HP PROLIANT DL360 G5 User Manual

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HP ProLiant DL360 Generation 5 Server Maintenance and Service Guide

Part Number 406389-403 September 2008 (Twelfth Edition)

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© Copyright 2006, 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express

warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Microsoft and Windows are U.S. registered trademarks of Microsoft Corporation. Intel and Xeon are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

Intended audience

This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.

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Customer self repair...................................................................................................................... 5

Parts only warranty service ......................................................................................................................... 5

Illustrated parts catalog ............................................................................................................... 16

Mechanical components........................................................................................................................... 16

System components .................................................................................................................................19

Removal and replacement procedures........................................................................................... 25

Required tools......................................................................................................................................... 25

Safety considerations............................................................................................................................... 25

Preventing electrostatic discharge .................................................................................................... 25

Symbols on equipment ................................................................................................................... 25

Server warnings and cautions ......................................................................................................... 26

Preparation procedures............................................................................................................................ 27

Extend the server from the rack........................................................................................................ 27

Power down the server................................................................................................................... 27

Remove the server from the rack...................................................................................................... 28

Access panel .......................................................................................................................................... 28

Hard drive blanks.................................................................................................................................... 28

Hot-plug SAS or SATA hard drives............................................................................................................. 29

Front bezel ............................................................................................................................................. 30

Hard drive bezel blanks........................................................................................................................... 31

Multibay blank or device.......................................................................................................................... 31

Multibay device ejector............................................................................................................................ 32

Hot-plug power supply............................................................................................................................. 33

Power supply blank ................................................................................................................................. 34

PCI riser board assembly.......................................................................................................................... 34

PCI-X or PCI Express expansion board .......................................................................................................35

PCI Express riser board............................................................................................................................ 36

Power supply air baffle ............................................................................................................................ 37

Processor air baffle.................................................................................................................................. 37

Fan modules........................................................................................................................................... 38

Multibay backplane assembly................................................................................................................... 39

Battery tray............................................................................................................................................. 40

Battery pack ........................................................................................................................................... 41

SAS backplane ....................................................................................................................................... 43

Systems Insight Display ............................................................................................................................44

Integrated HP Smart Array E200i Controller or HP Smart Array P400i Controller............................................. 45

HP Smart Array E200i Controller memory module ....................................................................................... 46

HP Smart Array P400i Controller memory module ....................................................................................... 47

FBDIMMs ............................................................................................................................................... 48

Heatsink................................................................................................................................................. 48

Processor ...............................................................................................................................................50

System battery ........................................................................................................................................56

System board ......................................................................................................................................... 57

Cabling ..................................................................................................................................... 63

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Cabling overview.................................................................................................................................... 63

Array controller cabling ...........................................................................................................................63

HP Smart Array E200i Controller cabling .........................................................................................63

HP Smart Array P400i Controller cabling .........................................................................................64

PCI Smart Array controller cabling................................................................................................... 64

Battery pack cabling................................................................................................................................ 65

Multibay backplane cabling .....................................................................................................................66

Diagnostic tools.......................................................................................................................... 67

Troubleshooting resources ........................................................................................................................67

Array Diagnostic Utility ............................................................................................................................ 67

HP Instant Support Enterprise Edition.......................................................................................................... 67

HP Insight Diagnostics survey functionality .................................................................................................. 68

HP ROM-Based Setup Utility ..................................................................................................................... 68

Integrated Management Log ..................................................................................................................... 68

Automatic Server Recovery ....................................................................................................................... 69

HP Systems Insight Manager..................................................................................................................... 69

HP Insight Diagnostics.............................................................................................................................. 69

Web-Based Enterprise Service .................................................................................................................. 69

Open Services Event Manager.................................................................................................................. 70

Component identification............................................................................................................. 71

Front panel components ........................................................................................................................... 71

Front panel LEDs and buttons .................................................................................................................... 72

Rear panel components............................................................................................................................ 73

Rear panel LEDs and buttons..................................................................................................................... 74

System board components........................................................................................................................ 75

System maintenance switch............................................................................................................. 76

NMI functionality........................................................................................................................... 76

HP Systems Insight Display and LEDs.......................................................................................................... 76

HP Systems Insight Display LEDs and internal health LED combinations ........................................................... 77

SAS and SATA device numbers................................................................................................................. 79

SAS and SATA hard drive LEDs................................................................................................................. 80

SAS and SATA hard drive LED combinations .............................................................................................. 80

Fan locations .......................................................................................................................................... 81

Specifications............................................................................................................................. 82

Environmental specifications ..................................................................................................................... 82

Server specifications................................................................................................................................ 82

Hot-plug power supply calculations............................................................................................................ 83

FBDIMM specifications............................................................................................................................. 83

1.44-MB diskette drive specifications ......................................................................................................... 83

CD-ROM drive specifications .................................................................................................................... 84

DVD-ROM drive specifications ..................................................................................................................85

SAS hard drive specifications ................................................................................................................... 86

SATA hard drive specifications ................................................................................................................. 86

Acronyms and abbreviations........................................................................................................ 87

Index......................................................................................................................................... 89

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Customer self repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these

parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for

customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the North American program, refer to the HP website (http://www.hp.com/go/selfrepair

Parts only warranty service

Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, HP will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:

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• Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à

HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

• Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont

également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair

Service de garantie "pièces seules"

Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par HP ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida

la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

• Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di

componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

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NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair

Servizio di garanzia per i soli componenti

La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie

den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

• Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center

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anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSRErsatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si

solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos

componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al

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Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair

Servicio de garantía exclusivo de componentes

La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

• Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze

onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

• Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde

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periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair

Garantieservice "Parts Only"

Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente. Existem duas categorias de peças CSR:

• Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua

essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas

para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair

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Serviço de garantia apenas para peças

A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

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Illustrated parts catalog

Mechanical components

Item Description Spare part

number

1 Access panel 412209-001 Mandatory1 2 Plastics kit 412208-001 Mandatory1

a) Optical drive ejector assembly — — b) Front bezel — —

c) Optical device blank * — — d) Expansion slot covers (2) * — — e) Screws, M3×0.5×4 in, T-10 (4) * — — f) Bezel screw, T-10, flathead, 1/4-in * — — g) Power supply air baffle — — h) Processor air baffle — — i) HP Smart Array E200i Controller battery tray — — j) HP Smart Array P400i Controller battery tray — —

Customer self repair (on page 5)

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Item Description Spare part

number

Customer self repair (on page 5)

3 Hard drive blank LFF 392613-001 Mandatory1

4 Rack mounting hardware kit * 360104-001 Mandatory1 5 Cable management arm * 360105-001 Mandatory1

*Not shown

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti.

Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

k) Hard drive bezel blank SFF — — l) Power supply blank — —

Rack mounting hardware

Illustrated parts catalog 17

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HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 18

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System components

Item Description Spare part

number

Customer self repair (on page 5)

6 System fan module 412212-001 Mandatory1 7 Hot-plug power supply, 700 W 412211-001 Mandatory1 8 PCI riser board assembly 412200-001 Mandatory1 9 Processor — —

a) Dual-Core, Intel® Xeon® Processor 5050 (3.00-GHz, 667MHz FSB, 2x2-MB L2 cache)†

b) Dual-Core, Intel® Xeon® Processor 5060 (3.20-GHz, 1066MHz FSB, 2x2-MB L2 cache)*†

c) Dual-Core, Intel® Xeon® Processor 5080 (3.73-GHz, 1066MHz FSB, 2x2-MB L2 cache)*†

d) Dual-Core, Intel® Xeon® Processor 5110 (1.60-GHz, 1066MHz FSB, 2x2-MB L2 cache)*†

e) Dual-Core, Intel® Xeon® Processor 5120 (1.86-GHz, 1066MHz FSB, 2x2-MB L2 cache)*†

f) Dual-Core, Intel® Xeon® Processor 5130 (2.00-GHz, 1333MHz FSB, 2x2-MB L2 cache)*†

409423-001 Optional2

409424-001 Optional2

412955-001 Optional2

416795-001 Optional2

416794-001 Optional2

416796-001 Optional2

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Item Description Spare part

number

g) Dual-Core, Intel® Xeon® Processor 5140 (2.33-GHz, 1333MHz FSB, 2x2-MB L2 cache)*†

h) Dual-Core, Intel® Xeon® Processor 5148 (2.33-GHz, 1333MHz FSB, LV, 771 LG*†

i) Dual-Core, Intel® Xeon® Processor 5150 (2.66-GHz, 1333MHz FSB, 2x2-MB L2 cache)*†

j) Dual-Core, Intel® Xeon® Processor 5160 (3.00-GHz, 1333MHz FSB, 2x2-MB L2 cache)*†

k) Dual-Core, Intel® Xeon® Processor E5205 (1.86-GHz, 1066MHz FSB, 65W, 1x6-MB L2 cache)*†

l) Dual-Core, Intel® Xeon® Processor X5260 (3.33-GHz, 1333MHz FSB, 80W, 1x6-MB L2 cache)*†

m) Quad-Core, Intel® Xeon® Processor E5310 (1.60-GHz, 1066-MHz FSB, 4x2-MB L2 cache)*†

n) Quad-Core, Intel® Xeon® Processor E5320 (1.86-GHz, 1066-MHz FSB, 4x2-MB L2 cache)*†

o) Quad-Core, Intel® Xeon® Processor L5320 (1.86-GHz, 1066MHz FSB, 4x2-MB L2 cache)*†

p) Quad-Core, Intel® Xeon® Processor E5335 (2.00-GHz, 1333-MHz FSB, 4x2-MB L2 cache)*†

q) Quad-Core, Intel® Xeon® Processor E5345 (2.33-GHz, 1333-MHz FSB, 4x2-MB L2 cache)*†

r) Quad-Core, Intel® Xeon® Processor X5355 (2.66-GHz, 1333MHz FSB, 4x2-MB L2 cache)*†

s) Quad-Core, Intel® Xeon® Processor E5405 (2.00-GHz, 1333MHz FSB, 2x6-MB L2 cache), 80-W*†

t) Quad-Core, Intel® Xeon® Processor E5410 (2.33-GHz, 1333MHz FSB, 2x6-MB L2 cache)*†

u) Quad-Core, Intel® Xeon® Processor L5410 (2.33-GHz, 1333MHz FSB, 2x6-MB L2 cache), 50-W*†

v) Quad-Core, Intel® Xeon® Processor E5420 (2.50-GHz, 1333-MHz FSB, 2x6-MB L2 cache)*†

w) Quad-Core, Intel® Xeon® Processor L5420 (2.50-GHz, 1333-MHz FSB, 2x6-MB L2 cache), 50-W*†

x) Quad-Core, Intel® Xeon® Processor E5430 (2.66-GHz, 1333-MHz FSB, 2x6-MB L2 cache)*†

y) Quad-Core, Intel® Xeon® Processor E5440 (2.83-GHz, 1333-MHz FSB, 2x6-MB L2 cache)*†

z) Quad-Core, Intel® Xeon® Processor E5450 (3.00-GHz, 1333-MHz FSB, 2x6-MB L2 cache), 80-W*†

aa) Quad-Core, Intel® Xeon® Processor X5450 (3.00-GHz, 1333-MHz FSB, 2x6-MB L2 cache), 120-W*†

bb) Quad-Core, Intel® Xeon® Processor X5460 (3.16-GHz, 1333-MHz FSB, 2x6-MB L2 cache), 120-W*†

416797-001 Optional2

431716-001 Optional2

416798-001 Optional2

416799-001 Optional2

460493-001 Optional2

459738-001 Optional2

437945-001 Optional2

436151-001 Optional2

440935-001 Optional2

437946-001 Optional2

439827-001 Optional2

438363-001 Optional2

457876-001 Optional2

460492-001 Optional2

459736-001 Optional2

460491-001 Optional2

463719-001 Optional2

457877-001 Optional2

460490-001 Optional2

457878-001 Optional2

462801-001 Optional2

457879-001 Optional2

Customer self repair (on page 5)

Illustrated parts catalog 20

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Item Description Spare part

number

Customer self repair (on page 5)

10 Heatsink with grease and alcohol swab 412210-001 Optional2

11 HP Smart Array controllers — —

12 System boards — —

13 SAS backplane 412201-001 Optional2 14 Multibay media backplane 412202-001 Mandatory1 15 HP Systems Insight Display, LEDs, and power button assembly,

cc) Quad-Core, Intel® Xeon® Processor X5470 (3.33-GHz, 1333-MHz FSB, 4x2-MB L2 cache), 120-W*†

dd) Quad-Core, Intel® Xeon® Processor X5470 (2.66-GHz, 1333-MHz FSB, 4x2-MB L2 cache), 50-W*†

Boards

a) HP Smart Array E200i Controller, integrated SAS 412205-001 Mandatory1 b) HP Smart Array P400i Controller, integrated SAS 412206-001 Mandatory1

a) System board with processor cage supporting Intel® Xeon® 50xx and 51xx processors

b) System board with processor cage supporting Intel® Xeon® 52xx, 53xx, and 54xx processors*

with cable Media devices

497545-001 Optional2

459735-001 Optional2

412199-001 Optional2

436066-001 Optional2

412204-001 Optional2

16 Multibay drives — —

17 PC2-5300F FBDIMM — —

18 SAS hard drives — —

19 60-GB SATA hard drive, 5,400-rpm* 405419-001 Mandatory1

a) CD-RW/DVD combo drive, removable multibay, IDE, 24X 399959-001 Mandatory1 b) DVD-ROM drive, removable multibay, 8X* 397928-001 Mandatory1 c) Diskette drive, removable multibay* 399396-001 Mandatory1 Memory

a) 1-GB (2x512-MB) 416470-001 Mandatory1 b) 2-GB (2x1-GB)* 416471-001 Mandatory1 c) 4-GB (2x2-GB)* 416472-001 Mandatory1 d) 8-GB (2x4-GB)* 416473-001 Mandatory1 e) 16-GB (2x8-GB)* 416474-001 Mandatory1 Hard drives

a) 36-GB, 10,000-rpm 376596-001 Mandatory1 b) 72-GB, 10,000-rpm* 376597-001 Mandatory1

BBWC

20 HP Smart Array E200i Controller battery pack 307132-001 Optional2

Illustrated parts catalog 21

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Item Description Spare part

number

Customer self repair (on page 5)

21 HP Smart Array P400i Controller battery pack 398648-001 Optional2 22 HP Smart Array E200i Controller memory module, 64-MB* 412800-001 Optional2 23 HP Smart Array E200i Controller memory module, 128-MB* 413486-001 Optional2 24 HP Smart Array P400i Controller memory module, 256-MB* 405836-001 Optional2 25 HP Smart Array P400i Controller memory module, 512-MB* 405835-001 Optional2

Miscellaneous

26 SAS cable* 408763-001 Mandatory1 27 AC power cord* 187335-001 Mandatory1 28 Battery, 3.3-V, lithium* 234556-001 Mandatory1

*Not shown †All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption.

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

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Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Illustrated parts catalog 23

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Illustrated parts catalog 24

Page 25

Removal and replacement procedures

Required tools

You need the following items for some procedures:

• T-10 Torx screwdriver

• T-15 Torx screwdriver

• Diagnostics Utility

Safety considerations

Preventing electrostatic discharge

Before performing service procedures, review all the safety information.

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

Removal and replacement procedures 25

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14.06 to 17.92 kg

31.00 to 39.50

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,

do not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to

cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment,

observe local occupational health and safety requirements and guidelines for manual material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords

to completely disconnect power from the system.

Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Do not disable the power cord grounding plug. The grounding plug is an important safety

feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all

times.

• Unplug the power cord from the power supply to disconnect power to the equipment.

• Do not route the power cord where it can be walked on or pinched by items placed against

it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Removal and replacement procedures 26

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Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Extend the server from the rack (on page 27).

If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.racksolutions.com/hp

• Power down the server (on page 27).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Remove the server from the rack (on page 28).

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

Extend the server from the rack

NOTE: If the optional cable management arm option is installed, you can extend the server

without powering down the server or disconnecting peripheral cables and power cords. These

1. Power down the server (on page 27).

2. Disconnect all peripheral cables and power cords.

3. Loosen the front panel thumbscrews.

4. Extend the server on the rack rails until the server rail-release latches engage.

5. After performing the installation or maintenance procedure, slide the server into the rack:

6. Connect the peripheral cables and power cords.

steps are only necessary with the standard cable management solution.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack

is adequately stabilized before extending a component from the rack.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-

release latches and sliding the server into the rack. The sliding rails could pinch your fingers.

a. Slide the server fully into the rack. b. Secure the server by tightening the thumbscrews.

Power down the server

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

Removal and replacement procedures 27

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IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.

1. Back up the server data.

2. Shut down the operating system as directed by the operating system documentation.

3. If the server is installed in a rack, press the UID LED button on the front panel. Blue LEDs illuminate on

the front and rear panels of the server.

4. Press the Power On/Standby button to place the server in standby mode. When the server activates

standby power mode, the system power LED changes to amber.

5. If the server is installed in a rack, locate the server by identifying the illuminated rear UID LED button.

6. Disconnect the power cords.

The system is now without power.

Remove the server from the rack

To remove the server from an HP, Compaq branded, telco, or third-party rack:

1. Power down the server (on page 27).

2. Extend the server from the rack (on page 27).

3. Disconnect the cabling and remove the server from the rack. For more information, refer to the

documentation that ships with the rack mounting option.

4. Place the server on a sturdy, level surface.

Access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

To remove the component:

1. Power down the server if the standard cable management solution is installed ("Power down the

server" on page 27).

NOTE: If the optional cable management arm is installed, you can extend the server and

perform hot-plug installation or maintenance procedures without powering down the server.

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Lift up on the hood latch handle and remove the access panel.

To replace the component, reverse the removal procedure.

Hard drive blanks

Removal and replacement procedures 28

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CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

all bays are populated with either a component or a blank.

Remove the component as indicated.

To replace the component, reverse the removal procedure.

Hot-plug SAS or SATA hard drives

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

Remove the component as indicated.

all bays are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 29

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Front bezel

1. Power down the server (on page 27).

2. Extend the server from the rack (on page 27).

3. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 29) and hard drive blanks (on

page 28).

4. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it

from the chassis.

5. Use the T-10 Torx screwdriver to remove the screws located on the top and sides of the front bezel.

6. Gently push on the two tabs located at the top of the bezel

7. Rotate the bezel away from the server and remove the bezel.

To replace the component, reverse the removal procedure.

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Hard drive bezel blanks

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

To remove the component:

1. Remove hard drives 1 and 2 ("Hot-plug SAS or SATA hard drives" on page 29).

2. Remove the hard drive bezel blank.

all bays are populated with either a component or a blank.

To replace the component, reverse the removal procedure.

Multibay blank or device

To remove the component:

1. Power down the server (on page 27).

NOTE: Access to the ejector button is intentionally restricted. To eject the optical device, push

2. Eject the device or blank.

the ejector button with a small flat object such as a key or pen.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

all bays are populated with either a component or a blank.

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To replace the component, reverse the removal procedure.

Multibay device ejector

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove any device in the multibay ("Multibay blank or device" on page 31).

4. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 29) and hard drive blanks (on

page 28).

5. Remove the front bezel ("Front bezel" on page 30).

6. Remove the two T-10 Torx screws that secure the multibay device ejector to the server chassis.

7. Press the tab on the side of the multibay device ejector to release it from the chassis.

Removal and replacement procedures 32

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Remove the multibay device ejector.

To replace the component, reverse the removal procedure.

Hot-plug power supply

WARNING: To reduce the risk of electric shock, do not disassemble the power supply or

To remove the component:

1. Unfasten the cable management solution to access the power supply bays.

2. Disconnect the power cord.

attempt to repair it. Replace it only with the specified spare part.

CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure

unless both bays are populated with power supplies.

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

all bays are populated with either a component or a blank.

Removal and replacement procedures 33

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Remove the power supply.

To replace the component, reverse the removal procedure.

Power supply blank

Remove the component as indicated.

To replace the component, reverse the removal procedure.

PCI riser board assembly

CAUTION: To prevent damage to the server or expansion boards, power down the server and

To remove the component:

remove all AC power cords before removing or installing the PCI riser board assembly.

Removal and replacement procedures 34

Page 35

Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the PCI riser board assembly: a. Disconnect external cables connected to any existing expansion boards. b. Loosen the four PCI riser board assembly thumbscrews. c. Lift the assembly to unseat the PCI riser boards and remove the assembly.

5. Remove any existing expansion boards ("PCI-X or PCI Express expansion board" on page 35).

To replace the component, reverse the removal procedure.

PCI-X or PCI Express expansion board

To remove the component:

1. Power down the server (on page 27).

2. Extend the server from the rack, if applicable ("Extend the server from the rack" on page 27).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 34).

Removal and replacement procedures 35

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Remove any expansion board installed in the assembly.

To replace the component, reverse the removal procedure.

PCI Express riser board

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 34).

5. Remove all expansion boards. ("PCI-X or PCI Express expansion board" on page 35)

6. Remove the full-length PCI Express riser board from the riser board assembly.

Removal and replacement procedures 36

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To replace the component, reverse the removal procedure.

Power supply air baffle

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the air baffle.

To replace the component, reverse the removal procedure.

Processor air baffle

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

Removal and replacement procedures 37

Page 38

Remove the air baffle.

To replace the component, reverse the removal procedure.

Fan modules

The server has three fan modules ("Fan locations" on page 81). To remove a fan module:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

NOTE: The connectors of an installed fan module are tightly seated in the server. Pull firmly to

4. To remove fan module 1:

remove a fan module.

a. Remove the power supply air baffle ("Power supply air baffle" on page 37).

Removal and replacement procedures 38

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Remove fan module 1.

5. To remove fan module 2 or 3: a. Remove the processor air baffle ("Processor air baffle" on page 37). b. Remove fan module 2 or 3.

To replace the component, reverse the removal procedure.

IMPORTANT: After installing the fan module, firmly press the top of the module connectors to

ensure the connectors are seated properly.

Multibay backplane assembly

To remove the component:

1. Power down the server (on page 27).

Removal and replacement procedures 39

Page 40

Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the processor air baffle ("Processor air baffle" on page 37).

5. Remove fan module 3 ("Fan modules" on page 38).

6. Disconnect the cable from the multibay backplane.

7. Remove any device in the multibay ("Multibay blank or device" on page 31).

8. Remove the multibay device ejector ("Multibay device ejector" on page 32).

9. Remove the two T-15 Torx screws that secure the multibay backplane assembly.

10. Remove the multibay backplane.

To replace the component, reverse the removal procedure.

Battery tray

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the processor air baffle ("Processor air baffle" on page 37).

5. Remove the power supply air baffle ("Power supply air baffle" on page 37).

6. Remove fan module 2 ("Fan modules" on page 38).

7. Remove the battery tray.

Removal and replacement procedures 40

Page 41

HP Smart Array E200i Controller battery tray

o HP Smart Array P400i Controller battery tray

8. Remove the battery pack ("Battery pack" on page 41).

To replace the component, reverse the removal procedure.

Battery pack

CAUTION: To prevent a server malfunction or damage to the equipment, do not add or

remove the battery pack while an array capacity expansion, RAID level migration, or stripe

To remove the component:

1. Power down the server (on page 27).

size migration is in progress.

Removal and replacement procedures 41

Page 42

Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the processor air baffle ("Processor air baffle" on page 37).

5. Remove the power supply air baffle ("Power supply air baffle" on page 37).

6. Remove fan module 2 ("Fan modules" on page 38).

7. Remove the battery tray ("Battery tray" on page 40).

8. Remove the battery pack:

o HP Smart Array E200i Controller battery pack

o HP Smart Array P400i Controller battery pack

9. Disconnect the battery pack cable from the controller.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 42

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SAS backplane

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove all SAS or SATA hard drives ("Hot-plug SAS or SATA hard drives" on page 29).

5. Remove any device in the multibay ("Multibay blank or device" on page 31).

6. Remove the power supply air baffle ("Power supply air baffle" on page 37).

7. Remove the processor air baffle. ("Processor air baffle" on page 37)

8. Remove all fan modules ("Fan modules" on page 38).

9. Remove the multibay backplane assembly ("Multibay backplane assembly" on page 39).

10. Remove the battery tray ("Battery tray" on page 40).

11. Disconnect the power and data cables from the SAS backplane.

12. Remove the three T-15 Torx screws from the backplane.

Removal and replacement procedures 43

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13.

Remove the backplane.

To replace the component, reverse the removal procedure.

Systems Insight Display

The Systems Insight Display is an assembly that includes the front panel LEDs, Power On/Standby button, and a cable.

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove all hard drives ("Hot-plug SAS or SATA hard drives" on page 29) and hard drive blanks (on

page 28).

5. Remove the front bezel ("Front bezel" on page 30).

6. Remove the processor air baffle ("Processor air baffle" on page 37).

7. Remove fan module 3 ("Fan modules" on page 38).

8. Remove any device in the multibay ("Multibay blank or device" on page 31).

9. Remove the multibay backplane ("Multibay backplane assembly" on page 39).

10. Disconnect the Systems Insight Display cable.

Removal and replacement procedures 44

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11.

Remove the T-15 Torx screw that secures the Systems Insight Display.

12. Remove the Systems Insight Display.

To replace the component, reverse the removal procedure.

Integrated HP Smart Array E200i Controller or HP Smart Array P400i Controller

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the power supply air baffle ("Power supply air baffle" on page 37).

Removal and replacement procedures 45

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Disconnect all cables from the integrated array controller.

6. Disconnect the backplane power cable from the system board.

7. Turn the quarter-turn fasteners counter-clockwise.

8. Remove the integrated array controller.

To replace the component, reverse the removal procedure.

HP Smart Array E200i Controller memory module

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

Removal and replacement procedures 46

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Remove the power supply air baffle ("Power supply air baffle" on page 37).

5. Remove the existing memory module.

To replace the component, reverse the removal procedure.

HP Smart Array P400i Controller memory module

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the power supply air baffle ("Power supply air baffle" on page 37).

5. Remove the existing memory module.

Removal and replacement procedures 47

Page 48

To replace the component, reverse the removal procedure.

FBDIMMs

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the FBDIMM.

To replace the component, reverse the removal procedure.

Heatsink

To remove the component:

1. Power down the server (on page 27).

2. Extend the server from the rack (on page 27).

3. Remove the access panel ("Access panel" on page 28).

4. Remove the power supply air baffle, if necessary ("Power supply air baffle" on page 37).

5. Remove the processor air baffle ("Processor air baffle" on page 37).

Removal and replacement procedures 48

Page 49

Open the heatsink retaining latches.

7. Remove the heatsink.

To replace the heatsink:

1. Use the alcohol swab to remove all the existing thermal grease from the processor. Allow the alcohol

to evaporate before continuing.

2. Apply new grease to the top of the processor in one of the following patterns to ensure even

distribution.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

Removal and replacement procedures 49

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3. Install the heatsink.

4. Install the processor air baffle ("Processor air baffle" on page 37).

5. Install the power supply air baffle ("Power supply air baffle" on page 37).

6. Install the access panel ("Access panel" on page 28).

Processor

The server supports single- and dual-processor operation. With two processors installed, the server supports boot functions through the processor installed in processor socket 1.

The server uses embedded PPMs as DC-to-DC converters to provide the proper power to each processor.

CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or

cache sizes. Refer to the label on the processor heatsink for a description of the processor.

Removal and replacement procedures 50

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IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.

IMPORTANT: If upgrading processor speed, update the system ROM before installing the

processor.

To remove a processor:

1. Update the system ROM.

Locate and download the latest ROM version from the HP website (http://h18023.www1.hp.com/support/files/server/us/romflash.html

). Follow the instructions on

the website to update the system ROM.

2. Power down the server (on page 27).

3. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

4. Remove the access panel ("Access panel" on page 28).

5. Remove the power supply air baffle, if necessary ("Power supply air baffle" on page 37).

6. Remove the processor air baffle ("Processor air baffle" on page 37).

7. Open the heatsink retaining latches.

Removal and replacement procedures 51

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Remove the heatsink.

9. Open the processor retaining latch and the processor socket retaining bracket.

Removal and replacement procedures 52

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10.

Using your fingers, remove the failed processor.

To replace a processor:

IMPORTANT: Be sure the processor remains inside the processor installation tool.

1. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.

2. Align the processor installation tool with the socket and install the spare processor.

CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides

on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.

Removal and replacement procedures 53

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3. Press down firmly until the processor installation tool clicks and separates from the processor, and

then remove the processor installation tool.

Removal and replacement procedures 54

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Close the processor retaining latch and the processor socket retaining bracket.

5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to

evaporate before continuing.

6. Apply all the grease to the top of the processor in one of the following patterns to ensure even

distribution:

Removal and replacement procedures 55

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Install the heatsink.

8. Install the processor air baffle ("Processor air baffle" on page 37).

9. Install the power supply air baffle ("Power supply air baffle" on page 37).

10. Install the access panel ("Access panel" on page 28).

System battery

If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium

pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

3. Remove the access panel ("Access panel" on page 28).

• Replace only with the spare designated for this product.

the server from the rack" on page 28).

4. Remove the PCI riser board assembly ("PCI riser board assembly" on page 34).

5. Locate the battery on the system board ("System board components" on page 75).

Removal and replacement procedures 56

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Remove the battery.

IMPORTANT: Replacing the system board battery resets the system ROM to its default

configuration. After replacing the battery, reconfigure the system through RBSU.

To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an

authorized service provider.

System board

To remove the component:

1. Power down the server (on page 27).

2. Extend or remove the server from the rack ("Extend the server from the rack" on page 27, "Remove

the server from the rack" on page 28).

3. Remove the access panel ("Access panel" on page 28).

CAUTION: To prevent damage to the server or expansion boards, power down the server and

4. Remove all power supplies ("Hot-plug power supply" on page 33).

remove all AC power cords before removing or installing the PCI riser cage.

5. Remove the power supply air baffle ("Power supply air baffle" on page 37).

6. Remove the processor air baffle ("Processor air baffle" on page 37).

7. Remove the three fan modules. ("Fan modules" on page 38)

8. Disconnect all cables connected to the system board ("System board components" on page 75). For

additional information, see "Cabling (on page 63)."

9. Remove the PCI riser board assembly ("PCI riser board assembly" on page 34).

10. Remove the integrated array controller ("Integrated HP Smart Array E200i Controller or HP Smart

Array P400i Controller" on page 45).

11. Remove all FBDIMMs. ("FBDIMMs" on page 48)

Removal and replacement procedures 57

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12.

Open the processor retaining latch and the processor socket retaining bracket on the failed system board.

13. Using your fingers, remove the processor from the failed system board.

CAUTION: To avoid damage to the system board:

• Do not touch the processor socket contacts.

• Always install the processor socket cover after removing the processor from the socket.

• Do not tilt or slide the processor when lowering the processor into the socket.

CAUTION: To avoid damage to the processor:

• Handle the processor only by the edges.

• Do not touch the bottom of the processor, especially the contact area.

Removal and replacement procedures 58

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14.

Remove the failed system board.

To replace the system board:

1. Install the spare system board in the server before installing the processor.

2. Prepare the processor socket on the spare system board: a. Open the processor retaining latch and the processor socket retaining bracket.

Removal and replacement procedures 59

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Remove the processor socket protective cover.

3. Install the processor socket cover onto the processor socket of the failed system board. The cover

protects the socket during shipping when the failed board is returned.

CAUTION: The processor is designed to fit one way into the socket. Use the alignment guides

on the processor and socket to properly align the processor with the socket. Refer to the server hood label for specific instructions.

CAUTION: Always install the processor parallel to the system board to avoid damage to the

pins.

Removal and replacement procedures 60

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Close the processor retaining latch and the processor socket retaining bracket.

5. Clean the old thermal grease from heatsink and the top of the processor with the alcohol swab.

Allow the alcohol to evaporate before continuing.

6. Apply all the grease to the top of the processor in one of the following patterns to ensure even

distribution.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

7. Install the heatsink ("Heatsink" on page 48).

IMPORTANT: To ensure proper cooling, be sure the processor air baffle is installed at all times

(if applicable).

8. Install all components removed from the failed system board.

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IMPORTANT: Install all components with the same configuration that was used on the failed

system board.

9. Power up the server.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access RBSU.

2. Select the Advanced Options menu.

3. Select Serial Number. The following warning is displayed:

Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.

4. Press the Enter key to clear the warning.

5. Enter the serial number.

6. Select Product ID. The following warning is displayed.

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

7. Enter the product ID and press the Enter key.

8. Press the Esc key to close the menu.

9. Press the Esc key to exit RBSU.

Press the F10 key to confirm exiting RBSU. The server will automatically reboot.

Removal and replacement procedures 62

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Cabling

Cabling overview

This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance.

For information on cabling peripheral components, refer to the white paper on high-density deployment at the HP website (http://www.hp.com/products/servers/platforms

CAUTION: When routing cables, always be sure that the cables are not in a position where

Array controller cabling

they can be pinched or crimped.

Depending on the primary controller installed, various cabling configurations exist:

• HP Smart Array E200i Controller cabling (on page 63)

• HP Smart Array P400i Controller cabling (on page 64)

• PCI Smart Array controller cabling (on page 64)

• Battery pack cabling (on page 65)

HP Smart Array E200i Controller cabling

CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure

the cables do not interfere with fan module installation. Be sure to route the cables around the access panel mounting pin bracket so as not to interfere with access panel installation.

Cabling 63

Page 64

HP Smart Array P400i Controller cabling

CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure

the cables do not interfere with fan module installation. Be sure to route the cables around the access panel mounting pin bracket so as not to interfere with access panel installation.

PCI Smart Array controller cabling

CAUTION: When routing cables, use the cable trough between fan modules 1 and 2. Be sure

the cables do not interfere with fan module installation. Be sure to route the cables around the access panel mounting pin bracket so as not to interfere with access panel installation.

IMPORTANT: When using a PCI array controller, be sure to remove the integrated array

controller.

Cabling 64

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Battery pack cabling

• HP Smart Array E200i Controller battery pack cabling

Cabling 65

Page 66

• HP Smart Array P400i Controller battery pack cabling

Multibay backplane cabling

Cabling 66

Page 67

Diagnostic tools

Troubleshooting resources

The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problemspecific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language:

• English (http://www.hp.com/support/ProLiant_TSG_en)

• French (http://www.hp.com/support/ProLiant_TSG_fr)

• Italian (http://www.hp.com/support/ProLiant_TSG_it)

• Spanish (http://www.hp.com/support/ProLiant_TSG_sp)

• German (http://www.hp.com/support/ProLiant_TSG_gr)

• Dutch (http://www.hp.com/support/ProLiant_TSG_nl)

• Japanese (http://www.hp.com/support/ProLiant_TSG_jp)

Array Diagnostic Utility

The HP Array Diagnostics Utility is a web-based application that creates a report of all HP storage controllers and disk drives. This report provides vital information to assist in identifying faults or conditions that may require attention. ADU can be accessed from the SmartStart CD or downloaded from the HP website (http://www.hp.com

HP Instant Support Enterprise Edition

ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to identify and prevent potential critical problems. Through remote diagnostic scripts and vital system configuration information collected about your systems, ISEE enables fast restoration of your systems. Install ISEE on your systems to help mitigate risk and prevent potential critical problems.

For more information on ISEE, refer to the HP website (http://www.hp.com/hps/hardware/hw_enterprise.html

). To download HP ISEE, visit the HP website (http://www.hp.com/hps/hardware/hw_downloads.html For installation information, refer to the HP ISEE Client Installation and Upgrade Guide

(ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf

Diagnostic tools 67

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HP Insight Diagnostics survey functionality

HP Insight Diagnostics (on page 69) provides survey functionality that gathers critical hardware and software information on ProLiant servers.

This functionality supports operating systems that may not be supported by the server. For operating systems supported by the server, see the HP website (http://www.hp.com/go/supportos

If a significant change occurs between data-gathering intervals, the survey function marks the previous information and overwrites the survey data files to reflect the latest changes in the configuration.

Survey functionality is installed with every SmartStart-assisted HP Insight Diagnostics installation, or it can be installed through the HP PSP.

NOTE: The current version of SmartStart provides the memory spare part numbers for the

server. To download the latest version, see the HP website (http://www.hp.com/support

HP ROM-Based Setup Utility

RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration activities that can include the following:

• Configuring system devices and installed options

• Enabling and disabling system features

• Displaying system information

• Selecting the primary boot controller

• Configuring memory options

• Language selection

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM ("HP Systems Insight Manager" on page 69)

• From within Survey Utility

• From within operating system-specific IML viewers

o For NetWare: IML Viewer o For Windows®: IML Viewer o For Linux: IML Viewer Application

• From within the iLO 2 user interface

• From within HP Insight Diagnostics (on page 69)

Diagnostic tools 68

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For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.

Automatic Server Recovery

ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.

ASR increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or through RBSU.

HP Systems Insight Manager

HP SIM is a web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a web browser. HP SIM provides device management capabilities that consolidate and integrate management data from HP and third-party devices.

IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for

processors, SAS and SATA hard drives, and memory modules.

For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or the HP SIM website (http://www.hp.com/go/hpsim

HP Insight Diagnostics

HP Insight Diagnostics is a proactive server management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server installations, troubleshoot problems, and perform repair validation.

HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.

HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft® Windows® and Linux versions, the utility helps to ensure proper system operation.

For more information or to download the utility, refer to the HP website (http://www.hp.com/servers/diags

Web-Based Enterprise Service

WEBES enables administrators to manage hardware events proactively, either locally or online. The service provides real-time multiple event analysis, crash analysis, and notification, locally through SMTP and remotely through ISEE for OpenVMS, Tru64, and Microsoft® Windows® operating system binary error logs.

For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/

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Open Services Event Manager

OSEM is a standalone tool that performs real-time reactive and proactive service event filtering, analysis, and notification. The tool gathers event data from SNMP traps or information provided over an HTTP interface and notifies an administrator or HP through SMTP and ISEE.

For more information, refer to the HP website (http://h18000.www1.hp.com/support/svctools/

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Component identification

Front panel components

Item Description

1 Hard drive bay 5 (optional)* 2 Hard drive bay 6 (optional)* 3 Multibay drive bay 4 USB connector 5 HP Systems Insight Display 6 Video connector 7 Hard drive bay 4 8 Hard drive bay 3 9 Hard drive bay 2 10 Hard drive bay 1

*An optional controller is required when the server is configured with six hard drives.

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Front panel LEDs and buttons

Item Description Status

1 Power On/Standby button

and system power LED

2 UID button/LED Blue = Identification is activated.

3 Internal health LED Green = System health is normal.

4 External health LED

(power supply)

5 NIC 1 link/activity LED Green = Network link exists.

Green = System is on. Amber = System is shut down, but power is still applied. Off = Power cord is not attached, power supply failure has

occurred, no power supplies are installed, facility power is not available, or disconnected power button cable.

Flashing blue = System is being remotely managed. Off = Identification is deactivated.

Amber = System health is degraded. To identify the component in a degraded state, see "HP Systems Insight Display and LEDs (on page 76)."

Red = System health is critical. To identify the component in a critical state, see "HP Systems Insight Display and LEDs (on page

76)."

Off = System health is normal (when in standby mode). Green = Power supply health is normal. Amber = Power redundancy failure occurred. Off = Power supply health is normal when in standby mode.

Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on

the RJ-45 connector for status by referring to the rear panel LEDs ("Rear panel LEDs and buttons" on page 74).

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Item Description Status

6 NIC 2 link/activity LED Green = Network link exists.

Flashing green = Network link and activity exist. Off = No link to network exists. If power is off, the front panel LED is not active. View the LEDs on

the RJ-45 connector for status by referring to the rear panel LEDs ("Rear panel LEDs and buttons" on page 74).

Rear panel components

Item Description

1 PCI Express expansion slot 1, low-profile, half-length 2 PCI Express expansion slot 2 3 Power supply bay 2 4 Power supply bay 1 5 NIC 2 connector 6 NIC 1 connector 7 Keyboard connector 8 Mouse connector 9 Video connector 10 Serial connector 11 USB connector 12 USB connector 13 iLO 2 NIC connector

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Rear panel LEDs and buttons

Item Description Status

1 iLO 2 NIC activity

LED

2 iLO 2 NIC link

LED

3 10/100/1000

NIC 1 activity LED

4 10/100/1000

NIC 1 link LED

5 10/100/1000

NIC 2 activity LED

6 10/100/1000

NIC 2 link LED

7 UID button/LED Blue = Identification is activated.

8 Power supply 2

LED

9 Power supply 1

LED

Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. Green = Link exists. Off = No link exists. Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. Green = Link exists. Off = No link exists. Green = Activity exists. Flashing green = Activity exists. Off = No activity exists. Green = Link exists. Off = No link exists.

Flashing blue = System is being managed remotely.

Off = Identification is deactivated. Green = Normal Off = System is off or power supply has failed Green = Normal Off = System is off or power supply has failed

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System board components

Item Description

1 System maintenance switch (SW1) 2 NMI switch 3 FBDIMM slots (1-8) 4 Processor socket 2 5 Processor socket 1 6 Multibay drive connector 7 Power button connector 8 Fan module 3 connectors 9 Fan module 2 connectors 10 Fan module 1 connectors

11 SAS hard drive backplane power connector

12 Integrated Smart Array controller connector

13 Power supply connector 1

14 Power supply connector 2

15 Internal USB connector

16 System battery

17 PCI riser board connector 2

18 PCI riser board connector 1

Component identification 75

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System maintenance switch

Position Default Function

S1 Off Off = iLO 2 security is enabled.

On = iLO 2 security is disabled.

S2 Off Off = System configuration can be modified.

On = System configuration is locked and cannot be modified. S3 Off Reserved S4 Off Reserved S5 Off Off = Power-on password is enabled.

On = Power-on password is disabled. S6 Off Off = Normal

On = ROM treats system configuration as invalid. S7 Off Reserved S8 Off Reserved

When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to

properly configure the server or data loss could occur.

NMI functionality

An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.

To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can do any of the following:

• Short the NMI jumper pins

• Press the NMI switch

• Use the iLO Virtual NMI feature

For additional information, see the whitepaper on the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf

HP Systems Insight Display and LEDs

The display provides status for all internal LEDs and enables diagnosis with the access panel installed.

Component identification 76

Page 77

To view the LEDs, access the HP Systems Insight Display.

Item Description Status

1 Online spare memory

LED

2 Mirrored memory LED Green = Protection enabled

All other LEDs Amber = Failure

Green = Protection enabled Flashing amber = Memory configuration

error Amber = Memory failure occurred Off = No protection

Flashing amber = Memory configuration error

Amber = Memory failure occurred Off = No protection

Off = Normal For additional information detailing the

causes for the activation of these LEDs, refer to HP Systems Insight Display LEDs and internal health LED combinations (on page 77).

NOTE: The HP Systems Insight Display LEDs represent the system board layout.

HP Systems Insight Display LEDs and internal health LED combinations

When the internal health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated system LEDs and the internal health LED indicate system status.

Component identification 77

Page 78

The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may report server status differently than the health LEDs because the software tracks more system attributes.

HP Systems Insight Display LED and color

Processor failure, socket X (amber)

Internal health

Status

LED color

Red One or more of the following conditions may exist:

• Processor in socket X has failed.

• Processor X is required yet not installed in the socket.

• Processor X is unsupported.

Amber Processor in socket X is in a pre-failure condition.

Processor failure, both sockets (amber)

PPM failure (amber) Red Integrated PPM has failed. FBDIMM failure, slot X

(amber)

Red Processor types are mismatched.

Red One or more of the following conditions may exist:

• FBDIMM in slot X has failed.

• FBDIMM in slot X is an unsupported type, and no

valid memory exists in another bank.

Amber One or more of the following conditions may exist:

• FBDIMM in slot X has reached single-bit correctable

error threshold.

• FBDIMM in slot X is in a pre-failure condition.

• FBDIMM in slot X is an unsupported type, but valid

memory exists in another bank.

FBDIMM failure, all slots (amber)

Overtemperature (amber) Amber The health driver has detected a cautionary temperature

Riser interlock (amber) Red The PCI riser board assembly is not seated properly. Online spare memory

(amber) Fan module (amber) Amber A redundant fan has failed. Fan module (amber) Red The minimum fan requirements are not being met in one

Red No valid or usable memory is installed in the system.

level.

Red The server has detected a critical temperature level.

Amber Bank X failed over to the online spare memory bank.

or more of the fan modules. One or more fans have failed or are missing.

Component identification 78

Page 79

SAS and SATA device numbers

• Four hard drive configuration

• Six hard drive configuration

Component identification 79

Page 80

SAS and SATA hard drive LEDs

Item Description

1 Fault/UID LED (amber/blue) 2 Online LED (green)

SAS and SATA hard drive LED combinations

Online/activity LED (green)

On, off, or flashing Alternating amber

On, off, or flashing Steadily blue The drive is operating normally, and it has been selected by a

On Amber, flashing

On Off The drive is online, but it is not active currently. Flashing regularly

(1 Hz)

Flashing regularly (1 Hz)

Fault/UID LED

Interpretation

(amber/blue)

The drive has failed, or a predictive failure alert has been

and blue

regularly (1 Hz)

Amber, flashing regularly (1 Hz)

Off Do not remove the drive. Removing a drive may terminate the

received for this drive; it also has been selected by a management application.

management application. A predictive failure alert has been received for this drive. Replace the drive as soon as possible.

Do not remove the drive. Removing a drive may terminate the current operation and cause data loss.

The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.

current operation and cause data loss. The drive is rebuilding, or it is part of an array that is undergoing

capacity expansion or stripe migration.

Component identification 80

Page 81

Online/activity LED (green)

Flashing irregularly Amber, flashing

Flashing irregularly Off The drive is active, and it is operating normally. Off Steadily amber A critical fault condition has been identified for this drive, and

Off Amber, flashing

Off Off The drive is offline, a spare, or not configured as part of an

Fan locations

Fault/UID LED (amber/blue)

regularly (1 Hz)

Interpretation

The drive is active, but a predictive failure alert has been received for this drive. Replace the drive as soon as possible.

the controller has placed it offline. Replace the drive as soon as possible.

A predictive failure alert has been received for this drive. Replace the drive as soon as possible.

array.

Item Description

1 Fan module 1 2 Fan module 2 3 Fan module 3

Component identification 81

Page 82

Specifications

Environmental specifications

Specification Value

Temperature range*

Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F)

Relative humidity (noncondensing)**

Operating 10% to 90% Non-operating 5% to 95%

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed. ** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 KPa.

Server specifications

Specification Value

Dimensions

Height 4.32 cm (1.70 in) Depth 69.22 cm (27.25 in) Width 42.62 cm (16.78 in) Weight (maximum: two

processors, two power supplies, six hard drives)

Weight (minimum: one processor, one power supply, no hard drives)

Weight (no drives installed) 14.06 kg (31.00 lb) Input requirement Rated input voltage 100 VAC to 240 VAC Rated input frequency 50 Hz to 60 Hz Rated input current 7.1A (at 120 VAC); 3.5A (at 240 VAC) Rated input power 852 W BTUs per hour 2910 (at 120 VAC); 2870 (at 240 VAC) Power supply output

17.92 kg (39.50 lb)

14.51 kg (32.00 lb)

Specifications 82

Page 83

Specification Value

Rated steady-state power 700 W

Hot-plug power supply calculations

For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/

FBDIMM specifications

CAUTION: Be sure to install FBDIMMs in the proper configuration. Refer to the Documentation

CD.

Specification Value

Type FBDIMM, PC2-5300F, Fully-Buffered DIMMs Size 512-MB, 1-GB, 2-GB, 4-GB, 8-GB Width 72 bits Upgrade

requirement *

*Use only Registered DDR2 FBDIMMs. Use HP FBDIMMs only.

FBDIMMs must be installed in pairs within a bank. A bank must be populated with two FBDIMMs with identical HP part numbers.

1.44-MB diskette drive specifications

Specification Value

Dimensions

Height 12.7 mm (0.5 in) Width 96 mm (3.8 in) Depth 130 mm (5.1 in) LEDs (front panel) Green = On

Read/write capacity per diskette

High density 1.44 MB Low density 720 KB Drives supported 1 Drive height One-third height Drive rotation 300 rpm Transfer rate High 500 Kb/s Low 250 Kb/s Bytes/sector 512 Sectors per track (high/low) 18/9

Specifications 83

Page 84

Specification Value

Tracks per side (high/low) 80/80 Access times Track-to-track (high/low) 3 ms/6 ms Average (high/low) 169 ms/94 ms Setting time 15 ms Latency average 100 ms Cylinders (high/low) 80/80 Read/write heads 2

CD-ROM drive specifications

Specification Value

Disk formats CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA;

Photo CD (single/multiple-session), CD-XA ready; CDi ready

Capacity 550 MB (mode 1, 12 cm)

Block size 2368, 2352 bytes (mode 0)

Dimensions Height 12.7 mm (0.50 in) Depth 132.08 mm (5.20 in) Width 132.08 mm (5.20 in) Weight 0.34 kg (0.75 lb) Data transfer rate Sustained 150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X) Burst 16.6 MB/s Access times (typical) Full stroke 300 ms Random 140 ms Diameter 12 cm, 8 cm (4.70 in, 3.15 in) Thickness 1.2 mm (0.05 in) Track pitch 1.6 µm (6.3 × 10-7 in) Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm

640 MB (mode 2, 12 cm)

2352, 2340, 2336, 2048 bytes (mode 1) 2352, 2340, 2336, 2048 bytes (mode 2)

Specifications 84

Page 85

Specification Value

Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90%

DVD-ROM drive specifications

Specification Value

Disk formats DVD (single and double layer), DVD-5, DVD-9, DVD-10, DVD-R, CD-ROM Mode

1 & 2, CD-DA, CD-XA (Mode 2, Form 1 & 2), CD-I (Mode 2, Form 1 & 2), CD-I ready, CD-Bridge, CD-R, PhotoCD (single and multi-session)

Capacity 4.7 GB (DVD-5), 8.5 GB (DVD-9), 9.4 GB (DVD10), 550 Mb (Mode 1, 12 cm),

640 Mb (Mode 2, 12 cm), 180 Mb (8 cm)

Block size 2352 bytes (mode 0)

2352, 2340, 2336, 2048 bytes (mode 1) 2352, 2340, 2336, 2048 bytes (mode 2)

2048 bytes (DVD) Dimensions Height 12.7 mm (0.50 in) Depth 132.08 mm (5.20 in) Width 132.08 mm (5.20 in) Weight 0.34 kg (0.75 lb) Data transfer rate Sustained 4463 - 10,800 KB/s (8X CAV DVD mode), 150 KB/s (sustained 1X CD-ROM),

1552 3600 KB/s (24X CAV CD-ROM) Burst 16.6 MB/s with DMA support Access times (typical) Full stroke <200 ms CD

<300 ms DVD Random <110 ms CD

<180 ms DVD Diameter 12 cm, 8 cm (4.70 in, 3.15 in) Thickness 1.2 mm (0.05 in) Track pitch 0.74 µm (3.15 × 10-7 in) DVD-ROM

1.6 µm (6.3 × 10 Cache/buffer 128 KB Startup time < 10 s Stop time < 5 s (single); < 30 s (multisession) Laser parameters Type Semiconductor laser GaAs Wave length 700 ± 25 nm

-7

in) CD-ROM

Specifications 85

Page 86

Specification Value

Divergence angle 53.5° ± 1.5° Output power 0.14 mW Operating conditions Temperature 5°C to 45°C (41°F to 118°F) Humidity 5% to 90%

SAS hard drive specifications

Item 36-GB SAS drive 72-GB SAS drive 146-GB SAS drive

Capacity 36,420 MB 73,408 MB 146,815 MB Height 25.4 mm (1.0 in) 25.4 mm (1.0 in) 25.4 mm (1.0 in) Interface SAS SAS SAS Transfer rate 3 Gb/sec 3 Gb/sec 3 Gb/sec Rotational speed 15,000 rpm 15,000 rpm 15,000 rpm Bytes per sector 512 512 512 Logical blocks 71,132,959 143,374,737 286,749,487 Operating temperature 10º to 35ºC (50º to 95ºF) 10º to 35ºC (50º to 95ºF) 10º to 35ºC (50º to 95ºF)

SATA hard drive specifications

Item 80-GB SATA 160-GB SATA 250-GB SATA 500-GB SATA

Capacity 80,026 MB 160,041 MB 250,059 MB 500,107 MB Height 2.611 cm (1.028

in) Interface Serial ATA Serial ATA Serial ATA Serial ATA Transfer rate 1.5 Gb/sec 1.5 Gb/sec 1.5 Gb/sec 1.5 Gb/sec Rotational speed 7,200 rpm 7,200 rpm 7,200 rpm 7,200 rpm Bytes per sector 512 512 512 512 Logical blocks 156,301,488 312,581,808 488,397,168 976,773,168 Operating

temperature

5º to 55ºC

(41º to 131ºF)

2.611 cm (1.028 in)

5º to 55ºC (41º to 131ºF)

2.611 cm (1.028 in)

5º to 55ºC (41º to 131ºF)

2.611 cm (1.028 in)

5º to 55ºC (41º to 131ºF)

Specifications 86

Page 87

Acronyms and abbreviations

ABEND

abnormal end

ADU

Array Diagnostics Utility

ASR

Automatic Server Recovery

BBWC

battery-backed write cache

FBDIMM

fully buffered DIMM

iLO 2

Integrated Lights-Out 2

IML

Integrated Management Log

NIC

network interface controller

NMI

non-maskable interrupt

NVRAM

non-volatile memory

OSEM

Open Services Event Manager

PCI Express

Peripheral Component Interconnect Express

Acronyms and abbreviations 87

Page 88

PCI-X

peripheral component interconnect extended

PPM

processor power module

PSP

ProLiant Support Pack

RBSU

ROM-Based Setup Utility

SAS

serial attached SCSI

SATA

serial ATA

SIM

Systems Insight Manager

UID

unit identification

USB

universal serial bus

WEBES

Web-Based Enterprise Service

Acronyms and abbreviations 88

Page 89

Index

A

AC power supply 73, 75 access panel 28 additional information 67 ADU (Array Diagnostic Utility) 67 air baffle 27, 37 array controller, cabling 63 Array Diagnostic Utility (ADU) 67 ASR (Automatic Server Recovery) 69 Automatic Server Recovery (ASR) 69

B

backplane, SAS 43 battery 56, 76 battery-backed write cache battery pack 40 battery-backed write cache cabling 65 battery-backed write cache enabler cabling 65 blue screen event 76 buttons 71, 72, 74

C

cables 63 cabling 63 cautions 26 CD-ROM drive 84 component identification 71, 73, 76, 80 components 16, 19, 71, 73 components, mechanical 16 components, system 19 connectors 71, 72, 73, 74, 75 crash dump analysis 76 CSR (customer self repair) 5 customer self repair (CSR) 5

D

diagnostic tools 67, 69 diagnostics utility 69 diskette drive 83 DVD-ROM drive 85

E

electrostatic discharge 25 environmental requirements 82 environmental specifications 82 expansion boards 35 extending server from rack 27 external health LED 71, 72

F

fan module locations 81 fan modules, installation 38 FBDIMMs 83 features 71 front panel buttons 72 front panel components 71 front panel LEDs 72

H

hard drive bezel blanks 31 hard drive blanks 28, 31 hard drive LEDs 80 hard drives 71, 79, 80 hard drives, determining status of 80 health driver 69 health LEDs 76, 80 heatsink 48 HP Insight Diagnostics 68, 69 HP ProLiant Essentials Foundation Pack 69 HP Systems Insight Manager, overview 69

I

iLO 2 activity LED 74 iLO 2 diagnostic LED 75 iLO 2 link LED 74 iLO connector 76 IML (Integrated Management Log) 68 Insight Diagnostics 68, 69 Integrated Management Log (IML) 68 internal health LED 71, 76, 77, 80

Index 89

Page 90

K

keyboard connector 73

L

LED, external health 72 LED, internal health 72 LED, power on 72 LED, system power 72 LED, UID 72, 74 LEDs 71, 80 LEDs, hard drive 80 LEDs, NIC 72, 74 LEDs, power supply 74

M

management tools 67 mechanical components 16 memory dump 76 memory slot LEDs 76, 77 mezzanine boards, removing 45 mouse connector 73 multibay backplane assembly 39 multibay backplane, cabling 66 multibay blank, removing 31 multibay device ejector, removing 33 multibay/SAS backplane, removing 39

N

NIC LEDs 72, 73, 74 NMI functionality 76 NMI switch 76

O

operating system crash 76 overtemperature LED 76, 77

P

part numbers 16, 19 PCI array controllers, cabling 63 PCI riser board 34 PCI riser board assembly 34 power LEDs, system 72, 73, 74 Power On/Standby button 27, 71, 72 power requirements 83 power supplies 33, 83 power supply air baffle 37 power supply LEDs 76, 77

powering down 27 PPM failure LEDs 76, 77, 79 preparation procedures 27 processor air baffle 37 processor failure LEDs 76, 77 processors 50

R

RBSU (ROM-Based Setup Utility) 68 rear panel buttons 73, 74 rear panel components 73 rear panel LEDs 74 resetting the system 76

S

safety considerations 25 SAS backplane 43 SAS hard drive 29 SAS hard drive LEDs 80 SATA drives 79 SATA hard drive 29, 80 SATA hard drive LEDs 80 specifications, environmental 82 specifications, server 82, 83 static electricity 25 switches 76 symbols on equipment 25 system battery 56 system board 57 system board components 75, 76 system components 19 system maintenance switch 76 system power LED 72, 76 Systems Insight Display 76 Systems Insight Display LEDs 76 Systems Insight Display LEDs and internal health LED

combinations 77

Systems Insight Manager 69

T

temperature, overtemperature LED 76, 77 troubleshooting 67

U

UID LED 27, 71, 76 utilities 67 utilities, deployment 68

Index 90

Page 91

V

video connector 71, 74

W

warnings 26

Index 91

HP PROLIANT DL360 G5 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

HP ProLiant DL360 Generation 5 Server Maintenance and Service Guide

Contents

Customer self repair

Parts only warranty service

Illustrated parts catalog

Mechanical components

System components

Removal and replacement procedures

Required tools

Safety considerations

Preventing electrostatic discharge

Symbols on equipment

Server warnings and cautions

Preparation procedures

Extend the server from the rack

Power down the server

Remove the server from the rack

Access panel

Hard drive blanks

Hot-plug SAS or SATA hard drives

Front bezel

Hard drive bezel blanks

Multibay blank or device

Multibay device ejector

Hot-plug power supply

Power supply blank

PCI riser board assembly

PCI-X or PCI Express expansion board

PCI Express riser board

Power supply air baffle

Processor air baffle

Fan modules

Multibay backplane assembly

Battery tray

Battery pack

SAS backplane

Systems Insight Display

Integrated HP Smart Array E200i Controller or HP Smart Array P400i Controller

HP Smart Array E200i Controller memory module

HP Smart Array P400i Controller memory module

FBDIMMs

Heatsink

Processor

System battery

System board

Cabling

Cabling overview

Array controller cabling

HP Smart Array E200i Controller cabling

HP Smart Array P400i Controller cabling

PCI Smart Array controller cabling

Battery pack cabling

Multibay backplane cabling

Diagnostic tools

Troubleshooting resources

Array Diagnostic Utility

HP Instant Support Enterprise Edition

HP Insight Diagnostics survey functionality

HP ROM-Based Setup Utility

Integrated Management Log

Automatic Server Recovery

HP Systems Insight Manager

HP Insight Diagnostics

Web-Based Enterprise Service

Open Services Event Manager

Component identification

Front panel components

Front panel LEDs and buttons

Rear panel components

Rear panel LEDs and buttons

System board components

System maintenance switch

NMI functionality

HP Systems Insight Display and LEDs

HP Systems Insight Display LEDs and internal health LED combinations

SAS and SATA device numbers