Huawei Honor U8860 Maintenance Manual

U8860

Maintenance Manual

Issue

1.1

Date

2012-4-25

HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.1 (2012-4-25)

Huawei Proprietary and Confidential

i

No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address:

Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China

Website:

http://www.huawei.com

Email:

support@huawei.com

U8860 Maintenance Manual

About This Document

Issue 1.1 (2012-4-25)

Huawei Proprietary and Confidential

ii

Author

Prepared by

R & D

Date

2011-11-12

Reviewed by

Maintenance support engineer

Date

2011-11-14

Approved by

Service representative

Date

2011-11-14

Date

Version

Change Reason

Revised Chapter

Description

Author

2011-11-12

V1.0

Released the first issue.

R&D

2012-4-25

V1.1

upgrade

9

Add pictures

Maintenance support engineer

About This Document

Change History

U8860 Maintenance Manual

Contents

Issue 1.1 (2012-4-25)

Huawei Proprietary and Confidential

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Contents

About This Document .................................................................................................................... ii

1 Product Introduction .................................................................................................................... 1

1.1 Appearance ....................................................................................................................................................... 1

1.2 Specifications ................................................................................................................................................... 1

2 Applicable Scope and Precautions ............................................................................................ 4

2.1 Applicable Scope .............................................................................................................................................. 4

2.2 Maintenance Precautions .................................................................................................................................. 4

2.3 How to Obtain Product and Maintenance Information .................................................................................... 4

3 Explosive View .............................................................................................................................. 5

4 Components on PCBA ................................................................................................................. 7

5 Software Upgrade ....................................................................................................................... 13

5.1 Upgrade Preparation ....................................................................................................................................... 13

5.2 Normal Upgrade ............................................................................................................................................. 13

5.3 Troubleshooting .............................................................................................................................................. 14

6 Maintenance Tools ...................................................................................................................... 15

7 Disassembly Procedure .............................................................................................................. 17

8 Assembly Procedure ................................................................................................................... 25

9 Principles and Troubleshooting ............................................................................................... 28

9.1 Block Diagram and Phone Introduction ......................................................................................................... 29

9.2 Baseband Unit ................................................................................................................................................ 33

9.2.1 Power-on Management Circuits ............................................................................................................ 33

9.2.2 Charging Management Circuits ............................................................................................................ 41

9.2.3 Clock Circuit ......................................................................................................................................... 43

9.2.4 Flash Memory Circuit ........................................................................................................................... 44

9.3 RF Unit ........................................................................................................................................................... 44

9.4 Peripheral Circuits .......................................................................................................................................... 47

9.4.1 Display .................................................................................................................................................. 47

9.4.2 Keypads ................................................................................................................................................ 50

9.4.3 Vibration ............................................................................................................................................... 51

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9.4.4 Call Reception ....................................................................................................................................... 52

9.4.5 Call Transmission .................................................................................................................................. 53

9.4.6 Headset .................................................................................................................................................. 55

9.4.7 SIM Card ............................................................................................................................................... 58

9.4.8 I/O Connector........................................................................................................................................ 60

9.4.9 microSD Card Connector ...................................................................................................................... 61

9.4.10 Camera ................................................................................................................................................ 63

9.4.11 BT&Wi-Fi ........................................................................................................................................... 65

9.4.12 Accelerometer ..................................................................................................................................... 68

9.4.13 Compass .............................................................................................................................................. 70

9.4.14 Gyroscope ........................................................................................................................................... 72

9.4.15 Touchscreen ........................................................................................................................................ 73

9.4.16 Approach Sensor ................................................................................................................................. 76

10 Functional Tests......................................................................................................................... 79

10.1 Keys ............................................................................................................................................................. 79

10.2 MMI Test ...................................................................................................................................................... 80

10.3 Voice Call Test .............................................................................................................................................. 82

11 Solder Points on the PCB and BGA Chip............................................................................. 83

12 PCBA Layout .............................................................................................................................. 88

U8860 Maintenance Manual

1 Product Introduction

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1.1 Appearance

Item

Description

Dimensions (H x W x D)

122 mm x 61.5 mm x 10.9 mm

1 Product Introduction

1.2 Specifications

U8860 Maintenance Manual

1 Product Introduction

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Item

Description

Technical standards

WCDMA/HSDPA/HSUPA: 3GPP FDD Release 7

Bands

WCDMA: 2100 MHz/900 MHz GSM: 850 MHz/900 MHz/1800 MHz/1900 MHz

Weight

About 140 g with battery installed

Appearance

Bar type mobile phone

Antenna

Built-in

SIM/USIM

Standard 6-pin SIM card, supporting 1.8 /3 V USIM card

Charger

5 V, 1 A

Battery

1930 mAh

Standby time: 380 hours (3G) Talk time: 400 minutes (3G)

Camera Primary camera

8 MP AF HD

Secondary camera

0.3 MP FF

Display

Resolution

854 x 480 pixels (FWVGA)

Type

TFT-LCD

Color

16 M

Size

4.0 inch

Ports

Charger port

Micro-USB port

USB port

Micro-USB port

microSD card slot

microSD card slot (up to 32 GB)

Headset jack

3.5 mm

Bluetooth

V2.1 + EDR

Wi-Fi

802.11 b/g/n, supporting Wi-Fi

USB

USB 2.0, 480 Mbit/s

FM radio

Built-in FM radio

GPS

GPS/AGPS/GPS XTRA

Storage space

ROM: 4 GB (the available space is about 2.5 GB); RAM: 512 MB (the available space is about 300 MB)

Maximum transmit power

WCDMA 2100 MHz/900 MHz: +24 dBm (Power Class 3) GSM 850 MHz/900 MHz: +32.5 dBm (Power Class 4) GSM 1800 MHz/1900 MHz: +29.5 dBm (Power Class 1) EDGE 850 MHz/900 MHz: 26 dBm (±3 dBm) EDGE 1800 MHz/1900 MHz: 25 dBm (±3 dBm)

U8860 Maintenance Manual

1 Product Introduction

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Item

Description

Static sensitivity

WCDMA 900 MHz: better than -103.7 dBm/3.84 MHz WCDMA 2100 MHz: better than-106 dBm/3.84 MHz GSM 850 MHz: better than -102 dBm/200 KHz GSM 900 MHz: better than -102 dBm/200 KHz DCS 1800 MHz: better than -102 dBm/200 KHz PCS 1900 MHz: better than -102 dBm/200 KHz

Temperature

Operating temperature: –10 °C to +45 °C (when the phone is not being charged) Storage temperature: –40°C to +70°C

Humidity

Operating humidity: 5% to 95% RH

U8860 Maintenance Manual

2 Applicable Scope and Precautions

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2 Applicable Scope and Precautions

ESD is the major cause of damages to electrostatic-sensitive components, so every service center must pay high attention to avoid ESD discharge and comply with the ESD protection requirements of this manual.

2.1 Applicable Scope

This document provides maintenance instructions for technicians at service centers authorized by Huawei. This service manual is confidential and can be accessed by authorized service sites or companies only. Although every effort has been made to ensure the accuracy of the document, errors may still exist. If you find any error or have any suggestions, please contact Huawei's customer service center.

2.2 Maintenance Precautions



Only qualified technicians are allowed to perform the repair and calibration.



Perform all operations in electrostatic discharge (ESD) rooms and wear electrostatic wrist straps throughout the operations.



Ensure that all the components, screws, and insulators are properly installed after repair and calibration. Ensure that all cables and wires are installed and connected correctly.



Ensure that the soldering is lead-free and compliant with the environmental-friendly requirements.

2.3 How to Obtain Product and Maintenance Information

To obtain relevant product and maintenance information, you can visit Huawei website at

http://www.huaweidevice.com/cn/technicaIndex.do

U8860 Maintenance Manual

3 Explosive View

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No.

Description

Quantity

1

U8860 touchscreen protective film

1

2

U8860 touchscreen

1 3 U8860 receiver decorating items

1

3 Explosive View

List of components in the explosive view

Note: The components listed in the following table are structural parts of the phone, and cannot be used as reference when applying for spare parts.

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3 Explosive View

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No.

Description

Quantity

4

U8860 cover A assembly

1 5 U8860 main FPC

1

6

U8860 receiver

1 7 U8860 front camera

1 8 U8860 main PCB

1 9 U8860 speaker

1

10

U8860 battery

1

11

U8860 battery cover

1

12

U8860 test point protection jacket

1

13

U8860 screws

6

14

U8860 cover B assembly

1

15

U8860 rear camera

1

16

U8860 LCD shielding film

1

17

U8860 microphone

1

18

U8860 LCD module

1

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4 Components on PCBA

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4 Components on PCBA

U1001 headphone jack damage

results in charging failure.

J1502 IO connector-Mini USB type B socket

damage results in

charging failure and data communication failure.

MIC601 MIC damage

results incall transmission

failure.

X701 crystal oscillator-

24.576 MHz damage

results in LPA (Low

power audio) failure and power-on failure.

U1701 NAND FLASH-

4GB EMMC damage

results in power-on failure

and software failure.

X401 crystal oscillator-19.2 MHz damage results in power-

on failure.

U4201 Single Band 2.4 GHz WLAN/Bluetooth 2.1/FM single chip -BCM4329 damage

results in Bluetooth, WiFiand

FM failures.

U4104 RF switch-0.5~3.0 GHz

damage results in Bluetooth

and WiFi failures.

X4101 crystal oscillator -37.4

MHz damage results in

Bluetooth, WiFiand FM failures.

U4001 WCMDA/GSM dual mode RF transmission and reception(QTR8615) damage

results in RF failure and audio

failures.

X402 crystal oscillator-

0.032768 MHz damage results

in power-on failure.

U301power management chip

(PM8058) damage results in

power-on failure.

U4003 LED Driver

damage results in LED

backlight failure.

U203 Switching Regulators damage

results in power-on

failure.

U6002 RF low noise amplifier damage results

in GPS failure.

U2001 audio amplifier

damage results in audio

failure.

U5002 RF low noise amplifier

(receive diversity) damage

results in weak

W2100MHz signal.

U5003 SAW filter-

2140MHz (receive

diversity) damage results

in weak W2100MHz signal.

J1302 BTB connector

damage results in power-

on failure, touchscreen failure, motor vibrating failure, speaker soundless, and approach light failure.

U6001 SAW filter

damage results in GPS

failure.

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J3201~J3203 master

antenna contacts

damage results in RF

failure.

U3201 RF connector

damage results in RF

failure.

U3501 RF power module and GSM PA

damage results in

GSM transmission

failure and GSM no registration.

J1201 FPC connector

damage results in

display failure.

U201

WCDMA/GSMdual

mode baseband processor MSM8255T

damage results in

power-on failure, system breakdown, and

RF failure.

U3302 RF power module -1920~1980 MHz

damage results in

W2100 MHz

transmission failure.

U3202 RF switch

damage results in RF

failure.

U3301 SAW filter1950 MHz damage

results in

W2100 MHz

transmission failure.

U3900 Switching

Regulators damage

results in power-on

failure.

J1501 card holder connector-battery socket-3PIN damage

results in power-on

failure.

J1601 SIM card holder damage results

in SIM card failure.

U3304 duplexer - RX: 2110~2170 MHz/TX: 1920~1980 MHz-1.9dB

failure results in

W2100 MHz transmission and recept ion failure.

Z4201 ceramic filter

damage results in

Bluetooth and WiFi

damage.

U3404 duplexer- TX: 880~915MHz/RX:925~ 960MHz damage

results in W900 MHz

transmission and recept ion failure.

J1602 MicroSD card holder damage results

in microSD card failure.

U3402 RF power failure -880 MHz ~

915 MHz damage

results in W900 MHz

transmission failure.

U1401 semiconductor sensor-Accelerometer -

LGA-3 axis damages

result in gravity

sensing failure.

U1402 semiconductor sensor-electronic compass damages

result in compass

failure.

U2101 semiconductor sensor-3 axis

gyroscopes

damages result in

degree rotation sensing failure.

J6003 RF connector

damage results in GPS

failure.

J1902 BTB connector and primary camera interface damages

result in primary

camera failure.

MIC2001 microphone

damage results in low

or noisy transmitted

voice.

U1102 LED flash driver IC damage

results in camera flash

failure.

J1301 headphone connector - 3.5 mm

damage results in

headphone failure.

J1901BTB connector and front camera

damages result in front

camera failure.

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4 Components on PCBA

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Power key damage results in

power-on failure.

Volume key damage

results that volume

cannot be adjusted by pressing volume key.

Approach light sensor damage

results in ambient light and

approach light sensing failure.

BTB connector damage results

in power-on failure, touchscreen

failure, motor vibrating failure, speaker soundless, and approach light failure.

Flash damage results in flash

function failure.

Touchscreen BTB

connector damage results

in touch panel failure.

Motor damage results

in vibration failure.

Speaker connection

point damage results in

speaker failure.

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4 Components on PCBA

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BOM Code

Description

Bit

15040208

Transient voltage suppression diode-6.8 V-11.4 V-75 W-7 A-SOT-363

D1301, D1601

15040238

Transient voltage suppression diode-6 V-14 V-10 W-12 A-SOD882/0402

D1501

15020099

Lighting diode-0.045 cd-White-25 mA-0603, SMD

D1502, D1503, D1504, D1505

15010251

Schottky diode-30 V-0.2 A-0.5 V-SOD523

D2001, D4001

19040121

Fast Blowout Fuse-32 V-2 A-IEC Spec-0.03 ohm-0.100 A*A*Sec-UL/CSA/ANSI 248 Certificated

F1501 14090079

FPC connector -27pin-0.6 mm-0.3 mm-horizontal-0.2 mm

J1201

14240246

Headphone Connector, 3.5 mm, 6 pin, Side plugging, SMT, Mid Mount, 1.85 mm Height from PCB Top Side, Arc type

J1301

14240100

Card holder connector—battery socket-3PIN-side contact-2.8 mm-1.4 mm-with positioning peg

J1501 14240272

IO connector-Micro_B-Female-5pin-bend-SMT

J1502

14240207

Card holder connector-SIM card socket-6 Pin-horizontal-2.54 mm-without clip-without positioning peg-SMT-spherical structure-height-2.0 mm

J1601 14240243

Card holder connector-Micro SD Receptacle-10 Pin-bend-1.1 mm-without clip-without positioning peg

J1602 14240181

BTB connector-female-24-0.4 mm-1 mm-SMT

J1302, J1901, J1902

13010265

SAW filter -1574.42 MHz/1605.89 MHz-2.2 dB-50 V-1411-Balance

J4105 14240004

RF connector-straight-female-SMT

J6003, U3201

22050053

Microphone-44 dB.-D4.0 mm*1.3 mm-SMT

MIC2001, MIC601

15060150

MOSFET-P channel—12 V-2.4 A-0.112 ohm-8 V-SOT-23

Q301

15050170

Triode-NPN bias resistor transistor

Q1501

07050063

NTC-150000 ohms-SMT-0402

RT301

07040061

Varistor-12 V-99999 V-5A-25V-SMT-0402-50pF@1 KHz

RV1501, RV2001, RV2002, RV2003, RV2004

07040071

Varistor-90 V-45 V-1 A-300 V-SMT-0402-3pF@100 MHz

RV1502, RV1503

07040075

Varistor-18 V-14 V-10 A-40 V-SMT-0402-82pF@1 KHz

RV1504

39200306

CPU-WCDMA/GSM dual mode baseband processor MSM8255T

U201

39110566

Switching Regulators-1~4 V-1.5 A-SMT

U203, U3900

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BOM Code

Description

Bit

39200177

Terminal Dedicated IC, Power Management IC of QUALCOMM MSM7x30 Series (PM8058)

U301 39110531

DCDC charging control chip-20-Pin WCSP

U1001

39110523

LED flash driver IC-QFN16

U1102

38140023

Semiconductor sensor-accelerometer -LGA-3 axis

U1401

38140024

Semiconductor sensor – Electronic compass-WL-CSP (lead-free)-3 axis

U1402 40060276

NAND FLASH-4GB EMMC V4.4-52 MHz-1024 KB

U1701

39080127

Audio amplifier --2.5 V~5.5 V-differential-Micro SMD 9pin (pb free BGA)

U2001 38020046

Analog switch-DUAL SPDT-2.7-4.2V-0.6 ohm-16 MHz-QFN10L

U2002

38140020

Semiconductor sensor—3 axis gyroscope-SMT

U2101

47140073

RF switch -824-2170 MHz

U3202

13010147

SAW filter-881.5 MHz-2.2 dB-50 V-00241564

U3203

13010186

SAW filter – 1950 MHz-2.9-QCS5I

U3301

47100397

RF power module-1920~1980 MHz-28.2 dB-3*3 QFN-1000 V

U3302

13080038

Duplexer-RX: 2110~2170 MHz/TX: 1920~1980 MHz

U3304

13010189

SAW filter-897.5 MHz-2.7 dB-100V(MM)-SFLT5-0101

U3401

47100387

RF power module-880 MHz~915 MHz-28/18/11-QFN-1000 V

U3402

13080067

Duplexer-TX: 880~915 MHz/RX: 925~960 MHz

U3404

47100307

RF power module-824-849 MHz; 880-915 MHz; 1710-1785 MHz; 1850-1910 MHz

U3501 39110552

Switching Regulators-0.4~3.4 V-

U3800

39200249

Terminal dedicated baseband IC-WCMDA/GSM Radio Transceiver (QTR8615)

U4001 39110626

Switching Regulators- LED Driver

U4003

47140049

RF switch

U4104

39200222

Single Band 2.4 GHz WLAN/Bluetooth 2.1/FM single chip-BCM4329-2.3~5.5 V-WLBGA182 (pb free)

U4201 47090037

RF low-noise amplifier-1.5 G-3 GHz-15 dB-1.1 dB-QFN-200 V

U5002

13010176

SAW filter-2140 MHz-1.9 dB-1.4*1.1 mm

U5003

13010264

SAW filter-1590.16 MHz-1.8 dB-50 V-1411

U6001

47090042

RF low-noise amplifier-0.5~3 GHz-16.8 dB-0.87-QFN-250 V

U6002

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BOM Code

Description

Bit

12020141

Crystal oscillator-19.2 MHz-7pF-±10 ppm-70 ohm-3.2*2.5*0.6 mm

X401

12020125

Crystal oscillator-0.032768 MHz

X402

12020162

Crystal oscillator-24.576 MHz-12 pF-±30 ppm-100 ohm-3225

X701

12020168

Crystal oscillator -37.4 MHz-10pF-±10 ppm-80 ohm-2016

X4101

07040064

Varistor—8 V-4 V-30 V-SMT-0405-ESD + EMI component

Z1301

13030048

Ceramic filter-2450 MHz-2.9 dB-2.0*1.25*1.05 mm

Z4201

13010148

SAW filter-2140 MHz-50 V-00231804

Z5001

40020162

SDRAM-4Gb LPDDR2-333 MHz-32 bit-1.8 V-240 Ball

U201_POP

U8860 Maintenance Manual

5 Software Upgrade

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5.1 Upgrade Preparation

5.2 Normal Upgrade

1. Format the microSD card.

2. Create a folder named dload in the root directory of the microSD card.

3. Copy the upgrade file to the dload folder.

4. Install the microSD card to the phone. Power the phone on, and enter *#*#2846579#*#* in

the standby screen.

5. Select SD card upgrade then touch Confirm to start the upgrade.

Before the upgrade, NV items backup is performed (if the phone has not been backed up before). Then the phone restarts and the upgrade starts.

The upgrade progress is displayed on the LCD.

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Failure

Solution

Failed to upgrade the phone using the microSD card.

1. Check that the upgrade file is correct.

2. Check that the upgrade method is correct.

3. Check that the microSD functions properly.

4. Perform the upgrade again.

After the upgrade is completed, the phone restarts and the NV items are restored.

6. After the main upgrade pack is upgraded, upgrade the vendor upgrade package using the same

upgrade method.

----End

If the phone cannot be properly powered on, follow the following two methods to forcibly upgrade the phone.



Install the battery to the phone (if the screen is splashing, remove the battery and wait for five seconds before installing the battery again). Press and hold the Volume+ and Volume–, and concurrently press the Power key, then the phone will start SD forcible upgrade. The specific download process is similar to the project menu download.



When the phone is not installed with a battery. Press and hold the Volume+ and Volume–, and concurrently connect the phone to a charger, then the phone can also start the SD forcible upgrade. It is recommended that you use charger to perform forcible upgrade. If the download still fails, replace the SD card and try forcible upgrade again.

5.3 Troubleshooting

U8860 Maintenance Manual

6 Maintenance Tools

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6 Maintenance Tools

Name: constant-temperature heat gun Usage: to heat components

Name: soldering iron Usage: to maintain and solder components

Name: DC regulated power supply Usage: to supply DC current

Name: soldering table Usage: to secure the main PCBA

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6 Maintenance Tools

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Name: lead-free solder wire Usage: to solder components

Name: digital multimeter Usage: to measure during repair

Name: toolkit Usage: to assemble and disassemble components

Name: electric screwdriver Usage: to fasten and remove screws

U8860 Maintenance Manual

7 Disassembly Procedure

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7 Disassembly Procedure

2. Remove the battery.

1. Remove the battery cover.

2. Start to disassemble the U8860.

1. Ensure that the ESD wrist strap is well grounded.

U8860 disassembly guide:

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6. Carefully take out the FPC cable.

5. Turn over the buckle in the ZIF interface.

4. Use a cover opener to loosen the buckle between cover A and cover B.

3. Remove the six screws from cover B.

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10. Carefully separate the FPC and cover B (Note: there is double-sided tape between the FPC and shielding cover, carefully perform the operation to avoid damaging the FPC).

9. Loosen the BTB connector.

8. Turn over the main board and loosen the BTB connector.

7. Separate the FPC and the main board (Note: there is double-sided tape between FPC and shielding cover, carefully perform the operation to avoid damaging the FPC)

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1. Introduction to the disassembly tools

13. The phone is now disassembled.

12. Remove the speaker.

11. Remove the receiver.

Screw for fixing

Sucker

Base

Cover for fixing

Level the main

FPC

separate the

TP BTB

2. Disassemble the phone and separate the components from the front cover. The main FPC does not have to be separated.

3. Separate the BTB that the touchscreen connects to main FPC, and lever the part of the main FPC that blocks the touchscreen BTB.

Disassembly guide to touchscreen and LCD

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5. Fasten the cover.

4-2. Note: Do not press touchscreen BTB.

4-1. Note: Do not press LCD FPC.

4. Put the front cover components into the jig base. The placing direction is as shown in this Figure (See procedure 4-1 and 4-2 for precautions).

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8. Slowly suck up the touchscreen and stop sucking until half of the touchscreen is sucked up.

7-1. Note: Put the sucker in the opposite direction of the receiver.

7. Put the sucker in the middle of the touchscreen Icon and press the sucker tightly.

6. Tighten the two screws (Note: The screws lie in the position where the sucker sucks the touchscreen BTB).

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7 Disassembly Procedure

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11-1. Take out the component and remove the touchscreen gently.

10. Unfasten the screw and gently remove the cover.

9. Remove the sucker. Note: the touchscreen will easily be removed by opening the sucker edge with your finger nail and letting the air in.

8-1. Note: Slowly suck the touchscreen because the FPC of the touchscreen BTB will be broken if the touchscreen is sucked up too fast.

U8860 Maintenance Manual

7 Disassembly Procedure

Issue 1.1 (2012-4-25)

Huawei Proprietary and Confidential

24

13. Remove the LCD. The disassembly is completed.

12-2. Note: the LCD glass is thin and easy to be broken. During disassembly, place the tweezers against the buckle instead of the glass. The LCD must not be distorted.

12-1. After removing the touchscreen, use a tweezers to lift the four buckles of the LCD front cover (one of the buckles lies under the side key FPC). Usually after removing three buckles, the LCD can be removed (see Figure 12-2 for precautions).

11-2. Take out the component and remove the touchscreen gently.

Huawei Honor U8860 Maintenance Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

About This Document

1 Product Introduction

1.1 Appearance

1.2 Specifications

2 Applicable Scope and Precautions

2.1 Applicable Scope

2.2 Maintenance Precautions

2.3 How to Obtain Product and Maintenance Information

3 Explosive View

List of components in the explosive view

4 Components on PCBA

5 Software Upgrade

5.1 Upgrade Preparation

5.2 Normal Upgrade

1. Format the microSD card.

2. Create a folder named dload in the root directory of the microSD card.

3. Copy the upgrade file to the dload folder.

5. Select SD card upgrade then touch Confirm to start the upgrade.

5.3 Troubleshooting

6 Maintenance Tools

7 Disassembly Procedure

U8860 disassembly guide:

Disassembly guide to touchscreen and LCD