digits display the layer number of the current process.

2.1.5 CRYSTAL

HEALTH %

A two digit display is used to show the health percentage of the sensor crystal in use. A fresh crystal starts out with a health of 99%.

FRONT PANEL DISPLAYS AND CONTROLS

2-1

MDC-360 DEPOSITION CONTROLLER

2.1.6 TIME TO GO

Time To Go is displayed in hours, minutes and seconds. This display can be configured to show the estimated state or layer time or the elapsed process, lay

or state times.

2.2 PARAMETER/STATUS DISPLAYS

A graphics display labeled Parameter/Status is used for process programming and controller setup as w operator can switch between programming screens and status screens by

ell as displaying run time status and data graphing. The

pressing the Program and Status keys on the front panel. Upon power up, the Parameter/Status display automatically reverts to the last viewed status screen. Detail descriptions of the different programming and status screens can be found in Section 4 and 5.

Displays the current

rocess name.

Figure 2-2 Parameter/Status Display

2.3 OPERATING CONTROLS

Normal operation of the MDC-360 is controlled by seven operating keys, Manu Start, Abort, Reset, Zero, Shutter and Status. Except for the Zero and Status key each of the other keys is equipped with an LED to indicate the controller’s statu

2.3.1 MANUAL KEY

This key is used to toggle the MDC-360 Manual mode on and off. A red light behind this key indicates the controller is in manual power control mode. This mode may be selected at any time providing that the controller is not in Abort mode. The Manual mode indicates that the source control voltage output is bei contro voltage remains constant unless incremented up or down by means of the Rem Power Handset. At entry into the Manual mode, the power is left at the prior to entry and is thereafter modified only through the Remote Power Handset. Exit from the manual mode is accomplished by means of the Manual or Reset key.

Displays the current material name.

Sample Cr Process Ready 10 R a t e

Displays the controller modes, states or troubles.

Displays the ti axis scale facto

lled through the Remote Power Handset. In the Manual mode the control

last value

al,

ote

The MDC-360 can also be aborted through the Remote Power Handset. This abort feature is active whether or not MDC-360 is in the manual mode.

FRONT PANEL DISPLAYS AND CONTROLS 2-2

MDC-360 DEPOSITION CONTROLLER

2.3.2 START KEY

The Start key starts a process, starts a layer, or resumes an aborted process. A green light behind this key indicates the controller is in process. When this key is pressed the first time a list of stored processes is displayed in the Parameter/Status window. The up and down arrow keys can be used to move the cursor to the desired process. Press the Start key again to start that process. Note that in many cases messages will be displayed in the Parameter/Status window reminding the operator to check system set up. Follow the prompt.

2.3.3 ABORT KEY

The Abort key drives the MDC-360 into the Abort mode. All source powers are set to zero and discrete outputs are set to inactive state. A red light behind this key indicates the controller is in the abort mode.

2.3.4 RESET KEY

The Reset key is used to clear the controller from Abort mode and put it into the Ready mode. A yellow light behind this key indicates a Ready mode. The Reset key is inactive during the In Process mode so that a premature exit from the In Process mode requires an abort.

2.3.5 ZERO KEY

Pressing the Zero key causes the thickness display to go to zero. This key is active at all times and if pressed during the deposit state will result in a film thicker than that desired by an amount equal to the thickness displayed at the time the display was zeroed.

2.3.6 SHUTTER KEY

This key is used to manually open and close all source shutters. The red light is illuminated when the active source shutter relay is closed. This key is only active when the controller is in the Process Ready mode.

2.3.7 STATUS KEY

Pressing the Status key will bring up one of the six run-time status screens. Repeatedly pressing the key will cycle through the different status screens. Refer to Section 5 for a detailed description of these status screens.

FRONT PANEL DISPLAYS AND CONTROLS

2-3

MDC-360 DEPOSITION CONTROLLER

Figure 2-3 Programming Section

2.3.8 ARROW KEYS

The arrow keys are used to navigate through the programming and setup menu structure. These keys will auto-repeat if they are held down for more than half a second.

Figure 2-4 Arrow Keys

2.3.9 PROGRAM KEY

Pressing the programming key will bring up the last viewed programming screen. If a programming screen is already shown, nothing will happen. This key is also used in conjunction with the Up and Down Arrow keys to adjust the contrast of the Parameter/Status display.

FRONT PANEL DISPLAYS AND CONTROLS 2-4

MDC-360 DEPOSITION CONTROLLER

2.3.10 ALPHANUMERIC KEYBOARD

Figure 2-5 Alphanumeric Keyboard

The alphanumeric keyboard is used to edit controller programs. Refer to Section 4 for the use of each key.

‘Backspace’

‘Enter’

FRONT PANEL DISPLAYS AND CONTROLS

2-5

MDC-360 DEPOSITION CONTROLLER

3. BENCH CHECKOUT & INSPECTION

3.1 INSPECTION

Your MDC-360 was released to the carrier in good condition and properly packed. It is essential to all concerned that the contents of the shipment be carefully examined when unpacked to assure that no damage occurred in transit. Check the material received against the packing list to be certain that all elements are accounted for. Items included with your controller are:

1 MDC-360 Deposition Controller 1 Operation and Service Manual 1 Power cord 1 Source cable (4 pin mini DIN connector) 1 Discrete I/O connector kit (37P D shell)

In addition, you may have ordered one or more of the accessories listed in Section

1.4. If there is evidence of loss or damage: a) Notify the carrier or the carrier agent to request inspection of the loss

or damage claimed.

b) Keep the shipping containers until it is determined whether or not they

are needed to return the equipment to Maxtek.

3.2 INITIAL POWER UP

Upon initial power up the unit will start with all LED’s lighted. The Parameter/Status display will show the controller Sign-on screen with its configuration information. The unit will stay in this state until a key is pressed.

When any key on the front panel is pressed, the operating display and the Parameter/Status display will return to the last viewed screen prior to loss of power.

3.3 SAMPLE PROGRAM

The sample program listed below is included in the MDC-360 memory at the time of shipment. It can be used to check out the controller by running it in Simulate mode. Follow instructions in Section 4 to navigate through the menu structure. Check the controller parameter values against the sample program for discrepancy and change if necessary. Note also, if the source or sensor configuration has been changed during familiarization with the controller programming, appropriate source and sensor parameter values also need to be retained for the sample program to run correctly.

Once the sample program has been checked, use the programming Main Menu, Edit System Setup, Edit Utility Setup, to select Simulate mode ON, then use Start to select and run the sample program in Simulate mode.

BENCH CHECKOUT & INSPECTION

3-1

MDC-360 DEPOSITION CONTROLLER

3.3.1 MATERIAL #1 PARAMETERS

Material Name Cr Sensor # 1 Crystal # 1 Source # 1 Pocket # 1 Material Density 07.20 gm/cm

Acoustic Impedance 28.95 gm/cm2 sec Tooling Factor 70 % Proportional gain 2400 Integral Time constant 99.9 Derivative Time constant 0.00 Rise to Soak Time 0:00:10 H:MM:SS Soak Power 5 % Soak Time 0:00:10 Rise to Predeposit Time 0:00:10 Predeposit Power 9.5 % Predeposit Time 0:00:05 Rate Establish Time 0 sec Rate Establish Error 0 % Deposition Rate #1 10.0 Å/sec Rate Ramp Start (1 to 4) 999.9 KÅ Rate Ramp Stop (1 to 4) 999.9 KÅ Time Setpoint 0 Ramp to Feed Time 0:00:05 Feed Power 7 % Feed Time 0:00:10 Ramp to Idle Time 0 Idle Power 0 Maximum Power 20 % Power Alarm Delay 5 sec Minimum Power 0 % Rate Deviation Attention 0 % Rate Deviation Alarm 0 % Rate Deviation Abort 0 % Sample Dwell % 100.0 % Sample Period 0 Crystal Fail Time Power Backup Sensor # 1 Backup Tooling Factor 100 Backup Crystal # 1 Material Password 0000

3-2 BENCH CHECKOUT & INSPECTION

MDC-360 DEPOSITION CONTROLLER

3.3.2 MATERIAL #2 PARAMETERS

Material Name Au Sensor # 2 Crystal # 1 Source # 1 Pocket # 2 Material Density 19.30 gm/cm

Acoustic Impedance 23.18 gm/cm2 sec Tooling Factor 70 % Proportional gain 5000 Integral Time constant 99.9 Derivative Time constant 0.00 Rise to Soak Time 0:00:05 H:MM:SS Soak Power 25 % Soak Time 0:00:05 Rise to Predeposit Time 0:00:05 Predeposit Power 37.5 % Predeposit Time 0:00:10 Rate Establish Time 0 sec Rate Establish Error 0 % Deposition Rate #1 20.0 Å/sec Rate Ramp Start (1 to 4) 999.9 KÅ Rate Ramp Stop (1 to 4) 999.9 KÅ Time Setpoint 0 Ramp to Feed Time 0:00:05 Feed Power 10 % Feed Time 0:00:10 Ramp to Idle Time 0 Idle Power 0 Maximum Power 50 % Power Alarm Delay 5 sec Minimum Power 0 % Rate Deviation Attention 0 % Rate Deviation Alert 0 % Rate Deviation Alarm 0 % Sample Dwell % 100.0 % Sample Period 0 Crystal Fail Time Power Backup Sensor # 1 Backup Tooling Factor 100 Backup Crystal # 1 Material Password 0000

BENCH CHECKOUT & INSPECTION

3-3

MDC-360 DEPOSITION CONTROLLER

3.3.3 PROCESS PARAMETERS

Process Name Layer No. Thickness Material Sample 1 0.400 KÅ Cr 2 1.050 KÅ Au

3.4 SIMULATE OPERATION

Testing the MDC-360 is best accomplished by checking its operation in the Simulate mode. This mode can be selected by using the programming Main Menu, Edit System Setup, Edit Utility Setup, to select Simulate mode ON, then use Start to select and run a process in Simulate mode.

The Simulate mode is identical to the Normal mode except that the sensor input is simulated. For this reason, entry to the Simulate mode will extinguish the Crystal Failure message if it is flashing. No other difference between the Simulate mode and the Normal mode occurs until entry to the Deposit State.

3.5 MANUAL OPERATION

Manual Mode is selected by depressing the Manual key. The LED behind the key will light up indicating the controller is in Manual mode.

The Manual Mode is identical to the normal mode in all respects except that source power is controlled only through the Remote Power Handset.

The Remote Power Handset has three push buttons, see Figure 3-1. Without any of the buttons depressed, the output power is maintained at its last value. Depressing the “PWR UP” button will increase the power, depressing the “PWR DN” button will decrease the power and depressing the “ABORT” button will put the controller into the Abort mode.

The Abort Mode is active whether or not the MDC-360 is in Manual Mode and therefore can be used as a remote “panic button”.

The minimum increment by which the power is increased or decreased is 0.1%. The Remote Power Handset can also be used to initiate a manual sensor and

crystal change by depressing both the power increase and decrease buttons simultaneously. Each time a sensor/crystal switch is initiated, the controller will toggle between the primary and the backup sensor/crystal combination as defined by the active material’s parameters. The sensor/crystal switching function is only operational when the controller is not in the Manual Mode.

3.6 INSTALLING OPTION BOARDS

Option boards are most easily installed while the MDC-360 is on the bench. Figure 8-9 shows the location of the various option boards. Also, they are clearly marked on the rear panel.

All Dual Source-Sensor boards are identical, as are all Discrete I/O boards. The input-output configuration of these boards is defined by the position into which

3-4 BENCH CHECKOUT & INSPECTION

MDC-360 DEPOSITION CONTROLLER

they are installed. One exception for the Discrete I/O boards is that the jumper J2 on the board installed in the Discrete I/O-2 position has to be connected. This is required so the controller will acknowledge the second Discrete I/O board. A Source-Sensor board plugged into the second position will provide sensor inputs numbers 3 & 4, and source outputs numbers 3 & 4. The IEEE-488 board has a single slot.

3.6.1 SOURCE-SENSOR BOARD

1. Remove the chassis top cover.

2. Remove the three plastic hole-plugs from the rear panel.

3. Carefully slide the two BNC connectors on the Source-Sensor board into the two top holes on the rear panel. Then with even pressure, push the card edge connector down into the Main board J12.

4. Fasten the two BNC connectors using the nuts and washers supplied with the kit. Make sure the board is properly aligned.

5. Tighten the board down with the tie wrap.

6. Replace the chassis top cover and apply power to the controller.

7. The Sign On screen should acknowledge Source-Sensor 3,4 installed.

3.6.2 DISCRETE I/O BOARD

1. Remove the chassis top cover.

2. Locate Discrete I/O-2 slot and remove the slot cover.

3. Carefully slide the D37 connector of the DIO board into the slot and fasten it using the hex fasteners and washers supplied with the kit.

4. Fasten the other end of the board to the standoffs using the two # 4-40 screws provided.

5. Plug the 26-pin ribbon connector into the DIO edge connector J1.

6. Replace the chassis top cover and apply power to the controller.

7. The Sign On screen should acknowledge Discrete I/O-2 installed.

3.6.3 IEEE-488 OPTION BOARD

1. Remove the chassis top cover.

2. Locate IEEE-488 option slot and remove the slot cover.

3. Carefully slide the connector of the IEEE-488 board into the slot and fasten it using the fasteners and washers supplied with the kit.

4. Plug the 20-pin ribbon connector into J7 connector on the Main board.

5. Replace the chassis top cover and apply power to the controller.

6. The Sign On screen should acknowledge IEEE-488 option installed.

3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT

The built-in DAC function on the Main board contains two converters, allowing simultaneous recording of any two of the following four parameters: Rate, Rate deviation, Power and Thickness. The full scale output of each converter is 5 volts, is single ended and is referenced to ground. Parameter selection for each of the channels is accomplished independently by making the appropriate choices in the DAC setup menu.

BENCH CHECKOUT & INSPECTION

3-5

MDC-360 DEPOSITION CONTROLLER

In addition to the individual channel output pins there are two control pins which are common to both channels and are intended to simplify the process of setting up analog recorders. Connecting the Zero control line to ground will drive both channel outputs to zero, allowing the recorder zero reference to be easily set. Releasing the Zero line and connecting the Full Scale line to ground will drive both channel outputs to full scale for establishing the recorder full scale calibration.

Each channel can be set independently to convert either the two or the three least significant digits of the chosen parameter to a proportional analog signal, corresponding to the DAC setup option chosen. With the three digit setting, a thickness of 0.500 KÅ would result in an analog output of 2.50 volts, or a scale factor of 5 mV/Å. If more resolution is desired, either channel can be configured to convert only the last two digits of the parameter, thus the analog output would achieve full scale at 99Å. The output scale factor in this configuration is 50 mV/Å.

The above scale factors are based on the assumption that the thickness display is in the 0 - 9.999 KÅ range. Because the thickness and rate displays are autoranging, the analog output of these variables will also autorange so that in the above example, if the thickness is in the range of 10 KÅ to 99.9 KÅ, the analog scale factor would be 50 millivolts per 10 Å, also ten times larger.

The Rate deviation parameter must be handled differently than the other parameters because it can be negative. Maximum positive error is converted to 5 volts, maximum negative error is converted to 0 volts and zero error is converted to a mid scale, 2.5 volt, output. Maximum corresponds to 99 or 999, plus 1.

The DAC can be checked by putting the MDC-360 into the Simulate mode and checking for correspondence between the analog output and the selected front panel displays.

3-6 BENCH CHECKOUT & INSPECTION

MDC-360 DEPOSITION CONTROLLER

Figure 3-1 Remote Power Handset

BENCH CHECKOUT & INSPECTION

3-7

MDC-360 DEPOSITION CONTROLLER

4. PROGRAMMING AND CONTROLLER SETUP

4.1 GENERAL

4.1.1 NAVIGATING THE MENU STRUCTURE

Before attempting to navigate the menu structure of the MDC-360 controller, please refer to Section 2 which provides a brief summary of the front-panel displays and key functions. A graphical menu structure is shown in Figure 15-1. Note that following power-on, and acknowledgment of the Sign-on screen by making any key depression, e.g. Reset, the LCD display will return to the display function being used at the last power-off, i.e. either a status display screen or a programming function screen.

This may be confusing until the full scope of the controller’s capabilities are understood. However, as their names suggest, the Status and Program keys select the display of status information and the display of programming information, respectively.

So, for example, if having chosen the programming functions with a Program key depression there is any doubt about the point in the menu system that is then being displayed, holding down the left-arrow key will eventually display the Main Menu from which point the desired option can be chosen by selective use of the Up-arrow and Down-arrow keys to move the cursors to point to an option, and the Right-arrow key or the Enter key to select the option.

Main Menu

>View/Edit Process < View/Edit Material View Results Edit System Setup

Figure 4-1 The Main Menu Press the Program key to enter the programming mode. The programming

screens can be visualized as a two dimensional menu format. The Main Menu

is visualized at the far left, with an increasing level of detail in the menus to the right. The Left and Right-arrow keys are used to move between menus. The Up and Down-arrow keys are used to scroll through a list of parameters or option each menu. To select a menu option, align the cursors with the option, then

s in

press either the Enter key or the Right-arrow key. This will present the next screen associated with the selected option. You can always hold down the Left-arrow

4-1PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

key to go back to the Main Menu. Each of the programming screens is described in detail later in this section.

4.1.2 ENTERING ALPHA CHARACTERS

To enter a name, press the k

ey that contains the letter or character you wish to enter. Next, press the Alpha key to change the number to the first letter of that key. K ep pressing the Alpha key

e to get the desired letter. Its upper/lower case can be toggled by pressing the Shift key. Once the desired letter is achieved, repeat the above procedure and enter the remainder of the name. Note, the number 9 key contains characters Y, Z, and ‘space’. Use this key to ente

4.1.3 ENTERING TIME PARAMETERS

The MDC-360 expresses time in 24-hour h:mm:ss format. In p

rogramming a

r a space.

time parameter, the Decimal ‘.’ key is used to separate hour, minute and second. Hence, 1:45:23 would be entered as “1.45.23” and 0:00:35 entered as “..35”, followed by the Enter key.

4.1.4 COPYING AND DELETING

A ‘process’ is defined by one or more ‘layers’, and a layer requires

a ‘material’ and a thickness definition. The MDC-360 has the capability of copying and deleting processes, layers, and materials. Except when copying a layer, procedures for copying and deleting a process, a layer and a material are the same. The difference when copying a layer is that layers are pushed-down to make space for the new layer, and move

up when a layer is deleted.

To copy a process, position the cursor at the process to be copied, then press the number 1 key. Next, move the cursor to the location where the process is to be copied and press Enter. The

process will be copied to the new location with the

same name. If there is already a process name at the new location, it will be overwritten. The copied process sho confusion. The same procedure applies when copying a material.

When copying a layer, the copied data will be positioned at the selected layer number. The data of the selected layer, and all following layers, will be p down one layer. Example, if a layer is copied onto Layer #4 location, the exis data in Layer #4 will be pushed to Layer #5, Layer #5 to Layer #6, etc., while the copied data is placed in Layer #4.

To delete a process or a material, mo A message will pop up asking for verification of the deletion, press 1 to confirm and 0 to cancel the deletion.

4.1.5 PASSWORD PROTECTION

Each Process has a View/Run password and an Edit password. Each Material has an Edit password. The three passwords protect against unauthorized operations. The passwords default to 0000, or no password protection, at the time of shipment. Refer to the descriptions below to set each password. Note: The

password protection is only meant to deter unsophisticated users. Be sure

4-2 PROGRAMMING AND CONTROLLER SETUP

uld be given a new name to avoid

ushed

ting

ve the cursor to the item and press the 0 key.

MDC-360 DEPOSITION CONTROLLER

record passwords, because if you forget a password it will not be possible to gain access to the protected item!

4.1.5.1 VIEW/RUN PROCESS PASSWORD

The View/Run password is required password, select View/Edit Process from the Main Menu, select the process fro

to view or run a process. To set this

m the Select Process screen. Move the cursor onto the View/Run password, type in your password (4 digit string), then press the Enter key. A message will pop up asking for verification to change the password. Press 1 to confirm and 0 to c the change. Each time you want to view or run this process, you will now be

ancel

asked to enter the correct password. Note that the Edit Process password takes precedence over the View/Run password. If you know the Edit password, you can also view the process. Once

a password other than 0000 has been installed, it

will not be displayed unless re-entered.

4.1.5.2 EDIT PROCESS PASSWORD

The Edit process password is required to edit a process. To set this password select View/Edit Process from the Main Menu, select the process from th Process screen. Move the cursor onto the Edit password, type in your passwor

e Select

d (4 digit string), then press the Enter key. A message will pop up asking for verification to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to edit this process, you will be asked to enter correct password. Once a password other than 0000 has been installed, it will n be displa

yed unless re-entered.

the

4.1.5.3 EDIT MATERIAL PASSWORD

The Edit material password is required to edit a material. To set this password, select View/Edit Material from the Main Menu, select the material from the Select Material screen. Move the cursor down to the Material Password parameter, the last item in the list, type in your password (4 digit string), then press the Enter key. A message will pop up asking for verificat

ion to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to edit this material, you will be asked password other than 0000 has been installed, it will not be displayed unless

to enter the correct password. Once a

re-

entered.

4.1.6 ADJUSTING PARA

The Parameter/Status display contrast can be adjusted by using the Progr

METER/STATUS DISPLAY CONTRAST

am key in conjunction with the Up-arrow and Down-arrow keys. Hold down the Program key and press the Up-arrow key to increase the contrast. Likewise, hold down the Program key and press the Down-arrow key to

decrease the contrast. It may take

several seconds for the change in contrast to become apparent.

4-3PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

4.2 GETTING STARTED

This section lays out the basic programming sequence with programming examples for initial setup of the MDC-360 deposition controller.

4.2.1 UTILITY SETUP

The only critical parameter in the Utility Setup is the Crystal Frequency parameter. This parameter must be set for the specific frequency crystals th

at you

plan to use (2.5, 3.0, 5.0, 6.0, 9.0, 10.0 MHz). There is one other parameter in the Utility Setup menu that may be useful in the

initial setup and testing phase of the MDC-360 and that is the Simulate Mode parameter. The simulate mode of the MDC-360 provides a means of simulatin deposition

on the crystal. This mode is useful for testing the setup of the MDC-

360 without having to deposit any material.

4.2.2 DAC SETUP

If the DAC (digital to analog) outputs are to be used then these parameters can be set at this time but it is not necessary for the operation of the controller.

4.2.3 SOURCE SETUP

The first item to note is that in defining s the

MDC-360 will automatically create the inputs and outputs necessary to comple e setup is comp assignm that the I/O pin t scr

The us There a outputs program ard card has TTL ground true inputs wh des

The of sou

te the interface based on the parameter settings. Therefore, once th

lete, the user should review the inputs and outputs noting the pin

ents so that the proper connections can be made. Also note assignments can be changed if necessary in the program input and outpu eens.

er must also be aware of the type of I/O card installed in the MDC-360.

re two types of I/O cards available. Both cards have the same 9 relay

(8 programmable and 1 abort) and the same number of inputs (8

mable). The difference is the stand

ile the Active I/O card has 115VAC high true inputs. The Active I/O card is

ignated by “Active I/O Card“ written on the rear panel of the MDC-360.

following two items in the Source Setup are common to almost all types

rces and typically require definition:

Source Shutter - If the source has a shutter to be activated by the MDC-36

ources, and sensors for that matter, is that

0 then the Shutter Relay Type parameter must be set to either N.O. (normally open) or N.C. (normally closed). The typical setting is N. which means th

at the relay will close to open the shutter.

Once defined, the MDC-360 will create a relay output called “SourceN

Shutter” that should be connected to the shutter actuator. The shu be tested by pressing the Shutter key with the c Ready state. When the red LED in the Shutter key is illuminated then all source shutters should be opened. When the shutter LED is off then all source shutters should be closed.

4-4 PROGRAMMING AND CONTROLLER SETUP

tter can

ontroller in the Process

MDC-360 DEPOSITION CONTROLLER

If th

e shutter actuator has a significant delay in opening and closing then set

the Shutter Delay parameter equal to the delay

Source Voltage - This parameter must be set to correspond to the input

voltage range of the source power supply (0 to 2.5, 5.0 or 10.0 volts).

The set source manual

Sin

tings of the rest of the source parameters are dependent on whether the

has one or more pockets (crucibles) and whether pocket selection is

or automatic. gle Pocket Source - If the source has only one pocket (single pocket E-

beam gun, filament boat or sputtering source) then the remaining parameters can be left at their default values.

ltiple Pocket Source with Manual Position Control - For manual position control of a

multiple pocket source, you need only set the Number of Pockets parameter to the correct number of pockets. Once set, a message will appear at the start of each layer instructing the operator to change source N to the required material.

ltiple Pocket Source with Automatic Position Control - There are two parameters requiring definition which are common to all the various types

osition control. The first is the Number of Pockets parameter and the

of p

ond is the Rotator Delay parameter. The Number of Pockets parameter

sec

imply the number of pockets in the source. The Rotator Delay

is s

ameter defines the maximum amount of t

par ime allowed for the correct pocket to rotate into position. This should be set to the time it takes for the rot

The se pocke osition control and

ator to go from pocket #1 all the way around to pocket #1 again. ttings of the three remaining parameters required for automatic

t position control depend on the required type of p

position feedback.

Positi t

on Control - The MDC-360 can be setup to either control the pocke

positio interfa

Direct eans that the MDC-

a. Un rive - The rotator drive motor can only turn in

n directly by interfacing to the rotator’s actuator or indirectly by

cing to a rotator controller.

Control of Pocket Position - Direct control m

360 will control the actuator (rotator motor, pneumatic valve, e directly to get the desired pocket into position. For direct contr se

t the Control Parameter to Direct then select one of the following

ive types and follow the instructions:

idirectional Motor D

tc.)

ol first

one direction. Select Up for the Drive parameter. A relay output will be created called “SourceN Drive Up” that should be connected between the rotator motor and power supply.

b. Bi-

directional Motor Drive - The rotator motor can turn in either

direction. Select Fast for the Drive parameter. Two relay outputs will be created. One called “SourceN Drive Up” and one called “SourceN Drive Dn”. With this drive

type, the MDC-360 will

4-5PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

activate either the drive up or drive down outputs to rotate to the required pocket in the least amount of time.

c. Motor Driven Inline Source - Select Inline for the Drive type

parameter. Two relay outputs will be created. O “

SourceN Drive Up” and one called “SourceN Drive Dn”. In this

c t

ase the up output will be activated when going from the greates

ocket to pocket #1.

ne called

d. Uni c Drive - Select Sngl Step or Dbl Step for the

directional Pneumati

rive parameter. A relay output will be created called “SourceN

rive Up” that should be connected between the rotator’s

p l

neumatic valve and power supply. With Sngl Step, the output wil

p .

ulse once for one second to increment the rotator one position

ith Dbl Step, the output will pulse twice for one second each to

i otator one position.

ncrement the r

Indirect Control of Pocket Position - Indirect control means that the MDC-

360 will indicate the desired pocket position to a pocket rotator contro through position select outputs. The Drive pa

rameter selects between the

ller

two following indirect position output formats:

a. Individual - With individual format, one output will be created for each pocket. So, if pocket 2 is the desired pocket, then the output “SourceN Pocket 2” will be true while all the other positio outputs will be false.

b. BCD - With BCD format , the MDC-360 will create from one to three outputs based on the number of pockets. For example, an eight pocket source would use three outputs. If pocket one is t

d pocket, all outputs will be false. If pocket four is the

desire desired pocket, outputs one and two will be true and outpu

t three

will be false.

Pos eed t

ition F back - The last step in defining automatic control of a multi-pocke

sou

rce is to select the pocket position feedback type. The MDC-360 has the

followi

ng five types of position feedback available:

Feedback - As the name implies, no position feedback is created for this

type.

Ind his feedback type, one input is created for each pocket

ividual - For t

position in the source. The inputs are labeled “SourceN Pocket X”. All inputs are normally false (open circuit) unless the respective pocket position then that input should be true (closed to gr six pocket source would use six inputs. If pocket two was in position the all the inputs should be false except the input connected to “SourceN Pocket 2”.

Individual position feedback is the most typical feedback type and is

recommended if more than one type is available.

4-6 PROGRAMMING AND CONTROLLER SETUP

is in

ound). For example, a

MDC-360 DEPOSITION CONTROLLER

BCD - Binary Coded Decimal position feedback. This feedback type

uses binary coding to indicate the pocket position. Inputs are numbered most significant bit first. For example, an eig

ht pocket source would use three inputs. With pocket one in position, all inputs will be false. With pocket four in position, inputs one and two will be true and input three will be false.

SNGL HOME - Single home position feedback. This feedback type uses one

input. The input is normally false (open circuit) and should go true (closed to ground) when pocket one is in position.

POSITION - In position feedback. This feedback type uses one input.

The input is normally false (open circuit) and

should go true (closed to

ground) when the desired pocket is in position.

4.2.4

The fol -360 is setup to control the fou

SENSOR SETUP

lowing examples demonstrate how the MDC

r basic types of crystal sensor heads available:

Sin for a

gle Crystal Sensor Head - No sensor parameters need to be changed

single crystal sensor head.

gle Crystal Sensor Head with Shutter - For a single shuttered sensor

Sin

head, set the Shutter Relay Type parameter to either N.O. (normally open or N.C. (normally closed). The typical setting is normally open which means that “SensorN Shutter” will be created that should be connected between

the relay will close to open the shutter. A relay output called

the

sensor shutter actuator and power supply.

Du ensor

al Crystal Sensor Head with Shutter - For a dual crystal shuttered s

hea

d, set the Shutter Relay Type parameter to Dual. A relay output called

“Du

alSnsr1&2 Shtr” will be created that should be connected between the

sen

sor shutter actuator and power supply.

Autom in the material menu by

atic crystal switching upon failure is enabled

sett

ing the Crystal Fail parameter to Switch and the Backup Sensor

num r

ber to 2. Note that with the dual sensor head you define the senso

num

ber that you would like to use, (or switch too) not the crystal number.

The ple

crystal number need only be defined when you are using a multi

cry

stal sensor head(sensor head with one BNC output and more than one

cry

stal).

)

Multip

le Crystal Sensor Head - The MDC-360 can be setup for either

auto

matic or manual control of multiple crystal sensor heads.

a. Manual Crystal Pos

control of a multiple crystal sensor head, set the Number of Crystals parameter to the correct number of crystals. Once set, a message w appear at the start o

sensor N to the required crystal number.

ition Control - For manual crystal position

ill

f each layer instructing the operator to change

4-7PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

b. Automatic Crystal Position Control - There are two parameters requiring definition which are common to all the various types of multiple sensor heads. The first is the Number of and

the second is the Rotator Delay parameter. The Number of

Cry

stals parameter defines the number of crystals in the sensor head.

The Ro allowed set to th around

The crystal po position fe

Pos l the cry indirectly

tator Delay parameter defines the maximum amount of time

for the correct crystal to rotate into position. This should be e time it takes for the rotator to go from crystal #1 all the way

to crystal #1 again.

settings of the three remaining parameters required for automatic

sition control depend on the type of position control and

edback.

ition Control - The MDC-360 can be setup to either contro

stal position directly by interfacing to the rotator’s actuator or

by interfacing to a rotator controller.

Crystals parameter

Direct

Control of Pocket Position - Direct control means that the

DC-360 will control the actuator (rotator motor, pneumatic

va ired crystal into position. For

lve, etc.) directly to get the des

direct control, set the Control Parameter to Direct then selec

one of the following drive types and follow the instructions:

a. Un

idirectional Motor Drive - Select Up for the Drive

parameter. A relay output will be created called “SensorN Drive Up” that should be connected between the rotator motor and power supply.

b. Bi-

directional Motor Drive - Select Fast for the Drive

parameter. Two relay o

utputs will be created. One called “SensorN Drive Up” and one called “SensorN Drive Dn”. With this drive type, the MDC-360 will activate either the drive up or drive down outputs to get to the required crystal in the least amount of time.

d. Unidirectional Pneumatic Drive - Select Sngl Step or Dbl

Step for the Drive parameter. A relay output will be crea

ted called “SensorN Drive Up” that should be connected between the rot

ator’s pneumatic valve and power supply. With Sngl Step, the output will pulse once for one second to increment the rotator one position. With Dbl Step, the output will pulse twice for one second each to increment the rotator one position.

Indirect C

360 wi esired crystal position to a crystal rotator controller

ontrol of Crystal Position - Indirect control means that the MDC-

ll indicate the d through position select outputs. . The Drive parameter selects between the two following indirect position output formats:

a. Individual - With individual format, one output will be created for each crystal. So, if crystal 2 is the desired cry

4-8 PROGRAMMING AND CONTROLLER SETUP

stal, then the

MDC-360 DEPOSITION CONTROLLER

output “Senso N tal2r Crys ” will be true while all the other position outputs will b fa

e lse.

4.2.4.1

b. BCD - With BCD format , the MD to three outputs based on the number eight crystal sensor head will use three o the desire sta output desired crys n will be fa

EXAMPLE USING MAXTEK’S RSH-600 SIX CRYSTAL SENSOR HEAD

d cry l, all s will be false. If crystal four is the

tal, outputs o two will be true and output three

e and

lse.

C-360 will create from one

of crystals. For example, an

utputs. If crystal one is

The following is a list of the sensor parameter settings required to control Maxtek’s RSH-600 six crystal sensor head.

Number of Crystals - 6 Shutter Relay Type - None Control - Direct Drive - Sngl Step Feedback Type - Indiv Rotator Delay - 30 With the above parameter settings, the

MDC-360 will create six position feedback inputs called “SensorN CrystalX” where X ranges from 1 to 6. These inputs should be connected to the six position feedback pins o RSH-600 sensor head. Pin #1 of connector J1 on the sensor head sho

n the

uld be connected to the “SensorN Crystal1” input on the MDC-360. Pin #2 the sensor head should be connected to “SensorN Crystal2” on the M 360 and so on. Pin #7 on the sensor head should be connected to pin or any of the return pins w

hen using the standard 360 I/O board. When

using the 360 Active I/O board then pin #7 of the sensor head should b

DC-

#12

e connected to one side of a 115VAC source. The other side of the 115VAC source should be connected to the other side of the six position feedback inputs on the 360.

4.2.5

The or an inte control require

The fol program

INPUT, OUTPUT AND ACTION SETUP

MDC-360’s inputs, outputs and actions can be used to provide control for,

rface to all sorts of vacuum system peripherals such as PLC system

lers, substrate heaters, planetary rotators, etc. If your system doesn’t any special interfacing or control then you can skip to the next section.

lowing are a few examples of some typical uses for the MDC-360’s

mable I/O’s and actions.

Optical Monitor Termination - To setup the MDC-360 to terminate the

deposit on a signal from an optical monitor, the first step is to prog input that will be connected to an output in the op

tical monitor. Go to the

ram an

Program Inputs screen and select a blank input. Name the input “Optical

4-9PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Monitor” for future identification. Note the I/O card and the pin numbers of the input so you can later connect the input to the optical monitor.

xt, go to the Program Actions screen and select any action labeled “No

Action”. Press the right arrow key with the cursor on the action Nam parameter and select the TerminateDeposit action. Move the curs Conditions fi

eld and press the 0 key to add a condition. Move the cursor

or to the

down to the Input condition type, press the right arrow key, move the cursor onto the “Optical Monitor” input and press enter. Press enter agai to complete the condition string.

w, the MDC-360 will terminate the deposit whenever the “Optical

Monitor” input is set true by the optical monitor.

Sub

strate Heat Control - To create an output in the MDC-360 to switch on

and off a substrate heat controller, first go to the Program Outputs screen and select a blank output. Name the output “Substrate Heat” for future identification. Note

the I/O card number and the pin numbers of the output so you can later connect the output to the substrate heater controller.

Next, move the cursor onto the Conditions field and press the 0 key to add a condition. With th arrow key and select the state in which you would like the heater to

e cursor on the State condition type, press the right

first turn on. If you would like the heater on during more than the one state, then press the 5 key to add an or “|” symbol then press 0 to add the next desired state. Repeat this process until all of the states requiring substrate heat have been added to the condition. For example, if you would like substrate heat to start in the Predeposit Hold state and continue through t Deposit

1 state then your condition string would look like this “Predeposit

Hold|Deposit 1”.

With the condition string completed, the MDC-360 will set this output tr when ever it is in the selected states.

4.2.6 DISPLAY SETUP

The only parameter in the Display Setup menu that affects the controller’s function is the Pause On Layer Complete parameter. This parameter determines whether or not the controller will pause at the completion of each layer. When to Yes, the contro

ller will stop at the end of each layer and wait for a Start key

press before continuing. When set to No, the controller will immediately go the next layer.

4.2.7 MATERIAL SETUP

The

next step in the initial setup of the controller is to define the materials that

you of

wish to deposit. Because of its many features, the MDC-360 has a long list

mat t

erial parameters which at first can be overwhelming. Fortunately, the defaul

sett efine is disabled when

ings of most parameters are such that the feature they d

left at the default. This section will list the material parameters typically set for

4-10 PROGRAMMING AND CONTROLLER SETUP

set

MDC-360 DEPOSITION CONTROLLER

all materials and the parameters which must be set to utilize the different feature

he MDC-360. For a detailed description of any mate

of t rial parameter, go to

Section 4.3.2.1.

following is a list of the material parameters that

The are typically set when defining a new material:

cess Name - If you select a material from the default material library (pres

Pro s the

right arrow key from the material name parameter and press enter on the desired material) then the density and acoustic impedance for that material will be entered automatically. If your material is not in the library then yo

must enter the name, density and acoustic impedance.

Sensor input and crystal number - Defines the sensor and crystal number o

f the

sensor which will be used to monitor this material.

Source output and pocket number - Defines the source and pocket number of the

source that the material will be deposited from.

Tooling Factor - Used to correlate the controller’s rate and thickn

ess readings

with those on the substrates. This parameters is determined empirically.

Control loop parameters (Proportional Gain, Integral Time, Derivative Time).

The default settings for these parameters are a good starting point. Deposit Rate #1 - Defines the target deposit rate for the material. Maximum Power - Defines the maximum deposit power for the material. The above parameters are typically all that are needed to deposit the most basic

materials. I neglected. The following is a list of the more specialized features defin

f no other features are required then the remaining parameters can be

ed by the

material parameters. All of the features are disabled by default.

4.2.7.1 POWER RAMPS

Pow sed for source material conditioning prior to and after the

er ramps are u deposit states. A power ramp is defined by a ramp time, a ramp too po and a hold time before the next state. There are two power ramps avai

wer level

lable prior to and one after the deposit states. The first ramp prior to deposit is the soak and the second is the predeposit. If only one ram

p is needed prior to deposit then you should use the predeposit ramp. The power ramp after the deposit states is called the Feed.

The parameters used to define the three power ramps are as follows: Soak Power Ramp - Rise to Predeposit Power Ramp - Rise to Predeposit Time, Predeposit Power and Ram

Soak Time, Soak Power and Soak Time

to Feed Time

Feed Power Ramp - Ramp to Feed Time, Feed Power and Feed Time

4-11PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

4.2.7.2 AUTOMATIC CRYSTAL SWITC HING

To enable automatic Crystal switching upon failure, set the Crystal Fail paramete to Switch then set the Backup Sensor, Backup Tooling and Backup Crystal parameters to define the backup sensor and crystal.

4.2.7.3 RATE ESTABLISH

The rate establish feature is used in critical processes where it is important to establish the correct de

position rate prior to opening the source shutter and depositing on the substrates. To use this feature, the sensor head must be mounted in such a way that it is in the material vapor stream with the source shutter either opened or closed.

To enable this feature you must set the Rate Estab. Time and Rate Estab. Error parameters. Th

e Rate Establish Time parameter sets the maximum time that the controller will attempt to keep the rate error within the Rate Estab. Error limit for a period of five seconds. If the rate error condition is time then the controller will enter the deposit state. If not, then the process w

meet within the allotted

ill be

halted and a Rate Establish Error will be displayed.

4.2.7.4 RATE RAMPS

Rate ramping is typically used at the beginning of the deposition to ease the rate up slowly to prevent material spitting. Rate ramping is also used towards the end of the deposition to achieve a more accurate endpoint thickness. By slowing down the rate, the thickness overshoot caused by the delay of the shutter

closing

is diminished The MDC-360 has four rate ramps available. A rate ramp is defined by its R

amp

Start and Ramp Stop Thicknesses and the final rate. The rate

ramps are disabled by default with the Ramp Start and Ramp Stop

Thicknesses set to 999.9.

4.2.7.5 RATE SAMPLE MODE

Rate sample feature is designed for large deposition thicknesses where c

rystal life is a problem. . By sampling the rate periodically to maintain rate control, then closing the sensor shutter with the rate and power level constant, a large deposition thickness can be achieved with one crystal.

To enable the rate sample feature, set the Sample Dwell% parameter to the percentage of time you wish

the controller to sample the rate. Then set the Sample Period parameter to the time period of the sample and not sampling period.

4.2.

7.6 RATE DEVIATION ALARM

The MDC-360 provides three rate deviation levels to an alarm sound, or a process abort. The attention an momentarily triggered meaning they will sound when the error is exceede

4-12 PROGRAMMING AND CONTROLLER SETUP

trigger an attention sound,

d alarm sounds are

d and

MDC-360 DEPOSITION CONTROLLER

clear when within the limit. The process will abort when the abort level is

eeded and the power is at the maximum or minimum power. exc

4.2.8 PROCESS SETUP

The final step in the initial setup of the controller is to define the processes that

i you should complete the following steps:

you w sh to run. To define a process Select a blank process from the Select Process Screen. Please note that you can

also copy and modify a similar process to save time. Enter a process name in the Define Process Screen. Move the cursor onto the layer thickness parameter and e

nter the desired

thickness for the layer. Select a material for the layer by moving the cursor onto the material column,

pressing the right arrow key, moving the cursor onto the desired material for

the layer and pressing the Enter key. Repeat steps c&d until the process layers are co

4.2.9 STARTING A NEW PROCESS

To start a new process, the controller m

ust be in the Process Ready state. If not,

mplete.

press abort then reset. From the ready state, press the start key, move the cursor onto the desired process and press start again to start the process.

4.2.10 RESUMING A PROCESS FROM ABORT OR HALT

To resume an aborted process, first press the start key. A message will appea

r asking you to press the start key again to resume the process. The process will resume from the layer where the process was aborted starting in either the Rise to Soak or Rise to Predeposit power states. Once in deposit, the thickness will continue from the last value prior to the abort.

4.3 DETAILED PROGRAMMING

4.3.1 VIEW/EDIT PROCESS

Selecting View/Edit Process from the Main Menu will present the Select Process screen to delete, copy, view or edit any one of up to 99 processes.

To select a process for viewing and editing, move the cursor onto the desired process using the Up-arrow and D

own-arrow keys, then press the Enter key.

PROGRAMMING AND CONTROLLER SETUP

4-13

MDC-360 DEPOSITION CONTROLLER

02 Au 03 04 05 1 - Copy process 06 0 - Delete process 07

Figure 4-2 Select Process screen

4.3.1.1 DEFINE A PROCESS

Process Name Layer# Thickness Material >Sample < 001 0.500 Cr Edit 0000 002 1.350 View/Run 0000 003 0.000 004 0.000 End Layer 005 0.000 End Layer 006 0.000 End Layer

007 0.000 End La

Au End Layer

< Select Process: 01 >Cr

Figure 4-3 Define Process screen

Selecting a process will bring up the Define Process screen as shown in Figure 4-3. In this screen you enter all of the parameters that define a process. A process consists of a twelve-character name, two levels of passwords and finally a sequence of layers that makeup the process. Each layer consists of a material and the desired thickness for the layer. A process can have from 1 to 999 layers as long as the total number of layers in all the processes is not greater than 999. The following list describes all of the p rocess parameters:

Process Name (twelve character alphanum

eric field)

Each process is referenced by a twelve-character alphanumeric process name. You enter a process name using the alphanumeric keypad as described in ENTERING ALPH process name is displayed in the upper left

A CHARACTERS section 4.1.2. Please note that the active

-hand corner of all the status screens.

Edit Password (four character alphanumeric field) The Edit process password allows you to lock out other users

process unless the correct pa cursor onto the Edit passwor

ssword is known. To set this password, move the d field, type in your password then press the Enter

from editing a

key. A message will pop up asking for verification to change the password. Press

4-14 PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

1 to confirm and 0 to cancel the change. Each time you want to edit this proces you will be asked to enter entered, th

is parameter will not be displayed until the password has been entered

the correct password. Once a password has been

again. The default for this parameter is '0000'.

Please note that once the password has been changed, the process cannot be modified unless the correct password is entered so

you must remember your

passwords. View/Run Password (four character alphanumeric field)

The View/Run process password allows you to lock out other

users from viewing and/or running a process unless the correct password is known. To set this password

, move the cursor onto the Edit password field, type in your password then press the Enter key. A message will pop up asking for verification to change the password. Press 1 to confirm and 0 to cancel the change. Each time you want to view or run this process, you will be asked to enter this password. Please note that the view function of this password is ignored if the Edit Password is not set. Once a password has been entered, this parameter will not be displayed until the password has been entered again.

The default for this parameter is '0000'.

Please note that once the password has been changed, the process cannot be viewed or run unless the correct password is entered so you must remember your passwords.

Layer (000 to 999)

This column shows the layer number in the process. Please note that with the cursors on a layer number you ca

n copy or delete this layer.

Thickness (000.0 to 999.9) This parameter defines the desired thickness for the layer. The default for this

parameter is 0.000 Kang. Material This p

from the list of m aterial. Therefore, you should define See E n 4.3.2.

To se e materi

arameter defines the material for this layer. The layer material is s elected

aterials defined in View/Edit m

all of the necessary materials for the process before defining the process.

DIT MATERIAL PASSWORD sectio

lect a material, move the cursors to th al parameter for that layer and press the Right-arrow key. The Select Layer Material screen will be displayed as shown below. Scroll to the desired material and press Enter.

The layer material defaults to 'End Layer' meaning this layer marks the end of the process.

4-15PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Select Layer Material: 01 >Cr < 02 Au 03 04 05 06 07

Figure 4-4 Select Layer Material screen

4.3.2 VIEW/EDIT MATERIAL

From the Main Menu, selecting View/Edit Material w Material screen shown below.

ill present the Select

Select Material: 01 >Cr < 02 Au 03 04

1 - Copy m 0 - Delete material 07

05 aterial 06

elect Material screen Figure 4-5 S

4.3.2.1 DEFINE A MATERIAL

Selecting a material for viewing and/or editing will present the screen which permits the material to be defined, shows the first page of this screen. In this screen, you define al material parameters are described in detail below

l of the material parameters for the selected material. The

4-16 PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Material Name: >Cr < Sensor 1 Crystal 1 Source 1 Pocket 1 Density 07.20 gm/cm^3 Acoustic Impedance 28.95 gm/cm^2/sec

Figure 4-6 Define Material screen

1. Material Name (A ten character material name)

The material name parameter allows you to either use the keypad to type in a name, or pick a name from the materials already stored in the material library.

To pick parameter and press the Ri materials that are stored in the MDC-360. on ess Enter key. Once a material is chosen, the stored values for the density and acoustic impedance f entered into their respective param

a material from the material library, move the cursor to the material

ght-arrow key. This will display a complete list of

To pick a material, move the cursor

to that material and pr

or that material are automatically

eters.

2. Sensor# (1 to 4) This parameter defines the sensor input number that will be used for this material,

and cannot be greater than the number of sensor inputs fitted to the controller. Th default setting is 1.

3. Crystal# (1 to 8) This parameter defines the primar

parameter cannot be greater than the N

y crystal used to monitor this material. This

umber of Crystals parameter in the Sensor

Setup screen. . The default setting is 1.

4. Source# (1 to 4) This parameter defines the source output number that will be used for this

material, and cannot be greater than the number of source outputs fitted to the controller. The default setting is 1.

5. Pocket# (1 to 8) This parameter defines the pocket number that contains this material. This

parameter cannot be greater than the Number Of Pockets parameter in the Source Setup screen. The default setting is 1.

6. Density (0.80 to 99.99 gm/cm This par

ameter provides the material density so that the controller can calculate

and display the physical film thickness

)

. If the film density is known it should be

PROGRAMMING AND CONTROLLER SETUP

4-17

MDC-360 DEPOSITION CONTROLLER

used. A list of the more commonly used film densities is presented in Table 10-1. As a first approximation, bulk material density can be used in programming. Empirical calibration of this parameter is described in Section 10.6.1.

7. Acoustic Impedance (0.50 to 59 This parameter is the acoustic impedance of the material. The acoustic

impedance of the deposited film is required b accurately establish the sensor scale factor wh loaded. If the acoustic impedance of the film mater directly in units of 10 bulk material can be used and can be obt other source of acoustic data. The shear shear wave acoustic impedance can be c shear wave velocity and the density by using the following equation:

gm/cm2 sec. In most cas

.99 gm/cm

ained from The Handbook of Physics or wave impedance should be used. The alculated from the shear modulus or the

/sec)

y the MDC-360 in order to

en the sensor crystal is heavily

ial is known, it can be entered

es the acoustic impedance of the

AI C G=⋅= ⋅

Where: AI= Acoustic Impedance

= Density (gm/cm3)

C= Transverse (shear) wave velocity (cm/sec) G= Shear Modulus (dynes/cm2).

A list of the acoustic impedance and density of the more commonly dep materials is presented in Table 10-1 and this parameter is presented in Section 10.6.3.

In many cases and particularly if the s sufficient accuracy can be achieved by which is 8.83 X 10

8. Tooling Factor (10.0 to 499.9%) This parameter is the tooling factor for the primary sensor. The Tooling Factor

parameter is used to compensate for geometric factors in th which result in a difference between the rate on the sensing crystal. This param corresponds to equal rates at the substrate and at the sensing crystal. To a first approximation the tooling factor can be calculated using the following equatio

gm/cm2 sec.

ρρ

a technique for empirically determining

ensor crystal is not heavily loaded,

using the acoustic impedance of quartz

deposition rate on the substrates and the

eter is entered in percent units and 100%

osited

e deposition system

⎛ ⎞

⎟

⋅

100

where: dc= Distance from source to crystal.

4-18

PROGRAMMING AND CONTROLLER SETUP

Tooling

% =

⎝⎜⎠

MDC-360 DEPOSITION CONTROLLER

ds= Distance from source to substrate. Empirical calibration of the tooling factor is described in Section 10.6.2.

9. Proportional Gain (0 to 9999) This parameter is the proportional gain factor for the source power control loop.

10. Integral Time constant (0 to 99.9 sec) This parameter is the system time constant.

11. Derivative Time constant (0 to 99.9 sec) This parameter is the system dead time.

12. Rise To Soak Time (0 to 9:59:59) This parameter sets the time interval for the source power to ramp up from zero t

the power level set in Soak Power parameter. It should be long enough for the material to have time to reach equilibriu case of evaporation sources, protected from

m temperature without spitting, or in the

unnecessary thermal shock.

13. Soak Power (0.0-99.9%) This parameter defines the source power le

vel during the Soak state. The Soak Power should be established at a level which will assure that the source material i properly outgassed and prepared for subsequent deposition.

14. Soak Time (0 to 9:59:59) The Soak Tim

conjunction with the Soak Power to allow t

e parameter defines the time duration of the Soak state. It is used in

he material to fully outgas.

15. Rise To Predeposit (0 to 9:59:59) This parameter sets the time interval for the

source power to ramp from Soak

Power level to the Predeposit Power.

16. Predeposit Power (0.0 to 99.9%) This parameter defines the source power level during the Predeposit state. This

should be set as close as possible to the power level required to reach the desire deposition rate. The Manual mode can be used to conveniently determ Soak and Predeposit power levels of a parti

cular material.

ine the

17. Predeposit Time (0 to 9:59:59) This parameter defines the time duration of t

Time should be established at a value which allow brought to the deposit temperature level and Since evaporation will normally occur at th

he Predeposit state. The Predeposit

s the source material to be

stabilized in an orderly manner.

e Predeposit power level, too long a Predeposit Time will result in unnecessary buildup of material on the shutter and unnecessary material loss.

18. Rate Establish Time (0 to 99 seconds This parameter defines the time limit of the rate establish state.

state occurs before the deposit state and is us

)

The rate establish

ed to establish the correct source

4-19PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

power before the source shutter is opened. In the rate establish state the crystal shutter is opened, the source shutter is close source power to achieve the programmed ra

d, and the controller is controlling

te within the Rate Establish Error% for a period of 5 seconds. Once the rate has been held within limit for 5 seconds, the controller will go into the deposit state. If the rate error c the allowed percentage error for 5 seconds, then the contro

annot be held within

ller will display a Rate

Establish Error and the process will be halted. For the rate establish function to wor

the vapor stream of the source whil

e the source shutter is closed. The default

k, the sensor must be loca

ted somewhere in

setting for this parameter is 0 which disables this function.

19. Rate Establish E

This parameter sets a maximum limit for t

rr% (0 to 99%)

he rate establish error, which must not be exceeded for a five-second period during the rate establish state, in order for the controller to enter the deposit state.

20. Deposit Rate #1 (0.0 to 999.9

Å/sec)

This parameter defines the first deposition rate.

21. Ramp Start Thk #1 (0.000

to 9999.)

This parameter determines the thickness value to trigger the start of the fir s t rate ramp. A value of 999.9 will disable the rate ramp function. Please note that all the Ramp Start Thk parameters can also be u

sed as thickness setpoints for triggering

I/O events.

22. Ramp Stop Thk #1 (0.000 to 999.9) This parameter defines the ending thickness for rate ramp #1.

23. Dep

osit Rate #2 (0.0 to 999.9 Å/sec)

This parameter defines the second

rate.

24. Ramp Start Thk #2 (0.000 to 9999.) This parameter determines the thickness value to trigger the start of the second

rate ramp. A value of 999.9 will disable the rate ramp function.

25. Ramp Stop Thk #2 (0.0

00 to 999.9)

This parameter defines the ending thickn

26. Deposit Rate #3 (0.0 to 999.9 Å/sec) This parameter defines the third deposition rate.

27. Ramp Start Thk #3 (0.000 to 9 This parameter determines the thickness value to trigger the start of the third rate

ramp. A value of 999.9 will disable the rate ramp fun

28. Ramp Stop Thk #3 (0.000 to 999. This parameter defines the ending thickness for rate ramp #3.

29. Deposit Rate #4 (0.0 to 999.9 Å/sec)

4-20 PROGRAMMING AND CONTROLLER SETUP

ess for rate ramp #2.

999.)

ction.

MDC-360 DEPOSITION CONTROLLER

This parameter defines the fourth deposition rate.

30. Ramp

This parameter determines the thickness va

Start Thk #4 (0.000 to 9999.)

lue to trigger the start of the fourth rate

ramp. A value of 999.9 will disable the rate ramp function.

31. Ramp Stop Thk #4 (0.000 to 999.9) This parameter defines the ending thickness for rate ramp #4.

32. Time Setpoint (0 to 9:59:59) This parameter defines the time from the start of the layer until the time setpoi

event is triggered.

33. Ramp To Feed Time (0 to 9:59:59

)

This parameter defines the time allowed for the source power to go from the last deposition power to the Feed Power. The default for this parameter is zero.

34. Feed Power (00.0 to 99.9%) The Feed Power parameter defines the sour

ce power level during the feed state.

35. Feed Time (0 to 9:59:59) The Feed Time parameter sets the feed time. This parameter can also be used as a

delay between the deposit state and the idle state. The default for this parameter is zero which disables the feed function.

36. Ramp To Idle Time (0 to 9:59:59) This parameter defines the time allowed for the source power to go from the last

deposition power or feed power to the Idle Power. The default for this parameter is zero.

37. Idle Power (00.0 to 99.9%) This parameter defines the source power after the feed or deposit states until the

next Soak or abort state. If the idle power is greater than zero then the next layer using this source and pocket will start from the Predeposit state. If any subsequent layer uses the same source but a different pocket, the idle power will be automatically set to zero.

38. Maximum Power (00.0 to 99.9%) The maximum power parameter sets the maximum allowable source power for

this material. The deposition power will not be allowed to exceed this value.

39. Power Alarm Delay (0 to 99) This parameter sets the time

required for the deposit power to be at Maximum or

Minimum power before the alarm will be triggered.

40. Minimum Power (00.0 to 99.9%) This parameter sets the minimum power level for the minimum power warnings.

If the power is at or below this level during a deposit a Minimum Power attention warning will be given. If this condition remains true for longer than the time set

4-21PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

by the Power Alarm Delay parameter then a Minimum Power Alert warnin

g will

be given.

41. Rate Dev. Attention (00.0 to The rate deviation attention parameter sets the allowable percent devi

the deposition rate. If the dep during the deposition, than a r the Parameter/Status display. The default setting of

99.9%) ation from

osition rate deviates by more than this percentage ate deviation attention message will be displayed in

00.0% disables this function.

42. Rate Dev. Alarm (00.0 to 99.9%) This parameter sets the percent deviation from the deposition rate required to

trigger a rate deviation alarm. The default setting of 00.0% disables this functi

on.

43. Rate Dev. Abort (00.0 to 99.9%) The rate deviation abort pa

rameter sets the allowable percent deviation from the deposition rate. If the deposition rate deviates by more than this percentage and the deposit power is at the maximum or minimum power alert level then the process will be aborted. The default setting of 00.0% disables this function.

44. Sam

h Sample Dwell% parameter establishes the percentage of the Sample Time for

T e which the crystal is being sampled. Rat

ple Dwell% (000.0 to 100.0)

e sampling is used for high deposition thickness where crystal life is a problem. By sampling the rate periodically and setting and m

the power level to establish rate control, then closing the crystal shutter

aintaining the power level, a large deposition thickness can be achieved with one crystal. The primary sensor must have an individual shutter for the rate sample feature. The default for this parameter is 100% which enables sampling at all times.

45. Sample Period (0 to 9:59:59) The Sample Period parameter defines the sample period. For example, a sample

time of 5 minutes and a dwell of 40% will result in the crystal being sampled for 2 minutes, then the crystal shutter is automatically closed for the remaining 3 minutes while the deposition power is kept constant. Please note, once the crystal shutter has opened, there is a 5-second delay for crystal stabilization before

easuring.

46. Crystal Fail (Halt, Time Pwr, This parameter

defines the controller’s action in the event of a crystal failure. The

Switch)

options are to halt the process, finish the curre a backup crystal. Use the Enter key to cycle between the options.

47. Backup Sensor (1 to 4) This parameter defines the backup sensor input for the backup crystal. For a dual

sensor head, this parameter is set to 2 assuming sensor #1 However, for six crystal sensor head, th the Sensor# parameter and the Backup Crystal # parameter below would be set two. This is because the six crystal sensor head uses one sensor input to measu

4-22 PROGRAMMING AND CONTROLLER SETUP

nt layer on time-power, or switch to

is the primary crystal.

is parameter would be the same value as

MDC-360 DEPOSITION CONTROLLER

any of its six crystals while the dual sensor head uses two sensor inputs to measure either crystal.

48. Tooling #2 (10.0 to 499.9%) This parameter defines the tooling factor for the backup sensor head

49. Backup Crystal (1 to 8) This parameter defines the backup crystal number.

50. Material Passwor

for the material. If the password is set to anythi

d (4 digit string) This parameter defines the edit password

ng other than 0000 it will not be displayed, and when you attempt to edit the material you will first be asked to enter the correct password.

4.3.3 SYSTEM SETUP

Choosing the Edit System Setup option from the Main Menu screen will present the System Setup Menu options as shown in Figure 4-7. These options allow for setting up the controller to

interface with the vacuum system and are described

below.

System Setup: >Edit Display Setup< Program Inputs Program Outputs Progra Edit Sensor Setup Edit Source Setup

Edit Utilit

Edit DAC Setup

m Actions

Setu

Figure 4-7 System Setup Menu screen

4.3.3.1 EDIT DISPLAY SETUP

Selecting Edit Display Setup will present the Display Setup screen.

Display Setup Pause On Layer Complete >Yes< Thickness Graph Scale 3-digit Time To go Display Estimated Layer Thickness Vs. Time Graph Disabled Rate Vs. Time Graph Enabled Rate Dev. Vs. Time Graph Enabled

Figure 4-8 Display Setup Screen

PROGRAMMING AND CONTROLLER SETUP

4-23

MDC-360 DEPOSITION CONTROLLER

1. Pause On Layer Complete (Yes or No) This parameter determines whether the controller will pause between layers. If

his parameter is set to Yes then the controller will stop on layer complete and

t wait for a Start key press from the operator. If this parameter is set to No then the controller will automatically increment to the next layer.

2. Thk Graph Scale (2-digit, 3-digit) This parameter defines whether the rightmost 2 or 3 digits of thickness will be

graphed.

3. Time To Go Display (Estimated state, layer time or Elapsed process, la

ate time)

st This parameter defines the displayed value of the Time To Go display on the fr

panel. The choices are estimated state or layer time, or the elapsed process, laye

yer or

ont

or state time.

4. Thickness Vs. Time Graph (Enabled, Disabled) This parameter defines whether the thickness verses time graph is enabled as one

of the status screens.

5. Rate Vs. Time Graph (Enabled, Disabled) This parameter defines whether the rate verses time graph is enabled as one of the

status screens.

6. Rate Dev. Vs. Time Graph (Enabled, Disabled) This parameter defines whether the rate deviation verses time graph is enabled a

one of the status screens.

7. Power Vs. Time Graph (Enabled, Disabled) This parameter defines whether the power verses time graph is enabled as one of

the status screens.

8. Source/Sensor Status (Enabled, Disabled) This parameter defines whether the source/sensor status screen is enabled as one

of the status screens.

9. I/O

This p as one of the status

Note, raph will be displa

4.3.3.2 PROGRAM INPUTS

Status (Enabled, Disabled)

arameter defines whether the I/O status screen is enabled

screens.

if all six status screens are disabled, the Rate Vs. Time G

yed when the Status key is pressed.

The controller has ‘logical’ discrete inputs which are used when running a process, and ‘physical’ discrete inputs at the rear-panel connector pins which be associated arbitrarily by the user with the logical inputs using the Edit Program

4-24 PROGRAMMING AND CONTROLLER SETUP

can

MDC-360 DEPOSITION CONTROLLER

Inputs function. By itself a user defined input has no effect, it can only be use when its logical state is used as a condition for an

internal action, or an external

ful

action represented by the state of a discrete output. The controller provides for a maximum of 16 logical inputs. The 16 logical

inputs can be associated with up to 8 physical inputs with the single I/O card provided with the basic controller, and with up to 16 physical inputs if the secon

optional I/O card is installed.

A logical input (01 to 16) can be given a 16-digit name, and can be associated with a physical input by identifying the I/O card (1 or 2) and connector pin number (30 to 37, each of which also has a separate pin for the signal return which is displayed to the right of the Pin#). The input’s true level can also be defined for each input. An input defined as High true will be true when the input’s voltage is at or above

the high level for the particular I/O card installed.

The MDC-360 has two types of I/O cards available. The Passive I/O card, PN# 179206, has TTL level (0 to 5 volt DC) inputs. The Passive inputs are pulled up to 5 volts internally through a 4.7 K OHM resister and are set true, assuming the input’s True level is set to Low, by shorting the input pins together. The Ac I/O card, PN# 179239, has 12 to 120 volt AC/D set true, assuming the input’s true level i

s set to High, by supplying 12 to 120 volt

C inputs. The Active inputs are

tive

AC or DC across the input pins. Both cards have the same relay outputs.

Use the Main Menu, Edit System Setup, Program Inputs to display

the logical inputs, and the Up-arrow and Down-arrow keys to select the logical input. The Left-arrow and Right-arrow keys select the Input Name, True level, Card# and Pin# edit fields.

A 16-digit name can be assigned to the logical input. Pressing the Enter key on the True level column will toggle between High or Low true. Any entry other than 1 or 2 will be ignored for the Card#, as will a Pin# less than 30 or greater than 37.

The logical discrete inputs have two categories. One category contains logical inputs that are named and assigned by the user, the other category contains logical inputs that are automatically defined by the controller, such as those required for source and sensor position feedback, and these cannot be changed by the user.

When the controller defines inputs, it selects the blank names remaining in the logical input list and assigns them in sequence to the internally generated

nctions. For this reason, it is important that unused inputs are left blank, and

fu that there are sufficient inputs for

all required functions.

Inputs that are internally defined are discussed further in the source/sensor setup sections. Table 8-4 lists the input pin numbers.

4-25PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Input Input Name True Card Pin-Ret 1 >External Start < Low 1 30 12

2 Deposit pressure High 1 31 13 3 Over Pressure Low 1 32 14 4 Optical Monitor Low

1 33 15

5 Low 1 34 16 6 Low 1 35 17 7 Low 1 36 18

↓

4.3.3.3 PROGRAM OUTPUTS

The controller has ‘logical’ discrete outputs which are used when running a process, and ‘physical’ discrete outputs which can be associated arbitrarily by th user with the logical outputs using the Program Outputs function. Each physica discret on a controller back-panel connector, and these contacts will close

e output is in the form of a pair of relay contacts assigned to dedicated pins

when a the logical discrete output associated with the physical output satisfies a set of conditions defined by the user which are evaluated every 100 mS.

The controller provides for a maximum of 16

logical outputs. The 16 logical outputs can be associated with up to 8 physical outputs with the single I/O card provided with the basic controller, and with up to 16 physical outputs if the second optional I/O card is installed. Additionally, the controller has a relay output which is dedicated to the Abort function.

Use the Main Menu, Edit System Setup, Program Outputs to display the logical outputs, and the Up-arrow and Down-arrow keys to select the logical output.

A logical output (01 to 16) can be given a 16-digit name, and can be associated with a physical output by identifying the I/O card (1 or 2) and connector pin number (2 to 9, paired with 21 to 28, respectively, for the relay contacts).

The logical discrete output outputs that are name

s have two categories. One category contains logical

d and assigned by the user, the other category contains logical outputs that are automatically defined by the controller, such as those required for source and sensor rotator controls, and these cannot be changed by the user. These internally defined outputs are indicated by a condition string labeled “Internally Defined”

When the controller defines outputs, it selects the blank names remaining in logical output list and assigns them in sequence to the internally

generated

the

functions. For this reason, it is important that unused outputs are left blank, and that there are sufficient outputs for all required functions. Outputs that are internally defined are discussed further in the source/sensor setup sections.

Table 8-4 lists the output pin numbers.

4-26

PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Two screens are required to program the Discrete outputs. The first screen provides for selecting the output to be programmed, while the second screen provides for the actual programming, including the output name.

Selecting Program Outputs from the System Setup menu will present the Select Output screen.

Select Output: 01 >End of Process < 02 Wire feed Al 03 Layer Complete

06 07 to select 08

04 Procs Complete 05

↓

Figure 4-9 Select Output screen

electing an output with the Right-arrow or Enter key will present the screen

hich permits definition of the output, as shown below.

w The Le

the Ou e, car lds. A 16-digit na can be ssign for the

ft-arrow, Right-arrow, Up-arrow and Down-arrow keys provide access to

tput Nam d#, pin# and Condition string edit fie me

a ed to the logical input. Any entry other than 1 or 2 will be ignored

card#, as will a pin# less than 2 or greater than 9.

Output Name: Wire Feed Al 1 2 21 Condi

Valid ope Press 0 f n

Card# Pin#-Rt

tions :> Al & FeedHold

rators: 1=!, 2=(, 3=), 4=&, 5=| or conditio s, to validate.

Figure 4-10 Program Output Screen

The output con output. The output relay is closed when th Otherwise, per second (ev

dition string is a logical statement that determines the state of the

e condition string is evaluated as true.

the relay is open. Each output condition string is evaluated ten times

ery 100 milliseconds).

PROGRAMMING AND CONTROLLER SETUP

4-27

MDC-360 DEPOSITION CONTROLLER

4.3.3.3.1 ENTERING A CONDITION STRING

A condition st the logical op chosen from

ring comprises one or more individual conditions linked together by

erators ! NOT, & AND, | OR and parentheses ( ). Conditions are

a list. To enter a condition string correctly you must follow these

rules:

must be an equal number of closed and open parentheses.

There All conditions Condition strings To enter a conditio

The second line from parentheses. The

ondition string to the left of the cursor. To select a symbol, press the

must be separated by either the & or the | operator.

cannot end in an operator.

n string, first move the markers onto the condition string field.

the bottom of the screen displays the valid operators and

screen symbols will change depending on the contents of the

corresponding key number. In the example displayed, the bottom line tells yo that you press the “0” key to validate

While which hand s

Example: If you m

all the poss press the rig onto the d and add the sele

the string. A blank condition string is evaluated as false.

entering the condition string, pressing the “0” key will present a screen has a list of condition types at the left side. For the chosen type, the right-

ide of the screen displays a list of sub-conditions or a number entry field.

ove the marker of the left column onto the State condition type, a list of

ible states will appear in the right column. To select one of the states,

ht arrow key to move the marker to the right column. You then move

esired state and press enter. This will return you to the previous screen

cted state to the condition string. You can return to the left

column without selecting a state by pressing the L

select a condition or, the Enter key to finish and

eft-arrow key.

Condition >S Type: Event Start Layer I

Source Prede

Sensor Soak Rise Crystal Soak Hold

tate < >Process Ready <

nput Change Pocket Process Change Crystal Material Layer Ready

osit Rise ↓

Example: If you move the marker of the left column onto the Layer condition type, a

number field will arrow key to move the marker to the right

appear in the right column. To select layer #5, press the Right-

column. You then type the number 5

and press Enter.

4-28

PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Condition Input Type: Process Material Sensor Crystal

Pocket La

Source

er Number: >005<

4.3.3.3.2 CONDITION TYPES

States - State conditions are evaluated true whenever the controller is in the respective state. Controller States ar

e: Process Ready Start Layer Change Pocket Change Crystal Layer Ready Soak Rise Soak Hold Predeposit Rise Predeposit Hold Establish Rate Deposit 1 Rate Ramp 1 Deposit 2 Rate Ramp 2 Deposit 3 Rate Ramp 3 Deposit 4 Rate Ramp 4

eposit 5

amp To Feed

eed

PROGRAMMING AND CONTROLLER SETUP

4-29

MDC-360 DEPOSITION CONTROLLER

Ramp To Idle Layer Complete Process Complete

r ess Resume

P oc

Events - Event conditions are evaluated true whenever the respective event is true. C

ontroller Events are: Abort Halt Hold Time Power Ready In Process Simulate Time Setpoint Last Layer Crystal Failure Crystal Marginal Min Rate&Max Pwr Max Rate&Min Pwr Rate Dev. Alarm Rate Est. Error Source Fault Sensor Fault Rate Dev. Alert Max. Power Alert Min Power Alert Rate Dev. Atten. Max Power Atten. Min Power Atten.

Inputs - Input conditions are represented by the user defined programmable inputs. A condition is either true or false depending on the state of the input. Inputs are considered true when pulled to logic ground.

4-30 PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

Process - The process condition is evaluated true whenever the selected proce

ss is

the current process. Material - The material condition is evaluated true whenever the selected

material is the current material. Sensor (1-4) - The sensor condition is evaluated true whenever the current senso

equals the specified sensor. Crystal (1-8) - The crystal condition is evaluated true whenever the current

crystal equals the specified crystal. Source (1-4) - The source condition is evaluated true whenever the current source

equals the specified source. Pocket (1-8) - The pocket con

dition is evaluated true whenever the current pocket

equals the specified pocket. Layer (1-999) - The layer condition is evaluated true whenever the current layer#

equals the specified layer#.

4.3.3.4 PROGRAM ACTIONS

The MDC-360 provides for 16 internal user programmable actions. Internal actions are used to provide special functions at the true evaluation of a conditi string. These functions may be such things as terminating a deposit on an inpu from an optical monitor. Or, sounding an alar

m when certain events are true.

To program an action, first select the desired action from the list of 16 programmable actions displayed in

Actions: 01 Hold In State 02 Step From State 03 Sound Attention 04 Sound Alert 05 Sound Alarm

07 No Acti to select action 08 No Acti

06 > No Action <

the Actions screen.

on on

↓

Onc

e you have selected the required action, pressing the Right-arrow key will

pre

sent the screen which permits programming of the action details, and this

pro

cedure is similar to the one used for programming discrete outputs.

PROGRAMMING AND CONTROLLER SETUP

4-31

MDC-360 DEPOSITION CONTROLLER

Action Name: > < Conditions :

Valid operators: 1=!, 2=(, 3=), 4=&, 5=| 0= Add condition

to save

In this screen you select the predefined action you would like to take and the associated condit

ions. To specify an action, move the markers onto the action name field and press the Right-arrow key. This will present the Select Defined Action screen.

Select Defined Action: 01 >No Action < 02 Manual Power 03 Zero Thickness 04 Reset Controller 05 Abort Process 06 Halt Process 07 TerminateDeposit to select 08 Hold In State

his screen you can select a predefined action from the list by moving the

In t

sors onto the desired action and pressing Enter. The following is a list of the

cur

defined actions:

pre

Action - No action is taken. The default setting.

nual - Functionally identical to press

Ma ing Manual key.

↓

Zero - Functionally identical to pressing Zero key. Res

et - Functionally identical to pressing Reset key.

ort - Functionally identical to pressing Abort key.

Halt - Halts the process, sets active source power to idle, and leaves all other

source powers unchanged. Terminate Deposit - Triggers the final th

ign

ored if state is not a deposit state.

ld In State - Holds controller in current state.

Ste

p From State - Steps controller to next state.

4-32

PROGRAMMING AND CONTROLLER SETUP

ickness for the deposit state. Action is

MDC-360 DEPOSITION CONTROLLER

Sou

nd Attention - Triggers the attention sound and displays the "Attention

Act Parameter/Status display.

ion" message in the State/Trouble field in the

Sound Alert - in t

he State/Trouble field in the Parameter/Status display.

Sou

nd Alarm - Triggers the Alarm sound and displays the message "Alarm

Act

ion" in the State/Trouble field of the Parameter/Status display.

Sta ger the start of the currently selected process. This action is

rt Process - Trig

ignored tate.

unless the controller is in the Process Ready s

Select Pro S oce as th process to be started by the Start Proce de abo

Triggers the Alert sound and displays the "Alert Action" message

cess 1-8 -

ss action

elect pr

scribed

ss #1-8

ve.

e next

Switch Crystals - Toggles between the primary and the backup sensor/crystal combinatio efined b tiv al.

n d y the ac e materi

Once the action is selected then you need to establish when the action should take place by de ing its c str his is in the earlier section called Entering a Condition S

4.3.3.5 EDIT SENSOR SETUP

Selecting E Sensor ill he S Setup screen shown in Figure 4-11. In this screen you define the sensor param e controller needs to interface to the various types of sensors. Onc nsor setup is complete, the controller w create t ssar s and ts needed to interface to the defined sensors. To define a sensor, fi

fin ondition ing. T covered

tring.

dit Setup w present t ensor

eters that th

e the se

ill he nece y input

outpu

rst select the sensor number by using the Up-arrow and Down-arrow keys to position the cursor on the desired sensor num

ber. Once selected, the sensor is configured by selecting the appropriate

par

ameters from the right half of the display:

Sensor Setup: Number of Crystals >Sensor #1< Shutter Relay Type N.O Sensor #2 Control Sensor #3 Drive Up Sensor #4 Feedback Type No Feedback Rotator Delay(sec) 00

Manual

6 .

Figure 4-11 Sensor Setup Screen

1. Number of crystals (1 to 8

)

This parameter defines the number of crystals available for that sensor inpu t. F a single sensor head this would be set to one. For a dual sensor head with separate oscillators and sensor connections, this would still be set to one becau there is only one crystal for ea

ch sensor input. And, for a multiple rotary type

PROGRAMMING AND CONTROLLER SETUP

4-33

MDC-360 DEPOSITION CONTROLLER

sensor head, this parameter would be set to the number of crystals that the sensor will hold.

2. Shutter Relay type (N.O., N.C., None, Dual) This parameter defines the shutter relay type used to control the sensor shutter.

The following four relay types are available:

N.O. - Relay is normally open and closes to close shutter. For this type, a “SensorN Shutter” output will be created to interface to the shutter actuator.

N.C. - Relay is normally closed and opens to close shutter. For this type, a “SensorN Shutter” output will be created to interface to the shutter a ator.

ctu

None - No sensor shutter outpu

t is created.

Dual - Select this type for a dual sensor head. For this type, a “Dual Snsr1&2 Shtr” output will be created to interface to the shutter actuator.

3. Control (Manual, Direct, BCD This parameter defines the type o

, Indiv)

f crystal position control utilized.

Manual, as it implies, means not under control of the MDC-360. Under manual control, the MDC-360 will stop the process upon the comple layer when the next layer requires a differen

t crystal position. A message

tion of the current

prompting the operator with the number of the crystal required is displayed in the Parameter/Status window. Once the crystal has been changed, the process is resum

ed by pressing the Start key.

D and Indiv are used when control is through an external crystal rotation controller which accepts Bi clo

sures to select the crystal. The controller creates the number of outputs

req

uired to interface with the external controller and set the outputs as required to

sig

nal a crystal

Direct is used when the actuating device is dr

nary Coded Decimal inputs or Individual switch

iven directly. In this case the controller creates one or two outputs, one for each available direction, to drive a motor or solenoid.

4. Drive (Up, Down, Fast, Inline, Sngl Ste This parameter defines the drive method or direction for Dir

has an effect when Control type is set to Direct. The different settings are described below.

Up, Down, Fast and Inline - These four settings are typically used with multi-

crystal heads that use a motor to rotate the crystals into position. With Up selected, the controller will create one output called "SensorN Drive Up". Th

0 will activate this output to increment the sensor head up to the next

36 position. The down selection works the same except the output is called "SensorN Drive Dn". With Fast selected, the controller will create both a and a down output. The 360 will then determine the fastest direction to target crystal position by activating the appropriate output. The Inline drive type informs the contro

4-34 PROGRAMMING AND CONTROLLER SETUP

ller that continuous travel in one direction is not

p, Dbl Step)

ect control and only

n up

the

MDC-360 DEPOSITION CONTROLLER

possible. Therefore to get from position 6 to 1, the direction must be do

through 5, 4, etc. until 1 is reached.

SnglStep and Dbl Ste

used with multi-crystal sensor heads that are actuated valve. The 360 will create a "SensorX Drive Up" which is either singly o

p - Both the SnglStep and Dbl Step settings are typically

by pulsing a pneumatic

doubly pulsed to sequentially step the sensor head to the next position.

5. Feedback Type (Individual, BCD, Single Home, In Position, No Feedback) This parameter defines the type of feedback for a multiple sensor head. The three

feedback types available are as follows:

Individual - Individual position feedback. This feedback type uses one input for each crystal position in the sensor head. All inputs are normally false (open circuit) unless that crystal is in position then that input is true (closed to ground). For example, a six crystal sensor head would use six inputs. If crystal two was in position then all the inputs would be fa

lse except the input

connected to feedback position number two. BC

D - Binary Coded Decimal position feedback. This feedback type uses binary coding to indicate which crystal is in position. Inputs are num t significant bit first. For example, an eight crystal sensor head

bered mos would use three inputs. With crystal one in position, all inputs would be false. With crystal four in position, inputs one and two would be true and input three would be false.

Table of Input states for BCD feedback type.

Crystal number

Input BCD2

Input BCD1

Input

BCD0 1 OPEN OPEN OPEN 2 OPEN OPEN GND 3 OPEN GND OPEN 4 OPEN GND GND 5 GND OPEN OPEN 6 GND OPEN GND 7 GND GND OPEN 8 GND GND GND

SNGL HOME - Single home position feedback. This feedback type uses one input. The input is normally false (open

circuit) and should go true (closed to

ground) when crystal one is in position. IN POSITION - In position feedback. This feedback type uses one inpu

The input is normally false (open circuit) and sh

ould go true (closed to

ground) when the desired crystal is in position.

4-35PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

NO used.

FEEDBACK - No crystal position feedback is

6. Rotator 0 t ond This param s ere ions. If the feedback type is “None”

(Not recom nded. S ons nstallation section.) this parameter tells the control how lon t as the crystal is in position. If position feedback is provided, this parame the ler how long it should wait for the crys to reach t p befo es a Sensor Fault message.

4.3.3.6 EDIT SOURCE SETUP

Selecting E Source ill he S etup screen as shown in

Delay (

eter serve

o 99 sec

two diff

nt funct

me ee cauti in the I

ler g to wai suming

ter tells control

tal its targe osition re it issu

dit Setup w present t ource S Figure 4-12. In this screen you first select the source setup you wish to edit. To select a sou e Up-arrow an wn-arrow keys, then press the Rightarrow or E r key to

rce, use th

nte

Source Setup: Number of Pockets 6 Shutter Relay Type N.O. >Source #1< Shutter Delay (sec) 0.0 Source #2 Control Direct Source #3 Drive Up Source #4 Feedback Type Indv Pos Pocket Delay (sec) 10

select.

Source Volta

d Do

e 10V

Figure 4-12 Source Setup screen

Once selected, the source is configured with the following parameters located on the right side of the display:

1. Number of Pockets (1 to 8) This parameter defines the number of pockets, or crucibles, available for the

source. The default value is 1 for a single pocket source.

2. Shutter Relay type (N.O

., N.C., None)

This parameter defines the shutter relay type used to control the source shutter. The following three relay types a

N.O. - Relay is normally open and closes to close sh “SourceN Shutter” output will b ted to interfa

.C. - Relay is normally closed and open

N s to close shutter. For this type, a

ourceN Shutter” output will be create he shutter actuator.

“S d to interface to t

one - No sensor shutter output is created.

re available:

utter. For this type, a

e crea ce to the shutter actuator.

3. Shutter Delay (sec) (0.0 to 9.9 seconds) This parameter defines the amount of time allowed for the source shutter to close.

4-36

PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

4. Control (Manual, Direct, BCD, Indv) This parameter defines the type of pocket control utilized. Manual, as it implies, means not u

nder control of the MDC-360. Under manual control, the MDC-360 will stop the process upon the completion of the current layer when the next layer requires a different pocket. A message prompting the operator with the material required is displayed in the Parameter/Status window. Once the pocket has been changed, the process is resumed by pressing the Start key.

BCD and Indv are used when control is through an external pocket rotation controller which accepts Binary Coded Decimal inputs or Individual switch closures to select the pocket. The controller creates the number of outputs required to interface with the external controller and sets the outputs as required to signal a pocket change.

Direct is used when the actuating device is driven directly. In this case th controller sets up one or two outpu

otor or solenoid.

5. Drive (Up, Down, Fast, Inline, Sngl Step, Dbl

ts, one for each available direction, to drive a

Step)

When the Control type is Direct, this parameter defines the drive method or direction. For Sngl Step and Dbl Step dr output which is either singly or

doubly pulsed to actuate a solenoid to sequentially

ive types, the controller sets up one

step the rotator to the desired position. For Up and Down drive types, the controller sets up one output to control a drive motor which is turned on until the rotator reaches the desired position. For Fast and Inline drive types, the controller sets up a drive up and a drive down output. For the Fast drive type, the controlle determines the fastest direction to the target pocket position and turns on the appropriate output. The Inline drive type, informs the controller that continuou

s travel in one direction is not possible. Therefore to get from position 6 to 1, the direction must be down through 5, 4, etc. until 1 is reached.

The controller creates on

e or more of the following outputs depending on the

type:

Drive Up Drive Down Step

6. Feedback Type (Individual, BCD, Single Home, In Position, No Feedba

ck)

This parameter defines the type of feedback for a multiple pocket source. The three feedback types available are as follows:

Individual - Individu

al position feedback. This feedback type uses one input for each pocket position in the source. All inputs are normally false (open circuit) unless the respective pocket is in position then that input is true (closed to ground). For example, a six pocket source would use six inputs. If pocket two was in position then all the connected to feedback p

osition number two.

inputs would be false except the input

4-37PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

BCD - Binary Coded Decimal position feedback. This feedback type uses binary coding to indicate the pocket position. Inputs are numbered most signi

ficant bit first. For example, an eight pocket source would use three inputs. With pocket one in position, all inpu four in position, inputs one and two would be

ts would be false. With pocket

true and input three would be

false. SNGL HOME - Single home position feedback. This feedback type uses one

input. The input is normally false (open circuit) and should go true (closed to ground) when pocket one is in position.

IN POSITION - In position feedback. This feedback type uses one input. The input is normally false (open circuit) and should go true (closed to ground) when the desired pocket is in position.

NO FEEDBACK - No pocket position feedback is used.

Table of Input states for BCD feedback type.

Pocket Number

Input BCD2

Input BCD1

Input

BCD0 1 OPEN OPEN OPEN 2 OPEN OPEN GND 3 OPEN GND OPEN 4 OPEN GND GND 5 GND OPEN OPEN 6 GND OPEN GND 7 GND GND OPEN 8 GND GND GND

7. Rotator Delay (0 to 99 seconds) This parameter serves two different functions. If the feedback type is “None”

(Not recommended. See cautions in the Installation section.) this parameter tells the controller how long to wait, on the assumption the pocket will get into position. If position feedback is provided, this parameter tells the controller how long it should wait for the pocket to reach its target position before it issues a Source Fault message.

8. Source Voltage (2.5V, 5.0V, 10V) This parameter sets the upper voltage range for the source control output. The

lower voltage range is always 0. For example, selecting 10 for this parameter sets the source control voltage range from 0 to 10 volts.

4-38 PROGRAMMING AND CONTROLLER SETUP

MDC-360 DEPOSITION CONTROLLER

4.3.3.7 EDIT DAC SETUP

Se p from menu will present the

lecting Edit DAC Setu

DA allow eter and its signal range

C Setup screen which

the Edit System Setup

s selection of the param

for each of the two DACs.

DAC Setup

DAC Output #1 DAC Scale #1 DAC Output #2 Power DAC Scale #2 2 Digit

>Rate < 2 Digit

Figure 4-13 DAC Setup Screen

1. DAC Output (Rate, Rate Dev., Power, Thickness) One of four system control parameters is chosen for the DAC output. The default

setting is Rate for DAC #1 and Rate Deviation for DAC #2.

2. DAC Scale (2-digit, 3-digit) Either the two least significant, or the three least significant, digits of the chosen

control parameter are used to represent full scale for the DAC output.

4.3.3.8 EDIT UTILITY SETUP

Selecting the Edit Utility Setup from the Edit System Setup menu will present the Utility Setup screen. Figure 4-14 shows the first page of this screen. All parameters are described below.

Utility Setup Crystal Freq. 6.0 MHz Simulate mode On Interface address 01 (1-32) Attention Volume 01 (0-10) Alert Volume 01 (0-10) Alarm Volume 01 (0-10) Data Points

min 60 ppm ↓

Figure 4-14 Utility Setup screen

1. Xtal Freq. (2.5, 3.0, 5.0, 6.0, 9.0, 10.0 MHz)

PROGRAMMING AND CONTROLLER SETUP

4-39

MDC-360 DEPOSITION CONTROLLER

This parameter determines the uncoated crystal frequency type for all sensor inputs. The default setting is 6.0 MHz.

2. Simulate Mode (On, Off) This parameter enables or disables the Simulate mode of the controller. The

Simulate mode is used for process testing and differs from the Normal mode only to the extent that the Thickness and Rate displays are derived from a simulated sensor input rather that the actual sensor. While in this mode, the simulated thickness build- up is directly proportional to the displayed power level and independent of actual thickness on the sensor. The Simulate mode allows the total deposit process to be simulated. It also allows the tooling factor, density and acoustic impedance calculations to be conveniently checked and altered at the end of the run, if necessary.

3. Interface Address. (1-32) This parameter sets the controller’s computer interface address for the RS-485

and IEEE-488 interfaces.

4. Attention Volume (0-10) This parameter sets the volume of audio attention sound. Attention sounds

indicate that the controller is waiting for an operator response or action before continuing the process. A setting of zero disables audio attention sound.

5. Alert Volume (0-10) This parameter sets the volume of audio alert sound. Alert sounds indicate that a

material alert level has been exceeded. A setting of zero disables audio alert sounds.

6. Alarm Volume (0-10) This parameter sets the volume of audio alarm sound. Alarm sounds indicate that

a material alarm level has been exceeded. A setting of zero disables audio alarm sounds.

7. Data Points/Min (30,60,120,300,600 PPM) This parameter sets the number of run-time data point sets per minute that will be

written to the process log. The default is 600 data points/minute. During a process, data is logged automatically up to 10 data point sets per minute. At this rate the 27,000 data point storage can hold 45 minutes of data. To allow for longer processes, you can change the number of data point sets stored per minute. The following table shows the approximate storage time based on the number of data points per minute parameter. Press the ‘Enter’ key to cycle between options. This parameter is only visible when the data logging option is installed.

PROGRAMMING AND CONTROLLER SETUP 4-40

MDC-360 DEPOSITION CONTROLLER

Data Points/Minute Aprox. Storage Ti

(minutes)

30 900

60 450 120 225 300 90 600 45

8. Time (00:00-23:59) This parameter sets the system time. Time is entered in 24-hour format without a

digit separator “:”. For example, to enter 1:05 PM you must enter “1305”. This parameter is only visible when the data logging option is installed.

9. Date (01/01/00-12/31/99) This parameter se ts the system date in month/day/year format. The complete date

must be entered without the digit separator “/” character, and with two digits for each of the month, day and year. For example, to enter 5/2/94, you must enter “050294”. Th

is parameter is only visible when the data logging option is installed.

PROGRAMMING AND CONTROLLER SETUP

4-41

MDC-360 DEPOSITION CONTROLLER

5. OPERATING THE MDC-360

5.1 SIGN-ON SCREEN

At power-on the Parameter/Status display will present a screen which details the controller configuration, and all LEDs will be illuminated. The figure below shows the configuration for a basic MDC-360 with a single Source/Sensor card, a single Discrete I/O card and an RS-232 interface installed. Please refer to Sections 2, 3 and 4 for a detailed description of the MDC-360 resources and how to use them before attempting to operate the controller.

At this point, with the sign-on configuration information on the LCD screen and all LED’s illuminated, pressing any key mo the Abort mode. Within the illuminated key pad group, only the red LED behind the Abort key pad will now be illumina

umerical LEDs will contain a 0-9 valun

reen will depend on what was being displayed when power to the controller was

sc last turned off.

Press the Reset key to put the controller into the Reset state in preparation for a process-run.

mentarily will put the controller into

ted. Each digit position of the process-run

e. The information displayed by the LCD

Maxtek MDC-360 Software Version x.x

Source/Sensors Cards 1 Installed Discrete I/O Cards 1 Installed RS-232 Computer Interfa Data Log Storage

Press any key to continue.

ce Installed Not Installed

Figure 5-1 Sign-on screen

5.2 STARTING A NEW PROCESS

Pressing the Start key while the controller is in the Ready state will present the screen shown below. A run number is provided to help correlate process information with a specific process run. The run number can range from 1 to

9999. It is incremented at the start of each process. At 10,000 the run number will roll over to 1.

OPERATING THE MDC-360

5-1

MDC-360 DEPOSITION CONTROLLER

Start Process: 01 >Sample < 02 Starting Layer: 001 03 Run Number : 0001 04 05 06 Press Start to start 07 or Reset to cancel. 08

Figure 5-2 Run Process Selection Screen

From this screen you can change the starting layer number and run number, if required, using the arrow keys to position the edit cursors, and can then select the process to start by positioning the cursors on the desired process name, which then becomes the ‘current’ process. To actually start the process just press the Start key again. The controller will then scan the total process def

inition and the condition of the system, and if everything appears to be in order will start the process.

If at this point an error message is presented by the LCD screen, it is likely that there is a problem somewhere with either the system configuration and/or the value of a system parameter which will prevent the process from running correctly. Use the details of the error message as an indication of the co action that should be taken. Press the Abor

e Reset key, and then make the necessary changes.

5.3 STARTING A NEW LAYE

The Start k also used to start individual layers when the controller is set up for manual r sequencing. The contr pt the operator to press the Start key to ext layer.

5.4

he Start key is also used to resume an aborted or halted process. Pressing the

ey is

laye oller will prom

start the n

RE ING AN ABORTED O ALTED PROCESS

SUM R H

t key to abort the process start, then

rrective

Start key while the controller is in abort or halt mode will bring up the following prompt. Note that the green LED behind the Start key is illuminated, indicating that the process is resumable. Otherwise, the controller has to be reset, and th

process has to be started over.

Press Start to resume process

ollow the prompt to resume the process.

5-2 OPERATING THE MDC-360

or Reset to cancel.

MDC-360 DEPOSITION CONTROLLER

5.5 STATUS DISPLAYS

There are six different run time status screens that can be displayed at any time pressing the Status key (providing they have each been enabl

ed using Edit

Display Setup). The first key press will bring up the last viewed status screen, repeatedly pressing the Status key will cycle through the six status screens, show below.

Displays the current

rocess name.

Displays the current material name.

Sample Cr Process Ready 10 R a t e

0 1

Figure 5-3 Rate vs. Time Graph

Sample Cr Process Ready 20 R D a e t v 1 e %

Figure 5-4 Rate Deviation vs. Time graph

Sample Cr Process Ready 999 T h i c k 0 1

Figure 5-5 Thickness vs. Time Graph

OPERATING THE MDC-360

5-3

MDC-360 DEPOSITION CONTROLLER

Sample Cr Process Ready 5 P o w e r % 0 1

Figure 5-6 Power vs. Time Graph

Sample Cr Process Ready

Source Status Sensor Status Src# Pckt# Power Snsr# Xtl# Health 1 1 23. 2 1 10.0 2 1 99 3 1 10.0 3 1 99 4 1 10.0

7 1 1 95

4 1 99

Figure 5-7 Source/Sensor Status screen

Sample Cr Process Ready Input State Output State 01>Name F F< 02 F F 03 F F

F F 04 05 F F 06 F F

Figure 5-8 I/O Status Screen

5.6 VIEWING RESULTS

The MDC-360 has an optional Internal Data Storage capability that provides internal storage of real time run data. Stored data can later be viewed through th four status graphs

or can be downloaded to a PC for permanent storage and/or

review.

5-4

OPERATING THE MDC-360

MDC-360 DEPOSITION CONTROLLER

The data log option provides storage for up to 16 process logs and/or 27,000 data point sets of real time run data. A process log consists of the process name, run number, starting time and date, ending time and the completion status of the run. The process logs are stored in a sta

ck such that newest process is at the top of the stack and the oldest process is at the bottom of the stack. The start of the next process will push all of the logs down one position on the stack.

The last or 16th

process log on the stack will be lost. A data point set consists of the measured deposit rate, rate deviation, thickness

and the deposit power. The 27,000 data point sets are stored in a circular buffer such that new data will overwrite the oldest data. If data from the current process overwrites an older process than that entire process will be erased. If data from the current process tries to overwrite the start of the current process then data logging is stopped so that the beginning of the process is saved.

During a process, data is logged automatically up to 10 data point sets per minute. At this rate the 27,000 data point storage can hold 45 minutes of data. To allo for longer processes, the user has the ability to change the number of data poin sets stored per minute. The parameter to modify is ca

lled Data Points/Min and

can be found in the Utility Setup menu. The following table shows the total storage time based on the number of data points per minute ter.

parame

Data Points/Minute Ap e Time

rox. Storag

(minute

30 900

60 450 120 225 300 90 600 45

To view a stored process log select the View Results option from the Main Menu. This will prese shown 5 screen any of the 1 ected f or vie . Note screen is only av

nt a screen with the process log in Figure -9. From this

6 process logs can be sel wing that this

ailable if the Internal Data Storage and Time/Date Clock option

installed.

OPERATING THE MDC-360

5-5

MDC-360 DEPOSITION CONTROLLER

Process Name Run# Time Date >Sample Sample 0001 09:54 01/23/95

0002 12:05 12/28/ <

Stat

94 Normal

Aborted

Figure 5-9 View Results Screen

This screen displays the process name, run number, starting time and date and the status. The status can be either running, normal, aborted or overrun. Overrun means that this process overran itself within the data store.

To select a process log for viewing, just move the cursors onto the desired proces and press the Enter or the Right-arrow key. Please note that you cannot view a process log while in-process.

Once a process has been selected, the screen will ch

ange to the rate vs. time graph shown in Figure 5-10. The logged data will be plotted for the first layer of the process. Plotting the data may take from 5 secon seconds or more for long layers with a lot of data. Please note that while the

ds for short layer to up to 15

data is being plotted the controller will not read any key presses. When the data has been plotted the layer number will be displayed in the upper right hand corner of the screen. At this point you can press the Status key to switch be

tween the four

graphs. You can also enter a different layer number to view another layer.

Displays the current

rocess name.

5-6

OPERATING THE MDC-360

Displays the current

er material name.

Sample Cr Lyr>001< (001-999) 10 R a t e

0 1

Displays the current

er number.

Figure 5-10 Rate vs. Time Process Log Graph

press the Left-arrow key. To return to the process log,

Displays the process

er range.

MDC-360 DEPOSITION CONTROLLER

5.7 MODES

Modes are conditions which the controller can occupy. Some modes are indicated by the LED’s behind the operating keys. Other modes are displayed in the top right hand corner of the status display (Refer to Figu

re 5-3). These controller

modes are described below.

5.7.1 PROCESS READY

The Process Ready Mode indicates the MDC-360 has been reset and is awaiting a Start key

press. The yellow LED behind the Reset key, when illuminated,

indicates that the controller is in Process Ready Mode.

5.7.2 ABORT

The Abort mode is indicated by a red LED behind the Abort key as well as t flashing

of all of the numeric LED displays. In Abort Mode all displays and

operating keys, with the exception of the Start and Reset keys, are inoperative. All source control outputs are forced discrete outputs are forced to open circuit. In addition, if the controller initiate the abort then the condition which caused the abort will be displayed in the top right hand corner o

f the Parameter/Status display. Exit from Abort Mode requires

to zero, the Abort relay is closed and all

either a Reset or Start key press. See also Section 5.4 for resuming an aborted process. Refer to Table 5-1 for condition w

hich causes an abort.

5.7.3 HALT (SOFT ABORT)

In Halt all I/O is frozen. If power is above Soak level, it is ramped down to Soak at the Predeposit ramp rate. If Power is constant. The user has the option to resume from Halt or press Reset and star over. See also Section 5.4 for resuming a halted process. Refer to Table 5-1

at or below the Soak level it is held

t for

conditions which cause the process to halt.

5.7.4 IN PROCESS

The green LED behind the Start key, when illuminated, indicates the controlle

r is

in the In-Process Mode.

5.7.5 NOT SAMPLING

This mode indicates that the sensor crystal is shuttered from the source and that the deposition rat

e is established using the last power level. Sampling mode is set by two material parameters, Sample Dwell % and Sample Period. Refer to Section 4 # 44 and # 45 for a de

5.7.6 PROCESS COMPLETE

.3.2.1 scription of Sample Mode.

This mode indicates that the selected process has run to completion. A Process Complet age is displayed in th

e mess e top right hand corner of the status display. In addition, an attention warning will sound. The controller remains in this mod until a reset signal puts it into the Process Ready mode.

OPERATING THE MDC-360

5-7

MDC-360 DEPOSITION CONTROLLER

5.7.7 MANUAL

This mode is indicated by the red LED behind the Manual key. In this mode the control voltage output is controlled through the Remote Power Handset. For a detailed description of this mode, re

5.7.8 SIMULATE

This mode simulates rate and thick

fer to Section 3.5.

ness build-up by simulating the sensor input rather than the actual sensor. Refer to Section 3.4 for more information on the Simulate Mode.

5.8 STATES

Figure 5-11 shows the different s

tates that make up a complete deposition cycle, such as Rise to Soak, Rise to Predeposit, etc. The controller moves from state to state as the deposition progresses.

5.9 TROUBLE, ERROR A

Troubles are controller conditions which in most case are indicative of problems or errors, but may be just warnings. Thes hand corner of the status screen (See Figure 5-3).

In addition,

there are three levels of audible warnings associated with the trouble conditions, Attention, Alert and Alarm. Table 5-1 lists the messages and warning levels. The list is arranged in descending than one warning level is triggered, the higher level has priority. An asterisk in the Clear co

lumn indicates the warning sound will clear when the condition clears. Any key press will also clear the sound. The action column indicates what if any action is taken as a result of the

Messages Type Clear Action

Min Rate&Max Power Alarm Abort Max Rate&Min Power Alarm Abort System Setup memory corrupted Alarm Halt Process memory corrupted Alarm Halt Material memory corrupted Alarm Halt Rate Est. Error Alarm Halt Crystal Failure Alarm/Attn NO/* Halt Source Fault Alarm Halt Sensor Fault Alarm Halt Time Power Alarm Time/Power Rate Dev. Alarm Alarm * Alarm Action Alarm

Crystal Marginal Alert/Attn NO/* Rate Dev. Alert Alert * Max power Alert Alert * Min power Alert Alert *

5-8 OPERATING THE MDC-360

ND WARNING MESSAGES

e messages are displayed in the top right

order of priority. In the event that more

trouble.

Warning

MDC-360 DEPOSITION CONTROLLER

Alert Action Alert * Xtal Fail Switch Attention Crystal

Switch

Xtal Mrgn Switch Attention Crystal

Switch Rate Dev. Atten Attention * Max power Attention * Min power Attention * Change source # X to (material name)

Attention Hold and press Start to continue. Change sensor # X to crystal # X

Attention Hold and press Start to continue. Attention Action Attention * Press Start to resume process. N/A Start to continue. Attention * Hold Table 5-1 Trouble Conditions and Warnings

5.9.1 DESCRIPTION

Each of the messages is described below.

5.9.1.1 MIN RATE&MAX POWER

This message indicates that the output power is at the maximum power level set by the Maximum Power parameter and the rate deviation is below the limit value set in the Rate Dev. Alarm parameter. When this happens, the controller will go into the Abort mode and the Alarm will sound.

5.9.1.2 MAX RATE&MIN POWER

This message indicates that the output power is at the minimum power level set by the Minimum Power parameter, and the rate deviation is above the limit value set by the Rate Dev. Abort parameter. When this happens, the controller will go in Abort mode and the Alarm warning will sound.

5.9.1.3 SYSTEM SETUP MEMORY CORRUPTED

The integrity of the System Setup Memory has changed since the last time a system parameter was modified. Each one of the sub menus and its parameters has to be checked and corrected as necessary to fix this problem.

5.9.1.4 PROCE

SS MEMORY CORRUPTED

The integrity of the selected process has been changed since last time the process was modified. Each one of the process parameters has to be checked and corrected as necessary to fix this problem.

OPERATING THE MDC-360

5-9

MDC-360 DEPOSITION CONTROLLER

5.9.1.5 MATERIAL MEMORY CORRUPTED

The integrity of the selected material has been changed since last time the material was modified. Each one of th

e material parameters has to be checked

and corrected as necessary to fix this problem.

5.9.1.6 RATE EST. ERROR

The controller is unable to establish the programmed rate within the time specified in the Rate Establish Time parameter. The rate is considered esta

blished

when it stays within the Rate Establish Error % for 5 seconds.

5.9.1.7 CRYSTAL FAILURE

This condition indicates lack of a valid signal from the sensor, and generally results from a failed crystal but may also indicate problems in the crystal mounting or the in

terconnection between the sensor and the controller. If the primary crystal fails and the process is not in deposit state, the Attention warning will sound. If the backup crystal fails and the process is not in the deposit stat

the alarm will sound and the process will be halted.

5.9.1.8 SOURCE FAULT

This condition indicates that the correct source pocket position feedback has not been achieved within the time set by the Rotator Delay parameter (Source Setup Menu).

5.9.1.9 SENSOR FAULT

This condition indicates that the correct crystal position feedback has not been achieved within the time set by the Rotator Delay parameter (Sensor Setup Menu).

5.9.1.10 TIME POWER

This message is displayed when the controller is completing the current layer based on the last power and rate. This occurs in the event of a crystal failure without a backup.

5.9.1.11 RATE DEV. ALARM

The deposition rate error is greater than the rate deviation value set in the Rate Deviation Alarm parameter.

5.9.1.12 ALARM

ACTION

This message indicates the Alarm sound was initiated by an internal action.

5.9.1.13 CRYSTAL MARGINAL

The sensor crystal in use is poor in quality. If the crystal is the backup one, the Alert warning will sound when the process is in deposit state. If the primary crystal is in poor quality then the Attention will sound.

5-10 OPERATING THE MDC-360

MDC-360 DEPOSITION CONTROLLER

5.9.1.14 RATE DEV. ALERT

The deposition rate deviation is greater than the value set in the Rate Deviation Alert parameter.

5.9.1.15 MAX POWER ALERT

Indicates that the power output level has been at the Maximum Power level longer than the time period set in the Power Alert Delay parameter.

5.9.1.16 MIN POWER ALERT

Indicates that the power output level has been at or below the Minimum Power level longer than the time period set in the Power Alert Delay parameter.

5.9.1.17 ALERT ACTION

This message indicates the Alert sound was initiated by an internal action.

.9.1.18 XTAL FAIL SWITCH

This message indicate ensor input has been switche kup cryst on, n war nds.

d to the bac al. In additi the Attentio ning sou

s the primary crystal has failed and the s

Press any key to clear the sound.

5.9.1.1 ITCH

9 XTAL MRGN SW

This message indicates the primary crystal is marginal and the sensor input has been stal. I ddition, the

switched to the backup cry n a Attention warning sounds.

Press any key to clear the sound.

5.9.1.20 RATE DEV. ATTEN

The deposition rate deviation error is greater than the value set in the Rate Deviation Attention parameter.

5.9.1.21 MAXIMUM POWER

The output power is being limited by the value set in the Maximum Power parameter.

5.9.1.22 MINIMUM POWER

The output power is at or below the minimum power set by the Minimum Power parameter.

5.9.1.23 CHANGE POCKET...

Prompts the operator to switch the source pocket to the correct position. The process will be on hold until the Start key is pressed. There is no message if the Control parameter is set to Auto (Source Setup Menu).

OPERATING THE MDC-360

5-11

MDC-360 DEPOSITION CONTROLLER

5.9.1.24 CHANGE CRYSTAL...

Prompts the operator to switch the sensor to the correct crystal position. The process will be on hold until the Start key is

ontrol parameter is set to Auto (Sensor Setup Menu).

pressed. There is no message if the

5.9.1.25

This message indicates the Alert sound wa by an ction.

ATTENTION ACTION

s initiated internal a

5-12 OPERATING THE MDC-360

MDC-360 DEPOSITION CONTROLLER

Figure 5-11 Typical Process Profile

OPERATING THE MDC-360

5-13

MDC-360 DEPOSITION CONTROLLER

6. TUNING THE MDC-360 CONTROL LOOP

6.1 Control Loop Basics

If evaporation rate were a function of source power alone, a rate controller would not be necessary. One would establish the power required to achieve the desired rate, set the power at that point and that would be that. In control system parlance, this is called “Open Loop” control.

Unfortunately, evaporation rate is a function of many variabl

es. With E-gun sources, rate is affected by material level, water cooling temperature, beam position, sweep pattern, etc. With filaments and boats, ra

te is affected by material level, boat or filament condition, power line voltage, power losses in cables, connections, transformers, switches, etc. Even when sputtering under the conditions of constant power and constant pressure, rate is affected by target condition.

So, if we want to achieve a known and constant rate, we need a rate controller. The rate controller c

ompares the measured rate with the desired rate and attempts to keep them equal by adjusting the command signal to the power supply. This is called “Closed Loop” or feedback control.

The most common example of feedback control is a car and driver. The car is

the “Plant”. It is controlled by pedal pressure and steering wheel angle. Its output is direction and speed. The driver is

irection and speed and adjusts pedal pressure and steering wheel angle to achieve

e direction and speed he/she desires. If we hold the controls steady and close

th our eyes, no feedback, then our control If the road is very straight and ther road for crosswi

e is no wind, “no disturbances to the plant”, we can sometimes stay on the

a pretty good distance. If the road is rolling or we have a good

nd, the time we can stay on the road in open loop control can be pretty

the “Controller”. The driver monitors the

is open loop.

short indeed. If the controller is slow and

sluggish, i.e. a drunk driver, the difference between the desired speed and direction can be very different from the speed and direction desired. The driver can be all over the road, speeding up, slowing down, etc.

If the controllers gain is too high, typical of a young person’s first driving experience, the response to an error is both slow and too great and the car careens from one side of the road to the other. This control “System” would normally go completely unstable and crash if control were not assumed by a different controller.

In the case of a young driver with a little more experience under his/her belt, th

e response speed has improved but the gain is still a little high. The vehicle stays pretty well in control but there is a lot of steering wheel action. We say this controller is “

When we go from one vehicle to a different in size or weight, we find at first. That is because we are learning the characteris

oversteering”.

nother, especially if the vehicles are very

that we must really con

centrate on our driving

tics of the “Plant”. As

Tuning the MDC-360 Control Loop

6-1

MDC-360 DEPOSITION CONTROLLER

soon as we’ve learned them, we know what we have to do to correct for errors and we are back in good control. In other words the controller must compen

sate

for the characteristics or the “Plant”.

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION

In the deposition control loop the vacuum system and evaporation supply make up the plant. The output, deposition rate, is controlled by the source control volta which establishes the source power. If all pl predefine the characteristics of the control plants vary widely, in their gain, linearity, response

ants were the same we could

ler for optimum control. Unfortunately,

, noise and drift.

The question we are going to address here is how the controller control voltage, the “command signal”. The MDC utilizes a type 1 control l

adjusts the source

oop. A type 1 control loop does not require a continuous error to achieve a non zero control voltage.

Many controllers utilize a type 0 control loop. In this type of loop the source control voltage output is determined by multiplying the rate error by the Proportional gain. For any given non zero outpu

t the error required to achieve the necessary output is inversely proportional the to gain. High gain, low error, low gain, high error. This would seem to call for high gain. Unfortunately, the

higher the gain the higher the chance of instability. We may go unstable before we get the error down to where we want it.

In the MDC, the proportional gain parameter sets the rate at which the control voltage changes in response to an error signal. Any error in the rate causes th source con

trol voltage to ramp to a new value. When the source control voltage

increases or decreases to the correct value, the value required to achieve the desired rate, the error goes to zero and the output remains constant.

The Derivative Time constant is utilized to compensate for slow sources such as boats and induction heated sources. Like a large truck, these sources take time to get up to speed and to stop. The Derivative Time constant looks at the rate of change of the error. If the error is decreasing rapidly we better take our foot off the gas or we are going to overshoot our target. If the error is decreasing, but decreasing very slowly, we need to goose it to get up to speed. The Derivative Time constant instructs the controller on how much attention to pay to the rate of change of the error. A value of zero tells the controller to ignore the rate of change of the error. A large value tells the controller that this source is slow and is going to be hard to get going and hard to stop. So if the rate starts to fall off, give it power, or if we’re quickly approaching the target, begin to decrease the power.

The Integral Time constant is used to keep the thickness profile on schedule. We may have no rate error right now, so if we were not concerned about the thickness profile, we would be happy and leave everything as it is. However if we are trying to stay on a thickness profile, stay on schedule as it were, we may want to speed up or slow down a little bit to make up for previously lost, or gained time. For example, suppose our desired speed is 50 mph and that’s the speed we are traveling. However we’ve been traveling for exactly an hour and we’ve only

6-2 Tuning the MDC-360 Control Loop

MDC-360 DEPOSITION CONTROLLER

gone 48 miles because of some traffic earlier on. Our Integral error is 2 miles. If we want to get back on schedule we need to speed up a bit. If schedule is very important to us, we will speed up a lot to get back on schedule fast. If schedule is not important at all we will maintain our speed. The Integral Time constant instructs the controller on how much attention to pay to the schedule. If we don’t care what happened in the past and we want zero rate error right now, we don’t want any Integral feedback. To accomplish that we set the Integral Time constant to its maximum value, which tells the controller to ignore any past error unless it lasts for a very long.

6.3 ESTABLISHING MDC-360 CONTROL LOOP PARAMETERS

As explained above, the MDC utilizes three control loop parameters referred to as PID parameters; Proportional gain, Integral Time constant and Derivative Time constant to provide for optimization of the control loop. The MDC provides default values for each of these parameters.

Default and Range for PID Parameters

Parameter Minimum

Proportional gain 1 9999 1000

Integral time constant,

sec.

Derivative time constant

sec.

value

Maximum

value

Default

value

0 99.9 99.9

0 99.9 0.0

Tuning the MDC-360 Control Loop

6-3

MDC-360 DEPOSITION CONTROLLER

The following table lists some recommended PID values for different types of deposition sources. These values repres cases may not need to be further modifi

ent a good starting point and in some

ed.

Suggested PID Starting Values for Different Sources

Parameter Electron

Beam Gun

Filament

Boat

Proportional gain 2000 600

Integral time constant,

99.9 99.9

sec.

Derivative time constant

25.0 75.0

sec.

In the MDC-360, the PID parameters are defined at the material level because different materials often require different PID settings even though they may be deposited from the same source. Therefore it is usually necessary to establish the PID parameters for every each material and deposition source.

The first step in setting the PID parameters for a new material or source is to enter the recommended starting values listed above. Be sure and choose the PID values for the type of source you're using. Next, create a dummy process with the first layer set for the new material. Start and abort the dummy process to load the new material as the active material. You should now see the material's name in the top line of any Status Screen. Next, open the shutter and put the 360 in the manual power mode and adjust the source power using the remote handset to establish the power ramp parameters. Set the Predeposit Power level at or slightly below the power needed to get the desired deposition rate.

With the power ramp parameters defined, the next step is to start the dummy process to see how well the 360 controls the rate. If the rate is too high or low when the shutter opens then make a note to go back and adjust the Predeposit Power level. Watch the rate graph and the power display. If the rate is different from the target rate then you should see the 360 adjust the power attempting to achieve the target rate. If the rate is close to the target, then you should temporarily change the rate to see how the 360 reacts. Ideally the 360 will adjust the power so that the rate goes right to the target rate without overshooting it. If it does then no further adjustments are necessary.

If it seems like the 360 is reacting too slowly, press the Program key to get back to the material screen and increase the Proportional Gain parameter. Begin with changes of about 10 to 20%. Changes of this magnitude are a good starting point because they are large enough to show the effect of the parameter and small enough that you won't greatly overshoot the ideal setting. Remember that too much Proportional Gain will make the system unstable and too little will make the 360 slow to react. An unstable system is evident by the rate oscillating around the target value. A general rule of thumb is the faster the source, the larger the Proportional Gain. And conversely, the slower the source the smaller the Proportional Gain.

6-4 Tuning the MDC-360 Control Loop

MDC-360 DEPOSITION CONTROLLER

With the Proportional Gain at an acceptable value, the next step is to adjust the Derivative Time if necessary. Disturb the system again by changing the target rate. Watch the rate graph as the rate approaches the target. If the rate overshoots the target then increase the Derivative Time and change the target rate again to see the effect. Repeat these steps slowly increasing the Derivative Time until the rate goes right to the target without overshoot.

In very slow systems such as large filament boats, the Proportional Gain parameter may have to be set so low to maintain stability where the rate smoothly levels off but remains below the target value. In this case you will need to adjust the Integral Time parameter. This parameter works in reverse meaning the smaller the value the larger the effect. So, slightly decrease this parameter then watch the rate graph. The rate should ramp up to the target without overshoot. If the ramp takes too long then slowly decrease the Integral Time again and repeat these steps until you are satisfied with the control.

Tuning the MDC-360 Control Loop

6-5

MDC-360 DEPOSITION CONTROLLER

7. INPUT/OUTPUT CHARACTERISTICS

The following section describes the electrical characteristics of the MDC-360 inputs and outputs. All outputs are updated and inputs are sampled every 100 msec. In order to insure immunity to transients, inputs are not considered to have changed until the same input state is obtained on two successive input samples.

For this reason all input signals must have a minimum duration of at least 0.2 sec. Input signals lasting less than 100 msec. will be ignored while signals lasting between 100 and 200 msec. may or may not be recognized.

7.1 SOURCE CONTROL VOLTAGE OUTPUT

For maximum noise immunity, each two-terminal control voltage output pair is isolated from controller ground. Either terminal can be grounded within the user system, so the output can provide either a negative or positive output voltage range. In the event that the receiving equipment has an isolated input, one of the two lines should be grounded to avoid excessive voltage buildup on the otherwise isolated circuitry.

The voltage output range can be programmed (see Source Setup) for 2.5, 5.0 or 10 volts full scale. The output impedance is nominally 100 ohms. The outputs are short circuit protected with short circuit current limited to between 20 and 40 milliamps, though the outputs should not be short-circuited for long periods. The schematic appears in Figure 7-5.

CAUTION

Long term shorting of any of the Source outputs may cause excessive temperature rise in the isolated power supply and should be avoided.

7.2 SENSOR INPUT

The sensor oscillator is connected through a single coaxial cable. Sensor ground is common with the MDC-360 ground. Power to the sensor oscillator is carried on the center conductor of the coaxial cable. Power is supplied from the MDC360 internal 5 volt supply through a 50 ohm resistor which accomplishes the dual function of properly terminating the 50 ohm coaxial cable and providing short circuit protection. The sensor buffer circuit is shown schematically in Figure 7-4.

7.3 DISCRETE OUTPUTS

Each Discrete Output is an isolated, independent, normally open relay output connected to one pin pair on the output connector. See Table 8-4 for pin signal assignments.

7.4 DISCRETE INPUTS

The Input circuit for the Passive I/O card

is shown in

INPUT/OUTPUT CHARACTERISTICS

7-1

MDC-360 DEPOSITION CONTROLLER

Figure 7-1. The Passive inputs are activated by shorting the input’s pins together. The inputs are internally pulled up to 5 vdc through a 4.7 Kohm resistor and incorporate a 10 millisecond filter to enhance noise immunity and provide protection from a momentary short.

The Input circuit for the Active I/O card is shown in Figure 7-2. The Active inputs are activated by supplying 12 to 120 volt AC or DC across the input pins. The inputs incorporate a 10 millisecond filter to enhance noise immunity and provide protection from a momentary short.

Pin assignments are shown in Table 8-4.

7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS

Both of the DAC Analog outputs are single-ended and share the MDC-360 common ground, although a separate ground pin is provided for each of the two DAC outputs. The nominal output voltage range is 0 to 5.0 vdc and the output impedance is 10 Kohm nominal. The DAC analog output circuit is shown in Figure 7-3 and Table 8-2 provides pin assignments. Refer to Section 4.3.3.7 for instructions on setting up the DAC parameters.

7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS

The DAC Control inputs are single-ended and share a common ground with the MDC-360. The inputs are activated by connecting them to ground through a jumper, mechanical switch or transistor. In the open state, the inputs are pulled up to 5 volts through a 4.7 Kohm resistor. The DAC control input circuit is shown in

Figure 7-1. Refer to Figure 8-3 and Table 8-1 for pin assignments and connector rating. The circuitry is located on the Main Processor board.

INPUT/OUTPUT CHARACTERISTICS 7-2

MDC-360 DEPOSITION CONTROLLER

Figure 7-1 Passive Input Buffer circuit

INPUT/OUTPUT CHARACTERISTICS

7-3

MDC-360 DEPOSITION CONTROLLER

Figure 7-2 Active Input Buffer Circuit

INPUT/OUTPUT CHARACTERIS

TICS 7-4

MDC-360 DEPOSITION CONTROLLER

Figure 7-3 DAC Output circuit

INPUT/OUTPUT CHARACTERISTICS

7-5

MDC-360 DEPOSITION CONTROLLER

Figure 7-4 Sensor Input Buffer circuit

INPUT/OUTPUT CHARACTERIS

TICS 7-6

INFICON MDC-360 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1.2.1 EXTENSIVE PROGRAM STORAGE

1.2.2 DYNAMIC MEASUREMENT UPDATE RATE

1.2.4 PROGRAM SECURITY

1.2.5 DESIGNED FOR UNATTENDED OPERATION

1.2.6 FAIL SAFE ABORTS

GENERAL DESCRIPTION 1-1

1.2.7 ABORT STATUS RETENTION

1.2.8 RUN COMPLETION ON CRYSTAL FAILURE

1.2.9 POWERFUL SYSTEM INTERFACE

1.3.4 PROGRAM STORAGE CAPACITY

FRONT PANEL DISPLAYS AND CONTROLS

2.1.6 TIME TO GO

3.2 INITIAL POWER UP

BENCH CHECKOUT & INSPECTION

3.3.1 MATERIAL #1 PARAMETERS

3.3.2 MATERIAL #2 PARAMETERS

3.6 INSTALLING OPTION BOARDS

3.6.2 DISCRETE I/O BOARD

3.6.3 IEEE-488 OPTION BOARD

3.7 DIGITAL TO ANALOG CONVERTER (DAC) CHECKOUT

4.1.1 NAVIGATING THE MENU STRUCTURE

4-1PROGRAMMING AND CONTROLLER SETUP

4.1.3 ENTERING TIME PARAMETERS

4.1.4 COPYING AND DELETING

SENSOR SETUP

EXAMPLE USING MAXTEK’S RSH-600 SIX CRYSTAL SENSOR HEAD

INPUT, OUTPUT AND ACTION SETUP

4.2.9 STARTING A NEW PROCESS

4.3.3.3.1 ENTERING A CONDITION STRING

5.2 STARTING A NEW PROCESS

OPERATING THE MDC-360

5.7.3 HALT (SOFT ABORT)

5.9.1.15 MAX POWER ALERT

5.9.1.16 MIN POWER ALERT

.9.1.18 XTAL FAIL SWITCH

ATTENTION ACTION

6.1 Control Loop Basics

Tuning the MDC-360 Control Loop

6.2 CONTROL LOOPS APPLIED TO VACUUM DEPOSITION

6.3 ESTABLISHING MDC-360 CONTROL LOOP PARAMETERS

7.1 SOURCE CONTROL VOLTAGE OUTPUT

7.2 SENSOR INPUT

INPUT/OUTPUT CHARACTERISTICS

7.5 DIGITAL-TO-ANALOG CONVERTER OUTPUTS

7.6 DIGITAL-TO-ANALOG CONVERTER CONTROL INPUTS